JP2968139B2 - Panel mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel mounting structure. More specifically, the present invention relates to a structure for mounting a panel such as a liquid crystal panel in which electrode terminals are arranged on a peripheral portion.

[0002]

2. Description of the Related Art As shown in FIG.
In general, a liquid crystal 121 is sealed between a pair of glass substrates 101 and 102. This liquid crystal panel 1
Reference numeral 20 denotes an electrode terminal 103 connected to a pixel and an electrode terminal 185 for receiving a driving signal from the outside on the periphery of one glass substrate 102. In the mounted state, a driving IC 105 (having a bump electrode 112) for driving the liquid crystal panel 120 is connected between the electrode terminal 103 and the electrode terminal 185 by a conductive paste (not shown) (chip-on-glass). (COG) method). Further, a circuit board 182 for supplying a driving signal to the driving IC 105 is connected to the electrode terminal 185 via a flexible wiring board 181. The electrode terminal 185 and the flexible wiring board 181 are connected to the anisotropic conductive material 18.
4 are connected by thermocompression bonding while the flexible wiring board 1 is connected.
81 and the circuit board 182 are connected by solder 183. The driving signals are supplied to other driving ICs arranged in the back or front in the drawing of the driving IC 105 through a bus line 173 provided on the circuit board 182.

[0003]

By the way, the recent competition in the development of liquid crystal panels is very severe, and there is a strong demand for reducing the size of the mounting state (module) of the liquid crystal panel in size and weight. However, in the above-described conventional mounting structure, since the circuit board 182 is arranged apart from the side of the liquid crystal panel 120, there is a problem that the size of the module is inevitably increased. Glass substrate 12
Since the drive IC 105 is mounted on the periphery of the zero, the width of the periphery is increased, and the size of the liquid crystal panel 120 itself is also increased. In addition, two large components, a flexible wiring board and a circuit board, are provided because a driving signal needs to be supplied to another adjacent driving IC. Because of this, the weight of the module has increased,
Weight reduction is hampered.

Further, since two large components, ie, a flexible wiring board and a circuit board, are provided, the number of components is increased and the material cost is increased, and the anisotropic conductive material 184 and the solder 183 are provided.
Therefore, there is a problem that the number of steps of the two connection steps due to the above increases, and the cost increases.

The liquid crystal panel 120 (glass substrate 10)
Since the driving IC (chip) 105 is mounted on the peripheral portion of 2), a prober contact equivalent to the IC is required as an inspection pad, and there is a problem that an operation test (panel inspection) is complicated and takes a long time.

Further, since the driving IC 105 is connected by a conductive paste, it is firmly attached to the liquid crystal panel 120. For this reason, there is a problem that the liquid crystal panel 120 is damaged when the driving IC 105 determined to be defective by the panel inspection is removed. Also, a new driving IC is used in place of the defective IC 105.
In order to connect C, a series of steps of transferring a conductive paste to a bump electrode of a new driving IC, aligning the conductive paste with the electrode terminals 103 and 185 of the liquid crystal panel 120, and curing the conductive paste are required. For this reason,
There is a problem that it takes time to replace (rework) the driving IC. This has led to increased costs.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a panel mounting structure which is small, lightweight, low-cost, and can easily perform an operation test and rework.

[0008]

In order to achieve the above object, the present invention provides a method for driving the panel to the electrode terminal of a panel having a plurality of electrode terminals arranged along a peripheral edge on one side. Connect the driving IC and drive IC
In a mounting structure of a panel for connecting circuit wiring for transmitting a signal given from the outside, a peripheral portion of the panel, a lower layer than the electrode terminals, extends along the peripheral portion, and sandwiches an insulating layer. Along with providing the circuit wiring electrically insulated from each of the electrode terminals, it is electrically connected to the circuit wiring,
A relay terminal which penetrates the insulating layer at a predetermined position and forms the same layer as the electrode terminal is provided, and a chip substrate on which the driving IC is mounted is provided. On one surface of the chip substrate, the relay of the panel peripheral portion is provided. Terminals and electrode terminals are provided with input terminals and output terminals connected to the driving ICs at positions corresponding to the driving ICs.The chip substrate is superimposed on the peripheral portion of the panel, and relay terminals, electrode terminals and the chip on the peripheral portion of the panel are provided. The input terminal and the output terminal of the substrate are connected to each other via an anisotropic conductive material.

It is desirable that a plurality of the driving ICs be mounted on one chip substrate.

Preferably, the input terminals and the output terminals of the chip substrate are arranged on one side of the one surface.

It is preferable that the peripheral portion of the panel and the chip substrate have the same coefficient of thermal expansion.

