JP3116187U - Heat dissipator adapted to liquid heat transfer medium - Google Patents

Abstract

A heat dissipator (1) and a barrier layer (2) provided on one surface in contact with a low melting point metal alloy material (3) serving as a liquid heat transfer medium on the heat dissipator, wherein the barrier layer is a frame type, A heat dissipation device that surrounds the outside of the liquid heat transfer medium, provides a blocking and blocking function by the roughened surface 21 of the blocking layer, and is adapted to the liquid heat transfer medium that effectively avoids the occurrence of leakage of the liquid heat transfer medium to the outside. provide.
A heat dissipation device adapted to a liquid heat transfer medium including a heat dissipator (1) and a barrier layer (2) is provided, and the heat dissipator (1) is made of a metal material having a good heat conductivity such as a copper material or an aluminum material. The shape and structure of the heat dissipator 1 are not limited, and various heat dissipators may be used. The heat dissipator 1 includes a pedestal 11 and a plurality of heat dissipating fins 12. These heat dissipating fins 12 are integrally formed and protrude from the pedestal 11. These heat dissipating fins 12 can also be provided on the base 11 in a combined manner.
[Selection] Figure 3

Description

  The present invention relates to a heat dissipating apparatus adapted to a liquid heat transfer medium, and particularly refers to a heat dissipating apparatus that avoids the occurrence of leakage outside the liquid heat transfer medium.

  With the rapid development of the computer industry, the execution speed of heat sources such as chips and central processing units (CPUs) has become faster, and the amount of heat generated by the heat sources has also increased. In order to discharge outside and allow the heat source to operate normally at an acceptable temperature, a heat sink having a relatively large area is usually attached on the heat leak surface of the heat source, Contributes to heat dissipation with fins. For example, a Taiwanese patent tw562395 on November 11, 2003 shows a conventional heat dissipation device.

  In order to ensure that the amount of heat generated by the heat source is transmitted to the heat dissipator, it is generally necessary to provide a heat conduction paste between the heat source and the heat dissipator. Deriving the high temperature generated by the heat source in the paste and heat dissipator, and cooperating with the heat dissipation of the heat source.

  The conventional heat dissipating device uses a heat conductive paste as a heat conductive medium, but the heat conductive coefficient TC of the heat conductive paste is very low, so the heat conduction efficiency is relatively poor, and a high temperature at which a heat source such as a chip or a central processing unit is generated. However, it becomes difficult to effectively transmit to the heat dissipator, and the heat dissipating efficiency deteriorates.

  In addition, there is a heat dissipation device according to the present invention. By attaching a low melting point metal alloy material to a heat sink, the low melting point metal alloy material can be used as a heat transfer medium, and the heat conduction coefficient of the low melting point metal alloy material is Since it is high, the amount of heat generated by the heat generation source can be effectively transmitted to the heat dissipator, and favorable heat dissipating efficiency is provided.

  However, the low melting point metal alloy material is installed between the heat source and the heat dissipator, but when the operating temperature of the heat source is high and the melting point of the low melting point metal alloy material is reached, the low melting point metal alloy material Becomes liquid and leaks outside, and its heat conduction efficiency is greatly reduced.

  For this reason, the present inventor provides the present invention which can be deliberately studied and studied in view of the conventional drawbacks, and can be rationally designed and improved according to the operation of academic theory.

  The main object of the present invention is to provide a barrier layer on one surface that contacts the liquid heat transfer medium on the heat spreader, the barrier layer surrounds the outside of the liquid heat transfer medium, and provides a function of blocking and blocking by the barrier layer, Provided is a heat dissipation device adapted to a liquid heat transfer medium that avoids a situation in which the liquid heat transfer medium leaks outside and maintains a preferable heat transfer efficiency.

  In order to achieve the above object, the present invention provides a heat dissipating apparatus adapted to a liquid heat transfer medium including a heat dissipator and a frame-type blocking layer provided on the heat dissipator and surrounding the liquid heat transfer medium.

  In order to further understand the features and technical contents of the present invention, a deep and specific understanding can be obtained by referring to the following detailed description and the accompanying drawings related to the present invention. Needless to say, the scope of the present invention is not limited to a narrow sense.

  Referring to FIGS. 1 and 2, the present invention provides a heat dissipating device adapted to a liquid heat transfer medium including a heat dissipator 1 and a barrier layer 2, and the heat dissipator 1 is made of a heat conductive material such as a copper material or an aluminum material. Although it is made of a good metal material, the shape and structure of the heat dissipator 1 are not limited, and various heat dissipators may be used. In this embodiment, the heat dissipator 1 includes a pedestal 11 and a plurality of heat dissipating fins 12, and these heat dissipating fins 12 are integrally formed and protrude from the pedestal 11. These heat dissipating fins 12 can also be provided on the base 11 in a combined manner.

