JP3314412B2 - Bonding tool - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounted with tape automated bonding (hereinafter abbreviated as TAB mounting).
The present invention relates to a bonding tool used for outer lead bonding (hereinafter abbreviated as OLB) for connecting a semiconductor chip such as a semiconductor chip and an LSI to a circuit board.

[0002]

2. Description of the Related Art A conventional OLB bonding tool will be described below with reference to FIG. As shown in FIG. 3, one end of a large number of lead terminals 2 is connected to electrodes (not shown) of the semiconductor chip 1, and the other ends of the lead terminals 2 are connected to conductors of a circuit board 3. Wiring (not shown)
Bonding. The bonding tool includes a bonding nozzle 5 having a vacuum suction hole 4 for vacuum suction of the semiconductor chip 1, a shaft 6 fitted to the bonding nozzle 5 and rotatable up and down, and a bonding nozzle 5 and a shaft 6. And a spring 7 installed between them to prevent the circuit board 3 from being damaged.

The operation of the bonding tool configured as described above will be described below. After the semiconductor chip 1 is sucked by the bonding nozzle 5, the spring 7 is compressed even after the shaft 6 descends and the lead terminal 2 comes into contact with the circuit board 3, and the lead terminal 2 is attached to the circuit board 3.
Is pressed, and the tip of the lead terminal 2 is connected to the conductor wiring on the circuit board 3 by laser heating the connection portion.

[0004]

However, in the above-mentioned conventional configuration, the amount of pushing after the lead terminals of the semiconductor chip contact the circuit board is limited only by the moving distance of the shaft, and the amount of deformation of the lead terminals is limited. However, there has been a problem that the amount of deformation cannot be made constant due to the influence of the warpage of the circuit board, and stable bonding cannot be realized.

The TAB tape has a lead terminal adhered to one surface of a frame made of a resin film and protruding inward, and an electrode of a semiconductor chip is connected to one end of the lead terminal. At this time, there are a case where the semiconductor chip is mounted on the same side as the frame when viewed from the lead terminal and a case where the semiconductor chip is mounted on the opposite side. Therefore, when the semiconductor chip is sucked by a conventional bonding tool, the height at which the tip of the bonding nozzle hits is different between the case where the frame body is above the lead terminal and the case where it is below the lead terminal. There has been a problem that the amount of deformation of the terminals is different and stable bonding cannot be performed.

Further, in the conventional bonding tool, since the TAB tape is held and moved to the bonding position only by vacuum suction without the positioning portion and bonding is performed, the positional relationship between the semiconductor chips is lost after the positioning, or the lead terminals are connected to the circuit board. There is a problem that the semiconductor chip is displaced due to too much external force when pressing and deforming, and stable bonding cannot be performed.

The present invention solves the above-mentioned conventional problems. Regardless of the relationship between the semiconductor chip, the lead terminals, and the frame, the positional relationship between the semiconductor chip and the bonding nozzle is kept constant, and OL that can keep deformation constant
It is intended to provide a B bonding tool.

[0008]

In order to achieve this object, a bonding tool according to a first aspect of the present invention is provided with a flat base side.
A rib having a base and a tip inclined downward toward the tip.
A bonding tool having a bonding nozzle for adsorbing a semiconductor chip having an electrode connected to the flat part of the circuit board terminal and bonding the semiconductor chip on a circuit board, wherein a circuit board is provided at a tip end of the bonding nozzle. A first protruding portion that abuts against the base of the lead terminal;
And a second protrusion that is in contact with the flat portion of the lead terminal, and a height difference between the first protrusion and the second protrusion is set in anticipation of the amount of deformation of the tip of the lead terminal. is there. Also,
A bonding tool according to a second invention of the present application is a bonding tool including a bonding nozzle for adsorbing a semiconductor chip having electrodes connected to lead terminals protruding inside a frame, and bonding the semiconductor chip on a circuit board. A first protrusion that contacts the circuit board, a second protrusion that is at least as thick as the thickness of the frame body and contacts the lead terminal, and holds the lead terminal at the tip of the bonding nozzle. And a third protrusion having a concave portion corresponding to a portion obtained by cutting a connecting portion connecting the frame to the long tape.

