JP3194669B2 - Inspection device and connection method in inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for inspecting electrical characteristics of a semiconductor wafer, for example, and a connection method in such an inspection apparatus.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, a large number of semiconductor devices are formed on a semiconductor wafer.
Disconnected for each device. In the manufacturing process of such a semiconductor device, the electrical characteristics of a semi-finished semiconductor device are conventionally inspected in the state of a semiconductor wafer using a probe device.

This probe device has a large number of probes capable of contacting electrode pads of each chip on a semiconductor wafer. When the probe contacts each chip,
Various measurement patterns from a tester are applied to each chip.
The output pattern from each chip is monitored by a probe device. As a result, the electrical characteristics of each chip on the semiconductor wafer are inspected.

As such a probe device, a probe device having a structure in which a test head containing a test circuit or the like can move between a test position and a retracted position retracted from this position is used. The test head comes into contact with each contact of the probe card at the inspection position, and is moved toward the retracted position, whereby the contact with each contact is released. And when the test head is in the retracted position, for example,
The probe card is exchanged in the inspection device.

[0005] Between the test head and the probe, a connection unit for connecting them is provided. The connection unit has a plurality of terminals at the upper part thereof to which the wiring of the test head is connected, and a plurality of pogo pins as reciprocable contacts connected to these terminals at the lower end thereof. The pogo pin retracts when pressed against the electrode portion of the probe card, and makes proper contact with the electrode portion by the urging force of a spring built in the connection unit. This connection unit is attached to the test head,
When the test head is located at the inspection position, it is fixed to the head plate. Then, a probe card holder to which the probe card is fixed is attached to the head plate.

[0006]

By the way, in the conventional structure, when the test head turns and the test head and the probe card are connected, a virtual plane formed by the tip of the probe supported by the probe card is formed. In some cases, the wafer to be inspected is not parallel, and the probe and the semiconductor wafer are not properly contacted.

That is, when the test head turns and is located at the connection position where it is connected to the probe card, pressure acts on the probe card holder, and a bending moment is generated on the head plate. In particular, when there are a large number of pogo pins as contacts, in order to make all the pogo pins evenly contact the electrode portion of the probe card,
Significant contact loads are required. For example, if the contact load of the pogo pins of the connection unit is 100 g per one and the number of the pogo pins is 1,000, a load of about 100 kg is applied as a load to the head plate. For this reason, the head plate bends and deforms due to the bending moment, thereby deforming the probe card. In this case, the amount of deflection of the head plate depends on the strength of the head plate, but is 100 to 250 μm.
m.

Therefore, when such a bending deformation occurs, the contact condition between the semiconductor wafer and the probe, which is set before the test head is set at the connection position, that is, the contact angle and the contact position Changes. When the contact angle changes, the tip of the probe needle is naturally inclined, and the best contact in a direction perpendicular to the electrode pad cannot be made. Moreover, in addition to the change in the contact angle of the probe, there is a possibility that the probe may be displaced or the probe may be cut. In other words, if bending deformation occurs in the head plate, the distance between the probe and the test object is not constant,
In a portion where the distance between the probe and the inspection object is short, the probe may be buckled and cut, or the tip of the probe may be displaced.

Another problem is that it is difficult for the conventional device to properly make contact between the probe card and the pogo pins. This is for the following reasons.

[0010] The support shaft, which forms the pivot of the test head,
Usually, it is arranged above the head plate. One of the reasons is that a path for automatic replacement of the probe card is provided inside the head plate, thereby preventing interference with peripheral devices. On the other hand, in the specifications of the tester, since the shortening of the measuring is required, the contact position between the probe card and the pogo pin is set to a position close to the wafer mounting table inside the probe device.

Therefore, there is a considerable distance between the axis of the support shaft and the probe card contact surface of the pogo pin. For this reason, when the test head rotates, the pogo pins located closer to the spindle contact the electrode portions of the probe card before the pogo pins located farther away.

