JP3099498B2 - Power supply equipment for full plating equipment - Google Patents
Power supply equipment for full plating equipmentInfo
- Publication number
- JP3099498B2 JP3099498B2 JP04035919A JP3591992A JP3099498B2 JP 3099498 B2 JP3099498 B2 JP 3099498B2 JP 04035919 A JP04035919 A JP 04035919A JP 3591992 A JP3591992 A JP 3591992A JP 3099498 B2 JP3099498 B2 JP 3099498B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- lead frame
- roller
- plating
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フレーム縦送り方式の
リールトウリール全面めっき装置の給電装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply apparatus for a frame reel vertical reel reel plating apparatus.
【０００２】[0002]
【従来の技術】近年、リードフレームは外装めっきにお
いて、貴金属類の全面めっき化を取り入れる動向にあ
る。図５，図６は従来の全面めっき装置の給電装置の動
作説明図である。８はリードフレーム７にめっきするた
めの給電ローラ、９は給電するために給電ローラ８に接
触するばね式給電ブスバーである。リードフレーム７
は、めっきラインの最後尾にある駆動ローラ（図示せ
ず）によって引かれる。それに伴ない、リードフレーム
７に接触している給電ローラ８はリードフレーム７との
摩擦によって回転しながらリードフレーム７に給電す
る。2. Description of the Related Art In recent years, there has been a trend to adopt a plating method of a noble metal in a lead frame as an external plating. 5 and 6 are explanatory views of the operation of the power supply device of the conventional full-surface plating apparatus. Reference numeral 8 denotes a power supply roller for plating the lead frame 7, and reference numeral 9 denotes a spring-type power supply bus bar that contacts the power supply roller 8 for supplying power. Lead frame 7
Is drawn by a drive roller (not shown) at the end of the plating line. Accordingly, the power supply roller 8 in contact with the lead frame 7 supplies power to the lead frame 7 while rotating by friction with the lead frame 7.
【０００３】この従来の全面めっき装置の給電ローラ方
法では、ばね式給電ブスバー９を給電ローラ８の外周側
面に接触し給電しているのでリードフレーム７の幅およ
び板厚が変わると、リードフレーム７と給電ローラ８間
の摩擦抵抗が変わり、条件によっては給電ローラ８は回
転しなくなり、リードフレーム７表面に損傷を与え、ま
た、給電時の電流電圧、特に電圧が不安定になり断続給
電の状態に至ることがある。この場合、スパークが発生
し、リードフレーム７表面上にスパークによる酸化被膜
が生成され層間剥離を起こし、めっき特性に著しい劣化
を与える。In the conventional power supply roller method of the entire plating apparatus, the spring-type power supply bus bar 9 is brought into contact with the outer peripheral side surface of the power supply roller 8 to supply power. The frictional resistance between the power supply roller 8 and the power supply roller 8 changes, and the power supply roller 8 does not rotate depending on the conditions, causing damage to the surface of the lead frame 7, and the current voltage, especially the voltage during power supply becomes unstable, resulting in an intermittent power supply state. May be reached. In this case, a spark is generated, an oxide film is formed on the surface of the lead frame 7 by the spark, and delamination occurs, which significantly deteriorates plating characteristics.
【０００４】[0004]
【発明が解決しようとする課題】つまり、上記従来例で
は、幅が狭く０．１５mm程度の薄い板厚のリードフレー
ムを全面めっきする際、給電ローラの回転が不完全とな
るため、給電ローラとリードフレームのめっき面上との
間で滑りが起こり、傷や層間剥離を発生する。That is, in the above-mentioned conventional example, when the lead frame having a small width and a thin plate thickness of about 0.15 mm is plated over the entire surface, the rotation of the power supply roller is incomplete. Slip occurs between the plating surface of the lead frame and the lead frame, causing scratches and delamination.
【０００５】本発明はこの課題を解決するもので、安定
な給電を保持し、めっきを均一にする全面めっき装置の
給電装置の提供を目的とする。An object of the present invention is to solve this problem, and an object of the present invention is to provide a power supply apparatus for a full-surface plating apparatus which maintains stable power supply and makes plating uniform.
【０００６】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するために、給電ローラとその軸を一体にしてブスバー
の接触部を給電ローラの軸上に配設する構成を有する。In order to achieve the above object, the present invention has a structure in which the power supply roller and its shaft are integrated and the contact portion of the bus bar is disposed on the shaft of the power supply roller.
