JP3141135U - Light-emitting diode light inner tube structure - Google Patents

Abstract

The present invention provides a lamp train inner sleeve structure for a light-emitting diode that can improve the yield and reduce the cost by effectively reducing the outer diameter of the inner sleeve of the lamp train.
In a light-emitting diode-line inner-sleeve structure, at least a pair of positive and negative electrode conductors are installed in parallel or wound around each other, and includes a bare chip having at least an anode side and a cathode side. A light-emitting diode light-line sleeve structure characterized in that a cathode side is electrically connected to the positive and negative-electrode conductive lines, and the conductive line and each bare chip are covered with an insulating seal material to form a long light-line sleeve. is there.
[Selection] Figure 5

Description

The present invention is a light-emitting diode (LED, Light
In particular, the present invention relates to a design structure for improving the yield and reducing the cost by effectively reducing the outer diameter of the lamp train.

Traditional light-emitting diode (LED, Light
The structure of the Emitting Diodes) is composed of at least one light emitting diode chip 10 (commonly referred to as an LED bare chip) and a pair of parallel and corresponding lead frames 11 and 12, and the light emitting diode chip 10 is connected to one lead frame 12 And at least one metal filament 13 (the blue and green light emitting chips are connected to each lead frame using two metal filaments because the anode and cathode are on the same side). By electrically connecting the light emitting chip 10 to another lead frame 11, a closed electric circuit is formed between the lead frames 11 and 12, and the member is formed into a ram shape using a transparent sealing material (epoxy) 14 And only the lead wires 111 and 121 of the lead frames 11 and 12 are exposed (see FIG. 1).

However, most of the structures of the light emitting diodes are so-called lamp-type light emitting diodes (see FIG. 1) that are used as lighting fixtures. Therefore, in assembly, the lead wires 111 and 121 are placed on a socket dedicated to the light emitting diodes (not shown). By simply inserting and connecting the positive and negative electrodes, the assembly work can be completed easily, and the light emitting diode is ignited. However, when the light emitting diode is applied to a flexible light emitting array, in order to avoid the influence of the socket on the flexibility of the array, most of the sockets are omitted and the light emitting diode anode leads 111 and cathode leads are omitted. 121 is directly welded onto the anode conductor 15 and the cathode conductor 16 to form a closed serial lamp skew circuit between each light emitting chip 10 and the anode conductor 15 and the cathode conductor 16, and an insulating sealing material is used. The series lamp skewer circuit is used to form the lamp train inner tube 100. The lamp train inner tube 100 is covered with a PVC material to form a lamp train of existing light emitting diodes.

However, the disadvantage of the method for manufacturing the light train inner sleeve is that the respective light emitting diodes are welded, so that the manufacturing process becomes too complicated and affects the yield. Since at least the light emitting chip 10 and the sealing material 14 for sealing the light emitting diode, the lead frames 11, 12 and the like are accommodated, the outer diameter θ1 of the light train inner tube 100 becomes excessive, and the design outer diameter of the inner tube 100 is increased. It cannot be thinned. Accordingly, there is a limit to the application area in the luminous lamp train.

How to effectively improve the inner tube structure formed by light emitting diodes to achieve rapid production in mass production and effectively reduce the outer diameter of the light train inner tube to improve the application area in the light train Measures are also issues to be considered in the present invention.

In order to achieve the above-described object, the present invention provides a light-emitting diode light-inner tube inner tube structure in which at least a pair of positive and negative electrode conductors are installed in parallel or around each other, and at least one bare chip having an anode end and a cathode end is provided. The anode end and the cathode end are electrically connected to the positive and cathode conducting wires, respectively, and the conducting wire and each bare chip are covered with an insulating sealing material to form an elongated lamp train inner tube. To do.

With the above-described configuration, it is possible to achieve a high speed of production and to have a double effect of effectively reducing the outer diameter of the light train inner tube.

