JP3031045B2 - Fine particle composite plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus and, more particularly, to an apparatus suitable for forming a fine particle-free plating film after forming a fine particle plating film on aluminum or the like.

[0002]

2. Description of the Related Art In a scroll compressor, a scroll member 60 having a spiral wrap 8 on a head plate 7 as shown in FIG. 11 is engaged so that two spirals mesh with each other.
This is a type in which one is fixed and the other is swirled to compress the gas at the spiral part.

In recent years, in a scroll compressor, an aluminum material having a small specific gravity has been used in order to reduce the centrifugal force of the orbiting scroll as much as possible with an increase in the rotation speed of the orbiting scroll. However, a problem arises with aluminum materials in terms of wear resistance. Various surface treatment methods have been developed to solve this.

In a conventional scroll compressor, a method has been considered in which one of an orbiting scroll and a fixed scroll is made of aluminum and the other is cast iron, and the surface of the aluminum is subjected to surface treatment. For example, as described in JP-A-62-199882,
A method of performing electroless nickel-boron plating on the surface of an orbiting scroll, as described in JP-A-64-80785, a plating film containing a predetermined amount of nickel, tungsten or the like on the surface of an orbiting scroll or a fixed scroll. There is a method to apply.

An example in which both the orbiting scroll and the fixed scroll are made of aluminum is disclosed in Japanese Utility Model Laid-Open No. 3-998.
As described in Japanese Patent Publication No. 01, at least one of the orbiting scroll and the fixed scroll, the inner surface of the spiral wrap and the inner surface of the end plate is made of electroless nickel-phosphorus plating or alumina or silicon carbide (hereinafter referred to as SiC) hard. Electroless nickel-phosphorus-plated scroll-type fluid machine in which fine particles are compositely dispersed, as described in JP-A-2-125988, hard anodic oxidation treatment on one of the surfaces of an orbiting scroll and a fixed scroll And tin plating on the other surface.

[0006]

However, in the above prior art, one of the orbiting scroll and the fixed scroll used in the scroll compressor is made of aluminum and its surface is subjected to surface treatment, and the other is made of cast iron. In the case of the combination, the wear resistance of the sliding surface is good, but there is a problem in weight reduction.

When both are made of aluminum, at least one of them needs to be subjected to a surface treatment, which is problematic in terms of mass production and cost reduction. In particular, when a particle composite surface treatment is applied, there is a problem that hard particles on the plating surface are peeled off, the particles act as an abrasive, and the mating side and even the surface treated surface itself are worn. . An object of the present invention is to reduce the cost of a surface treatment for improving abrasion resistance, which is required when reducing weight of an orbiting scroll and a fixed scroll using aluminum.

[0008]

Another object of the present invention is to provide a plating apparatus suitable for performing a surface treatment having both wear resistance and conformability or a surface treatment having wear resistance on the surfaces of the orbiting scroll and the fixed scroll. It is in.

[0010]

SUMMARY OF THE INVENTION The object of the present invention is to provide a fine particle composite plating having a structure in which hard fine particles on the plating surface do not peel off from one of the orbiting scroll and the fixed scroll used in the scroll compressor. This is achieved by providing a plating apparatus. Specifically, an apparatus configuration capable of realizing the following method was adopted.

An electroless nickel-phosphorous plating layer without fine particles is provided on the fine particle composite electroless nickel-phosphorous plating layer so that the fine particles do not peel off from the plating surface.

In the fine particle composite electroless plating having a structure in which the fine particles on the surface of the plating do not peel off from the surface, in the plating process, plating is first performed in a plating solution in which the fine particles are mixed, and then the fine particles are mixed. It is obtained by performing the plating treatment in a plating solution that does not have any. This plating treatment may be performed in the same plating solution tank, or may be performed using a plating solution tank containing fine particles and a plating solution tank not containing fine particles.

Further, the above object can be attained by providing a thick plating layer that does not combine fine particles with the wear-resistant fine particle composite plating layer provided on the surface of the aluminum alloy scroll. When forming a thin plating layer in which fine particles are combined, ultrafine particles having a particle diameter of 0.1 μm or less are used as the fine particles to be combined with the electroless nickel-phosphorus plating solution. The fine particles are preferably hard particles such as silicon carbide, silicon dioxide, alumina, zirconia and diamond.

Further, the above-mentioned object is attained by providing the fine particle composite plating apparatus having the following configuration.

[0015] A tank filled with a plating solution composed of fine particles, plating solution stirring means, means for holding the plating component on a vertical axis, and first rotating means for rotating the holding means around a horizontal axis passing through the holding means; And a second rotating means for rotating a vertical axis.

[0016] A tank filled with a plating solution composed of fine particles, plating solution stirring means, means for holding the plating component on a vertical axis, and first rotating means for rotating the holding means around a horizontal axis passing through the holding means; A fine particle composite plating apparatus comprising: a second rotating means for rotating a vertical shaft; a circulation pump for connecting the inlet and outlet of the tank to circulate the plating solution; and a fine particle collection filter provided on the inlet side of the circulation pump.

[0017] A tank filled with a plating solution, a partition plate for dividing the tank into a region filled with a reference plating solution and a region filled with a plating solution in which fine particles are combined with the reference plating solution, and the plating solutions in the plurality of regions are respectively stirred. Stirring means, means for holding the plating component on a vertical axis, first rotating means for rotating the holding means around a horizontal axis passing through the holding means, second rotating means for rotating the vertical axis, A fine particle composite plating apparatus comprising: moving means for moving a plurality of areas while the holding means is immersed in the plating solution.

[0018] A fine particle composite plating apparatus as described above, wherein the tank is disposed in a hot water tank.

[0019] A tank having an annular flow path for storing the plating solution, a reflux means for circulating the plating solution in the tank along the annular flow path, and disposed at least in one of the annular flow paths so as to intersect the flow path Openable and closable partition plate, a filter that intersects the flow path on the downstream side of the partition plate and allows only the reference plating solution to pass, means for holding the plated component, and flow while rotating the holding means in the plating solution. And a moving means for moving along a road.

[0020]

[Action]

[0021]

Fine particle composite electroless nickel according to the present invention
In forming a phosphor plating film, first, electroless plating is performed in a plating solution in which fine particles are mixed. Although the fine particles mixed in the plating solution are embedded in the plating film formed in the first step, only a part of the fine particles is exposed from the fine particles exposed from the plating film surface. Fine particles in various states are mixed up to fine particles attached to the plating film surface. Next, electroless plating is performed on the plating film in this state in a plating solution in which fine particles are not mixed. In the second stage, no new fine particles adhere to the plating film and only the metal of the plating adheres, so that the fine particles exposed on the surface of the plating film formed in the first stage remain in the plating film. Embedded. If the plating time in the second stage is lengthened, the fine particles are embedded in the plating film. If the plating time in the second stage is lengthened, the fine particles are completely embedded in the plating film, and if the time is shortened, the fine particles can be embedded, for example, about half.

The fine particles on the surface of the plating film obtained after the completion of the plating treatment in the second stage are locked in the plating layer and are hardly peeled off. As a result, the amount of fine particles peeling off from the plating film surface and serving as an abrasive on the sliding surface is reduced, and wear on the scroll surface is reduced.

Further, when the layer in which fine particles having abrasion resistance are compounded is made thinner and the layer in which fine particles are not compounded is made thicker, the layer in which fine particles are not compounded during the running-in operation after the orbiting scroll and the fixed scroll are assembled. Even if the parts sliding on each other wear, aluminum does not wear out, and an appropriate sealing effect can be obtained.

At this time, even if one of the abrasion advances and reaches the fine particle composite layer, the abrasion of the mating portion proceeds thereafter, so that the surface of the aluminum is protected. The layer for obtaining such a sealing effect of the sliding parts is a so-called "conforming layer".

Since the layer released by abrasion is a layer which does not combine fine particles, the fine particles are not released and do not act as an abrasive. Also, by thickening the conformable layer,
An appropriate shape having a sealing effect is formed by the layer coated on the surface without processing the shape of the scroll with high precision.

The plating apparatus of the present invention is optimal for forming the above-mentioned plating layer.

By rotating the holding means for holding the scroll member around the vertical axis while rotating,
The plating solution is supplied to the entire region of the scroll member having a deep structure, and a uniform plating layer is formed.

Further, by providing a filter and a partition plate for removing the fine particles of the plating solution in which the fine particles are combined, it is possible to form a fine particle composite plating solution and a plating solution in which the fine particles are not combined, so that the plating layer having a two-layer structure can be easily formed. Can be formed.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

First, a pretreatment step for plating is shown in FIG.
All the plating processes described below were performed after this pretreatment.
AD-68F, AD-101, AD-30 in the figure
1-3X are reagents manufactured by Uemura Kogyo Co., Ltd.

