JP3340610B2 - Electronic component package body and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device such as an integrated circuit chip, a chip component such as a chip resistor and a chip capacitor, and an electronic component for mounting an electronic component such as a crystal oscillator and a surface acoustic wave device. The present invention relates to a package body and a manufacturing method thereof.

[0002]

2. Description of the Related Art In a ceramic package body on which an integrated circuit chip or the like is mounted, an unfired ceramic green sheet is printed or filled into through holes with a paste of tungsten or the like for circuit wiring, and then laminated and cut into a predetermined shape. After firing, a material manufactured by a simultaneous firing method is often used.

[0003] Here, plating of the required plating parts which require plating of each part of the fired laminate is performed by electroless plating or electrolytic plating. Among them, the electrolytic plating has an advantage that the production cost is low and the plating can be performed reliably, compared with the electroless plating, but it is necessary to provide electrical conduction to a plating required portion, so that the electrolytic plating is formed in the laminate. Conducting conduction through a plating tie bar is performed.

FIGS. 11 to 14 show a method of manufacturing a package body according to the prior art. FIG. 11 is a plan view of the green sheet. On the green sheet (first layer) 314 in which the first opening 314A is formed, a metal paste layer 382 serving as an internal wiring and a plating tie bar is applied. On the upper surface of this metal paste layer 382, FIG.
By laminating a second layer green sheet (not shown) in which a second opening 316A shown by a broken line is formed,
A laminated sheet is formed. Here, the inner end 382a of the metal paste layer is a portion to be a bonding pad later, is exposed from the second opening 316A side even after lamination, and extends to approximately the first opening 314A. . In the figure, C is a cutting line indicating the cutting position of the laminated sheet.

FIG. 13 is an enlarged view of a circle A in FIG. The metal paste layer 382 shown in the drawing includes a portion 382b for forming an internal wiring and a portion 382c for forming a plating tie bar, and the portion 382c for forming a plating tie bar extends outside the cutting line C (right side in the drawing). )
Extends.

FIG. 12A shows a state of a metal paste layer of a laminate obtained by cutting a laminated sheet obtained by laminating a second green sheet on the first green sheet 314 shown in FIG. 11 along a cutting line C. FIG. 12B shows a state in which a metal paste layer is applied to the side end surface of the stacked body shown in FIG. 12A and then baked to form a conductive layer 335 for plating.
In the laminated body shown in FIG. 12B, the metallized layer (bonding pad) exposed from the opening 316A side
332a is subjected to electrolytic plating. Here, after immersing the laminate in the plating solution, the plating conductive layer 33 on the side surface of the laminate is used.
5 through the plating tie bar 337 and the internal wiring 339 to the metallization layer 332a.
Plating all at once. Thereafter, by removing the conductive layer for plating 335 by grinding or the like, the wirings are separated from each other and become independent.

[0007]

Here, the plating tie bar provided for performing the electrolytic plating when forming the package body for the integrated circuit is unnecessary after the plating, but is not necessary thereafter. It remains in the package body. In addition, the plating tie bar has a stray capacitance between a ground line and a power supply line (not shown) and may transmit noise and the like to the internal wiring 339 side. It is necessary to reduce the capacity. Therefore, circle A in FIG.
As shown in FIG. 13 which is an enlarged view of the portion, the metal paste layer 382c forming the plating tie bar is formed thinner than the metal paste layer 382b forming the internal wiring.

However, the metal paste layer 382
When c is formed to be thin, there may be a case where the metal is not connected to the metal paste layer serving as the conductive layer for plating 335 described above with reference to FIG. 12B, and a case where plating cannot be performed may occur.

FIG. 14 is an enlarged view of a side surface of a cross section taken along line BB of FIG. When the thin metal paste layer 382c is cut along the cutting line C in FIG. 11, between the first layer green sheet 314 and the second layer green sheet 316 as shown in FIG. It may be buried and cannot be exposed on the side end surface. Therefore, FIG.
As shown in FIG. 2 (B), the plating conductive layer 3
Even if 35 is provided, a plating tie bar that is not connected to the plating conductive layer 335 can be formed. Then, since no current can flow through the metallized layer 332a connected to the plating tie bar, the metallized layer 332a (for example, at one location)
Only the electrolytic plating is not performed, and the entire package body must be discarded as defective.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to reduce the floating capacity of a plating tie bar and to reliably perform electrolytic plating. And a method for manufacturing the same.

