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JP3302124B2 - Ultrasonic probe and manufacturing method thereof - Google Patents

Ultrasonic probe and manufacturing method thereof

Info

Publication number
JP3302124B2
JP3302124B2 JP25002093A JP25002093A JP3302124B2 JP 3302124 B2 JP3302124 B2 JP 3302124B2 JP 25002093 A JP25002093 A JP 25002093A JP 25002093 A JP25002093 A JP 25002093A JP 3302124 B2 JP3302124 B2 JP 3302124B2
Authority
JP
Japan
Prior art keywords
electrode
piezoelectric element
ultrasonic probe
thick portion
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25002093A
Other languages
Japanese (ja)
Other versions
JPH0787594A (en
Inventor
勝裕 若林
之彦 沢田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp, Olympus Optical Co Ltd filed Critical Olympus Corp
Priority to JP25002093A priority Critical patent/JP3302124B2/en
Publication of JPH0787594A publication Critical patent/JPH0787594A/en
Application granted granted Critical
Publication of JP3302124B2 publication Critical patent/JP3302124B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、医療分野で用いる超音
波内視鏡等において利用される超音波探触子及びその製
造方法に係り、特に圧電素子の電極構造を改良した超音
波探触子及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe used in an ultrasonic endoscope or the like used in the medical field and a method of manufacturing the same, and more particularly, to an ultrasonic probe having an improved electrode structure of a piezoelectric element. And a method of manufacturing the same.

【0002】[0002]

【従来の技術】近年、超音波探触子は、非破壊検査装置
の他、医療用の超音波診断装置として急速な需要の伸び
をみせている。超音波内視鏡等の探触子は、超音波トラ
ンスデューサから高周波の音響振動を生体中に放射し、
反射して戻ってきた超音波を超音波トランスデューサで
受信し、わずかな界面特性の違いによって異なる情報を
処理することで、生体内部の断面像を得るものである。
2. Description of the Related Art In recent years, ultrasonic probes have been rapidly growing in demand as medical ultrasonic diagnostic devices in addition to nondestructive inspection devices. Probes such as ultrasonic endoscopes emit high-frequency acoustic vibrations from the ultrasonic transducer into the living body,
The reflected ultrasonic waves are received by an ultrasonic transducer, and different information is processed according to slight differences in interface characteristics, thereby obtaining a cross-sectional image of the inside of a living body.

【0003】超音波トランスデューサの振動子は、概略
的に、圧電素子、音響整合層および背面負荷材から構成
されている。この超音波トランスデューサは、上記圧電
素子表面に形成された電極を使用して圧電素子に高周波
の電圧パルスを印加し、圧電素子を共振させて急速に変
形を起こし、超音波パルスを発生させるものである。と
ころが、血管用超音波探触子のように、高周波化、小型
化が必要なものでは、圧電素子の形状は小さくなり、厚
さも非常に薄いものとなって、結線方法、いわゆる電極
の取り方が非常に困難になってきた。また、電極材料
は、樹脂や圧電セラミックスへの付着強度が強いが、圧
電特性を十分に引き出せないなど、完全なものはいまだ
見つかっていない。一般に、電極としては、銀の焼き付
け電極が使用されているが、高周波化、高精度化が要求
される場合には、金、銀、ニッケル等の金属や合金の蒸
着、スパッタにより電極を形成することも多々ある。
[0003] A transducer of an ultrasonic transducer is generally composed of a piezoelectric element, an acoustic matching layer, and a back load material. This ultrasonic transducer applies a high-frequency voltage pulse to the piezoelectric element using the electrode formed on the surface of the piezoelectric element, causes the piezoelectric element to resonate, rapidly deforms, and generates an ultrasonic pulse. is there. However, in the case of high frequency and miniaturization, such as an ultrasonic probe for blood vessels, the shape of the piezoelectric element becomes small and the thickness becomes very thin. Has become very difficult. In addition, although the electrode material has a high adhesion strength to a resin or a piezoelectric ceramic, a perfect electrode material has not yet been found, such as not being able to sufficiently bring out the piezoelectric characteristics. In general, a silver-baked electrode is used as an electrode, but when higher frequency and higher precision are required, the electrode is formed by vapor deposition or sputtering of a metal or alloy such as gold, silver, and nickel. There are many things.

