JP3165192B2 - Method for manufacturing semiconductor integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor integrated circuit device, and more particularly to a method for dividing a semiconductor integrated circuit substrate into chips.

[0002]

2. Description of the Related Art In recent years, in the field of semiconductor integrated circuits, high density and high integration of devices have been promoted, and miniaturization of devices has been progressing.

Such a semiconductor integrated circuit device is usually
A large number of integrated circuits are manufactured on a semiconductor substrate such as a silicon substrate, and after completion, the semiconductor integrated circuit chips are divided into semiconductor integrated circuit chips, and these semiconductor integrated circuit chips are mounted on a mounting member such as a lead frame or a tape carrier. Obtained by sealing with resin or the like.

Incidentally, the step of dividing the integrated circuit substrate into semiconductor integrated circuit chips is usually performed as follows.

[0005] As shown in FIG. 5 (a), a surface protection sheet 2 is adhered to a semiconductor integrated circuit board 1 so as to prevent air bubbles from coming out, and a fixing sheet 7 is attached to the back surface. The semiconductor integrated circuit board 1 is fixed to the suction stage 3 by mounting the circuit board 1 and performing vacuum suction through the suction holes 10.

[0006] The thin blade cutter 4 scans the semiconductor integrated circuit board 1 while performing positioning with a monitor TV 5 via a TV camera, and cuts the semiconductor integrated circuit board 1 into semiconductor integrated circuit chips 1C. After dividing in this manner, the surface protection sheet was peeled off as shown in FIG.
It is transported to the mounting line.

In this case, when the surface protection sheet is peeled off, the adhesive of the surface protection sheet remains on the chip surface, or the chips 8 bulge and remain beside the cutting line (scribe line). The chips 8 are pushed down and fall, and the fallen chips are scattered, which may cause dust, adhesion of dirt, scratches on the chip surface. Conventionally, these have often caused adverse effects such as malfunctions of the semiconductor integrated circuit.

In order to reduce the generation of such chips, a method of cutting the semiconductor integrated circuit board by half the thickness of the semiconductor integrated circuit board (half cut) at the time of cutting and applying pressure later to cut the semiconductor integrated circuit board, A method has been proposed in which the thickness of the circuit board is reduced from the beginning. However, the problem that chips are scattered on the surface to cause dust and dirt to adhere and flaws to be generated has not been improved yet.

[0009]

As described above, according to the conventional cutting method, when the chip surface is contaminated with an adhesive or when the surface protection sheet is peeled off, the chip 8 is pushed down and falls down, Scattering, etc., causes dust and dirt to adhere to the chip surface, scratches, and the like, thereby causing a problem of malfunction of the semiconductor integrated circuit.

The present invention has been made in view of the above circumstances, and prevents contamination of a chip surface by chips at the time of cutting,
An object is to obtain a highly reliable semiconductor integrated circuit device.

[0011]

Therefore, in a first aspect of the present invention, a sheet for protecting the surface is attached to the surface of the semiconductor integrated circuit substrate, and the semiconductor integrated circuit is left from the back side so as to leave the sheet for protecting the surface. The substrate is cut, and then the sheet for protecting the surface is peeled off to obtain a divided semiconductor integrated circuit chip.

Preferably, the sheet is attached via an ultraviolet-curable adhesive, and prior to peeling, the surface of the semiconductor integrated circuit substrate is irradiated with ultraviolet light to cure the ultraviolet-curable adhesive, In a state where it is easy to peel off.

According to a second aspect of the present invention, an adhesive layer is selectively formed on a region slightly larger than the region to be cut along the region to be cut, and the adhesive layer is used to form a surface of the semiconductor integrated circuit substrate. A sheet for protecting the surface is adhered to the semiconductor integrated circuit board, and the sheet for protecting the surface is cut together with the sheet for protecting the surface, divided into semiconductor integrated circuit chips, and then the sheet for protecting the surface is peeled off. .

In a third aspect of the present invention, an ultraviolet-curing adhesive is applied to the entire back surface of the sheet for protecting the surface, and the surface of the sheet is shielded from light in an area slightly larger than the area corresponding to the area to be cut. After forming a film pattern and irradiating ultraviolet rays with the light-shielding film pattern as a mask, and selectively curing the ultraviolet curable adhesive in an area other than the area where the sheet is cut, the sheet is placed on the surface of the semiconductor integrated circuit substrate. The semiconductor integrated circuit board is cut together with the sheet for surface protection, cut into semiconductor integrated circuit chips, and the sheet for surface protection is peeled off.

Preferably, prior to peeling, the surface of the semiconductor integrated circuit substrate is irradiated with ultraviolet rays to cure the ultraviolet-curable adhesive, and the sheet is peeled after it is easily peeled.

[0016]

According to the first structure, a sheet for protecting the surface is attached to the front surface of the semiconductor integrated circuit substrate and cut from the back surface side to be divided into semiconductor integrated circuit chips. Even if dust is generated, it is on the back side of the semiconductor integrated circuit substrate, and contamination on the surface is reduced. Since the semiconductor integrated circuit substrate is cut from the back side so as to leave the sheet for surface protection, the sheet remains as a unit after cutting, and is easily peeled off.

[0017] Then, the sheet is adhered through an ultraviolet-curable adhesive, and prior to peeling, the surface of the semiconductor integrated circuit substrate is irradiated with ultraviolet light to cure the ultraviolet-curable adhesive. As a result, the sheet is in a state of being easily peeled.

Further, according to the second configuration, an adhesive layer is selectively formed along a region to be cut on a region slightly larger than the region to be cut, and the sheet for protecting the surface is formed on the semiconductor integrated circuit. When the semiconductor integrated circuit board is cut together with the surface protection sheet, the vicinity of the cut surface is fixed by an adhesive layer, and the element region of the semiconductor substrate is bonded to the adhesive. The surface is protected by the sheet fixed only on the side surface of the cut surface without being contaminated, so that it is not contaminated by chips or the like. Also,
The adhesive layer for fixing the surface protective sheet can be easily peeled off by using an ultraviolet-curing adhesive and by irradiating with ultraviolet rays prior to peeling.

According to a third aspect of the present invention, an ultraviolet-curable adhesive is applied to the entire back surface of the sheet for protecting the surface, and the surface of the sheet is shielded from light in an area slightly larger than the area corresponding to the cut area. After forming a film pattern and irradiating ultraviolet rays using the light-shielding film pattern as a mask, and selectively curing the ultraviolet curable adhesive in an area excluding the cut area of the sheet, the sheet is used as a semiconductor integrated circuit board. When the semiconductor integrated circuit board is cut together with the surface protection sheet by bonding to the surface as in the second configuration, the vicinity of the cut surface is fixed by an adhesive layer, and the element of the semiconductor substrate is attached. The area is fixed to the surface protection sheet only on the side of the cut surface without contaminating the surface with the adhesive, and the area is protected by the adhesive layer and the sheet. And is it not also contaminated with such. Also in this case, the separation can be easily performed by irradiating ultraviolet rays before the separation.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

Embodiment 1 FIG. 1 is a diagram showing a method for cutting a semiconductor integrated circuit board according to a first embodiment of the present invention.

First, as shown in FIG.
A surface protective sheet 12 made of polyethylene or polyolefin film having a thickness of 80 .mu.m is coated on the surface of the semiconductor integrated circuit substrate 1 such as the side on which the integrated circuit is formed with an ultraviolet-curable adhesive P having a thickness of 10 .mu.m so as to prevent air bubbles. To stick through. Then, the semiconductor integrated circuit board 1 is mounted on a suction stage 13 made of an infrared-transmissive material such as glass, with the surface of the semiconductor integrated circuit board 1 facing down, and vacuum suction is performed from the suction hole 10. The semiconductor integrated circuit board 1 is fixed to the suction stage 13. Here, as the surface protective sheet 12 and the ultraviolet-curable adhesive P, an ultraviolet-curable dicing sheet manufactured by Lintec Co., which is designated as D-604MS, was used.

Then, the infrared lamp 1 is placed from the front side of the substrate.
6, the integrated circuit board 1 is irradiated with light, and the transmitted light is used to monitor the pattern of the scribe line 9 formed on the circuit board 1 using an infrared vidicon camera.
5, the thin blade cutter 4 whose height has been adjusted while scanning is scanned, and the semiconductor integrated circuit substrate 1 is sequentially cut and divided into semiconductor integrated circuit chips 1C. At this time, the surface protection sheet 12 is left without being cut.

After the division as described above, the stage 1
As shown in FIG. 1B, the fixing sheet 7 is adhered to the back surface of the semiconductor integrated circuit board 1 while the fixing sheet 7 is fixed. The fixing sheet 7 is made of a polyethylene or polyolefin film having a thickness of 80 μm similarly to the surface protection sheet 12, and is adhered via an ultraviolet curing adhesive (not shown).

Then, as shown in FIG. 1C, UV irradiation is performed from the front side of the semiconductor integrated circuit substrate 1.

Here, the ultraviolet curable adhesive P is applied as shown in FIG.
As shown in (2), when the cured state changes to P ', the adhesive strength is reduced, and the surface is easily peeled, the surface protection sheet 12 is peeled off at once. Here, the adhesive force of the ultraviolet-curing adhesive of the fixing sheet 7 also decreases in the region where the light is applied. In this case, since UV irradiation is performed from the front surface side of the substrate, that is, the side where the integrated circuit is formed, the chip In a certain area of the wiring pattern, the light is blocked, and the adhesive state can be maintained.

Then, the sheet is conveyed to a mounting line while being fixed on the fixing sheet 7.

Then, the fixing sheet 7 is extended, the interval between the chips is increased, and U
When V-irradiation is performed and similarly cured, the adhesive strength is reduced, and the film is easily peeled, it is transferred one by one using a collet, and positioned and mounted on a lead frame or a film carrier or the like.

The semiconductor integrated circuit chip thus formed can be obtained without chips attached to the surface, and a good surface state can be maintained.

Further, since the sheet remains intact without being divided, and the adhesive strength of the surface protection sheet can be reduced by UV irradiation, the surface protection sheet can be easily peeled off.

Here, in order to detect a scribe line from the back surface of the semiconductor integrated circuit substrate, a suction stage formed of an infrared transmitting material such as glass is used, and infrared light is irradiated from below to detect transmitted light. I did,
The detecting means may be placed on the lower side to detect the reflected light.

Embodiment 2 FIG. 2 is an explanatory view showing a method of cutting a semiconductor integrated circuit substrate according to a second embodiment of the present invention, and FIGS. 3 (a) to 3 (i) are cross-sectional views showing this process.

According to this method, an adhesive layer 23 is selectively formed along a cutting line, that is, a region 24 to be cut, in a region slightly larger than the region to be cut.
A surface protection sheet 25 is adhered to the surface of the semiconductor integrated circuit substrate 11 by using
The semiconductor integrated circuit substrate is cut, divided into semiconductor integrated circuit chips, and then a surface protection sheet is peeled off. Here, 22 is an element region, that is, a region where surface protection is to be performed.

First, as shown in FIG.
Integrated circuit substrate 11 on which integrated circuit 22 such as
To form Here, reference numeral 24 denotes a cutting line, that is, a region to be cut in the dicing step.

Next, as shown in FIG.
On the surface of a surface protection sheet 25 made of a polyethylene or polyolefin film having a thickness of 50 μm, a grid pattern 23 made of a 50 μm-thick ultraviolet-curable adhesive formed about 60 μm larger than the cut region 24 of the semiconductor integrated circuit board 11 by a printing method. Is fixed so that the pattern 23 coincides with the cutting region 24 of the semiconductor integrated circuit substrate 11. FIG. 3 (c) shows the state in which they are fixed.

Thereafter, the semiconductor integrated circuit board 11 is mounted on the fixing sheet 17 mounted on the suction stage with the back surface of the semiconductor integrated circuit board 11 facing down.
Is fixed, and dicing is performed from the surface of the substrate using a dicing machine 18 as shown in FIG. At this time, since the adhesive remains on the cut surface, the element region is well protected.

Thereafter, ultraviolet rays are irradiated from the substrate surface for about 5 seconds to cure the adhesive and reduce the adhesiveness. Here, as shown in FIG. 3 (e), the UV-curable adhesive is cured and changes its state to P ', the adhesive strength is reduced, and the adhesive is easily peeled.

Then, as shown in FIG. 3 (f), an adhesive tape 20 is adhered to the surface of the surface protection sheet 25, and the surface protection sheet 25 is peeled off at once.

The sheet is conveyed to a mounting line while being fixed on the fixing sheet 17. Then, as shown in FIG. 3 (g), the fixing sheet 17 is extended, the interval between the chips is increased, and as shown in FIG. 3 (h), UV irradiation is performed again from the bonding surface, that is, the back surface of the substrate. Similarly, when the adhesive is cured, the adhesive strength is reduced, and it becomes easy to peel off, as shown in FIG. 3 (i), it is transferred one by one using a collet 21 and positioned on a lead frame or a film carrier. Installing.

The semiconductor integrated circuit chip thus formed can be obtained without the surface of the element region being contaminated with an adhesive or attaching chips, and a good surface condition can be maintained. Can be.

In this example, an ultraviolet-curable pattern is used as the adhesive. However, the adhesive is not necessarily ultraviolet-curable, and a normal adhesive may be used.
When forming the pattern, not only a screen printing method but also a mask coating method of coating through a mask pattern or the like may be used.

Embodiment 3 FIGS. 4A to 4I are process sectional views showing a method for cutting a semiconductor integrated circuit substrate according to a third embodiment of the present invention.

In the second embodiment, the adhesive is patterned and printed. In this method, the ultraviolet curable adhesive 33 is applied to the entire back surface.
Is applied to the surface of the semiconductor integrated circuit substrate along the cutting line, that is, the cut area 34, and selectively on the area slightly larger than the cut area. Is formed, and the bonding function is selectively reduced by exposure through the light-shielding pattern 30, so that the adhesive region 33S is left in a pattern. Same as 2. Here, 32 is an element region, that is, a region where surface protection is to be performed.

First, as shown in FIG.
A 50 .mu.m-thick UV-curable adhesive 33 is applied to the entire back surface of the surface protection sheet 25 made of a polyethylene or polyolefin film, and the surface is formed to be about 60 .mu.m larger than the cut area 34 of the semiconductor integrated circuit board 31 by a printing method. A grid pattern 30 of a light-shielding film made of Cr and having a thickness of 50 μm is formed.

Thereafter, as shown in FIG. 4 (b), ultraviolet rays are irradiated from the front side to cure the ultraviolet curable adhesive in the area other than below the grid pattern 30 of the light-shielding film. Is left as the adhesive region 33S.

Thereafter, as shown in FIG. 4 (c), the adhesive area is formed on the back surface of the sheet so as to form a pattern in an area slightly larger than the area corresponding to the area to be cut in the cutting step. Is fixed such that the pattern-like adhesive region 33S coincides with the cutting region 34 of the semiconductor integrated circuit substrate 31. On the surface of the semiconductor integrated circuit substrate 31, an integrated circuit 32 such as a silicon IC is formed. Here, 34 is a cutting line, that is, a region to be cut in the dicing step.

FIG. 4 (d) shows the state of fixation.

Thereafter, the semiconductor integrated circuit board 31 is mounted on the fixing sheet 17 mounted on the suction stage with the back surface of the semiconductor integrated circuit board 31 facing down.
Is fixed, and dicing is performed from the surface of the substrate using a dicing machine 38 as shown in FIG. At this time, since the adhesive region 33S remains on the cut surface, the element region is well protected.

Thereafter, as shown in FIG. 4 (f), ultraviolet light is applied for about 5 seconds from an oblique direction of the substrate surface to harden the adhesive in the adhesive area 33S to lower the adhesiveness.

Then, as shown in FIG. 4 (g), the adhesive tape 20 is adhered to the surface of the surface protection sheet 35, and the surface protection sheet 35 is peeled off at once.

Then, the sheet is conveyed to a mounting line while being fixed on the fixing sheet 17. Then, as shown in FIG. 4 (h), the fixing sheet 17 is stretched, the interval between the chips is increased, and as shown in FIG. 4 (i), UV irradiation is performed again from the bonding surface, that is, from the back side of the substrate. Similarly, when the adhesive is cured, the adhesive strength is reduced, and the adhesive is easily peeled, as shown in FIG. 4 (j), it is transferred one by one using a collet 21 and positioned on a lead frame or a tape carrier. Installing.

The semiconductor integrated circuit chip formed in this manner can be obtained without the element region surface being contaminated with an adhesive and chips are not attached, and a good surface state is maintained. Can be.

[0053]

As described above, the first aspect of the present invention is as follows.
According to the method, a sheet for protecting the surface is attached to the front surface of the semiconductor integrated circuit board, and only the semiconductor integrated circuit board is cut so as to leave this sheet from the back side, and cut into semiconductor integrated circuit chips. Since this sheet is peeled, contamination on the surface of the semiconductor integrated circuit substrate is reduced, and reliability can be improved.

According to the second aspect of the present invention, an adhesive layer is selectively formed on a region slightly larger than the region to be cut along the region to be cut, and the surface protection sheet is formed on the semiconductor integrated circuit. When the semiconductor integrated circuit board is cut together with the surface protection sheet, the vicinity of the cut surface is fixed by an adhesive layer, and the element region of the semiconductor substrate is bonded to the adhesive. It is fixed to the surface protection sheet only on the side of the cut surface without being contaminated by the surface, and is protected by this adhesive layer and sheet,
There is no contamination by chips or the like.

According to the third aspect of the present invention, an ultraviolet-curable adhesive is applied to the entire back surface of the sheet for surface protection, and the surface of the sheet is coated with an area slightly larger than the area corresponding to the area to be cut. After forming a light-shielding film pattern and irradiating ultraviolet rays with the light-shielding film pattern as a mask to selectively harden an ultraviolet-curable adhesive in an area other than an area to be cut on the sheet, the sheet is mounted on a semiconductor integrated circuit substrate. When the semiconductor integrated circuit substrate is cut, the vicinity of the cut surface is fixed by an adhesive layer, and the element region of the semiconductor substrate is contaminated by the adhesive when the semiconductor integrated circuit substrate is cut. And is protected by a sheet for surface protection, so that it is not contaminated by chips or the like.

[Brief description of the drawings]

FIG. 1 is a view showing a cutting process of a semiconductor integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is an explanatory view showing a method for cutting a semiconductor integrated circuit device according to a second embodiment of the present invention.

FIG. 3 is a view showing a cutting step of the semiconductor integrated circuit device according to the second embodiment of the present invention.

FIG. 4 is a view showing a cutting step of the semiconductor integrated circuit device according to the third embodiment of the present invention.

FIG. 5 is a view showing a cutting step of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor integrated circuit board 1C chip 2 Surface protection sheet 3 Suction stage 4 Thin blade cutter 5 TV camera 6 Infrared lamp 7 Fixed sheet 8 Chip 9 Scribe line 10 Suction hole 11 Semiconductor integrated circuit board 12 Surface protection sheet 13 Suction stage 15 TV camera Reference Signs List 16 infrared lamp 17 fixing sheet P ultraviolet curing adhesive 23 adhesive layer 24 cutting line 25 sheet for surface protection 31 semiconductor integrated circuit board 32 element area 33S adhesive area 34 cutting line

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-167839 (JP, A) JP-A-2-306669 (JP, A) JP-A-64-61208 (JP, A) JP-A-62 79649 (JP, A) JP-A-3-239346 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/301

Claims (4)

(57) [Claims] In a method of manufacturing a semiconductor integrated circuit for dividing a semiconductor integrated circuit board into a plurality of semiconductor integrated circuit chips, a surface protection sheet is adhered to the surface of the semiconductor integrated circuit board via an ultraviolet curable adhesive. A sheet sticking step; a cutting step of cutting the semiconductor integrated circuit board from the back side so as to leave the surface protection sheet; and cutting the semiconductor integrated circuit board into semiconductor integrated circuit chips; and an ultraviolet ray on the surface of the semiconductor integrated circuit board. And an ultraviolet ray irradiating step of irradiating the ultraviolet curable adhesive to make the sheet easy to peel off, and a peeling step of peeling off the surface protection sheet. Device manufacturing method. 2. A method for manufacturing a semiconductor integrated circuit, which divides a semiconductor integrated circuit substrate into a plurality of semiconductor integrated circuit chips, selectively along a region cut in a cutting step to a region slightly larger than the region to be cut. A sheet adhering step of adhering a surface protection sheet to the surface of the semiconductor integrated circuit board with the adhesive layer, and cutting the semiconductor integrated circuit board together with the surface protection sheet A method for manufacturing a semiconductor integrated circuit device, comprising: a cutting step of cutting into semiconductor integrated circuit chips; and a peeling step of peeling the surface protection sheet. 3. A method for manufacturing a semiconductor integrated circuit, which divides a semiconductor integrated circuit substrate into a plurality of semiconductor integrated circuit chips, wherein an ultraviolet curable adhesive is applied to the entire back surface of the surface protection sheet; On the surface of the sheet, a light-shielding film pattern is formed in an area slightly larger than the area corresponding to the area to be cut in the cutting step, and ultraviolet light is irradiated using this light-shielding film pattern as a mask, excluding the area where the sheet is cut. An ultraviolet irradiation step of selectively curing the ultraviolet curing adhesive in a region; a sheet attaching step of attaching the sheet to a surface of a semiconductor integrated circuit board; and the semiconductor integrated circuit together with the surface protection sheet. A cutting step of cutting a substrate and cutting it into semiconductor integrated circuit chips; and a peeling step of peeling off the surface protection sheet. Method for producing a body integrated circuit device. 4. The method according to claim 1, further comprising: irradiating the surface of the semiconductor integrated circuit substrate with ultraviolet rays to cure the ultraviolet-curable adhesive before the peeling step, so that the sheet is easily peeled. 4. The method for manufacturing a semiconductor integrated circuit device according to claim 3, wherein: