JP3072235B2 - Surface mount type remote control light receiving unit and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type remote control light receiving unit, and more particularly to a surface mount type remote control light receiving unit used for various electronic devices such as TVs and VTRs for receiving a remote control signal and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 4A and 4B are external views of a conventional surface mount type remote control light receiving unit, FIG. 4A is a plan view, and FIG.
Is a front view, (c) is a back view, (d) is a right side view, and (e) is a bottom view. 5A and 5B are views for explaining the internal configuration of the surface-mount type remote control light-receiving unit. FIG. 5A is a longitudinal sectional view, FIG. 5B is a perspective view of a main part, and FIG. FIG.

A conventional surface mount type remote control light receiving unit is
As shown in FIGS. 4 and 5, a printed wiring board (PWB)
A light receiving chip 2, a signal processing IC chip 3, a chip capacitor 4, and a chip resistor 5 are mounted on a printed wiring board 1, and a resin frame 6 surrounding all the chips described above is arranged on an outer peripheral portion of the printed wiring board 1. The chip is covered with a light-transmitting coating resin 7 injected into the resin frame 6, and the front surface thereof is a shield case except for a portion (light receiving window 9) located above the light receiving surface of the light receiving chip 2. 8. In FIG. 5B, reference numeral 10 denotes an adhesive.

The shield case 8 has a hook 8a for engaging with the resin frame 6, and the resin frame 6 has a fitting groove 6a corresponding to the hook 8a.

[0005] The shield case 8 is shown in FIG.
As shown in FIG. 1C, a lead terminal 8b is provided, and the lead terminal 8b and a ground terminal of the printed wiring board 1 (hereinafter, referred to as a lead terminal 8b).
It is referred to as “GND terminal”. 11) are arranged at positions corresponding to each other, and the lead terminal 8b and the GND terminal 11 are electrically connected by, for example, soldering at the time of reflow by a user, so that the shield case 8 has a shielding effect. .

In FIG. 4, reference numeral 12 denotes a V _CC terminal.
3 is a V ₀ terminal.

The surface mounting type remote control light receiving unit having the above structure is manufactured, for example, by the following manufacturing method. First, as shown in FIG. 6, a multiple board (for example, 96
A light receiving chip, a signal processing IC chip, a chip capacitor, and a chip resistor are mounted on a printed wiring board 1 'made of individual pieces, and a multi-unit resin frame (16-piece resin frame) 6' is arranged in six rows and an adhesive is provided. Then, the coating resin is potted in the resin frame 6 '. Here, the resin frame 6 'serves to stop the flow of the coating resin. 6A is a bottom view, FIG. 6B is a side view, and FIG. 6C is an enlarged view of a portion B of FIG.

Next, the assay product comprising the printed wiring board 1 'and the multiple resin frames 6' is diced using a dicing device along the dicing line 14, and divided into individual surface-mount type remote control light receiving units. However,
Prior to dicing, 32 printed wiring boards 1 'are taken by a PWB split type and are once divided into printed wiring boards.

Now, the dicing will be described.
An assay product for two resin frames is attached to a dicing sheet, and dicing is performed with water to prevent abrasion of a dicing blade (a tooth for dicing cutting). Next, ultraviolet irradiation is performed to weaken the adhesive force of the adhesive of the dicing sheet.

[0010] Since the assay product cut into a single product from the dicing sheet is watered at the time of dicing, water is replaced. For example, alcohol substitution is performed and drying is performed at a high temperature (70 ° C.).

The through hole 15 shown in FIG.
It is when dividing into individual by a dicing, through holes holes are halved, and the terminals of the surface mounting type remote control light receiving unit (GND terminal 11, V _CC terminal 12, V ₀ terminal 13).

Thereafter, a shield case 8 is put on the surface mount type remote control light-receiving unit in order to provide a shielding effect. The shield case 8 is provided with a hook 8a provided on the shield case 8 and a fitting provided on the resin frame 6. It is fixed to the resin frame 6 by fitting with the groove 6a.

