JP3368645B2 - LAMINATED ELECTRONIC COMPONENT, ITS MANUFACTURING METHOD AND ITS CHARACTERISTIC MEASUREMENT METHOD - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component having internal circuit elements arranged therein, a method of manufacturing the same, and a characteristic measuring method thereof, and more particularly, to improvement of a mode of forming external electrodes in the laminated electronic component. Is.

[0002]

2. Description of the Related Art For example, a multilayer electronic component typified by a multilayer capacitor, a multilayer inductor, a multilayer circuit board, and a multilayer composite electronic component has a plurality of internal circuit elements such as a conductive film and / or a resistance film. And a laminated body formed by laminating the insulating sheets. As an insulating sheet,
Ceramic sheets are typically used.

FIG. 5 is a perspective view showing the appearance of a conventional laminated electronic component 1 which is of interest to the present invention. The laminated electronic component 1 includes a laminated body 2 in which a plurality of insulating sheets are laminated with an internal circuit element (not shown) interposed. External electrodes 3 electrically connected to the internal circuit elements are formed on, for example, four side surfaces of the laminated body 2. These external electrodes 3 are provided by dividing the through holes 4 as shown by phantom lines in FIG.

That is, in a mother laminated body 5 prepared so that a plurality of laminated electronic components 1 can be obtained by dividing along a predetermined dividing line, a through hole 4 is formed, and an external surface is formed on the inner peripheral surface thereof. After applying the conductive material 6 to be the electrodes 3, the mother laminated body 5 is divided so as to divide the through holes 4.

Such a laminated electronic component 1 is surface-mounted in the form of a chip on an appropriate circuit board via the external electrodes 3.

[0006]

The above-mentioned application of the conductive material 6 to the through hole 4 is generally carried out by screen printing the conductive material using a conductive paste. Therefore, the conductive material 6 forming the external electrode 3 extends not only on the inner peripheral surface of the through hole 4 but also on each peripheral surface of the through hole 4 so as to extend onto each main surface of the laminated body 2. Granted. As a result, the external electrode 3 forms the overhanging portion 7 on each main surface of the laminated body 2.

The presence of such an overhang 7 causes the following problems. That is, when another component is mounted on both main surfaces or one of the main surfaces of the laminated electronic component 1 to form a composite, the area where such another component can be placed is limited. Further, it prevents the arrangement pitch of the external electrodes 3 from being made fine.

When the conductive material 6 to be the external electrode 3 is formed by applying silver paste and baking, for example, nickel plating is usually applied on the conductive material 6 to protect the silver, and the conductive material 6 is further applied. In order to improve the solderability, tin plating is applied. On the other hand, when the silver paste to be the conductive material 6 is applied in the through holes 4, if the silver paste is excessive, the penetration of the through holes 4 may be hindered. However, if the penetrability of the through hole 4 is impeded in this way, it becomes impossible to apply the above-mentioned plating to the inside of the through hole 4. Therefore, when the external electrode 3 is exposed by dividing the through hole 4, a portion where a desired plating film is not formed is generated on the external electrode 3 and the above-described plating function is exerted. A situation occurs where it is not properly exhibited.

Further, the laminated electronic component 1 must be measured for its characteristics at least before shipping. However, as a general rule, the laminated electronic component 1 cannot measure its characteristics unless it is in an independent state. That is, at the stage of the mother laminated body 5, the characteristics of the individual laminated electronic components 1 cannot be measured, and after dividing the mother laminated body 5 so as to divide the through holes 4,
For the first time, the characteristics can be measured. Therefore, the characteristics of many laminated electronic components 1 cannot be efficiently measured.

Therefore, it is an object of the present invention that at least one main surface thereof can be widely used as a mounting surface of another component for compounding, so that high density mounting of components can be achieved. It is an object of the present invention to provide a laminated electronic component and a method for manufacturing the same, which can realize a fine arrangement pitch of external electrodes.

Another object of the present invention is to provide a characteristic measuring method capable of efficiently measuring the characteristic of a plurality of laminated electronic components.

