JP3136350U - Heat dissipation device - Google Patents

Abstract

Disclosed is a heat dissipating device capable of obtaining a stable and strong coupling.
A block-shaped heat dissipating pedestal 1 is mainly formed by laminating a plurality of heat dissipating fins 11a, 11b. Therefore, the heat conduit 2 and the base 3 constitute a heat dissipation device. A plurality of double class holes 13 are opened in each radiating fin. When the double class holes are fitted and inserted into each other, a first-time coupling is formed so as to form a tight coupling, and a through hole without a gap is formed. Since the diameter of the through hole is smaller than the outer diameter of the heat conduit with an allowable tolerance, the second time is passed so that the heat radiation fin and the heat conduit are tightly coupled while passing through the through hole so as to tightly couple the heat conduit. Form a bond. Then, the joint tightness of adjacent fins and the strength of the structure of the manipulative structure are improved, the impact damage is less likely to occur during transportation or attachment, and the close contact between the fins and the heat conduit is enhanced. Optimum heat conduction and heat dissipation effects can be obtained.
[Selection] Figure 1

Description

The present invention relates to a heat dissipation device, and in particular, by adopting a system in which heat dissipation fins are double class holes and are fitted and inserted into each other, it penetrates the heat conduit closely, and it is a stable and strong connection with two tight connections Relates to a heat dissipation device.

Conventionally, known heat dissipation device structures assembled with heat conduits are composed of a plurality of heat conduits, a plurality of heat dissipation fins, and a base of aluminum or copper material. For heat sink fins, aluminum or copper is usually used. The heat conduit is a closed metal tube at both ends and is filled with working liquid. A plurality of heat dissipating fins are stacked adjacent to each other to form a block-shaped heat dissipating base. So it penetrates and couples the heat conduit to the base.

However, with the above-mentioned known heat conduit, the diameter of the tube is almost like a large head and a small tail, with a tolerance of +/− 0.05 mm. In other words, the tube of the heat conduit was actually not an exact true circle, but roundness was sufficient. The diameter size of the known heat conduits changed slightly, and the heat sink fins and the heat conduits were not tightly coupled with each other, so the defect rate was high and biased, but it was difficult to select defective products. Also, if the diameter of the heat conduit is small and not sufficient, the structural strength after assembling with the radiating fin is of course extremely unstable, and there is a risk of loosening. Eventually, it was easy to be shocked or damaged during transportation or installation. The conventional known method is soldering and the structure is reinforced, but such processing is cumbersome and not only increases costs, but also causes environmental pollution, and is not an ideal solution.

As shown in FIG. 7, conventionally, all the known fins 10 are in the form of a single class hole, that is, a single class part 101 is extended from the peripheral wall of the opening hole. Adjacent radiating fins 10 were formed by penetrating the thermal conduit 20 through the hole after being connected to each other via a single class part 101 before and after and forming a spacing arrangement. Due to the lack of roundness of the heat conduit 20 and a tolerance of +/− 0.05 mm in diameter, the heat sink fin 10 and the heat conduit 20 are not easily tied together and have good contact properties. Not only was there, but the structure of the manipulative structure was tight and unreliable, and defects such as loosening and falling out always occurred.

Accordingly, it is a primary object of the present invention to provide an improved design of the heat sink fin and heat conduit assembly of the heat sink. That is, a plurality of double class holes are opened in the heat dissipation fin. When the double class holes are fitted and inserted into each other, a first-time coupling is formed so as to form a tight coupling, and a through-hole having an aperture smaller than the outer diameter of the heat conduit is formed. While passing through the through-hole so that the heat conduit is tightly coupled, the outer class part and the inner class part of the double class hole are connected again so as to be tightly compressed, so that heat radiation fins and heat The conduits form a second bond so that they are tightly coupled. Then, the joint tightness of the adjacent fins and the strength of the whole structure are improved, the impact damage is less likely to occur during transportation or installation, and the close contact between the fins and the heat conduit is enhanced. The best heat conduction and heat dissipation effect can be obtained.