As described above, the surface mount type remote control light receiving unit is manufactured.

[0014]

However, in the conventional surface mount type remote control light receiving unit, even if dicing is performed, the process is complicated and the cost is increased as described above.

The lead terminals 8b of the shield case 8 for GND connection may be completely inserted into the fitting grooves of the resin frame 6 depending on the fitting state of the hooks 8a of the shield case 8, as shown in FIG. In some cases, the lead terminal 8b cannot be arranged at a position where the lead terminal 8b can be connected to the GND terminal 11 of the printed wiring board 1 without being hooked on the 6a. For example, the thickness of the solder paste at the time of reflow by a user is, for example, 0.15 to 0.2 mm, and the shortness is such that the hook 8a is not completely caught in the fitting groove 6a and exceeds the lead terminal 8b. Can no longer be soldered,
There is a problem that the contact with the GND terminal 11 is lost, and the remote control light receiving unit is weakened by external noise, and the distance characteristics and the like are significantly affected.

As described above, the conventional surface mount type remote control light receiving unit and the manufacturing method thereof have complicated manufacturing steps,
Further, there has been a problem that many combinations of components lead to an increase in cost and sometimes to a factor of characteristic deterioration.

An object of the present invention is to solve the above problems.

[0018]

According to the present invention, there is provided a surface-mounted remote control light-receiving unit, comprising: a light-receiving chip; a signal processing IC chip; a substrate on which the light-receiving chip and the signal processing IC chip are mounted; A light-transmitting coating resin for protecting the signal processing IC chip, a non-conductive resin body disposed so as to surround the coating resin, and a portion excluding the light-receiving surface of the non-conductive resin body and the light-receiving chip. A conductive resin body to be covered, wherein the non-conductive resin body and the conductive resin body are integrally molded. The substrate is provided with a ground terminal, and the conductive resin body is provided with a lead pin formed to protrude at a position corresponding to the ground terminal.

According to the method of manufacturing the surface mount type remote control light receiving unit of the present invention, the light receiving is performed on each substrate of the multi-cavity substrate having the ground terminal and the plurality of substrates connected in a substantially island shape at the connection portion. A step of mounting a chip and an IC chip for signal processing; a step of integrally molding a conductive resin body formed by insert molding of a lead pin and a non-conductive resin body by two-color molding; Correspondingly, the method comprises a step of mounting the integrally molded product on each of the substrates, and a step of punching the connection portion with a die.

[0020]

As described above, the surface-mounted remote control light-receiving unit of the present invention uses a conductive resin body for shielding and is formed by integrally molding the conductive resin body and the non-conductive resin body. The components are two, an integrally molded product made of a non-conductive resin body and a conductive resin body, and a substrate on which the chip is mounted, and the number of components can be reduced.

Further, the substrate is provided with a ground terminal, and the conductive resin body is provided with a lead pin formed to protrude at a position corresponding to the ground terminal. And the conductive resin body can have a shielding effect. The positioning of the ground terminal and the lead pin can be easily performed by positioning the integrally molded product and the substrate, and it is possible to prevent a defective contact with the ground terminal due to a fitting error when fitting a conventional shield case. It is possible to prevent the characteristics from deteriorating.

Further, in the method of manufacturing the surface mount type remote control light receiving unit according to the present invention, since the die is cut by a die instead of the conventional dicing cut, the manufacturing process can be simplified. Further, since the non-conductive resin body and the conductive resin body are integrally molded, there is no need to fit the conductive resin body to the non-conductive resin body. Therefore, it is possible to simplify the manufacturing process, reduce the number of combinations of the components, and reduce the cost.

[0023]

1 is a longitudinal sectional view showing a surface mount type remote control light receiving unit according to an embodiment of the present invention.

