JP3299108B2 - EMC countermeasure structure of electronic circuit unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an EMC (electromagnetic compatibility) countermeasure structure of an electronic circuit unit which emits electromagnetic waves or malfunctions due to the influence of the electromagnetic waves, and more particularly to a front plate of an electronic circuit package and a grounding structure thereof.

[0002]

2. Description of the Related Art As a conventional EMC countermeasure structure of this kind,
As shown in FIG. 6, after the electronic circuit package 1 is inserted or removed from the front surface of the electronic circuit unit 10 in order to provide an electronic shielding effect to the front surface of the electronic circuit unit 10, the electronic circuit unit 10 is formed of an integrated metal plate. The conventional structure employs a structure in which a shield cover 15 is attached and fixed with screws or the like.

FIG. 7 shows a configuration of a conventional electronic circuit device designed for improving maintainability of the electronic circuit package 1, and FIG. 7A is a left side view. 7 (b) is a front view, and FIG. 7 (c) is a cross-sectional view of a package row as viewed from above to schematically show a state of competing for connection contacts.

Referring to FIG. 7, a shield front plate 16 made of metal is individually provided for each of electronic circuit packages 1, and connection contacts 17 formed on the side surfaces of shield front plate 16 by an elastic member such as beryllium copper. The shield contacts 16 are electrically connected by the connection contacts 17 between the shield front plates 16 of the adjacent electronic circuit packages 1 and mounted on the right end 19 of the electronic circuit unit 10 (see FIG. 7B). The connection contact 17 of the electronic circuit package 1 and the connection contact 17 provided on the left end 18 of the electronic circuit unit 10 are grounded to the frame ground of the electronic circuit unit 10 so that the front surface of the electronic circuit unit 10 has an electromagnetic shielding effect. The structure that was made to take was adopted.

[0005]

However, in the above-mentioned conventional EMC countermeasure structure, in the case of the structure shown in FIG. 6, every time the electronic circuit package 1 needs to be added or maintained, an integrated type is required. The shield cover 15 has to be removed, which causes a problem that maintenance workability is poor.

Further, in the conventional structure shown in FIG. 7, a competition occurs between the adjacent electronic circuit packages 1 due to the contact force of the connection contacts 17, and the electronic circuit packages 1 are clamped by the shield front plate 16 when the electronic circuit package 1 is inserted or removed. The connected contact 17 may be caught by an adjacent object (adjacent electronic circuit package), and the connecting contact 17 may fall off.

Furthermore, in the conventional structure shown in FIG. 7, the shield front plate 16 is provided below the package insertion / extraction lever 6, so that the frame earth cannot be connected to the insertion / extraction lever 6 made of synthetic resin. In addition to the above, there is a problem that a sufficient electromagnetic shielding effect cannot be obtained, and the connection point of the frame ground of the shield front plate 16 is limited to the left end 18 or the right end 19 of the electronic circuit unit 10. However, there is a problem that a sufficient shielding effect cannot be obtained because the connection resistance before the connection increases.

Accordingly, the present invention has been made in view of the above-mentioned problems of the prior art, and has an excellent electromagnetic shielding effect on a front portion of an electronic circuit unit while being excellent in operability of inserting and removing an electronic circuit package. An object of the present invention is to provide a front plate of an electronic circuit package and a grounding structure thereof.

[0009]

In order to achieve the above object, the present invention provides a bookshelf mounting structure in which an electronic circuit package is mounted on a bookshelf, comprising a U-shaped connecting plate provided on the front of the electronic circuit package. A connection contact fixed to a side surface of the U-shaped connection plate, the end surface of the U-shaped connection plate facing an adjacent electronic circuit package being chamfered, and further provided on a back surface of the ejector. A step-bending shield plate provided and joined to the U-shaped connection plate, and a rotary connection plate having a rotation fulcrum on the front surface of the base plate of the electronic circuit unit and contacting the connection contact according to rotation. EM of electronic circuit unit characterized by:
Provide C countermeasure structure. Preferably, the electronic circuit package
The bookshelf is mounted on the electronic circuit unit in a bookshelf.
In the roof mounting structure, the front of the electronic circuit package is
The board has a U-shaped conductive connection plate ("U-shaped connection
Plate "), and one side surface of the U-shaped connection plate
A flexible connection contact is fixed, and
In the U-shaped connection plate, the connection contact is fixed.
The chamfer is applied to the end face on the side opposite to the side
In addition, the back of the U-shaped connection plate is
The step bending shield plate extended in is joined,
Rotating fulcrum on the front of the base plate of the electronic circuit unit
Rotating connection that contacts the connection contact in response to rotation
Plate, wherein the rotary connection plate is in contact with the connection contact.
Grounded to the frame ground of the electronic circuit unit in contact
And a plurality of electronic circuits mounted on the electronic circuit unit.
The front plate of the package is connected to the side of the U-shaped connection plate.
The electrons are electrically connected to each other through contacts;
The electronic circuit pack attached to one end of the circuit unit.
The front panel of the package is connected to the U
The contact contacts the inner wall of the electronic circuit unit and
Grounded to the slave circuit unit, and other than the electronic circuit unit.
Front plate of the electronic circuit package mounted on the side end
The side of the U-shaped connection plate is
Abuts the connection contacts installed on the
It is configured to be grounded to the slave circuit unit.

