JP3070358B2 - Flexible printed wiring board shielding device - Google Patents
Flexible printed wiring board shielding deviceInfo
- Publication number
- JP3070358B2 JP3070358B2 JP5264082A JP26408293A JP3070358B2 JP 3070358 B2 JP3070358 B2 JP 3070358B2 JP 5264082 A JP5264082 A JP 5264082A JP 26408293 A JP26408293 A JP 26408293A JP 3070358 B2 JP3070358 B2 JP 3070358B2
- Authority
- JP
- Japan
- Prior art keywords
- shield
- insulating film
- hole
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気機器等の接続に際
して使用されるフレキシブル印刷配線板のシールド装置
の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a shield device for a flexible printed wiring board used for connection of electric equipment and the like.
【０００２】[0002]
【従来の技術】フレキシブル印刷配線板については、内
部の信号回路を電磁妨害波等のノイズから保護するため
のシールド構造が採用されていた。フレキシブル印刷配
線板のシールド装置は、図３に示すように、絶縁フィル
ム１上に長手方向に沿って信号線２及び接地線３を形成
し、絶縁フィルム１の側方に形成された延長部４に前記
接地線３と接続されるシールドパターン５を形成してい
る。そして、図４に示すように、信号線２を包み込むよ
うに延長部４を折曲させて巻回し、両面テープ６等の接
着剤を巻回接着させてシールド構造を形成していた（特
開昭６２−２６９３８９号公報参照）。2. Description of the Related Art For flexible printed wiring boards, a shield structure for protecting internal signal circuits from noise such as electromagnetic interference waves has been employed. As shown in FIG. 3, the shield device for a flexible printed wiring board forms a signal line 2 and a ground line 3 on an insulating film 1 along a longitudinal direction, and an extension 4 formed on the side of the insulating film 1. And a shield pattern 5 connected to the ground line 3 is formed. Then, as shown in FIG. 4, the extension portion 4 is bent and wound so as to surround the signal line 2, and an adhesive such as a double-sided tape 6 is wound and adhered to form a shield structure (Japanese Patent Application Laid-Open No. H11-163873). See JP-A-62-269389).
【０００３】[0003]
【発明が解決しようとする問題点】上記フレキシブル印
刷配線板のシールド構造によれば、信号線２全体をシー
ルドパターン５で包み込む構造であるので、外部から信
号線２に侵入するノイズを遮断し、また、信号線２から
のノイズが外部へ放射することを遮断している。しかし
ながら、各信号線同士についてのノイズの干渉について
は、何等対策が取られておらず、隣接する信号線からの
影響を受けるという問題点があった。According to the shield structure of the flexible printed wiring board, since the entire signal line 2 is wrapped with the shield pattern 5, noise entering the signal line 2 from outside can be cut off. In addition, noise from the signal line 2 is prevented from radiating outside. However, no countermeasures have been taken for noise interference between the signal lines, and there has been a problem that the signal lines are affected by adjacent signal lines.
【０００４】本発明は上記実情に鑑みてなされたもの
で、フレキシブル印刷配線板の周辺に位置する電気機器
からの電磁妨害波をシールド可能とするとともに、複数
の信号線同士のノイズの干渉を防止することができるフ
レキシブル印刷配線板のシールド装置を提供することを
目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to shield an electromagnetic interference wave from an electric device located around a flexible printed wiring board and to prevent interference of noise between a plurality of signal lines. It is an object of the present invention to provide a flexible printed wiring board shielding device that can perform the above-described steps.