[0009]

According to the first aspect of the present invention, with the above structure, the difference in height between the first protrusion contacting the circuit board and the second protrusion contacting the flat portion at the base of the lead terminal is obtained. The height of the flat part of the lead terminal is regulated, and the difference in height
Is the height of the flat part of the lead terminal from the circuit board.
Since the amount of deformation of the tip of the lead terminal can be made constant, the semiconductor chip can be accurately and stably bonded on the circuit board. In addition, lead terminals
In the case of a semiconductor chip whose carrier is reinforced by a frame, the second
There is no frame on the flat part of the lead terminal
What is the thickness of the frame because it abuts
And the frame is on either side of the lead terminals.
Regardless of the height of the first protrusion and the second protrusion,
The height of the flat part of the lead terminal is regulated by the
Precision and stable bonding of semiconductor chip on substrate
Can be done . According to the second aspect of the present invention, with the above-described configuration, the connection portion of the cut frame is regulated by the concave portion of the third protrusion, so that the semiconductor chip sucked by the bonding nozzle does not shift. Bonding can be performed stably with high positional accuracy.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An OLB bonding tool according to an embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a side sectional view of the OLB bonding tool.
In FIG. 1, the same parts as those in the conventional example shown in FIG. Reference numeral 8 denotes a frame for holding the lead terminals 2, 9 denotes a first projection provided on the bonding nozzle 5 and abutting on the circuit board 3, and 10 denotes a second projection abutting on the lead terminals. The height of the second protrusion 10 from the tip of the bonding nozzle 5 is obtained by adding the thickness of the TAB tape frame 8 to the thickness of the adhesive bonding the frame 8 and the lead terminals 2. It is desirable that the height is not less than the height.

The operation of the bonding tool configured as described above is basically the same as that of the conventional example, and only different points will be described. First, the semiconductor chip 1 is vacuum-sucked by the hole 4 of the bonding nozzle 5, and at that time, the second protrusion 10 contacts the lead terminal 2. In this state, the bonding nozzle 5 descends and stops when the first protrusion 9 contacts the circuit board 3. At this time, the amount of deformation of the tip of the lead terminal 2 is determined by the height relationship between the first projection 9 and the second projection 10.

The second protrusion 10 is provided only on the side where the lead terminal 2 exists, so as to press down the flat portion where the lead terminal 2 protrudes from the semiconductor chip 1. The commonly used TAB tape has a three-layer structure, that is, a resin film (same for the frame 8), an adhesive, and the lead terminals 2.
The height of 0 needs to be higher than the sum of the thickness of the frame 8 and the adhesive from the tip of the bonding nozzle 5.
In the case where the TAB tape has a two-layer structure, that is, is composed of only the resin film and the lead terminals 2, the height of the second protrusion 10 only needs to be higher than the thickness of the frame 8.

Next, the OLB according to the second embodiment of the present invention will be described.
The bonding tool will be described with reference to the drawings. FIG. 2 is a bottom view of the bonding tool. FIG.
As shown in FIG. 1, the lead terminals 2 of the semiconductor chip 1 mounted on the TAB are pressed by the second protrusions 10. The semiconductor chip 1 was mounted on a continuous TAB tape by TAB.
Was connected to TAB tape at four corners. The semiconductor chip 1 is separated from the TAB tape by cutting the connection portion and the tip of the lead terminal 2. In the present embodiment, a third protrusion 11 is provided that matches the cut connection portion 8a. The third protrusion 11 is used to position the frame 8 with respect to the bonding nozzle 5 so as to position the frame 8 with the bonding nozzle. The semiconductor chip 1 does not shift when the semiconductor chip 1 is moved or when the semiconductor chip 1 is mounted, and the bonding position accuracy can be stably maintained.