In the present invention, preferably, the connection contact fixed to a side surface of the U-shaped connection plate is:
A plurality of conductive elastically deforming portions extending in a row from the band-shaped thick portion in a comb shape, wherein the band-shaped thick portion is fixed to a side surface of the U-shaped connection plate, and An end of the deformed portion abuts against the inner wall of the U-shaped connection plate, the elastically deformed portion is bent into a predetermined shape as viewed from the end face in the row direction of the comb teeth, and the band-shaped thick portion serves as a support end. It is characterized in that a contact is formed.

[0011]

According to the present invention, with the above structure,
The front plate between a plurality of electronic circuit packages mounted on the electronic circuit unit can be connected to each other via connection contacts fixed to the side surface of the U-shaped connection plate, and the front surface of the electronic circuit unit is made of metal. Since the material can be closed without any gap, leakage of electromagnetic waves from the gap between the front plates can be prevented.

Further, according to the present invention, since the rotary connection plate that contacts and shares the connection contact between the adjacent electronic circuit packages is grounded to the electronic circuit unit via the rotation fulcrum, the rotation connection plate is connected to the frame ground. The connection path can be shortened, and the connection resistance can be reduced.

Further, according to the present invention, since the electronic circuit package is guided when the electronic circuit package is inserted by the chamfer formed on the end surface of the U-shaped connection plate facing the adjacent electronic circuit package, the inserted electronic circuit package is already inserted. Competition with the electronic circuit package is avoided, and the potential circuit package can be inserted smoothly.

Further, according to the present invention, when the connection contact is configured as described in claim 2, when the electronic circuit package is inserted, the amount of competition between the position of the U-shaped connection plate and the protrusion of the elastic deformation portion is reduced. At least, it is possible to obtain a large contact force. As a result, even in a narrow gap between the electronic circuit packages, the connection contact is brought into contact with the U-shaped connection plate of the adjacent electronic circuit package with a strong contact force. This makes it possible to realize stable contact that is resistant to aging, and also avoids a situation in which an adjacent electronic circuit package is caught and connection contacts fall off.

As described above, the present invention realizes a front plate of an electronic circuit package and a grounding structure thereof, which achieve both excellent maintainability and an electromagnetic shielding effect.

[0016]

FIG. 1 is a view showing a front plate of an electronic circuit package and a grounding structure to an electronic circuit unit in one embodiment of an EMC countermeasure structure according to the present invention.
1A is a left side view, FIG. 1B is a front view, and FIG. 1C is a right side view. 2A and 2B are diagrams showing a configuration of a front plate according to an embodiment of the present invention. FIG. 2A is a front view of a lower portion of the front plate, and FIG. 2B is AA ′ in FIG. 2A. FIG.

1 and 2, an electronic circuit package 1 is mounted on an electronic circuit unit 10 in a bookshelf shape. On the front surface of the electronic circuit package 1, a metal connecting plate (referred to as “U-shaped connecting plate”) 3 having a U-shaped cross section is provided, and on one side surface of the U-shaped connecting plate 3. The connection contact 4 having flexibility (elasticity) is welded, and the end face of the U-shaped connection plate 3 facing the adjacent electronic circuit package, that is, the side end face opposite to the side face to which the connection contact 4 is fixed is provided. A tapered chamfer 5 is provided.

A package insertion / extraction lever (an ejector mechanism of an electronic circuit package) is provided on the back surface of the U-shaped connection plate 3.
A step-bending shield plate 7 extending to the back of 6 is welded, and constitutes a shield plate of the electronic circuit package 1.