As a result, the pogo pin at a position close to the support shaft is kept in contact with the pogo pin at a far position until it contacts the electrode portion.
Since the phenomenon of slipping on the electrode of the probe card occurs, the contact position shifts at that portion, the contact pressure becomes abnormally high, and the pogo pins are damaged. Such a phenomenon becomes more remarkable as the distance between the axis of the support shaft and the probe card contact surface of the pogo pin increases.

It is an object of the present invention to provide a good parallelism between a virtual plane formed by a tip of a contact such as a probe supported by a probe card and an object to be inspected. It is an object of the present invention to provide an inspection apparatus that stably contacts an object to be inspected.

Another object of the present invention is to provide an inspection apparatus and a connection of the inspection apparatus capable of preventing a bending deformation of a head plate and a probe card and optimizing a contact relationship between a contact such as a probe and an object to be inspected. It is to provide a method.

Still another object of the present invention is to provide an inspection apparatus of a type in which a test head rotates between an inspection position and a retracted position, in which a contact such as a pogo pin on a test head side and a probe card are always stably maintained. An object of the present invention is to provide an inspection device that can be brought into contact and a method for connecting the inspection device.

[0016]

In order to achieve the above object, an inspection apparatus according to the present invention includes a plurality of first contacts that contact an object to be inspected, and each of the first contacts is electrically connected to each of the first contacts. A probe card having a plurality of electrodes to be moved, a test head that moves between a retracted position and an inspection position, and performs electrical measurement of the device under test at the inspection position, and the probe at the inspection position. A plurality of second contacts for contacting each of the electrodes of the card, electrically connecting the probe card to the test head, and a connection member movably supported by the test head; A head plate for supporting a probe card, a moving means for moving the probe card between an inspection position close to the head plate and a standby position separated from the head plate, When the probe card moves from the standby position to the inspection position, the movement of the connection member to the test head side is restricted, and the second contact is moved in cooperation with the moving means. And a movement restricting member for applying a pressing force to the connection member and the probe card via the connection member.

According to a second aspect of the present invention, in the inspection apparatus according to the first aspect, the movement restricting member has a stopper, the connecting member has a flange, and the flange is locked to the stopper. The movement of the connection member is regulated.

According to a third aspect of the present invention, there is provided an inspection apparatus, comprising: a probe card having a plurality of first contacts in contact with an object to be inspected; and a plurality of electrodes respectively connected to the first contacts. A test head that moves between the retracted position and the inspection position and performs electrical measurement of the device under test at the inspection position;
A plurality of second contacts for contacting the respective electrodes of the probe card at the inspection position, for electrically connecting the probe card to the test head, and for a connection supported by the test head; A member, a support mechanism that movably supports the connection member with respect to the test head, and the connection member such that the second contacts are respectively located at corresponding electrodes of the probe card at the inspection position. Guide means for guiding the test head, a restricting means for restricting the movement of the connecting member to the test head side after the test head is located at the inspection position, and a restricting means for restricting the movement of the connecting member by the restricting means. And fixing means for fixing the probe card in a state where the probe card is pressed against the connection member.

According to a fourth aspect of the present invention, in the inspection apparatus according to the third aspect, when the test head moves from the retracted position to the inspection position, the restricting means includes an insertion allowable position for permitting insertion of the connection member. A regulating member that can be switched between a regulating position that regulates movement of the connection member toward the test head and a driving mechanism that switches the regulating member between an insertion allowable position and a regulating position. It is characterized by.

According to a fifth aspect of the present invention, in the inspection apparatus according to the fourth aspect, the connection member has a flange around the connection member, and the regulating member has a connection member insertion hole on an upper wall thereof and a continuous connection member with the insertion hole. And a notch corresponding to the flange, and a stopper, wherein the flange corresponds to the notch when in the insertion allowable position, and the flange corresponds to the notch when in the regulation position. It corresponds to the stopper.