【０００５】[0005]
【課題を解決するための手段】上記従来例の問題点を解
決するため請求項１のフレキシブル印刷配線板のシール
ド装置は、信号線とこの信号線を挟むシールド線とを有
する配線パターンを形成した第１の絶縁フィルムを、前
記配線パターンを覆う面積を有するシールドパターンを
形成した第２の絶縁フィルム及び第３の絶縁フィルムで
挟んだ積層構造を有している。そして、前記シールド線
の長手方向に沿って複数の第１孔部を第１の絶縁フィル
ムに穿孔し、第１の絶縁フィルム上に積層される第２の
絶縁フィルムの前記第１孔部に対応する位置に第２孔部
を穿孔する。また、第１孔部の開口面積より第２孔部の
開口面積を大きくし形成し、第１孔部及び第２孔部に導
電性材料を充填することにより、前記シールド線と第２
の絶縁フィルム及び第３の絶縁フィルムに形成したシー
ルドパターンとを電気的に接続する。In order to solve the above-mentioned problems of the prior art, a shield device for a flexible printed wiring board according to the first aspect of the present invention has a wiring pattern having signal lines and shield lines sandwiching the signal lines. It has a laminated structure in which the first insulating film is sandwiched between a second insulating film having a shield pattern having an area covering the wiring pattern and a third insulating film. Then, a plurality of first holes are perforated in the first insulating film along the longitudinal direction of the shield wire, and correspond to the first holes of the second insulating film laminated on the first insulating film. The second hole is pierced at the position to be performed. Further, by forming the opening area of the second hole to be larger than the opening area of the first hole, and filling the first hole and the second hole with a conductive material, the shield line and the second hole are formed.
And the shield pattern formed on the third insulating film are electrically connected.
【０００６】[0006]
【作用】本発明のフレキシブル印刷配線板のシールド装
置によれば、第１の絶縁フィルム上に形成された信号線
は同一絶縁フィルム上に形成されるシールド線で挟むよ
うに構成され、また、上下方向については第２の絶縁フ
ィルム及び第３の絶縁フィルムに形成されたシールドパ
ターンで挟まれる。前記シールド線と第２の絶縁フィル
ム及び第３の絶縁フィルムに形成したシールドパターン
とは、第１孔部及び第２孔部に充填された導電性材料に
より電気的に接続され、第１孔部及び第２孔部はシール
ド線の長手方向に沿って複数形成されているので、前記
信号線は、等価的にシールド層で周囲を囲まれ、隣接す
る信号線との遮断及び外部との遮断を図ることができ
る。According to the flexible printed wiring board shield device of the present invention, the signal line formed on the first insulating film is configured to be sandwiched between the shield lines formed on the same insulating film. The direction is sandwiched between the shield patterns formed on the second insulating film and the third insulating film. The shield wire is electrically connected to the shield pattern formed on the second insulating film and the third insulating film by a conductive material filled in the first hole and the second hole. And a plurality of second holes are formed along the longitudinal direction of the shield line, so that the signal line is equivalently surrounded by a shield layer, and shuts off the adjacent signal line and the outside. Can be planned.
【０００７】[0007]
【実施例】本発明にかかるフレキシブル印刷配線板のシ
ールド装置の実施例について、図１及び図２を参照しな
がら説明する。フレキシブル印刷配線板のシールド装置
は、それぞれ同じ面積の第１の絶縁フィルム１０、第２
の絶縁フィルム２０及び第３の絶縁フィルム３０を、絶
縁フィルム３０，１０，２０の順に積層して構成されて
いる。第１の絶縁フィルム１０には、図２（ａ）に示す
ように、絶縁フィルム１０上に複数本の信号線１１と複
数本のシールド線１２とを交互に配置し、各信号線１１
がシールド線１２で挟まれた配線パターンが形成されて
いる。配線パターンは、絶縁フィルム１０の長尺側に沿
って形成された複数本の導電性の薄膜パターンで構成さ
れている。また、第１の絶縁フィルム１０には、各シー
ルド線１２の長手方向に沿った数箇所の位置に、シール
ド線１２の幅より狭い径の円形開口を有する第１孔部１
３が穿孔されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a shield device for a flexible printed wiring board according to the present invention will be described with reference to FIGS. The flexible printed wiring board shielding device has a first insulating film 10 and a second insulating film 10 each having the same area.
The insulating film 20 and the third insulating film 30 are laminated in the order of the insulating films 30, 10 and 20. As shown in FIG. 2A, a plurality of signal lines 11 and a plurality of shield lines 12 are alternately arranged on the first insulating film 10, and each signal line 11
A wiring pattern sandwiched between the shield wires 12 is formed. The wiring pattern is composed of a plurality of conductive thin film patterns formed along the long side of the insulating film 10. Further, the first insulating film 10 has a first hole 1 having a circular opening with a diameter smaller than the width of the shield wire 12 at several positions along the longitudinal direction of each shield wire 12.