FIGS. 1 and 2 show an electronic circuit unit 1 on which three electronic circuit packages 1 each having a front plate 2 are mounted.
Although 0 is shown, in actuality, as shown in FIG. 3, a plurality of electronic circuit packages 1 each having the front plate 2 individually are mounted on the electronic circuit unit 10 in a bookshelf shape.

At this time, the front plate 2 of the electronic circuit package 1 mounted on the rightmost end of the electronic circuit unit 10 has its connection contacts 4 abutting against the inner wall of the electronic circuit unit 10 and being grounded to the electronic circuit unit 10. I have. Further, the front plate 2 provided in the electronic circuit package 1 mounted on the leftmost end of the electronic circuit unit 10 has the U-shaped connection plate 3.
Side is in contact with the connection contact 4 provided on the electronic circuit unit 10 and is grounded to the electronic circuit unit 10.

According to the configuration described above, the front plate 2 of the plurality of electronic circuit packages 1 mounted on the electronic circuit unit 10
Is a connection contact 4 welded to the side of the U-shaped connection plate 3
The electronic circuit unit can be electrically connected to each other through a metal material, so that the front surface of the electronic circuit unit is closed with a metal material without any gap, thereby preventing leakage of electromagnetic waves from between the front plates.

Referring to FIG. 3, when the electronic circuit package 1 is inserted, the insertion position of the electronic circuit package 1 is determined by the package guide groove 11, and the contact force of the connection contacts 4 welded to the electronic circuit package 1 is determined. As a beam having both ends supported by the upper and lower package guide grooves 11, FIG.
Although it is deformed in the direction of the arrow shown by (b), it is reinforced by a U-shaped connection plate structure, and is formed by a chamfer 5 formed on an end surface of the U-shaped connection plate 3 facing an adjacent electronic circuit package.
Since the guide is provided when the package is inserted, a wedge effect due to the force applied for inserting the electronic circuit package 1 acts, and the electronic circuit package can be smoothly inserted to correct the position of the package.

On the other hand, referring to FIG. 4, connection contacts 4 are welded to the side surfaces of front plate 2 of the electronic circuit packages mounted on electronic circuit unit 10. A package guide groove 11 is formed on the front surface, and between the adjacent package guide grooves 11, a rotary connection plate 8 that can rotate and move until it contacts the connection contact 4 of the front plate 2, and a rotation fulcrum of the rotary connection plate 8. 9 are formed.

The rotary connection plate 8 mounted on the rotation fulcrum 9 is fixed only in the direction of the rotation axis and is rotatable in parallel with the component surface of the electronic circuit package 1. 4B, the state of contact with the connection contact 4 welded to the U-shaped connection plate 3 of the adjacent electronic circuit package 1 is released, It can be in a contact state.

FIG. 5 is a partially enlarged view of the rotation fulcrum 9 in the process of shifting to the non-contact state (see FIG. 4D). The C-shaped support plate 13 is welded to the rotary connection plate 8, and the short side of the emboss 14 is formed by the substantially rectangular-shaped embosses 14 formed on both side surfaces of the U-shaped bent rotary connection plate 8. C-shaped support plate 13 with slightly more opening
Is inserted in a lying state.

For this reason, when the rotary connection plate 8 is rotated to 90 degrees before the connection contact 4 of the front plate 2, the inner diameter of the C-shaped support frame 13 formed slightly smaller than the long side of the emboss 14 is formed. The emboss 14 contacts.

As described above, the rotary connection plate 8 can be grounded to the frame ground of the electronic circuit unit 10 in a state of contact with the connection contacts 4 of the front plate 2 while being rotatable.

A connection contact 4 suitable for use in the EMC structure according to the embodiment of the present invention will be described below.

The connection contacts 4 welded to the inner wall of the U-shaped connection plate 3 of the inserted electronic circuit package 1 are shown in FIG.
As shown in the figure, the elastic deformation portion 21 has a plurality of elastically deforming portions 21 which are protruded in a comb shape from the band-shaped thick portion 20 and are continuous in a line, and the elastically deforming portion 21 is bent in a V-shape as viewed from the end of the comb tooth array. It has been processed in advance so as to include at least the processed part (see FIG. 9A). When attaching the connection contact 4 to the U-shaped connection plate 4, first, as shown in FIG. 9A, the connection contact 4 is arranged on the inner wall of the U-shaped connection plate 3, and then, as shown in FIG. The band-shaped thick portion 20 is welded and fixed in the direction of the arrow, and after welding, as shown in FIG. 9B, the tip of the elastically deformable portion 21 is changed to the left in FIG. 9B. Is equivalent to

The electronic circuit package 1 is inserted into the connection contact 4 in which the tip of the elastic deformation portion 21 is displaced in advance, so that the left end position of the U-shaped connection plate 3 and the elastic deformation portion 21 A large contact force can be obtained even when the amount of competition (the amount of movement of the connection contact 4) with the rightmost end (the apex of the bent portion) is small.

