JP3261962B2 - Manufacturing method of piezoelectric electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a piezoelectric electronic component in which a piezoelectric vibrator is supported by a holding frame so as to vibrate.

[0002]

2. Description of the Related Art Conventionally, as a piezoelectric electronic component of this type, as shown in FIG.
Are formed, and a pair of holding frame members that support the center portion 2b so that the center portion 2b can be vibrated by sandwiching and bonding each end 2a of the piezoelectric vibrator 2 from the main surface side. 3 and a pair of case bodies 5 that house the piezoelectric vibrating body 4 with the piezoelectric vibrating body 4 interposed therebetween.

[0003] Such a piezoelectric electronic component is generally manufactured according to the procedure shown in FIG.
That is, first, the vibrating electrode 1 is placed on the opposing main surface.
The piezoelectric vibrator parent substrate 7 on which the electrode patterns 6 to be formed are formed, respectively, and a pair of holding frame parent substrates 9 having the longitudinally continuous convex portions 9a formed at both ends of the inner surface.

Then, the piezoelectric vibrator master substrate 7 is sandwiched between the holding frame master substrates 9, and the convex portions 9 a of each of the holding frame master substrates 9 are positioned on the main surface of the piezoelectric vibrator master substrate 7. After that, these parent substrates 7,
9 is adhered by an adhesive (not shown) such as an epoxy resin. Further, the structure body 10 is formed by pressing the holding frame main substrate 9 against the piezoelectric vibrator main substrate 7 and curing the adhesive while pressing the adhesive. Thereafter, the structure 10 is cut along a cutting line S set in parallel with the width direction of the structure 10 to form the piezoelectric vibrator 4 as shown in FIG. A plurality of piezoelectric vibrators 4 which are integrated with the holding frame 3 are manufactured.

[0005] Then, the piezoelectric vibrator 4 is sandwiched between the piezoelectric vibrators 4 configured as described above, and a pair of case bodies 5 are adhered to complete the piezoelectric electronic component.

[0006]

The piezoelectric electronic component manufactured in this manner has a variation in resonance frequency for each of the piezoelectric resonator parent substrates 7. The piezoelectric electronic component is formed because the resonance frequency varies in each of the longitudinal portions, and the variation in processing accuracy of the holding frame parent substrate 9 (in particular, the processing accuracy of the convex portion 9a) affects the resonance frequency. There is a problem that the characteristics vary greatly from one to another, and the yield is poor.

The present invention has been made in view of such inconveniences, and has as its object to suppress fluctuations in resonance frequency, homogenize characteristics, and improve the yield.

[0008]

In order to achieve the above object, according to a first aspect of the present invention, each end of a piezoelectric vibrator is held by a holding frame from a main surface side. a method of manufacturing a piezoelectric electronic component the central portion of the vibrator formed by vibratable support, resonant periphery of the piezoelectric vibrator
Measure the wave number and make sure that the resonance frequency is higher than the desired frequency range.
In the case of the wave number range, the resonance frequency matches the desired frequency range
Frame with a smaller clamping width than in the frequency range
While the resonance frequency is lower than the desired frequency.
Frequency range, the resonance frequency should be within the desired frequency range.
Retention with wider clamping width than in matching frequency range
It is characterized in that it is held by the frame .

In the first invention, when the resonance frequency of the piezoelectric vibrator is higher than a desired value, the holding width is narrowed, and when the resonance frequency of the piezoelectric vibrator is lower than a desired value. It is preferable to increase the holding width.

In the second invention, a parent substrate for a piezoelectric vibrator,
It has a convex portion that is continuous in the longitudinal direction at each end of one surface
Prepare a pair of holding frame parent substrates, and
One side of the parent substrate for the holding frame, on each side of the parent substrate
After forming the structure by symmetrically facing each other,
By cutting the structure along the width direction, piezoelectric vibration
A piezoelectric electronic component that supports the
A method of manufacturing a plurality of piezoelectric vibrator parent substrates.
For each part along the hand direction, the resonance frequency is
For the part higher than the resonance frequency range
Holding frame than the part whose number is in the desired resonance frequency range
While reducing the width of the convex part of the mother board, the resonance frequency
For parts below the desired resonance frequency range,
Retain more than the part where the frequency is in the desired resonance frequency range
It is characterized in that the width of the convex portion of the frame parent substrate is increased .