Further, it is desirable that a portion where the peripheral portion of the panel overlaps with the chip substrate and a driving IC mounted on the chip substrate are covered with a predetermined protective resin.

[0013]

In operation, a signal externally applied to the circuit wiring on the periphery of the panel is input from the relay terminal to the driving IC via the input terminal of the chip substrate. The signal output from the driving IC is supplied to the inside of the panel via the output terminal of the chip substrate and the electrode terminal on the periphery of the panel. Thus, the panel is driven.

In this mounting structure, the flexible wiring board and the circuit board (see FIG. 6) which were conventionally arranged on the side of the panel are omitted, and a new chip board is provided. Since this chip substrate is superimposed on the periphery of the panel, the size of the module is smaller than in the past. Further, since the driving IC is not mounted on the peripheral portion of the panel but mounted on the chip substrate, the width itself of the peripheral portion of the panel is narrowed, and the size of the module is further reduced. In addition, the number of components is increased in the number of chip substrates, but two large components of a flexible wiring board and a circuit board are omitted. Therefore, the number of parts is reduced as compared with the related art, and the weight of the module is reduced.

Further, since the number of parts is reduced as described above, material costs are reduced. Moreover, the relay terminal of the panel,
The electrode terminal and the input terminal and the output terminal of the chip substrate are collectively connected via an anisotropic conductive material. Therefore, only one connection process is required, and the number of steps is reduced as compared with the related art. Therefore, the cost is reduced.

Inspection pads required at the time of the operation test are provided, for example, at the end of the circuit wiring extending to the peripheral portion of the panel (the corner portion of the panel). If you do this,
The prober can be easily contacted, and the operation test can be performed easily and in a short time.

Further, in the present invention, the corresponding terminals are connected via the anisotropic conductive material in a state where the panel and the chip substrate are overlapped. Therefore, when the operation test reveals that the panel or the driving IC is defective, the panel and the chip substrate are easily removed without damaging both. Further, after being removed, the good parts can be reused as they are. Therefore, rework is easily performed as compared with the related art.

Further, when a plurality of the driving ICs are mounted on one chip substrate, the number of components is further reduced, and the number of steps of the connection process between the panel and the chip substrate is reduced. Therefore, the cost is further reduced.

Further, when the input terminals and the output terminals of the chip substrate are arranged on one side of the one surface, the prober can be easily contacted. Therefore, the operation test of the chip substrate itself becomes easy.

In the case where the thermal expansion coefficient of the peripheral portion of the panel is the same as the coefficient of thermal expansion of the chip substrate, even if the environmental temperature changes, the positions of the relay terminals and electrode terminals of the panel and the input terminals and output terminals of the chip substrate are changed. Does not shift. Therefore, the pitch of the electrode terminals can be reduced.

In the case where the peripheral portion of the panel and the chip substrate overlap with each other and the driving IC mounted on the chip substrate is covered with a predetermined protective resin, the terminals are separated by the resin. Connection point and drive I
The entry of moisture, gas, etc. into C is prevented.
Therefore, reliability is improved.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting structure of a panel according to the present invention will be described in detail below with reference to embodiments.

FIG. 1 shows a schematic cross section of a liquid crystal module according to one embodiment. The liquid crystal panel 20 is configured by sealing a liquid crystal 21 between a pair of glass substrates 1 and 2. A chip substrate 4 having the same coefficient of thermal expansion as the glass substrate 2 is overlaid on the periphery of one glass substrate 2. A driving IC for driving the liquid crystal panel 20 is provided on the chip substrate 4.
5 is mounted.

FIG. 3 is a top view of the periphery of the liquid crystal panel 20 in FIG. 1, and FIG.
It shows a cross section taken along the line arrow. As shown in FIG. 3, the periphery of the liquid crystal panel 20 (glass substrate 2) has pixels inside the panel.
A plurality of electrode terminals 3 connected to (not shown) are provided. As shown in FIG. 4, in a layer lower than the electrode terminals 3,
A bus line 73 is provided as circuit wiring. The bus line 73 extends along the periphery of the panel, and
Are electrically insulated from each of the electrode terminals 3 (the base coat 11 having an insulating property is provided between the bus line 73 and the glass substrate 2). Bus line 7
3, a through hole 74 is formed at a predetermined position, and a relay terminal 4 that is electrically connected to the bus line 73 through the through hole 74.
5 are provided. The relay terminal 45 has the same layer as the electrode terminal 3. On the other hand, as shown in FIG. 3, the chip substrate 4 has a rectangular shape, and is provided with strip-shaped input terminals 44 and output terminals 42 along one side of one side of one side. The input terminal 44 and the output terminal 42 are connected to the driving IC 5 by wires 43 and 41. The driving IC is mounted on the side opposite to the input terminal 44 and the output terminal 42 with a conductive paste or the like. The wiring 43
Is connected to a capacitor 55 for signal adjustment.
Next to the chip substrate 4, a chip substrate 4 'having exactly the same configuration
Is provided.