  The barrier layer 2 is provided on the surface of the pedestal 11 of the heat dissipator 1, and the barrier layer 2 is installed on the heat dissipator 1 by post-processing or integral molding. In this embodiment, the barrier layer 2 is installed on the heat radiator 1 by a post-processing method, that is, the barrier layer 2 is formed on the surface of the pedestal 11 of the heat radiator 1 by the sandblast method, and the barrier layer 2 becomes a frame type. A square or circular frame may be used. The barrier layer 2 is formed by sandblasting to form a roughened surface 21 and can provide a blocking and blocking function. The roughened surface 21 has an average roughness (Ra) of about 2 to 3 μm and a maximum height (Ry) of about 20 μm, but is not limited thereto. A heat dissipation device adapted to the heat transfer medium is formed.

  Referring to FIG. 3, the low melting point metal alloy material 3 is attached to the internal position of the surface blocking layer 2 of the base 11 of the heat dissipator 1, and the blocking layer 2 surrounds the outside of the low melting point metal alloy material 3. The low-melting-point metal alloy material 3 is in contact with a heat source 4 such as a chip or a central processing unit as a heat transfer medium, and effectively transmits the amount of heat generated by the heat source 4 to the heat dissipator 1 to provide a preferable heat dissipating efficiency.

  When the operating temperature of the heat source 4 is high and reaches the melting point or higher of the low melting point metal alloy material 3, the low melting point metal alloy material 3 changes to a liquid heat transfer medium. The occurrence of a situation where the liquid low melting point metal alloy material 3 leaks to the outside is avoided.

  Referring to FIG. 4, in this embodiment, the barrier layer 2 is installed on the heat dissipator 1 by a post-processing method, that is, the barrier layer 2 is formed on the surface of the base 11 of the heat dissipator 1 by a chemical etching method. 2 is formed by a chemical etching method to form a roughened surface 21 and can provide a blocking and blocking function.

  Referring to FIGS. 5 and 6, in this embodiment, the barrier layer 2 is installed on the heat dissipator 1 by an integral molding method, and the barrier layer 2 is formed on the surface of the pedestal 11 of the heat dissipator 1 like a recess or a protrusion. Installed, the height of the blocking layer 2 is about 0.5 mm, and can also provide blocking and blocking functions.

  In the present invention, a barrier layer 2 is specially provided on one surface of the heat spreader 1 that is in contact with the liquid heat transfer medium, and the barrier layer 2 surrounds the outside of the liquid heat transfer medium (low melting point metal alloy material 3). A function of blocking and blocking is provided, a situation where the liquid heat transfer medium (low melting point metal alloy material 3) leaks to the outside can be effectively avoided, and a preferable heat transfer efficiency can be maintained.

  As described above, the present invention is an unusual new product, has industrial applicability, novelty and inventive step, and fully satisfies the requirements of utility models.

  However, each of the specific configurations disclosed above is merely a working example of the present invention, and does not limit the features of the present invention. It is obvious that the home can perform appropriate conversions and modifications in the field of the present invention, but those implementations should be delivered within the claimed scope of the present invention.

It is a perspective view of the heat dissipation apparatus of this invention. It is sectional drawing of the heat dissipation apparatus of this invention. It is sectional drawing of the use condition of the heat dissipation apparatus of this invention. It is sectional drawing of other one Example of the heat dissipation apparatus of this invention. It is a perspective view of another Example of the heat dissipation apparatus of this invention. It is sectional drawing of another Example of the heat dissipation apparatus of this invention.

Explanation of symbols

1 Heat Dissipator 2 Barrier Layer 3 Low Melting Point Metal Alloy Material 4 Heat Source 11 Pedestal 12 Heat Dissipating Fin 21 Roughened Surface

Claims (7)

A heat sink,
A heat dissipation device adapted to a liquid heat transfer medium, which is provided on the heat dissipator and includes a frame type blocking layer surrounding the outside of the liquid heat transfer medium.   The heat dissipator includes a pedestal and a plurality of heat dissipating fins, the heat dissipating fins are integrally formed and protrude from the pedestal, and the blocking layer is provided on a surface of the pedestal of the heat dissipator. A heat dissipation device that is suitable for liquid heat transfer media.   2. The heat dissipation device adapted to a liquid heat transfer medium according to claim 1, wherein the barrier layer is installed on the heat dissipator by sandblasting.   2. The heat dissipation device adapted to a liquid heat transfer medium according to claim 1, wherein the blocking layer is disposed on the heat dissipator by a chemical etching method.   2. The heat dissipation device adapted to a liquid heat transfer medium according to claim 1, wherein the blocking layer is installed on the heat dissipator by an integral molding method.   2. The heat dissipating apparatus for a liquid heat transfer medium according to claim 1, wherein the barrier layer is disposed on the heat dissipator like a recess or a protrusion.   2. The heat dissipation device adapted to a liquid heat transfer medium according to claim 1, wherein the blocking layer forms a roughened surface.

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