In the second aspect of the present invention, it is preferable that the holding width of the protruding portion is narrowed at the center in the longitudinal direction of the parent substrate for the holding frame, while it is wide at both ends in the longitudinal direction.

[0012]

According to the first aspect of the invention, if the holding width of the end of the piezoelectric vibrator by the holding frame is changed, the resonance frequency of each piezoelectric vibrator changes in conjunction with the fluctuation of the holding width. Therefore, when there is a difference between the resonance frequency of each piezoelectric vibrator and a desired resonance frequency, the resonance frequency can be adjusted to a desired value by changing the holding width so as to eliminate the difference. For example, when the resonance frequency of the piezoelectric vibrator is higher than a desired value, the holding width is narrowed, and when the resonance frequency of the piezoelectric vibrator is lower than the desired value, the holding width is widened.

According to the second invention, as in the first invention,
By changing the holding width of the piezoelectric vibrator end by the holding frame,
The resonance frequency of each piezoelectric vibrator changes in conjunction with the change in the holding width. Therefore, when the piezoelectric vibrator parent substrate has a variation in the resonance frequency along the longitudinal direction, the width of the convex portion is changed so as to eliminate the variation, and the respective portions of the piezoelectric vibrator parent substrate are changed. Variation in resonance frequency can be adjusted. For example, in a piezoelectric vibrator parent substrate, the resonance frequency at the center in the longitudinal direction increases, while the resonance frequency at both ends in the longitudinal direction decreases. In such a case, while reducing the width of the protruding portion at the center in the longitudinal direction of the holding frame parent substrate, while increasing the width of the protruding portion at both ends in the longitudinal direction, the piezoelectric vibrator parent substrate can be reduced. Variations in the resonance frequency of each part can be reduced.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings.

This embodiment, like the conventional example, is a piezoelectric electronic component shown in FIG. 7, that is, a strip-shaped piezoelectric vibrator 2 in which vibrating electrodes 1 are respectively formed on main surfaces opposed to each other.
And a holding frame 3 having a “U” shape in a plan view, which holds each end 2 a of the piezoelectric vibrator 2 from the main surface side and supports the center 2 b so as to be able to vibrate, is integrated with the piezoelectric vibration. FIG. 1 is a perspective view of a piezoelectric vibrator master substrate 7 including a body 4 and a pair of case bodies 5 that sandwich and house the piezoelectric vibrator 4.
Are front views of the holding frame main substrate 9, and in these figures, the same components and parts as those in FIGS. 7 and 8 are denoted by the same reference numerals.

The method for manufacturing the piezoelectric electronic component of the present embodiment is as follows.

First, as shown in FIG. 1, a piezoelectric vibrator parent substrate 7 made of piezoelectric ceramic is prepared.
An electrode pattern 6 serving as the vibration electrode 1 is formed on each of the opposing main surfaces of the piezoelectric vibrator parent substrate 7. Further, as shown in FIG. 2, a parent substrate 9 for a holding frame, in which convex portions 9a continuous in the longitudinal direction are formed at both ends of the inner surface, is prepared. The holding frame-body mother board 9 is a plurality of sets prepared vertical pair as a pair, and further, as shown in FIG. 2 (a), the width h ₁ of the convex portion 9a equivalent to the standard pinching width Hs As shown in FIG. 2B, a certain set 9A has a width h of the convex portion 9a.
₂ is a set 9B slightly smaller than the standard holding width Hs, and a convex portion 9a.
Width h ₃ of the slightly wider set 9C than standard pinching width Hs, are prepared, respectively. Note that the standard holding width Hs referred to here is
Are the parent substrate 9 for the holding frame and the parent substrate 7 for the piezoelectric vibrator.
The holding width H of the piezoelectric vibrator 2 suitable for obtaining a desired resonance frequency in the piezoelectric vibrator 4 manufactured by combining
That is, the width H (see FIG. 7) of holding the end portion 2a of the piezoelectric vibrator 2 by the holding frame 3 is referred to.