According to a sixth aspect of the present invention, there is provided an inspection apparatus including a plurality of first contacts in contact with an object to be inspected, and electrodes electrically connected to the first contacts, and is horizontally supported by a head plate. A probe card, a test head that moves to a retracted position and an inspection position, and a plurality of second contacts that elastically contact the electrodes of the probe card at a predetermined contact pressure at the inspection position. A connection unit supported by the test head, and connecting the connection unit to the test head.
A support mechanism movably supporting the tester;
After the head is placed in the inspection position, the connection unit
Engaging member for restricting the movement of the
Moving the engaging member up and down,
It is characterized by having an air cylinder, the that.

According to a seventh aspect of the present invention, there is provided a probe card including a plurality of first contacts in contact with an object to be inspected, and a plurality of electrodes respectively connected to the first contacts, a retracted position, A test head that moves between an inspection position and performs electrical measurement of the device under test at the inspection position; and a plurality of second contacts that contact each electrode of the probe card at the inspection position. And a connection member electrically connected between the probe card and the test head and movably supported by the test head. Moving the test head from the retracted position to the inspection position and fixing the same; and, when the test head is fixed at the inspection position, moving the connection member toward the test head. And a step of moving the probe card toward the connection member, and bringing the second contactor into contact with the probe card in a state where a pressing force is applied by the movement. It is characterized by:

[0023]

According to the present invention, the test head is set at the inspection position and the probe card is moved to the inspection position, so that the second contact of the connection member supported by the test head is provided. And the probe card contact with a predetermined contact pressure. When the probe card moves in the direction approaching the head plate, the connection member provided with the second contact tries to move in the same direction as the direction in which the probe card moves, but the movement is restricted. Due to this movement restriction, a reaction force acts on the probe card via the connecting member, and the load for applying a bending moment to the probe card and, consequently, the head plate is offset. Thus, it maintains a virtual plane in which the first contact tip of the probe card is formed, it is maintained parallelism between the workpiece, a proper contacting relationship therebetween.

According to the third or fourth aspect of the present invention, in addition to the above-described operation, the connecting member is guided when the test head is set at the inspection position, so that the second contact is formed on the probe card. It can be brought into contact with an appropriate position.

According to the fifth aspect of the present invention, by combining the flange provided on the connection member with the notch into which the flange can be inserted, the movement of the connection member can be restricted with a simple structure.

In the invention according to claim 6, the probe card
Move when is supported horizontally by the head plate.
The engaging member of the regulating means is moved up and down by the air cylinder
The configuration is adopted.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram showing the entire configuration of an inspection apparatus according to one embodiment of the present invention. FIG. 2 is a schematic view showing the main part, showing a state before entering an inspection state.

This inspection apparatus is provided in the housing 1 and has a positioning unit 100 for positioning a semiconductor wafer W as an object to be inspected, and an inspection unit 200 for performing inspection.

The positioning unit 100 includes a main stage 1
01 and a moving mechanism 102 provided thereon. The moving mechanism 102 is a z-θ stage 1 on which the semiconductor wafer W is placed and which moves in the z direction and the θ direction
03 and the moving x stage 104 moving in the x direction
And a y stage 105 that moves in the y direction.
The semiconductor wafer W can be moved to a desired position.

The inspection section 200 includes a probe card 20 provided to face the moving mechanism 102, a test head 30 for electrically measuring a semiconductor wafer W to be inspected, a probe card 20 and a test head. 30
And a connection unit 40 that constitutes a connection member for electrically connecting. A head plate 10 is provided at the uppermost portion of the housing 1, and the probe card 20 is supported by the head plate 10 in an inspection state.

The head plate 10 has a connection unit 40
Is formed, and an engagement member 12 for engaging the connection unit 40 is rotatably fitted in the hole 10a.

The probe card 20 includes a substantially disc-shaped printed circuit board 21, a plurality of probes 22 projecting from the lower surface thereof, and a plurality of electrode pads 23 provided on the upper surface thereof in correspondence with the probes 22. Have been. The probe card 20 is attached to a probe card holder 24 whose outer peripheral portion on the lower surface is made of stainless steel or the like. The card holder 24 is set in a shape having a surface for supporting and fixing the probe card 20 and a surface connected to a part of a driving mechanism 50 described later.

The test head 30 has a built-in performance board 31 on which elements for inspecting electrical characteristics of the semiconductor wafer W are mounted. As will be described later, the test head 30 movably supports the connection unit 40. I have. Then, the test head 30 is driven by an arrow A in FIG.
Along the line between the inspection position shown in FIG. 1 and the retracted position.

The connection unit 40 has a cylindrical shape, and is provided with a plurality of pogo pins 41 at its bottom, which are in elastic contact with the electrode pads of the probe card. The elastic force of the pogo pins 41 is provided by a coil spring (not shown) provided in the connection unit 40. The pogo pins 41 of the connection unit 40 are electrically connected to terminals of the performance board 31 by flexible wiring 33. Due to the flexible wiring 33, the connection unit 40 is, for example, about 3 m with respect to the test head 30.
A moving margin of m is secured.

The probe card 20 is movable between a lower standby position and an upper inspection position by a driving mechanism 50 while being supported by the holder 24. The drive mechanism 50 uses air pressure, and includes an insert ring 51, an air cylinder 52, an elevating member 53, and a spring 54 as an urging member. A guide pin 51a for guiding the card holder 24 is attached to a lower end of the insert ring 51.

The insert ring 51 is exchangeable according to the size of the probe card 50 and is fixed to the head plate 10. The air cylinder 5
Reference numeral 2 is attached to an insert ring 51, and a piston 52a which can be advanced and retracted by air is inserted therein. The lifting member 53 has a piston 52 at one end.
a, and the other end is fixed to the card holder 24. The spring 54 has a biasing force in the direction of pushing down the piston 52a, and keeps the probe card 20 at the standby position by pushing down the elevating member 53 until the pressure in the cylinder 52 reaches the biasing force or more. On the other hand, cylinder 5
When the pressure in 2 rises above the urging force of spring 54, card holder 24 rises along guide pin 51a, and probe card 20 rises to the inspection position.

Next, the relationship between the engaging member 12 and the connecting member 40 will be described with reference to FIG.

As described above, the engaging member 12 is rotatably fitted into the circular hole 10a of the head plate 10, and is driven by a driving member 14 such as an air cylinder.
It is rocked along the inner circumference of a. The engagement member 12 has a cylindrical shape having a ceiling wall 12a, and a hole 12b for inserting the connection unit 40 is provided at a center position of the ceiling wall 12a. Notches 12c and stoppers 12d are alternately formed on the ceiling wall 12a of the engaging member 12 at predetermined intervals along the circumferential direction of the hole 12b. The stopper 12d is formed by leaving the ceiling wall 12a between the notches 12c.

A flange 42 radially projects from the outer peripheral wall of the connection unit 40 at an interval corresponding to the notch 12c of the engagement member 12. Some of these collars 42
For example, as shown in FIG. 3, every other hole 43 penetrates and is formed. The hole 43 has a tapered shape extending from top to bottom as shown in FIG. The insert ring 51 is provided, at positions corresponding to the holes 43, with guide pins 18 having a conical tip for positioning and guiding the connection unit 40 (see FIG. 2).

The driving member 14 is configured such that the position of the engaging member 12 is set at the first position where the flange 42 of the connection unit 40 can enter the notch 12c, and the position of the flange 42 is notched.
c, the stopper 12d is provided on the upper surface of the flange 42.
Are switched between the opposing second position. Therefore, in a state where the engagement member 12 is in the first position, the connection unit is configured such that the flange 42 has the notch 1.
2c, the guide pin 18 is inserted into the hole 12b of the engagement member 12 while the guide pin 18 is being inserted into the hole 43b.
And guides the connection unit 40. Thereby, the pogo pins 41 are positioned with respect to the electrode pads 23 on the arrangement plane. That is, the corresponding positions in the X and Y directions of the probe card 20 and the pogo pins 41 are set.

