JP3166442B2 - Multilayer wiring board and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-density multilayer wiring board used for computers such as large-scale computers and workstations, exchanges, and the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a new high-density multilayer printed wiring board and a method for manufacturing the same in place of the conventional multilayer printed wiring board and the method for manufacturing the same, see, for example, Japanese Patent Application Laid-Open No. 4-148590.
The build-up method as disclosed in Japanese Unexamined Patent Publication (Kokai) No. H10-26095 is known.
Basically, after forming a photosensitive insulating material on the surface layer of the printed wiring board on which the surface layer conductor is patterned, forming a via hole by exposure and development, and then forming the conductor on the entire surface, Is patterned, and this is repeated to form a multilayer, and finally, a through-plated through-hole is formed. In this method, the connection between the surface conductor of the printed wiring board, the conductor layer of the build-up, and the conductor layer of the build-up is not a connection through a through-plated through hole by drilling, but a connection by a conformal via. A multilayer printed wiring board having a higher density can be obtained as compared with a printed wiring board in which interlayer connection is made only by holes. However, since the connection with the inner layer conductor of the printed wiring board or the connection on both sides of the printed wiring board is made by the through-plated through holes formed in the final stage, there is a disadvantage that the wiring density is reduced accordingly. Further, on a printed wiring board formed by drilling and having a through plated through hole that is not filled, a thin film multilayer wiring layer cannot be formed by a build-up method because a photosensitive insulating material cannot be formed.

[0003] A multi-layer printed wiring board is provided in which a hole of a plated through hole formed by drilling for interlayer connection is filled with a resin, and a conductive pad connected to the plated through hole is formed on the upper portion to effectively use the area of the plated through hole. As a manufacturing method, for example, there is a method disclosed in JP-A-4-168794. Although this method is effective for connecting two adjacent conductor layers of a multilayer printed wiring board, it is effective for connecting both conductor layers of the printed wiring board or for connecting two conductor layers separated by one or more conductor layers. After all, it is necessary to rely on the through-plated through holes formed in the final stage, and the completed multilayer printed wiring board has through-plated through holes that are not filled.

[0004]

As described above, the build-up method cannot be applied if the base printed wiring board has a through plated through hole. Also, even if a thin-film multilayer wiring layer is formed by a build-up method on a base printed wiring board without through-plated through holes, the connection between the conductor layer formed by the build-up and the inner-layer conductor of the base printed wiring board is not If through-plated through-holes are formed at the final stage in order to make connections on both sides of the base printed wiring board, it is inherently possible to maximize the wiring density of the build-up method that can form high-density wiring. Can not.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer wiring board which eliminates the influence of the through-plated through-hole and maximizes the original high-density wiring ability by which a build-up method can be formed, and a method of manufacturing the same. .

[0006]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors first set the structure of a multilayer wiring board at a desired position on a conductor of a hole-filled interlayer connection through hole. A laminate comprising a conductor pattern layer and an interlayer insulating film layer is formed on the double-sided printed wiring board provided with the conductor pads to be connected, and the conductor pads, the conductor pattern layers, and the conductor pattern layers are The structure is such that it is electrically connected. The double-sided printed wiring board may include an inner conductor layer.

[0007] In the multilayer wiring board of the present invention, first, on the conductor of the filled interlayer connection through hole serving as the base board.
The double-sided printed wiring board provided with the conductor pads to be connected at desired positions is manufactured by the following method.

(1) A step of forming a double-sided printed wiring board provided with a conductor pad connected to a desired position of a through-plated through-hole conductor. (2) A through-plated through-hole and a conductor gap of the double-sided printed wiring board are organically formed. This is a method including a step of filling with an insulating film of a system polymer.

The step of forming a double-sided printed wiring board provided with a conductor pad to be connected to a desired position of a through-plated through-hole conductor will be described below in more detail. That is, (1) a step of patterning a surface conductor of a double-sided copper-clad laminate having a through-plated through-hole by etching (2) a step of forming a resist removal pattern at a desired position on the double-sided printed wiring board conductor (3) A) a step of forming a conductor in the resist removal pattern; and (4) a step of removing the resist.

