JP2982139B2 - Electronic circuit board transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board transfer device, and more particularly, to a device for transferring electronic substrates sequentially on a belt conveyor-type substrate transfer device and mounting electronic components thereon. The present invention relates to a device in which electronic components are efficiently transported to a position without waiting time and electronic components are efficiently mounted.

[0002]

2. Description of the Related Art An electronic circuit board provided with a belt-conveyor-type transfer device, which transfers a substrate from an upstream side, waits at a standby station, and then sends it to a mounting station, where necessary electronic components are mounted and sent out of line. Transporting apparatuses have been known in the art, and an example thereof is disclosed in JP-A-3-30496.
Can be mentioned.

FIG. 4 is an explanatory view showing the conventional apparatus. In this type of apparatus, the presence or absence of a substrate is detected, and when the mounting station is vacant, the substrate is immediately transferred from the standby station, and is transferred to the standby station. Needs to transport a new substrate from a substrate supply station (not shown) on the upstream side. Therefore, in the related art, sensors S1 and S2 are arranged at the standby station and the mounting station to detect the presence or absence of the substrate. In this case, a light reflection type or a light shielding type optical sensor is used as the sensor,
Usually, when light is received (shielded) near the edge of the substrate indicated by the dashed line in FIG. 5, the presence or absence of the substrate is detected by outputting an H level signal.

Incidentally, the shape of the substrate is not necessarily a regular rectangular shape, but has various shapes such as a shape in which the center of the edge is cut off as shown in FIG. In order to detect the presence or absence of a board having a shape as shown in FIG. 5 without error, a sensor with a delay circuit is conventionally used. The H level signal is held during the time when the passage is completed, so that the protrusion on the rear end side is not erroneously detected.

[0005]

However, such a sensor is expensive and, for example, when it is detected on the rear end side, there is a disadvantage that the movement of the substrate cannot be detected for a predetermined time after the substrate has passed. From that point, change the position of the sensor,
It is conceivable to detect at the center position of the substrate, but some substrates are perforated near the center position, and in any case, in the related art, it is always possible to always obtain stable detection accuracy with respect to the variety of substrate shapes. It was difficult.

Accordingly, an object of the present invention is to solve the above-mentioned drawbacks, detect the presence or absence of a board with high accuracy in response to a variety of board shapes, and consequently efficiently transport and mount components. It is an object of the present invention to provide an electronic circuit board transfer device which can reduce the waiting time to improve the work efficiency and is inexpensive in the configuration.

[0007]

As shown in the present invention, for example according to claim 1, wherein in order to solve the above object, SUMMARY OF], and a loading station located at least wait station and downstream thereof, the waiting station loading station in the electronic circuit board transfer apparatus designed to mount the electronic circuit components on a substrate transferred from the the standby station and the loading station, to detect the presence of a substrate site at a predetermined conveying direction vertical line of the substrate A counting means for counting the number of times is arranged, and it is configured such that it is confirmed that one or a plurality of substrates have passed between them when the count values of both counting means coincide.

[0008]

The operation will be described with reference to FIG. 5. The number of the substrate projections on the vertical line of the substrate transfer indicated by the one-dot chain line is counted. By counting, the shape of one or a plurality of substrates is specified. be able to. Therefore, if the count value of the standby station on the upstream side matches the count value of the mounting station on the downstream side, it is possible to reliably detect that the specified board has passed between them, and immediately confirm the absence of the board. Since the replenishment can be performed quickly, the waiting time of the operation at the mounting station can be reduced, and the parts can be mounted efficiently.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory view schematically showing an electronic circuit board transport device according to the present invention.

