JP3270224B2 - Method and apparatus for bonding display panel substrates - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a display panel which requires the first and second substrates to be bonded together with a predetermined gap provided therebetween, and a method of manufacturing the display panel. The present invention relates to a device suitable for implementation, and a liquid crystal injection method, particularly a method for bonding first and second substrates and a device suitable for the implementation, and a liquid crystal injection suitable for injecting liquid crystal into a spacerless cell. It is about the method.

[0002]

2. Description of the Related Art A liquid crystal panel, which is a type of display panel,
It is frequently used as a simple display device, and is expected as one of the leading candidates for a display device to replace a CRT (cathode ray tube). When manufacturing such a liquid crystal panel, the first and second substrates on which various components have been formed are bonded together with a sealing material while maintaining a predetermined gap between the substrates. Needs to be filled with a liquid crystal material. The bonding of the first and second substrates is as follows.
Since it is one of the important factors that affect the characteristics of the liquid crystal panel, it is necessary to perform the operation with a predetermined accuracy. Therefore, various methods for bonding the first and second substrates have been conventionally proposed.

A typical conventional method of bonding the first and second substrates for forming a liquid crystal panel includes a so-called hot press method and an optical press method. These methods are described, for example, in Document I (published by the Industrial Research Institute, Ltd.) of the applicant of this application, January 1992.
February issue, pp. 57-58).

In the former hot press method, as shown in FIG. 8 (A), (1). First, a first substrate 11 and a second substrate 13 for forming a liquid crystal panel are interposed by a spacer 15 at a predetermined position. By facing each other with the thermosetting sealing material 17 applied to the portion, a structure 19 to be bonded is obtained,
(2) Next, the structure 19 is pressed from both substrates 11 and 13 by a mechanical pressing device 21. (3) Next, the sealing material 17 is heated and cured in this pressed state. Substrate 11,
13 is bonded. Note that, in this hot press method, when it is desired to perform substrate bonding for a large number of liquid crystal panels at once, as shown in FIG. The layers sequentially laminated with a suitable spacer (not shown) interposed between the structures 19 are pressed from above and below by a mechanical press device 21 and the laminate is heated in this pressed state. There is a way to do it.

In the latter optical pressing method, as shown in FIG. 9, (1) first, a first substrate 11 for forming a liquid crystal panel is formed.
And the second substrate 13 is opposed to the second substrate 13 with the ultraviolet-curing sealing material 23 applied to a predetermined portion via the spacer 15 to obtain a structure 25 to be bonded,
(2) Next, the structure 25 is pressed against the quartz upper plate 27 by the mechanical press device 21 to apply pressure (3).
Next, in this pressurized state, ultraviolet rays 29 are irradiated onto the sealing material 23 from above the quartz upper plate 27 through the upper plate 27 to cure the sealing material 23 and bond the substrates 11 and 13 together. .

[0006]

However, the conventional substrate bonding method has the following problems.

(1) First, in the conventional hot press method,
Since the structure 19 to be bonded (see FIG. 8A) is pressurized by the mechanical press device 21, it is inevitable that FIG. As described above, a method of laminating a large number of structures 19 and pressing them is adopted, but in this case, there is a problem that both the pressurized state and the heated state tend to be different for each structure 19. is there. If the pressing state and the heating state are different for each of the structures 19, the bonding state of the substrates becomes non-uniform, thereby lowering the quality of the liquid crystal panel and lowering the manufacturing yield, while improving the throughput of the liquid crystal cell manufacturing process. Since it is essential to simultaneously bond a large number of sets of substrates, a bonding method capable of solving the above problem is desired.

(2) In the conventional optical pressing method, it is necessary to irradiate the sealing member 23 with ultraviolet rays while pressing the structure 25 to be bonded (see FIG. 9) with a mechanical pressing device. For this reason, one pressing member of the pressing device has to be constituted by the upper plate 27 made of a material that can transmit ultraviolet rays (quartz in the above example). The upper plate made of quartz is an insulator, and is a first substrate 1 for a liquid crystal panel.
1 is also a glass substrate (insulating material), and thus has a problem in that a large amount of static electricity is likely to be generated in the structure 25 during the bonding operation, which may cause the components (eg, thin film transistors) of the liquid crystal panel to be destroyed. .

(3) In any conventional method regardless of the hot press method or the optical press method, a spacer is used to set a gap between the first substrate and the second substrate to a predetermined value. . However, it is not easy to uniformly disperse the spacers between the two substrates, and it is considered that the use of no spacers can provide advantages such as improvement in image quality and simplification of the manufacturing process. It would be useful if a technique for bonding the two substrates together with a desired gap without using a spacer was established.

The present application has been made in view of such a point, and an object of the first invention of the present application is to provide a method of bonding substrates which can solve the above problems (1) and (2). Is to do. Another object of the second invention of this application is to provide a substrate bonding apparatus suitable for carrying out the first invention. It is another object of the third invention of the present application to provide a substrate bonding method capable of solving at least the above-mentioned problem (3). Also,
An object of the fourth invention of this application is to provide an apparatus suitable for implementing the third invention. Further, an object of the fifth invention of this application is to satisfactorily inject liquid crystal into the voids of a structure in which the first and second substrates for a display panel are bonded together with a predetermined void maintained without a spacer. It is to provide a way to do it.

[0011]

According to the first aspect of the present invention, a first substrate and a second substrate for forming a display panel are provided between the substrates. In the method of bonding with a sealing material while maintaining a predetermined gap, the first substrate and the second substrate in the structure to be bonded, in which the first and second substrates are configured to face each other with the sealing material interposed therebetween. Each, the surface opposite to the surface facing the other substrate, is brought into contact with a gas atmosphere that can be set to any first pressure, and the first substrate, the second substrate, and the The gap surrounded by the seal material is connected to a gas atmosphere that is cut off from the gas atmosphere set to the first pressure and can be set to any second pressure lower than the first pressure, First pressure and second pressure as described above Pressurizing the first and second substrates described above by adjusting either or both, and wherein the curing the aforementioned sealing material in the pressurizing state.

