JP3108746B2 - Mounting structure and mounting method of electronic component to flexible board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a method for mounting an electronic component on a flexible substrate.

[0002]

2. Description of the Related Art Conventionally, solder or low-temperature solder has been used to connect electrode portions of chip-type electronic components to a circuit pattern formed by etching a copper foil provided on a flexible substrate. That is, solder cream is printed on a flexible substrate, and a chip-type electronic component is mounted thereon by an automatic mounting machine. Then, the flexible substrate is passed through a heating furnace to solder the electronic components.

[0003] Since the flexible substrate is easily bent, the connection strength is low only by the connection and fixing by soldering. Therefore, a UV-curable adhesive is further applied on the electronic component so as to seal the same, and this is applied. It is hardened by passing it through a UV furnace.

On the other hand, in the case of a circuit pattern formed by printing a silver paste on a flexible substrate, unlike a circuit pattern formed by etching a copper foil, there is a problem in adhesiveness to solder. Instead, a hot melt type conductive adhesive is used. Also, when a film having a low heat-resistant temperature (such as a polyethylene terephthalate (PET) film) is used as the flexible substrate, it is necessary to use a conductive adhesive.

[0005] In this case, a conductive adhesive is printed and dried on the flexible substrate, and electronic components are mounted thereon by an automatic mounting machine, and then the flexible substrate and the electronic components are heated and pressurized. Melts the conductive adhesive to make connection between them.

[0006] In this case, too, the connection strength between the flexible substrate and the electronic component is not so strong.
Seal with a V-curable adhesive.

[0007]

In any of the above connection methods, when the number of electronic components mounted on the flexible substrate is large, the flexible substrate on which the electronic components are mounted is passed through a heating furnace or a UV irradiation furnace. This is efficient because connection of a large number of electronic components is completed simultaneously.

However, when the number of electronic components mounted on the flexible substrate is small, the manufacturing efficiency is adversely affected. That is, even when the number of electronic components to be mounted is small, it is necessary to place the electronic components on a flexible substrate, connect and fix them through a heating furnace, apply a UV-curable adhesive, and pass through a UV irradiation furnace. Because.

Further, it is necessary to install a heating furnace or a UV irradiation furnace, which leads to an increase in equipment costs.

In order to solve the above problems, it is only necessary that each electronic component can be mechanically attached to a flexible substrate one by one.

[0011] The applicant of the present application has proposed in FIG.
As shown in (a) and (b), the flexible sheet 11
The electrode pattern forming portion 117, which can be bent by notching the periphery of the electrode patterns 113 provided on
The flexible substrate 110 includes a flexible substrate 110 on which an electronic component 117 is formed, an electronic component 130 on which the electrode portions 133 and 133 are provided, and a holding member 140 on which holding pieces 141 and 141 for holding the electronic component 130 are provided. The electronic component 130 is placed on the upper side and the holding member 14 is
0 is pushed up in the direction of arrow a so that two holding pieces 141
The electronic component 130 is sandwiched while bending the electrode pattern forming portions 117, 117 so that the electrode pattern forming portions 117, 117 are wound around the side surfaces of the electronic component 130, and the electrode patterns 113, 113 are pressed against the electrode portions 133, 133. A structure for mounting such electronic components on a flexible substrate was proposed.

With this configuration, the mounting is easy, and there is no need to use a heating furnace or a UV furnace for mounting the electronic components 130. Therefore, even if the number of the electronic components 130 to be mounted on the flexible substrate 110 is small, manufacturing is possible. Efficiency can be improved.

Further, the electronic component 130 can be securely fixed to the flexible substrate 110, so that it is not necessary to reinforce the electronic component 130 with an adhesive.