By the way, in the mother substrate 7 for the piezoelectric vibrator, the resonance frequency varies as shown in FIG. 3 for each substrate due to the manufacturing method. In FIG. 3, a permissible range of the desired resonance frequency is a range B, a range below the lower limit of the resonance frequency is range A, and a range above the upper limit of the resonance frequency is range C.

On the other hand, the piezoelectric vibrator 4 is characterized in that when the above-described holding width H (see FIG. 7) fluctuates, the resonance frequency fluctuates. More specifically, the resonance frequency decreases as the clamping width H decreases, and the resonance frequency increases as the clamping width H increases.

Then, the resonance frequency of the piezoelectric vibrator mother substrate 7 is measured, and if the resonance frequency is higher than the desired frequency range, that is, the range C, the width h ₂ of the convex portion 9a is reduced. The piezoelectric vibrator parent substrate 7 is clamped by the set 9B of the holding frame parent substrate 9 slightly smaller than the standard clamping width Hs. Then, these parent substrates 7 and 9 are adhered by an adhesive (not shown) such as epoxy resin, and each holding frame parent substrate 9 is pressed against the piezoelectric vibrator parent substrate 7 to press the adhesive. By hardening while the mother substrates 7 and 9 are integrated with each other, the structure 10 is manufactured. Further, as shown in FIG. 8, the structure 10 is cut along each of the cutting lines S set as a cross, thereby cutting the piezoelectric vibrator 4, ie, the piezoelectric vibrator 2, the holding frame 3, Is produced to produce a piezoelectric vibrating body 4.

The piezoelectric vibrator 4 thus manufactured
As a result, the holding width H of the holding frame 3 becomes narrower than the standard holding width Hs, and as a result, the resonance frequency shifts to the lower frequency side, and falls within the desired allowable range B of the resonance frequency.

On the other hand, the resonance frequency of the mother substrate 7 for the piezoelectric vibrator is measured, and if the resonance frequency is lower than the desired frequency range, that is, the range A, the width h ₃ of the convex portion 9a is reduced. The piezoelectric vibrator parent substrate 7 is clamped by the set 9C of the holding frame parent substrate 9 slightly wider than the standard clamping width Hs. Then, these parent substrates 7 and 9 are adhered by an adhesive (not shown) such as epoxy resin, and each holding frame parent substrate 9 is pressed against the piezoelectric vibrator parent substrate 7 to press the adhesive. The mother substrates 7 and 9 are integrated with each other by hardening while curing to form the structure 10. Further, as shown in FIG. 8, by cutting the structure 10 along each of the cutting lines S set as a cross, the piezoelectric vibrator 4, that is, the piezoelectric vibrator 2 and the holding frame 3 are cut. Is produced to produce a piezoelectric vibrating body 4.

The piezoelectric vibrator 4 thus manufactured
As a result, the holding width H of the holding frame 3 becomes wider than the standard holding width Hs. As a result, the resonance frequency shifts to the higher frequency side, and falls within the desired resonance frequency allowable range B.

Further, the resonance frequency of the piezoelectric vibrator mother substrate 7 is measured, and if the resonance frequency is in the frequency range that matches the desired frequency range, that is, the range B, the width h _{3 of the} convex portion 9a is measured. Are used to hold the piezoelectric vibrator parent substrate 7 with a set 9A of holding frame parent substrates 9 having the same size as the standard clamping width Hs.
Then, these parent substrates 7 and 9 are adhered by an adhesive (not shown) such as epoxy resin, and each holding frame parent substrate 9 is pressed against the piezoelectric vibrator parent substrate 7 to press the adhesive. The mother substrates 7 and 9 are integrated with each other by hardening while curing to form the structure 10. Further, as shown in FIG. 8, the structure 10 is cut along each of the cutting lines S set as a cross, thereby cutting the piezoelectric vibrator 4, ie, the piezoelectric vibrator 2, the holding frame 3, Is produced to produce a piezoelectric vibrating body 4.