[0012]

A laminated electronic component according to the present invention is a laminated body in which a plurality of insulating sheets are laminated with an internal circuit element interposed, and electrically connected to the internal circuit element. And an external electrode formed on the outer surface of the laminated body, wherein the laminated body has a step on the side surface,
It is divided into two parts by the boundary surface corresponding to the position of the step.
When divided, the external electrode is formed on one side,
In addition, at least the external electrode of the plurality of main surfaces is formed.
The main surface of the laminated body that is not covered constitutes the mounting surface of the electronic component
It is characterized in that.

In the method for manufacturing a laminated electronic component according to the present invention, a plurality of laminated electronic components can be obtained by dividing the laminated electronic component along a predetermined dividing line. A plurality of mother insulating sheets are laminated with the internal circuit elements interposed so as to distribute the internal circuit elements for the laminated electronic component, and do not penetrate at positions passing through the dividing lines. A step of preparing a mother laminated body provided with holes,
In the hole, the step of applying a conductive material to be electrically connected to the internal circuit element, at least on the main surface of the plurality of main surfaces of the mother laminate on the side where the hole is provided ,
The conductive material is divided into a plurality of parts, and the parts are electrically connected to each other.
So as to be independent of each other, a groove is formed along the dividing line, and then the mother laminated body is divided along the dividing line to form a step around each side surface of the plurality of laminated electronic components. And the process.

In the method for measuring the characteristics of a laminated electronic component according to the present invention, a plurality of laminated electronic components can be obtained by dividing along a predetermined dividing line, and each region divided by the dividing line is individually divided. In order to distribute the internal circuit elements for the laminated electronic component, the plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and the mother insulating sheets are pierced at positions passing through the dividing lines. A hole is provided and a conductive material that is electrically connected to the internal circuit element is provided in the hole, a step of preparing a mother laminate, and dividing the conductive material in the hole into a plurality of parts So as to be electrically independent from each other, a step of forming a groove in the mother laminated body along the dividing line, and measuring the characteristics of each laminated electronic component using each divided conductive material portion as an external electrode. And a step of.

The form of the laminated electronic component given in the above-mentioned characteristic measuring method, that is, the aggregate of the laminated electronic components composed of the mother laminated body in which the groove is formed can be used as it is as the form at the time of shipment.

[0016]

According to the laminated electronic component of the present invention, since the conductive material to be the external electrode is provided in the hole that does not penetrate the laminated body, the external electrode is provided on one main surface of the laminated body. Since it is not exposed, this main surface of the laminated body can be widely used as a mounting surface of other components for compounding without being interfered with by external electrodes, and as a result, it is possible to mount the components. Higher density can be achieved. Also,
The conductive material applied in the holes can be prevented from forming the overhanging portions 7 shown in FIG. 5 by selecting the applying method, so that the arrangement pitch of the external electrodes can be made fine.

Further, according to the method of manufacturing a laminated electronic component of the present invention, many steps for obtaining a laminated electronic component can be carried out in the state of a mother laminated body.
A large number of laminated electronic components can be efficiently manufactured.
Also, when dividing the mother laminated body to obtain a plurality of laminated electronic components, a groove is formed in the mother laminated body in advance along the dividing line, thereby forming a groove in the conductive material in the hole. By doing so, the plating for giving preferable properties as the external electrode can be applied to the portion exposed on the side surface of the groove. As a result, the surface of the external electrode of the laminated electronic component obtained by finally dividing the mother laminated body is surely covered with such a plating film.

Further, according to the method for measuring characteristics of a laminated electronic component according to the present invention, by forming a groove, a plurality of laminated electronic components can be electrically isolated from each other, but as a mother laminated body. Remains mechanically integrated,
The properties of individual laminated electronic components can be measured. Therefore, it is not necessary to handle a plurality of mechanically independent laminated electronic components, and the characteristics of a large number of laminated electronic components can be efficiently measured by screening, for example.

