JP3202415B2 - Antistatic agent and resin composition - Google Patents
Antistatic agent and resin compositionInfo
- Publication number
- JP3202415B2 JP3202415B2 JP14264693A JP14264693A JP3202415B2 JP 3202415 B2 JP3202415 B2 JP 3202415B2 JP 14264693 A JP14264693 A JP 14264693A JP 14264693 A JP14264693 A JP 14264693A JP 3202415 B2 JP3202415 B2 JP 3202415B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- acid
- molecular weight
- polyetheresteramide
- number average
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002216 antistatic agent Substances 0.000 title claims description 18
- 239000011342 resin composition Substances 0.000 title claims description 15
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 30
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 24
- 229920001577 copolymer Polymers 0.000 claims description 15
- 239000004952 Polyamide Substances 0.000 claims description 12
- 229920002647 polyamide Polymers 0.000 claims description 12
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 11
- 125000000101 thioether group Chemical group 0.000 claims description 11
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 10
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 3
- 150000002009 diols Chemical class 0.000 claims description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229940126062 Compound A Drugs 0.000 claims 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 229920005553 polystyrene-acrylate Polymers 0.000 claims 1
- SKIVFJLNDNKQPD-UHFFFAOYSA-N sulfacetamide Chemical compound CC(=O)NS(=O)(=O)C1=CC=C(N)C=C1 SKIVFJLNDNKQPD-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 15
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- -1 ω-aminoenanthic acid Chemical compound 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 10
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 238000004898 kneading Methods 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000004594 Masterbatch (MB) Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 5
- 239000001361 adipic acid Substances 0.000 description 5
- 235000011037 adipic acid Nutrition 0.000 description 5
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 4
- ODJQKYXPKWQWNK-UHFFFAOYSA-N 3,3'-Thiobispropanoic acid Chemical compound OC(=O)CCSCCC(O)=O ODJQKYXPKWQWNK-UHFFFAOYSA-N 0.000 description 4
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000003490 Thiodipropionic acid Substances 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 235000019303 thiodipropionic acid Nutrition 0.000 description 4
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 150000003951 lactams Chemical group 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- LYTNHSCLZRMKON-UHFFFAOYSA-L oxygen(2-);zirconium(4+);diacetate Chemical compound [O-2].[Zr+4].CC([O-])=O.CC([O-])=O LYTNHSCLZRMKON-UHFFFAOYSA-L 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- SGBXIDHAUUXLOV-UHFFFAOYSA-N 1-sulfocyclohexa-3,5-diene-1,3-dicarboxylic acid Chemical class OC(=O)C1=CC=CC(S(O)(=O)=O)(C(O)=O)C1 SGBXIDHAUUXLOV-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- LHLUQDDQLCJCFU-UHFFFAOYSA-L disodium;1-sulfocyclohexa-3,5-diene-1,3-dicarboxylate Chemical compound [Na+].[Na+].OS(=O)(=O)C1(C([O-])=O)CC(C([O-])=O)=CC=C1 LHLUQDDQLCJCFU-UHFFFAOYSA-L 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- GYPCWHHQAVLMKO-XXKQIVDLSA-N (7s,9s)-7-[(2r,4s,5s,6s)-4-amino-5-hydroxy-6-methyloxan-2-yl]oxy-6,9,11-trihydroxy-9-[(e)-n-[(1-hydroxy-2,2,6,6-tetramethylpiperidin-4-ylidene)amino]-c-methylcarbonimidoyl]-4-methoxy-8,10-dihydro-7h-tetracene-5,12-dione;hydrochloride Chemical group Cl.O([C@H]1C[C@@](O)(CC=2C(O)=C3C(=O)C=4C=CC=C(C=4C(=O)C3=C(O)C=21)OC)C(\C)=N\N=C1CC(C)(C)N(O)C(C)(C)C1)[C@H]1C[C@H](N)[C@H](O)[C@H](C)O1 GYPCWHHQAVLMKO-XXKQIVDLSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- UFFRSDWQMJYQNE-UHFFFAOYSA-N 6-azaniumylhexylazanium;hexanedioate Chemical compound [NH3+]CCCCCC[NH3+].[O-]C(=O)CCCCC([O-])=O UFFRSDWQMJYQNE-UHFFFAOYSA-N 0.000 description 1
- UQXNEWQGGVUVQA-UHFFFAOYSA-N 8-aminooctanoic acid Chemical compound NCCCCCCCC(O)=O UQXNEWQGGVUVQA-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 159000000021 acetate salts Chemical class 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QFNNDGVVMCZKEY-UHFFFAOYSA-N azacyclododecan-2-one Chemical compound O=C1CCCCCCCCCCN1 QFNNDGVVMCZKEY-UHFFFAOYSA-N 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- BVFSYZFXJYAPQJ-UHFFFAOYSA-N butyl(oxo)tin Chemical compound CCCC[Sn]=O BVFSYZFXJYAPQJ-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- VXTYCJJHHMLIBM-UHFFFAOYSA-N carboxysulfanylformic acid Chemical compound OC(=O)SC(O)=O VXTYCJJHHMLIBM-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- QAWTYRYXDYHQNU-UHFFFAOYSA-N diazathiane Chemical class NSN QAWTYRYXDYHQNU-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 229910001623 magnesium bromide Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は耐熱性と永久帯電防止性
に優れ、さらに熱可塑性樹脂との相溶性に優れたポリエ
ーテルエステルアミドおよびこのポリエーテルエステル
アミドを使用した樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyetheresteramide having excellent heat resistance and permanent antistatic properties, and further having excellent compatibility with a thermoplastic resin, and a resin composition using the polyetheresteramide. is there.
