JP2891141B2 - Air cooling device for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component air cooling device for cooling an electronic component by a heat sink.

[0002]

2. Description of the Related Art Conventionally, as a heat sink for cooling electronic components, there is a heat sink configured as shown in FIGS. FIG. 2 is a perspective view showing a conventional heat sink provided with heat radiation fins, and FIG. 3 is a perspective view showing a conventional heat sink provided with heat radiation pins.

In these figures, reference numeral 1 denotes a heat sink. In the heat sink 1 shown in FIG. 2, a plurality of thin plate-shaped heat radiation fins 3 are arranged on a base 2 at intervals in the thickness direction. The base 2 has a structure in which a side surface opposite to the heat radiation fins 3 is formed flat, and this flat surface is closely attached to an electronic component that easily generates heat, for example, a semiconductor device.

The heat sink 1 shown in FIG. 3 has a large number of cylindrical heat radiating pins 5 erected on one side surface of a plate-shaped base 4.
The heat sink 1 is also provided with a heat radiation pin 5 on the base 4.
The opposite side surface is formed flat, and this flat surface is in close contact with an electronic component that easily generates heat.

[0005] By attaching the heat sink 1 configured as described above to an electronic component, the substantial surface area of the electronic component can be increased by the radiating fins 3 and the radiating pins 5, so that the heat radiation can be improved. That is, by attaching the heat sink 1 to the electronic component, the heat of the electronic component is transmitted to the bases 2 and 4, and the radiating fins 3 and the radiating pins 5 are transmitted therefrom.
And is dissipated in the air. At this time, the surrounding air whose temperature has risen due to the transfer of heat from the radiating fins 3 and the radiating pins 5 rises due to convection, and the relatively low-temperature air newly touches the radiating fins 3 and the radiating pins 5. By repeating, cooling is continuously performed.

In the so-called natural air cooling utilizing the convection of the air around the heat sink 1 as described above, when the heat sink 1 is arranged in the apparatus housing, the air does not easily flow, so that the cooling efficiency is reduced. Conventionally, in such a case, a forced air cooling is performed by attaching a blowing fan to the apparatus housing.

When the forced air cooling is performed, an air flow is generated in the device housing by the blower fan, and the air heated by the heat sink 1 is discharged out of the device housing.
It becomes possible to force relatively low-temperature air to flow to the heat sink 1 in the strong device.

[0008]

However, in the heat sink 1 as described above, it is an object to improve the heat transfer characteristic when heat is dissipated from the heat radiating portions such as the heat radiating fins 3 and the heat radiating pins 5 to the surrounding air. Met.

That is, when the heat sink 1 is used with natural air cooling, cooling is performed by convection of the air around the heat radiating portion, but the flow velocity at the time of convection of the air is extremely low. When the heat sink 1 is used with forced air cooling, the heat radiating section may be exposed to relatively low-temperature air. However, since there are many other electronic components in the device housing, these electronic components are not used. The air flow path is complicatedly changed by the parts, and the heat sink 1
May not be positioned on the air flow path.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and is intended to obtain a high heat transfer characteristic by natural air cooling or forced air cooling when cooling an electronic component using a heat sink. The purpose is to do.

[0011]

According to the present invention, there is provided an air cooling apparatus for electronic parts , wherein a plate-like fin is provided on a heat sink in a thickness direction.
By arranging a plurality of them at intervals,
Forming an air circulation space open to three sides between cows,
The fin extends through the fin row and has one end
The drive shaft connected to the motor on the side of the heat sink can rotate freely
Between the fins of this drive shaft.
A centrifugal fan is mounted on the shaft.
The air flow space positioned closer to the edge than the center of the main surface of
It is a structure that rotates inside the.

According to the present invention, the air in the air circulation space is blown off in three directions by the rotation of the fan. Among the air blown off when the fan rotates, the air blown in the direction in which the fan is biased with respect to the center of the main surface of the fin has a small resistance when flowing because the distance of contact with the fin surface is relatively short. Therefore, the air is easily blown off toward the edge of the fin, and hardly blown on the opposite side, that is, toward the center of the fin.
That is, the rotation of the fan causes a bias in the pressure distribution of the air in the air circulation space, and the air in the air circulation space flows from the high pressure side to the low pressure side, so that the air stays on the base side of the fin. Nothing. Therefore, the air in the air circulation space can be efficiently blown off in three directions.
it can.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an air cooling device for electronic parts according to the present invention will be described in detail with reference to FIG. 1A and 1B are views showing an air cooling device for electronic components according to the present invention. FIG. 1A is a plan view, FIG. 1B is a front view, and FIG. 1C is a line II in FIG. It is sectional drawing.

In these figures, reference numeral 11 denotes an air cooling device for electronic parts according to this embodiment.
It is configured by attaching a plurality of motor driven fans 13 to the heat sink 12. The heat sink 12
Is formed of a metal material having a high thermal conductivity such as an aluminum material, for example.
The plate-shaped heat radiation fins 16 are integrally provided upright. The electronic component 14 is, for example, a semiconductor device that easily generates heat, and is mounted on the substrate 17. In this embodiment, the board 17 is set upright, and the base 15 of the heat sink 12 is mounted on the vertical surface of the electronic component 14.

The radiating fins 16 of the heat sink 12
Are formed in a rectangular shape as viewed from the side as shown in FIG. 1 (c), and a plurality of are arranged at equal intervals in the thickness direction so that an air circulation space is formed in the heat sink 12. In this embodiment, as described above, the electronic component 14
Since the base 15 is mounted on the vertical surface of the radiating fin 16, the radiation fin 16 has
5 extends horizontally. As a result, the air circulation space between the radiation fins 16 is
2, open up and down and in front.

As shown in FIG. 1 (c), the fan 13 is a centrifugal fan in which six blades 13a each having a substantially elliptical cross section are radially arranged. The driven shaft 18 is mounted so as to rotate integrally therewith. The drive shaft 18 is provided with each heat radiation fin 16.
All the radiating fins 16 are penetrated so as to be supported in the horizontal direction, and a motor 19 is connected to one end. The motor 19 is fixed to the outer surface of the radiation fin 16 positioned at the outermost position.

A portion of the drive shaft 18 exposed to the air flow space between the radiation fins 16 includes:
Each of the fans 13 is attached. For this reason, the fans 13 are arranged in all of the air circulation spaces formed in the heat sink 12, and are further connected to the motor 19 via the drive shaft 18.

The position of the fan 13 is set so as to be deviated from the center of the main surface of the radiating fin 16 toward the edge. The center of the main surface of the radiating fin 16 is a point at which the diagonal line of the radiating fin 16 shown by a dashed line in FIG. 1C intersects, and the edge of the radiating fin 16 is the upper end, the lower end, or the base 15. Denotes a protruding end on the opposite side. In this embodiment, the fan 13 is biased toward the lower end side and the projecting end side of the radiation fin 16 from the center. Also,
The fan 13 is entirely housed inside the air circulation space,
It is designed to rotate inside the air circulation.

Air cooling device 1 for electronic components thus configured
1 is used by driving a motor 19 while the heat sink 12 is in close contact with the electronic component 14. Heat sink 12
Is attached to the electronic component 14, the heat of the electronic component 14 is transmitted to the base 15 of the heat sink 12, is conducted to the radiation fin 16 from there, and is radiated into the air around the radiation fin 16.

When the motor 19 is driven, all the fans 13 rotate together with the drive shaft 18 and the radiation fins 1
The air in the air circulation space between the six is blown outward by the fan 13. The rotation direction of the fan 13 is set clockwise in FIG.

Therefore, by blowing off the air in the air circulation space in this way, an air flow can be forcibly generated in the air circulation space, and a large amount of air can enter and exit at a high speed. In other words, the air heated by the radiating fins 16 is blown off faster than it rises by convection, and relatively low-temperature air comes into contact with the radiating fins 16 faster.

Further, since the fan 13 is located on the edge side from the center of the main surface of the radiating fin 16, the direction in which the fan 13 is biased with respect to the center of the main surface of the radiating fin 16 out of the air blown off when the fan rotates. The air blown to the air {shown by a white arrow in FIG. 1C} has a relatively small resistance when flowing because the distance of contact with the surface of the radiation fin 16 is relatively short. Therefore, the air is easily blown off toward the edge of the radiating fin 16, and is hardly blown off on the opposite side, that is, toward the center of the radiating fin 16.
Therefore, the pressure distribution of the air in the fan 13 is biased, so that air flows from the high pressure side to the low pressure side and the fan 13
Air can be circulated inside. As a result, the air does not stay on the base side of the radiation fins 16,
Efficiently blow air in the air circulation space in three directions
Can be.

[0023]

As described above, the air-cooling apparatus for electronic components according to the present invention has a plate-like fin formed on a heat sink in a thickness direction.
By arranging a plurality of them at intervals in the
Creates an air circulation space that is open in three directions between each other
The fins extend through the row of fins and
One end rotates the drive shaft connected to the motor on the side of the heat sink.
Each fin on this drive shaft is supported rotatably.
A centrifugal fan is mounted on the shaft, and this fan is
The air flow is positioned closer to the edge than the center of the main surface of the fin.
The fan rotates because the structure rotates inside the passage space.
Air in the air circulation space
Be skipped.

For this reason, a large amount of air can be made to flow in and out at high speed by forcibly generating an air flow between the fins, so that high heat transfer characteristics can be obtained. As a result, in any of natural air cooling and forced air cooling, the electronic component to which the air cooling device according to the present invention is attached can be sufficiently cooled by efficiently dissipating the heat.

Also, the rotation of the fan causes
The pressure distribution of air in the air circulation space is biased,
Because the air in the circulation space flows from the high pressure side to the low pressure side,
The air does not stay on the base side of the fin 16.

Since the fan rotates inside the fin formation area, the wiring does not come into contact with the fan even if the wiring passes near the heat sink.

[Brief description of the drawings]

FIG. 1 is a view showing an air cooling device for electronic components according to the present invention.

FIG. 2 is a perspective view showing a conventional heat sink provided with a radiation fin.

FIG. 3 is a perspective view showing a conventional heat sink provided with heat radiation pins.

[Explanation of symbols]

11 ... air cooling device for electronic parts, 12 ... heat sink, 13
... Fan, 14 ... Electronic components, 16 ... Heat fins, 18 ...
Drive shaft, 19 ... motor.

Claims (1)

(57) [Claims] 1. An electronic component air cooling apparatus for cooling an electronic component by a heat sink closely attached to the electronic component, wherein a plate-like fin is provided on the heat sink at an interval in a thickness direction.
By arranging a plurality of fins, three
Forming an air circulation space open to the fin,
Extends through the fin row and one end is a heat sink
The drive shaft connected to the side motor is rotatably supported,
Centrifugal fan between each fin on this drive shaft
The fan is mounted on the center of the main surface of the fin.
Rotate inside the air flow space with positioning closer to the edge
An air-cooling device for electronic parts, characterized in that it has a structure to perform.