3 are perforated.
【０００８】第２の絶縁フィルム２０には、図２（ｂ）
に示すように、第１の絶縁フィルム１０（信号線１１及
びシールド線）の配線パターンを覆う面積を有する長方
形状のシールドパターン２１が形成され、前記第１の絶
縁フィルム１０の第１孔部１３に対応する位置に円形状
の開口面積を有する第２孔部２２が穿孔されている。第
２孔部２２の開口面積は、第１孔部１３の開口面積より
大きくし形成されている。The second insulating film 20 has a structure shown in FIG.
As shown in FIG. 3, a rectangular shield pattern 21 having an area covering the wiring pattern of the first insulating film 10 (the signal line 11 and the shield line) is formed, and the first hole 13 of the first insulating film 10 is formed. A second hole 22 having a circular opening area is perforated at a position corresponding to. The opening area of the second hole 22 is larger than the opening area of the first hole 13.
【０００９】第３の絶縁フィルム３０は、図２（ｃ）に
示すように、第１の絶縁フィルム１０配線パターンを覆
う面積を有する長方形状のシールドパターン３１が形成
されている。シールドパターン２１，３１は、それぞれ
導電性の薄膜パターンで構成されている。As shown in FIG. 2C, a rectangular shield pattern 31 having an area covering the wiring pattern of the first insulating film 10 is formed on the third insulating film 30. Each of the shield patterns 21 and 31 is formed of a conductive thin film pattern.
【００１０】絶縁フィルム１０，２０，３０は、例えば
特開平１−８９５８６号に開示されるように、半硬化状
態を有し加熱加圧することによって硬化する絶縁材料で
構成されている。上記したような３枚の絶縁フィルム
を、絶縁フィルム３０，１０，２０の順に重ね合せて加
熱加圧することにより接合させ、第１図に示すような積
層構造のフレキシブル印刷配線板のシールド装置を形成
する。第１孔部１３及び第２孔部２２部分においては、
第１孔部１３と第２孔部２２とが同芯状に位置するよう
接合される。また、第２孔部２２の開口面積を第１孔部
１３の開口面積より大きくしたので、接合積層時におい
ては第２孔部２２に対してその下層のシールド線１２の
一部が露出するようになる。The insulating films 10, 20, 30 are made of an insulating material which has a semi-cured state and is cured by applying heat and pressure, as disclosed in, for example, Japanese Patent Application Laid-Open No. 1-89586. The three insulating films as described above are laminated in the order of the insulating films 30, 10, and 20 and joined by heating and pressing to form a shield device for a flexible printed wiring board having a laminated structure as shown in FIG. I do. In the first hole 13 and the second hole 22,
The first hole 13 and the second hole 22 are joined so that they are located concentrically. In addition, since the opening area of the second hole 22 is made larger than the opening area of the first hole 13, a part of the shield wire 12 under the second hole 22 is exposed to the second hole 22 at the time of bonding and lamination. become.
【００１１】第１孔部１３及び第２孔部２２には導電性
ペースト等の導電性材料４０を充填して硬化させるこに
より、第３の絶縁フィルム３０に形成したシールドパタ
ーン３１、第１の絶縁フィルム１０に形成したシールド
線１２、第２の絶縁フィルム２０に形成したシールドパ
ターン２１とを導電性材料４０を介して電気的に接続し
ている。第２孔部２２の開口面積を第１孔部１３の開口
面積より大きくしたので、下層のシールド線１２の一部
を露出させることができ、導電性材料４０の充填でシー
ルドパターン２１とシールド線１２とを確実に接続可能
としている。また、複数の信号線１１及びシールド線１
２の長手方向両端側には、コネクタ等に接続するための
接続部（図示せず）が形成されている。The first hole portion 13 and the second hole portion 22 are filled with a conductive material 40 such as a conductive paste and cured, so that the shield pattern 31 formed on the third insulating film 30 and the first The shield wire 12 formed on the insulating film 10 and the shield pattern 21 formed on the second insulating film 20 are electrically connected via a conductive material 40. Since the opening area of the second hole section 22 is larger than the opening area of the first hole section 13, a part of the lower shield wire 12 can be exposed. 12 can be reliably connected. In addition, a plurality of signal lines 11 and shield lines 1
A connection portion (not shown) for connecting to a connector or the like is formed on both ends in the longitudinal direction of 2.
