JP3235309B2 - Holder for chip parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holder for holding a chip component such as a chip-shaped electronic component or a body serving as a main body of the electronic component.
The present invention relates to a holder for holding a plurality of chip components in a state of being distributed in a plane.

[0002]

2. Description of the Related Art FIG. 6 shows a typical example of a chip-shaped electronic component of interest to the present invention. The electronic component 1 shown here includes a body 2 constituting the main body, and electrodes 3 and 4 serving as terminals are formed at both ends of the body 2. The electrodes 3 and 4 are usually formed by applying a paste containing a metal powder to each end of the element body 2 and then baking the paste.

FIG. 7 shows a process of applying a paste to one end of the element body 2. The plurality of element bodies 2
Each one end is held by the holder 5 in a state of being projected. The holder 5 includes a lattice-shaped core member 6 and an elastic member 7 made of, for example, rubber formed so as to cover the core member 6. The elastic member 7 has a holding hole 8 for receiving the element bodies 2 one by one. Are provided so as to penetrate the elastic body 7. Therefore, the element body 2 inserted into the holding hole 8 is elastically held.

On the other hand, a paste 9 for forming the electrodes 3 and 4
Is applied on the surface 11 of the application board 10 with a constant film thickness.
The holder 5 is approached toward the application board 10, whereby one end of the element body 2 is immersed in the paste 9. Then, when the element body 2 is pulled up from the coating board 10,
A paste 9 is applied to one end of each of the element bodies 2.

When the paste 9 is to be further applied to the other end of the body 2, the paste 9
After the is dried, the element body 2 held by the holder 5 is transferred to the second holder 5a as shown in FIG. That is, the holding hole 8 of the holder 5 a is aligned with the holding hole 8 of the holder 5, and the element body 2 is pushed by the pusher pin 12.
Is pressed toward the holder 5a. Thus, the element body 2 is held by the holder 5a.
Thereafter, the paste 9 is applied also to the other end of each of the element bodies 2 by a process similar to the process shown in FIG.

[0006]

Referring to FIG. 6, when the electronic component 1 is particularly small, a comparison is made between the dimensions 13 of the electrodes 3 and 4 extending from the end face of the element body 2 to the side face. High precision is required. The dimension 13 originally depends on the thickness of the paste 9 shown in FIG. 7, but the heights of the plurality of element bodies 2 held by the holder 5 (or 5a) are different from each other. In some cases, the size 13 is smaller than the target value.

When the electrodes 3 and 4 are to be formed at both ends of the element body 2, a transfer step as shown in FIG. 8 is necessary. Will always be rubbed by the inner peripheral surface of the For this reason, in the obtained electronic component 1, a defect may occur in the electrode 3 or 4. Further, the inner peripheral surface of the holding hole 8 may be contaminated with the paste 9, and the paste 9 adhered to the inner peripheral surface of the holding hole 8 may adhere to an undesired portion of the element body 2.

The dimensions of the holding holes 8 provided in the holders 5 and 5a must be appropriately selected in relation to the dimensions of the element body 2. If the dimensions of the element body 2 are different, it is necessary to use the holders 5 and 5a provided with the holding holes 8 having dimensions adapted to the dimensions. Therefore, the holders 5 and 5a
You have to prepare some kind of
As a result, the manufacturing cost of the electronic component 1 increases, and the labor burden for properly using the holders 5 and 5a increases.

Therefore, an object of the present invention is to provide a chip component holder which can solve the above-mentioned problems.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned technical problem, a chip component holder according to the present invention first has a fixed position in which main surfaces face each other at a predetermined interval. There are two outer plates arranged in a relationship and each having a plurality of penetrating portions each penetrating a plurality of chip components. With the middle plate sandwiched between these two outer plates,
It is arranged to be able to reciprocate relative to the outer plate in a direction parallel to the main surface of the outer plate . The center plate is located at a position corresponding to the plurality of penetrations of the outer plate,
Multiple penetrations to penetrate multiple chip components respectively
Having a part . And each of the central plate penetrations
At least a portion of the inner peripheral edge of which pressing piece is formed elastically coming into contact with the chip, among the reciprocating one
Relative movement in the direction of
The inner peripheral edge and the pressing piece of the center plate sandwich the chip component
Hold.

[0011]

According to the chip component holder of the present invention,
With the chip component penetrating through each of the through holes of the outer plate, the chip component can be clamped or released by relative movement between the outer plate and the center plate. Therefore, when the chip component is to be moved in the penetrating portion, it may be set in the released state. In the released state, if a plurality of chip components are brought into contact with a flat surface, the heights of all the chip components can be made uniform.

[0012]

Therefore, according to the present invention, when the chip component is to be moved in the penetrating portion, the chip component can be set in the released state. Rubbing can be prevented. Therefore, if the holder according to the present invention is used in the step of applying the paste to the end of the chip component, it is possible to prevent the once applied paste from being damaged.

Further, according to the present invention, it is easy to make the heights of a plurality of chip components held by the holder uniform. Variations in the application width of the paste can be made extremely small.

Further, according to the holder of the present invention, when the chip component is clamped, the pressing piece that elastically contacts the chip component acts, so that the chip component can be securely held. In addition to this, even if there are dimensional variations among a plurality of chip components, all the chip components can be held with an appropriate holding force while absorbing such variations.

[0015]

FIG. 1 is a perspective view showing the appearance of a chip component holder 14 according to an embodiment of the present invention.

The holder 14 has two outer plates 15 and 16 and a center plate 17 arranged between the outer plates 15 and 16. The outer plates 15 and 16 and the center plate 17 are made of a plate material made of, for example, stainless steel having a thickness of 0.15 mm. The outer plates 15 and 16 are fixed to each other with a predetermined gap formed between them via a spacer 18.

FIGS. 2A, 2B and 2C are enlarged plan views showing a part of the outer plate 15, the center plate 17 and the outer plate 16, respectively.

Each of the outer plates 15 and 16 has a plurality of penetrating portions 22 and 23 for penetrating the element body 2 (see FIG. 6) as a plurality of chip components, respectively.
Is provided. Each of these penetrations 22 and each of penetrations 23 are aligned with each other. Each of the through portions 22 and 23 has, for example, an elliptical shape. In this embodiment, the through portions 22 and 23 are each provided by a through hole, but may be provided by, for example, a notch as long as the element body 2 can be penetrated. The penetrating portions 22 and 23 define a dimension larger than the cross-sectional dimension of the element body 2.

On the other hand, the center plate 17 is disposed between the outer plates 15 and 16 so as to be able to reciprocate relative to the outer plates 15 and 16 in the main surface direction.
The center plate 17 has a wall portion 24 for narrowing the inner diameters of the through portions 22 and 23 by relative movement in one direction. In this embodiment, the center plate 17
Has a plurality of through holes 25 corresponding to the plurality of through portions 22 and 23, respectively, and these through holes 25 have an elliptical shape similar to the through portions 22 and 23.

In the present embodiment, the above-mentioned wall portion 24 is provided by a pair of pressing pieces 19 and 20 formed along one side edge of each through hole 25. These pressing pieces 19 and 20 act so as to elastically contact the element body 2.

It is important that the center plate 17 has a wall 24 at least partially provided by the pressing pieces 19 and 20, and the form of the through hole 25 is arbitrary. For example, several through holes 25 adjacent to each other may be formed as one through hole, or a cutout may be provided instead of the through hole 25.

Outer plates 15 and 1 as described above
6 and the through-holes 22 and 23 provided in the center plate 17, the through-hole 25 and the pressing pieces 19 and 20
Can be easily formed by, for example, etching.

The holder 14 described above is used, for example, as shown in FIG. FIG. 3 shows a step of applying a conductive paste 30 to form the electrodes 3 and 4 on the ends of the element body 2 in order to obtain the electronic component 1 shown in FIG. FIG. 4 shows the outer plates 15 and 16 and the center plate 17 shown in FIG. Here, FIG.
FIG. 4B shows a state in which the body 2 is clamped, and FIG. 4B shows a state in which the body 2 is released.

As shown in FIG. 3, the holder 14 is attached to a pressing member 27 by a chuck member 28. The chuck member 28 preferably makes the holder 14 detachable. The pressing member 27 has, for example, a thickness of 3
An elastic body 29 made of rubber or the like of about mm is provided. The elastic body 29 is located so as to face the holder 14.

On the other hand, a paste 30 to be the electrodes 3 and 4 shown in FIG. 6 is prepared in a state of being applied on the surface 32 of the application board 31 with a constant film thickness.

A method for obtaining the electronic component 1 shown in FIG. 6 in such a configuration will be described below.

First, the outer plate 1 provided in the holder 14
The plurality of element bodies 2 are respectively penetrated through the respective penetrating portions 22 and 23 of 5 and 16, and in this state, the center plate 17 is moved so as to reduce the inner diameter of the penetrating portions 22 and 23. . Thereby, as shown in FIG. 3A and FIG. 4A, each element body 2
And 23 are held by one side edge and the wall 24, and are held by the holder 14.
Here, pressing pieces 19 and 20 that provide a part of the wall 24
Are in elastic contact with the element body 2 as is well shown in FIG.

Next, the holder 14 holding the plurality of element bodies 2 is attached to the pressing member 27 by the chuck member 28. In this state, the pressing member 27 is lowered, and the holder 14 approaches the application board 31. Thereby, one end of each of the plurality of element bodies 2 is immersed in the paste 30.

Next, as shown in FIG.
In order to increase the inner diameter of 2 and 23,
Is moved. Thus, the holder 14 releases the holding of the plurality of element bodies 2. This state is also shown in FIG.