【0004】従来例としては、図11に示した特開平5
−13542号公報記載の超音波探触子のように、台座
25に設けられた背面負荷材7上の超音波探触子の圧電
素子3の主平面から側面部にまで形成された第一の電極
5aと、この第一の電極5aと絶縁を確保し、対向する
ような位置に形成された第二の電極5bを有する構成が
ある。22はフレキシブル基板である。圧電素子3への
結線は、圧電素子3の側面部もしくは折返し電極を通し
て半田18により導通を取るという方法が採られてい
る。そして、裁断時に角部の電極5a,5bが引き裂か
れたり、剥がれたりするのを防ぐために、各電極5a,
5bの側面電極周辺部分を補強電極24により補強して
いる。
[0004] As a conventional example, Japanese Patent Application Laid-Open No. Hei 5 (1993) shown in FIG.
As in the ultrasonic probe described in JP-A-13542, a first ultrasonic probe formed on the back load member 7 provided on the base 25 from the main plane to the side surface of the piezoelectric element 3 of the ultrasonic probe. There is a configuration having an electrode 5a and a second electrode 5b formed at a position facing the first electrode 5a while ensuring insulation with the first electrode 5a. 22 is a flexible substrate. For connection to the piezoelectric element 3, a method is adopted in which conduction is established by the solder 18 through the side surface of the piezoelectric element 3 or a folded electrode. Then, in order to prevent the corner electrodes 5a, 5b from being torn or peeled off at the time of cutting, each of the electrodes 5a, 5b is cut.
The peripheral portion of the side electrode 5b is reinforced by the reinforcing electrode 24.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、特開平
5−13542号公報のような構成の従来の超音波探触
子では、電極5a,5bを圧電素子3の側面部にまで延
長して形成している。そのために、次に記すいくつかの
不具合がある。すなわち、側面にまで電極5a,5bを
設けた構成のために、側面電極周辺部では分極軸の方向
が、90度反転した横方向(径方向)に近づき、不要な
モードの振幅が起こりやすくなる。そして、分極時の絶
縁対策のために、実際に超音波を送受する対向する位置
に正負の電極5a,5bがある部分の割合が減少してし
まう。小型化が要求され、圧電素子3の体積自体が規制
されている血管用探触子等では、実際に駆動する部分の
減少は、大きく感度に影響し、画像精度の劣化につなが
る。また、高周波化とともに、圧電素子3の厚さは薄く
なり、側面部に電極5a,5bを形成すること自体が非
常に困難になっている。
However, in a conventional ultrasonic probe having a structure as disclosed in Japanese Patent Application Laid-Open No. Hei 5-13542, the electrodes 5a and 5b are formed to extend to the side surface of the piezoelectric element 3. ing. Therefore, there are several problems described below. In other words, because of the configuration in which the electrodes 5a and 5b are provided on the side surfaces, the direction of the polarization axis approaches the horizontal direction (radial direction) inverted by 90 degrees in the peripheral portion of the side surface electrodes, and the amplitude of an unnecessary mode is likely to occur. . Then, due to insulation measures at the time of polarization, the ratio of the portion where the positive and negative electrodes 5a and 5b are located at opposing positions where ultrasonic waves are actually transmitted and received decreases. In a blood vessel probe or the like in which the volume itself of the piezoelectric element 3 is regulated, the reduction in the part to be actually driven greatly affects the sensitivity and leads to deterioration in image accuracy. Further, as the frequency is increased, the thickness of the piezoelectric element 3 is reduced, and it is very difficult to form the electrodes 5a and 5b on the side surfaces.

【0006】本発明は、かかる従来の問題点に鑑みてな
されたもので、小型化が容易で、結線が容易な圧電素子
を使用した超音波探触子およびその製造方法を提供する
ことを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide an ultrasonic probe using a piezoelectric element which can be easily miniaturized and easily connected, and a method of manufacturing the same. And

【0007】[0007]

【課題を解決するための手段】上記課題を解決するため
に、請求項1記載の発明は、少なくとも一つ以上の音響
整合層又は音響レンズと、表裏面に電極を有する圧電素
子と、背面負荷材とから構成される超音波探触子におい
て、前記圧電素子の一方端であって、表面に設けられる
表面非電極部と、前記圧電素子の他方端であって、裏面
に設けられる裏面非電極部と、前記圧電素子の前記他方
端であって、前記裏面非電極部に対向する位置に設けら
れ、前記圧電素子の前記他方端の側面から露出する表面
電極厚肉部と、前記圧電素子の前記一方端であって、前
記表面非電極部に対向する位置に設けられ、前記圧電素
子の前記一方端の側面から露出する裏面電極厚肉部と、
を具備することを特徴とするものである。
In order to solve the above-mentioned problems, the invention according to claim 1 comprises at least one or more acoustic matching layers or acoustic lenses, a piezoelectric element having electrodes on the front and back surfaces, and a back load. In the ultrasonic probe made of a material, at one end of the piezoelectric element, a surface non-electrode portion provided on the front surface, and at the other end of the piezoelectric element, a back non-electrode provided on the back surface Portion, the other end of the piezoelectric element, provided at a position facing the back non-electrode portion, a surface electrode thick portion exposed from the side surface of the other end of the piezoelectric element, A back electrode thick portion provided at a position facing the front non-electrode portion at the one end, and exposed from a side surface of the one end of the piezoelectric element;
It is characterized by having.