Further, if the aggregate of laminated electronic components, which is a form for carrying out the above-mentioned characteristic measurement and is composed of a mother laminate having grooves formed therein, is used as it is as a form at the time of shipment, on the consumer side. The individual laminated electronic components can be taken out from the mother laminated body only by dividing the mother laminated body along the grooves. In this case, the individual laminated electronic components can be subjected to mounting without any problem because the characteristics of the individual laminated electronic components can already be measured. It should be noted that it is easier to pack and handle than the case in.

[0020]

1 is a perspective view showing the external appearance of a laminated electronic component 10 according to an embodiment of the present invention. Multilayer electronic component 10
Is mounted on an appropriate circuit board in the form of the illustrated chip, but in FIG. 1, the laminated electronic component 10 is illustrated with the main surface facing the circuit board facing upward. Has been done.

The laminated electronic component 10 comprises a laminated body 11 in which a plurality of insulating sheets are laminated with an internal circuit element (not shown) interposed. For example, 4 of the laminated body 11
An external electrode 12 exposed on the outer surface of the stacked body 11 is formed on each of the two side surfaces. Although not shown, these external electrodes 12 are electrically connected to internal circuit elements.

The external electrode 12 as described above has the laminated body 1 as will be apparent from the description of the manufacturing method described below.
1 is formed by exposing the conductive material provided in the holes provided in the laminated body 11 so as not to penetrate 1 through the division of the holes. Further, the step 13 is formed on each of the four side surfaces of the laminated body 11, for example. The reason why the step 13 is formed will be apparent from the following description of the manufacturing method.

In order to obtain the laminated electronic component 10 as described above, a mother laminated body 14 as shown in FIG. 2 is prepared.
The mother laminated body 14 provides a plurality of laminated electronic components 10 by dividing the laminated electronic components 10 along a predetermined dividing line 15 (one-dot chain line). A plurality of mother insulating sheets 16 and 1 with the internal circuit elements interposed so that the internal circuit elements (not shown) for 10 are distributed.
7 is laminated.

To obtain the mother laminated body 14 as described above, for example, the following steps are carried out. In addition,
In this example, the mother insulating sheets 16 and 17 are
Is composed of a ceramic sheet.

First, sheet formation is performed by a doctor blade method or the like, and mother insulating sheets 16 and 17 are formed.
Get a ceramic green sheet that should be. A via hole or the like is formed in a particular one of these ceramic green sheets by punching or the like in order to enable electrical conduction through the sheet in the thickness direction. Next, a conductive film and / or a resistance film to be an internal circuit element is printed on a specific one of the ceramic green sheets. At this time, a conductive material may be filled in the already formed via hole.

Next, the mother insulating sheets 16 and 17 as described above are stacked and pressed. Thereby, the mother laminated body 14 is obtained. A partial cross-sectional view of the mother laminated body 14 is shown in FIG.

Next, as shown in FIGS. 2 and 3B, a hole 19 having a predetermined depth is formed in the mother laminated body 14 at a position passing through the dividing line 15 by, for example, a drill. These holes 19 do not penetrate the mother laminate 14.
Therefore, such holes 19 are formed in the mother insulating sheet 16 located relatively above in FIG. 2, and the holes 19 are formed in the mother insulating sheet 17 located relatively below.
Just understand that it has not arrived.

Next, as shown in FIG. 3C, the conductive material 18 is applied in the hole 19. Although not shown, the conductive material 18 is electrically connected to internal circuit elements. Conductive material 1
The application of 8 is performed, for example, by filling the hole 19 with a conductive paste by a dispenser or screen printing.

When trying to form the hole 19 described above,
As described above, after the mother laminated body 14 is obtained, the hole 1 is formed so as to reach the mother laminated body 14 partway in the thickness direction.
9, the plurality of mother insulating sheets 16 forming the relatively upper portion of the mother laminated body 14 shown in FIG.
7 are laminated separately from each other, and through holes which are to be the holes 19 are provided in the plurality of mother insulating sheets 16 thus laminated by, for example, punching, drilling, laser or the like, and then the mother insulating sheet 16 is Mother insulating sheet 1
A method of laminating on 7 may be adopted. In these methods, the holes 19 are formed at the same time in a single process, so the holes 19
The inner peripheral surface of can be easily smoothed. However, before the mother insulating sheets 16 are laminated, the through holes to be the holes 19 are provided in advance in each of the mother insulating sheets 16, and the mother insulating sheets 16 are laminated so that these through holes are aligned. You may do it.