As shown in the figure, the surface mount type remote control light receiving unit of the present embodiment has a printed wiring board (PWB) on which electric components such as a light receiving chip 21, a signal processing IC chip 22, a chip capacitor 23 and a chip resistor 24 are mounted. ) 25,
A non-conductive resin body 26 disposed on an outer peripheral portion of the printed wiring board 25 and surrounding all of the chips described above; a coating resin 27 for covering all the chips in the non-conductive resin body 26; A conductive resin body 28 that covers the conductive resin body 26 and covers the surface side of the light receiving chip 21 except the light receiving surface above the light receiving surface (light receiving window 33).

The printed wiring board 25 is formed by forming and fixing a conductive pattern based on a circuit design on a surface of an insulating substrate using a conductive material made of copper foil or the like. It is wire bonded. A plurality of semicircular terminals are formed on both ends of the printed wiring board 25. The terminals are a voltage input terminal (V _CC terminal), a voltage output terminal (V ₀ terminal), and a ground terminal (GND terminal). ).

The non-conductive resin body 26 is made of a heat-resistant resin such as polyphenylene sulfide (PPS), for example.
The coating resin 27 is made of a resin having a high surface tension, for example, a silicone resin or an epoxy resin.

The conductive resin body 28 has a resistance value of about several tens Ω to several hundred Ω, and is made of, for example, a mixture of about 20 to 30% of carbon in a heat-resistant polyimide resin.
A contact lead pin 29 protruding at a position corresponding to the ND terminal is insert-molded at one end.

The contact lead pin 29 and the GND terminal are electrically connected, for example, by soldering at the time of reflow by the user. Thereby, the conductive resin body 28 has a shielding effect.

The non-conductive resin body 26 and the conductive resin body 2
As shown in FIG. 2, reference numeral 8 denotes an integrally molded product 30 integrally formed, the integrated molded product 30 includes a light receiving window 33, and a contact lead pin 29 at one end. Further, positioning pins 31 for the printed wiring board 25 are provided at least at two places on the printed wiring board mounting surface of the integrally molded product 30. 2A is a plan view, FIG. 2B is a front sectional view, and FIG. 2C is a right side sectional view.

The positioning pins 31 are provided at, for example, corners, and are used for positioning when the integrally molded product 30 is mounted on the printed wiring board 25. It has a pin hole.

According to this structure, a conductive resin body 28 and a non-conductive resin body 26 obtained by insert-molding a contact lead pin 29 are integrally formed in the surface-mounted remote control light-receiving unit of this embodiment. Since the integrally molded product 30 is mounted on the printed wiring board 25, the components are two, the integrated molded product 30 and the printed wiring board 25, and the number of components can be reduced. Also, lead pin 2 for contact
9 and the GND terminal can be easily positioned by positioning the integrally molded product 30 and the printed wiring board 25,
G due to misalignment when fitting a conventional shield case
It is possible to prevent contact failure to the ND terminal, and to prevent deterioration of characteristics.

Hereinafter, an example of a method for manufacturing the above-described surface-mount type remote control light receiving unit will be described. First, a light receiving chip is mounted on each printed wiring board 25 'of a wiring board 25' having a plurality of substantially island-shaped printed wiring boards 25 which are connected only to a part (connection part 32) as shown in FIG. 21, electrical components such as a signal processing IC chip 22, a chip capacitor 23, and a chip resistor 24 are mounted, and all the chips are covered with the coating resin 27 for each printed wiring board 25.

In another step, a contact lead pin 29 is insert-molded into the non-conductive resin body 26, and the non-conductive resin body 26 and the conductive resin body 28 are integrally formed by two-color molding. The integrally molded product 30 is mounted on each printed wiring board 25 via an adhesive. Note that FIG.
In the middle, the hatched portion indicates a blank portion.

Next, by punching out the connection portion 32 using a mold, individual surface mount type remote control light receiving units are obtained.

