JP3375831B2 - Processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus such as a wafer cleaning apparatus for cleaning semiconductor wafers.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, it is required to clean a semiconductor wafer (hereinafter simply referred to as a wafer), for example, removal of fine particles, removal of metal contamination, removal of oxide film and the like. In the cleaning process for removing fine particles, NH
Liquid phase cleaning using a ₄ / H ₂ O ₂ / H ₂ O mixed solution (hereinafter referred to as APM) is generally used, and HCl / H ₂ O ₂ / H ₂ is used in the cleaning process for removing metal contamination.
Liquid phase cleaning using an O mixed solution (hereinafter referred to as HPM) is generally used, and an HF / H ₂ O mixed solution (hereinafter referred to as DHM) is used in a cleaning process for removing an oxide film. Liquid phase washing is common.

In recent years, with the increase in the diameter of wafers, the single-wafer processing of each processing process is progressing, and the single-wafer processing is also progressed in such a cleaning process. As a single wafer processing wafer cleaning apparatus, for example, a processing chamber for APM cleaning, a processing chamber for HPM cleaning, and a processing chamber for DHM cleaning are arranged along a wafer transfer path for transferring wafers,
There is an apparatus in which a wafer transfer body that transfers wafers between these processing chambers is movably arranged on the wafer transfer path.

The structures of the above-mentioned processing chambers are almost the same, and a schematic structure of an example of the processing chamber is shown in FIG.

As shown in FIG. 1, a hermetically sealed processing chamber 100 is provided.
A holding member 101 for holding the wafer W rotatably therein.
And a predetermined cleaning liquid for the surface of the wafer W held and rotated by the holding member 101, such as NH for APM cleaning.
Jet nozzle 10 for jetting a ₄ / H ₂ O ₂ / H ₂ O mixed liquid
2 and are provided. Further, on the front surface of the processing chamber 100 on the wafer transfer path side, an openable / closable window portion 103 for transferring the wafer W is provided. Then, the wafer transfer body 104 movably arranged on the wafer transfer path transfers the wafer W to be cleaned through the window 103.

When the processing chamber 100 is constructed as described above, if the atmosphere inside the processing chamber 100, for example, NH ₄ gas leaks outside the processing chamber for APM cleaning, for example, to the wafer transfer path side, it adversely affects the wafer on the wafer transfer path. Therefore, it is necessary to avoid such leakage. For example, window part 1
When 03 is opened, the atmosphere leaks from the window 103 to the outside, which adversely affects the wafer on the wafer transfer path. Therefore, for example, an inlet for introducing an external atmosphere is provided at a predetermined position in the processing chamber 100, the processing chamber is evacuated, and the processing chamber is set to a negative pressure.

[0007]

However, even when the exhaust means is provided in the processing chamber of such a wafer cleaning apparatus as described above, if the window 103 is opened to transfer the wafer W, The negative pressure setting in the processing chamber is weakened,
The atmosphere in the processing chamber may leak outside through the window 103. Further, there is a problem that the atmosphere in the processing chamber may leak to the outside from the above-mentioned inlet when the exhaust by the exhaust means cannot be performed for some reason.

The present invention addresses the above-mentioned problems.
It is an object of the present invention to provide a processing apparatus in which the atmosphere in the processing chamber does not leak outside.

More specifically, an object of the present invention is to provide a processing apparatus in which the atmosphere in the processing chamber does not leak to the outside through the window portion for delivering the substrate to be processed.

Another object of the present invention is to provide a processing apparatus in which the atmosphere in the processing chamber does not leak to the outside through an inlet for introducing the outside atmosphere.

An object of the present invention is to provide a processing apparatus which can realize the above object with a very simple structure.

A further object of the present invention is to provide a processing apparatus capable of forming a downflow airflow in the processing chamber.

Still another object of the present invention is to provide a processing apparatus in which dust generated from the vicinity of an inlet for introducing an external atmosphere does not adhere to a substrate to be processed.