Next, as shown in FIGS. 3D and 4, the groove 20 is formed along the dividing line 15 in the mother laminated body 14.
Are formed by, for example, a dicing saw. Groove 20
Is selected to have a depth such that the conductive material 18 in the hole 19 is divided into a plurality of parts and the parts are electrically isolated from each other. As a result, the conductive material 18 is exposed on the side surface of the groove 20.

Next, as shown in FIGS. 3 (e) and 4, slits 21 and 22 are provided on the bottom surface of the groove 20 and the lower surface of the mother laminated body 14 facing it, respectively, if necessary. One of the slits 21 and 22 may be omitted.

Incidentally, in FIG. 4, conductive films 23 and 24 to be internal circuit elements are shown. Further, a state in which the conductive film 23 is electrically connected to the conductive material 18 is also illustrated.

Next, the mother laminated body 14 is fired in order to sinter the ceramics constituting the mother insulating sheets 16 and 17. Thereafter, if necessary, a conductive film and / or a resistance film is formed on the surface of the mother laminated body 14, an overcoat is applied, and a solder resist is applied. In addition, the conductive material 18 or other conductive film to be the external electrode 12 is plated if necessary.

When the above steps are completed, the mother laminated body 1
Since the plurality of laminated electronic components 10 included in 4 are electrically independent from each other, the conductive material 18 present in each part of the hole 19 divided by the groove 20 is used as an external electrode. The characteristics of each laminated electronic component 10 can be measured.

As described above, after the characteristics have been measured, other electronic components for compounding are mounted on the laminated electronic component 10 determined to be non-defective, if necessary. The steps described so far can be efficiently performed in the state of the mother laminated body 14. The laminated electronic component 10 may be shipped at this stage.

Next, in order to obtain a plurality of mechanically independent laminated electronic components 10, the mother laminated body 14 is completely divided along the dividing line 15, that is, the groove 20. This division is
Groove the mother laminate 14 into the groove 20 so as to break the chocolate.
Easily achieved by splitting along. The slits 21 and 22 described above make such division easier. Note that such division may be achieved by cutting with a dicing saw having a blade thickness smaller than the width of the groove 20.

In this way, the laminated electronic component 10 shown in FIG. 1 is obtained. As can be seen from the above description,
The step 13 is a result of the formation of the groove 20 described above. When the laminated body 11 is divided into two parts by the boundary surface corresponding to the position of the step 13, the external electrode 12 is formed only in one part.
Therefore, the external electrode 12 does not reach the lower main surface (main surface hidden in FIG. 1) of the laminated electronic component 10 in the posture shown in FIG. It can be widely used as a mounting surface for other electronic components without being interfered by the external electrodes 12.

Next, the laminated electronic component 10 is casing if necessary. This casing covers other components mounted on the lower main surface of the laminated electronic component 10 according to FIG.

Although the present invention has been described above with reference to the embodiments shown in FIGS. 1 to 4, several other modifications are possible within the scope of the present invention.

For example, the step of firing the mother laminate 14 is performed before the step shown in FIG. 3B, before the step shown in FIG. 3C, before the step shown in FIG. 3D, or before the step shown in FIG. It may be performed before. When the step of FIG. 3C is performed after such a firing step, the conductive material 18 may be provided in the hole 19 by dry plating.

Regarding the steps after the firing step in the illustrated embodiment described above, at least some of them may be omitted or the order thereof may be changed.

Although the cross-sectional shape of the hole 19 is circular, it may be changed to another shape such as a quadrangle.

The insulating sheet used in the present invention is not limited to the ceramic sheet, and may be replaced with an insulating sheet made of another material.

Further, the present invention is not limited to the laminated electronic component in which all of the plurality of external electrodes are formed on the basis of the conductive material provided in the holes, but a laminated structure in which some of the external electrodes are formed by another method. It can also be applied to electronic components.

[Brief description of drawings]

FIG. 1 is a perspective view showing an appearance of a laminated electronic component 10 according to an embodiment of the present invention.

2 is a perspective view showing a mother laminate 14 prepared to obtain the laminated electronic component 10 shown in FIG.

FIG. 3 is a cross-sectional view showing various steps sequentially performed on the mother laminated body 14 shown in FIG.

4 is an enlarged perspective view showing a part of the mother laminated body 14 obtained by the step shown in FIG. 3 (e).

FIG. 5 is a perspective view showing an appearance of a conventional laminated electronic component 1 which is of interest to the present invention.

[Explanation of symbols]

10 Multi-layer electronic components 11 laminate 12 external electrodes 14 mother laminate 15 dividing line 16,17 Mother insulating sheet 18 Conductive material 19 holes 20 grooves 23, 24 conductive film (internal circuit element)

Continuation of front page (51) Int.Cl. ⁷ Identification code FI H05K 3/40 H05K 3/40 D 3/46 3/46 N W

Claims (6)

(57) [Claims] 1. A laminated body in which a plurality of insulating sheets are laminated with an internal circuit element interposed, and an electrically connected to the internal circuit element and formed on an outer surface of the laminated body. An external electrode, wherein the laminate has a step on a side surface, and when divided into two parts by a boundary surface corresponding to the position of the step, the external electrode is formed on one part, and A laminated electronic component in which at least the principal surface of the laminated body on the side on which the external electrode is not formed among a plurality of principal surfaces constitutes a mounting surface of the electronic component. 2. The laminated electronic component according to claim 1, wherein the external electrode does not reach a boundary surface corresponding to the position of the step. 3. A plurality of laminated electronic components can be obtained by dividing along a predetermined dividing line, and an internal circuit for each of the laminated electronic components is provided in each region divided by the dividing line. A mother laminate in which a plurality of mother insulating sheets are laminated with these internal circuit elements interposed so as to distribute the elements, and holes not passing through are provided at positions passing through the dividing lines. prepare, in said bore, said internal circuit elements impart electrically connected to a conductive material, at least on the hole on the side that is provided the major surface of said mother laminate of a plurality of main surfaces, said If the conductive material in the hole is
Divide into several parts and make each part electrically independent of each other.
As described above, after forming a groove along the dividing line, dividing the mother laminated body along the dividing line to form a step around each side surface of the plurality of laminated electronic components. A method of manufacturing a laminated electronic component, comprising: 4. A method for forming a groove along a parting line, comprising:
After that, in the step of dividing the mother laminated body along the division line.
Before, comprising the step of firing the mother laminate
Item 3. A method for manufacturing a laminated electronic component according to Item 3. 5. A plurality of laminated electronic components are obtained by dividing along a predetermined dividing line, and an internal circuit for each of the laminated electronic components is provided in each region divided by the dividing line. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a hole that does not penetrate is provided at a position passing through the dividing line. Preparing a mother laminated body to which a conductive material electrically connected to the internal circuit element is provided, and dividing the conductive material in the hole into a plurality of parts so that the respective parts are electrically independent from each other. A groove is formed in the mother laminated body along the dividing line, and the characteristic of each laminated electronic component is measured by using each divided portion of the conductive material as an external electrode. Characteristic measurement Method. 6. A plurality of laminated electronic components are obtained by dividing along a predetermined dividing line, and an internal circuit for each of the laminated electronic components is provided in each region divided by the dividing line. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a hole that does not penetrate is provided at a position that passes through the dividing line. A conductive material that is electrically connected to the internal circuit element is provided, and a mother laminated body is provided, and the mother laminated body is divided into a plurality of portions of the conductive material in the hole to electrically connect each portion to each other. A group of laminated electronic components, wherein grooves are formed along the dividing lines so as to be independent.