The above-mentioned band-shaped thick portion 20 is welded to the inner wall of the U-shaped connection plate 3 at an appropriate welding pitch (for example, about 50 mm) so as not to deteriorate workability, and the elastically deforming portion 21 is formed.
If the plate is formed to have a thickness and width functioning as a good support end with respect to a bending moment caused by displacement of the rightmost end of the elastic deformation portion, the elastic deformation of the elastic deformation portion 21 can be prevented from being impaired.

As described above, according to the present embodiment, the frame ground connection can be established by the connection between the front plates 2 by the connection contacts 4, and the rotary connection plate 8 in contact with the connection contacts 4 forms the rotation fulcrum 9. Since the front plate 2 is connected to the base plate 12 via the emboss 14, the front plate 2 is connected to the frame ground of the electronic circuit unit 10 with a short connection distance.

Further, when removing the electronic circuit package 1, as shown in FIG. 4D, the rotary connection plate 8 is rotated to the front side, and then the electronic circuit package 1 is removed, and when the electronic circuit package 1 is inserted, After the electronic circuit package 1 is inserted, the rotary connection plate 8 can be rotated to the connection state shown in FIG.

As a result, the connection resistance from the front plate 2 to the ground is small, an excellent electromagnetic shielding effect can be provided on the front of the electronic circuit unit, and excellent insertion / removal maintainability can be realized.

[0035]

As described above, according to the present invention,
The front plates of adjacent electronic circuit packages can be electrically connected to each other, and the rotatable connection plate is provided, so that the electronic circuit unit can be grounded very close to the front plate, and the connection resistance can be reduced. Therefore, an excellent electromagnetic shielding effect can be provided to the front of the electronic circuit unit only by the individual front plate.

Further, according to the present invention, the end surface structure for preventing the competition between the electronic circuit packages is adopted in combination with the rotatable connection plate structure, so that excellent insertion / removal maintainability and electromagnetic shielding effect are obtained. A compatible front plate of an electronic circuit package and its grounding structure can be realized.

Further, according to the present invention, the connection contact fixed to the U-shaped connection plate is configured as described in claim 2, so that the position of the U-shaped connection plate and the elastic deformation when the electronic circuit package is inserted. Even if the amount of competition with the protrusion of the part is small, there is an effect that a large contact force can be obtained. For this reason, according to the present invention, even in a narrow gap between electronic circuit packages, it is possible to contact the connection contact with the U-shaped connection plate of the adjacent electronic circuit package with a strong contact force. In addition, a stable contact can be realized, and a situation in which the connection contact is dropped due to being caught by an adjacent electronic circuit package is also avoided.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams showing a front plate of an electronic circuit package and a grounding structure to an electronic circuit unit in an EMC countermeasure structure according to an embodiment of the present invention, wherein FIG.
Is a front view, and (c) is a right side view.

FIGS. 2A and 2B are examples of a front plate in an EMC countermeasure structure according to an embodiment of the present invention, wherein FIG. 2A is a front view of a lower portion of the front plate, and FIG. FIG.

FIG. 3 is a view showing an electronic circuit unit on which a plurality of electronic circuit packages each having a front plate according to an EMC countermeasure structure according to an embodiment of the present invention are mounted, (a) is a front view,
(B) is a sectional view of the upper part of the package row.

4A and 4B are diagrams illustrating a state in which a rotary connection plate comes into contact with a connection contact welded to a front plate of an electronic circuit package in an EMC countermeasure structure according to an embodiment of the present invention, and FIG. Figure, (b) is a right side view of (a),
(C) is a front view showing the non-contact state of the rotary connection plate, (d)
(C) is a right side view of FIG.

5A and 5B are diagrams showing a connection structure of a rotation fulcrum in an EMC countermeasure structure according to an embodiment of the present invention, wherein FIG. 5A is a front view, and FIG. 5B is a left side view in a non-contact state. .