In FIG. 1, reference numeral 10 indicates a first belt conveyor, and reference numeral M1 indicates a first motor for driving the first belt conveyor. The belt conveyor 10 and the motor M1 constitute a standby station (referred to as a "buffer" in the embodiment) for receiving a supply of the substrate 12 from a substrate supply station (not shown) of the same configuration on the upstream side and waiting. On the downstream side, the second belt conveyor 14 and the second motor M2
(In the embodiment, referred to as “component mounting section”), and the substrate 1 conveyed here is connected.
The required components are mounted on the chip 2 via a chip mounter unit (not shown in FIG. 1), and are further transported to a downstream station (not shown). The shape of the substrate 12 is as shown in FIG.

Here, as shown in the drawing, sensors S1, S2 and S3 of the light reflection type are arranged at the positions shown in the transport direction in the buffer and the component mounting portion. That is, the sensor S1 is arranged near the downstream end of the buffer, the sensor S2 is arranged near the front end of the board at the component mounting position in the component mounting portion, and the first sensor S1 is arranged near the upstream end of the buffer.
Distance D greater than the length of the substrate to be transported in the transport direction
, A third sensor S3 is arranged. In addition, these sensors are arranged in such a position that they can be detected at the position indicated by the dashed line shown in FIG. 5 in the horizontal direction.

FIG. 2 is a block diagram showing a control device for controlling the operation of the device in response to the outputs of these sensors. In the drawing, the outputs of the sensors S1, S2 and S3 are sent to a processing circuit 20, where an H-level signal is generated each time the sensor receives reflected light at the projection of the substrate and sent to the CPU 22 at the next stage. CPU22 counts the number of output times of the H-level signal as shown in FIG. 5, on the motor M1, M2, sends a signal off, driving the motor M1, M2. ROM
Program shown in FIG. 3 is stored in the 24, RAM 26
And execute the program. When the sensor S2 detects the arrival of the board, the chip mounter unit 30 is driven via the drive circuit 28 to instruct the mounting of components,
The completion of mounting is detected by the end of the component mounting program.

Next, the operation of the present apparatus will be described with reference to FIG.

First, in step S10, it is confirmed whether or not the substrate has arrived at the upstream end of the buffer from the substrate supply station on the upstream side, that is, whether or not the substrate has arrived at the sensor S3. At this time, the motor M1 is turned on (during rotation) at S42 as described later. When the arrival is confirmed, the process proceeds to S12, where the substrate is being conveyed onto the buffer, so that the sending out of the substrate supply station on the upstream side is stopped.
Count the level output. In the case of the embodiment, the count value is "2" when the sheet is conveyed in the direction of the arrow from the shape as shown in FIG.
Becomes

Subsequently, in step S16, the light reception of the sensor S1 is confirmed.
That is, it is confirmed whether or not the substrate has reached the downstream end of the buffer.
As the memory 1. That is, since the sensors S1 and S3 are separated by the distance D, the arrival of the substrate at the position where the sensor S1 is disposed means that the substrate has completely passed the position where the sensor S3 is disposed, in other words, the counting of the substrate protrusions. This means that one substrate can be specified through the shape after the completion of the above operation, and the count value is stored at this time.

Next, in step S20, the sensor S
1 is counted, and in S22, it is determined whether or not the counted value matches the memory 1 (the counted value of the sensor S3). If a match is confirmed in S22, it can be confirmed that the board of the specified shape has completely passed through the buffer and is being transferred to the next component mounting section. At the same time as permitting, the motor M1 is stopped in S26 to interrupt the transportation to the component mounting unit. Next, in S28, the process proceeds to S30 after waiting for arrival at the sensor S2 arrangement position, where the count value of the sensor S1 is stored in the RAM 26 as the memory 2. Next, the process proceeds to S32, in which the motor M2 is stopped, and the downstream delivery is stopped, and the process proceeds to S33 to start mounting components.

Next, after confirming the completion of the component mounting by ending the component mounting program in S34, the process proceeds to S36, in which the motor M2 is restarted, the process proceeds to S38, and the sensor S2 output is counted. 2 (Sensor S
(1 count value) is determined. If they match, it means that the board of the specified shape has completely passed the sensor S2 arrangement position, that is, the board has been sent out of the row, so the process proceeds to S42, where the motor M1 is restarted.
Then, the board is transferred from the buffer to the component mounting section, and the steps are repeated thereafter.