As shown in FIG. 4, the relay terminal 45 and the electrode terminal 42 on the peripheral edge of the panel and the input terminal 44 and the output terminal 42 on the chip substrate are collectively connected via an anisotropic conductive material 95 respectively. It is connected by crimping.

In operation, a driving signal is externally applied to the bus line 73 at the periphery of the panel shown in FIG. This signal is transmitted from the relay terminal 45 to the input terminal 4 of the chip substrate 4.
4. The signal is input to the driving IC 5 via the wiring 43. The signal output by the driving IC 5 is supplied to the inside of the liquid crystal panel 20 via the wiring 41, the output terminal 42, and the electrode terminal 3 on the periphery of the panel. Thereby, the liquid crystal panel 20 is driven.

In this liquid crystal module, a circuit board (see FIG. 6) which is conventionally disposed on the side of the glass substrate 2 is omitted, and a new chip substrate 4 is provided. Since the chip substrate 4 overlaps the peripheral portion of the panel,
Module size can be reduced. Also,
No driving IC 5 is mounted on the periphery of the panel, and the chip substrate 4
, The width of the peripheral portion of the panel itself can be reduced, and the size of the module can be further reduced. Also, as the number of components, the number of chip substrates 4 increases,
The flexible wiring board 181 and the circuit board 18 shown in FIG.
2 large parts can be omitted. Therefore, the number of parts can be reduced and the weight of the module can be reduced as compared with the related art.

Further, since the number of parts is reduced as described above, material costs can be reduced. In addition, the terminals 45, 3 on the peripheral portion of the panel and the terminals 44, 42 on the chip substrate can be connected together via the anisotropic conductive material 95. Therefore, only one connection process is required, and the number of steps can be reduced as compared with the related art. Therefore, costs can be reduced.

The test pads necessary for the operation test are, for example, at the end of the bus line 73 extending to the peripheral portion of the panel.
(At the corner of the panel). In this case, the contact of the prober becomes easy, and the operation test can be easily performed in a short time. Inspection of the chip substrate 4, that is, inspection of the driving IC 5, can be similarly easily performed since the input terminal 44 and the output terminal 42 are provided on one side of the chip substrate 4.

In this liquid crystal module, the corresponding terminals 45, 44; 3, 42 are connected via an anisotropic conductive material 95 in a state where the liquid crystal panel 20 and the chip substrate 4 are overlapped. Therefore, when the liquid crystal panel 20 and the driving IC 5 are found to be defective by the operation test, the liquid crystal panel 20 and the chip substrate 4 can be easily removed without damaging both. After the removal, the good parts can be reused as they are. Therefore, rework can be performed more easily than in the past. Thereby, a cost merit also arises.

Further, since the coefficient of thermal expansion of the chip substrate 4 is the same as that of the glass substrate 2, even if the environmental temperature changes, the terminals 45, 3 on the peripheral portion of the panel and the terminals 4
There is no deviation from the position with the reference numeral 42. Therefore, the pitch of the electrode terminals 3 can be reduced. In this case, by increasing the number of output terminals of the driving IC 5,
The image on the liquid crystal panel 20 can be made high definition.

Further, as shown in FIG.
Where the peripheral portion of the substrate and the chip substrate 4 overlap and the driving IC 5 is made of an epoxy-based, ultraviolet-curing type protective resin 9.
2 may be covered. This resin 92 allows terminals 4 to be connected to each other.
5, 44; 3, 42 can be prevented from invading moisture, gas and the like into the connection portion and the driving IC 5. Therefore, reliability can be improved.

Further, as shown in FIG.
Two (or more) driving ICs 5 may be mounted on each of the 4, 14 ', and 14 "boards (in the figure, reference numeral 8 denotes a connector for supplying a driving signal to the bus line 73). In this case, the number of components can be further reduced, and the number of steps of the connection process between the liquid crystal panel 20 and the chip substrates 14 can be reduced, so that the cost can be further reduced. , ..., drive IC5
A bus line connecting them may be provided. The structure of this bus line is the same as the structure of the bus line 73 provided on the peripheral portion of the panel.