[0014]

In order to solve such a problem, the processing apparatus according to the present invention according to claim 1 introduces an openable / closable window portion for transferring a substrate to be processed and an external atmosphere. and a inlet for the sealed processing chamber for performing a predetermined process on the substrate to be processed is passed through the window portion, and an exhaust means for performing exhaust of the process chamber, wherein
An opening / closing plate that pivotally supports the opening and closing, and a balance weight that closes the opening and closing plate by closing the opening and closing the opening when the negative pressure in the processing chamber is reached.
And an opening / closing mechanism having.

According to the present invention, since the opening / closing mechanism is configured to open the inlet when the pressure inside the processing chamber is negative, for example, when the window is closed, the outside atmosphere is introduced from the inlet while the processing is performed by the exhaust means. Exhaust in the room can be realized. On the other hand, an opening / closing mechanism is introduced when the pressure inside the processing chamber is other than negative pressure, for example, when the window is opened to transfer the substrate to be processed or when exhaust by the exhaust means cannot be performed for some reason. since the configuration to close the mouth, that the atmosphere in or processing chamber that atmosphere in the processing chamber from leaking to the outside from the window portion leaks outside from the inlet port that a no.

According to the present invention, since the opening / closing plate closes the inlet, and the opening / closing plate is opened / closed by the counterweight that balances with the opening / closing plate so that the inlet is opened when the pressure in the processing chamber is negative, the inside of the processing chamber is opened. The atmosphere can be leaked to the outside with a very simple structure.

The processing apparatus according to the present invention as defined in claim 2 is
It has an openable and closable window part for delivering the substrate to be processed, and an inlet for introducing an external atmosphere on the upper surface, and the substrate to be processed is delivered through the window part. And a closed type processing chamber for performing a predetermined process, an exhaust means provided below the processing chamber for exhausting the inside of the processing chamber, an opening / closing plate pivotally supported to open / close the inlet, and the opening / closing plate. And an opening / closing mechanism having a counterweight that closes the inlet and opens the inlet when the processing chamber is under negative pressure so as to balance the opening / closing plate.

In the present invention, in addition to the above structure, an inlet for introducing the external atmosphere and its opening / closing mechanism are provided on the upper surface of the processing chamber, and the exhaust means is provided below the processing chamber. An air stream of flow can be formed.

A processing apparatus according to a third aspect of the present invention is
It has an openable and closable window part for delivering the substrate to be processed, and an inlet for introducing an external atmosphere on the upper surface, and the substrate to be processed is delivered through the window part. And a closed type processing chamber for performing a predetermined process, an exhaust means provided below the processing chamber for exhausting the inside of the processing chamber, an opening / closing plate pivotally supported to open / close the inlet, and the opening / closing plate. Is an opening / closing mechanism that closes the inlet and has a counterweight that balances the opening / closing plate so as to open the inlet when the negative pressure in the processing chamber is present, and is disposed in the processing chamber, and with respect to the substrate to be processed. A partition plate for partitioning the processing section for performing a predetermined process and the inlet above the processing section and having a ventilation hole is provided.

In the present invention, since the partition plate for partitioning the processing unit for performing the predetermined processing on the substrate to be processed and the inlet above it is arranged in the processing chamber, the partition plate is introduced from the vicinity of the inlet for introducing the external atmosphere. The generated dust does not adhere to the substrate being processed. It is preferable that the partition plate be provided with the ventilation hole in a region other than a region immediately below the introduction port. Thus, dust inlet side Ru can be prevented from falling to the processing unit through the vent hole.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1 to 3 each show a semiconductor wafer (hereinafter referred to as “wafer”) to which the embodiments of the present invention are adopted. 1 is a diagram of the overall configuration of the wafer cleaning apparatus 1 of FIG.
Shows a plane, FIG. 2 shows the front, and FIG. 3 shows the back.