In this embodiment, as described above, three sensors are arranged in the transport direction, the number of projecting portions of the substrate is counted, one substrate is specified through the shape, and the counted values are compared with each other and specified. to transport while confirming the has been the passage of the board of shape
Having in earthenware pots, when there is no substrate in each station may be supplemented with the substrate immediately from the upstream side, resulting in component mounting portion in order to be able to mount the parts to reduce the mounting operation latency Thus, the board can be efficiently transported and components can be mounted.

[0019]

According to the first aspect of the present invention, there is provided at least a waiting station and a mounting station located downstream thereof.
In the electronic circuit board transfer apparatus designed to mount the electronic circuit components on the substrate conveyed from the standby station at the loading station, said the waiting station and the loading station, the substrate site at a predetermined conveying direction vertical line of the substrate detecting the presence of the counting means for counting the number of times respectively disposed, even one with a match count values of both counting means
Or, it is configured to confirm that a plurality of substrates have passed between them, so that even for a wide variety of substrates, one or more substrates can be specified through the shape from the count value, and from the count value. One of the specified shapes
Alternatively, it is possible to reliably detect the movement of a plurality of substrates, and when a substrate does not exist in any of the stations , it is possible to immediately replenish the substrate, thereby efficiently transporting the substrate, and as a result, The waiting time in the component mounting operation can be reduced, and the efficiency of the component mounting operation can be improved.

Preferably, the counting means is arranged near the upstream end and near the downstream end of the waiting station, respectively, and when the counting values of both counting means coincide with each other, the one or more counting means are arranged.
Is configured to confirm that a plurality of substrates have passed through the standby station, so that it is possible to reliably and quickly detect that the substrate has moved from the standby station to the loading station for the reasons described above. Can be immediately replenished, and as a result, the efficiency of component mounting work can be improved.

According to a third aspect of the present invention, the counting means is arranged at a separation distance larger than the length of the substrate in the transport direction, so that the shape of the substrate can be specified with certainty. The movement can be reliably detected, and the efficiency of component mounting work can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic view of an electronic circuit board transfer device according to the present invention.

FIG. 2 is an explanatory block diagram showing details of a control device of the apparatus shown in FIG. 1;

FIG. 3 is a flowchart showing the operation of the apparatus in FIG. 2;

FIG. 4 is a schematic view showing a conventional electronic circuit board transport device.

FIG. 5 is an explanatory plan view showing an example of the shape of a substrate transferred by the present apparatus.

[Explanation of symbols]

 Reference Signs List 10 first belt conveyor 12 substrate 14 second belt conveyor 20 processing circuit 22 CPU 24 ROM 26 RAM 28 drive circuit 30 chip mounter unit M1 first motor M2 second motor S1 first sensor S2 second sensor S3 Third sensor

Claims (3)

(57) [Claims] 1. A comprising at least standby station and a loading station located downstream, in the electronic circuit board transfer apparatus designed to mount the electronic circuit components on the substrate conveyed from the standby station at the loading station, the waiting At the station and the mounting station, counting means for detecting the presence of a substrate portion on a vertical line in the predetermined transport direction of the substrate and counting the number of times are arranged, and one or more counting means are provided when the counting values of both counting means match. electronic circuit board conveying device number of <br/> substrate is characterized by being configured so as to confirm that passed between them. 2. The counting means is arranged near the upstream end and near the downstream end of the standby station, respectively, and when one of the counting means coincides with the other, the one or more substrates are in standby. electronic circuit board conveying device according to claim 1, wherein said that so as to verify that has passed through the station. 3. The electronic circuit board carrying device according to claim 2, wherein said counting means is arranged at a separation distance larger than a length of the board in the carrying direction.