FIG. 1 shows a first embodiment of the present invention. The figure shows S coated on the surface of aluminum 3 forming the scroll.
1 shows a cross section of an iC composite electroless nickel-phosphorous plating film 1. The plating film 1 is formed to include fine particles 2 of SiC, and the fine SiC particles 2 are uniformly dispersed in the plating film 1.

Further, a nickel-phosphorous plating layer 5 containing no SiC fine particles 2 is coated on the plating film 1. Such a plating layer 5 has the effect of compensating for errors in processing accuracy and assembly accuracy of the scroll member. That is, generally, the performance of a scroll compressor depends on the size of the gap between the orbiting scroll and the fixed scroll. High performance requires high precision machining and assembly to reduce the gap, but this is very difficult. Therefore, when a predetermined thickness of electroless nickel-phosphorus plating lacking abrasion resistance is applied on SiC composite electroless nickel-phosphorus plating (hereafter, all plating is electroless plating), extra nickel-phosphorous plating occurs during operation. The phosphorus plating layer is worn and the film thickness is reduced, and the clearance is kept constant. In other words, this plating layer is a so-called conforming layer, and functions as a sealing material. This makes it possible to absorb errors in processing accuracy or assembly accuracy.

FIG. 1 shows a state in which the SiC fine particles are completely covered with the nickel-phosphorus plating layer 5.
When the nickel-phosphorus plating layer that does not combine fine particles is thinned, a part of the SiC fine particles 2 is exposed on the surface and becomes locked by the plating layers 1 and 5.

FIG. 2 is a sectional view of the orbiting scroll provided with a plating layer in which SiC fine particles are compounded in the present embodiment. The scroll member comprises a head plate 7 and a wrap 8 formed substantially perpendicular to the head plate 7 as shown in the figure. When viewed from above in FIG. 2, the wrap 8 has a spiral shape as shown in FIG. . In this embodiment, plating is performed on almost the entire area except for a part below the end plate 7, but plating may be performed only on a sliding portion with a mating member.

The above-described SiC composite nickel-phosphorus plating can be treated by the following method.

FIG. 3 shows a mechanism for rotating the object to be plated 14 in a solution. The mechanism includes a linear drive shaft 11 which is a moving means disposed above a tank 12 filled with a plating solution, a movable table 27 driven by the linear drive shaft 11 to move in a horizontal direction, and a movable table 27. A hollow vertical rotation drive shaft 28 rotatably mounted, a rotation drive means 10 mounted on a moving table and rotating the vertical rotation drive shaft 28 around the axis, and a vertical rotation drive shaft 28 ,
It passes through a horizontal rotation drive shaft 29 inserted substantially parallel to the axis of the rotation drive shaft 28 and an opening 30 connected to the horizontal rotation drive shaft 29 via a bevel gear and provided on a side surface of the vertical rotation drive shaft 28. And a holding means 25 attached to the end of the horizontal rotation shaft 26, a horizontal rotation drive shaft 29 attached to the upper end of the vertical rotation drive shaft 28. Is connected to a rotation driving means 9 for rotatingly driving the upper end of the shaft around its axis. The vertical rotation drive shaft 28 is arranged so that its axis is substantially vertical and the opening 30 on the lower side surface thereof is below the level of the plating solution.

The above mechanism operates as follows. First, the object to be plated 14 is held in the plating solution by the holding means 25. When the rotation drive means 9 rotates the horizontal rotation drive shaft 29, the horizontal rotation shaft 26 is rotated via the bevel gear, and the workpiece 14 held by the holding means 25 is rotated around the horizontal axis. The holding means 25 holds the object to be plated 14 such that the central axis of the object to be plated 14 substantially coincides with the axis of the horizontal rotation shaft 26, and the object to be plated 14 rotates around its own central axis. I do. When the rotation drive means 10 rotates the vertical rotation drive shaft 28, the horizontal rotation shaft 26
While rotating around its own axis, it rotates around the vertical axis with the rotation of the opening 30 of the vertical rotation drive shaft 28.