【0002】[0002]
【従来の技術】従来、プラスチック用帯電防止剤として
種々のものが提案されている。その内ポリエーテルエス
テルアミドは一部の熱可塑性樹脂用帯電防止剤として優
れた帯電防止性を付与することが知られているが、
(1)ポリエーテル成分にポリオキシアルキレングリコ
ール例えば、ポリエチレングリコール等を使用している
ため耐熱性が低く、高温での成形に問題あった。(2)
ポリエーテルエステルアミドと他の熱可塑性樹脂との相
溶性が悪いため、層状剥離が起きたり、衝撃強度が劣っ
たりして、望ましい機械的性質を有する樹脂組成物を得
ることができないという問題があった。(2)の問題を
解決するため、ポリエーテルエステルアミドにカルボキ
シル基を有する変性ビニル系重合体を相溶化剤として使
用する方法(特公平4−72855号)や、ヒドロキシ
ル基を有するビニル単量体を共重合成分とするゴム変性
スチレン系熱可塑性樹脂を相溶化剤として使用する方法
(特開平2−70739号)が知られている。これらの
方法によって相溶性の問題は改良されているものの、多
量の相溶化剤の添加が必要であり他の熱可塑性樹脂2種
だけを混練したものに比べ帯電防止性が低下するという
欠点があった。また特開平1−14417号において、
特定分子量のポリオキシアルキレングリコール用いて得
られたポリエーテルエステルアミドおよび樹脂組成物は
透明でかつ永久帯電性に優れていることが開示されてい
るが、(1)の耐熱性の問題は依然解決されていない。2. Description of the Related Art Various types of antistatic agents for plastics have been proposed. Among them, polyetheresteramide is known to impart excellent antistatic properties as an antistatic agent for some thermoplastic resins,
(1) Since polyoxyalkylene glycol such as polyethylene glycol is used for the polyether component, heat resistance is low and there is a problem in molding at high temperature. (2)
Poor compatibility between polyetheresteramide and other thermoplastic resins causes problems such as delamination or poor impact strength, making it impossible to obtain a resin composition having desirable mechanical properties. Was. In order to solve the problem (2), a method using a modified vinyl polymer having a carboxyl group in polyetheresteramide as a compatibilizer (Japanese Patent Publication No. 4-72855), a vinyl monomer having a hydroxyl group (Japanese Patent Laid-Open No. 2-70739) is known which uses a rubber-modified styrene-based thermoplastic resin having a copolymer component as a compatibilizer. Although the compatibility problem has been improved by these methods, a large amount of a compatibilizer must be added and the antistatic property is lower than that obtained by kneading only two other thermoplastic resins. Was. Also, in JP-A-1-144417,
It is disclosed that the polyetheresteramide and the resin composition obtained by using a polyoxyalkylene glycol having a specific molecular weight are transparent and have excellent permanent charging properties, but the problem of heat resistance (1) is still solved. It has not been.
【0003】[0003]
【発明が解決しようとする課題】現在、耐熱性に優れ、
かつポリスチレン、ポリメタクリル酸メチル、スチレン
/アクリロニトリル共重合体(SAN樹脂)、アクリロ
ニトリル/ブタジエン/スチレン共重合体(ABS樹
脂)、メタクリル酸メチル/ブタジエン/スチレン共重
合体(MBS樹脂)およびスチレン/メタクリル酸メチ
ル/アクリロニトリル共重合体等の熱可塑性樹脂との相
溶性の良い、ポリエーテルエステルアミドが望まれてい
る。At present, the heat resistance is excellent.
And polystyrene, polymethyl methacrylate, styrene / acrylonitrile copolymer (SAN resin), acrylonitrile / butadiene / styrene copolymer (ABS resin), methyl methacrylate / butadiene / styrene copolymer (MBS resin) and styrene / methacrylic A polyetheresteramide having good compatibility with a thermoplastic resin such as a methyl acid / acrylonitrile copolymer is desired.
【0004】[0004]
【課題を解決するための手段】本発明者らは、上記問題
を解決すべく鋭意検討した結果、特定の基を導入したポ
リエーテルエステルアミドが、従来のポリエーテルエス
テルアミドに比べ耐熱性および帯電防止性に優れるこ
と;またこのポリエーテルエステルアミドと熱可塑性樹
脂からなる樹脂組成物が耐熱性、永久帯電防止性および
機械的強度に優れることを見出し本発明に至った。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above problems, and as a result, polyetheresteramide having a specific group introduced therein has higher heat resistance and chargeability than conventional polyetheresteramide. The present invention has been found that the resin composition comprising the polyetheresteramide and the thermoplastic resin has excellent heat resistance, permanent antistatic properties and mechanical strength.
【0005】すなわち本発明は、両末端にカルボキシル
基を有する数平均分子量500〜5,000のポリアミ
ド成分(a1)と数平均分子量1,500〜3,000
のポリエ−テルジオ−ル成分(a2)から誘導され、成
分(a1) にチオエ−テル基を含有するポリエーテル
エステルアミド(A)からなる帯電防止剤;両末端にカ
ルボキシル基を有する数平均分子量500〜5,000
のポリアミド成分(a1)と数平均分子量1,500〜
3,000のポリエ−テルジオ−ル成分(a2)から誘
導され、成分(a2)がチオエ−テル基含有低分子ジオ
−ルあるいはメルカプタン化合物のアルキレンオキシド
付加物であるポリエーテルエステルアミド(A)からな
る帯電防止剤;および該停電防止剤と熱可塑性樹脂
(B)からなる樹脂組成物である。That is, the present invention relates to a polyamide component (a1) having carboxyl groups at both ends and having a number average molecular weight of 500 to 5,000 and a number average molecular weight of 1,500 to 3,000.
(A2) derived from the polyetherdiol component (a2) A thioether - antistatic agent consisting of polyether ester amide (A) containing ether groups; mosquitoes at both ends
Number average molecular weight having a ruboxyl group of 500 to 5,000
With the polyamide component (a1) having a number average molecular weight of 1,500 to
Induced from 3,000 polyetherdiol components (a2)
And the component (a2) is a thioether group-containing low molecular
-Alkylene oxides of methyl or mercaptan compounds
From the adduct polyetheresteramide (A).
And a resin composition comprising the antistatic agent and the thermoplastic resin (B).