In short, according to the present invention, the improved design of the heat dissipation fin and heat conduit assembly of the heat dissipation device is mainly stacked with a plurality of heat dissipation fins to form a block-shaped heat dissipation base. Thus, the heat conduit and the base constitute a heat dissipation device. The key point of the improvement is to open multiple double class holes in each radiating fin. When the double class holes are fitted and inserted into each other, a first-time connection is formed so that the double-class holes are closely connected, and a through hole without gap is formed. Since the permissible tolerance of the diameter of the through hole is smaller than the outer diameter of the heat conduit, the second heat dissipation fin and the heat conduit are tightly coupled while passing through the through hole so that the heat conduit is tightly coupled. Form a bond of times. As a result, the joint tightness between adjacent fins and the strength of the structure of the manipulative structure are improved, impact damage is less likely to occur during transportation or installation, and intimate contact between the fins and the heat conduit is enhanced. Then, it achieves the best heat conduction and heat dissipation effect.

In order to achieve the purpose and features of the present invention and to understand the technical means and effects employed, the following description will be made in more detail with reference to specific examples.

Please refer to FIG. 1 first. According to the present invention, the improved design of the heat sink fin and heat conduit assembly of the heat dissipating device is mainly formed by stacking (stacking) the heat dissipating fins 11a or 11b at adjacent intervals to form the block-shaped heat dissipating base 1. Therefore, when combined with a plurality of heat conduits 2 and one base 3, a heat dissipation device is formed. (See FIGS. 2 and 3).

The plurality of thermal conduits 2 are known components and are closed bent metal tubes at both ends. The tube body is filled with working liquid and the shape (for example, U shape or L shape) is not limited. A selected portion of the heat conduit 2 (for example, an extending arm or a bent portion of the tube) is connected to the base 3. The base 3 is made of copper or aluminum, and the form is not limited. The base 3 is tightly coupled to the heat conduit 2. A heat conductive thin piece 4 made of copper is tied to the lower surface of the base 3 according to needs. (It may be configured by a method such as rivet joining, fitting, or pressing).

As shown in FIG. 1, the present invention mainly improves the assembly of the heat dissipating fin 1 and the heat conduit 2 again. A plurality of heat dissipating fins 11a or 11b are opened with double class holes 13 whose positions correspond to each other and penetrate the heat conduit 2 closely. (See FIGS. 2 to 4). Each double class hole 13 has one outer class part 131 and one inner class part 132. (See FIG. 5). That is, each double class hole 13 has the characteristics of a double class ring. Adjacent heat dissipating fins 11a or 11b are so tightly coupled that the front and rear double class holes 13 are fitted and inserted, and the front and rear outer class parts 131 and the inner class part 132 are fitted together. In this way, a first-time bond is formed, and a through hole without gap is formed. While passing through the through hole so as to tightly couple the heat conduit 2, the radiating fin 1 and the heat conduit 2 form a second bond so as to be tightly coupled.

See FIG. On the other hand, in the double class hole 13 described above, the inner diameter C of the inner class part 132 is smaller than the outer diameter A of the outer class part 131 in an allowable tolerance. Therefore, when the front and rear double class holes 13 are fitted and inserted into each other, the front and rear outer class parts 131 and the inner class part 132 are tightly coupled via tight tolerances and compression. Form a single bond. Further, since the inner diameter B of the posted outer class portion 131 is smaller than the outer diameter D of the heat conduit 2 in an allowable tolerance, the outer class portion 131 passes through the heat conduit 2 closely. When the outer class part 131 and the inner class part 132 of the double class hole 13 are pressed again so as to be tight and compressed, a second coupling is formed so that the heat dissipating fin 11a or 11b and the heat conduit 2 are tightly coupled. To do. The outer class portion 131 of the front double class hole 13 receives the action of opening the heat conduit 2 and presses the inner class portion 132 of the rear double class hole 13, so that the heat radiation fin 11a or 11b and the heat conduit 2 are coupled. Improves the tightness and strength of the structure of the manipulative structure, makes it difficult for impact damage to occur during transportation or installation, enhances the close contact between the heat dissipating fins 11a or 11b and the heat conduit 2, and The best adhesion and contact can be maintained between the tube body and the through hole formed by the double class hole 13, and the best heat conduction and heat dissipation effect can be provided.

In such an embodiment, the heat dissipating base 1 is configured so that a plurality of heat dissipating fins 11a or 11b are formed adjacent to each other. The lower end shape is fitted so as to match the upper end surface of the base 3. The heat conduit 2 may be provided with a flat portion that is formed by being pressed flat. After the heat conduit 2 is fitted into the base 3 so as to be tightly coupled, the bottom surface of the flat portion is aligned with the bottom surface of the base 3. Further, the heat conductive thin piece 4 having excellent heat conductivity is attached to the bottom surface of the base 3 and the heat conduit 2 is closely covered. (See FIG. 3). Moreover, both sides of the heat conducting thin piece 4 are brought into contact with the flat portion of the heat conduit 2 and the heat generating portion of the electronic chip, respectively. (For example, the electronic chip is a CPU or a GPU). At the time of thermal expansion, since the heat conducting thin piece 4 and the heat conduit 2 are bonded in contact so as to be very tightly coupled, the heat conducting thin piece 4 is completely attached to the heat radiating part of the electronic chip and is in contact with it. The temperature is rapidly transferred to the heat conduit 2. If it does so, the heat | fever conduit | pipe 2 will exhibit the outstanding heat dissipation effect, and will fulfill | achieve the objective of heat conduction and heat dissipation rapidly.

However, the present invention is not limited to the technical scope of the present invention. The feature lies in that a double class hole 13 corresponding to the position is opened in the heat dissipating fin 11a or 11b of the heat dissipating base 1. Therefore, it fits so that the front and back may be closely joined. If it is the configuration form of the heat conduit 2 and the base 3, there is no special restriction. Of course, the configuration of the heat dissipation device is not limited. In the technical idea of the present invention, any local change or modification made by a person skilled in the art shall be included in the claims of the present invention.

Exploded view of the present invention Assembly three-dimensional view of the present invention Assembly side view of the present invention Assembly sectional view of the present invention Explanatory drawing which expands the local part of FIG. Explanatory drawing of the assembly which the heat sink fin and heat conduit | pipe which concern on this invention are couple | bonded closely Traditionally, explanatory surface to expand the local assembly of known fin and heat conduit

Explanation of symbols

1 Radiation base
11a Heat dissipation fin 11b Heat dissipation fin 2 Heat conduit
3 Base 4 Heat conduction flake
13 Double class hole 131 Outer class part
132 Inner class part A Outer class part outer diameter
B Inner diameter of outer class
C Inner class inner diameter
D Outer diameter of heat conduit

Claims (6)

A heat dissipating device comprising a plurality of heat dissipating fins having the same or different shapes laminated at adjacent intervals, a heat dissipating pedestal, a plurality of heat conduits, and a base. Opens a plurality of double class holes corresponding to each other so as to closely penetrate the heat conduit, and the double class holes have one outer class part and one inner class part and are adjacent to each other. Each of the radiating fins is inserted so that the front and rear double class holes are fitted to each other, and the front and rear outer class parts and the inner class part are fitted together so as to be tightly coupled. In addition, the through hole without gaps is formed, and the heat radiation fin and the heat conduit are closely coupled when the heat conduit is closely passed through the through hole. Heat dissipation, characterized by forming a double bond Location. 2. The heat dissipation device according to claim 1, wherein an inner diameter of the inner class portion of the double class hole is smaller than an outer diameter of the outer class portion. 2. The heat dissipation device according to claim 1, wherein an inner diameter of an outer class portion of the double class hole is smaller than an outer diameter of the heat conduit. 2. The heat dissipating device according to claim 1, wherein the heat dissipating fins are adjacent to each other to constitute the heat dissipating pedestal, and a lower end of the heat dissipating pedestal is configured to be fitted to an upper end surface of the base. The heat conduit is fitted into the base so as to be tightly coupled, and is attached to the bottom surface of the base with a heat conductive flake having excellent heat conductivity, and is configured to cover the heat conduit closely. The heat dissipating device according to claim 1, wherein: 2. The heat dissipation device according to claim 1, wherein the heat conduit is configured to be tightly coupled to the base via an extending arm or a bent portion of a tubular body.