According to a second aspect of the present invention, there is provided an apparatus for bonding a first substrate and a second substrate for forming a display panel with a sealing material while maintaining a predetermined gap between the substrates. In the structure to be bonded, in which the first and second substrates are opposed to each other with a sealant interposed therebetween, on the side opposite to the surface of the first substrate and the second substrate facing the other substrate, respectively. A chamber for forming a gas atmosphere of any first pressure to be contacted, and a space surrounded by the first substrate, the second substrate, and the sealing material, and the chamber described above. A connection mechanism for connecting to a gas atmosphere of any second pressure that is shut off and lower than the first pressure, and / or both the pressure in the chamber and the second pressure in the outdoor. One of the pressures is equal to the first and A pressure adjusting mechanism for adjusting the two substrates to a pressure at which the substrate can be pressurized at a predetermined pressure, and an energy supply mechanism for supplying energy for curing the sealing material to the sealing material. Features.

In the first and second aspects of the present invention, the term "display panel" broadly means a display panel which requires the first and second substrates to be bonded together with a predetermined gap provided therebetween. For example, a liquid crystal panel, a plasma display panel, or the like can be used (the same applies to the following third and fourth inventions). Further, in the substrate bonding device of the display device of the second invention, the pressure adjusting mechanism includes a pressure device (for example, a compressor) and / or a pressure reducing device (for example, an exhaust device or a vacuum device) and a pressure regulator. (Similarly in the following fourth invention).

In the first and second inventions,
Instead of bringing both the first and second substrates in the structure to be bonded into contact with the gas atmosphere at the first pressure, only one of the substrates may be brought into contact with the gas atmosphere. In this case, the substrate on the side that is not brought into contact with the gas atmosphere at the first pressure is, for example, in a state of being brought into contact with a lower plate or the like (the lower plate mentioned here also includes the bottom surface of the pressurizing chamber). Is preferably pressurized by other suitable pressurizing means (by hydraulic, hydraulic, pneumatic, etc.). When only one of the substrates is brought into contact with the gaseous atmosphere, the substrate which is exposed to the ultraviolet rays is pressurized in the gaseous atmosphere when the ultraviolet rays are irradiated from one side which is advantageous in terms of the effect of preventing static electricity. Is good. As a specific method for bringing only one substrate into contact with the gas atmosphere, for example, FIG.
In the configuration shown in (1), one of the first chamber 71 and the second chamber 73 is not used, and a lower plate or the like is used instead. Of course, other suitable means may be taken.

[0015] The inventor of the present application has intensively studied to achieve the third object of the present invention. As a result, as described with reference to FIG. 10, these substrates 11 and 13 are simply pressed while being pressed by the upper plates 21 a and 21 b without interposing a spacer material between the first substrate 11 and the second substrate 13. In the case of bonding, it was found that remarkable interference fringes (not shown) were observed on the substrate surface of the bonded sample. This is the first and second substrates 1
The first and second substrates 11 and 13 bend under the influence of the repulsive force P _R from the sealing material 17 on the first and second substrates 13 and 13 and, furthermore, remain in this bent state (in other words, the distance between the two substrates at each location of the two substrates). It is considered that the cause is that both substrates are stuck together (with variation).

Therefore, according to the third invention of the present application, the first and second substrates to be bonded, in which the first substrate and the second substrate for forming the display panel are opposed to each other via a sealing material, are formed. In a method in which the two substrates are pressed from a surface opposite to a surface facing each other and bonded together while maintaining a predetermined gap between the two substrates, maintaining the predetermined gap is performed by maintaining the first substrate and the second substrate. By supplying a gas having an appropriate pressure opposite to the substrate surface pressure into a gap surrounded by the substrate and the sealing material. In the implementation of the third invention, together with the pressure applied to the substrate surface and the gas pressure supplied to the gap,
Preferably, a third appropriate pressure opposing the gas pressure is applied to the sealing material.

According to the fourth invention of this application, there is provided an apparatus for bonding a first substrate and a second substrate for forming a display panel with a sealing material while maintaining a predetermined gap between the substrates. A substrate pressing portion for pressing these substrates from a surface opposite to a surface of the first and second substrates facing each other, and a gap surrounded by the first substrate, the second substrate, and a sealing material. A gas supply unit for supplying gas at an arbitrary pressure opposite to the pressing force from the substrate pressing unit, and a pressure adjusting mechanism for adjusting both or one of the pressures of the substrate pressing unit and the gas supply unit And an energy supply mechanism for supplying energy for curing the sealing material to the sealing material. In the implementation of the third invention, it is preferable that the apparatus further includes a seal member pressurizing unit for supplying a third pressure, which is opposite to the gas pressure supplied from the gas supply unit, to the seal member. is there.

The method of pressing the substrate surface in the third invention and the structure of the substrate pressing section in the fourth invention are as follows.
The method is not particularly limited as long as it can press the substrate surface, and can be any method and configuration according to the design, such as a conventionally known mechanical pressing method and a method using a gas atmosphere referred to in the first invention. .

[0019]

[0020]

[0021]

[0022]

According to the structure of the first aspect, the first pressure is applied to the first and second substrates in the structure to be bonded, which are opposite to the surfaces facing the other substrate. The space surrounded by the first substrate, the second substrate, and the sealant in the structure is connected to the second pressured atmosphere. At this time, since the magnitude relation between the first pressure and the second pressure is first pressure> second pressure, the first and second substrates are pressurized so as to approach each other. The degree of pressing of the substrate can be adjusted by adjusting one or both of the first pressure and the second pressure. Therefore, the first and second substrates can be pressurized at a predetermined pressure via gas (in a state where the necessary pressurizing plate is removed by a mechanical press).