The wafer cleaning apparatus 1 includes a plurality of wafers W as a substrate to be processed in a wafer cassette CR, for example, 25 wafers.
A cassette station 10 for loading / unloading wafers W into / out of the system, and a predetermined cleaning process for wafers W one by one. It has a configuration in which it is integrally connected to a cleaning processing station 11 in which various single-wafer cleaning processing units for performing the above are arranged at predetermined positions.

In the cassette station 10, as shown in FIG. 1, a positioning protrusion 20a on the cassette mounting table 20 is provided.
A plurality of wafer cassettes CR, for example up to 4
However, they are placed in a line in the X direction (vertical direction in FIG. 1) with their respective wafer entrances and exits facing the processing station 11 side, and the cassette arrangement direction (X direction) and wafer cassette CR
A wafer transfer body 21 that is movable in the wafer arrangement direction (Z direction; vertical direction) of the wafers stored therein selectively accesses each wafer cassette CR. Further, the wafer transfer body 21 is configured to be rotatable in the θ direction, so that the wafer transfer body 22 on the cleaning processing station 11 side can also be accessed from each other, as described later.

The cleaning processing station 11 is provided with a wafer carrier 22 as shown in FIG. The wafer transfer body 22 is movable along the wafer transfer path (Y direction). Cleaning processing units are arranged on both sides of the transfer path of the wafer transfer body 22. The wafer transfer body 22 of the processing station 11 is configured to be rotatable in the θ direction as well, and in addition to the wafer transfer body 21 on the cassette station 10 side described above, each cleaning processing unit can be accessed. .

As shown in FIG. 1, for example, four cleaning processing units are arranged on both sides of the transfer path of the wafer transfer body 22. On the front side of the device, pure water (DIW: de
A DIW cleaning unit for cleaning with ionized water and an APM cleaning unit for cleaning with APM are arranged, and a DHM using DHM is provided on the back side of the device.
A cleaning unit and an HPM cleaning unit that performs cleaning using HPM are arranged. In addition, in the remaining positions,
It is possible to arrange these units or other units.

FIG. 4 shows the configuration of these cleaning processing units. The APM cleaning unit, the DHM cleaning unit, and the HPM cleaning unit basically have the same structure as shown in the figure.

As shown in the figure, a chuck mechanism 31 for supporting and rotating the peripheral portion of the wafer W is provided below the center of the sealed type processing chamber 30. The chuck mechanism 31 is moved up and down within a predetermined range by a drive cylinder 32 together with a first cup 38 described later. Further, below and above the wafer W supported by the chuck mechanism 31, jet nozzles 33 and 34 for jetting DIW as a cleaning liquid or a rinsing liquid to the wafer W are provided. The ejection nozzles 33 and 34 are
Each of them is connected to a solution tank or DIW tank (not shown), and the solution or DIW is supplied from here.

The ejection nozzle 33 provided below the wafer W is moved up and down within a predetermined range by the drive cylinder 35. Further, the ejection nozzle 34 provided above the wafer W is moved up and down within a predetermined range by a drive cylinder 36, as shown in FIG. Further, the ejection nozzle 34 is rotatable in the horizontal direction (θ ′ direction) by a rotation drive mechanism (not shown), and thus the ejection nozzle 34 is rotated to a position outside the outer periphery of the wafer W. It has become so. A dummy dispenser 37 for collecting the solution ejected from the ejection nozzle 34 is provided at a predetermined position outside the outer periphery of the wafer W.

The chuck mechanism 31, the jet nozzle 33 and the like are housed in a first cup 38 having a small diameter. First
The cup 38 has an opening having a diameter slightly larger than the diameter of the wafer W, and the wafer W is accommodated in the cup from above through the opening. A first drain 39 is provided on the lower surface of the first cup 38 for collecting and discharging the solution and DIW ejected in the cup. Furthermore, the first
An exhaust port 40 as an exhaust unit for exhausting the inside of the processing chamber 30 is provided on the lower surface of the cup 38. The exhaust port 40 is connected to, for example, an exhaust pump (not shown).