The piezoelectric vibrator 4 thus manufactured
As a result, the holding width H of the holding frame 3 becomes equal to the standard holding width Hs. As a result, the resonance frequency is not adjusted and the desired resonance frequency allowable range B is maintained.

As shown in FIG. 7, the piezoelectric vibrator 4 constructed as described above is sandwiched between the piezoelectric vibrator 4 and a pair of case bodies 5 attached to the piezoelectric vibrator 4 as shown in FIG. Parts.

When the piezoelectric electronic component is manufactured in this manner, as shown in FIG. 4, in the state of the piezoelectric vibrator parent substrate 7, the resonance frequency varies for each piezoelectric vibrator parent substrate 7. Nevertheless, when completed as a piezoelectric electronic component, most of the piezoelectric electronic components have a resonance frequency within a desired frequency range B. In FIG. 4, the solid line indicates the variation in the resonance frequency of the piezoelectric electronic component manufactured by the method of the present embodiment, and the two-dot chain line indicates the variation in the resonance frequency in the state of the piezoelectric vibrator mother substrate 7. I have.

In this embodiment, the parent substrate 7 for the piezoelectric vibrator is
One having a resonance frequency within a desired resonance frequency allowable range B, one having a resonance frequency in a range A equal to or lower than the lower limit of the resonance frequency, and one having a resonance frequency in a range C equal to or higher than the upper limit of the resonance frequency. On the other hand, three types of sets 9A, 9B, and 9C of the holding frame main substrates 9 having the convex portions 9a having the widths h1 _to h3 are prepared. The resonance frequency of the finished product is adjusted to a desired value by selecting a suitable one from the three types of holding frame parent substrates 9 corresponding to the above. However, while holding the piezoelectric vibrator parent substrate 7 in a narrower group (three or more groups) according to the variation of the resonance frequency, a holding frame having a clamping width for adjusting the resonance frequency corresponding to the group is provided. It goes without saying that the resonance frequency can be adjusted more accurately by preparing a plurality of types of the parent substrates 9.

Next, a second embodiment of the present invention will be described. This embodiment also has the piezoelectric electronic component shown in FIG.
That is, a strip-shaped piezoelectric vibrator 2 in which the vibrating electrodes 1 are respectively formed on main surfaces facing each other, and a center portion 2b can be vibrated by sandwiching each end 2a of the piezoelectric vibrator 2 from the main surface side. A piezoelectric vibrating body 4 in which a holding frame 3 having a “U” shape in a plan view is integrally supported, and a pair of case bodies 5 that sandwich and house the piezoelectric vibrating body 4. In this embodiment, variations in characteristics and deterioration in yield due to fluctuations in the resonance paper frequency for each portion on the piezoelectric vibrator master substrate 7 are eliminated.

That is, the piezoelectric vibrator mother substrate 7 has a variation in resonance frequency along the longitudinal direction L due to its structure, and the resonance frequency of each part along the longitudinal direction L does not completely match. It has been known. Specifically, FIG.
As shown in FIG. 6, the highest resonant frequency domain a ₃ at the longitudinal center portion of the piezoelectric vibrator mother board 7, the resonance frequency toward the both ends low. Therefore, assuming that the range α (see FIG. 6) located at the center of the fluctuation range of the resonance frequency is the desired resonance frequency range B (see FIGS. 3 and 4), the piezoelectric vibrator corresponding to the resonance frequency range α while shifting the resonant frequency in the region a _2, a ₄ substrate longitudinal center side of the area a ₃ than the parent board 7 to the low frequency side, region a _2, the region a ₁ in a ₄ from the substrate longitudinally defined end regions, a _By shifting the resonance frequency of No. ₅ to the higher frequency side, the resonance frequency of the entire area of the piezoelectric vibrator master substrate 7 becomes the desired resonance frequency range B.