Further, according to the configuration of the second invention, the first invention can be easily implemented.

Further, according to the structure of the third invention, the first and second substrates are bonded together while supplying gas at an appropriate pressure to the space surrounded by the first substrate, the second substrate, and the sealing material. . The gas of the appropriate pressure supplied here has a role of relaxing the local repulsive force of the sealant against the substrate surface to maintain the gap of the first and second substrates where the sealant is not present at a predetermined value. Therefore, it is considered that it plays a role of a conventionally used spacer. Moreover,
By removing the gas after the bonding, a spacer-less display panel is obtained as a result.

In the third aspect of the present invention, in the configuration in which the sealing material is pressurized by the third pressure, when a gas at an appropriate pressure is introduced into a space surrounded by the first substrate, the second substrate, and the sealing material, Even when the third pressure is likely to move outward (in a direction orthogonal to the substrate pressing force) due to the gas pressure, the third pressure prevents this movement, so that the accuracy of bonding the substrates can be more easily secured.

[0026]

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the first to fifth inventions will be described below with reference to the drawings. However, the drawings used in the description schematically show the shapes, dimensions, and arrangement relations of the components so that these inventions can be understood. In each of the drawings used in the following description, the same components are denoted by the same reference numerals. In addition, duplicate description of those similar components may be omitted. In the following embodiment, an example in which the display panel is a liquid crystal panel will be described.

1. Description of First and Second Inventions 1-1. First embodiment 1-1-1. Description of Main Apparatus Configuration FIG. 1A is a top view for explaining a first embodiment, and FIG.
(B) is shown in the above top view, but I in FIG.
FIG. 4 is a side view including a cross-sectional view taken along line -I. In both figures,
The structure 43 to be bonded (hereinafter referred to as “structure 4
3 ". 1) shows a state where the substrate is mounted in the chamber 45 of the substrate bonding apparatus of the first embodiment. Note that, in this case, the structure 43 to be bonded is
The first and second substrates 31 and 33 on which necessary components (not shown) (for example, switching elements, electrodes, alignment films, etc.) are formed are placed in a state where a sealing material 37 is applied to a predetermined portion via a spacer 35. They are prepared by facing each other and temporarily fixing the substrates 31 and 33 with a fixture 39 and a connection mechanism 41 (both will be described in detail later).

Here, the sealing material 37 is applied to one of the first and second substrates 31 and 33 by a suitable method such as a screen printing method (for example, FIG. 1A).
(The pattern shown in FIG. 3). Specifically, it is applied along the edges of the first and second substrates,
Further, in order to fill the liquid crystal later, a part of the edge of the substrate is applied so that the sealing material is not applied. This sealing material 3
The portion 37a not coated with 7 serves as a communication port for connecting a gap surrounded by the first and second substrates 31, 33 and the sealing material 37 to a gas atmosphere which can be set to the second pressure in the present invention. It will be used later (details will be described later).

The structure of the connecting mechanism 41 and the fixing tool 39 is as described below in this case, and these can be used as follows in this case. These will be described with reference to FIGS. 1, 2A and 2B. Here, FIG. 2A is an explanatory diagram of a procedure for forming the structure 49, and FIG. 2B is a connection mechanism 41 of the first embodiment.
FIG. 4 is a plan view showing the device viewed from the side where it comes into contact with the first and second substrates 31 and 33 thereof.

The connection mechanism 41 in the case of the first embodiment comprises:
As shown in FIG. 1B or FIG. 2B, a portion 37a to which the sealing material 37 is not applied (see FIG. 1A)
And the first and second substrates 31 and 3
It is intended to be installed over three spaces. The connection mechanism 41 is connected to the first and second substrates 31 and 3.
3 and a holding portion 41a for temporarily fixing these substrates.
And a tubular portion 41b for connecting a communication port (also referred to as a gap) 37a (see FIG. 2A) surrounded by the first and second substrates 31, 33 and the sealing material 37 to the outside of the chamber 45. Is provided. The holding portion 41a can hold the first and second substrates 31 and 33 in their thickness direction (the state of FIG. 1B), and releases the holding posture by, for example, an action of an operator (FIG. 2 ( (A)) (for example, a configuration like a clothespin). In addition, the tubular portion 4
1b has a tubular portion 41b
An airtight holding member (packing) 41c (shown with diagonal lines in FIG. 2B) for the purpose of airtightly connecting the air gap 37a on the substrate side with the air gap 37a is provided. In addition, fixture 3
9 is a connection mechanism 4 for the first and second substrates 31 and 33.
It is provided at a well-balanced position different from the position where 1 is fixed. The fixing device 39 can of course use the connection mechanism 41, but the tubular portion 41b and the airtight holding member 41c are unnecessary for the purpose of the fixing device 39 in the first place. 4
Except for 1c, the hollow portion of the tubular portion is made solid.

Then, the first and second substrates 31, 33
The fixing member 39 and the connection mechanism 41 are applied to a state in which the sealing material 37 is applied to both or one of them as predetermined, and the substrates are opposed to each other via the spacer 35 in a state where the holding portion 41a is spread. Contact, and then the holding portion 4
1a is returned to the position of the holding state. Thereby, the structure 43
Is obtained.