[0011]

According to a first aspect of the present invention, there is provided an electronic component package body for mounting an electronic component, comprising: a plurality of laminated insulating layers; A plating tie bar disposed between the insulating layer and the insulating layer to expose the package body, and a plating tie bar disposed on the side surface of the package body and exposed on the side surface. and a plating conductive layer connected, the plating tie bars, the plating tie bars, the width of the cutting portion is formed wider than the portion located from the object to be cut portion near the inside of the package body and This is a technical feature.

In the electronic component package body of the first aspect, the plating tie bar disposed between the insulating layer and the insulating layer is formed such that the width of the portion inside the package body is smaller than the width of the portion to be cut. Therefore, the stray capacitance becomes smaller,
Less susceptible to noise. Conversely, since the portion to be cut is widened, the connection between the conductive layer for plating and the plating tie bar can be ensured, and there is no problem that plating is not applied to various places where plating is to be performed.

According to a second aspect of the present invention, there is provided an electronic component package body for mounting an electronic component, comprising: a plurality of laminated insulating layers; and a metallized layer disposed between the insulating layers. A metallized layer including an internal wiring and a plating tie bar derived from the internal wiring to the side surface of the package body, and a conductive layer for plating disposed on the side surface of the package body and connected to the plating tie bar exposed to the side surface, In the plating tie bar of the metallized layer, a technical feature is that a width of a cut portion of the package body is formed wider than a width of a portion connected to the internal wiring.

In the electronic component package body of the second aspect, the plating tie bar of the metallized layer is formed so that the width of the portion connected to the internal wiring is narrower than the cut portion of the package body. For this reason, the floating capacitance of the plating tie bar is reduced, and is less susceptible to noise and the like. On the other hand, since the portion to be cut is wide, the connection between the conductive layer for plating and the plating tie bar can be surely performed, and the occurrence of a problem that causes a portion where plating is not attached can be suppressed.

According to a third aspect of the present invention, there is provided a method of manufacturing an electronic component package body for mounting an electronic component, wherein a plurality of metal pastes having a portion which becomes an internal wiring and a plating tie bar by firing are provided on the first green sheet. Forming a layer, wherein a width of a portion to be cut out of a portion serving as the plating tie bar is wider than a width of a connection portion with a portion serving as the internal wiring; A step of laminating and pressing a second green sheet on the sheet, cutting the laminate of the first and second green sheets at a predetermined position, and covering the portion of the metal paste layer that serves as the plating tie bar. Exposing a cut portion, forming a metal paste layer to be a conductive layer for plating on the side surface of the cut laminate, and forming the plating tie bar through the exposed cut portion. And a step of firing the laminate, and passing an electric current from the conductive layer for plating formed by the firing to the internal wiring through a plating tie bar, and plating each required plating portion of the package body connected thereto. And a step of performing the following.

According to a third aspect of the present invention, in the method of manufacturing a package body for an electronic component, the step of applying a metal paste layer comprises the steps of:
Since the width of the portion to be cut out of the portion that becomes the plating tie bar by firing is wider than the width of the connection portion with the portion that becomes the internal wiring, the laminate of the first and second green sheets is cut. Then, the cut portion can be reliably exposed. Therefore, when a metal paste layer serving as a plating conductive layer is applied to the side surfaces of the first and second green sheet laminates, the plurality of metal paste layers serving as the plating tie bars become the plating conductive layers. A metal paste layer can be connected. Therefore, after firing, a current flows from the conductive layer for plating to the internal wiring through a plurality of plating tie bars, and a bonding pad, a pad for C4, a die attach portion, a seal ring, an input / output pin, an input / output pad, etc. are connected thereto. In addition, it is possible to reliably perform plating on each of the required plating portions provided in the package body.

In claims 4 and 5, claims 1 to 1
Item 3 is a technical feature in that a width of a portion to be cut at the portion serving as the plating tie bar is 180 μm or more.