[0014]

As described above, according to the present invention, a plurality of first protrusions contacting the circuit board at the tip end and a plurality of first protrusions having a height at least as large as the thickness of the frame body contacting the lead terminals. 2. Excellent OLB bonding that can prevent a semiconductor chip from being displaced and perform stable outer lead bonding regardless of the warpage of the circuit board, the positional relationship between the lead terminals and the frame of the TAB tape, etc. by providing the two protrusions. Tools can be realized.

[Brief description of the drawings]

FIG. 1 is a side sectional view of an OLB bonding tool according to an embodiment of the present invention.

FIG. 2 is a bottom view of an OLB bonding tool according to a second embodiment of the present invention.

FIG. 3 is a side sectional view of a conventional OLB bonding tool.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Lead terminal 3 Circuit board 4 Hole 5 Bonding nozzle 6 Shaft 7 Spring 8 Frame 9 First projection 10 Second projection

Continuation of the front page (72) Inventor Akira Kashimo 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-4-114441 (JP, A) JP-A-3-217034 ( JP, A) JP-A-3-235341 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60

Claims (6)

(57) [Claims] (1) A downward inclination toward a flat portion and a tip on the base side.
A bonding tool including a bonding nozzle for adsorbing a semiconductor chip having an electrode connected to the flat portion of the lead terminal having a slanted tip portion and bonding the semiconductor chip on a circuit board, A first projection contacting a circuit board and a second projection contacting a flat portion on the base side of the lead terminal are provided at a tip end, and the first projection and the second projection are provided. A bonding tool in which the height difference is set in anticipation of the amount of deformation of the tip of the lead terminal. 2. A bonding tool comprising a bonding nozzle for adsorbing a semiconductor chip having electrodes connected to lead terminals protruding inside a frame body and bonding the semiconductor chip on a circuit board, wherein the bonding nozzle includes: A first projection abutting on the circuit board, a second projection having a height at least as large as the thickness of the frame body abutting on the lead terminal, and a frame body holding the lead terminal at the tip of the frame. A third protrusion having a concave portion corresponding to a portion obtained by cutting the connecting portion connected to the tape,
Bonding tool provided with 3. A flat portion on the base side and an end bonded to the frame.
Of a lead terminal having a tip portion inclined downward toward
Adsorb the semiconductor chip with the electrode connected to the flat part ,
What is claimed is: 1. A bonding tool comprising a bonding nozzle for bonding the semiconductor chip on a circuit board, comprising: a first protrusion contacting a circuit board at a tip end of the bonding nozzle; and a flat part at a root side of the lead terminal. To
A second protrusion having a height at least equal to the thickness of the frame body, which is in contact with a portion where the frame body does not exist, and a difference in height between the first protrusion and the second protrusion. A bonding tool which is set in consideration of the amount of deformation of the tip of the lead terminal. 4. An electrode is connected to a lead terminal protruding inside the frame.
Sucks the connected semiconductor chip and places it on the circuit board.
A bonding nozzle for bonding semiconductor chips
A bonding tool, wherein a lead terminal is held at a tip end of the bonding nozzle.
Frame for the cutting the connecting portion which connects the tape long
The position of the frame by the shape that matches the part
Bonding tool with means . 5. A means for adjusting the position of a frame, comprising: a projection having a concave portion corresponding to a portion obtained by cutting a connecting portion connecting the frame holding the lead terminal to a long tape. Item 5. A bonding tool according to Item 4. 6. A nozzle holder for lowering the bonding nozzle to a circuit board holding the bonding nozzle vertically movable upon bonding, the nozzle holder to urge the force to press the bonding nozzle to a circuit board The bonding tool according to any one of claims 1 to 5, further comprising an urging portion.