Further, it can be manufactured by the following method.

(1) A step of forming a resist removal pattern at a desired position on a surface conductor of a double-sided copper-clad laminate having a through-plated through hole (2) A step of forming a conductor in the resist removal pattern ) Step of stripping the resist (4) Step of patterning the surface conductor of the double-sided copper-clad laminate by etching, and penetration of a double-sided printed wiring board provided with a conductor pad to be connected to a desired position of the through-plated through-hole conductor The step of filling the plating through hole and the conductor gap with an organic polymer insulating film will be described in more detail. (1) A mold having a flat surface is placed on the double-sided printed wiring board, and Step of sandwiching a fluid organic polymer precursor containing no solvent between the mold and the mold (2) Evacuation between the mold and the double-sided printed wiring board Step (3): moving the mold in the direction of the double-sided printed wiring board to fill the flowable organic polymer precursor containing no solvent into the through-holes and the gaps between conductors; and (4) containing the solvent. Applying hydrostatic pressure to the non-fluid organic polymer precursor (5) curing the non-solvent fluid organic polymer precursor (6) removing the upper surface of the conductor covered with the organic polymer The method includes a step of exposing.

By the above method, it is possible to manufacture a printed wiring board provided with a conductor pad to be connected at a desired position on the conductor of the filled interlayer connection through hole. The following method was used as a method of forming a thin-film multilayer wiring layer on the surface of the base substrate. That is, (1) a step of forming a photosensitive insulating resin, (2) a step of forming a via hole in the photosensitive insulating resin by exposure and development, and (3) a step of roughening the exposed surface of the photosensitive insulating resin ( 4) A step of forming a conductor (5) A step of completely curing the photosensitive insulating resin by thermosetting (6) A build-up method including a step of forming a pattern by etching the conductor. This method is also a method of improving the bonding strength between the conductor and the interlayer insulating film, which has been a problem in the past.

Here, the material used in the present invention will be described in more detail. A fluid organic polymer precursor containing no solvent is a polyfunctional epoxy resin composition having two or more maleimide skeletons in the molecule. Compound composition, 2 per molecule
It is a composition of a compound having two or more cyanate ester skeletons, or a composition containing at least one of compounds having two or more benzocyclobutene skeletons in a molecule. The photosensitive insulating resin is a composition comprising at least a polyfunctional unsaturated compound that is solid at room temperature, an epoxy resin, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent, or at least an unsaturated group. Is a polyfunctional solid epoxy resin having two or more functional groups, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent, wherein the amine-based thermosetting agent is dicyandiamide or diaminodiamine. Triazine compounds are preferred.

[0014]

An interlayer insulating film layer is formed on a double-sided printed wiring board provided with a conductor pad for connecting the structure of the multilayer wiring board at a desired position on the conductor of the filled interlayer connection through hole.
And a conductive pattern layer are formed, and the conductive pad, the conductive pattern layer, and the conductive pattern layer are electrically connected to each other. The effect of the hole is eliminated, and a thin-film multilayer wiring layer can be formed thereon. Further, since there is no through-plated through hole formed in the final stage, the wiring density of the thin-film multilayer wiring layer on the base substrate can be maximized. Furthermore, connection of each conductor layer, such as connection between the thin-film multilayer wiring layer on the base substrate and the inner conductor layer of the base substrate or connection of both surfaces of the base substrate, can be performed without through-plated through holes in the final stage. Became.

With regard to the method for manufacturing a multilayer wiring board of the present invention, first, a mold having a flat surface is set on a double-sided printed wiring board provided with a conductor pad to be connected to a desired position of a through-plated through-hole conductor. A step of sandwiching a fluid organic polymer precursor containing no solvent between the double-sided printed wiring board and the mold; and a step of exhausting the space between the mold and the double-sided printed wiring board. Moving the mold in the direction of the double-sided printed wiring board and filling the solvent-free fluid organic polymer precursor into the through-holes and the conductor gaps; and the solvent-free fluid organic. A base including a step of applying a hydrostatic pressure to the polymer precursor, a step of curing the fluid organic polymer precursor not containing the solvent, and a step of exposing a conductor upper surface covered with the organic polymer. Double-sided printed wiring board Because of this method, it is possible to form an insulating film with uniform physical properties without pinholes or cracks in through-holes or conductor gaps, and it is necessary to connect the next conformal via to be formed. The surface of the conductive pad of the double-sided printed wiring board could be exposed and a base substrate having a flat surface could be produced.

Next, regarding the build-up method formed thereon, a step of forming a photosensitive insulating resin, a step of forming a via hole in the photosensitive insulating resin by exposure and development, and a step of The steps of roughening the surface of the insulating resin, forming a conductor, completely curing the photosensitive insulating resin by heat curing, and forming a pattern by etching the conductor have been performed. Thus, the bonding strength between the conductor and the interlayer insulating film, which has been a problem in the past, could be improved, and a highly reliable thin-film multilayer wiring layer could be formed.

Here, the material applicable to the above-mentioned method for filling the through-plated through-holes or the conductor gap is a fluid organic polymer precursor containing no solvent, and is a polyfunctional epoxy resin composition. Among the composition of the compound having two or more maleimide skeletons, the composition of the compound having two or more cyanate ester skeletons in the molecule, and the composition of the compound having two or more benzocyclobutene skeletons in the molecule A composition containing at least one or more provided an insulating film having excellent heat resistance, mechanical properties, electrical properties, and the like. Further, the photosensitive insulating resin for build-up, in order to improve the adhesive strength between the conductor and the interlayer insulating film, a component that is cured by light and a component that is cured by heat are necessary, at least,
A composition comprising a polyfunctional unsaturated compound solid at room temperature, an epoxy resin, an acrylate monomer, a photopolymerization initiator, an amine-based thermosetting agent, or at least a bifunctional or higher polyfunctional compound obtained by an addition reaction of an unsaturated group The composition comprising the solid epoxy resin, the acrylate monomer, the photopolymerization initiator, and the amine-based thermosetting agent was excellent in the adhesive strength between the conductor and the interlayer insulating film, and also had good resolution. Furthermore, by using a dicyandiamide or diaminotriazine compound as the amine-based thermosetting agent, migration of the conductor could be suppressed.

As described above, a highly reliable high-density multilayer wiring board having excellent properties such as heat resistance, mechanical properties, and electrical properties can be manufactured at low cost.

[0019]

The present invention will be described more specifically with reference to the following examples. Here, a description will be given through a multilayer wiring board in which both surface conductors of a double-sided printed wiring board are used as two types of power supply layers and two XY signal layers and one ground / cap layer are formed on both sides thereof and a method of manufacturing the same. Alternatively, a four-layer board having two XY signal layers in the inner layer of the double-sided printed wiring board may be used, and the present invention is not limited to these layer configurations.

[0020] <Example 1> First, where on the conductor of the filling has been interlayer connection through holes
An example of a method for manufacturing a double-sided printed wiring board provided with via conductors to be connected at desired positions will be described with reference to FIGS.

FIG. 1 a) has two types of through-plated through-holes 102 and 103 for connecting between the through-plated through-holes 101 connecting the signal layers on both sides and the power supply layer on the back side, and copper on both sides is patterned. A glass polyimide double-sided printed wiring board is prepared. B for printed wiring board
A printed wiring board made of T resin (manufactured by Mitsubishi Gas Chemical) or a printed wiring board using a highly heat-resistant epoxy resin may be used.

Next, a dry film resist is formed on both sides of the double-sided printed wiring board, and a resist removal pattern is formed at a desired position on a surface conductor or a through-hole land by exposure and development. Then, the conductor pads 104 were formed in the grooves by electroless copper plating, and the resist was peeled off to obtain FIG. 1B).