The lamp inner tube structure of the light emitting diode according to the present invention is characterized in that an insulating adhesive is applied to the surface of the contact portion between the positive and negative electrode conductors and the bare chip.

Accordingly, the positive and negative electrode conductors in the light-emitting diode inner-tube structure of the light-emitting diode of the present invention are polyester-coated copper wire, nylon-coated polyester copper wire, or enameled wire made of polyvinyl chloride steel wire material. .

In addition, the said inner tube structure of the lamp train inner tube structure of the light-emitting diode in an idea is completed using the following method.
Step 1 (S1): Place positive and cathode conductors at the conductor positions on the respective tool.
Step 2 (S2): Place the LED bare chip on the chip position on each jig, and electrically connect the cathode end and anode end of the bare tip to the respective positive and cathode conductors.
Step 3 (S3): An anode lead wire, a cathode lead wire, and a bare LED chip are formed into a single-tube structure using an insulating sealing material.

With the above-described configuration, it is possible to achieve a high speed of production and to have a double effect of effectively reducing the outer diameter of the light train inner tube.

The inventive light-emitting diode array inner tube structure uses an electrical connection method between the positive / cathode lead wire and the positive / cathode end of the bare LED chip, and directly connects each electrode end to the lead wire (commonly called filament). ) Or the positive (negative) extreme is directly connected to the anode (cathode) lead, and an electrical connection is made between the positive (negative) and positive (negative) lead of the bare LED chip. That is, when the LED bare chip is a red light or yellow light type LED bare chip, the cathode end of the bare chip is located below the bare chip, and the anode end of the bare chip is located above the bare chip. Therefore, the cathode end of the bare chip is directly electrically connected to the cathode conducting wire, and the anode end and the anode conducting wire of the bare tip are connected by a metal wire to achieve an electrical connection effect.

When the bare chip is a blue / green light type LED bare chip, the cathode end of the bare chip is located on the upper side of the chip, and the anode end of the bare chip is located on the lower side of the chip. The anode end and the cathode end are electrically connected to the anode lead wire and the cathode lead wire through respective metal wires.

The technical means and other effects used to achieve the above object of the present invention will be described in detail below with reference to the drawings.

The LED chips described in the present invention (hereinafter abbreviated as LED bare chips) are various types of bare chips such as red / yellow light chips or blue / green light chips, and are not limited in the present invention. However, the present invention will first describe that the technical features and effects of the present invention are described in detail below, mainly based on examples of red / yellow light and blue / green light bare chips.

3 to 7, FIG. 3 shows a flow chart of manufacturing steps of the light-emitting diode lamp inner tube structure according to the present invention. FIG. 4 shows a red / yellow light-emitting chip, an anode conductor, and a light-emitting diode lamp inner tube structure according to the present invention. The connection diagram of a cathode conducting wire is shown. FIG. 5 is a cross-sectional view taken along line AA in FIG. 4, and FIG. 6 is a connection diagram of the blue / green light emitting chip, the anode lead wire, and the cathode lead wire in the light-emitting diode lamp inner tube structure of the invention. FIG. 7 is a sectional view taken along line AA in FIG.

As shown in the drawing, the light-emitting diode string inner tube structure provided in the device is installed with a conductive wire position and a plurality of bare chips on the jig to achieve high-efficiency production using the jig. A chip position is provided. The intervals between the chip positions may be the same pitch or non-same pitch, and the manufacturing steps of the lamp train inner tube structure are not limited in the invention. Therefore, the device manufactured the inner tube structure according to the following manufacturing steps.

First, the anode conducting wire 30 and the cathode conducting wire 40 for power connection are left in parallel at the conducting wire position on the jig (S1). Usually, the lead wire connected to the external anode power source is referred to as the anode lead wire 30 and the lead wire connected to the external cathode power source is referred to as the cathode lead wire 40 (see FIG. 4). After the conducting wire is electrically connected to the bare chip, an insulating layer is formed on the conducting wire surface by applying an insulating coating agent. The insulating layer is made of polyester, nylon-coated polyester, polyvinyl chloride or the like, but is not particularly limited in the invention. Therefore, it is possible if the anode conductor 30 and the cathode conductor 40 are not brought into contact with each other to form a short circuit by providing insulation on the conductor.

Next, the light emitting diode chip (abbreviated as bare chip 50) is left at the tip position of the jig, and the anode end 51 and the cathode end 52 of the bare chip 50 are electrically connected to the anode lead wire 30 and the cathode lead wire 40, respectively. (S2) Therefore, between the positive / cathode conducting wires 30, 40 and the positive / cathode ends 51, 52 of the bare chip 50, metal wires 511 (commonly referred to as filaments) connected between the anode ends 51 and the anode conducting wires 30 and After contact between the cathode end 52 and the cathode conducting wire 40, electrical connection is made between the anode end 51 and the anode conducting wire 30 and between the cathode end 52 and the cathode conducting wire 40 (see FIG. 5).

Thereafter, the anode lead wire 30, cathode lead wire 40, bare chip 50, etc. are directly sealed using the transparent sealing material 60 to form the lamp train inner tube 70 (S3) (see FIGS. 4 and 5). The production and effective double effect of reducing the outer diameter θ2 of the light train inner tube 70 is achieved.

Depending on the type of the bare chip 50 to be used, the electrical connection method between the bare chip 50 and the anode conductors and cathode conductors 30 and 40 adopted by the present invention is shown in FIGS. When the red / yellow light naked chip 50 'type is used, most of the bare tips 50' inner tube cathode end 52 is on the lower side of the bare tips 50 ', and the anode end 51 of the bare tip 50' is bare tips 50. 'Because it is on the upper side, the cathode end 52 of the bare tip 50' and the cathode conducting wire 40 are electrically connected by direct contact, and the anode tip 51 of the bare tip 51 and the anode conducting wire 30 are connected with a metal wire. Electrical connection is established by the connection of 511 (see FIG. 5). When the bare chip 50 is a blue / green light bare chip 50 ″, the cathode end and the anode end of the bare chip 50 ″ are both above the bare chip 50 ″. Metal wires 511 and 511 are connected to the extreme 51 and the cathode end 52, respectively, to make electrical connection with the anode conductor 30 and the cathode conductor 40 (see FIGS. 6 to 7).

FIG. 8 is a connection diagram in the case where the second anode lead wire and the second cathode lead wire are added in the light-emitting diode string inner tube structure of the invention. The lamp train inner tube structure shown in FIG. 8 is different in the positions of the anode end 51 and the cathode end 52 in the red / yellow light bare chip 50 ′ and the blue / green light bare chip 50 ″, Different current standards are required for bare chips 50 ', 50 "(red / yellow light bare chip 50' uses DC 18 V, blue / green bare chip 51" uses DC 27 V). When the chips 50 'and 50 "are arranged in the same light tube, at least a pair of anode conductors and cathode conductors must be installed to provide different standard currents and different electrical connection methods. Therefore, in the invention, the added anode lead / cathode lead is defined as the second anode lead 30 ′ and the second cathode lead 40 ′, and appropriate currents are provided to different types of bare chips 50 ′, 50 ″. Therefore, in the example shown in Fig. 8, four types of naked chips 50 ', 50 including a red light naked chip R, a blue light naked chip B, a yellow light naked chip Y, and a green light naked chip G are provided inside the same light train inner tube 70. "In the embodiment of the case where the (four-color lamp) is inserted and arranged, the red light naked chip R and the yellow light naked chip Y of the same type as the originally installed anode lead wire 30 and cathode lead wire 40 are electrically connected to the DC
Provide 18 V power supply, and make electrical connection of blue light naked chip B and green light naked chip G of the same type with the added second anode lead wire 30 ′ and second cathode lead wire 40 ′, and power supply of DC 27 V You can make an offer. Therefore, different types of bare chips 50 ′ and 50 ″ are simultaneously mounted in the same lamp train inner tube 70 to achieve the light source effect of multicolor light change.

FIG. 9 is a connection diagram of current-carrying states in the positive and negative electrode conductors when a current switching device is provided on the inlet / outlet side of the positive and negative electrode conductors and the second positive / cathode conductor in the light-emitting diode string inner tube structure of the invention. FIG. 10 is a connection diagram of energization states in the second positive / cathode lead when the current switching device is provided on the power supply side of each positive / cathode lead in the light-emitting diode lamp inner tube structure. 11 shows the switching state when a current switching device is provided at the middle position of the positive / cathode conductor in the light-emitting diode array inner tube structure and the cross ignition control of each bare chip in the latter half of the positive / cathode conductor. In FIG. 12, in the light-emitting diode lamp inner tube structure of the invention, the switching state when the current switching device is provided at the middle position of the positive / cathode conductor and the control of the cross-ignition state of each bare cathode of the positive / cathode conductor. The method is shown.

In FIG. 9, the idea is that the positive / cathode conductors 30, 40 and the second positive / cathode conductors 30 ′, 40 ′ are on the current inlet / outlet side (see FIG. 9) or the respective positive / cathode conductors (30, 40), By providing a current switching device S (see FIGS. 9 and 11) at the middle position of (30 ′, 40 ′), the current is controlled, and the positive / cathode conductors (30, 40), (30 ′, Bare chips in 40 ') cross and ignite, resulting in a sparkling effect. As shown in FIG. 9, when the current switching device S is provided at the current inlet / outlet of the positive / cathode conductor (30, 40) and the second positive / cathode conductor (30 ', 40'), Select bare tip ignition on lead (30, 40) (see FIG. 9) or select bare tip 50 ignition on second positive / cathode lead (30 ′, 40 ′) (see FIG. 10). 11 to 12, the current switching device S is installed in the middle position of the positive / cathode conductors (30, 40), (30 ′, 40 ′), and the upper half and the lower half of the light train inner tube 70 are respectively shown. The half bare chip 50 controls cross-ignition.

FIG. 13 shows another structural state in the case where the outer tube is covered outside the inner tube in the light-emitting diode light train inner tube structure, and FIG. 14 is a sectional view taken along line BB in FIG.

The inventive light train inner tube 70 can be configured as a light-emitting light train 700 (see FIG. 13) by forming an outer tube (outer tube) 71 with a polyvinyl chloride (PVC) material on the outside thereof. . In order to provide the toughness in the light-emitting lamp train 700, by providing at least one traction line 711 (see FIG. 14) inside the outer tube 71, the light-emitting lamp train 700 is appropriately stretched and pulled. Alternatively, it is possible to avoid troubles such as tearing due to excessive deflection of the light-emitting lamp row 700, or mounting failure. Since the pulling wires 711 and 711 are also made of a conductive metal (using a tin-plated copper wire), the metal pulling wires 711 and 711 are connected to the anode conducting wire 30 and the cathode conducting wire 40 end of the light train inner tube 70, An electric circuit (see FIG. 13) is formed between the anode conductor 30 and the cathode conductor 40.

Based on the above description, the device differs from the conventional light-emitting diode light train inner tube structure. The idea is to use a transparent encapsulant to fix the anode and cathode conductors and the bare chip to the customary method of welding the light-emitting diode lead wires to the anode and cathode conductors, respectively, and to cover the bare chip, respectively. In addition to forming an electric circuit between the bare chip, the anode conductor and the cathode conductor only by sealing with a transparent sealing material, the purpose of rapid production effect in mass production is achieved. In addition, the device eliminates the unnecessary lead frame and lamp-shaped sealing in the light-emitting diode, directly uses the bare chip, reduces the cost of the light-emitting diode end, and minimizes the outer dimensions of the light-emitting lamp row. By controlling, the application area | region of the said light-emitting lamp row | line | column is improved.

Although the present invention will explain the merit of the invention in the above-described better embodiments, the above description is only an embodiment of the invention and does not restrict the scope of the invention. Accordingly, it is also claimed that the same changes and modifications as described in the claims of the present invention should be included in the scope of application of the present invention.

Traditional well-known light-emitting diode structure diagram Traditional well-known light-emitting diode light sleeve structure Manufacturing step flow chart of light-emitting diode lamp inner tube structure in the invention Connection diagram of red / yellow light-emitting chip, anode lead wire and cathode lead wire in the inner tube structure of the light-emitting diode line Sectional view along line AA in FIG. Connection diagram of blue / green light-emitting chip, anode conductor and cathode conductor in the inner tube structure of the light-emitting diode line Sectional view of the AA line in FIG. Connection diagram when the second anode lead wire and the second cathode lead wire are added in the light-emitting diode string inner tube structure of the invention Connection diagram showing the current-carrying state of the positive / cathode lead when the current switching device is provided on the entrance / exit side of the positive / cathode lead and the second positive / cathode lead in the inner tube structure of the light-emitting diode light train Connection diagram showing the energization state of the second positive / cathode conductor when the current switching device is provided on the power supply side of each positive / cathode conductor in the inventive light-emitting diode array inner tube structure In the invented light-emitting diode array inner tube structure, the switching state when the current switching device is provided in the middle position of the positive / cathode conductor and the cross ignition control of each bare chip in the latter half of the positive / cathode conductor are shown. In the invented light-emitting diode array inner tube structure, the switching state when the current switching device is provided in the middle position of the positive / cathode conductor and the cross ignition state control of each bare cathode of the positive / cathode conductor are shown. In the light-emitting diode light train inner tube structure of the present invention, another structural state when the outer sleeve is covered outside the inner tube is shown. 14 is a cross-sectional view taken along line BB in FIG.

Explanation of symbols

10 LED chip
100 inner tube
11 Lead frame
111 Lead wire
12 Lead frame
121 Lead wire
13 Metal wire
14 Transparent encapsulant (epoxy)
15 Anode conductor
16 Cathode conductor
30 Anode conductor
30 'second anode lead
40 Cathode conductor
40 'second cathode conductor
50 LED bare chip
50 'LED bare chip
50 ”LED bare chip
51 Anode end
511 metal wire
52 Cathode end
60 Transparent encapsulant
70 Light train inner tube
700 Skewer-shaped light emitting lamp
71 Outer tube
711 Traction line θ1 outer diameter θ2 outer diameter
R Red LED bare chip
B Blue light LED bare chip
Y Yellow LED bare chip
G Green LED bare chip
S Current switching device

Claims (5)

In the light tube inner tube structure of light emitting diodes,
Install at least a pair of positive and negative electrode conductors in parallel or around each other,
At least one light emitting diode bare chip having an anode end and a cathode end is provided, and the anode end and the cathode end are electrically connected to the anode conductor and the cathode conductor, respectively, and the conductor and each bare chip are connected with a transparent sealing material. A light-emitting diode light-tube tubular structure, characterized in that the light-emitting diode is formed into an elongated light-tube tube. 2. The light-emitting diode light train inner tube according to claim 1, wherein an insulating coating agent is applied to a portion other than a contact portion between the positive and negative electrode conductors and an anode end and a cathode end of the bare chip. Construction. 2. The light-emitting diode light train inner tube structure according to claim 1, wherein the positive and negative electrode lead wires and the anode end and the cathode end of the bare chip are directly contacted or electrically connected using a metal lead wire. 2. The light-emitting diode light train inner tube structure according to claim 1, wherein the bare chips are a plurality of bare chips of the same type or different types. 2. The light-emitting diode light train inner tube structure according to claim 1, wherein at least one current switching device is installed between each of the positive and negative electrode conductors.