According to the manufacturing method, punching and division are performed by using a die instead of the conventional dicing. Therefore, the die punching process is easier than the dicing process, and the manufacturing process can be simplified. In addition, the non-conductive resin body 2
6 and the conductive resin body 28 are integrally molded, so that it is not necessary to fit the conductive resin body 28 to the non-conductive resin body 26. Therefore, the manufacturing process can be simplified, and the number of combinations of components is reduced, which leads to cost reduction.

[0036]

As described above, according to the surface mount type remote control light receiving unit of the present invention, a conductive resin body is used for shielding, and the conductive resin body and the non-conductive resin body are integrally molded. With this configuration, the number of components is two, that is, an integrally molded product made of a non-conductive resin body and a conductive resin body, and a substrate on which a chip is mounted, and the number of components is reduced.
Further, the positioning of the ground terminal and the lead pin can be easily performed by positioning the integrally molded product and the substrate, whereby the ground terminal and the lead pin can be securely connected, and the conductive resin body can have a shielding effect. it can. As a result, it is possible to prevent a defective contact with the ground terminal as in the related art, and to prevent deterioration in characteristics.

Further, according to the method of manufacturing the surface mount type remote control light receiving unit of the present invention, since the die is punched and divided instead of the conventional dicing cut, the manufacturing process can be simplified. Further, since the non-conductive resin body and the conductive resin body are integrally molded, there is no need to fit the conductive resin body to the non-conductive resin body. Therefore, the manufacturing process can be simplified, the number of combinations of the components is reduced, and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention.

FIGS. 2A and 2B are views showing an integrally molded product including a non-conductive resin body and a conductive resin body shown in FIG. 1, wherein FIG. 2A is a plan view, FIG. It is a right side sectional view.

FIG. 3 is a plan view for explaining a method of manufacturing the surface-mounted remote control light-receiving unit shown in FIG.

4A and 4B are external views of a conventional surface mount type remote control light receiving unit, wherein FIG. 4A is a plan view, FIG. 4B is a front view, FIG. 4C is a rear view, and FIG. FIG.
(E) is a bottom view.

FIG. 5 is a diagram for explaining the internal configuration of FIG. 4;
(A) is a longitudinal sectional view, (b) is a perspective view of a main part,
(C) is an enlarged sectional view of a part A of (a).

FIG. 6 is a view for explaining a method of manufacturing the conventional surface-mounted remote control light-receiving unit shown in FIGS. 4 and 5;
(A) is a bottom view, (b) is a side view, and (c)
FIG. 3 is an enlarged view of a portion B in FIG.

FIG. 7 is a longitudinal sectional view for explaining a conventional problem.

[Explanation of symbols]

 Reference Signs List 21 light-receiving chip 22 signal processing IC chip 25 printed wiring board 26 non-conductive resin body 27 pre-coated resin 28 conductive resin body 29 contact lead pin 30 integrally molded product

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 31/00-31/0392

Claims (3)

(57) [Claims] A light-receiving chip, a signal processing IC chip, a substrate on which the light-receiving chip and the signal processing IC chip are mounted, and a light-transmitting coating resin for protecting the light-receiving chip and the signal processing IC chip. A non-conductive resin body disposed so as to surround the coating resin, and a conductive resin body that covers the non-conductive resin body and a portion other than the light receiving surface of the light receiving chip, wherein the non-conductive resin A surface-mounted remote control light-receiving unit characterized in that a body and a conductive resin body are integrally molded. 2. The surface mount type according to claim 1, wherein the substrate includes a ground terminal, and the conductive resin body includes a lead pin formed to protrude at a position corresponding to the ground terminal. Remote control light receiving unit. 3. A step of mounting a light receiving chip and a signal processing IC chip on each substrate of a multi-cavity substrate having a plurality of substrates having a ground terminal and being held substantially in an island shape at a connection portion. A step of integrally molding a conductive resin body formed by insert molding of a lead pin and a non-conductive resin body by two-color molding; and forming the integrally molded article on each of the substrates so that the lead pin and the ground terminal correspond to each other. And a step of punching the connection portion with a mold.