It is preferable that the fixing tool 39 and the connection mechanism 41 are made of a conductive material. And the fixture 3
9 and the connection mechanism 41 are preferably grounded. The reason is that static electricity may be generated in the structure 43 during the bonding operation of the substrates, and this static electricity may cause damage to the components (for example, thin film transistors) of the liquid crystal panel. However, in the case of the bonding method of the present invention, the first and second substrates 3
Since pressurization of 1, 33 can be performed by the pressure of gas (details will be described later), the generation of static electricity is significantly reduced as compared with the case where the upper plate of the press is a quartz plate described with reference to FIG. Therefore, it is considered that it is not always necessary to configure the fixing tool 39 and the connection mechanism 41 with a conductive material or ground them.

On the other hand, the chamber 45 is not limited to this. For example, as shown in a perspective view in FIG. 3, the upper part 45a and the lower part 45d are a box body and hinge means 45e.
It can be composed of a box connected via a. The upper part 45a and the lower part 45d have airtight holding members (packing) 45b or 45c on the opposing part side thereof, and a concave part in which a part of the fixing tool 39 or the connection mechanism 41 is fitted in a predetermined part. 45f, and both parts 45a,
5d is fixed at the time of work, and 45 g of fixing means is provided so that the inside of the chamber 45 can be made a substantially closed system from the outside. The replacement of the sample to be bonded to the substrate can be performed by releasing the fixing means 45g and moving the upper portion 45a upward to open the chamber 45.

In the configuration of the first embodiment described with reference to FIGS. 1 to 3, the interior of the chamber 45 can be a gas atmosphere which can be set to an arbitrary first pressure according to the present invention.
5 The outside can be a gaseous atmosphere that can be set to any second pressure lower than the first pressure. Therefore, in the case of this embodiment, a pressure adjusting mechanism 51 is connected to the chamber 45 in order to set the inside of the chamber 45 to an arbitrary first pressure. In this embodiment, the pressure adjusting mechanism 51 is provided with a compressor 51a having a suitable pressure adjusting function such as a pressure control valve, and a pipe 51 connecting the compressor 51a and the chamber 45.
b. If the compressor 51a is configured to be able to heat the gas output from the compressor 51a, it is convenient, for example, when the sealing material used for bonding the substrates is a thermosetting material. is there. Further, the pipe 51b is connected to the upper part 45 of the chamber 45.
Considering the opening and closing of a, it is preferable to make it flexible. When the second pressure needs to be lower than the atmospheric pressure, an exhaust device connected to the connection mechanism 41 may be added to the pressure adjustment mechanism 51.

In this embodiment, a suitable position (the wall of the chamber 45 in this example) which is inside the chamber 45 and which is above the first substrate 31 and below the second substrate 33, respectively.
Further, an energy supply mechanism 53 for supplying energy for curing the sealing material 37 to the sealing material 37 is provided.
The energy supply mechanism 53 may have a suitable energy source according to the type of the sealing material 37. If the sealing material 37 is of a thermosetting type, the sealing material 37 may include a heater (arbitrary things such as a heater itself or a plate in which a heater is embedded; the same applies hereinafter), and the sealing material 37 may be of an ultraviolet curing type. For example, it may include an ultraviolet lamp and a heater as necessary.

The configuration of the apparatus according to the first embodiment is not limited to the example shown in FIGS. For example, FIG.
As shown in (A), when the wall of the chamber 45 is made of a material that can transmit energy for curing the sealing material 37, the energy supply mechanism 53 is provided at a suitable position outside the chamber 45. It is also possible. FIG.
As shown in (B), the chamber 45 itself is configured to be able to store the entire structure 43 to be bonded, and has a flexible tube 61 that connects the inside and outside of the chamber 45 to the wall of the chamber 45. It is also possible to use a room with a different configuration. FIG.
In (B), 63 is a pedestal on which the structure 43 is placed. In the case of the configuration shown in FIG. 4B, by connecting the tubular portion 41b of the connection mechanism in the structure to be bonded accommodated in the chamber 45 to the flexible tube 61,
A space 37 a (see FIG. 2A) surrounded by the first and second substrates 31 and 33 and the sealing material 37 can be connected to the outside of the chamber 45.

1-1-2. Mainly Principle Description of Bonding Method In the configuration of the first embodiment, in the structure 43 to be bonded, a gap 37 a surrounded by the first and second substrates 31 and 33 and the sealing material 37 (FIG. A))
Is connected to the outside of the chamber 45 by the connection mechanism 41 (in the example of FIG. 4B, by the connection mechanism 41 and the flexible pipe 61), so that the pressure in the gap 37a becomes almost atmospheric pressure. On the other hand, the compressor 51 of the pressure adjusting mechanism 51
When a gas, for example, air is sent into the chamber 45 by a, the chamber 45 is in a substantially airtight state, so that the internal pressure of the chamber 45 increases and the pressure in the chamber becomes higher than the atmospheric pressure. Therefore, room 4
5 and the gap 37a, a pressure difference is generated between the first and second substrates 31 and 33 in the structure 43 to be bonded. By adjusting this pressure difference, the distance between the first and second substrates 31, 33 can be controlled. As described above, according to the present invention, both the substrates 31 and 33 in the structure 43 to be bonded can be pressurized by the gas pressure. That is, both the substrates 31 and 3 are pressed without mechanically bringing the pressing plate into contact with the first and second substrates 31 and 33.
3 can be pressurized.

This is because when a large number of sets of substrates are simultaneously bonded, for example, as shown in FIG.
Is large enough to accommodate a large number of structures 43 (many sets of substrates), and even if the structures 43 are installed in an isolated state inside the chamber 45 (that is, FIG. 8B). Each of the structures 43 is not stacked (as described in the above).
It means that each substrate can be bonded. Therefore, compared to the case of FIG. 8B, the first and second substrates of each structure 43 can be pressed under substantially the same conditions. Further, assuming that the sealing material used in each structure 43 in FIG. 5 is a thermosetting material, each structure can be heated by supplying warm air into the chamber 45, and
Each structure can be heated under substantially the same heating conditions as compared to the case of FIG.