By the way, as described in the first embodiment,
A width for holding the end of the piezoelectric vibrator 2 by the holding frame 3,
That is, the resonance frequency decreases as the clamping width H decreases, while the resonance frequency increases as the clamping width H increases.

Therefore, in the present embodiment, the inner end of the protruding portion 9a of the holding frame parent substrate 9 is curved so that the longitudinal direction L
, The width h of the convex portion 9a is continuously varied,
As a result, the holding width H is changed, and the piezoelectric vibrator parent substrate 7 is changed.
Are adjusted so as to shift within the desired frequency range B. Specifically, in the regions b ₂ and b ₄ (see FIG. 5) of the holding frame main substrate 9 facing the regions a ₂ and a ₄ of the piezoelectric vibrator main substrate 7, the width of the protruding portion 9 a is reduced. while a standard pinching width Hs equivalent width h ₄ back and forth, the region in the region b ₃ of the holding frame-body mother board 9 corresponding to a ₃ (see FIG. 5), the width standard clamping width Hs of the convex portion 9a and more slightly narrower h ₅ before and after, further, in the region b ₁ of the holding frame-body mother board 9 corresponding to the region a _1, a _5, b ₅ (see FIG. 5), the width of the convex portion 9a standard has a slightly wider width h ₆ longitudinal than nipping width Hs, so that such width h _{4 to 6,} which is curved inner end of the convex portion 9a. Note that the standard holding width Hs referred to here is
Uses the concept described in the first embodiment as it is.

Then, after holding the piezoelectric vibrator master substrate 7 with the holding frame master substrate 9 having such a convex portion 9a, the master substrates 7, 9 are bonded with an adhesive (eg, epoxy resin). (Not shown), and pressing each of the holding frame parent substrates 9 against the piezoelectric vibrator parent substrate 7 and hardening while pressing the adhesive, thereby integrating the parent substrates 7 and 9 together to form a structure. 10 is manufactured. Further, as shown in FIG. 8, the structure 10 is cut along each of the cutting lines S set as a cross, thereby cutting the piezoelectric vibrator 4, ie, the piezoelectric vibrator 2, the holding frame 3, Is produced to produce a piezoelectric vibrating body 4.

In the piezoelectric vibrating body 4 thus manufactured, the holding width of the holding frame 3 is smaller than the standard holding width Hs in the piezoelectric vibrating body 4 manufactured from the area a ₃ of the resonance vibrator parent substrate 7. As a result, the resonance frequency shifts to the lower frequency side and falls within the allowable range B of the desired resonance frequency. Further, in the case of the resonator vibrator main substrate 7 manufactured from the regions a ₁ and a ₅ ,
As a result of the holding width H of the holding frame 3 being wider than the standard holding width Hs, the resonance frequency shifts to the high frequency side, and falls within the allowable range B of the desired resonance frequency. Further, those made from the region a _2, a ₄ resonant vibrator mother board 7, as a result of pinching width H of the support frame 3 is equivalent to the standard clamping width Hs, the resonant frequency is adjusted But within the allowable range B of the desired resonance frequency. Therefore, in the piezoelectric electronic component manufactured by this method, since the variation in the resonance frequency of each portion in the longitudinal direction L of the piezoelectric vibrator parent substrate 7 is corrected, the piezoelectric electronic component is manufactured from the entire region of the piezoelectric vibrator parent substrate 7. The variation in the resonance frequency between the piezoelectric electronic components thus obtained is eliminated, and each of the piezoelectric electronic components has a resonance frequency within a desired resonance frequency range B.

[0035]

As described above, according to the first aspect of the present invention, when the resonance frequency of the piezoelectric vibrator is higher than a desired value, the holding width of the holding frame is reduced, and If the resonance frequency is lower than a desired value, such as increasing the holding width of the holding frame, if there is a variation between the resonance frequency of each piezoelectric vibrator and the desired resonance frequency, eliminate the variation. By changing the holding width of the holding frame, the resonance frequency can be adjusted to a desired value. Therefore, the characteristics of the completed piezoelectric electronic component are homogenized, the yield is improved, and the cost is reduced accordingly.