【0006】本発明における両末端にカルボキシル基を
有するポリアミド成分(a1)としては、(1)ラクタ
ム開環重合体、(2)アミノカルボン酸の重縮合体もし
くは(3)ジカルボン酸とジアミンの重縮合体等の公知
のポリアミドに両末端にカルボキシル基を含有させたも
のが挙げられる。(1)のラクタムとしては、カプロラ
クタム、エナントラクタム、ラウロラクタム、ウンデカ
ノラクタム等が挙げられる。(2)のアミノカルボン酸
としては、ω−アミノカプロン酸、ω−アミノエナント
酸、ω−アミノカプリル酸、ω−アミノペルゴン酸、ω
−アミノカプリン酸、11−アミノウンデカン酸、12
−アミノドデカン酸等が挙げられる。(3)のジカルボ
ン酸としては、チオジ酢酸、チオジプロピオン酸、アジ
ピン酸、アゼライン酸、セバシン酸、ウンデカンジ酸、
ドデカンジ酸、イソフタル等酸が挙げられ、またジアミ
ンとしては、ヘキサメチレンジアミン、ヘプタメチレン
ジアミン、オクタメチレンジアミン、デカメチレンジア
ミン、チオジエチルアミン、ジアミノジフェニルチオエ
−テル等が挙げられる。上記アミド形成性モノマーとし
て例示したものは二種以上使用してもよい。これらの内
好ましいものは、カプロラクタム、12−アミノドデカ
ン酸、およびアジピン酸−ヘキサメチレンジアミンであ
り、特に好ましいものは、カプロラクタムである。The polyamide component (a1) having carboxyl groups at both terminals in the present invention includes (1) a lactam ring-opening polymer, (2) a polycondensate of an aminocarboxylic acid or (3) a polycondensate of a dicarboxylic acid and a diamine. Known polyamides such as condensates include carboxyl groups at both ends. Examples of the lactam (1) include caprolactam, enantholactam, laurolactam, undecanolactam and the like. As the aminocarboxylic acid (2), ω-aminocaproic acid, ω-aminoenanthic acid, ω-aminocaprylic acid, ω-aminopergonic acid, ω
-Aminocapric acid, 11-aminoundecanoic acid, 12
-Aminododecanoic acid and the like. As the dicarboxylic acid (3), thiodiacetic acid, thiodipropionic acid, adipic acid, azelaic acid, sebacic acid, undecandioic acid,
Examples of the acid include dodecane diacid, isophthalic acid and the like, and examples of the diamine include hexamethylene diamine, heptamethylene diamine, octamethylene diamine, decamethylene diamine, thiodiethylamine, diaminodiphenylthioether and the like. Two or more of those exemplified as the amide-forming monomers may be used. Preferred of these are caprolactam, 12-aminododecanoic acid, and adipic acid-hexamethylenediamine, and particularly preferred is caprolactam.
【0007】成分(a1)は、炭素数4〜20のジカル
ボン酸成分を分子量調整剤として使用し、これの存在下
に上記アミド形成性モノマーを常法により開環重合ある
いは重縮合させることによって得られる。炭素数4〜2
0のジカルボン酸としては、チオジ酢酸、チオジプロピ
オン酸、コハク酸、グルタル酸、アジピン酸、ピメリン
酸、スベリン酸、アゼライン酸、セバシン酸、ウンデカ
ンジ酸、ドデカンジ酸等の脂肪族ジカルボン酸や、テレ
フタル酸、イソフタル酸、フタル酸、ナフタレンジカル
ボン酸等の芳香族ジカルボン酸や、1,4−シクロヘキ
サンジカルボン酸、ジシクロヘキシル−4,4−ジカル
ボン酸等の脂肪族ジカルボン酸および3−スルホイソフ
タル酸ナトリウム、3−スルホイソフタル酸カリウム等
の3−スルホイソフタル酸アルカリ金属塩が挙げられ、
これらのうち好ましいものは脂肪族ジカルボン酸、芳香
族ジカルボン酸および3−スルホイソフタル酸アルカリ
金属塩であり、特に好ましいものはチオジ酢酸、チオジ
プロピオン酸、アジピン酸、セバシン酸、テレフタル
酸、イソフタル酸および3−スルホイソフタル酸ナトリ
ウムである。The component (a1) is obtained by subjecting the amide-forming monomer to ring-opening polymerization or polycondensation of the amide-forming monomer in the presence of a dicarboxylic acid component having 4 to 20 carbon atoms as a molecular weight modifier. Can be Carbon number 4 ~ 2
Examples of the dicarboxylic acid 0 include aliphatic dicarboxylic acids such as thiodiacetic acid, thiodipropionic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecandioic acid, and dodecanediacid, and terephthalic acid. Aromatic dicarboxylic acids such as acid, isophthalic acid, phthalic acid, and naphthalenedicarboxylic acid; aliphatic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid and dicyclohexyl-4,4-dicarboxylic acid; and sodium 3-sulfoisophthalate. Alkali metal salts of 3-sulfoisophthalic acid such as -potassium sulfoisophthalate;
Of these, preferred are aliphatic dicarboxylic acids, aromatic dicarboxylic acids and alkali metal salts of 3-sulfoisophthalic acid, and particularly preferred are thiodiacetic acid, thiodipropionic acid, adipic acid, sebacic acid, terephthalic acid, and isophthalic acid. And sodium 3-sulfoisophthalate.
【0008】成分(a1)の数平均分子量は、500〜
5,000、好ましくは500〜3,000である。5
00未満ではポリエーテルエステルアミド自体の耐熱性
が低下し、5,000を超えると反応性が低下するため
ポリエーテルエステルアミド製造時に多大な時間を要す
る。The number average molecular weight of the component (a1) is from 500 to
It is 5,000, preferably 500-3,000. 5
If it is less than 00, the heat resistance of the polyetheresteramide itself decreases, and if it exceeds 5,000, the reactivity decreases, so that it takes a lot of time to produce the polyetheresteramide.
【0009】成分(a1)中にチオエ−テル基を導入す
るには、ポリアミド製造時に分子量調節剤を含めて酸成
分としてチオジカルボン酸を用いるかまたはアミン成分
にジアミノスルフィド化合物を用いることによって達成
される。このようなチオジカルボン酸としてはチオジ酢
酸およびチオジプロピオン酸が挙げられる。ジアミノス
ルフィド化合物としてはチオジエチルアミンおよびジア
ミノジフェニルチオエ−テルが挙げられる。The introduction of a thioether group into the component (a1) can be achieved by using a thiodicarboxylic acid as an acid component including a molecular weight regulator during the production of a polyamide, or using a diaminosulfide compound as an amine component. You. Such thiodicarboxylic acids include thiodiacetic acid and thiodipropionic acid. Diaminosulfide compounds include thiodiethylamine and diaminodiphenylthioether.
【0010】成分(a2)としては、アルコ−ル、フェ
ノ−ル類およびカルボン酸のアルキレンオキシド付加物
が挙げられる。アルコ−ルとしては、エチレングリコ−
ル、プロピレングリコ−ル、ブタンジオ−ル、チオジエ
チレングリコ−ル、シクロヘキサンジオ−ル、シクロヘ
キサンジメタノ−ル、キシリレングリコ−ルなどの脂肪
族、脂環式または芳香族基含有グリコ−ルが挙げられ
る。フェノ−ル類としては、ハイドロキノン、ビスフェ
ノ−ルA、ビスフェノ−ルF、ビスフェノ−ルS、ジヒ
ドロキシジフェニルエ−テル、ジヒドロキシジフェニル
チオエ−テルおよびこれらのアルキルまたはハロゲン核
置換体が挙げられる。The component (a2) includes alcohols, phenols and alkylene oxide adducts of carboxylic acids. As the alcohol, ethylene glycol
And aliphatic, alicyclic or aromatic group-containing glycols such as toluene, propylene glycol, butanediol, thiodiethylene glycol, cyclohexanediol, cyclohexanedimethanol, and xylylene glycol. Can be Examples of phenols include hydroquinone, bisphenol A, bisphenol F, bisphenol S, dihydroxydiphenyl ether, dihydroxydiphenylthioether, and substituted alkyl or halogen nuclei thereof.