However, in this mounting structure, the holding member 140 is pushed up in the direction of arrow a so that the electronic component 130
When attaching to the both side surfaces of the
The holding pieces 141 and 141 of the holding member 140 are once opened with a strong force by the surface on which the 33 and 133 are formed. At this time, a strong load is applied to the electrode sections 133 and 133, and conversely, the electrode sections 133 and 133 are applied. As shown in FIG. 12B, depending on the material, thickness, etc.
3, 133 may be cracked and the likelihood of disconnection may occur.

When attaching the holding member 140 to the electronic component 130, it is necessary to push up the holding member 140 in the direction of the arrow a and simultaneously press the head of the electronic component 130 with the jig 150. If it is strong, depending on the electronic component 130, the internal element itself may be damaged.

The present invention has been made in view of the above points, and an object of the present invention is to provide a mounting structure and a mounting method for an electronic component to a flexible substrate without causing an excessive burden or damage to the electronic component at the time of mounting. It is to provide a method.

[0017]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a flexible board having an electrode pattern formed on a flexible sheet, an electronic component having an electrode portion, and sandwiching the electronic component. A holding member provided with a holding piece and a pressing portion for pressing the holding piece in a direction to open the holding piece, wherein the electrode pattern is brought into contact with the electrode portion of the electronic component mounted on the flexible substrate, An electronic component was clamped by moving the clamping piece of the clamping member disposed on the back surface of the substrate over the flexible substrate. Further, the present invention provides a flexible substrate having an electrode pattern formed on a flexible sheet, an electronic component having an electrode portion, and a holding member having a holding piece for holding the electronic component. The electronic component is arranged on the upper surface side, the holding member is arranged on the lower surface side, and the holding member of the flexible member is pressed by the holding member on the lower surface of the flexible substrate in a state where the holding piece of the holding member is opened by the jig. The electrode pattern of the flexible substrate is brought into pressure contact with the electrode portion of the electronic component by releasing the state in which the holding piece is opened by bending the flexible substrate over the flexible substrate while partially bending it. Further, the present invention includes a flexible substrate formed by forming an electrode pattern on a flexible sheet, an electronic component provided with an electrode portion, and a holding member having a holding piece for holding the electronic component. In a state where the electrode pattern is in contact with the electrode portion of the electronic component placed on the flexible board, the holding piece of the holding member provided on the back surface of the flexible board is moved over the flexible board to hold the electronic component, and further the electronic component is held on the flexible board. An insulating layer having a thickness for preventing the electronic component from sliding in a direction not sandwiched by the sandwiching member.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIG. 1 is an exploded perspective view of a main part of a mounting structure of an electronic component to a flexible substrate according to a first embodiment of the present invention. As shown in the figure, in this embodiment, the flexible board 10 and the electronic component 30 are mechanically and electrically connected and fixed by the sandwiching member 40. Hereinafter, each component will be described.

The flexible substrate 10 has two electrode patterns 13, 13 formed on a surface of a synthetic resin film, for example, a flexible sheet 11 made of PET, and has a U-shape in a portion surrounding three sides of each of the two electrode patterns 13, 13. The tongue-shaped electrode pattern forming portions 17 are provided by forming the notches 15 in the shape of a circle.

The electrode patterns 13 and 13 are circuit patterns 14 and 13 drawn from the electrode patterns 13 and 13, respectively.
14 together with a silver paste by screen printing.

Further, the connecting portion 1 at the base of the notch 15, 15
On layers 9 and 19, insulating layers 21 and 21 are formed by screen-printing an insulating paint a plurality of times. The thickness of the insulating layers 21 and 21 is, for example, about 100 μm.

Next, the electronic component 30 is a light emitting diode in this embodiment, and its outer shape is a convex shape. Then, electrode portions 33, 33 are formed over the lower surface, the side surface, and the upper surface of the projecting portions 31, 31 projecting from both sides.

Next, as shown in FIGS. 1 and 2, the holding member 40 has two holding pieces 41, 41 formed on both sides of the base 42 by bending opposite sides of the elastic metal plate into a substantially U-shape. Further, T-shaped connecting portions 43, 43 are projected from opposite side sides different from the holding pieces 41, 41, and four tongue-shaped guide projections 4 are formed upward from both outer sides thereof.
5 is bent.