1-2. Second Embodiment In the above-described first embodiment, an example in which the structure 43 is substantially entirely housed in the chamber 45 that can be set to the first pressure has been described. But,
The present invention is not limited to the example of the first embodiment, and the first and second substrates for forming a display panel can be set to the first pressure only on the surface opposite to the surface facing the other substrate. Of course, a configuration in which it is brought into contact with the atmosphere may be used. The second embodiment is a specific example. FIG. 6 is a diagram provided for the explanation, and is a side view shown in a state similar to FIG.

In the second embodiment, first and second chambers 71 and 73 are prepared. Each of the chambers 71 and 73 has a structure in which a box is split from half. Then, the first chamber 71 is interposed via the airtight holding member 75 so that the internal space of the first chamber 71 contacts the surface of the first substrate 31 opposite to the surface facing the second substrate 33. The lever is placed on the first substrate 31. Further, a second chamber 73 is provided on the surface of the second substrate 33 opposite to the surface facing the first substrate 31.
The second chamber 73 is set on the second substrate 33 via the airtight holding member 75 so that the internal space of the second substrate 73 comes into contact.
The first chamber 71 and the second chamber 73 are, for example, band-shaped so that the edges of these walls are in good contact with the first substrate 31 or the second substrate 33 via the airtight holding member 75. It is fixed by fixing means 77. Then, the pressure adjusting mechanism 51 is operated to set the pressure in the first and second chambers 71 and 73 to a predetermined pressure equal to or higher than the atmospheric pressure. Also in the case of the second embodiment, similarly to the first embodiment, there is a difference between the pressure in the chambers 71 and 73 and the pressure in the gap 37a in the structure 43 to be bonded. The first and second substrates 31, 33 can be pressurized by gas.
FIG. 6 shows an example in which the connection mechanism 41 is connected to the substrates 31 and 33. However, in the second embodiment, the connection mechanism 41 is not always necessary, and the fixture 39 may be used in this portion. In the second embodiment, the substrate 3
This is because only the specific surfaces 1 and 33 are housed in the room 71 or the room 73, so that the gap 37a is already exposed to the outside of the room 71 or the room 73. Rather, in the second embodiment, the size of the first and second chambers 71 and 73, the walls of these chambers, and the airtight holding member 75 make the connection mechanism 4
1 can be said to be configured.

In the above description, the embodiment of the method for bonding the substrates of the display panel of the present invention and the apparatus suitable for carrying out the method have been described. However, the present invention is not limited to the above-described embodiment.

For example, in the above-described embodiment, the first pressure is set to a pressure higher than the atmospheric pressure, and the second pressure is set to the atmospheric pressure. However, these pressures are not limited to this example. For example, the second pressure can be an appropriate pressure lower than the atmospheric pressure. In some cases, both the first and second pressures may be set to be equal to or lower than the atmospheric pressure.

The fixing device 39, the connection mechanism 41, the chamber 4
5. The shape and configuration of each of the pressure adjusting mechanisms 51 are not limited to those in the embodiment, but may be any suitable ones according to the design.

In the above embodiment, the first and second substrates are used for forming one display panel. However, as shown in FIG. 7, the first and second substrates are formed as shown in FIG. In the case where a large number of display cells are obtained (four in the example of FIG. 7), the pattern of the sealing material 37 is different from the original pattern of the sealing material 37.
It is preferable to provide a second pattern 81 corresponding to the pattern of the sealing material in the case of single-piece as shown in (A) between the first and second substrates. The reason is that when a large number of display panels are used, gaps 37v, 37w, 37x, 37z for each display panel are formed between the first and second substrates 31, 33, and these gaps are exposed to an atmosphere of a second pressure. Although the connection is difficult, if the second pattern 81 is provided, the gaps 37v to 37z for each display cell can be easily connected to the gas atmosphere of the second pressure in the manner of the first embodiment. That is because

In the first embodiment, the sealing material 37 is used.
Since the first pressure is applied also from the lateral direction, there is a risk that the sealing material 37 is pushed from the edge of the substrate toward the center of the substrate. If it is necessary to avoid this, the periphery of the edge of the structure 43 to be bonded (excluding the connection mechanism 41 and the fixing tool 39) may be covered by some method.

2. Description of Third and Fourth Inventions Next, a method of bonding both substrates while maintaining a predetermined gap between the first substrate and the second substrate without interposing a spacer between the two substrates (No. Embodiments of the (third invention) and the apparatus (fourth invention) will be described together. FIG. 11 is a diagram provided for the description, and is a plan view showing a configuration of a bonding apparatus 100 corresponding to an embodiment of the fourth invention together with a structure 150 to be bonded, and a cross-sectional view taken along line II. is there. However, in the plan view, some of the components shown in the cross-sectional view, such as the upper plate of the substrate pressing unit, are not shown. Further, while the structure 43 to be bonded in the first invention has a spacer interposed between the two substrates, the structure 15 to be bonded in the third invention has
Numeral 0 indicates that the first substrate 31 and the second substrate 33 for forming the display panel are opposed to each other via the sealing material 37 without using a spacer. The application position of the sealing material 37 is the same as that of the structure of the first invention. Therefore, the structure 15
0 has a portion 37a in which the sealing material 37 is not interposed for the purpose of enclosing the liquid crystal, as in the case of the first invention.