The first cup 38 is the first cup 3
It is accommodated in a second cup 41 having a diameter larger than eight. The second cup 41 has an opening portion having a diameter larger than that of the first cup 38, and the wafer W is placed in the second cup and further in the first cup through the opening portion. Accommodate. The height of the opening of the second cup 41 is
Is higher than the height of the cup 38, and the solution or DI is introduced into the second cup 41 through the gap utilizing this height difference.
It is designed to collect W. Further, on the lower surface of the second cup 41, the solution or D ejected in the cup
A second drain 42 is provided for collecting and discharging the IW. An exhaust port similar to that of the first cup 38 may be provided in the second cup 41.

On the front surface of the processing chamber 30 on the wafer transfer path side,
A window portion 43 for delivering the wafer W is provided. The window 43 can be opened and closed vertically, for example, by a drive cylinder (not shown). The wafer transfer body 22 movably arranged on the wafer transfer path transfers the wafer W to be cleaned with the processing chamber 30 through the window 43.

Then, the chuck mechanism 31 moves the window portion 43 at the first position above the opening portion of the second cup 41.
The wafer W is received from the wafer carrier 22 via the wafer W, and the wafer W is transferred to a gap position between the openings of the first cup 38 and the second cup 41 to perform cleaning by DIW, for example. The wafer W is transferred to a position below the opening of the first cup 38, and cleaning with, for example, a solution is performed.

Further, on the upper surface of the processing chamber 30, there are, for example, 2 inlets 44 for introducing an external atmosphere into the processing chamber 30.
It is provided in some places. Each of these inlets 44 is provided with an opening / closing mechanism 45 for opening and closing the inlet 44.

6 and 7 show an example of the structure of the opening / closing mechanism 45. 6 is a BB arrow view in FIG. 4, and FIG. 7 is an enlarged perspective view of the opening / closing mechanism 45.

As shown in these figures, the opening / closing mechanism 4
5 is an opening / closing plate 46 axially supported to open and close the inlet 44.
The opening / closing plate 46 closes the inlet 44 when the pressure inside and outside the processing chamber 30 is substantially equal or the inside of the processing chamber 30 is positive, and the inlet 44 is opened when the inside pressure of the processing chamber 30 is negative. It has a counterweight 47 that counterbalances 46.

As shown in FIG. 4, in the processing chamber 30, processing units such as the first cup 38 and the second cup 41 arranged below the processing chamber 30 are provided and above the processing units. A partition plate 48 for partitioning the inlet 44 is arranged. As shown in FIG. 8, the partition plate 48 is provided with a plurality of ventilation holes 49 radially, for example. These ventilation holes 4
9 is provided in a region other than the region 50 immediately below the inlet 44. As a result, it is possible to prevent dust from the introduction port 44 from falling through the ventilation hole 49 to the processing parts such as the first cup 38 and the second cup 41. But,
It is also possible to provide such a ventilation hole 49 in the region 50 immediately below the introduction port 44. Furthermore, it is possible not to intentionally arrange such a partition plate 48.

9 to 11 show examples of opening / closing operations by the opening / closing mechanism 45.

As shown in FIG. 9, when the window 43 is opened to transfer the wafer W, the pressure inside and outside the processing chamber 30 becomes substantially the same, so that the opening / closing plate 46 is closed and the external atmosphere becomes the window. It is introduced into the processing chamber 30 via 43. In this case, a downflow airflow from the window 43 to the exhaust port 40 is formed in the processing chamber 30.

As shown in FIG. 10, the wafer W is placed in the processing chamber 3
0, and when the window 43 is closed, the processing chamber 30
The inside becomes negative pressure, the opening / closing plate 46 opens, and the external atmosphere is introduced into the processing chamber 30 through the introduction port 44. in this case,
In the processing chamber 30, a downflow airflow from the introduction port 44 to the exhaust port 40 is formed.

As shown in FIG. 11, when the inside of the processing chamber 30 cannot be exhausted for some reason, the pressure inside and outside the processing chamber 30 becomes almost the same, so the open / close plate 46 is closed. The chamber 30 is in a sealed state.