【００１２】上記構造のシールド装置によれば、信号線
１１の平面方向は信号線１１を挟むシールド線１２で、
上下方向はシールドパターン２１，３１で外部と遮断さ
れている。更に、第１孔部１３及び第２孔部２２が形成
された部分においては、各シールドパターン２１，３１
とシールド線１２とが導電性材料４０で接続されている
ので、信号線１１の周囲をシールド層で囲むようにな
る。そして、第１孔部１３及び第２孔部２２を形成する
長手方向の間隔ｄを調整することにより、信号線１１の
全体にわたってこれを囲むシールド層が等価的に形成さ
れる。第１孔部１３及び第２孔部２２を形成する長手方
向の間隔ｄは、フレキシブル印刷配線板に柔軟性を持た
せるとともに、信号線１１を囲むシールド効果を得るた
めには、送信する信号の波長の１／２０程度の間隔にす
る。また、電磁波を遮断するような場合には、前記間隔
は１０〜２０ｃｍとするのが適している。According to the shield device having the above structure, the signal line 11 is in the plane direction with the shield line 12 sandwiching the signal line 11 therebetween.
The vertical direction is shielded from the outside by shield patterns 21 and 31. Further, in the portion where the first hole 13 and the second hole 22 are formed, the shield patterns 21 and 31 are formed.
And the shield line 12 are connected by the conductive material 40, so that the signal line 11 is surrounded by the shield layer. Then, by adjusting the distance d in the longitudinal direction between the first hole 13 and the second hole 22, a shield layer surrounding the entire signal line 11 is equivalently formed. In order to provide flexibility to the flexible printed wiring board and obtain a shielding effect surrounding the signal line 11, the distance d in the longitudinal direction for forming the first hole portion 13 and the second hole portion 22 is determined by the length of the signal to be transmitted. The interval is about 1/20 of the wavelength. In the case where electromagnetic waves are to be blocked, it is suitable that the interval is 10 to 20 cm.
【００１３】上記実施例においては、第１孔部１３及び
第２孔部２２は円形状としたが、他の形状でもよく、第
１孔部１３の開口面積より第２孔部２２の開口面積を大
きくして、下層のシールド線１２の一部が開口部から露
出するような構成であればよい。In the above embodiment, the first hole 13 and the second hole 22 are formed in a circular shape. However, other shapes may be used. The opening area of the second hole 22 is smaller than the opening area of the first hole 13. May be increased so that a portion of the lower shield wire 12 is exposed from the opening.
【００１４】[0014]
【発明の効果】本発明のフレキシブル印刷配線板のシー
ルド装置によれば、、第１の絶縁フィルム上に形成され
た信号線は同一絶縁フィルム上に形成されるシールド線
で挟むように構成され、また、上下方向については第２
の絶縁フィルム及び第３の絶縁フィルムに形成されたシ
ールドパターンで挟まれる。前記シールド線と第２の絶
縁フィルム及び第３の絶縁フィルムに形成したシールド
パターンとは、第１孔部及び第２孔部に充填された導電
性材料により電気的に接続され、第１孔部及び第２孔部
はシールド線の長手方向に沿って複数形成されているの
で、孔部の間隔を調整することにより、前記信号線は、
等価的にシールド層で周囲を囲まれ、隣接する信号線と
の遮断及び外部との遮断を確実に図ることができる。従
って、フレキシブル印刷配線板の周辺に位置する電気機
器からの電磁妨害波をシールド可能とするとともに、複
数の信号線同士のノイズの干渉を防止することができ
る。According to the shield device for a flexible printed wiring board of the present invention, the signal lines formed on the first insulating film are configured so as to be sandwiched by the shield lines formed on the same insulating film, In addition, the second
And the shield pattern formed on the third insulating film. The shield wire is electrically connected to the shield pattern formed on the second insulating film and the third insulating film by a conductive material filled in the first hole and the second hole. And a plurality of second hole portions are formed along the longitudinal direction of the shield line, so that by adjusting the interval between the hole portions, the signal line is
Equivalently, the periphery is surrounded by the shield layer, so that it is possible to reliably shut off the adjacent signal line and the outside. Accordingly, it is possible to shield electromagnetic interference waves from electric devices located around the flexible printed wiring board, and to prevent interference of noise between a plurality of signal lines.