The bonding apparatus 100 of this embodiment adds the substrates 31 and 33 from the surface of the structure 150 to be bonded from the surface opposite to the surface of the first substrate 31 and the second substrate 33 facing each other. A substrate pressurizing unit 102 for pressurizing, and a gas at an arbitrary pressure opposite to a pressing force from the substrate pressurizing unit to a gap S surrounded by the first substrate, the second substrate, and the sealant. And a pressure adjusting mechanism 102c, 104b for adjusting one or both of the pressures of the substrate pressurizing unit 102 and the gas supplying unit 104, and the energy for curing the sealant 37. And an energy supply mechanism 106. Further, the bonding apparatus 100 of this embodiment
There is provided a sealing member pressurizing unit 108 for supplying a third pressure to the sealing member 37 opposite to the gas pressure supplied from the gas supply unit 104.

Here, in this case, the substrate pressing unit 102
Lower plate 102 for placing structure 150 to be bonded
b, upper plate 102a for pressing the bonded structure
While applying a predetermined pressure to the upper plate 102a.
2a. If an ultraviolet-curable adhesive is used as the sealing material 37, the upper plate 102a is preferably made of a material having a high ultraviolet transmittance, for example, quartz. The pressure adjusting mechanism can be constituted by a press device using, for example, hydraulic pressure, hydraulic pressure, pneumatic pressure, or the like. Or, a motor or the like for moving the upper plate 102a,
A pressure sensor for sensing the pressure of the upper plate 102a against the structure 150 to be bonded and / or a position sensor for detecting the distance between the first and second substrates in the structure 150; It may have a configuration capable of appropriately pressing the substrate 150. Of course, the substrate pressing unit 102 may be a device (a device of the second invention) capable of performing the pressing method of the first invention (a method using a gas atmosphere).

The gas supply unit 104 is provided with a suitable gas source such as an inert gas, a pressure regulating valve, and a gap S.
A pressure adjusting mechanism 104b having an exhaust device for exhausting the gas once introduced to the substrate, and a substrate 37 via a portion 37a of the structure 150 to which the sealing member 37 is not provided with the sealing material 37 provided with the mechanism 104b. A connection mechanism 104a for surely supplying the air to the gap S is provided. The connection mechanism 104a can have any suitable configuration.

Further, the energy supply mechanism can be optional depending on the type of sealing material used. When an ultraviolet-curable adhesive is used as the sealing material, an ultraviolet light source may be used.

Further, in this case, the sealing member pressing section 108 is for covering the side of the structure 150 to be bonded so that the third pressure can be applied to the sealing member 37 from the side. Cover member 108a, bellows 108b
, A seal portion 108c, and a pressure adjusting mechanism 108d for adjusting the third pressure. The pressure adjusting mechanism 108d includes a suitable gas source such as an inert gas and a pressure adjusting valve. The covering member 108a has an opening 108e for supplying gas supplied from the pressure adjusting mechanism 108d to the inside of the covering member 108a. The bellows 108b is provided in consideration of the vertical movement of the upper plate of the substrate pressing unit 102. Further, the seal portion 108c is provided for the purpose of maintaining airtightness in the cover member 108a.

In the bonding method according to the third embodiment of the present invention, when bonding the structure 150 to be bonded while maintaining a predetermined gap between the first and second substrates 31 and 33, Maintaining the air gap is the first substrate 3
First, gas is supplied to the gap S surrounded by the second substrate 33 and the sealing material 37 by the gas pressurizing unit 104 at an appropriate pressure. Although various procedures are conceivable, for example, the following procedure can be adopted.

First, the upper plate 1 of the substrate pressing section 102 is set so that the distance between the first and second substrates 31 and 33 becomes a predetermined value.
The first and second substrates 31 and 33 are pressurized by applying pressure to 02a by the pressure adjusting mechanism 102c. After the pressurization by the substrate pressurization unit 102 or in parallel with the pressurization of the substrate pressurization unit 102, the gas supply unit 104 is operated to be surrounded by the substrates 31 and 33 and the sealing material 37. A suitable gas such as an inert gas is supplied into the gap S at a predetermined pressure and flow rate. This condition is set so as to prevent the occurrence of bending in both substrates and to set the gap between both substrates to a predetermined value, and it is preferable to determine the conditions in advance according to the scale and shape of the panel. It is. Further, in this embodiment, a pressure opposing the pressure of the gas supply unit 104 can be generated by appropriately operating the sealant pressing unit 108. The pressure P _{A of} the gas supplied from the gas supply unit 104 into the gap S (see FIG. 11) may be changed depending on the case.
7 may be moved laterally from the gap S side, and there is a risk that the first and second substrates may be displaced. In such a case, it is preferable because by operating the sealing member pressing 108 can stop the movement of the transverse sealing material 37 is supplied to the third pressure P _B from the sealing material pressurizing portion 108.

If the distance between the substrates 31 and 33 deviates from a predetermined value, the pressure between the substrate pressing unit 102 and the gas supply unit 104 is adjusted as needed.

Next, the energy supply mechanism 106 is operated for a required time to cure the sealing material 37. When the sealing material 37 is cured, if the internal pressure of the gap S fluctuates due to the influence of heat generation or the like and there is a danger that the gap between the substrates 31 and 33 fluctuates, the pressure in the gap S is reduced by the pressure adjusting mechanism 104b. Control promptly.

When the curing of the sealing material 37 is completed, the gap S
The gas introduced inside is exhausted by an exhaust device provided in the pressure adjusting mechanism 104b. This is because the portion 37a to which the sealing material 37 is not applied has a generally small area, so that the gas introduced into the gap S is not easily removed to the outside unless forcedly removed. Then, the substrate pressing unit 102
The substrate pressurization by is ended.

In order to take out the bonded sample from the apparatus 100, in the case of this apparatus 100, FIG.
As shown in the figure, the seal portion 108c is removed from the lower plate 102b, and the upper plate 102a, the cover member 108a, and the connection mechanism 1
04a and the like are separated from the lower plate 102b. And FIG.
A sample may be taken as shown in FIG. The installation of a new structure to be bonded to the bonding apparatus 100 may be performed in a procedure reverse to the above-described removal procedure.

Although the third and fourth embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.

In the third and fourth embodiments of the present invention, an example has been described in which the third pressure opposing the pressure of the gas supply unit 104 is supplied by the sealing material pressing unit 108. Depending on the application area of the material, there is a case where there is no danger of lateral movement of the sealing material. In that case, there is no need to pressurize the sealing material with the third pressure. In that case, the sealing member pressurizing section 108 may be removed from the bonding apparatus. FIG.
An example is shown below.

The bonding procedure described in the third embodiment of the present invention is merely an example. Therefore, pressurization by the substrate pressurization unit 102, pressurization by the gas supply unit 104,
Timing of pressurization by the sealing material pressurizing unit 108,
The timing of exhausting the gas from the gap S after bonding is not limited to the above example, and can be changed according to the design of the display panel and the like.

Further, it is apparent that the specific configurations of the substrate pressing unit 102, the gas supply unit 104, the energy supply mechanism 106, and the sealing material pressing unit 108 described in the fourth embodiment of the present invention can be changed according to the design or the like. It is.

[0063]

[0064]

[0065]

[0066]

[0067]

[0068]

[0069]

[0070]

[0071]

As is apparent from the above description, according to the method for bonding substrates of a display panel of the first invention of this application, at least one of the first and second substrates in the structure to be bonded. Can be pressurized via a gas (with the press plate required by a mechanical press removed). For this reason, even when it is desired to process a large number of structures to be bonded by a simultaneous bonding operation, each of the structures is processed as shown in FIG.
Since it is possible to apply pressure in an isolated state without using the laminated structure described with reference to (B), it can be expected that each sample can be pressed with a uniform pressure as compared with the related art, and that each sample can be heated more uniformly than before. . Further, even when an ultraviolet-curable sealing material is used, the sample can be pressurized without using a quartz upper plate, so that the problem of static electricity, which has been a problem in the past, can be expected to be prevented or reduced as compared with the conventional case.

Further, according to the device of the second invention of this application, the bonding method of the first invention can be easily implemented.

Further, according to the method of bonding the substrates of the display panel of the third invention of the present application, while supplying gas at an appropriate pressure to the space surrounded by the first substrate, the second substrate and the sealing material. The first and second substrates are bonded together. The gas of the appropriate pressure supplied here plays the role of a conventionally used spacer. Then, after the bonding is completed, this gas can be removed. For this reason, a spacer-less display panel can be obtained.

Further, according to the device of the fourth invention of this application, the bonding method of the third invention can be easily implemented.

[0075]

[Brief description of the drawings]

1 (A) and 1 (B) show the first and second aspects of the present invention.
It is a figure (the 1) used for explanation of an example, and is a top view showing the relation between a structure to be pasted, a pasting device, etc., and a side view using a partial sectional view.

FIG. 2 (A) and (B) are the first and second aspects of the present invention.
FIG. 9 is a diagram (part 2) used for explaining the embodiment, and is an explanatory diagram of a procedure for preparing a structure to be bonded and an explanatory diagram of the connection mechanism 41.

FIG. 3 is a diagram (part 3) for explaining the first embodiment of the first and second inventions, and is a perspective view for explaining a chamber provided in the bonding apparatus.

FIG. 4 (A) and (B) are the first and second aspects of the invention.
It is FIG. (4) provided for description of an Example, and is an explanatory view of a modification.

FIG. 5 is a diagram (No. 5) used to explain the first embodiment of the first and second inventions, and is a diagram showing an example in which a large number of sets of substrates are bonded.

FIG. 6 is a diagram provided for explanation of a second embodiment of the first and second inventions.

FIG. 7 is an explanatory view of a modified example of the first and second inventions, and shows a preferred pattern example of a sealing material when a large number of display panels are formed from the first and second substrates bonded together. FIG.

FIGS. 8A and 8B are diagrams for explaining a conventional method of bonding substrates by a hot press method.

FIG. 9 is a diagram provided for explanation of a conventional substrate bonding method using an optical pressing method.

FIG. 10 is an explanatory diagram of a problem in a case where a spacer is not used (a case where a spacer is not used) in a conventional technique (a conventional bonding method).

FIG. 11 is an explanatory diagram for explaining an embodiment of the third and fourth inventions.

FIGS. 12A and 12B are diagrams showing an example of a work procedure according to the third invention.

FIG. 13 is an explanatory diagram of another example of the third and fourth inventions.

[Explanation of symbols]

 31: First substrate 33: Second substrate 35: Spacer 37: Sealing material 37a: Communication port (portion without sealing material) 37v to 37z: Void 39: Fixing tool 41: Connection mechanism 41a: Clamping part 41b: Tubular Part 41c: Airtight holding member 43: Structure to be bonded 45: Chamber 45a: Upper part of the chamber 45b, 45c: Airtight holding member 45d: Lower part of the chamber 45e: Hinge means 45f: Recess 45g: Fixing means 51: Pressure adjusting mechanism 51a: Compressor 51b: Piping 53: Energy supply mechanism 61: Flexible pipe 71: First chamber 73: Second chamber 75: Airtight holding member 77: Fixing means 81: Second pattern of sealing material 100 : Bonding device of the fourth invention 102: Substrate pressing unit 104: Gas supply unit 106: Energy supply mechanism 108: Sealing material pressing unit

Continuation of front page (56) References JP-A-59-57221 (JP, A) JP-A-1-257824 (JP, A) JP-A-63-163423 (JP, A) JP-A-1-248132 (JP, A) , A) JP-A-2-124525 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02F 1/13

Claims (14)