FIG. 6 is a perspective view showing a conventional structure using an integrated shield cover.

FIGS. 7A and 7B are diagrams showing a conventional structure having an individual front plate type shield structure, wherein FIG. 7A is a left side view, FIG. 7B is a front view, and FIG. FIG. 2 is a cross-sectional view of a package row viewed from above for schematically explaining;

FIG. 8 is a front view showing a structure of a connection contact according to one embodiment of the present invention.

FIG. 9 is a partial cross-sectional view showing a process of welding a connection contact to an inner wall of a U-shaped connection plate according to an embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic circuit package 2 front plate 3 U-shaped connection plate 4 connection contact 5 chamfer 6 package insertion / extraction lever 7 step bending shield plate 8 rotation connection plate 9 rotation fulcrum 10 electronic circuit unit 11 package guide groove 12 base plate 13 C-shaped support plate 14 Emboss 15 Integrated shield cover 16 Shield front plate of conventional example 17 Connection contact of conventional example 18 Left end of electronic circuit unit 19 Right end of electronic circuit unit 20 Strip thick part 21 Elastic deformation part

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tohru Kishimoto Nippon Telegraph and Telephone Corporation 3-2-1, Nishishinjuku, Shinjuku-ku, Tokyo (72) Inventor Hiroki Oka 3-19, Nishishinjuku, Shinjuku-ku, Tokyo No. 2 Inside Nippon Telegraph and Telephone Corporation (72) Mitsuhiko Kawachi 3-19-2 Nishi Shinjuku, Shinjuku-ku, Tokyo Nippon Telegraph and Telephone Corporation (56) References JP-A-7-38272 (JP, A JP-A-5-63386 (JP, A) JP-A-64-13798 (JP, A) JP-A-5-183287 (JP, A) JP-A-5-59898 (JP, U) JP-A-5-9898 122493 (JP, U) Actually open 63-164290 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 7/14 H05K 9/00

Claims (3)

(57) [Claims] In a bookshelf mounting structure in which an electronic circuit package is mounted on an electronic circuit unit in a bookshelf shape, a front plate having a U-shaped cross section is provided on a front plate of the electronic circuit package.
An electrically conductive connection plate (referred to as a "U-shaped connection plate"), and a flexible connection connector on one side surface of the U-shaped connection plate.
The contact is fixed , and the connection contact is fixed in the U-shaped connection plate.
Chamfered on the end face on the side opposite to the
Cage, on the back surface of the U-shaped connection plate, extends to the rear of the ejector
Stage bending shield plate that Zaisa and is joined, a rotating connection plate where the contact with the connection contacts in accordance with the rotation has a rotation fulcrum on the base plate front surface of the electronic circuit unit, wherein the rotational connection plate the connecting With contacts
To the frame ground of the electronic circuit unit
A plurality of electronic circuit packages mounted on the electronic circuit unit are grounded.
The front plate of the cage is connected to the connection connector on the side of the U-shaped connection plate.
The electric circuit is electrically connected to each other through a tact, and is attached to one end of the electronic circuit unit.
The front panel of the sub-circuit package has its U-shaped connection
Contact contacts with the inner wall of the electronic circuit unit
To the electronic circuit unit, and
The electronic circuit package mounted on the other end of the unit
When the front plate of the U-shaped connection plate is attached,
Abuts the connection contacts installed on the circuit unit
Wherein the electronic circuit unit is grounded to the electronic circuit unit. 2. The connection contact fixed to a side surface of the U-shaped connection plate has a plurality of conductive elastically deformable portions extending in a comb-like shape from a band-shaped thick portion. A band-shaped thick portion is fixed to a side surface of the U-shaped connecting plate, and an end of the elastically deforming portion abuts on an inner wall of the U-shaped connecting plate. 2. The EMC countermeasure structure for an electronic circuit unit according to claim 1, wherein the connection contact is bent into a predetermined shape when viewed from an end face side, and the connection contact is formed with the band-shaped thick portion as a support end. 3. The electronic device according to claim 3, wherein the elastically deformable portion includes a portion bent in a V shape as viewed from the end face in the column direction, and the V shape is formed when the electronic circuit package is inserted into the electronic circuit unit. 3. The EMC countermeasure structure of an electronic circuit unit according to claim 2, wherein a top portion of the bent portion is in contact with a side surface of the U-shaped connection plate of an adjacent electronic circuit package.