【0011】カルボン酸としては、前記ポリアミド成分
(a1)のところで述べたジカルボン酸が挙げられる。Examples of the carboxylic acid include the dicarboxylic acids described for the polyamide component (a1).
【0012】これらの内、好ましいのはフェノ−ル類、
特に好ましいのはビスフェノ−ルAである。Of these, preferred are phenols,
Particularly preferred is bisphenol A.
【0013】アルキレンオキシドとしてエチレンオキシ
ド、プロピレンオキシド、ブチレンオキシドおよびスチ
レンオキシドが挙げられる。好ましいものはエチレンオ
キシドである。また、エチレンオキシドとともに他のア
ルキレンオキシド(プロピレンオキシド等)を併用する
事もできるが、他のアルキレンオキシドの量はエチレン
オキシドの量に基づいて通常10重量%以下である。[0013] Alkylene oxides include ethylene oxide, propylene oxide, butylene oxide and styrene oxide. Preferred is ethylene oxide. Further, other alkylene oxides (such as propylene oxide) can be used together with ethylene oxide, but the amount of the other alkylene oxide is usually 10% by weight or less based on the amount of ethylene oxide.
【0014】成分(a2)中にチオエ−テル基を導入す
るには、チオエ−テル基含有低分子ジオ−ルあるいはメ
ルカプタン化合物のアルキレンオキシド付加物を用いる
ことによって達成される。このようなチオエ−テル基含
有低分子ジオ−ルとしてはジヒドロキシジフェニルエ−
テルおよびジヒドロキシジフェニルチオエ−テル挙げら
れ、メルカプタン化合物としては硫化水素およびメルカ
プトエタノ−ルが挙げられる。The introduction of a thioether group into the component (a2) can be achieved by using an alkylene oxide adduct of a thioether group-containing low molecular weight diol or a mercaptan compound. Examples of such thioether group-containing low molecular diols include dihydroxydiphenyl ether.
Ter and dihydroxydiphenylthioether; and mercaptan compounds include hydrogen sulfide and mercaptoethanol.
【0015】成分(a2)の数平均分子量は、1,50
0〜3,000である。1,500未満では、帯電防止
性が不十分となり、3,000を超えると反応性が低下
するためポリエーテルエステルアミド製造時に多大な時
間を要する。The number average molecular weight of the component (a2) is 1,50
0 to 3,000. If it is less than 1,500, the antistatic property becomes insufficient, and if it exceeds 3,000, the reactivity decreases, so that a great amount of time is required in producing the polyetheresteramide.
【0016】(a2)は、前記(a1)と(a2)の合
計重量に基づいて20〜80重量%の範囲で用いられ
る。20%未満ではポリエーテルエステルアミド(A)
の帯電防止性が劣り、80重量%を超えると(A)の耐
熱性が低下するために好ましくない。(A2) is used in a range of 20 to 80% by weight based on the total weight of (a1) and (a2). If less than 20%, polyetheresteramide (A)
Is inferior in antistatic properties, and if it exceeds 80% by weight, the heat resistance of (A) is undesirably reduced.
【0017】ポリエーテルエステルアミド(A)の製法
としては、下記製法または製法が例示されるが、特
に限定されるものではない。 製法:アミド形成性モノマーおよびジカルボン酸を反
応させて成分(a1)を形成せしめ、これに成分(a
2)を加えて、高温、減圧下で縮合反応を行う方法。 製法:アミド形成性モノマーおよびジカルボン酸と成
分(a2)を同時に反応槽に仕込み、水の存在下または
非存在下に、高温で加圧反応させることによって中間体
として成分(a1)を生成させ、その後減圧下で成分
(a1)と(a2)との縮合反応を行う方法。 なお、いずれの方法においてもチオエ−テル基含有化合
物を成分(a1)または(a2)の構成成分として使用
することが必要である。Examples of the method for producing the polyetheresteramide (A) include, but are not particularly limited to, the following methods and methods. Production method: The component (a1) is formed by reacting an amide-forming monomer and a dicarboxylic acid, and the component (a) is added thereto.
A method in which 2) is added and a condensation reaction is carried out at a high temperature under reduced pressure. Production method: An amide-forming monomer and a dicarboxylic acid and a component (a2) are simultaneously charged into a reaction vessel, and a pressure reaction is performed at a high temperature in the presence or absence of water to produce a component (a1) as an intermediate, Then, a method of performing a condensation reaction between the components (a1) and (a2) under reduced pressure. In any method, it is necessary to use a thioether group-containing compound as a component of the component (a1) or (a2).
【0018】また、上記の重合反応には、通常公知のエ
ステル化触媒が使用される。触媒としては、例えば三酸
化アンチモンなどのアンチモン系触媒、モノブチルスズ
オキシドなどのスズ系触媒、テトラブチルチタネートな
どのチタン系触媒、テトラブチルジルコネートなどのジ
ルコニウム系触媒、酢酸亜鉛などの酢酸金属塩系触媒な
どが挙げられる。これらの使用量は通常、成分(a1)
と(a2)の合計重量に対して0.1〜5重量%であ
る。In the above-mentioned polymerization reaction, a generally known esterification catalyst is used. Examples of the catalyst include antimony catalysts such as antimony trioxide, tin catalysts such as monobutyltin oxide, titanium catalysts such as tetrabutyl titanate, zirconium catalysts such as tetrabutylzirconate, and metal acetate salts such as zinc acetate. Catalysts and the like. These amounts are usually used as the component (a1)
And 0.1 to 5% by weight based on the total weight of (a2) and (a2).
【0019】(A)の相対粘度は耐熱性および成型性の
点から通常0.5〜4.0(0.5重量%m−クレゾー
ル溶液、25℃)、好ましくは0.6〜3.0である。The relative viscosity of (A) is usually 0.5 to 4.0 (0.5% by weight m-cresol solution at 25 ° C.), preferably 0.6 to 3.0, from the viewpoint of heat resistance and moldability. It is.