(57) [Claims] 1. A structure to be bonded, in which a first substrate and a second substrate for forming a display panel are opposed to each other with a sealant interposed therebetween, is attached to a surface of the first and second substrates facing each other. Is pressurized by the first pressure applied from the opposite side,
And in the method of bonding while maintaining a predetermined gap between both substrates, maintaining the predetermined gap, the first substrate, the second substrate and the space surrounded by the sealing material to the substrate surface pressing force A method of attaching a substrate for a display panel, comprising: applying an appropriate second pressure opposing the second pressure; and applying an appropriate third pressure opposing the second pressure to the sealing material. 2. A method for bonding a first substrate and a second substrate for forming a display panel with a sealing material while maintaining a predetermined gap between the substrates, wherein the first and second substrates are bonded with the sealing material. In the structure to be bonded and configured to face each other, the first substrate and the second substrate can be set to an arbitrary first pressure on the side opposite to the surface facing the other substrate. The first substrate, the second substrate and the gap surrounded by the sealing material are in contact with a gas atmosphere, and are cut off from the gas atmosphere set to the first pressure and lower than the first pressure. Connect to a gas atmosphere that can be set to any second pressure, pressurize the first and second substrates by adjusting both or one of the first pressure and the second pressure,
In addition, an appropriate third pressure opposite to the second pressure is applied to the sealing material, and the sealing material is cured in the pressurized state. 3. The method for bonding substrates of a display panel according to claim 2, wherein the gas atmosphere of the first pressure is formed by a pressurized chamber capable of storing the structure to be bonded. A method of bonding substrates for a display panel, wherein the gas atmosphere of the second pressure is formed by connecting the gap to an atmosphere outside the pressurizing chamber. 4. The method for bonding substrates of a display panel according to claim 2, wherein the first pressure gas atmosphere is the other of the first and second substrates in the structure to be bonded. A method for bonding a substrate of a display panel, the method comprising: independently contacting a surface opposite to a surface facing a substrate with a gas atmosphere. 5. The method for bonding a substrate of a display panel according to claim 4, wherein the first and second substrates are independently brought into contact with a gas atmosphere, respectively. A method for bonding substrates of a display panel, wherein the pressure is different from a gas atmosphere in contact with the two substrates. 6. The method for bonding a substrate of a display panel according to claim 2, wherein the first pressure is higher than the atmospheric pressure, and the second pressure is the atmospheric pressure or the atmospheric pressure. A method for bonding a substrate of a display panel, wherein the pressure is lower than that. 7. The display panel substrate according to claim 2, wherein the first and second substrates are grounded. 7. The display panel substrate according to claim 2, wherein the first and second substrates are grounded. Bonding method. 8. The method for bonding substrates of a display panel according to claim 2, wherein instead of bringing both the first and second substrates into contact with the gas atmosphere at the first pressure, one of the first and second substrates is attached to the other. A method for attaching a substrate of a display panel, wherein the substrate is brought into contact with a gas atmosphere. 9. An apparatus for bonding a first substrate and a second substrate for forming a display panel with a sealing material while maintaining a predetermined gap between the substrates, wherein the first and second substrates are bonded to each other. A substrate pressing portion for a first pressure for pressing these substrates from a surface opposite to a surface facing the substrate, and pressing the substrate into a gap surrounded by the first substrate, the second substrate, and a sealing material. A gas supply unit for supplying gas for an arbitrary second pressure opposite to the pressing force from the unit, and a pressure adjustment for adjusting both or one of the pressures of the substrate pressurizing unit and the gas supply unit. A mechanism, a sealing member pressurizing unit for supplying a third pressure opposite to the gas pressure supplied from the gas supply unit to the sealing member, and an energy for curing the sealing member. Energy supply mechanism and Bonding apparatus of the substrate of the display panel, characterized in that comprises. 10. The bonding apparatus for a display panel substrate according to claim 9, wherein the energy supply mechanism is at least one selected from a heater, a hot air device, and an ultraviolet light source according to the type of the sealing material. A bonding device for a substrate of a display panel, wherein the bonding device includes a mechanism including: 11. An apparatus for bonding a first substrate and a second substrate for forming a display panel with a sealing material while maintaining a predetermined gap between the substrates, wherein the first and second substrates are sealed. The first substrate and the second substrate in the structure to be bonded are configured to face each other via a material, and are brought into contact with surfaces of the first substrate and the second substrate that are opposite to the other substrate, respectively. A chamber for forming a gaseous atmosphere, and any second lower than the first pressure, wherein a gap surrounded by the first substrate, the second substrate, and the sealant is shut off from the chamber. A connection mechanism for connecting to a gaseous atmosphere of pressure, and a pressure of both or one of the first pressure inside the room and the second pressure outside the room at a predetermined pressure. So that it can be pressurized A pressure adjusting mechanism for adjusting the pressure, a sealant pressing unit for supplying a third pressure opposite to the second pressure to the sealant, and an energy for curing the sealant. An apparatus for bonding a substrate of a display panel, comprising an energy supply mechanism for supplying the substrate. 12. The bonding apparatus for a substrate of a display panel according to claim 11, wherein the connection mechanism sandwiches the first and second substrates and a holding portion for temporarily fixing the substrates, and the gap includes: And a tubular portion for connecting to the gas atmosphere of the second pressure outside the room. 13. The apparatus for bonding substrates of a display panel according to claim 11, wherein at least a portion of the connection mechanism that is in contact with the first substrate or the second substrate is made of a conductive material. An apparatus for bonding a substrate of a display panel, comprising: 14. The apparatus for bonding substrates of a display panel according to claim 11, wherein the chamber is a chamber for bringing only one of the first and second substrates into contact with the gas atmosphere at the first pressure. An apparatus for bonding a substrate of a display panel.