Here, the holding pieces 41 are formed so that the width of the tip portion is larger than the width of the root portion. The width of the tip portion is formed to be larger than the width of the electrode pattern forming portions 17 of the flexible substrate 10. Both ends of the distal end are used as pressing portions 47, respectively.

On the other hand, the width t2 of the guide projection 45 is the width t2 outside the notches 15 provided in the flexible substrate 10.
It is formed in a dimension slightly smaller than 1. The height of the guide projection 45 is higher than the height of the holding piece 41 and the height of the electronic component 30. Base 4
A positioning hole 49 is provided at the center of 2.

The electronic components 3 are mounted on the flexible substrate 10.
In order to attach the electronic component 30, the electronic components 30 are first mounted on the flexible substrate 10 as shown in FIG. 3 to join the two electrode patterns 13, 13 (see FIG. 1) to the lower surfaces of the electrode portions 33, 33. (No adhesive or solder is interposed between the two.) At this time, as shown in FIG. 3, the holding member placed on the push-up member 50 immediately below the portion on which the electronic component 30 is placed on the flexible substrate 10. 40 is arranged. At this time, the circular projection 53 at the center of the push-up member 50 is inserted into the positioning hole 49 of the holding member 40.

Here, the upper surface 51 of the push-up member 50 is formed into a circular arc with a predetermined curvature.

Then, as shown in FIG. 4, four rod-shaped pressing projections 55 (only two of the two pressing projections 55 are shown in FIG. 4) penetrate through the notch 15 from the upper side of the flexible substrate 10 to respectively hold the holding members. The four pressing portions 47 (see FIGS. 1 and 2) of the holding pieces 41, 41 are pressed, and both holding pieces 4 are pressed.
Open 1, 41 outward. At this time, the base 4 of the holding member 40
2 is bent in the same shape as the upper surface 51 of the push-up member 50.

Then, as shown in FIG.
The push-up member 50 is pushed up and the electronic component 3
When the head of “0” is pressed by the jig 60, the sandwiching pieces 41, 41 push up and bend the electrode pattern forming portions 17, and enter both sides of the projecting portions 31, 31 of the electronic component 30.

At this time, since both holding pieces 41, 41 are open, there is no possibility that the electrode portions 33, 33 of the electronic component 30 will be damaged. Also, since the head of the electronic component 30 is not strongly pressed by the jig 60, there is no possibility that the elements in the electronic component 30 will be destroyed.

Then, when the pressing projection 55 is pulled up to remove the push-up member 50 and the jig 60, as shown in FIG. 6, the electronic component 30 is strongly resiliently held and held by the holding pieces 41 of the holding member 40. The electronic components 3
The zero electrode portions 33 and 33 and the electrode pattern forming portions 17 and 17 of the flexible substrate 10 are firmly connected by pressure contact, and the mounting of the electronic component 30 is completed. At this time, the electrode patterns 13, 13 (see FIG. 1) are pressed against the electrode portions 33, 33, and the flexible substrate 10 and the electronic component 30 are securely and securely fixed electrically and mechanically. .

In the case of this mounting structure, if an excessively strong force is applied to the electronic component 30 in the direction of arrow A (lateral direction) shown in FIG. 1, the electronic component 30 slides in that direction. I can't say that there is no fear of doing it.
However, in the case of this embodiment, the insulating layer 2 having a predetermined thickness is provided at a position where the electronic component 30 is to slide.
Since the electronic components 30 and 21 are printed, the electronic component 30 strongly pressed against the flexible substrate 10 by the holding member 40 cannot exceed this thickness.
Is reliably prevented from sliding in the horizontal direction.

On the other hand, the guide projection 45 is provided for the following two reasons. In other words, the guide projection 45 is
This is because the holding member 40 is always positioned at an optimum position by being locked to the four outer sides 15a (see FIG. 1) of the holding member 40.