When the test head 30 is turned to the inspection position, the connection unit 40 is locked at the inspection position by the locking member 34.

Next, the test head 3 of the connection unit 40
The support mechanism for the zero will be described.

As shown in FIG. 5, a support board 44 having a disc shape is fixed to the upper end of the connection unit 40. The connection board 40 is movably supported by the test head 30 by the support board 44. You. That is, the support board 44 moves with respect to the test head 30 along the orthogonal X and Y axes, the orthogonal Z axis, and the θ direction (rotation direction) on the arrangement plane of the pogo pins 41. And a support mechanism that allows tilting movement.

This support mechanism will be described with reference to FIG. As shown in FIG. 5, the support board 44 has a hole 44a at the center, and a plurality of mounting holes 44b are formed at a predetermined radius from the center position. In FIG. 5, the mounting holes 44b are schematically shown for the sake of convenience in order to position components used for attitude control described later, and this function is effectively exhibited in an actual structure. That is, a structure that can be used is adopted.

A first elastic body 46 is arranged inside the mounting hole 44b along the circumferential direction.

Further, at the two positions of the first elastic body 46,
The second elastic bodies 48 extending vertically upward are arranged respectively. The second elastic body 48 is provided with the first elastic body 4.
6 is connected to the test head. The first elastic body 46 is provided to rotationally move the connection unit 40 in the X and Y-axis directions on the arrangement plane of the pogo pins 41 and as indicated by the reference numeral θ in FIG. In addition, the second elastic body 48 allows the connection unit 40 to move in the vertical direction (Z direction) and to tilt.

With such a support mechanism, the posture of the support board and the connection unit 40 fixed thereto can be freely changed. That is, the connection unit 40 is supported by the test head 30 so as to be freely movable.

Next, the operation of the inspection apparatus thus configured will be described.

Prior to turning the test head 30 from the retracted position to the inspection position, the z-θ stage 103 on which the semiconductor wafer W is mounted and fixed is moved to the non-inspection position, as shown by a two-dot chain line in FIG. It has been lowered. Further, as shown in FIG. 1, the drive mechanism 50 is set in a state where the piston 52a of the cylinder 52 is retracted,
Therefore, the card holder 24 supporting the probe card 20 is maintained at the standby position in the lowered state.

On the other hand, the engaging member 12 is
According to the initial state of (1), the turning flange 42 of the connection unit 40 is positioned at the first position corresponding to the notch 12c.

When shifting from the non-inspection state to the inspection state, the test head 3 is turned by a turning mechanism (not shown).
0 is turned from the retracted position to the inspection position.

When the test head 30 is turned, the connection unit 40 engages the hole 12 of the locking member 12 before reaching the inspection position.
b and inserted into it. At this time, the flange 42 of the connection unit 40 passes through the notch 12c of the locking member 12 and enters the inside thereof. At the same time, a guide pin 18 having a conical tip is inserted into the hole 43, and the connection unit 40 is guided by the guide pin 18, and the pogo pins 41 are positioned with respect to the electrode pads 23 on the arrangement plane. You. At this time, since the connection unit 40 is movably supported by the test head 30 by the support mechanism shown in FIG.
The connection unit 40 can be guided and moved by the guide pin 18 irrespective of the zero position.

When the test head 30 reaches the inspection position,
The test head 30 is held at the inspection position by the locking member 34. Then, when the test head 30 stops at the inspection position, the locking member 12 is moved by the rotation of the rotation driving member 14 so that the stopper 12 d is moved to the flange 42 of the connection unit 40.
Is moved to the second position facing. That is, the stopper 12d is in a state in which the upward movement of the connection unit 40 is restricted.

As described above, even when the test head 30 is held at the inspection position, since the probe card 20 is still maintained in a lowered state, the electrical connection between the probe card 20 and the pogo pins 41 of the connection unit 40 is not yet established. Not done. At this time, the drive mechanism 50 may be set so that the pogo pin 41 and the probe card 20 are slightly in contact with each other if a small load on the probe card 20 is obtained.

When the test unit 30 is turned, if the connection unit 40 is fixed to the test head 30 as in the related art, the pogo pin whose turning radius from the support shaft of the test head 30 is short is turned. The probe card contacts the probe card before the pogo pin at the longer radius, and the pogo pin at the position with the shorter radius turns the probe card until the pogo pin at the longer radius contacts the probe card. Pressing will cause an excessive buckling load.

However, in the apparatus having the above-described configuration, the support board 44 is supported by the test head 30 so as to be freely movable as described above, so that the pogo pins at a position with a short turning radius abut on the probe card 20. When the support card 44 is tilted, the probe card 2
Excessive pressure on zero is avoided. Therefore, the possibility that the pogo pin located at the position where the turning radius is short is buckled can be almost eliminated. Further, since the connecting member 40 is positioned by being guided by the guide pin 18, the pressure acting on the pogo pin can be further reduced.

Test head 30 and connection unit 40
Is held at the inspection position, the probe card 20 supported by the card holder 24 by the drive mechanism 50 is pushed up with its surface horizontal from the standby position to the inspection position above it. At this time, as the probe card 20 is raised, the connection unit 40 is also raised. That is,
When the probe card 20 moves up, the electrodes of the card 20 come into contact with the pogo pins 41 of the connection unit 40, whereby the connection unit 40 rises. With this rise, as shown in FIG. 6, the flange 42 comes into contact with the lower surface of the stopper 12 d of the engagement member 12.

As described above, when the probe card 20 is pushed up to the inspection position by the driving mechanism 50 and the flange 42 comes into contact with the lower surface of the stopper 12d of the locking member 12, the probe card 20 is attached to the probe card 20 as shown in FIG. The pressure (the force indicated by the symbol F1 in FIG. 6) acts according to the pushing amount. The stopper 12d is provided on the flange 42 of the connection unit 40.
F2 acts as a reaction of F1 in the reverse direction. With such pressure, the pogo pins 41 and the electrode pads 2 are kept in a state where the pogo pin arrangement plane and the probe card 20 are parallel.
3 is securely connected electrically. Note that the cylinder 52 of the drive mechanism 50 is controlled so that the pressure at this time becomes an appropriate value.
Is set as appropriate.

In this case, the pogo pin 41 and the electrode pad 2
The pressure required for the electrical connection with the connection member 3 is given by the pushing up of the probe card 20 by the drive mechanism 50 and the movement of the connection unit 40 by the locking member 12. The pressure required for the electrical connection does not directly act on the head plate 10 as in the prior art. That is, conventionally, as shown in FIG. 7, the flange 42 is placed on the head plate 10 and the connection unit 40 is fixed to the test head 30, so that the electrical connection between the pogo pins 41 and the electrode pads 23 is achieved. Pressure directly acts on the head plate 10,
The head plate 10 has been deformed by bending due to the bending moment. However, in the state shown in FIG. 6, the flange 42 is not mounted on the head plate 10 and the connection unit 40 is movable. Such bending moment does not occur. Therefore, the head plate 10 is not bent and deformed, and the probe card 20 is prevented from bending.

In other words, the probe card 20 and the connection unit 40 only receive the pressure for sandwiching them, and do not apply excessive pressure to the outside. Therefore, the bending deformation of the head plate 10 occurs as described above. There is no.

When the apparatus is set to the inspection state by the above-described procedure, the probe card 20 does not bend. Therefore, the parallelism between the plane formed by the tip of the probe 22 of the probe card 20 and the semiconductor wafer W is ensured. Thereafter, as shown by a solid line in FIG. 6, the stage 103 is moved up, the electrode pads of the semiconductor wafer W are brought into contact with the probes 22, and an electrical inspection is performed.

As described above, according to the inspection apparatus of this embodiment, only the pressure for sandwiching the probe card 20 and the connection unit 40 is applied, but no excessive pressure for applying a bending moment to the head plate 10 is applied. In addition, when the test head 30 turns from the retracted position to the inspection position, the mounting stage 103 of the semiconductor wafer W is lowered, and the probe card 20 is also lowered.
The impact force to the vehicle does not have to be transmitted.