Further, in the electronic component package body according to the fourth and fifth aspects, the width of the cut portion of the portion of the metal paste layer that becomes the plating tie bar is set to 180 μm or more. Therefore, when the laminate of the first and second green sheets is cut, the cut portion can be reliably exposed to the side surface of the laminate.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. FIG. 1 is a partially cutaway side view of an electronic component package body according to a first embodiment of the present invention. Package body 1 for integrated circuits
Numeral 0 designates an insulating layer (bottom layer) 12 which is formed of simultaneously baked insulating layers 12, 14, and 16 and which forms a bottom surface, and a first opening 14A, a second opening 14A provided in the first layer 14 and the second layer 16. A space (recess) 1 in which the inner peripheral wall (side wall) is stepped by the opening 16A.
0A and houses the integrated circuit 20. First layer 14
A metallized layer 32 formed by applying and simultaneously firing a tungsten paste between
Is arranged. The first layer 1 of the metallized layer 32
The portions exposed in the vacant spaces 4 are plated with nickel and gold and arranged in rows as bonding pads 30. In this package body 10, the metallization layer 32 is connected to input / output pins 50 for connection to the outside through the inside of the package body. Note that a cap 60 for keeping the integrated circuit 20 airtight is placed via a seal ring 62 on the upper portion (upper side in the figure) of the package body 10.

Next, a method of manufacturing the package body 10 will be described with reference to FIGS. Ceramic powder containing alumina as a main component, silica as a sintering agent, magnesia, kneading powder such as calcia and organic solvents and binders to create a slurry, casting the slurry by a doctor blade method, sheet Thickness 0.
A plurality of green sheets of 5, 0.6 and 1 mm are prepared.
FIG. 2 shows a bottom green sheet 72 having a sheet thickness of 1 mm, a first layer green sheet 74 having a sheet thickness of 0.5 mm, and a second layer green sheet 76 having a sheet thickness of 0.6 mm. And Here, predetermined portions of the first layer green sheet 74 and the second layer green sheet 76 are punched to form a first opening 74A and a second opening 76A larger than the first opening 74A, and the first layer green sheet 74A is formed. Predetermined positions of the sheet 74 and the bottom green sheet 72 are punched to form via holes 86 and 88. Thereafter, a paste-like metal mixture containing tungsten as a main component is uniformly filled in the via holes 86 and 88 without gaps and dried.

After this drying, a metal paste layer 82 which becomes a metallized layer after firing on the surface of the first layer green sheet 74
Further, a metal paste layer 84 is applied to the surface of the bottom green sheet 72 to a thickness of 20 μm by screen printing a paste-like metal mixture containing tungsten as a main component.

Here, FIG. 4 shows a state in which the metal paste layer 82 applied to the surface of the first layer 74 is viewed along the arrow D. As will be described later, the metal paste layer 82 includes a portion 82a exposed from the second opening 76A of the second layer green sheet 76 to form a bonding pad, a first layer and a second layer.
A portion 82b between the green sheets 74 and 76 for forming the internal wiring and a portion 82 for forming the plating tie bar
c and 82d are formed. Here, the portion 82a for forming the bonding pad and the portion 82b for forming the internal wiring are formed to have a width of about 180 μm. The cutting line C for forming the package body is shown by a dashed line. FIG. 6 is an enlarged view of circle E in FIG.
Shown in In the metal paste layer constituting the plating tie bar, the connecting portion 82c with the internal wiring side is formed as thin as about 120 μm, and the portion (section to be cut) straddling the cutting line C is formed as thick as 180 μm. ing.

After drying the metal paste layers 82 and 84,
The metal paste layers 82 and 84 are pressed to form green sheets 72 and 74 such that the height from the sheet is 10 μm.
It is good to push in. Note that, in order to facilitate the description, a description in a state where the button is pressed in the drawings and the like is omitted.

Next, as shown in FIG. 3, the first layer green sheet 74 is placed on the bottom green sheet 72, and the second layer green sheet 7 is placed on the first layer green sheet 74.
6 is pressed while heating. Thereafter, the laminate sheet shown in FIG. 3 is cut along the cutting line C described above with reference to FIG. FIG. 5A is a plan view showing a state where the cut metal paste layer 82 of the stacked body 90 is seen through. In FIG. 5, the second layer green sheet 76 or the second layer 16 is
Note that only the second opening 76A or the opening 16A is shown for convenience of illustration. Here, FIG.
FIG. 7A is a view of the side surface 90A of the laminate 90 shown in FIG. 7A as viewed along the arrow F, that is, FIG.

As described above with reference to FIG. 6, the portion (section to be cut) 82d straddling the cutting line C of the metal paste layer constituting the plating tie bar is formed thick (wide), so that FIG. Unlike the prior art metal paste layer 382c described above, all the metal paste layers 82d are exposed from the side surface 90A.