Therefore, in the cleaning apparatus 1 of the present embodiment, when the window 43 is opened to transfer the wafer W, an airflow from the outside to the inside of the processing chamber 30 is formed through the window 43. Therefore, the atmosphere in the processing chamber 30 does not leak to the outside through the window 43. Further, for example, when the exhaust in the processing chamber 30 cannot be performed due to some reason, the inlet 44 is closed, so that the atmosphere in the processing chamber 30 leaks to the outside through the inlet 44 described above. Will disappear. And Tsu good,
For example, the wafer W on the wafer transfer path is not adversely affected. The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical idea.

For example, in the above-described embodiment, the example in which the present invention is applied to the APM cleaning unit, the DHM cleaning unit, and the HPM cleaning unit has been described, but the present invention can be applied to other cleaning units such as DIW cleaning. Further, the present invention can be applied to a processing unit other than the cleaning unit, such as a resist unit. In short, the present invention can be applied to any unit as long as it is a unit configured to exhaust the airtight processing chamber.

Further, the units may be constructed in multiple stages in the vertical direction (Z direction).

The substrate to be processed is not limited to the semiconductor wafer, and may be an LCD substrate, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.

[0045]

As described in detail above, according to the present invention,
A window part that can be opened and closed to transfer the substrate to be processed,
A closed processing chamber having an inlet for introducing an external atmosphere and performing a predetermined process on a substrate to be processed transferred through a window, and an exhaust unit for exhausting the inside of the process chamber. And, since it is provided with an opening / closing mechanism that closes the inlet and opens the inlet when the pressure inside the processing chamber is negative, the atmosphere inside the processing chamber leaks to the outside from the window and the atmosphere inside the processing chamber is lower than the inlet. It will not leak outside.

Further, according to the present invention, there is provided an openable / closable window portion for delivering the substrate to be treated and an inlet for introducing the external atmosphere, and the object to be treated delivered through the window portion. A closed type processing chamber for performing a predetermined process on a substrate, an exhaust means for exhausting the inside of the processing chamber, an opening / closing plate pivotally supported to open / close the inlet, and the opening / closing plate for opening / closing the inlet. Since it is provided with an opening / closing mechanism that closes and has a counterweight that balances with the opening / closing plate so as to open the inlet when the pressure inside the processing chamber is negative, a structure that very easily leaks the atmosphere in the processing chamber to the outside Can be achieved with.

Further, in the present invention, an openable / closable window portion for transferring the substrate to be processed is provided on the front surface, and an introduction port for introducing an external atmosphere is provided on the upper surface, and the window portion is provided. A closed type processing chamber for performing a predetermined process on the transferred substrate to be processed, an exhaust unit provided below the processing chamber for exhausting the processing chamber, and a shaft support capable of opening and closing the inlet. And the opening and closing plate, which closes the introduction port,
Further, since the opening / closing mechanism having the opening / closing plate and the counterweight which balances with the opening / closing plate is opened when the negative pressure in the processing chamber is opened, leakage of the atmosphere in the processing chamber to the outside is realized with a very simple structure. At the same time, a downflow airflow can be formed in the processing chamber.

Furthermore, according to the present invention, an openable and closable window portion for transferring the substrate to be processed is provided on the front surface, and an introduction port for introducing an external atmosphere is provided on the upper surface, and the window portion is provided. A processing chamber of a sealed type for performing a predetermined processing on the substrate to be processed transferred and provided below the processing chamber,
Exhaust means for exhausting the inside of the processing chamber, an opening / closing plate pivotally supported to open / close the inlet, the opening / closing plate closing the inlet, and opening the inlet when the pressure inside the processing chamber is negative. An opening / closing mechanism having a counterweight that balances the opening / closing plate, a processing unit that is disposed in the processing chamber and performs a predetermined processing on the substrate to be processed, and the inlet above the processing unit, and has a ventilation hole. Since it has a partition plate that has, it is possible to form a downflow airflow into the processing chamber while realizing the leakage of the atmosphere in the processing chamber to the outside with a very simple structure, and to introduce the external atmosphere. The dust generated from the vicinity of the introduction port does not adhere to the substrate being processed.