【0008】請求項2記載の発明は、少なくとも一つ以
上の音響整合層又は音響レンズと、表裏面に電極を有す
る圧電素子と、背面負荷材とから構成される請求項1記
載の超音波探触子を製造するにあたり、少なくとも一つ
以上の音響整合層又は音響レンズと、背面負荷材とを積
層接合した後、裁断して表面電極厚肉部及び裏面電極厚
肉部を露出させ、露出させた前記表面電極厚肉部及び裏
面電極厚肉部にて結線すること、を特徴とする超音波探
触子の製造方法ある。
According to a second aspect of the present invention, there is provided an ultrasonic probe according to the first aspect, comprising at least one or more acoustic matching layers or acoustic lenses, a piezoelectric element having electrodes on front and back surfaces, and a back load material. In manufacturing the stylus, at least one or more acoustic matching layer or acoustic lens, and after laminating and joining the back load material, cut and expose the surface electrode thick part and the back electrode thick part, and expose In addition, there is provided a method of manufacturing an ultrasonic probe, wherein the connection is made at the thick portion of the front electrode and the thick portion of the back electrode.

【0009】[0009]

【作用】本発明では、圧電素子の他方端の側面から露出
する表面電極厚肉部と、圧電素子の一方端の側面から露
出する裏面電極厚肉部とを設け、表面電極厚肉部、裏面
電極厚肉部にて結線し超音波探触子とするものであるか
ら、側面電極を設けなくても結線が容易に行える電極を
有する圧電素子を利用した超音波探触子及びその製造方
法を提供できる。
According to the present invention, a thick portion of the front electrode exposed from the side surface of the other end of the piezoelectric element and a thick portion of the back electrode exposed from the side surface of the one end of the piezoelectric element are provided. Since an ultrasonic probe is formed by connecting wires at a thick portion of an electrode, an ultrasonic probe using a piezoelectric element having an electrode that can be easily connected without providing a side electrode, and a method of manufacturing the same are disclosed. Can be provided.

【0010】[0010]

【実施例1】(構成)図1〜図6を用いて本実施例を説
明する。図1は圧電素子の斜視図、図2はその断面図、
図4および図5はそれぞれ超音波探触子の振動子部分の
作製方法を示す斜視図、図6は作製した超音波探触子の
断面図である。
Embodiment 1 (Configuration) This embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a piezoelectric element, FIG.
4 and 5 are perspective views showing a method of manufacturing the transducer portion of the ultrasonic probe, and FIG. 6 is a sectional view of the manufactured ultrasonic probe.

【0011】まず、長方形の圧電セラミックス薄板1
に、電極厚肉部2a,2bを主平面の表裏に図1に示し
たように形成する。次に、図2に示すように、一方の電
極厚肉部2aと導通が得られ、かつ対向する平面(反対
面)に電極厚肉部2bがある部分には電極材4aを付与
しないようにして、平面の電極5aを形成する。同様に
して、対向する電極5bを形成して、本実施例の超音波
探触子に用いる圧電素子3を作製する。
First, a rectangular piezoelectric ceramic thin plate 1
Then, the electrode thick portions 2a and 2b are formed on the front and back of the main plane as shown in FIG. Next, as shown in FIG. 2, the electrode material 4a is not applied to a portion where conduction with the one electrode thick portion 2a is obtained and where the electrode thick portion 2b is provided on the opposed flat surface (opposite surface). Thus, a flat electrode 5a is formed. Similarly, the opposing electrode 5b is formed, and the piezoelectric element 3 used for the ultrasonic probe of this embodiment is manufactured.

【0012】具体的には、厚さ0.11mmで共振周波
数20MHzのチタン酸鉛(PT)系(自発分極が消失
する温度は320℃)の圧電セラミックス薄板1をラッ
プ仕上げにより作製し、銀ペーストをスクリーン印刷法
により厚塗りし、乾燥、焼付けを行い、約35μmの厚
さの電極2a,2bを形成する。次いで、イオンボンバ
ート等の表面処理を行い、蒸着により、図2に示すよう
な主平面部に平面の電極5を形成して、分極作業を行っ
て圧電素子3を作製する。この圧電素子3に、図4に示
すように、エポキシ樹脂製の音響整合層6を形成し、タ
ングステンフィラー入りのエポキシ樹脂からなる背面負
荷材7を形成し、積層体を作製する。次いで、図4の実
線19部分を精密切断機で裁断し、図5に示すような電
極厚肉部を側面に露出させたものをつくる。さらに、図
5の実線26部分を精密切断機で裁断し、小さな一つの
振動子部を作製する。
More specifically, a lead ceramic titanate (PT) -based thin plate 1 having a thickness of 0.11 mm and a resonance frequency of 20 MHz (the temperature at which spontaneous polarization disappears is 320 ° C.) is prepared by lapping, and a silver paste is prepared. Is thickly applied by screen printing, dried and baked to form electrodes 2a and 2b having a thickness of about 35 μm. Next, a surface treatment such as ion bombardment is performed, and a planar electrode 5 is formed on the main plane portion as shown in FIG. 2 by vapor deposition, and a polarization operation is performed to produce the piezoelectric element 3. As shown in FIG. 4, an acoustic matching layer 6 made of an epoxy resin is formed on this piezoelectric element 3, and a back load material 7 made of an epoxy resin containing a tungsten filler is formed, thereby producing a laminate. Next, the solid line 19 in FIG. 4 is cut by a precision cutting machine to produce a structure in which the electrode thick portion is exposed on the side as shown in FIG. Further, a portion 26 indicated by a solid line in FIG. 5 is cut by a precision cutting machine to produce one small vibrator portion.