【0020】本発明の樹脂組成物において熱可塑性樹脂
(B)としては、ポリスチレン、ポリメタクリル酸メチ
ル、スチレンとメタクリル酸メチルとアクリロニトリル
とブタジエンからなる群より選ばれる2種以上の共重合
体(スチレン/アクリロニトリル共重合体、アクリロニ
トリル/ブタジエン/スチレン共重合体、メタクリル酸
メチル/ブタジエン/スチレン共重合体およびスチレン
/メタクリル酸メチル/アクリロニトリル共重合体
等)、ポリプロピレン、ポリエチレン等のポリオレフィ
ン、ポリカーボネート、アクリル樹脂等が挙げられる。
これらのうち好ましいものは、ポリスチレン、ポリメタ
クリル酸メチル、スチレン/アクリロニトリル共重合
体、アクリロニトリル/ブタジエン/スチレン共重合
体、メタクリル酸メチル/ブタジエン/スチレン共重合
体およびスチレン/メタクリル酸メチル/アクリロニト
リル共重合体である。In the resin composition of the present invention, the thermoplastic resin (B) may be selected from polystyrene, polymethyl methacrylate, and two or more copolymers selected from the group consisting of styrene, methyl methacrylate, acrylonitrile, and butadiene (styrene). / Acrylonitrile copolymer, acrylonitrile / butadiene / styrene copolymer, methyl methacrylate / butadiene / styrene copolymer and styrene / methyl methacrylate / acrylonitrile copolymer), polyolefins such as polypropylene and polyethylene, polycarbonate, acrylic resin And the like.
Of these, preferred are polystyrene, polymethyl methacrylate, styrene / acrylonitrile copolymer, acrylonitrile / butadiene / styrene copolymer, methyl methacrylate / butadiene / styrene copolymer, and styrene / methyl methacrylate / acrylonitrile copolymer. It is united.
【0021】本発明の樹脂組成物において、本発明の帯
電防止剤と熱可塑性樹脂(B)の重量比は、(5〜4
0):(95〜60)である。In the resin composition of the present invention, the weight ratio of the antistatic agent of the present invention to the thermoplastic resin (B) is (5 to 4).
0): (95 to 60).
【0022】本発明の樹脂組成物において、本発明の帯
電防止剤と(B)の相溶性を更に良くする目的で特開平
3−258850号等に記載のカルボキシル基、エポキ
シ基、アミノ基、ヒドロキシル基、ポリアルキレンオキ
シド基およびそれらの誘導体よりなる群から選ばれた少
なくとも1種の官能基を有する重合体、およびスルホン
酸基を有するビニル系重合体、ポリオレフィン部分と芳
香族ビニル系重合体部分を有するブロック重合体等
(C)を含有させても良い。(C)の使用量は、本発明
の帯電防止剤、(B)の合計重量に対して通常0.1〜
15重量%、好ましくは1〜10重量%である。In the resin composition of the present invention, in order to further improve the compatibility between the antistatic agent of the present invention and (B), carboxyl groups, epoxy groups, amino groups, hydroxyl groups described in JP-A-3-258850, etc. Group, a polymer having at least one functional group selected from the group consisting of a polyalkylene oxide group and a derivative thereof, and a vinyl polymer having a sulfonic acid group, a polyolefin portion and an aromatic vinyl polymer portion. (C) may be contained. The amount of (C) used is usually 0.1 to 10% based on the total weight of the antistatic agent of the present invention and (B).
It is 15% by weight, preferably 1 to 10% by weight.
【0023】帯電防止効果を更に向上させる目的で、ア
ルカリ金属および/またはアルカリ土類金属のハロゲン
化物からなる金属塩(D)を含有させてもよい。(D)
としては、塩化リチウム、塩化ナトリウム、塩化カリウ
ム、塩化マグネシウム、塩化カルシウム、臭化ナトリウ
ム、臭化カリウム、臭化マグネシウムなどをあげること
ができる。これらのうち特に好ましいものは、塩化ナト
リウムおよび塩化カリウムである。(D)の使用量は、
(A)、(B)および(C)の合計重量に対して通常
0.01〜5重量%、好ましくは0.05〜3重量%で
ある。0.01重量%未満では効果が発現せず、5重量
%を超えると樹脂表面に析出し樹脂の外観を損ねる。For the purpose of further improving the antistatic effect, a metal salt (D) comprising a halide of an alkali metal and / or an alkaline earth metal may be contained. (D)
Examples thereof include lithium chloride, sodium chloride, potassium chloride, magnesium chloride, calcium chloride, sodium bromide, potassium bromide, and magnesium bromide. Particularly preferred among these are sodium chloride and potassium chloride. (D)
It is usually 0.01 to 5% by weight, preferably 0.05 to 3% by weight, based on the total weight of (A), (B) and (C). If the content is less than 0.01% by weight, no effect is exhibited, and if it exceeds 5% by weight, it precipitates on the resin surface and impairs the appearance of the resin.
【0024】本発明の樹脂組成物は、公知の各種混合機
を用いて上記成分を混練することによって得ることがで
きる。混合機としては例えば押し出し機、ブラベンダ
ー、ニーダーおよびバンバリーミキサーなどがあげられ
る。The resin composition of the present invention can be obtained by kneading the above components using various known mixers. Examples of the mixer include an extruder, a Brabender, a kneader, and a Banbury mixer.
【0025】混練時の各成分の添加順序については特に
限定はないが、例えば、1.(A)〜(C)をブレンド
混練する方法、2.少量の(B)と(A)、(C)をブ
レンド混練した後、残りの(B)を混練する方法や3.
(A)、(C)をブレンド混練した後、(B)を混練す
る方法が挙げられる。2.と3.はマスターバッチまた
はマスターペレットと言われる方法である。分散性が良
く、永久帯電防止性と機械的強度に優れることから2.
の方法が好ましい。The order of addition of each component during kneading is not particularly limited. 1. A method of blending and kneading (A) to (C); 2. A method of blending and kneading a small amount of (B) with (A) and (C) and then kneading the remaining (B).
After blending and kneading (A) and (C), there is a method of kneading (B). 2. And 3. Is a method called master batch or master pellet. 1. It has good dispersibility, and is excellent in permanent antistatic properties and mechanical strength.
Is preferred.
【0026】マスターバッチを経由して本発明の組成物
を得る方法は、通常本発明の帯電防止剤50〜90重量
部、(B)50〜10重量部、好ましくは30〜10重
量部および(C)2〜30重量部をブレンド、混練しマ
スターバッチとなし、このマスターバッチとさらに
(B)とをブレンド、混練し、本発明の組成物を得るこ
とができる。この方法は特に、大量の(B)中に少量の
本発明の帯電防止剤を均一に分散させることが出来るの
で、本発明の組成物はマスターバッチを経由してなるこ
とが好ましい。The method for obtaining the composition of the present invention via a masterbatch generally comprises 50 to 90 parts by weight of the antistatic agent of the present invention, (B) 50 to 10 parts by weight, preferably 30 to 10 parts by weight and ( C) 2 to 30 parts by weight are blended and kneaded to form a master batch, and this master batch and (B) are further blended and kneaded to obtain the composition of the present invention. In particular, since the method can uniformly disperse a small amount of the antistatic agent of the present invention in a large amount of (B), the composition of the present invention is preferably formed via a masterbatch.