The structure shown in FIG. 1B) has a through-plated through-hole, a dry film resist is formed on both sides of a copper-clad laminate where the surface conductor is not patterned, and is exposed and developed to a desired position on the surface conductor. A resist removal pattern is formed, and then a conductor pad 104 is formed in the groove by electrolytic copper plating to remove the resist. Further, an electrodeposition resist is formed, and a desired removal pattern of the resist is formed by exposure and development. After formation, it can also be manufactured by forming a copper pattern by etching.

Thereafter, the gap between the through-plated through-holes of this substrate and the surface conductor is filled with an organic polymer insulating film 106 to obtain the substrate shown in FIG. 1C. The detailed steps will be described with reference to FIG. . A fluid organic polymer precursor 105 containing no solvent on both sides of the substrate of FIG. 1b), here a tetrafunctional epoxy resin Epicron EXA4700 (trade name, manufactured by Dainippon Ink) and a phenolic resin Barcam TD-213
A film-like composition consisting of 65 phr (trade name, manufactured by Dainippon Ink and Chemicals, Inc.) is placed on both sides of the substrate shown in FIG. 1b) and inserted between the Teflon-coated mold 201 shown in FIG. 2a). Then, as shown in FIG.
Is heated to 70 ° C. to melt the composition 105. Further, the space between the mold 201 and the substrate of FIG. 1b) is evacuated to 10 torr and maintained for about 7 minutes. Was filled. After the pressure between the mold 201 and the substrate in FIG. 1B) is returned to the atmospheric pressure, the compression pressure in the vertical direction is 5 kgf / cm ² and the air pressure in the horizontal direction is 5 kgf / cm ^2.
cm ² and after 5 minutes the mold 201 was cooled from 70 ° C. to 200
The temperature was raised to 70 ° C (70 ° C / min) and kept for 30 minutes. Further, the mold 201 was removed, and the resultant was heated at 220 ° C. for 60 minutes under normal pressure to form an insulating layer 106 which was flat, had no voids and pinholes, and had uniform physical properties as shown in FIG. 2C).
Since the upper surface of the conductor pad of the substrate of FIG. 2c produced in this way had exposed and unexposed portions of the conductor, the substrate of FIG. 2c) was heated to 100 ° C., and UV was applied for 20 minutes.
By exposing the insulating film 106 to / O ₃ , the upper surface of the conductive pad is completely exposed, and in order to further improve the flatness, the upper surface of the exposed conductive pad is polished to be completely flat. FIG. 2d), ie, FIG.
The substrate of c) was obtained. Here, as the conditions of the mold, the degree of vacuum is 20 Torr or less, and the hydrostatic pressure is 20 kgf / cm.
² or less, further compression pressure in the vertical direction is desirably equal to or greater than the pressure from the lateral direction, the difference 1
More preferably, it is 0 kgf / cm ² or less. Further, oxygen plasma ashing, polishing, or the like can be used as a method of etch back.

<Embodiment 2> A desired position on the conductor of the filled interlayer connection through hole
Use substrate of FIG. 1c) formed by the method of Example 1 as a double-sided printed circuit board has contact pads provided to be connected in location, substrate and its production to form a thin film multi-layer wiring layer in the build-up method on this An example of the method will be described with reference to FIGS.

A resin composition comprising the following (a) to (f) was prepared and used as a photosensitive insulating resin of the present invention.

(A) 100 g of diallyl phthalate resin (b) 30 g of Epicoat 828 (c) 20 g of pentaerythritol triacrylate (4) 4 g of benzoin isopropyl ether (f) 4 g of (d) dicyandiamide (f) 2,4-diamino-6- [2 ' -Methylimidazolyl- (1 ')]-ethyl-s-triazine 1g (g) Other (additive for improving coating properties) suitable amount First, the above (a) to (c) and an appropriate amount of solvent (ethyl cellosolve) It mixed and heated and stirred at 80 degreeC for 30 minutes. Next, after the resin composition is brought to room temperature, other components (d) to
(G) was mixed and kneaded with a three-roll mill to obtain a photosensitive insulating resin.