Here, as shown in FIG. 5B, a paste-like metal mixture containing tungsten as a main component is screen-printed on each side surface 90A of the laminated body 90 shown in FIG. Then, a metal paste layer 85 to be a conductive layer for plating after firing is formed. FIG.
FIG. 7B shows a state in which the side surface 90A of the stacked body 90 shown in FIG. Here, since all the metal paste layers 82d are exposed from the side surface 90A, they are reliably connected to the applied metal paste layer 85.

Next, the laminate 90 shown in FIG. 5B is degreased and then fired. By this firing, the laminate shrinks and shrinks by less than about 20%. The laminate 92 after firing shrinkage is shown in FIG.
It is shown in (C). The metal paste layer 85 is fired to become the conductive layer for plating 35. Further, the metal paste layer 82 is baked, and the internal wiring 32 sandwiched between the first and second insulating layers and the pad 32a exposed from the second opening 76A is formed.
b and plating tie bars. Here, the narrow portion of the plating tie bar for connecting to the internal wiring 32b side shown in FIG. 5C is referred to as a conductive plating tie bar 32c.
Further, the thick portion cut at the cutting line C and connected to the plating conductive layer 35 side is connected to the plating tie bar 32 for connection.
Called as d. The pad portion 32a and the internal wiring 32b have a width of about 150 μm due to the contraction of about 20% described above.
m, the conductive tie bar 32c has a width of about 100 μm
The connecting plating tie bar 32d has a width of about 150 μm.

Next, the laminate 92 shown in FIG. 5C is immersed in a solution for electrolytic plating, and a current is applied to the conductive layer 35 for plating, so that the tie bars 32d and 32c and the internal wiring 32b are used. The pad portion 32a of the metallized layer 32 extending from the opening 16A of the second layer 16, that is, the pad portion 32a for the input / output pin (not shown) exposed from the laminated body 92, (Not shown) is subjected to electrolytic nickel plating. afterwards,
As shown in FIG.
Then, the pins 50 are soldered, electrolytic nickel plating is performed in the same manner, and electrolytic gold plating is performed, so that the pad portion 32a of the metallized layer 32 can be used as a bonding pad. That is, bonding described later can be easily performed. Further, Ni and gold plating are applied to the seal ring 62 and the input / output pins 50. After these electrolytic plating processes, the internal wirings are made independent by shaving off the conductive layer 35 for plating.
The package body 10 shown in FIG.

Thereafter, the integrated circuit 20 is fixed to the package body 10, and the input / output terminals of the integrated circuit 20 and the bonding pads 30 are connected by bonding wires 40. Since the width of the pad portion 32a of the bonding pad 30 is formed to be 150 μm, the tip of the bonding wire 40 from the input / output terminal 20a of the integrated circuit 20 can be easily connected to the bonding pad 30. By this bonding, a signal from the integrated circuit 20 is transferred to the bonding pad 30 (metallization layer 32).
And can be taken out of the pin 50 via the internal wiring 32. Thereafter, the cap 60 is sealed to complete the package.

In this embodiment, only the width of the connection plating tie bar 32d is large and the width of the conductive plating tie bar 32c, which occupies most of the plating tie bar, is small, so that the floating capacitance of the entire plating tie bar can be reduced. For this reason, there is an advantage that noise from an unillustrated ground line or power supply line is not easily transmitted to the internal wiring side via the plating tie bar.

Here, the relationship between the width of the connection plating tie bar 32d and the incidence of connection failure between the plating conductive layer 35 and the plating tie bar 32d, that is, the coverage of the metal paste layer 82 described above with reference to FIG. The relationship between the width at the cut portion 82d and the incidence of connection failure between the cut portion 82d and the metal paste layer 85 will be described with reference to FIG. In FIG. 8, the horizontal axis indicates the width (μm) of the connection plating tie bar 32d and the width (μm) of the cut portion 82d of the metal paste layer, and the vertical axis indicates the connection failure occurrence rate (%). As is clear from FIG. 8, there is a correlation between the width of the tie bar 32d or the width of the cut portion 82d and the connection failure occurrence rate.