【０００７】[0007]
【作用】本発明は上記構成によって、リードフレームの
移動による給電ローラの回転をスムーズにし給電電圧を
安定化するように作用する。According to the present invention, the power supply roller is smoothly rotated by the movement of the lead frame to stabilize the power supply voltage.
【０００８】[0008]
【実施例】以下、本発明の一実施例における全面めっき
装置の給電装置について説明する。本実施例は特に大量
生産工程向けのものであり、フープ状に連結されている
リードフレームにめっきを施すようにしたものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a power supply device for an entire plating apparatus according to an embodiment of the present invention will be described. The present embodiment is particularly intended for a mass production process, in which a lead frame connected in a hoop shape is plated.
【０００９】図２は本発明の一実施例における全面めっ
き装置の給電部水槽およびめっき液受液槽の平面図、図
１は本発明の実施例における給電部拡大斜視図、図３は
給電部ローラの要部平面図である。図１，図２におい
て、１は給電部水槽の内槽、２は内槽１からオーバフロ
ーした水を受けとめる外槽で、この内槽，外槽によって
給電部槽の受液槽が構成されている。軸一体給電ローラ
３，ブスバー４，多極化給電用の連結線５，リードフレ
ーム７で給電部は構成されている。FIG. 2 is a plan view of a power supply tank and a plating solution receiving tank of the entire plating apparatus in one embodiment of the present invention. FIG. 1 is an enlarged perspective view of the power supply section in the embodiment of the present invention. It is a principal part top view of a roller. 1 and 2, reference numeral 1 denotes an inner tank of a power supply unit water tank, and 2 denotes an outer tank for receiving overflowed water from the inner tank 1, and the inner tank and the outer tank constitute a liquid receiving tank of the power supply unit tank. . The power supply unit is constituted by the shaft-integrated power supply roller 3, bus bar 4, multi-polarized power supply connection wire 5, and lead frame 7.
【００１０】めっきラインの最後尾に設置されているリ
ードフレーム７の駆動ローラによってリードフレーム７
が引っ張られると、図３のように各給電ローラ３は矢印
の方向へリードフレーム７との摩擦抵抗によって回転す
る。ブスバー４による軸上給電接触抵抗は無視できる程
度に極めて小さく、リードフレーム７の幅および板厚が
各々３０mm,０．１５mmというような最小のものが使用
されても、給電ローラ３へのリードフレーム７の摩擦抵
抗は、ブスバー４の軸接触抵抗よりも充分に大きく安定
な回転給電がされる。その結果、電圧が安定化するた
め、めっき状態が均一となる。[0010] The lead frame 7 is driven by the drive roller of the lead frame 7 installed at the end of the plating line.
Is pulled, each power supply roller 3 rotates in the direction of the arrow due to frictional resistance with the lead frame 7 as shown in FIG. The on-axis power supply contact resistance due to the bus bar 4 is extremely small to a negligible level. Even if the width and thickness of the lead frame 7 are as small as 30 mm and 0.15 mm, respectively, the lead frame to the power supply roller 3 can be used. The frictional resistance 7 is sufficiently larger than the axial contact resistance of the bus bar 4 and a stable rotation power is supplied. As a result, the voltage is stabilized, and the plating state becomes uniform.
【００１１】このように本実施例によると、給電ローラ
とリードフレームとの接触面積を大きくするように、ロ
ーラ径を大にし、給電用ブスバーを給電ローラの中心軸
部に接触させて給電ローラの回転負荷を軽減してあるの
で、給電ローラはリードフレームの移動とともに安定に
回転して給電を一定化し、その結果、均一なめっきが行
なわれる。As described above, according to this embodiment, the diameter of the roller is increased so that the contact area between the power supply roller and the lead frame is increased, and the busbar for power supply is brought into contact with the central shaft portion of the power supply roller to form the power supply roller. Since the rotation load is reduced, the power supply roller rotates stably with the movement of the lead frame to make the power supply constant, and as a result, uniform plating is performed.
【００１２】[0012]
【発明の効果】以上の実施例から明らかなように本発明
によると、全面めっき装置の給電において給電ローラの
軸上で接触するブスバーを配設してあるので、給電ロー
ラの回転を妨げることなくリードフレームのめっき被膜
特性を安定化する、全面めっき装置の給電装置を提供で
きる。As is apparent from the above embodiment, according to the present invention, the bus bar which is in contact with the feed roller shaft in the feed of the entire plating apparatus is provided, so that the rotation of the feed roller is not hindered. It is possible to provide a power supply apparatus for a full-surface plating apparatus that stabilizes the characteristics of a plating film on a lead frame.
【図１】本発明の一実施例における全面めっき装置の給
電部の拡大斜視図FIG. 1 is an enlarged perspective view of a power supply unit of a full plating apparatus according to an embodiment of the present invention.
【図２】本発明の一実施例における全面めっき装置と給
電部の平面図FIG. 2 is a plan view of an entire plating apparatus and a power supply unit according to an embodiment of the present invention.
【図３】同装置給電部の要部拡大平面図FIG. 3 is an enlarged plan view of a main part of the power supply unit of the device.
【図４】図３のＡＡ′断面図FIG. 4 is a sectional view taken along the line AA ′ of FIG. 3;
【図５】従来の全面めっき装置の給電部の拡大平面図FIG. 5 is an enlarged plan view of a power supply unit of a conventional full-surface plating apparatus.
【図６】図５のＢＢ′断面図6 is a sectional view taken along the line BB 'in FIG.
３ 軸一体給電ローラ ４ 軸一体給電用ブスバー 3-axis integrated power supply roller 4-axis integrated power supply busbar
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−131387（ＪＰ，Ａ) 特開 昭62−186482（ＪＰ，Ａ) 特開 昭62−284099（ＪＰ，Ａ) 実開 昭57−176466（ＪＰ，Ｕ) 実開 昭61−86467（ＪＰ，Ｕ) 実開 昭49−51823（ＪＰ，Ｕ) 実開 昭63−14571（ＪＰ，Ｕ) 実開 昭59−185274（ＪＰ，Ｕ) 実開 昭59−125974（ＪＰ，Ｕ) 実公 昭63−11176（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 7/06 C25D 21/00 H01L 23/50 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-57-131387 (JP, A) JP-A-62-186482 (JP, A) JP-A-62-284099 (JP, A) 176466 (JP, U) Fully open 61-86467 (JP, U) Fully open 49-51823 (JP, U) Fully open 63-14571 (JP, U) Fully open 59-185274 (JP, U) Japanese Utility Model Application Sho 59-125974 (JP, U) Japanese Utility Model Application 63-11176 (JP, Y2) (58) Fields investigated (Int. Cl. 7 , DB name) C25D 7/06 C25D 21/00 H01L 23/50
Claims (1)
全面めっき装置において、フレームへ給電する給電ロー
ラとその回転軸とを一体にしてブスバーの接触部を給電
ローラの軸上に配設し、給電部水槽内のフレームへの給
電部の給電用ブスバーコンタクトを前記給電ローラの回
転軸上において前記ブスバーの接触部と接触するよう配
設したことを特徴とする全面めっき装置の給電装置。1. A power supply row for supplying power to a frame in a full- frame plating apparatus for a reel tow reel of a frame longitudinal feed type.
And the rotating shaft are integrated to feed the contact area of the bus bar.
The busbar contact for power supply of the power supply unit to the frame in the power supply unit water tank was disposed on the shaft of the roller so as to be in contact with the contact portion of the busbar on the rotation axis of the power supply roller. A power supply device for a full-surface plating apparatus, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04035919A JP3099498B2 (en) | 1992-02-24 | 1992-02-24 | Power supply equipment for full plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04035919A JP3099498B2 (en) | 1992-02-24 | 1992-02-24 | Power supply equipment for full plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05230691A JPH05230691A (en) | 1993-09-07 |
| JP3099498B2 true JP3099498B2 (en) | 2000-10-16 |
Family
ID=12455446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04035919A Expired - Lifetime JP3099498B2 (en) | 1992-02-24 | 1992-02-24 | Power supply equipment for full plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3099498B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003321796A (en) * | 2002-04-30 | 2003-11-14 | Nitto Denko Corp | Plating apparatus and method of manufacturing wiring board using the same |
| JP2006055952A (en) * | 2004-08-20 | 2006-03-02 | Asahi Diamond Industrial Co Ltd | Device and method of manufacturing ultra-long tool |
| JP4992428B2 (en) | 2004-09-24 | 2012-08-08 | イビデン株式会社 | Plating method and plating apparatus |
| TW200741037A (en) * | 2006-01-30 | 2007-11-01 | Ibiden Co Ltd | Plating apparatus and plating method |
| JP4878866B2 (en) | 2006-02-22 | 2012-02-15 | イビデン株式会社 | Plating apparatus and plating method |
-
1992
- 1992-02-24 JP JP04035919A patent/JP3099498B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05230691A (en) | 1993-09-07 |
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