【0013】そして、図6に示すように、このトランス
デューサを、金属パイプを加工したハウジング12に、
接着剤で絶縁板10を固定した上に接着固定し、トラン
スデューサ側面部に露出した電極厚肉部から導電性樹脂
9を介して結線する。その際、音響放射面側のGND電
極5aは、一度ハウジング12に導電性樹脂9でつな
ぎ、図示しないハウジングパイプ部でフレキシブルシャ
フト内を通っている同軸ケーブルに半田付けにより結線
する。一方、プラス側電極5bの結線は、ハウジング1
2との絶縁を確保するために、ポリイミド製の絶縁板1
0上で、導電性樹脂9により同軸ケーブル信号線11に
結線する。以上のような構成で超音波探触子17を作製
した。なお、導電性樹脂9部は、エポキシ系の樹脂8に
よりモールド保護した構成である。また、ハウジング1
2とフレキシブルシャフト13は、銀ロウ14によりロ
ウ付けしたもので、ハウジング12は半田付けが可能な
ように、耐食性のあるステンレス鋼に無電解ニッケルメ
ッキを施したものである。
Then, as shown in FIG. 6, this transducer is mounted on a housing 12 formed by processing a metal pipe.
The insulating plate 10 is fixed with an adhesive and then fixed, and the electrode thick portion exposed on the side surface of the transducer is connected via the conductive resin 9. At this time, the GND electrode 5a on the acoustic emission surface side is once connected to the housing 12 with the conductive resin 9, and is connected by soldering to a coaxial cable passing through the inside of the flexible shaft at a housing pipe (not shown). On the other hand, the connection of the plus side electrode 5b is
2 to ensure insulation from
On the reference numeral 0, the conductive resin 9 is connected to the coaxial cable signal line 11. The ultrasonic probe 17 was manufactured with the above configuration. 9 parts of the conductive resin is molded and protected by the epoxy resin 8. Also, housing 1
2 and the flexible shaft 13 are brazed by silver brazing 14, and the housing 12 is made of corrosion-resistant stainless steel plated with electroless nickel so that soldering is possible.

【0014】(作用)上述した方法で作製すると、裁断
により側面に露出した電極厚肉部から導電性樹脂9に導
通を確実にとることができる。そして、実際にトランス
デューサとして機能する対向する平面にある正負の電極
5a,5bは薄いため、機械的なロスにはならない。ま
た、音響整合層、背面負荷材を注型法により形成したり
または接着により積層する際、樹脂や接着剤のはみ出し
があっても、積層後に裁断することで問題がなくなる。
さらに、音響整合層、背面負荷材の積層時の精度が粗く
ても、裁断してしまうために問題がなく、容易に超音波
探触子を作製することができる。なお、本実施例では、
厚肉電極部を焼付け銀電極により設け、その後蒸着によ
り銀電極を主平面に形成したが、塗布の順番はどちらで
もよく、また電極材料は電極厚肉部は厚みの出せる材質
であれば良く、導電性樹脂でも同様な作用、効果が得ら
れ、主平面部へ塗布する電極の材質は金、銀、銅等の金
属および金属を主成分とする導電性材料であれば同様な
作用、効果が得られる。
(Operation) By the above-mentioned method, conduction from the thick electrode portion exposed on the side surface to the conductive resin 9 can be ensured. Since the positive and negative electrodes 5a and 5b on the opposing planes that actually function as transducers are thin, no mechanical loss occurs. Further, when the acoustic matching layer and the back load material are formed by the casting method or laminated by bonding, even if the resin or the adhesive runs out, the problem is eliminated by cutting after lamination.
Further, even if the accuracy at the time of laminating the acoustic matching layer and the back load material is rough, there is no problem because the cutting is performed, and the ultrasonic probe can be easily manufactured. In this embodiment,
The thick electrode portion was provided by a baked silver electrode, and then the silver electrode was formed on the main plane by vapor deposition, but the order of application may be any, and the electrode material may be any material as long as the electrode thick portion has a thickness. The same operation and effect can be obtained with a conductive resin, and the same operation and effect can be obtained as long as the material of the electrode applied to the main plane portion is a metal such as gold, silver, copper or the like and a conductive material mainly containing a metal. can get.

【0015】 (効果)上述した方法で作製すると、信頼性に問題があ
る側面電極や折返し電極を採用しなくとも、容易に結線
ができ、信頼性が向上する。また、音響整合層、背面負
荷材の積層精度が必要なく、電極5a,5bへの樹脂の
付着を考慮する必要がないために、容易に超音波探触子
を作製できる。そして、側面電極付きのものよりも正負
の電極5a,5bが対向する位置にある割合が高いため
に、実駆動部が大きく同レベルの感度を得るには小さな
形状でよく、硬質部長を決めるハウジング12が短くな
り、商品価値が向上する。なお、図1の圧電セラミック
ス薄板1上に帯状の電極厚肉部2a,2bを形成した
が、図3のように裁断ピッチを考慮した、ポイント上の
電極厚肉部2等でも同様な効果が得られる。
(Effect) By manufacturing by the above-described method, connection can be easily performed without using a side electrode or a folded electrode having a problem in reliability, and reliability is improved. In addition, since the lamination accuracy of the acoustic matching layer and the back load material is not required, and it is not necessary to consider the adhesion of the resin to the electrodes 5a and 5b, the ultrasonic probe can be easily manufactured. Since the ratio of the positive and negative electrodes 5a and 5b at the positions facing each other is higher than that with the side electrodes, the actual drive unit may be large and small to obtain the same level of sensitivity. 12 is shortened, and the commercial value is improved. Although the band-shaped electrode thick portions 2a and 2b are formed on the piezoelectric ceramic thin plate 1 in FIG. 1, similar effects can be obtained in the electrode thick portion 2 on a point and the like in consideration of the cutting pitch as shown in FIG. can get.

【0016】[0016]

【実施例2】(構成)図7は、本実施例における超音波
探触子の振動子部の斜視図で、図8は、その振動子を利
用したミラータイプの超音波探触子の断面図である。本
実施例の基本的な構成は前記実施例1と同様であり、同
一な構成部分には同一符号を付すとともに、相違点につ
いてのみ述べる。
Embodiment 2 (Configuration) FIG. 7 is a perspective view of a vibrator portion of an ultrasonic probe according to the present embodiment, and FIG. 8 is a cross section of a mirror type ultrasonic probe using the vibrator. FIG. The basic configuration of this embodiment is the same as that of the first embodiment. The same components are denoted by the same reference numerals, and only the differences will be described.

【0017】本実施例では、前記実施例1と同様な方法
にて圧電セラミックス薄板1の主平面に銀電極を塗布、
乾燥後、電極厚肉部を別なスクリーンに変えて塗布し、
乾燥、焼付けを行ったもので、実施例1の図5のような
音響整合層、圧電素子、背面負荷材の積層体を作製し
た。その後、50μmの厚さの銅箔15を導電性接着剤
により貼り付け、図7のような形状のものを精密裁断機
により長さ方向に裁断し、振動子部を作製した。この振
動子部を、超音波を反射させるミラー16を付けたハウ
ジング12上にポリサルホンの絶縁板10を介して実装
し、超音波探触子17を作製した。圧電素子3への結線
は、音響放射面側の電極5aをGNDとし、ハウジング
12に導電性樹脂(接着剤)9により落とし、ハウジン
グ12から図示しない部分で同軸ケーブルに半田により
結線し、プラス側電極5bは、背面負荷材7後方にまで
伸びた銅箔15に信号線11を半田18により半田付け
し、エポキシ系の樹脂8により絶縁を兼ね、モールドし
た構成である。
In this embodiment, a silver electrode is applied to the main surface of the piezoelectric ceramic thin plate 1 in the same manner as in the first embodiment.
After drying, change the electrode thick part to another screen and apply.
After drying and baking, a laminated body of the acoustic matching layer, the piezoelectric element, and the back load material as shown in FIG. 5 of Example 1 was produced. Thereafter, a copper foil 15 having a thickness of 50 μm was adhered with a conductive adhesive, and a shape as shown in FIG. 7 was cut in a length direction by a precision cutting machine to produce a vibrator portion. The vibrator portion was mounted on a housing 12 provided with a mirror 16 for reflecting an ultrasonic wave via a polysulfone insulating plate 10, thereby producing an ultrasonic probe 17. For connection to the piezoelectric element 3, the electrode 5 a on the acoustic emission surface side is set to GND, dropped on the housing 12 with a conductive resin (adhesive) 9, connected to a coaxial cable from the housing 12 by a solder (not shown), and connected to the positive side. The electrode 5b has a configuration in which the signal line 11 is soldered to a copper foil 15 extending to the rear of the back load member 7 with solder 18 and is also molded with an epoxy resin 8 which also serves as insulation.

【0018】(作用)上述した方法で作製すると、結線
のスペースを最小にできるため、縦置きのミラータイプ
超音波探触子の圧電素子3の割合を大きくとれる。ま
た、円板状セラミックスを用いて超音波探触子を作製す
るよりも、振動子部作製工程が容易で、一度に数十個の
ものが作製できる。また、圧電素子3に音響整合層6を
積層後、裁断するため、所望な厚みで均一な厚みの、圧
電素子3と同形状の音響整合層6が作製できる。さら
に、音響整合層6、背面負荷材7を圧電素子3に積層
後、裁断し、側面電極を付与するため、接着剤や、音響
整合層6、背面負荷材7を構成する樹脂等の側面電極部
への廻り込みがない。
(Operation) Since the connection space can be minimized by manufacturing according to the above-described method, the ratio of the piezoelectric element 3 of the mirror-type ultrasonic probe vertically installed can be increased. Also, the process of manufacturing the vibrator portion is easier than manufacturing an ultrasonic probe using disk-shaped ceramics, and several tens of devices can be manufactured at a time. Further, since the acoustic matching layer 6 is laminated on the piezoelectric element 3 and then cut, the acoustic matching layer 6 having a desired thickness and a uniform thickness and the same shape as the piezoelectric element 3 can be manufactured. Further, after laminating the acoustic matching layer 6 and the back load material 7 on the piezoelectric element 3, the piezoelectric element 3 is cut, and a side electrode is provided. There is no wrap around.

【0019】(効果)圧電素子3に音響整合層6を積層
後、裁断するため、所望な厚みで均一な厚みの、圧電素
子3と同形状の音響整合層6が得られ、同サイズの超音
波探触子よりも、高い感度が得られるとともに、超音波
ビームのゆがみがない超音波探触子が作製できる。ま
た、結線のスペースが小さく、圧電素子3の割合を大き
くとれることも感度向上の要因の一つである。そして、
円板状セラミックスを用いて超音波探触子を作製するよ
りも、振動子部作製工程が非常に容易で、音響整合層
6、圧電素子3、背面負荷材7を積層後、裁断して振動
子部を作製するため、一度に数十個のものがつくれ、量
産効果から安価に超音波探触子が作製できる。本実施例
では音響整合層6は1層構造のものであるが、少なくと
も音響整合層6または音響レンズが1つ以上あれば同様
な効果が得られる。
(Effect) Since the acoustic matching layer 6 is laminated on the piezoelectric element 3 and then cut, an acoustic matching layer 6 having a desired thickness and uniform thickness, the same shape as the piezoelectric element 3 is obtained, and An ultrasonic probe having higher sensitivity than the ultrasonic probe and having no distortion of the ultrasonic beam can be manufactured. Another factor for improving the sensitivity is that the space for the connection is small and the ratio of the piezoelectric element 3 can be increased. And
The process of manufacturing the vibrator portion is much easier than manufacturing an ultrasonic probe using disk-shaped ceramics. After the acoustic matching layer 6, the piezoelectric element 3, and the back load material 7 are laminated, the vibrator is cut and vibrated. Since the probe part is manufactured, several tens of pieces can be manufactured at a time, and an ultrasonic probe can be manufactured at low cost from the viewpoint of mass production. In this embodiment, the acoustic matching layer 6 has a single-layer structure, but the same effect can be obtained if at least one acoustic matching layer 6 or acoustic lens is provided.

【0020】[0020]

【実施例3】(構成)図9は、本実施例における超音波
探触子の振動子部の断面図である。本実施例の基本的な
構成は前記実施例1と同様であり、同一な構成部分につ
いては同一符号を付すとともに、相違点についてのみ述
べる。
Embodiment 3 (Structure) FIG. 9 is a sectional view of a transducer portion of an ultrasonic probe according to this embodiment. The basic configuration of this embodiment is the same as that of the first embodiment. The same components are denoted by the same reference numerals, and only the differences will be described.

【0021】本実施例では、前記実施例1と同様な方法
にて音響整合層6、圧電素子3、背面負荷材7の積層体
を作製し、裁断後、図9の破線部のように、電極5a,
5bが露出した側面部に蒸着により銀の外部電極21
a,21bを形成した。ただし、本実施例の振動子は、
圧電素子3にエポキシ樹脂系の音響レンズ20を形成し
た構成である。この外部電極21a,21bを形成した
振動子部で、実施例1の図6と同じ構成で超音波探触子
を作製した。
In this embodiment, a laminated body of the acoustic matching layer 6, the piezoelectric element 3, and the back load material 7 is manufactured in the same manner as in the first embodiment, and after being cut, as shown by a broken line in FIG. The electrodes 5a,
The silver external electrode 21 is deposited on the side surface portion where
a and 21b were formed. However, the vibrator of this embodiment is
This is a configuration in which an epoxy resin-based acoustic lens 20 is formed on the piezoelectric element 3. An ultrasonic probe having the same configuration as that of FIG. 6 of the first embodiment was manufactured using the vibrator portion on which the external electrodes 21a and 21b were formed.

【0022】(作用)上述した方法で作製すると、圧電
素子3の電極5a,5bと電気的につながっている圧電
素子側面部に形成した外部電極21a,21bから導電
性樹脂を用いて結線が可能となる。
(Operation) When manufactured by the above-described method, it is possible to connect the external electrodes 21a and 21b formed on the side surfaces of the piezoelectric element electrically connected to the electrodes 5a and 5b of the piezoelectric element 3 by using a conductive resin. Becomes

【0023】(効果)高周波化、小型化が進み振動子の
幅が細くなっても、導通に必要な面積を大きくかせげる
ために、結線に対して信頼性の高い超音波探触子を作製
できる。
(Effect) Even if the frequency is increased and the size is reduced and the width of the vibrator is reduced, an ultrasonic probe having high reliability for connection can be manufactured because the area required for conduction is increased. .

【0024】[0024]

【実施例4】(構成)図10は本実施例における超音波
探触子の振動子部の斜視図である。本実施例の基本的な
構成は前記実施例1と同様であり、同一な構成部分には
同一符号を付すとともに、相違点についてのみ述べる。
Embodiment 4 (Structure) FIG. 10 is a perspective view of a transducer portion of an ultrasonic probe according to this embodiment. The basic configuration of this embodiment is the same as that of the first embodiment. The same components are denoted by the same reference numerals, and only the differences will be described.

【0025】本実施例では、電極厚肉部を露出させるた
めの裁断後、途中から一枚にラミネート処理された2枚
のフレキシブル基板22を、それぞれ正負の電極5a,
5bに半田18により半田付けにより結線し、接着剤2
3を用いて振動子に固着させ、長さ方向に裁断し、ハウ
ジングに実装し、ケーブルに結線して超音波探触子を作
製する。
In this embodiment, after cutting to expose the electrode thick portion, the two flexible substrates 22 that have been laminated into one piece from the middle are cut into the positive and negative electrodes 5a and 5a, respectively.
5b by soldering with a solder 18 and an adhesive 2
The ultrasonic probe is fixed to the vibrator by using 3 and cut in the length direction, mounted on a housing, and connected to a cable.

【0026】(作用)上述した方法で作製すると、ケー
ブルとの結線を硬質部となるハウジング内で行わなくと
も、超音波探触子を作製できる。
(Function) When the ultrasonic probe is manufactured by the above-described method, the ultrasonic probe can be manufactured without connecting the cable to the inside of the housing serving as the hard portion.

【0027】(効果)上述した方法で作製すると、ケー
ブルとの結線を硬質部で行う必要がなく、硬質部長を短
くすることができ、商品価値が向上する。なお、フレキ
シブル基板22との結線は、半田18に限らず導電性樹
脂で行っても同様な効果が得られる。
(Effect) When manufactured by the above-described method, there is no need to connect the cable to the hard portion, and the length of the hard portion can be shortened, and the commercial value is improved. The same effect can be obtained even if the connection with the flexible substrate 22 is performed not only by the solder 18 but also by a conductive resin.

【0028】[0028]

【発明の効果】以上のように、本発明の超音波探触子お
よびその製造方法によれば、高周波で、小型小径化の要
求により、厚さが薄くなった圧電素子の超音波トランス
デューサにおいても、振動子の結線方法、いわゆる電極
の取り方が容易で、結線の信頼性が高く、かつ安価な超
音波探触子が容易に得られる。
As described above, according to the ultrasonic probe and the method of manufacturing the same according to the present invention, the ultrasonic transducer of a piezoelectric element having a reduced thickness due to a demand for high frequency, small size and small diameter. In addition, a method of connecting the transducers, that is, a so-called electrode mounting method, is easy, and a highly reliable and inexpensive ultrasonic probe can be easily obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1の超音波探触子の圧電素子を
示す斜視図である。
FIG. 1 is a perspective view showing a piezoelectric element of an ultrasonic probe according to Embodiment 1 of the present invention.

【図2】同実施例1の超音波探触子の圧電素子を示す断
面図である。
FIG. 2 is a cross-sectional view illustrating a piezoelectric element of the ultrasonic probe according to the first embodiment.

【図3】同実施例1の電極厚肉部を形成する他の方法を
示す斜視図である。
FIG. 3 is a perspective view showing another method for forming the thick electrode portion of the first embodiment.

【図4】同実施例1の超音波探触子の振動子部の作製方
法を示す斜視図である。
FIG. 4 is a perspective view illustrating a method of manufacturing a transducer unit of the ultrasonic probe according to the first embodiment.

【図5】同実施例1の超音波探触子の振動子部の作製方
法を示す斜視図である。
FIG. 5 is a perspective view illustrating a method of manufacturing the transducer unit of the ultrasonic probe according to the first embodiment.

【図6】同実施例1の超音波探触子を示す断面図であ
る。
FIG. 6 is a cross-sectional view showing the ultrasonic probe according to the first embodiment.

【図7】本発明の実施例2の超音波探触子の振動子部を
示す斜視図である。
FIG. 7 is a perspective view illustrating a vibrator portion of an ultrasonic probe according to a second embodiment of the present invention.

【図8】同実施例2の超音波探触子の振動子を利用した
超音波探触子の断面図である。
FIG. 8 is a sectional view of an ultrasonic probe using the transducer of the ultrasonic probe according to the second embodiment.

【図9】本発明の実施例3の超音波探触子の振動子部を
示す断面図である。
FIG. 9 is a cross-sectional view illustrating a transducer section of an ultrasonic probe according to a third embodiment of the present invention.

【図10】本発明の実施例4の超音波探触子の振動子部
を示す斜視図である。
FIG. 10 is a perspective view showing a transducer unit of an ultrasonic probe according to a fourth embodiment of the present invention.

【図11】従来の超音波探触子を示す断面図である。FIG. 11 is a sectional view showing a conventional ultrasonic probe.

【符号の説明】[Explanation of symbols]

1 圧電セラミックス薄板 2a,2b 電極厚肉部 3 圧電素子 5a,5b 電極 6 音響整合層 7 背面負荷材 9 導電性樹脂 10 絶縁板 11 信号線 12 ハウジング 17 超音波探触子 18 半田 20 音響レンズ 21 外部電極 22 フレキシブル基板 DESCRIPTION OF SYMBOLS 1 Piezoelectric ceramic thin plate 2a, 2b Electrode thick part 3 Piezoelectric element 5a, 5b electrode 6 Acoustic matching layer 7 Back load material 9 Conductive resin 10 Insulating plate 11 Signal line 12 Housing 17 Ultrasonic probe 18 Solder 20 Acoustic lens 21 External electrode 22 Flexible board

フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H04R 17/00 330 A61B 8/00 G01N 29/24 Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) H04R 17/00 330 A61B 8/00 G01N 29/24

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 少なくとも一つ以上の音響整合層又は音
響レンズと、 表裏面に電極を有する圧電素子と、 背面負荷材とから構成される超音波探触子において、 前記圧電素子の一方端であって、表面に設けられる表面
非電極部と、 前記圧電素子の他方端であって、裏面に設けられる裏面
非電極部と、 前記圧電素子の前記他方端であって、前記裏面非電極部
に対向する位置に設けられ、前記圧電素子の前記他方端
の側面から露出する表面電極厚肉部と、 前記圧電素子の前記一方端であって、前記表面非電極部
に対向する位置に設けられ、前記圧電素子の前記一方端
の側面から露出する裏面電極厚肉部と、 を具備することを特徴とする超音波探触子。
1. An ultrasonic probe comprising at least one or more acoustic matching layers or acoustic lenses, a piezoelectric element having electrodes on the front and back surfaces, and a back load material, wherein one end of the piezoelectric element And a front non-electrode portion provided on the front surface, the other end of the piezoelectric element, a rear non-electrode portion provided on the back surface, and the other end of the piezoelectric element, A surface electrode thick portion that is provided at an opposite position and is exposed from the side surface of the other end of the piezoelectric element, and is provided at a position that is the one end of the piezoelectric element and that faces the surface non-electrode portion; And a back electrode thick portion exposed from the side surface of the one end of the piezoelectric element.
【請求項2】 少なくとも一つ以上の音響整合層又は音
響レンズと、 表裏面に電極を有する圧電素子と、 背面負荷材とから構成される請求項1記載の超音波探触
子を製造するにあたり、 少なくとも一つ以上の音響整合層又は音響レンズと、背
面負荷材とを積層接合した後、裁断して表面電極厚肉部
及び裏面電極厚肉部を露出させ、露出させた前記表面電
極厚肉部及び裏面電極厚肉部にて結線すること、 を特徴とする超音波探触子の製造方法。
2. An ultrasonic probe according to claim 1, comprising at least one or more acoustic matching layers or acoustic lenses, a piezoelectric element having electrodes on the front and back surfaces, and a back load material. After laminating and joining at least one or more acoustic matching layers or acoustic lenses and a back load member, the exposed surface electrode thick portion and the back electrode thick portion are cut and exposed, and the exposed surface electrode thick portion is exposed. And a connection at a thick portion of the back electrode and the back electrode.
JP25002093A 1993-09-10 1993-09-10 Ultrasonic probe and manufacturing method thereof Expired - Fee Related JP3302124B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25002093A JP3302124B2 (en) 1993-09-10 1993-09-10 Ultrasonic probe and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25002093A JP3302124B2 (en) 1993-09-10 1993-09-10 Ultrasonic probe and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH0787594A JPH0787594A (en) 1995-03-31
JP3302124B2 true JP3302124B2 (en) 2002-07-15

Family

ID=17201656

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3302124B2 (en)

Also Published As

Publication number Publication date
JPH0787594A (en) 1995-03-31

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