Next, the pressing member 27 is further lowered, and the elastic body 29 presses the other ends of the plurality of element bodies 2. As a result, one end of each element body 2 located in the paste 30 is forced to be in a state in which it comes into contact with the surface 32 of the application board 31.

Next, the center plate 17 is moved so as to narrow the inner diameters of the through portions 22 and 23 again, whereby the element body 2 is held by the holder 14 as shown in FIG. It is said. In that state, the pressing member 2
7 is raised, so that the holder 14
Separated from zero. As a result, the element body 2 having the paste 30 applied to one end thereof is pulled up from the application board 31. Thereafter, the paste 30 applied to the element body 2 is dried.

Next, the paste 30 is applied to the other end of the body 2 as well.
The holder 14 is attached to the pressing member 27 via the chuck member 28 in a state where the holder 14 is turned upside down. Hereinafter, substantially in the same manner as in the case of applying the paste 30 to the one end described above, a step of dipping the body 2 into the paste 30, a step of releasing the holding of the body 2 by the holder 14,
The steps of forcing the body 2 to abut the surface 32 of the coating board 31, the step of holding the body 2 again by the holder 14, and the step of lifting the body 2 from the coating board 31 are repeated.

In this manner, the paste 30 is applied to both ends of the body 2 and then the paste 30 is baked, so that the electrodes 3 and 4 are applied to both ends of the body 2 as shown in FIG. Is obtained.

In the manufacture of such an electronic component 1, the problems of the prior art described above are not encountered.

FIG. 5 is a plan view showing a part of a chip component holder 14a according to another embodiment of the present invention. FIG.
In FIG. 5, the center plate 17a is shown by a solid line, and the through-holes 22a and 23a of the outer plates located on both sides thereof are shown.
Only the phantom lines are shown.

In this embodiment, the penetration portions 22a and 23
a and the through-hole 25a provided in the center plate 17a
Has a shape based on a square. The wall portion 24a for narrowing the inner diameters of the through portions 22a and 23a by moving the central plate 17a in one direction is provided by a pair of pressing pieces 19a and 20a projecting in an oblique direction. This embodiment has the significance of clarifying that the shape of each of the through portion, the through hole, and the pressing piece can be arbitrarily changed.

Although not particularly mentioned in the above description, the center plate 17 or 17a may be reciprocated by a driving source such as a motor, a cylinder or a solenoid, or may be reciprocated manually. Also, the outer plates 15 and 16 and the central plate 17 or 17
a may be relative to each other. In contrast to the above-described embodiment, even if the center plate 17 or 17a is fixed and the outer plates 15 and 16 are movable, the outer plates 15 and 16 are movable. 16 and the central plate 17 or 17a may both be movable.

In the above-described embodiment, two pressing pieces 19 and 20 or 19a and 20a are provided in a pair, but only one pressing piece may be provided.

The holder according to the present invention can be used not only when the paste 30 for the electrodes 3 and 4 is applied to the element body 2 but also when the paste for other purposes is applied. Further, the present invention can be applied to the case where the characteristics of a plurality of chip-shaped electronic components are measured at once.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a chip component holder 14 according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a part of each of outer plates 15 and 16 and a center plate 17 provided in a holder 14 shown in FIG.

1. FIG. 3 is an illustrative sectional view showing a step for obtaining the electronic component 1 shown in FIG. 6 performed using the holder 14 shown in FIG.

FIG. 4 is an enlarged plan view showing a part of a holder 14 shown in FIG. 1; FIG.
Indicates a state in which the body 2 is released.

FIG. 5 is an enlarged plan view showing a part of a holder 14a according to another embodiment of the present invention.

FIG. 6 is a perspective view showing a typical example of an electronic component 1 of interest to the present invention.

FIG. 7 is an illustrative sectional view showing a step of applying paste 9 to element body 2 included in a conventional method of manufacturing an electronic component.

FIG. 8 is an illustrative sectional view showing a step of transferring an element body 2 included in a conventional method of manufacturing an electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Element body 3, 4 Electrode 14, 14a Holder 15, 16 Outer plate 17, 17a Central plate 19, 19a, 20, 20a Pressing piece 22, 22, a, 23, 23a Penetration part 24, 24a Wall part 25, 25a Through hole

Claims (1)

(57) [Claims] 1. A main surfaces are arranged with a fixed positional relationship to each other in <br/> state opposed via a predetermined gap, and a plurality of chips plurality of penetrations pass through respective parts respectively a, and two outer plates, said at two state sandwiched between the outer plates, relatively reciprocally parallel <br/> direction to the principal surface of the outer plate to the outer plate Movably arranged and the plurality
The plurality of chip parts at positions corresponding to the
A central plate having a plurality of penetrating portions each penetrating through , at least a part of the inner peripheral edge of each of the penetrating portions of the central plate is provided by a pressing piece that elastically contacts the chip component. And one of the reciprocating movements
Relative movement in the direction of the outer plate
The inner peripheral edge of the penetrating portion and the pressing piece of the center plate are in front.
A chip component holder that holds the chip component.