【0027】また本発明の樹脂組成物には種々の用途に
応じ、該組成物の特性を阻害しない範囲で他の樹脂用添
加剤を任意に添加することができる。該添加剤として
は、顔料、染料、充填剤、核剤、ガラス繊維、滑剤、可
塑剤、離型剤、酸化防止剤、難燃剤、紫外線吸収剤等が
あげられる。添加剤の使用量は、(A)、(B)および
(C)の合計重量に対して通常0.01〜5重量%、好
ましくは0.05〜3重量%である。0.01重量%未
満では効果が発現せず、5重量%を超えると樹脂表面に
析出し樹脂の外観を損ねる。The resin composition of the present invention may optionally contain other resin additives as long as the properties of the composition are not impaired, depending on various uses. Examples of the additives include pigments, dyes, fillers, nucleating agents, glass fibers, lubricants, plasticizers, release agents, antioxidants, flame retardants, ultraviolet absorbers and the like. The amount of the additive to be used is generally 0.01 to 5% by weight, preferably 0.05 to 3% by weight, based on the total weight of (A), (B) and (C). If the content is less than 0.01% by weight, no effect is exhibited, and if it exceeds 5% by weight, it precipitates on the resin surface and impairs the appearance of the resin.
【0028】[0028]
【実施例】以下、実施例により本発明をさらに説明する
が、本発明はこれに限定されるものではない。実施例中
の部は重量部を示す。なお最終的に得られた樹脂組成物
は射出成形法によって成形した後、下記の試験法により
諸物性を測定した。EXAMPLES The present invention will be further described with reference to the following examples, but the present invention is not limited to these examples. Parts in Examples are parts by weight. After the resin composition finally obtained was molded by an injection molding method, various physical properties were measured by the following test methods.
【0029】表面固有抵抗値 :厚さ2mmの角試験片
を用い、超絶縁計(アドバンテスト製)により20℃、
湿度65%RH雰囲気下で測定した。 アイゾット衝撃強度:ASTM D256−56A 引張強度 :ASTM D638 熱減量開始温度 :空気下TG−DTAによって測定し
た(耐熱性の指標)。Surface specific resistance: A square test piece having a thickness of 2 mm was measured at 20 ° C. using a super insulation meter (manufactured by Advantest)
The measurement was performed in a 65% RH atmosphere. Izod impact strength: ASTM D256-56A Tensile strength: ASTM D638 Heat loss starting temperature: Measured by TG-DTA under air (indicator of heat resistance).
【0030】[ポリエーテルエステルアミドの製造] 製造例1 3Lステンレス製オートクレーブに、ε−カプロラクタ
ム105部、チオジ酢酸17.4部、イルガノックス1
010(酸化防止剤 チバガイキー社製)0.3部お
よび水6部を仕込み、窒素置換後、220℃で加圧密閉
下4時間加熱攪拌し、両末端にカルボキシル基を有する
酸価110のポリアミドオリゴマーを117部得た。次
に数平均分子量2,000のビスフェノールAエチレン
オキサイド付加物225部および酢酸ジルコニル0.5
部を加え、245℃、1mmHg以下の減圧下の条件で
5時間重合し、粘稠なポリマーを得た。このポリマーを
ベルト上にストランド状で取り出し、ペレタイズするこ
とによってチオエ−テル基含有ポリエーテルエステルア
ミドを得た。このものの相対粘度は2.15(0.5重
量%m−クレゾール溶液、25℃)であった。このポリ
エーテルエステルアミドを以下(A−1)と略記する。[Production of Polyetheresteramide] Production Example 1 In a 3 L stainless steel autoclave, 105 parts of ε-caprolactam, 17.4 parts of thiodiacetic acid, and Irganox 1
010 (Antioxidant manufactured by Ciba-Gaiky) 0.3 parts and water 6 parts were charged, and after purging with nitrogen, the mixture was heated and stirred at 220 ° C. for 4 hours under pressure and airtight, and a polyamide oligomer having an acid value of 110 having a carboxyl group at both ends. 117 parts were obtained. Next, 225 parts of a bisphenol A ethylene oxide adduct having a number average molecular weight of 2,000 and 0.5 of zirconyl acetate were added.
Then, polymerization was performed for 5 hours under reduced pressure of 245 ° C. and 1 mmHg or less to obtain a viscous polymer. The polymer was taken out in a strand form on a belt and pelletized to obtain a thioether group-containing polyetheresteramide. Its relative viscosity was 2.15 (0.5% by weight m-cresol solution, 25 ° C.). This polyetheresteramide is abbreviated as (A-1) below.
【0031】製造例2 3Lステンレス製オートクレーブに、ε−カプロラクタ
ム105部、アジピン酸17.1部、イルガノックス1
010(酸化防止剤 チバガイキー社製)0.3部お
よび水6部を仕込み、窒素置換後、220℃で加圧密閉
下4時間加熱攪拌し、両末端にカルボキシル基を有する
酸価110のポリアミドオリゴマーを117部得た。次
に数平均分子量1,500の4,4´−ジヒドロキシジ
フェニルチオエ−テルのエチレンオキシド付加物225
部の混合物および酢酸ジルコニル0.5部を加え、24
5℃、1mmHg以下の減圧下の条件で5時間重合し、
粘稠なポリマーを得た。このポリマーをベルト上にスト
ランド状で取り出し、ペレタイズすることによってチオ
エ−テル基含有ポリエーテルエステルアミドを得た。こ
のものの相対粘度は2.20(0.5重量%m−クレゾ
ール溶液、25℃)であった。このポリエーテルエステ
ルアミドを以下(A−2)と略記する。Production Example 2 Into a 3 L stainless steel autoclave, 105 parts of ε-caprolactam, 17.1 parts of adipic acid, Irganox 1
010 (Antioxidant manufactured by Ciba-Gaiky) 0.3 parts and water 6 parts were charged, and after purging with nitrogen, the mixture was heated and stirred at 220 ° C. for 4 hours under pressure and airtight, and a polyamide oligomer having an acid value of 110 having a carboxyl group at both ends. 117 parts were obtained. Next, an ethylene oxide adduct 225 of 4,4'-dihydroxydiphenylthioether having a number average molecular weight of 1,500.
Parts of the mixture and 0.5 part of zirconyl acetate are added,
Polymerization was performed at 5 ° C. under reduced pressure of 1 mmHg or less for 5 hours,
A viscous polymer was obtained. The polymer was taken out in a strand form on a belt and pelletized to obtain a thioether group-containing polyetheresteramide. Its relative viscosity was 2.20 (0.5% by weight m-cresol solution, 25 ° C.). This polyetheresteramide is abbreviated as (A-2) below.
【0032】製造例3 3Lステンレス製オートクレーブに、ε−カプロラクタ
ム105部、アジピン酸17.1部、イルガノックス1
010(酸化防止剤 チバガイキー社製)0.3部お
よび水6部を仕込み、窒素置換後、220℃で加圧密閉
下4時間加熱攪拌し、両末端にカルボキシル基を有する
酸価110のポリアミドオリゴマーを117部得た。次
に数平均分子量1,500のポリオキシエチレングリコ
ール175部および酢酸ジルコニル0.5部を加え、2
45℃、1mmHg以下の減圧下の条件で5時間重合
し、粘稠なポリマーを得た。このポリマーをベルト上に
ストランド状で取り出し、ペレタイズすることによって
ポリエーテルエステルアミドを得た。このものの相対粘
度は2.20(0.5重量%m−クレゾール溶液、25
℃)であった。このポリエーテルエステルアミドを以下
(A−3)と略記する。 [グラフト共重合反応生成物の製造] 製造例4 ポリブタジエンラテックス40部の存在下でメタクリル
酸メチル72重量%、スチレン24重量%、アクリロニ
トリル4重量%からなる単量体混合物60部を乳化重合
した。得られた、グラフト共重合体ラテックスを、硫酸
で凝固し苛性ソーダで中和、洗浄、濾過、乾燥し、パウ
ダー状のグラフト共重合反応生成物(C−1)を調整し
た。Production Example 3 In a 3 L stainless steel autoclave, 105 parts of ε-caprolactam, 17.1 parts of adipic acid, Irganox 1
010 (Antioxidant manufactured by Ciba-Gaiky) 0.3 parts and water 6 parts were charged, and after purging with nitrogen, the mixture was heated and stirred at 220 ° C. for 4 hours under pressure and airtight, and a polyamide oligomer having an acid value of 110 having a carboxyl group at both ends. 117 parts were obtained. Next, 175 parts of polyoxyethylene glycol having a number average molecular weight of 1,500 and 0.5 parts of zirconyl acetate were added, and 2
Polymerization was performed at 45 ° C. under reduced pressure of 1 mmHg or less for 5 hours to obtain a viscous polymer. The polymer was taken out in a strand form on a belt and pelletized to obtain a polyetheresteramide. This has a relative viscosity of 2.20 (0.5 wt% m-cresol solution, 25
° C). This polyetheresteramide is abbreviated as (A-3) below. [Production of Graft Copolymerization Reaction Product] Production Example 4 In the presence of 40 parts of polybutadiene latex, 60 parts of a monomer mixture composed of 72% by weight of methyl methacrylate, 24% by weight of styrene, and 4% by weight of acrylonitrile were emulsion-polymerized. The obtained graft copolymer latex was coagulated with sulfuric acid, neutralized with caustic soda, washed, filtered and dried to prepare a powdery graft copolymerization reaction product (C-1).
【0033】製造例5 表1に示す割合の(A)〜(C)をヘンシェルミキサー
にて3分間ブレンドした後、ベント付き2軸押出機に
て、240℃、30rpm、滞留時間5分の条件で溶融
混練しマスターバッチ(M−1)〜(M−5)を得た。Production Example 5 After blending the components (A) to (C) at the ratios shown in Table 1 for 3 minutes using a Henschel mixer, the mixture was subjected to a twin-screw extruder equipped with a vent at 240 ° C., 30 rpm, and a residence time of 5 minutes. To obtain masterbatches (M-1) to (M-5).
【0034】[0034]
【表1】 [Table 1]
【0035】実施例1〜5 マスターバッチ(M−1)〜(M−5)、表2に示すア
クリロニトリル−ブタジエン−ポリスチレン三元共重合
体(B)を製造例4と同様の条件でブレンド、混練し本
発明の組成物を得た。マスターバッチを経由した本発明
の組成物の組成、割合を表2に示す。Examples 1 to 5 A master batch (M-1) to (M-5) and an acrylonitrile-butadiene-polystyrene terpolymer (B) shown in Table 2 were blended under the same conditions as in Production Example 4. It was kneaded to obtain the composition of the present invention. Table 2 shows the composition and ratio of the composition of the present invention via the masterbatch.
【0036】[0036]
【表2】 [Table 2]
【0037】実施例6〜12、比較例1〜5 表3に示す(A)〜(C)を製造例4と同様の条件でブ
レンド、混練し本発明の組成物および比較の組成物を得
た。Examples 6 to 12 and Comparative Examples 1 to 5 (A) to (C) shown in Table 3 were blended and kneaded under the same conditions as in Production Example 4 to obtain the compositions of the present invention and comparative compositions. Was.
【0038】[0038]
【表3】 [Table 3]
【0039】次いで射出成形機によりシリンダー温度2
20℃、金型温度60℃で試験片を成形し各物性を測定
した。結果を表4に示す。なお表面固有抵抗について
は、以下の方法により行った。 (a)成形後、角試験片をそのまま20℃、湿度65%
RH雰囲気下に24時間放置。 (b)成形後、角試験片を洗剤(ママレモン;ライオン
(株)製)水溶液で洗浄処理し、次いでイオン交換水で
充分洗ったのち、表面の水分を乾燥除去してから20
℃、湿度65%RH雰囲気下に24時間放置。Next, the cylinder temperature was set to 2 by the injection molding machine.
A test piece was molded at 20 ° C. and a mold temperature of 60 ° C., and each physical property was measured. Table 4 shows the results. The surface resistivity was determined by the following method. (A) After molding, the square test piece is kept at 20 ° C. and a humidity of 65%.
Leave in RH atmosphere for 24 hours. (B) After molding, the square test piece is washed with an aqueous solution of a detergent (Mama Lemon; manufactured by Lion Corporation), and then sufficiently washed with ion-exchanged water.
It was left for 24 hours in an atmosphere of 65 ° C. and a relative humidity of 65%.
【0040】[0040]
【表4】 [Table 4]
【0041】[0041]
【発明の効果】以上明らかなように、本発明のチオエ−
テル基含有ポリエーテルエステルアミドからなる帯電防
止剤は、従来のポリエーテルエステルアミドからなる帯
電防止剤に比べ耐熱性、機械的強度および帯電防止性に
優れる。またこのポリエーテルエステルアミドと熱可塑
性樹脂からなる樹脂組成物は、耐熱性、永久帯電防止性
および機械的強度に優れる。従って本発明の帯電防止剤
は特に耐熱性プラスチックの帯電防止剤として有用であ
る。As is clear from the above, the thioether of the present invention can be used.
An antistatic agent comprising a ter group-containing polyetheresteramide is superior in heat resistance, mechanical strength, and antistatic properties to a conventional antistatic agent comprising a polyetheresteramide. The resin composition comprising the polyetheresteramide and the thermoplastic resin has excellent heat resistance, permanent antistatic properties, and mechanical strength. Therefore, the antistatic agent of the present invention is particularly useful as an antistatic agent for heat-resistant plastics.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI C08L 77/12 C08L 77/12 101/00 101/00 C09K 3/16 108 C09K 3/16 108B (56)参考文献 特開 昭63−227628(JP,A) 特開 平2−70739(JP,A) 特公 平4−72855(JP,B2) (58)調査した分野(Int.Cl.7,DB名) C08G 69/00 - 69/50 C08L 1/00 - 101/16 C09K 3/06 ──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. 7 Identification code FI C08L 77/12 C08L 77/12 101/00 101/00 C09K 3/16 108 C09K 3/16 108B (56) References JP 63-227628 (JP, A) JP-A-2-70739 (JP, A) JP 4-72855 (JP, B2) (58) Fields investigated (Int. Cl. 7 , DB name) C08G 69/00 -69/50 C08L 1/00-101/16 C09K 3/06
Claims (5)
分子量500〜5,000のポリアミド成分(a1)と
数平均分子量1,500〜3,000のポリエ−テルジ
オ−ル成分(a2)から誘導され、成分(a1) にチ
オエ−テル基を含有するポリエーテルエステルアミド
(A)からなる帯電防止剤。1. A polyamide component (a1) having carboxyl groups at both ends and having a number average molecular weight of 500 to 5,000 and a polyetherdiol component (a2) having a number average molecular weight of 1,500 to 3,000. , Component (a1) An antistatic agent comprising a polyetheresteramide (A) containing a thioether group.
分子量500〜5,000のポリアミド成分(a1)と
数平均分子量1,500〜3,000のポリエ−テルジ
オ−ル成分(a2)から誘導され、成分(a2)がチオ
エ−テル基含有低分子ジオ−ルあるいはメルカプタン化
合物のアルキレンオキシド付加物であるポリエーテルエ
ステルアミド(A)からなる帯電防止剤。 2. Number average having carboxyl groups at both ends
A polyamide component (a1) having a molecular weight of 500 to 5,000
Polyetherdiene having a number average molecular weight of 1,500 to 3,000
Derived from an all component (a2), wherein the component (a2) is
Ether group-containing low molecular diols or mercaptans
Polyether ether which is an alkylene oxide adduct of the compound
An antistatic agent composed of a steramide (A).
対粘度が0.5〜4.0(0.5重量%m−クレゾール
溶液、25℃)である請求項1または2記載の帯電防止
剤。3. A polyetherester relative viscosity of the amide (A) is 0.5 to 4.0 (0.5 wt% m-cresol solution, 25 ° C.) antistatic agent according to claim 1 or 2 wherein the.
分子量500〜5,000のポリアミド成分(a1)と
数平均分子量1,500〜3,000のポリエ−テルジ
オ−ル成分(a2)から誘導され、成分(a1) にチ
オエ−テル基を含有するポリエーテルエステルアミド、
または成分(a2)がチオエ−テル基含有低分子ジオ−
ルあるいはメルカプタン化合物のアルキレンオキシド付
加物であるポリエーテルエステルアミド(A)からなる
帯電防止剤と、熱可塑性樹脂(B)とからなる樹脂組成
物。4. Polyamide component (a1) having carboxyl groups at both ends and having a number average molecular weight of 500 to 5,000 and polyetherdiol component (a2) having a number average molecular weight of 1,500 to 3,000. , Component (a1) A polyetheresteramide containing a thioether group ,
Or, when the component (a2) is a thioether group-containing low molecular di-
Or alkylene oxide with mercaptan compound
A resin composition comprising an antistatic agent comprising a polyetheresteramide (A) , which is an additive, and a thermoplastic resin (B).
リメタクリル酸メチルおよび/または、スチレンとメタ
クリル酸メチルとアクリロニトリルとブタジエンからな
る群より選ばれる2種以上の共重合体である請求項4記
載の樹脂組成物。Wherein (B) is polystyrene and / or polymethyl methacrylate and / or, according to claim 4 wherein the two or more copolymers selected from the group consisting of styrene and methyl methacrylate and acrylonitrile and butadiene Resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14264693A JP3202415B2 (en) | 1993-05-21 | 1993-05-21 | Antistatic agent and resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14264693A JP3202415B2 (en) | 1993-05-21 | 1993-05-21 | Antistatic agent and resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06329790A JPH06329790A (en) | 1994-11-29 |
JP3202415B2 true JP3202415B2 (en) | 2001-08-27 |
Family
ID=15320198
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JP14264693A Expired - Fee Related JP3202415B2 (en) | 1993-05-21 | 1993-05-21 | Antistatic agent and resin composition |
Country Status (1)
Country | Link |
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JP (1) | JP3202415B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6825270B1 (en) | 1999-08-04 | 2004-11-30 | Atofina | Antistatic styrene polymer compositions |
US7018567B2 (en) | 2002-07-22 | 2006-03-28 | General Electric Company | Antistatic flame retardant resin composition and methods for manufacture thereof |
FR2912751B1 (en) | 2007-02-16 | 2012-07-13 | Arkema France | PROCESS FOR THE PREPARATION OF POLYLACTONES AND POLYLACTAMES |
FR2912752B1 (en) * | 2007-02-16 | 2012-10-05 | Arkema France | PROCESS FOR PREPARING A COPOLYMER OF AT LEAST ONE CYCLIC MONOMER |
CN113956472B (en) * | 2021-10-22 | 2023-09-19 | 擎天材料科技有限公司 | Polyester resin and preparation method and application thereof |
JPWO2024004933A1 (en) * | 2022-06-30 | 2024-01-04 |
-
1993
- 1993-05-21 JP JP14264693A patent/JP3202415B2/en not_active Expired - Fee Related
Also Published As
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JPH06329790A (en) | 1994-11-29 |
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