Further, in the present invention, since the partition plate has the ventilation hole in a region other than the region immediately below the introduction port, it is possible to prevent dust on the introduction port side from dropping through the ventilation hole to the processing section. You can

[Brief description of drawings]

FIG. 1 is a plan view of the overall configuration of a semiconductor wafer cleaning apparatus to which an embodiment of the present invention is applied.

FIG. 2 is a front view of the cleaning device shown in FIG.

3 is a rear view of the cleaning device shown in FIG. 1. FIG.

FIG. 4 is a vertical cross-sectional view of the cleaning processing unit shown in FIG.

5 is a view of the cleaning processing unit AA shown in FIG.

6 is a BB arrow view of the cleaning unit shown in FIG.

7 is an enlarged perspective view of the opening / closing mechanism shown in FIG.

8 is a view of the cleaning unit shown in FIG. 4, taken along the line CC.

FIG. 9 is a diagram showing an example of opening / closing operation by the opening / closing mechanism in the present embodiment.

FIG. 10 is a diagram showing an example of opening / closing operation by the opening / closing mechanism in the present embodiment.

FIG. 11 is a diagram showing an example of opening / closing operation by the opening / closing mechanism in the present embodiment.

FIG. 12 is a diagram showing a schematic configuration of a conventional processing chamber.

[Explanation of symbols]

1 cleaning device 22 Wafer carrier 30 processing room 31 Chuck mechanism 33, 34 jet nozzle 38 First Cup 40 exhaust port 41 Second Cup 43 Window 44 entrance 45 open / close mechanism 46 Open / close plate 47 counterweight 48 partition boards 49 ventilation holes 50 Area immediately below the inlet W wafer

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-148465 (JP, A) JP-A-6-126264 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/304 B08B 13/00 F24F 7/06 H01L 21/68

Claims (4)

(57) [Claims] 1. A substrate to be processed, which has an openable / closable window portion for transferring the substrate to be processed and an inlet for introducing an external atmosphere, and which is transferred through the window portion. A closed type processing chamber for performing a predetermined process, an exhaust unit for exhausting the inside of the processing chamber, an opening / closing plate pivotally supported to open / close the inlet, and the opening / closing plate closing the inlet, and A processing apparatus, comprising: an opening / closing mechanism having a counterweight that balances the opening / closing plate so as to open the inlet when a negative pressure is generated in the processing chamber. 2. A substrate having an openable and closable window portion for delivering the substrate to be processed and an inlet for introducing an external atmosphere on the top surface, and delivered through the window portion. A closed processing chamber for performing a predetermined processing on a substrate to be processed, an exhaust unit provided below the processing chamber for exhausting the processing chamber, and an opening / closing plate pivotally supported to open and close the inlet. And a closing mechanism having a counterweight that closes the inlet and the opening plate opens the inlet when the negative pressure in the processing chamber is reached. . 3. An openable / closable window portion for delivering a substrate to be processed is provided on the front surface, and an inlet for introducing an external atmosphere is provided on the upper surface, and the substrate is delivered through the window portion. A closed processing chamber for performing a predetermined processing on a substrate to be processed, an exhaust unit provided below the processing chamber for exhausting the processing chamber, and an opening / closing plate pivotally supported to open and close the inlet. And an opening / closing mechanism having an opening / closing plate that closes the inlet, and has a counterweight that balances the opening / closing plate so as to open the inlet when the pressure in the processing chamber is negative, and the opening / closing mechanism is disposed in the processing chamber. A processing apparatus comprising: a processing unit that performs a predetermined process on a processing substrate; and a partition plate that partitions the inlet above the processing unit and has a ventilation hole. 4. The processing apparatus according to claim 3 , wherein the partition plate has the ventilation hole in a region other than a region immediately below the introduction port.