According to the second aspect of the present invention, when the resonance frequency at the center in the longitudinal direction of the parent substrate for the piezoelectric vibrator is high and the resonance frequencies at both ends in the longitudinal direction are low, the width of the convex portion is maintained. If there is a variation in the resonance frequency along the longitudinal direction of the parent substrate for the piezoelectric vibrator, such as making it narrow at the center in the longitudinal direction of the parent substrate for the frame while making it wider at both ends in the longitudinal direction, the variation By adjusting the width of the protruding portion in each part of the piezoelectric vibrator parent substrate so as to eliminate the problem, the resonance frequency of each part of the piezoelectric vibrator parent substrate can be made uniform. Therefore, the characteristics of the completed piezoelectric electronic component are homogenized, the yield is improved, and the cost is reduced accordingly.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a parent substrate for a piezoelectric vibrator in first and second embodiments.

FIG. 2 is a front view illustrating a configuration of a holding frame parent substrate according to the first embodiment.

FIG. 3 is a diagram showing a variation state of a resonance frequency of a parent substrate for a piezoelectric vibrator.

FIG. 4 is a diagram showing a variation in resonance frequency of a piezoelectric electronic component manufactured by the method of the first embodiment.

FIG. 5 is an exploded perspective view showing a state in the course of production of the method for producing a piezoelectric electronic component according to the second embodiment.

FIG. 6 is a diagram illustrating a variation in resonance frequency of each portion in a longitudinal direction of a parent substrate for a piezoelectric vibrator.

FIG. 7 is an exploded perspective view showing a structure of a piezoelectric electronic component according to each embodiment and a conventional example.

FIG. 8 is an exploded perspective view showing a state in which a piezoelectric electronic component according to each embodiment and a conventional example is being manufactured.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 2 Piezoelectric vibrator 2a End part 2b Central part 3 Holding frame 7 Parent substrate for piezoelectric vibrator 9 Parent substrate for holding frame 9a Convex part 10 Structure h Width of convex part H _{1 to 6} H Nipping width

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H03H 3/00-3/10

Claims (3)

(57) [Claims] 1. A method for manufacturing a piezoelectric electronic component in which each end of a piezoelectric vibrator is sandwiched by a holding frame from a main surface side and a central portion of the piezoelectric vibrator is supported so as to be able to vibrate. , Measure the resonance frequency of the piezoelectric vibrator, and
If the frequency range is higher than the frequency range, the resonance frequency
Narrower than in the frequency range that matches the desired frequency range
While holding by the holding frame having a width, the resonance frequency is
If the frequency is lower than the desired frequency, the resonance frequency
Is wider than in the frequency range that matches the desired frequency range
A method for manufacturing a piezoelectric electronic component, wherein the piezoelectric electronic component is held by a holding frame having a holding width . 2. A base substrate for a piezoelectric vibrator and one end thereof
A pair of holding frames each having a convex portion continuous in the longitudinal direction.
And a parent substrate for the piezoelectric vibrator.
Each of the surfaces of the holding frame parent substrate is symmetrical to each other.
To form a structure, and then the structure is
By cutting along the direction, the piezoelectric vibrator is
Manufacture multiple piezoelectric electronic components that are supported so that they can vibrate
A method comprising the steps of:
Where the resonance frequency is higher than the desired resonance frequency range.
The resonance frequency within the desired resonance frequency range.
Make the width of the convex part of the holding frame parent substrate smaller than a certain part
On the other hand, the resonance frequency is lower than the desired resonance frequency range.
For those parts, the resonance frequency is the desired resonance frequency range.
Make the width of the protruding part of the holding frame parent substrate wider than the surrounding part.
A method for manufacturing a piezoelectric electronic component, comprising: 3. The method according to claim 1, wherein the width of the convex portion is set to the width of
At the center in the longitudinal direction, while narrowing, at both ends in the longitudinal direction
3. The piezoelectric electronic component according to claim 2, wherein the piezoelectric electronic component is widened.
Manufacturing method.