That is, when the width of the portion to be cut 82d is 180 μm or more, it is almost 0 (approximately 0.01%). In the case of a width of 60 μm (50 μm in width of the tie bar 32d), it is about 4%. Therefore, if the width of the connection plating tie bar 32d is set to 150 μm, that is, the width of the cut portion 82d is set to 180 μm, as described above with reference to FIG. The cut portion 82d of the metal paste layer can be reliably exposed. Then, since the connection between the plating tie bar 32d and the conductive layer for plating 35 described above with reference to FIG. 5C can be reliably established, the occurrence rate of connection failure is maintained at almost 0 (about 0.01%). Becomes possible. On the other hand, when the width of the connection plating tie bar 32d is less than 150 μm, that is, the width of the portion to be cut 82d is less than 180 μm, the cutting is performed along the cutting line C as described above with reference to FIG. At this time, the cut portion 82d is buried between the green sheet of the first layer and the green sheet of the second layer, so that the metal paste layer cannot be exposed on the side end surface, and the occurrence rate of disconnection failure gradually increases. To increase.

The calculation of the defect occurrence rate in the above case is as follows.
300 tie bars exposed from the package body side
In the package body, there is one plating failure in the package body due to poor connection between the conductive layer for plating and the tie bar.
In the case where it occurs even at a location, a method of determining a defect was employed.

A modification of the first embodiment will be described with reference to FIG. In the embodiment described above with reference to FIG. 6, the width of the metal paste layer 82c and the width of the metal paste layer 82d constituting the plating tie bar are changed stepwise. The width of the metal paste layer 82d is gradually changed, such as a trumpet-shaped thing spreading in a parabolic shape as shown in FIG. 9A, or a wedge-shaped thing spreading in a straight line as shown in FIG. 9B. It is also possible to go.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 10 shows the package body 1
10 is a plan view of FIG. In this figure, the second insulating layer
Note that only the second opening 116A is shown for convenience of illustration. On the first insulating layer 114, the internal wiring 132b extending to the vicinity of the side end 110A of the package body 110 and the side end 11 of the package body 110
Internal wiring 132b 'that does not extend to the vicinity of 0A is formed. Here, the plating tie bar connected to the internal wiring 132b 'that does not extend to the vicinity of the side end 110A includes a narrow conductive plating tie bar 132c and a thick connection plating tie bar 132d as in the first embodiment.
It consists of On the other hand, the internal wiring 132b extending to the vicinity of the side end 110A of the package body 110 includes:
The connection plating tie bar 132e having the same width is connected. In the second embodiment, the effect of noise is suppressed by forming a thin conductive plating tie bar 132c only on the plating tie bar having a large floating capacitance due to its long overall length.

In the above-described embodiment, an example is shown in which a conductive layer for plating is formed on the side surface of the package body by simultaneous firing. However, the present invention is not necessarily limited to this. After firing the laminate, a conductor may be baked (post-fired) on the side surface of the package body, or a conductive resin applied and cured may be used as a conductive layer for plating. It is also possible to use. Further, in the above-described embodiment, as the ceramic constituting the package body, a ceramic material containing alumina as a main component is used, but AlN, glass ceramic, SiC,
Various ceramic materials, such as mullite and glass ceramic, can be employed. The material of the metal paste layer may be appropriately selected according to the ceramic material, and for example, tungsten, molybdenum, copper, silver, or the like can be used.

In the above embodiment, the case where a bonding wire is used for connection between the integrated circuit chip and the bonding pad has been described. However, both may be connected by TAB connection. Further, a flip chip method (C4 technology) may be used. In this case, connection terminals (C4 pads and the like) are formed by connecting to internal wirings, and predetermined plating is performed according to the present invention.

The portions to be connected to the internal wiring and plated (required plating portions) include the connection terminals with the integrated circuit chip as described above, that is, the bonding pads and C4.
There are pads. In addition to the input / output pins described above, a BGA (Ball Grid Array) and an LG
Input / output terminals such as ball-shaped terminals and lands used in the form of A (Lead Grid Array) or the like, and lead-shaped terminals are included. Furthermore, a die attach portion for mounting an integrated circuit, a metallized portion for a seal ring for mounting the above-described seal ring, or a surface metallized portion for mounting a seal ring, a chip resistor, a chip capacitor, and the like are given. Can be

[0039]

As described above, according to the electronic component package body of the present invention, the width of the portion where the plating tie bar is connected to the internal wiring is formed narrow (narrow). For this reason, the floating capacitance of the plating tie bar can be reduced, and the influence of noise or the like can be reduced. On the other hand, since the portion exposed to the side surface of the package body is formed wide (thick), it is surely exposed to the side surface and is connected to the conductive layer for plating formed on the side surface. Plating can be reliably applied to the plated portion.