By providing a guide projection 45 higher than the electronic component 30 and the holding piece 41, other members can
Even if it tries to hit the holding member 41 or the holding piece 41, it only hits the guide member 45 and does not hit the holding piece 41 or the electronic component 30 directly, thereby further ensuring the mounting state of the electronic component 30. It is also to maintain.

[Second Embodiment] FIGS. 7 to 9 are views showing an assembling method for attaching an electronic component 30 to a flexible substrate 10 using a holding member 40-2 according to a second embodiment of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The holding member 40-2 according to this embodiment is different from the holding member 40 according to the first embodiment in that the base 42-2 has its both ends lifted upward in advance as shown in FIG. The only point that is curved. Therefore, both holding pieces 41-2, 41-2 are inclined more inward than each other in the first embodiment.

In order to attach the electronic component 30 to the flexible board 10 using the holding member 40-2, first, the electronic component 30 is placed on the push-up member 50-2 just below the flexible board 10 on which the electronic component 30 is placed. Clamping member 40-
2 is arranged. The upper surface 51- of the push-up member 50-2
2 is formed in a planar shape.

As in the case of the first embodiment, FIG.
As shown in (4), the pressing portions 47-2 of the holding member 40-2 are pressed by the four pressing protrusions 55 (only the two rear projections are shown in the figure) so that the two holding pieces 41-2, 41-2 are moved outward. Opening and pushing up the base 42-2 of the holding member 40-2, the member 50-2
The electronic component 30 is positioned by the jig 60 and pressed up against the upper surface 51-2 of the electronic component 30.
Are held open and both holding pieces 41-2 and 4 are open.
1-2 is put on both sides of the two projections 31, 31 of the electronic component 30, and then the push-up member 50-2, the pressing projection 55, and the jig 60 are removed, and as shown in FIG.
The electronic component 30 is firmly and securely fixed to the flexible substrate 10 by -2 and 41-2.

[Other Embodiments] The present invention is not limited to the above embodiments. For example, the guide projection 45 shown in FIG. 1 may be omitted in some cases, for example, as shown in FIG. 3 and a holding member 40-3 provided with a positioning hole 49-3.

The position of the pressing portion provided on the holding member is not limited to the position in each of the above embodiments, but may be another position.
In short, any location may be used as long as it can be pressed in the direction to open the holding piece. That is, as shown in FIG. 11, for example, instead of providing pressing portions on both holding pieces 41-4, 41-4, pressing portions 47-4 are provided at four corners of the base portion 42-4, and pressing is performed to press both portions. Pieces 41-4, 41-4
May be configured to be opened. A notch 70 is provided inside each pressing portion 47-4 so that the holding pieces 41-4, 41-4 can be easily opened.

Further, for example, the electronic component may be an electronic component having a function other than the functions described in the above embodiment, the shape of the electronic component, the shape of the holding member, the electrode pattern formed on the flexible substrate, and the formation of the electrode pattern. It goes without saying that various modifications can be made to the shape of the part.

In the above embodiment, the electrode pattern is formed by printing a silver paste. However, the present invention is not limited to this. The electrode pattern may be formed by etching a copper foil or formed by other methods. It may be what you did.

For further reinforcement, a solder or an adhesive may be used in combination.

[0044]

As described above in detail, according to the present invention, when an electronic component is mounted on a flexible substrate, there is an excellent effect that there is no possibility that the electronic component may be overburdened or damaged.

Further, since a positioning hole is provided in the center base of the holding member, the positioning of the holding member on the push-up member on which the holding member is placed can be reliably performed when the holding piece is opened. The opening operation can be performed reliably.

Further, according to the present invention, since the insulating layer having a thickness for preventing the electronic components from sliding is provided on the flexible substrate, there is a possibility that the electronic components slide in a direction not to be pinched by the pinching member to cause positional displacement. It has an excellent effect of being prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a main part of a structure for attaching an electronic component to a flexible substrate according to a first embodiment of the present invention.

FIG. 2 is a plan view of a holding member 40. FIG.

FIG. 3 is a side sectional view showing an assembling method of attaching the electronic component 30 to the flexible substrate 10 using the holding member 40.

FIG. 4 is a side sectional view showing an assembling method of attaching the electronic component 30 to the flexible substrate 10 using the holding member 40.

FIG. 5 is a side sectional view showing an assembling method of attaching the electronic component 30 to the flexible board 10 using the holding member 40.

FIG. 6 is a side sectional view showing an assembling method of attaching the electronic component 30 to the flexible substrate 10 using the holding member 40.

FIG. 7 is a diagram illustrating an assembling method of attaching the electronic component 30 to the flexible substrate 10 using the holding member 40-2.

FIG. 8 is a diagram illustrating an assembling method of attaching the electronic component 30 to the flexible board 10 by using a holding member 40-2.

FIG. 9 is a diagram illustrating an assembling method of attaching the electronic component 30 to the flexible substrate 10 using the holding member 40-2.

FIG. 10 is a perspective view showing another holding member 40-3.

11A and 11B are diagrams showing another holding member 40-4, wherein FIG. 11A is a perspective view and FIG. 11B is a plan view.

FIG. 12 is a diagram showing a mounting structure of an electronic component to a flexible substrate according to the earlier application of the present applicant, and FIG.
12A is a perspective view, and FIG. 12B is a side sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Flexible board 11 Sheet 13 Electrode pattern 17 Electrode pattern formation part 21 Insulating layer 30 Electronic component 33 Electrode part 40 Nipping member 41 Nipping piece 47 Pressing part

(56) References JP-A-2-101789 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/18 B23P 19/00 304 B23P 21/00 305 H05K 13/04

Claims (5)

(57) [Claims] 1. A flexible substrate having an electrode pattern formed on a flexible sheet; an electronic component having an electrode portion; and a holding piece for holding the electronic component, and pressing in a direction to open the holding piece. A holding member provided with a pressing portion, and a holding piece of the holding member provided on the back surface of the flexible substrate in a state in which the electrode pattern is brought into contact with the electrode portion of the electronic component mounted on the flexible substrate. A structure for mounting an electronic component on a flexible substrate, characterized in that the electronic component is clamped over the electronic component. 2. The flexible board according to claim 1, wherein the holding piece of the holding member holds the electronic component in a state where a part of the flexible board is bent from under the flexible board. Mounting structure to the. 3. A flexible substrate having an electrode pattern formed on a flexible sheet, an electronic component having an electrode portion, and a holding member having a holding piece for holding the electronic component are provided. The electronic component is arranged on the upper surface side, the holding member is arranged on the lower surface side, and the holding member of the holding member is opened by a jig, and the holding member is pressed against the lower surface of the flexible board, so that the holding member has a flexible board. The flexible board of the electronic component is characterized in that the electrode pattern of the flexible board is brought into pressure contact with the electrode portion of the electronic component by releasing the state in which the holding piece is opened while bending the part over the flexible substrate. Mounting method. 4. A flexible substrate comprising an electrode pattern formed on a flexible sheet; an electronic component having an electrode portion; and a holding member having a holding piece for holding the electronic component. In a state where the electrode pattern is in contact with the electrode portion of the electronic component mounted on the flexible board, the holding piece of the holding member provided on the back surface of the flexible board is moved over the flexible board to hold the electronic component, and Wherein an insulating layer having a thickness for preventing the electronic component from sliding in a direction not sandwiched by the sandwiching member is provided. Clamping piece according to claim 5, wherein the clamping member, the electronic components of the flexible substrate according to claim 4, wherein the clamping the electronic component in a state in which bent portions of the flexible substrate from below the flexible substrate Mounting structure to the.