[0034]

As is clear from the above, the mounting structure of the panel according to the present invention omits the flexible wiring board and the circuit board which are conventionally arranged on the side of the panel, and newly provides a chip board. Since the chip substrate is overlapped on the peripheral portion of the panel, the size of the module can be reduced as compared with the related art. Further, since the driving IC is not mounted on the peripheral portion of the panel but mounted on the chip substrate, the width of the peripheral portion of the panel itself can be reduced, and the size of the module can be further reduced.
Also, the number of parts can be reduced as a whole, and the weight of the module can be reduced.

Further, since the number of parts can be reduced in this way, material costs can be reduced. Moreover, the relay terminal of the panel,
Since the electrode terminals and the input terminals and the output terminals of the chip substrate are collectively connected via the anisotropic conductive material, only one connection process is required, and the number of steps can be reduced as compared with the related art. Therefore,
Costs can be reduced.

In addition, the test pads required for the operation test can be provided, for example, at the end of the circuit wiring extending to the periphery of the panel (the corner of the panel). Therefore,
The prober can be easily contacted, and the operation test can be easily performed in a short time.

Also, since the corresponding terminals are connected via an anisotropic conductive material in a state where the panel and the chip substrate are overlapped, when the operation test reveals that the panel or the driving IC is defective. , Without damaging both
The panel and the chip substrate can be easily removed.
Further, after removal, the good parts can be reused as they are. Therefore, rework can be performed more easily than in the past.

Further, when a plurality of the driving ICs are mounted on one chip substrate, the number of components can be further reduced, and the number of steps in the connection process between the panel and the chip substrate can be reduced. Therefore, the cost can be further reduced.

When the input terminals and the output terminals of the chip substrate are arranged on one side of the one surface, the prober can be easily contacted. Therefore, an operation test of the chip substrate itself can be easily performed.

When the thermal expansion coefficient of the peripheral portion of the panel and that of the chip substrate are the same, the positions of the relay terminals and electrode terminals of the panel and the input terminals and output terminals of the chip substrate are changed even if the environmental temperature changes. Does not shift. Therefore, the pitch of the electrode terminals can be reduced.

When a portion where the peripheral portion of the panel and the chip substrate overlap with each other and a driving IC mounted on the chip substrate are covered with a predetermined protective resin, the resin connects the terminals. It is possible to prevent moisture, gas, and the like from entering the location and the driving IC.
Therefore, reliability can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic cross section of a liquid crystal module according to an embodiment of the present invention.

FIG. 2 is a view showing a modification of the liquid crystal module.

FIG. 3 is a diagram showing a main part of the liquid crystal module shown in FIG. 1 as viewed from above.

FIG. 4 is a diagram showing a cross section taken along line BB ′ in FIG. 3;

FIG. 5 is a view showing a liquid crystal module according to another embodiment of the present invention when viewed obliquely.

FIG. 6 is a diagram showing a schematic cross section of a conventional liquid crystal module.

[Explanation of symbols]

 1, 2 glass substrate 3 electrode terminal 4 chip substrate 5 driving IC 42 output terminal 44 input terminal 45 relay terminal 73 bus line

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G02F 1/1345 G02F 1/13 101 G09F 9/00-9/46 H05K 1/14 H05K 3/36

Claims (5)

(57) [Claims] 1. A driving IC for driving the panel is connected to the electrode terminal of the panel having a plurality of electrode terminals disposed along a peripheral portion on one side, and the driving IC is connected to the driving terminal.
In a panel mounting structure for connecting circuit wiring for transmitting a signal given from the outside, the panel extends along the peripheral edge, below the electrode terminals, along the peripheral edge, with an insulating layer interposed therebetween. Providing a circuit wiring electrically insulated from each of the electrode terminals, providing a relay terminal that is electrically connected to the circuit wiring, penetrates the insulating layer at a predetermined location, and forms the same layer as the electrode terminal; An input terminal and an output terminal connected to the driving IC are provided on one side of the chip substrate at positions corresponding to the relay terminals and the electrode terminals on one side of the panel. The chip substrate is superimposed on the peripheral portion of the panel, and the relay terminals and electrode terminals on the peripheral portion of the panel are connected to the input terminals and output terminals of the chip substrate via anisotropic conductive materials. Implementation structure Le. 2. The panel mounting structure according to claim 1, wherein a plurality of the driving ICs are mounted on one chip substrate. 3. The panel mounting structure according to claim 1, wherein the input terminal and the output terminal of the chip substrate are arranged on one side of the one surface. 4. The panel mounting structure according to claim 1, wherein the peripheral portion of the panel and the chip substrate have the same coefficient of thermal expansion. 5. The device according to claim 1, wherein a portion where the peripheral portion of the panel overlaps the chip substrate and a driving IC mounted on the chip substrate are covered with a predetermined protective resin. 5. The mounting structure of the panel according to any one of items 4 to 4.