According to the method of manufacturing a package body for an electronic component of the present invention, in the step of applying the metal paste layer, the width of the cut portion of the metal paste layer that becomes a plating tie bar by firing is adjusted to the internal wiring. Since the coating is applied wider than the connection portion, the cut portion can be reliably exposed when the first and second green sheet laminates are cut. Therefore, when a metal paste layer serving as a plating conductive layer is applied to the side surfaces of the first and second green sheet laminates, the plurality of metal paste layers serving as the plating tie bars become the plating conductive layers. A metal paste layer can be connected. Therefore, after baking, a current is applied to the internal wiring from the conductive layer for plating via the plurality of plating tie bars, and the plating required for the package body connected to this can be reliably plated.

[Brief description of the drawings]

FIG. 1 is a partially cutaway side view of a package body according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing an assembly process of the package body shown in FIG.

FIG. 3 is a longitudinal sectional view showing a state where the green sheets shown in FIG. 2 are stacked.

FIG. 4 is a view on arrow D of the first layer green sheet shown in FIG. 2;

FIG. 5A is a plan view of a laminate cut from a laminated sheet, and FIG. 5B is a plan view of a laminate in which a metal paste layer is applied to side surfaces; FIG. 5C is a plan view of the laminated body after firing.

FIG. 6 is an enlarged view of a circle E part in FIG. 4;

7 (A) is a view as viewed in the direction of arrow F in FIG. 5 (A), and FIG. 7 (B) is a view as viewed in the direction of arrow G in FIG. 5 (B).

FIG. 8 is a graph showing the relationship between the width of a plating tie bar and the incidence of disconnection failure.

FIG. 9 is a plan view showing a modification of the first embodiment.

FIG. 10 is a plan view of a package body according to a second embodiment of the present invention.

FIG. 11 is a plan view showing a green sheet according to the related art.

12A and 12B are plan views of a laminate according to the related art, where FIG. 12A shows a state before firing and FIG. 12B shows a state after firing.

FIG. 13 is an enlarged view of a circle A part of FIG. 11;

FIG. 14 is an enlarged cross-sectional view taken along line BB of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Package body 14 1st layer 16 2nd layer 20 Integrated circuit 30 Bonding pad 32 Metallization layer 32a Pad part 32b Internal wiring 32c Plating tie-bar for conduction 32d Plating tie-bar for connection

Claims (5)

(57) [Claims] An electronic component package body for mounting an electronic component, comprising: a plurality of laminated insulating layers; and an insulating layer and an insulating layer for plating each part on the package body. A plating tie bar disposed on the side of the package body, and a plating conductive layer connected to the plating tie bar exposed on the side surface of the package body and exposed on the side surface; tie bars, the width of the cutting portion, an electronic component package body which is wider than the portion located inside said package body from the object to be cut portion <br/> vicinity. 2. An electronic component package body for mounting an electronic component, comprising: a plurality of laminated insulating layers; and a metallized layer disposed between the insulating layers. A metallizing layer including a wiring and a plating tie bar leading out from the internal wiring to a side surface of the package body; and a plating conductive layer disposed on the side surface of the package body and connected to the plating tie bar exposed to the side surface. The package body for an electronic component, wherein in the plating tie bar of the metallized layer, a width of a cut portion of the package body is formed wider than a width of a portion connected to the internal wiring. 3. A method of manufacturing an electronic component package body for mounting an electronic component, comprising: forming, on a first green sheet, a plurality of metal paste layers having portions that become internal wiring and plating tie bars by firing. Forming a coating tie bar, wherein the width of the cut portion of the portion serving as the plating tie bar is wider than the width of the connection portion with the portion serving as the internal wiring; A step of laminating and pressing a second green sheet; cutting the laminate of the first and second green sheets at a predetermined position to form a portion to be the plating tie bar of the metal paste layer; Forming a metal paste layer to be a conductive layer for plating on the side surface of the cut laminate, and contacting the portion to be the plating tie bar through the exposed cut portion. Causing the laminate to be fired; flowing current from the conductive layer for plating formed by firing to the internal wiring via a plating tie bar, and plating each required plating portion of the package body connected thereto. And a method of manufacturing a package body for an electronic component. 4. The method for manufacturing a package body for an electronic component according to claim 3, wherein a width of said portion to be cut at a portion to be said plating tie bar is formed to be 180 μm or more. 5. The width of the portion to be cut is 180 μm or more.
The electronic component according to claim 1, wherein the electronic component is formed to be
Package body.