The photosensitive insulating resin 301 is applied to both sides of the substrate of FIG.
Pre-drying was performed for 30 minutes to obtain a substrate shown in FIG.
Next, pattern exposure was performed with UV light for 2 minutes using a 400 W high-pressure mercury lamp, and development was performed to form a via hole 302.
Further, the whole surface was exposed to obtain a substrate shown in FIG. After that, the surface of the resin was roughened in order to secure the adhesive strength between the resin and the plating film in a later step. The roughening solution and roughening conditions used are as follows.

[0029] Potassium permanganate 0.1-0.5
mol / l sodium hydroxide 0.2-0.4
mol / l liquid temperature 50-90 ° C. The substrate of FIG.
Immerse in 50 vol% hydrochloric acid for 3 minutes to neutralize, then wash with water
After drying, a roughened layer was formed. Next, it is immersed in a catalyst solution to activate the roughened layer, and the underlying conductive film is formed to 0.2 μm by electroless copper plating.
Heat curing was performed at 0 ° C. for 30 minutes, and finally, 15 μm thick electrolytic copper plating 303 was applied to obtain a substrate of FIG. 3C). The processing solutions and processing conditions are shown below.

(Catalyst treatment liquid) Cataplip 404 (270 g / l) manufactured by Shipley Co., Ltd., 45 ° C., 3 minutes Cataprip 404 (270 g / l), 45 ° C., 5 minutes Catapposit 44 (30 ml / l) Accelerator Room temperature, 3 minutes (conductive) Membrane) Shipley Co., Ltd. Copper Mix 328A (125 ml / l) room temperature, 1 minute Copper Mix 328L (125 ml / l) Copper Mix 328C (25 ml / l) (copper plating pretreatment) Neutraclean (50 vol%) room temperature, 3 minutes sulfuric acid washed (10 vol%) at room temperature, 1 minute (thickening copper _{electroplating) CuSO 4 · 5H 2 O (} 75ml / l) H 2 SO 4 (98ml / l) HCl (0.15ml / l) Cu- board HA makeup ( 10ml / l) Ebara Uzilite Co., Ltd. Liquid temperature Room temperature Current density 2A / dm ² Next, the usual manner to form an etching resist to a substrate, exposure, development, copper 30 etching, peeling process
3 in which the first conductor pattern layer 304 is formed by patterning the first conductive pattern layer 304 and removing an unnecessary catalyst between circuits.
The substrate of d) was obtained. The catalyst was removed by immersion in a strong alkaline aqueous solution of 5 wt% NaOH for 10 minutes.

The second and third conductive pattern layers were formed in the same manner as described above. Finally, a solder resist was formed on the surface to obtain the substrate shown in FIG. In the layer structure of the substrate shown in FIG.
2 and 403, and 406 and 407 are signal layers, 404 and 4
Reference numeral 05 denotes two types of power supply layers, and the connection between the signal layers on the front and back surfaces of the base substrate and the power supply layer on the back surface is made by conductive pads 409 connected to the filled through plated through holes.

Example 3 The following electroless nickel plating was performed as a base conductive film, and the substrate of FIG. 4 was obtained in the same manner as in Example 2.

(Electroless Nickel Plating Solution) Blue Shumer (Ni-P) Undiluted Solution Manufactured by Kanigen Co., Ltd. Solution temperature 80 ° C. Plating time 5 minutes Nickel had higher adhesive strength to resin than copper to underlying conductive film.

<Embodiment 4> The same electroless nickel plating as in Embodiment 3 was used for the protection of the conductor surface on the substrate surface and the underlying conductive film in FIG. The substrate of FIG. 4 was obtained in the same manner as in Example 2 except for using the roughening solution and conditions.

Chromic anhydride 2.0 mol /
l-saturated concentration sulfuric acid 3.6-6mo
1 / l Liquid temperature 50-80 ° C Time 3-10 minutes Alkaline neutralization treatment 5-10 minutes

[0036]

According to the present invention, the wiring density is calculated assuming that a grid pitch is 1.27 mm and two wirings can be formed between the grids in a normal printed wiring board in which an interlayer connection is made between through through holes and interstitial via holes. Assuming that (the number of grids and the wiring length are taken into consideration), the thin-film multilayer wiring layer formed by the build-up method of the multilayer wiring board of the present invention can form at least two wirings at a grid pitch of 0.635 mm. The density is about 2. This means that if the area is the same, the number of signal layers of a normal printed wiring board can be reduced to 、, and if the number of signal layers is the same, the area can be reduced to 、. Great effect of cost reduction. On the other hand, if the through-plated through-holes are formed at the final stage of manufacturing, wiring corresponding to the area is lost.

As described above, the highly reliable multilayer wiring board and the method of manufacturing the same according to the present invention make it possible to maximize the original high-density wiring ability by which the build-up method can be formed. Densification and low cost were realized.

[Brief description of the drawings]

FIG. 1 is a process diagram showing an example of a multilayer wiring board and a method of manufacturing the same according to the present invention.

FIG. 2 is a process chart showing an example of a method for manufacturing a multilayer wiring board according to the present invention.

FIG. 3 is a process chart showing an example of a method for manufacturing a multilayer wiring board according to the present invention.

FIG. 4 is a diagram showing an example of a multilayer wiring board according to the present invention.

[Explanation of symbols]

Reference numeral 101: through-plated through hole for connecting signal layers on both surfaces; 102, through-plated through hole for connection to a power supply layer on the back surface; 103, through-plated through hole for connection to a power supply layer on the back surface; Reference numeral 105: an organic polymer insulating film; 106, a fluid organic polymer precursor containing no solvent; 201, a mold; 301, a photosensitive insulating resin; 302, a via hole; 303, thick copper electroplating; 304: first conductor pattern layer, 401: cap and ground layer, 402: signal layer, 403: signal layer, 404: power layer, 405: power layer, 406: signal layer, 407: signal layer, 408: Cap / ground layer, 409 ... conductor pad.

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Makio Watanabe 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside of Hitachi, Ltd. Production Technology Research Laboratory (72) Inventor Isamu Tanaka 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Address Co., Ltd.Hitachi, Ltd.Production Technology Research Laboratories (72) Inventor Hitoshi Oka 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture 292 Yoshida-cho, Hitachi, Ltd.Production Technology Laboratory (72) Inventor Yukihiro Taniguchi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Pref.Hitachi Ltd.Hitachi, Ltd.Information and Communication Division (56) References JP-A-4-94186 (JP, A) Japanese Utility Model Hei 3-85686 (JP, U) (58) Fields surveyed (Int. Cl. ⁷ , DB name) H05K 3/46

Claims (10)

(57) [Claims] 1. A printed wiring board and an interlayer connection through hole conductor.
Body, conductive pad, insulating film, conductive pattern layer, layer
An interlayer insulating layer, wherein the interlayer connection through-hole conductor is formed on at least a part of an inner surface of the interlayer connection through-hole provided on the printed wiring board and at least a part of an upper surface of the printed wiring board, and the conductive pad is provided on the printed wiring board. The printed wiring board is disposed so as to be connected at a desired position on the interlayer connection through-hole conductor within the upper surface of the board, and the insulating film includes the inside of the interlayer connection through-hole and excludes the conductor pad. And disposed on the interlayer insulating film above the insulating film.
Forming a laminate comprising a conductor pattern layer, wherein the conductor pad
And between the conductive pattern layers and between the conductive pattern layers
Characterized by being electrically connected to
substrate. 2. The multilayer wiring board according to claim 1, wherein said insulating film and said interlayer insulating layer are made of the same material. 3. A method for manufacturing a printed wiring board, wherein: (1) forming an interlayer connection through hole in the printed wiring board;
Process and, (2) forming an interlayer connection through-hole conductors at least a portion of the inner surface and the upper surface of the printed wiring board of the interlayer connection through holes, (3) in the upper surface of the printed wiring board, the interlayer connection scan
Conductor so that it is connected at the desired position on the conductor.
And forming a head, the internal (4) the interlayer connecting through-hole, the conductor
Make sure to cover the top of the printed wiring board except for the pad.
A method for manufacturing a printed wiring board , comprising: a step of forming an edge film.
Law. 4. The step of forming the conductor pad includes : (1) a surface layer of a double-sided copper-clad laminate having a through hole;
A step of forming a pattern by etching the conductor ; (2) a step of forming a resist removal pattern at a desired position of the surface conductor including at least the through-hole; and (3) a conductor inside the removal pattern. 4. The pudding according to claim 3 , further comprising: a forming step; and (4) a step of removing the resist.
Method of manufacturing wiring board. 5. The step of forming the conductor pad includes : (1) a surface layer of a double-sided copper-clad laminate having a through hole;
Form resist removal patterns at desired locations on conductors
And that step, a step of forming a conductor inside the pattern-out (2)該抜, removing the (3) the resist, a pattern using the etching surface conductor (4) the double-sided copper-clad laminate 4. A pudding according to claim 3 , further comprising a step of forming.
Method of manufacturing wiring board. 6. A step of forming an insulating film so as to cover the upper surface of the printed wiring board including the inside of the interlayer connection through hole and excluding the conductor pad, (1) forming an insulating film above the printed wiring board; Disposing a flat mold, and supplying a fluid organic polymer precursor containing no solvent between the mold and the printed wiring board; and (2) providing the mold and the printed wiring board with each other. And (3) moving the mold in a direction substantially perpendicular to the printed wiring board, and exposing the polymer precursor including the inside of the through hole and excluding the conductor pad. (4) applying a hydrostatic pressure to the polymer precursor, (5) curing the polymer precursor, and (6) applying the hydrostatic pressure to the polymer precursor. A step of exposing the upper surface of the conductive pad, The method for manufacturing a printed wiring board according to claim 3, comprising: 7. The polymer precursor according to claim 1, wherein said polymer precursor is a polyfunctional epoxy resin composition, a compound having at least two maleimide skeletons in the molecule, or a compound having two or more cyanate ester skeletons in the molecule. The method for producing a printed wiring board according to claim 6, wherein the composition is a composition containing at least one of a composition and a compound having two or more benzocyclobutene skeletons in a molecule. 8. A printed wiring board having an interlayer connection sulfo.
(2) forming an inner surface of the interlayer connection through-hole and the print layout;
At least a part of the upper surface of the wire plate has an interlayer connection through-hole conductor
Forming a, (3) in the upper surface of the printed wiring board, a step of forming a conductor pad so as to connect at a desired position of the interlayer connection through-hole conductors, the internal (4) the interlayer connection through-hole Including the conductor
Make sure to cover the top of the printed wiring board except for the pad.
Forming an edge film; (5) forming a photosensitive interlayer insulating layer above the insulating film;
Forming a step, a step of forming a via hole (6) interlayer insulating layer, a step of roughening the surface of the (7) interlayer insulating layer, a conductive pattern layer on the upper surface of the (8) interlayer insulating layer that Do
And (9) a step of curing the interlayer insulating layer . 9. The composition according to claim 1, wherein said photosensitive interlayer insulating layer is a composition comprising a polyfunctional unsaturated compound which is solid at least at room temperature, an epoxy resin, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent. 9. The multilayer wiring board according to claim 8, comprising a composition comprising a polyfunctional solid epoxy resin having a bifunctional or higher functionality having an addition reaction of a saturated group, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent. Manufacturing method. 10. The method according to claim 9, wherein the amine-based thermosetting agent is a dicyanamide or diaminotriazine compound.