【図１】 本発明のフレキシブル印刷配線板のシールド
装置の実施例を示す断面説明図である。FIG. 1 is an explanatory sectional view showing an embodiment of a shield device for a flexible printed wiring board according to the present invention.
【図２】 フレキシブル印刷配線板のシールド装置を構
成する各絶縁フィルムを示すもので、（ａ）は第１の絶
縁フィルムの平面説明図、（ｂ）は第２の絶縁フィルム
の平面説明図、（ｃ）は第３の絶縁フィルムの平面説明
図である。FIGS. 2A and 2B show respective insulating films constituting a shield device of a flexible printed wiring board, wherein FIG. 2A is a plan view of a first insulating film, FIG. 2B is a plan view of a second insulating film, (C) is a plane explanatory view of the third insulating film.
【図３】 従来のフレキシブル印刷配線板の展開説明図
である。FIG. 3 is a development explanatory view of a conventional flexible printed wiring board.
【図４】 図３のフレキシブル印刷配線板の使用状態に
おける断面説明図である。4 is an explanatory sectional view of the flexible printed wiring board of FIG. 3 in a state of use.
１０…第１の絶縁フィルム、 １１…信号線、 １２…
シールド線、 １３…第１孔部、 ２０…第２の絶縁フ
ィルム、 ２１…シールドパターン、 ２２…第２孔
部、 ３０…第３の絶縁フィルム、 ３１…シールドパ
ターン、 ４０…導電性材料10 ... first insulating film, 11 ... signal line, 12 ...
Shield wire, 13: first hole, 20: second insulating film, 21: shield pattern, 22: second hole, 30: third insulating film, 31: shield pattern, 40: conductive material
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−313300（ＪＰ，Ａ) 特開 平６−224587（ＪＰ，Ａ) 特開 昭61−27697（ＪＰ，Ａ) 特開 平４−267586（ＪＰ，Ａ) 特開 平２−266586（ＪＰ，Ａ) 実開 昭59−74758（ＪＰ，Ｕ) 実開 平４−15256（ＪＰ，Ｕ) 実開 昭63−147868（ＪＰ，Ｕ) 実開 昭62−120382（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 9/00 H05K 1/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-313300 (JP, A) JP-A-6-224587 (JP, A) JP-A-61-27697 (JP, A) 267586 (JP, A) JP-A-2-266586 (JP, A) JP-A-59-74758 (JP, U) JP-A-4-15256 (JP, U) JP-A-63-147868 (JP, U) Shokai 62-120382 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 9/00 H05K 1/02
Claims (1)
を有する配線パターンを形成した第１の絶縁フィルム
を、前記配線パターンを覆う面積を有するシールドパタ
ーンを形成した第２の絶縁フィルム及び第３の絶縁フィ
ルムで挟んだ積層構造から成るフレキシブル印刷配線板
のシールド装置であって、 前記シールド線の長手方向に沿って複数の第１孔部を第
１の絶縁フィルムに穿孔し、第１の絶縁フィルム上に積
層される第２の絶縁フィルムの前記第１孔部に対応する
位置に第２孔部を穿孔し、 第１孔部の開口面積より第２孔部の開口面積を大きくし
形成し、第１孔部及び第２孔部に導電性材料を充填する
ことにより、前記シールド線と第２の絶縁フィルム及び
第３の絶縁フィルムに形成したシールドパターンとを電
気的に接続して成るフレキシブル印刷配線板のシールド
装置。A first insulating film formed with a wiring pattern having a signal line and a shield line sandwiching the signal line; a second insulating film formed with a shield pattern having an area covering the wiring pattern; 3. A shield device for a flexible printed wiring board having a laminated structure sandwiched between insulating films according to No. 3, wherein a plurality of first holes are formed in the first insulating film along a longitudinal direction of the shield wires, A second hole is formed at a position corresponding to the first hole of the second insulating film laminated on the insulating film, and the opening area of the second hole is made larger than the opening area of the first hole. By filling the first hole and the second hole with a conductive material, the shield wire is electrically connected to the shield pattern formed on the second insulating film and the third insulating film. H Kishiburu printed wiring board of the shield apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5264082A JP3070358B2 (en) | 1993-09-29 | 1993-09-29 | Flexible printed wiring board shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5264082A JP3070358B2 (en) | 1993-09-29 | 1993-09-29 | Flexible printed wiring board shielding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07106787A JPH07106787A (en) | 1995-04-21 |