Further, the pogo pins 41 of the connection unit 40
Contact of the probe card 20 with the test head 3
After the 0 reaches the inspection position, the card surface of the probe card 20 is brought into contact with the probe card 20 horizontally. Therefore, even in an inspection apparatus having a moving structure of the test head by a swiveling method, the pogo pins 41 are A slip situation is prevented. Thereby, the displacement of each pogo pin can be eliminated.

In the above example, an air cylinder mechanism is employed as the driving mechanism 50, but the invention is not limited to this. For example, an eccentric cam mechanism can be used as shown in FIG. That is, the drive mechanism includes the interlocking member 57 and the eccentric cam 58 attached to the lower surface of the portion of the card holder 24 facing the head plate 10. The interlocking member 57 is in contact with the eccentric cam 58, and the interlocking member 57 moves up and down along a guide (not shown) by rotating the eccentric cam 58 by a rotating device (not shown). That is, the eccentric cam 58 is switched between a first position having the minimum eccentricity (indicated by a two-dot chain line in the figure) and a second position having the maximum eccentricity. When the eccentric cam 58 is at the first position, the interlocking member 57 is in a correspondingly lowered position as shown by a two-dot chain line, and the probe card 20 is maintained at the standby position. On the other hand, when the eccentric cam 58 is switched to the second position, the interlocking member 57 moves up along the guide, and the card holder 24 also moves up, so that the probe card 20 is moved to the inspection position. In this case, the maximum amount of eccentricity of the eccentric cam 58 is adjusted to an amount that allows the flange 42 of the connection unit 40 to contact the stopper 12d with a predetermined pressure.

In the above example, the engaging member 12 is fitted into the hole 10a of the head plate 10, but the engaging member 12 may be attached to the insert ring 51 as shown in FIG. In this case, as shown in FIG. 10, the air cylinder 6 is disposed between the engagement member 12 and the insert ring 51.
0 may be provided to move the engaging member 12 in the vertical direction.

In addition, various modifications can be made without departing from the gist of the present invention.

[0068]

According to the first, second and seventh aspects of the present invention,
By moving the probe card and restricting the movement of the connection member of the test head, a reaction force acts on the probe card via the connection member, and the load for applying a bending moment to the probe card and, consequently, the head plate is offset. You. Thus, it maintains a virtual plane in which the first contact tip of the probe card is formed, it is maintained parallelism between the workpiece, a proper contacting relationship therebetween.

According to the third or fourth aspect of the present invention, in addition to the above effects, when the test head is set at the inspection position, the connecting member is guided, so that the second contact can be connected to the probe card. It can be brought into contact with the appropriate position above.

According to the fifth aspect of the present invention, the movement of the connection member can be restricted with a simple structure by combining the flange provided on the connection member with the notch into which the flange can be inserted.

According to the sixth aspect of the present invention, the head plate
Movement restriction for probe card supported horizontally
The engaging member of the means is moved up and down by the air cylinder
be able to.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating an entire configuration of an inspection device according to one embodiment of the present invention.

FIG. 2 is a schematic diagram showing a state before entering an inspection state in a main part of the inspection apparatus according to one embodiment of the present invention;

FIG. 3 is a perspective view showing a locking member and a connection ring of the inspection device according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a flange in which a hole of a connection ring is formed.

FIG. 5 is a view showing a support mechanism of a connection ring for a test head.

FIG. 6 is a schematic diagram illustrating an inspection state in a main part of the inspection apparatus according to one embodiment of the present invention.

FIG. 7 is a schematic diagram for explaining a main part of a conventional inspection apparatus.

FIG. 8 is a sectional view showing a modification of the drive mechanism.

FIG. 9 is a sectional view partially showing an inspection apparatus according to another aspect of the present invention.

10 shows a modification of the device of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Head plate 12 Engaging member which constitutes test head holding means 12B Slit 14 Rotation driving member of engaging member 24 Card holder 22 Moving means 22B Interlocking member 22C Driving member 41 Pogo pin 20 Probe card 40 Connection unit 42 Flange

Claims (7)

(57) [Claims] A probe card including a plurality of first contacts in contact with an object to be inspected, a plurality of electrodes respectively conducting to the first contacts, and a probe card between a retracted position and an inspection position. A test head that moves at the test position and performs electrical measurement of the device under test at the test position; and a plurality of second contacts that contact the electrodes of the probe card at the test position. A probe card is electrically connected to the test head, and a connection member movably supported by the test head; a head plate supporting the probe card; and Moving means for moving between a test position and a standby position separated from the head plate; and the probe card moving from the standby position to the test position by the moving means. In this case, the movement of the connection member to the test head side is restricted, and a pressing force is applied to the connection member and the probe card via the second contact in cooperation with the movement means. An inspection apparatus, comprising: 2. The movement restricting member according to claim 1, wherein the movement restricting member has a stopper, the connecting member has a flange, and the stopper is locked by the flange to restrict the movement of the connecting member. An inspection apparatus characterized by the above-mentioned. 3. A probe card comprising a plurality of first contacts in contact with an object to be inspected, a plurality of electrodes respectively conducting to the first contacts, and a probe card between a retracted position and an inspection position. A test head that moves at the test position and performs electrical measurement of the device under test at the test position; and a plurality of second contacts that contact the electrodes of the probe card at the test position. A probe card is electrically connected to the test head, and a connection member supported by the test head; a support mechanism movably supporting the connection member with respect to the test head; Guide means for guiding the connection member such that the second contacts are respectively located on the corresponding electrodes of the probe card; and after the test head is located at the inspection position, the connection means Regulating means for regulating the movement of the material toward the test head side, and fixing means for regulating the movement of the connecting member by the regulating means and fixing the probe card in a state where the probe card is pressed against the connecting member. An inspection device, comprising: 4. The test apparatus according to claim 3, wherein the restricting unit includes: an insertion allowable position for allowing the insertion of the connection member when the test head moves from the retracted position to the inspection position; An inspection apparatus, comprising: a regulating member that can be switched between a regulating position that regulates movement to a head side; and a driving mechanism that switches the regulating member between an insertion allowable position and a regulating position. 5. The connection member according to claim 4, wherein the connection member has a flange around the connection member,
The upper wall has a connecting member insertion hole, a notch portion continuous with the insertion hole, corresponding to the flange, and a stopper, and when the insertion position is at the insertion allowable position, the flange is the notch portion. And wherein the flange corresponds to the stopper when in the regulation position. 6. A probe card having a plurality of first contacts in contact with an object to be inspected and electrodes electrically connected to the first contacts, and a probe card horizontally supported by a head plate; A test head that moves to an inspection position; and a plurality of second contacts that elastically contact the electrodes of the probe card at a predetermined contact pressure at the inspection position, and are supported by the test head. Connection unit, and the connection unit can be moved with respect to the test head.
After the test head is placed at the inspection position,
Restricting the connection unit from moving to the retreat position
Inspection system, wherein the movement restricting means having an engaging member, an air cylinder for vertically moving the engagement member, that it has a to. 7. A probe card having a plurality of first contacts in contact with an object to be inspected and a plurality of electrodes respectively conducting to the first contacts, and moving between a retracted position and an inspection position. A test head that performs electrical measurement of the device under test at the inspection position; and a plurality of second contacts that contact each electrode of the probe card at the inspection position. A connection member electrically connected to the test head, and a connection member movably supported by the test head. A method for connecting the test head and the probe card in an inspection apparatus, comprising: Moving the connecting member from the retracted position to the inspection position and fixing the same; and restricting the connection member from moving toward the test head when the test head is fixed at the inspection position. , The probe card is moved toward the connecting member,
Contacting the second contact and the probe card in a state where a pressing force is applied by this movement.