By the rotation in the two directions in the plating solution, the relative relationship between the direction of movement of the plating solution and the fine particles floating in the plating solution and the surface of the object to be plated 14 does not remain constant. As a result, there is no longer any difference between the upper and lower sides of the amount of plating applied to the object to be plated 14 and the difference between the front and back sides, and plating and fine particles are uniformly attached to the entire surface. The linear drive shaft 11
Thereby, the object to be plated 14 can be moved to the left and right, and the difference depending on the location of the tank can be eliminated. Next, by moving to a plating solution in which SiC fine particles are not mixed, plating is performed, so that various states of Si mixed in the plating film surface are mixed.
C fine particles are embedded in the nickel-phosphorus plating film.

By the above-described mechanism, it is possible to obtain a composite plating in which SiC particles are uniformly dispersed even in a complicated shape such as a scroll.

Embodiment 2 will be described with reference to FIG. FIG.
FIG. 2 is a partial cross-sectional view including an electroless nickel-phosphorous plating layer 1 in which SiC fine particles are composited on the surface of aluminum 3 forming a scroll, and a surface layer of the scroll in which an electroless nickel-phosphorous plating layer 5 is provided thereon. The portion excluding the surface layer is the same as in the first embodiment. In this embodiment, S
The thickness of the electroless nickel-phosphorous plating layer 1 in which the iC fine particles 2 were combined was 2 μm, and the thickness of the electroless nickel-phosphorous plating layer 5 was 15 μm.

The SiC fine particles 2 used in this embodiment are
Since the plating layer 1 in which the SiC fine particles 2 are composited is thin, the particle size is 0.1 μm so as to be uniformly dispersed in the plating layer 1.
The following ultrafine particles were used. In the present embodiment, since the electroless nickel-phosphorus plating layer 5 serving as a conforming layer is thickened, the effect of absorbing errors in the processing accuracy and assembly accuracy of the scroll is greater than in the case of the first embodiment.

Embodiment 3 is shown in FIG. The plating apparatus shown in the figure includes a hot water bath 17, a bath 12 disposed in the hot water bath 17,
A movable partition plate 20 for partitioning the tank 12 into first and second areas, and a mechanism for moving and rotating the object to be plated mounted above the tank 12 (a mechanism similar to that described in FIG. 18), a stirrer 19 and a hot magnetic stirrer 13 respectively arranged in the two regions.
It is comprised including. In the first region, a nickel-phosphorous plating solution 15 in which SiC fine particles are not mixed,
The second region is filled with a nickel-phosphorous plating solution 16 containing no SiC fine particles. The particle size of the SiC fine particles mixed in this example was 0.1%.
Although it is about μm, it is desirable that the maximum is about 1 μm.

First, the object to be plated 14 is placed in the first region on the right side containing the plating solution 15 in which SiC fine particles are mixed, and the SiC composite plating is performed. At this time, the plating object 14 is rotated in the liquid by the plating object rotating mechanism 18. On the other hand, the plating solution is stirred by the hot magnetic stirrer 13 and the stirrer 19. At this stage, a plating film in which SiC fine particles are uniformly dispersed and embedded in the nickel-phosphorus plating film is formed. After a predetermined time, the movable partition plate 20 is opened, and the object to be plated 14 is quickly moved to the second area filled with the plating solution 16 on which the SiC fine particles are not mixed, and the plating process is performed again. Done. At the stage where the film is moved from the first region to the second region, the surface of the formed plating film is in a state in which only a part is attached to the plating film surface from fine particles that are partially exposed from the plating film surface and the entire surface is exposed. The various fine particles of SiC in the exposed state are mixed up to the fine particles of. In the second region, since the SiC fine particles are not mixed in the plating solution, a nickel-phosphorous plating film containing no SiC fine particles is formed, and the second region is formed as time passes.
The SiC fine particles in various states mixed on the surface of the plating film when moved to the region are gradually embedded in the nickel-phosphorus plating film. The plating is electroless plating for both the first and second regions.

Next, a fourth embodiment is shown in FIG. The plating apparatus shown in the figure includes a hot water bath 17 and a bath 12 disposed in the hot water bath 17.
And a mechanism for moving and rotating the object to be plated mounted above the tank 12 (a mechanism similar to that described in FIG. 3 and a description thereof is omitted), and a stirrer 19 disposed at the bottom of the tank 12.
And a hot magnetic stirrer 13 disposed outside the bottom of the tank 12. In the plating solution 15 in which SiC particles are mixed,
The process of C composite plating is performed. During plating, the object to be plated 14 is rotated by a mechanism for moving and rotating the object to be plated (a mechanism similar to that described in FIG. 3 and the description is omitted) 18 and the plating solution is also stirred. After a predetermined time, the rotation of the plating object 14 and the stirring of the plating solution 15 are stopped.
When the stirring of the plating solution 15 is stopped, Si in the plating solution is removed.
C particles settle because they are heavy. Utilizing this, the second-stage plating (plating for embedding SiC particles) is performed where there is no overlying SiC particles in the plating solution.