| JP3070358B2 true JP3070358B2 (en) | 2000-07-31 |
Family
ID=17398272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5264082A Expired - Fee Related JP3070358B2 (en) | 1993-09-29 | 1993-09-29 | Flexible printed wiring board shielding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3070358B2 (en) |
Cited By (1)
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|---|---|---|---|---|
| US20120097428A1 (en) * | 2009-07-13 | 2012-04-26 | Murata Manufacturing Co., Ltd. | Signal line path and manufacturing method therefor |
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|---|---|---|---|---|
| JP2005268448A (en) * | 2004-03-17 | 2005-09-29 | Yoshinokawa Electric Wire & Cable Co Ltd | Flexible printed wiring board and its manufacturing method |
| JP2007335455A (en) * | 2006-06-12 | 2007-12-27 | Fujikura Ltd | Flexible printed wiring board |
| JP4919755B2 (en) | 2006-10-02 | 2012-04-18 | 日東電工株式会社 | Wiring circuit board and electronic equipment |
| JP4790558B2 (en) * | 2006-10-02 | 2011-10-12 | 日東電工株式会社 | Method for manufacturing printed circuit board |
| JPWO2009075079A1 (en) * | 2007-12-11 | 2011-04-28 | 住友ベークライト株式会社 | Circuit board, circuit board manufacturing method, and coverlay film |
| JP4468464B2 (en) * | 2008-03-28 | 2010-05-26 | 株式会社東芝 | Flexible printed wiring board and electronic device |
| TWI387407B (en) * | 2009-06-10 | 2013-02-21 | Htc Corp | Flexible printed circuit and fabrication method thereof |
| JP2011014656A (en) * | 2009-06-30 | 2011-01-20 | Toshiba Corp | Electronic apparatus and flexible printed wiring board |
| WO2011018979A1 (en) * | 2009-08-11 | 2011-02-17 | 株式会社村田製作所 | Multilayered substrate |
| JP2010192903A (en) * | 2010-02-23 | 2010-09-02 | Toshiba Corp | Electronic apparatus |
| JP5728837B2 (en) * | 2010-06-29 | 2015-06-03 | 大日本印刷株式会社 | Suspension substrate, method for manufacturing suspension substrate, suspension, suspension with element, and hard disk drive |
| JP4772919B2 (en) * | 2010-12-22 | 2011-09-14 | 株式会社東芝 | Flexible printed wiring board |
| JP4922465B2 (en) * | 2011-06-16 | 2012-04-25 | 株式会社東芝 | Electronics |
-
1993
- 1993-09-29 JP JP5264082A patent/JP3070358B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120097428A1 (en) * | 2009-07-13 | 2012-04-26 | Murata Manufacturing Co., Ltd. | Signal line path and manufacturing method therefor |
| CN105101621A (en) * | 2009-07-13 | 2015-11-25 | 株式会社村田制作所 | Signal line path and manufacturing method therefor |
| US9374886B2 (en) * | 2009-07-13 | 2016-06-21 | Murata Manufacturing Co., Ltd. | Signal line path and manufacturing method therefor |
| CN105101621B (en) * | 2009-07-13 | 2018-12-14 | 株式会社村田制作所 | Signal line and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07106787A (en) | 1995-04-21 |
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