According to this method, the plating process can be performed in the same plating solution, and the operation is easy with a very simple apparatus.

Embodiment 5 is shown in FIG. The plating apparatus shown in the figure comprises a hot water tank 17, a tank 12 arranged in the hot water tank 17 and filled with a SiC composite nickel-phosphorous plating solution 15, a stirrer 19 as a stirring means for stirring the plating solution, and a hot magnetic stirrer. 13, a plating object moving / rotating mechanism (a mechanism similar to that described in FIG. 3, and the description thereof is omitted) 18 for storing and rotating and moving the plating object 14 in a plating solution, and a tank 12. A circulating pump 22 connected to the inlet / outlet to circulate the plating solution, and a filter 21 mounted on the inlet side of the circulating pump to collect the SiC fine particles contained in the SiC composite nickel-phosphorous plating solution 15. It is configured.

According to the present embodiment, the object to be plated 14 is first subjected to the first stage plating (plating including SiC particles) in a liquid 15 in which SiC fine particles are mixed. When the plating treatment of the first stage is completed, the solution 15 containing the SiC particles is drawn out from the bottom of the tank by the pump 22, passes through the filter 21, the SiC particles are removed, and only the plating solution is returned to the tank. It is. After the SiC particles are removed from the plating solution, a second stage plating (plating not containing SiC particles) is performed. This method is a modification of the fourth embodiment. Although the plating process is performed in the same solution as in Example 4, since the SiC particles are completely removed from the solution as described above, the SiC particles can be more reliably embedded in the plating layer. Can be.

FIG. 8 shows a sixth embodiment as another example.
The plating apparatus shown in the figure includes a running water pool type tank 12 that forms a ring-shaped flow path and stores a plating solution, a circulating unit (not shown) that circulates the plating solution in the tank along the ring-shaped flow path, An openable and closable partition plate 20 mounted at three locations at predetermined intervals in an annular flow path, and a partition disposed at a predetermined interval from the partition plate 20 downstream of one of the partition plates 20. A filter 21 that forms a SiC composite nickel-phosphorous plating solution region between the plate 20 and the plating object 14 is immersed in the plating solution and rotated in the opposite direction to the flow of the plating solution along the flow path while rotating. To-be-plated object moving and rotating mechanism 2
4 is included. The plating object moving / rotating mechanism 24 includes the same holding means and rotating means as the plating object moving / rotating mechanism 18, and is configured to move the plating object along an annular flow path.

In this embodiment, the plating tank is shaped like a running water pool, and the object to be plated 14 is moved while rotating in the direction opposite to the flow of the solution. A movable partition plate 20 is attached to the plating tank, and the object to be plated 14 is subjected to the first stage plating while passing through a tank containing a nickel-phosphorous plating solution 15 mixed with SiC particles. Then, it moves to the tank containing the solution 16 in which the SiC particles are not mixed, and
Is carried out. By adjusting the moving speed of the plating object 14, the thickness of the plating to be processed can be made a desired thickness. This is a plating processing apparatus that can cope with mass production.

Using the above-described method, plating is performed on the SiC composite plating without containing SiC particles, and the SiC particles on the plating surface are embedded in the plating layer.

FIG. 9 shows a SiC particle composite electroless nickel-phosphorus plating formed by a conventional method (plating in which fine particles are present on the surface of a plating film by a conventional method).
5 shows the results of a sliding test of SiC composite electroless nickel-phosphorus plating (having the shape shown in FIG. 1) formed by the apparatus shown in Example 3. The plating was performed on the fixed test piece.

Test conditions (A) Shape of test piece (1) Fixed test piece (disk shape) Diameter 37 mm Thickness 12
mm (2) Rotating test piece (ring shape) Outer diameter 26 mm Inner diameter 1
6mm Thickness 12mm (b) Sliding conditions (1) Speed 3.14m / s (2) Load 12.2kgf / cm ² (3) Lubricating oil Freol F56 (c) Test material (1) Fixed test piece AHS ( A containing 11% Si
1) (2) Rotating test piece AHS (A containing 11% Si)
1) As is clear from FIG. 9, in the case of the conventional method, the plated surface itself is hardly worn, but the mating side is worn. However, in the case of the method according to the invention this time, both have very little wear.

In each of the above-described embodiments, SiC fine particles were used as fine particles dispersed in the plating film. However, in addition to SiC, oxides such as SiO ₂ , Al ₂ O ₃ and ZiO ₂ , diamond, and high hardness Fine particles, such as metal, which are easily dispersed in the plating solution may be used. As the plating film in which these fine particles are embedded, a plating film of copper, chromium, tin or the like may be used in addition to the nickel-phosphorus plating film used in the embodiment.

FIG. 12 is a view for explaining the seventh embodiment, and is a cross-sectional view showing the entire structure of the scroll compressor 70. The compression section includes a fixed scroll 40 having a spiral wrap on the head plate, a turning scroll 8 also having a spiral wrap on the head plate, and an Oldham for preventing the turning scroll 8 from rotating. It is composed of a ring 42 and has a configuration in which the wraps of the fixed scroll 40 and the turning scroll 8 are engaged with each other. In this compression section, the orbiting scroll 8 orbits via the shaft 45, thereby causing the suction port 50 to rotate.
The volume of the gas sucked from the compressor is reduced as the space (compression chamber) formed by the swirling scroll 6 and the fixed scroll 40 moves toward the center of the scroll, and is compressed. The compressed gas is discharged from a discharge port 52 provided at the center of the fixed scroll.

In this embodiment, a scroll member made of an aluminum alloy whose surface is coated according to the second embodiment is used for both the rotating scroll member and the fixed scroll member. After operation (4 hours) under normal operating conditions, both scroll members wear at several places in the adaptation layer and partially
Although the composite layer of the C fine particles 2 was exposed, the aluminum portion was not exposed, and good performance was obtained.

Further, the surface of the turning scroll member made of aluminum alloy is coated with Si by the method described in the first embodiment.
C fine particle composite nickel-phosphorus plating film (average thickness 7μ)
m) and a film of nickel-phosphorus plating only (average thickness 3
μm), and was mounted on a scroll compressor and operated under normal operating conditions. Cast iron (FC25) was used for the fixed scroll member.

After the operation, the nickel-phosphorus plating layer was slightly worn on the sliding portion surface of the rotating scroll, and a coating film partially composed of SiC was also exposed. On the other hand, the sliding portion of the fixed scroll member exhibited a good sliding surface with almost no wear.

In this embodiment, the surface coating is applied to almost the entire surface of the scroll member. However, the wrap portion of the fixed scroll, the wrap side of the end plate, and the wrap portion of the swivel scroll are used. The same effect can be obtained by plating the sliding portions such as the lap side of the head plate and the Oldham ring assembly.

[0060]

According to the present invention, at least one of the orbiting scroll and the fixed scroll formed of an aluminum alloy is provided with an electroless nickel-phosphorus plating layer having fine particles composited on its surface and an electroless nickel-coated layer formed thereon. The fine particles of the plating layer do not fall off by being formed by applying the phosphorus plating layer or by forming the surface of the electroless nickel-phosphorous plating layer in which the fine particles are composited by the layer composed of only the electroless nickel-phosphorus. Therefore, the wear resistance of the scroll compressor is improved. In addition, by increasing the thickness of the electroless nickel-phosphorous plating layer provided on the electroless nickel-phosphorous plating layer in which the fine particles are compounded, the electroless nickel-phosphorous plating layer becomes a conformable layer and has both sealing properties and wear resistance. Scroll compressor. Further, by using the plating apparatus of the present invention, it is possible to easily form a surface coating composed of two layers of a fine particle composite layer and a fine particle non-composite layer on the surface of the scroll member.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a plating state of Example 1.

FIG. 2 is a cross-sectional view of a scroll member subjected to a plating process of the present invention.

FIG. 3 is a perspective view of a plating apparatus used in Example 1.

FIG. 4 is a cross-sectional view showing a plating state of Example 2.

FIG. 5 is a sectional view of a plating apparatus showing an embodiment of the present invention.

FIG. 6 is a sectional view of a plating apparatus showing an embodiment of the present invention.

FIG. 7 is a sectional view of a plating apparatus showing an embodiment of the present invention.

FIG. 8 is an explanatory view of a plating apparatus of the present invention.

FIG. 9 is a graph showing a sliding test result.

FIG. 10 is a procedure diagram showing a pretreatment of plating.

FIG. 11 is a perspective view of a scroll member.

FIG. 12 is a sectional view of a scroll compressor.

[Explanation of symbols]

1 ... SiC composite nickel-phosphorus plating film, 2 ... SiC
Particles, 3 ... Aluminum material, 5 ... Nickel-phosphorus plating layer, 6 ... Orbiting scroll, 7 ... End plate, 8 ... Lap, 9 ... Rotation driving means, 10 ... Rotation driving means, 11
... means of movement (linear drive shaft), 12 ... tank, 13 ... hot magnetic stirrer, 14 ... plating object, 15 ...
SiC mixed nickel-phosphorus plating solution, 16: nickel-phosphorus plating solution, 17: hot water tank, 18: rotating mechanism for moving the object to be plated, 19: stirrer, 20: movable partition plate,
DESCRIPTION OF SYMBOLS 21 ... Filter, 22 ... Circulation pump, 23 ... Liquid flowing direction, 24 ... Plating object moving / rotating mechanism, 25 ... Holding means, 26 ... Horizontal rotating shaft, 27 ... Moving table, 28 ... Vertical rotating driving shaft ... horizontal drive shaft, 30 ...
Opening, 40: fixed scroll, 42: Oldham ring, 45: shaft, 50: suction port, 52: discharge port, 60: scroll member, 70: scroll compressor.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshi Iizuka 800, Tomita, Odai, Shimotsuga-gun, Tochigi Hitachi, Ltd.Tochigi Plant (72) Inventor Nobuo Abe 800, Tomita, Odaira, Shimotsuga-gun, Tochigi Hitachi, Ltd. Tochigi Plant (72) Inventor Kazuo Ikeda 800, Tomita, Ohira-cho, Shimotsuga-gun, Tochigi Prefecture Hitachi, Ltd. Tochigi Plant (72) Inventor Joji Okamoto 390, Muramatsu, Shimizu, Shizuoka Prefecture Hitachi, Ltd. Shimizu Plant (56) References JP-A-62-199982 (JP, A) JP-A-64-80785 (JP, A) JP-A-3-186667 (JP, A) JP-A-63-201915 (JP, A) JP-A 50-104730 (JP, A) JP-A 60-251300 (JP, A) JP-A 63-94963 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) C 23C 18/31-18/52 C25D 15/00-15/02 F04C 18/02 311 F04C 29/00

Claims (5)

(57) [Claims] A tank filled with a plating solution containing fine particles; a stirring means for stirring the plating solution; a holding means for holding a member to be plated in the plating solution and attached to a vertical shaft; A fine particle composite plating apparatus comprising: a first rotating means for rotating the holding means around a horizontal axis passing therethrough; and a second rotating means for rotating the vertical axis. 2. A tank filled with a plating solution containing fine particles, a stirring means for stirring the plating solution, a holding means for holding a member to be plated in the plating solution and attached to a vertical shaft, and the holding means. First rotating means for rotating the holding means around a horizontal axis passing therethrough, second rotating means for rotating the vertical axis, and a circulating pump connected to the inlet and outlet of the tank to circulate a plating solution. And a filter mounted on the inlet side of the circulating pump to collect the fine particles. 3. A tank filled with a plating solution, a partition plate for partitioning the tank into at least a region filled with a reference plating solution and a region filled with a plating solution in which fine particles are combined with the reference plating solution; A stirring means arranged in the region to stir the plating solution, a holding means for holding a component to be plated in the plating solution and attached to a vertical axis, and a rotating means for rotating the holding means around a horizontal axis passing through the holding means. 1
A fine particle composite comprising: rotating means for rotating the vertical axis; and moving means for moving the plurality of regions while the holding means is immersed in a plating solution. Plating equipment. 4. The fine particle composite plating apparatus according to any one of claims 1 to 3, wherein the tank is disposed in a hot water tank. 5. A tank for storing a plating solution as a current flow path, a reflux means for circulating the plating solution in the tank along the annular flow path, and at least one of the annular flow paths. An openable and closable partition plate disposed to intersect with the flow path at a location, and fine particles are combined with the reference plating solution between the partition plate and the partition plate disposed to intersect with the flow path on the downstream side of the partition plate. A filter that allows only the reference plating solution in the plating solution to form the fine particle composite plating solution region, holding means for holding the plated component in the plating solution, and rotating the holding means in the plating solution to the flow path. A fine particle composite plating apparatus, comprising: