JP2718793B2 - Copper or copper alloy with bright tin plating - Google Patents
Copper or copper alloy with bright tin platingInfo
- Publication number
- JP2718793B2 JP2718793B2 JP1337038A JP33703889A JP2718793B2 JP 2718793 B2 JP2718793 B2 JP 2718793B2 JP 1337038 A JP1337038 A JP 1337038A JP 33703889 A JP33703889 A JP 33703889A JP 2718793 B2 JP2718793 B2 JP 2718793B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- tin plating
- whiskers
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 66
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 21
- 239000010949 copper Substances 0.000 title claims description 21
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 description 14
- 238000005406 washing Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000005554 pickling Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は光沢錫めっきを有する銅又は銅合金に係り、
さらに詳しくは、ウィスカの発生が少ない光沢錫めっき
を有する銅又は銅合金に関する。The present invention relates to copper or copper alloy having bright tin plating,
More specifically, the present invention relates to copper or a copper alloy having bright tin plating with less occurrence of whiskers.
［従来技術］ 一般に、端子、コネクター等の電子部品には錫めっき
が施され、美観性、耐食性、はんだ付性に優れた光沢め
っきが多く採用されている（ここに、光沢めっきとは、
JIS Z 8741に規定する45゜−45゜の鏡面反射率が40％以
上のものを指す）。しかし、錫めっきには、ウィスカと
呼ばれる錫単結晶からなる針状結晶が発生することが知
られている。ウィスカは通常太さ１〜５μｍ、長さ最大
数mmに達し、光沢剤を添加した光沢錫めっきに特に発生
しやすい。ウィスカが発生すると回路中や端子間で短絡
したり、絶縁不良の発生、あるいは、ノイズが発生する
原因にもなっていた。[Prior art] In general, tin plating is applied to electronic components such as terminals and connectors, and gloss plating excellent in aesthetics, corrosion resistance, and solderability is often used (here, gloss plating is
45%-45% specular reflectance specified in JIS Z 8741 is 40% or more). However, it is known that tin-plated needle-shaped crystals called tin whiskers are generated in tin plating. Whiskers usually reach a thickness of 1 to 5 μm and a maximum length of several mm, and are particularly likely to occur in bright tin plating to which a brightener has been added. When a whisker is generated, a short circuit occurs in a circuit or between terminals, insulation failure occurs, or noise occurs.
最近の電子部品は小型化、高密度化、微弱電流化の傾
向にあり、特に、ウィスカの発生によって短絡障害が起
こり易くなっている。Recent electronic components tend to be smaller, have higher densities, and have weaker currents. In particular, short-circuit faults are more likely to occur due to the generation of whiskers.
ウィスカの発生の原因として、 （１）ウィスカの発生しやすい亜鉛、カドミニウムめっ
きと同様に錫が低融点金属であり、比較的低温（20〜10
0℃）で原子が移動して再結晶し易いこと、 （２）光沢剤を添加した光沢錫めっきは光沢剤が共存し
て内部応力が大きくなり、ウィスカが発生しやすくなる
こと、 （３）めっき時に発生する水素ガスがめっき中に吸臓
し、それによって生じた応力が緩和されるためにウィス
カが発生すること、 等が考えられる。その他にも考えられる要因が数多くあ
るが、はっきりした解明はまだされていないのが、実状
である。The causes of whisker generation are as follows: (1) Tin is a low melting point metal, similar to zinc and cadmium plating, where whiskers are likely to be generated, and relatively low temperature (20 to 10)
(2 ° C.) that atoms move easily at 0 ° C.) and recrystallization occurs. (2) Bright tin plating with a brightening agent coexists with a brightening agent to increase internal stress and easily generate whiskers. (3) It is conceivable that hydrogen gas generated at the time of plating sucks during plating, and the stress generated by the gas is alleviated to generate whiskers. There are many other possible factors, but the fact is that it has not been clarified yet.
ウィスカの発生を防止する方法は従来より幾つか提案
されている。例えば、 （１）錫めっき後、150〜180℃の温度において１〜３時
間加熱処理する方法、 （２）錫めっき後、真空中で電子線を照射する方法（特
公昭55−031196号公報）、 （３）錫めっき後、陽極酸化被膜を形成する方法（特公
昭52−053735号公報）、 （４）錫と鉛やニッケル等が共析する合金めっき方法、 （５）超音波エネルギーを与えてめっき時の水素吸臓を
軽減する方法、 等があるが、いずれも、連続的に処理するには問題があ
る。Several methods for preventing the generation of whiskers have been conventionally proposed. For example, (1) a method of heating for 1 to 3 hours at a temperature of 150 to 180 ° C. after tin plating, and (2) a method of irradiating an electron beam in a vacuum after tin plating (Japanese Patent Publication No. 55-031196). (3) a method of forming an anodized film after tin plating (Japanese Patent Publication No. 52-053735), (4) an alloy plating method in which tin and lead, nickel, etc. are eutectoid, (5) applying ultrasonic energy There is a method of reducing the amount of hydrogen absorbed during plating, but there is a problem in continuous treatment.
即ち、（１）の方法は加熱に長時間を要する。また、
加熱するため、光沢めっきは火ぶくれ、変色等の欠陥が
発生する。（２）の方法は真空中に保持しなければなら
ないため、連続処理は困難である。（３）の方法は連続
処理には適すが、めっき後、加工することは酸化被膜が
破壊される恐れがある。（４）の方法はめっき浴品質管
理が困難であると共に耐食性、はんだ付等に疑問があ
る。（５）の方法はウィスカめっき時の水素吸臓によっ
て、大きく支配されるならば効果は大きいが、ウィスカ
の発生は添加剤、めっき浴、めっき条件等多くの要因が
関与していると考えられるため、万全ではない。That is, the method (1) requires a long time for heating. Also,
Due to heating, bright plating causes defects such as blistering and discoloration. Since the method (2) must be kept in a vacuum, continuous processing is difficult. The method (3) is suitable for continuous processing, but working after plating may destroy the oxide film. In the method (4), it is difficult to control the quality of the plating bath, and there are questions about corrosion resistance, soldering, and the like. The method (5) has a large effect if it is largely controlled by hydrogen absorption during whisker plating, but it is considered that the generation of whiskers is related to many factors such as additives, plating baths and plating conditions. Therefore, it is not perfect.
［発明が解決しようとする課題］ 本発明は上記に説明した従来の銅および銅合金におけ
る錫めっきの種々の問題点に鑑みなされたものであり、
本発明は、銅および銅合金の錫めっきにおけるウィスカ
の発生のない光沢錫めっきを有する銅又は銅合金を提供
することを目的とする。[Problems to be Solved by the Invention] The present invention has been made in view of the various problems of tin plating in conventional copper and copper alloys described above,
An object of the present invention is to provide copper or a copper alloy having bright tin plating that does not generate whiskers in tin plating of copper and a copper alloy.
［課題を解決するための手段］ 本発明に係わる光沢錫めっきを有する銅および銅合金
は、炭素を0.10〜0.50wt％（0.1wt％を除く）含有する
一層の光沢錫めっきが直接又は銅下地めっきを介して形
成されていることを特徴とする。[Means for Solving the Problems] In the copper and copper alloy having bright tin plating according to the present invention, one layer of bright tin plating containing 0.10 to 0.50 wt% (excluding 0.1 wt%) of carbon is directly or copper-coated. It is characterized by being formed via plating.
［作用］ 本発明者は、ウィスカの抑制方法を種々検討した結
果、めっき被膜に含有する炭素がウィスカの発生と何ら
かの関連があることを見い出した。そこで、詳細な実験
を重ねたところ、めっき被膜中の炭素量が一定の範囲内
となった場合にウィスカの発生が抑制されることを解明
し、本発明をなすにいたった。[Action] As a result of various studies of whisker suppression methods, the present inventors have found that the carbon contained in the plating film has some relationship with the generation of whiskers. Therefore, as a result of repeated detailed experiments, it was clarified that the generation of whiskers was suppressed when the amount of carbon in the plating film was within a certain range, and the present invention was accomplished.
本発明は錫めっき被膜に含有する炭素量を0.10〜0.50
％とすることに最大の特徴を有する。The present invention reduces the amount of carbon contained in the tin plating film to 0.10 to 0.50.
%.
炭素を0.10〜0.50wt％（0.10％を除く）としたのは、
めっき被膜中の炭素量が0.10％未満ではウィスカの抑制
効果はあるが、めっきの光沢が低く光沢錫めっき（JIS
Z 8741に規定する45゜−45゜の鏡面反射率40％以上のも
の）とはいえないためである。また、0.50％以下とした
のは、0.50％を越えるとウィスカの発生が顕著になるか
らである。The reason for making carbon 0.10-0.50wt% (excluding 0.10%)
If the carbon content in the plating film is less than 0.10%, the effect of suppressing whisker is effective, but the gloss of plating is low and bright tin plating (JIS
This is because the specular reflectance of 45 ° -45 ° specified in Z 8741 is 40% or more. Also, the reason why the content is set to 0.50% or less is that when the content exceeds 0.50%, whisker generation becomes remarkable.
なお、めっき被膜に含有される炭素量はめっき浴中の
光沢剤の種類および量によって、大きく変動するので、
めっき浴組成（光沢剤の含有量）、電解条件（特に電流
密度）等を適宜コントロールすることによってめっき被
膜に含有される炭素量のコントロールを行えばよい。Since the amount of carbon contained in the plating film varies greatly depending on the type and amount of brightener in the plating bath,
The amount of carbon contained in the plating film may be controlled by appropriately controlling the plating bath composition (brightener content), electrolysis conditions (particularly, current density), and the like.
なお、本発明の効果のメカニズムは現在、確認中であ
り、現時点では解明されてはいないが、炭素量によっ
て、めっき結晶粒径の変動、めっきの内部応力も変動す
ることから、これらの点がウィスカの発生抑制に関連し
ているのではないかと推測される。The mechanism of the effect of the present invention is currently being confirmed and has not been elucidated at the present time.However, since the variation in the crystal grain size and the internal stress of the plating also vary depending on the amount of carbon, these points are considered. It is speculated that this may be related to the suppression of whisker generation.
本発明に係わる光沢錫めっき形成は次の一般的な工程
で行えばよい。The formation of the bright tin plating according to the present invention may be performed in the following general steps.
銅合金→脱脂→水洗→酸洗→水洗→銅下地めっき→水
洗→酸洗→水洗→錫めっき→水洗→中和→水洗→乾燥で
ある。Copper alloy → degreasing → water washing → pickling → water washing → copper base plating → water washing → pickling → water washing → tin plating → water washing → neutralization → water washing → drying.
なお、本発明では、光沢錫めっきは銅又は銅合金に直
接又は銅下地めっきを介して形成すればよい。In the present invention, the bright tin plating may be formed on copper or a copper alloy directly or via a copper base plating.
ただ、銅合金が、１〜45wt％の亜鉛含有銅合金の場合
には、銅下地めっきを介して光沢錫めっきを形成した方
が、耐食性、はんだ付性を長期間維持し、かつ、経時変
色を抑制するために好ましい。一方、銅合金が亜鉛を含
有しない銅合金の場合には、銅下地めっきを行っても行
わなくてもどちらでもよいが、耐ウィスカ性をより安定
化させるためには、銅下地めっきを行わず直接光沢錫め
っきを形成する方が望ましい。However, when the copper alloy is a 1-45 wt% zinc-containing copper alloy, it is better to form bright tin plating through copper base plating to maintain corrosion resistance and solderability for a long period of time and to discolor over time. It is preferable to suppress On the other hand, when the copper alloy is a copper alloy containing no zinc, either copper plating may or may not be performed, but in order to further stabilize whisker resistance, copper plating is not performed. It is preferable to form bright tin plating directly.
なお、光沢錫めっき浴は、例えば硫酸錫浴、ホウフッ
化錫浴、フェノールスルフォン酸浴等を用いればよい
が、特にこれらに限定する必要はない。The bright tin plating bath may be, for example, a tin sulfate bath, a tin borofluoride bath, a phenolsulfonic acid bath, or the like, but is not particularly limited thereto.
［実施例］ 本発明に係わる銅および銅合金の光沢錫めっきの実施
例について説明する。Example An example of bright tin plating of copper and a copper alloy according to the present invention will be described.
（試験片の製作） 試験片として次の２つを用意した。(Production of test pieces) The following two test pieces were prepared.
りん脱酸銅（JIS C 1220）1/2H 0.3t×50w×100l（mm） 黄銅（JIS C 2600）Ｈ 0.3t×50w×100l（mm） （めっき工程） この試験辺を次の手順でめっきを行った。Phosphorus deoxidized copper (JIS C 1220) 1 / 2H 0.3 t × 50 w × 100 l (mm) Brass (JIS C 2600) H 0.3 t × 50 w × 100 l (mm) (Plating process) The plating was performed according to the following procedure.
脱脂（アルカリ電解脱脂）→水洗→酸洗（５％H2S
O4、RT×5sec）→水洗→銅下地めっき（＊１）→水洗→
酸洗（５％H2SO4、RT×5sec）→水洗→錫めっき（＊
２）→水洗→中和（りん酸３ソーダ５％、70℃×5sec）
→水洗→乾燥 （＊１）銅下地めっき 浴組成 CuSO4・5H2O 190g/l H2SO4 50g/l Cl 30mg/l 光沢剤（市販剤を使用） 10mg/l めっき条件 温度 20℃ 電流密度 2.5A/dm2 めっき厚み 0.7μｍ （＊２）錫めっき 浴組成 SnSO4 40g/l H2SO4 100g/l クレゾールスルホン酸 30g/l ホルマリン 5ml/l 光沢剤 （分散剤） 20g/l （光沢剤）次のA,B,Cと変量 Ａの場合 5ml/l Ｂの場合 10ml/l Ｃの場合 15ml/l めっき条件 温度 20℃ 電流密度 第１表による （ウィスカ試験） 以上のようにして作製しためっき試験片に対し以下の
ウィスカ試験を行った。Degreasing (alkaline electrolytic degreasing) → water washing → pickling (5% H 2 S)
O 4 , RT × 5sec) → Washing → Copper base plating (* 1) → Washing →
Pickling (5% H 2 SO 4 , RT × 5sec) → water washing → tin plating (*
2) → Washing → Neutralization (phosphoric acid 3 soda 5%, 70 ℃ × 5sec)
→ Washing → Drying (* 1) Copper base plating Bath composition CuSO 4・ 5H 2 O 190g / l H 2 SO 4 50g / l Cl 30mg / l Brightener (use commercial agent) 10mg / l Plating condition Temperature 20 ℃ Current Density 2.5A / dm 2 Plating thickness 0.7μm (* 2) Tin plating Bath composition SnSO 4 40g / l H 2 SO 4 100g / l Cresol sulfonic acid 30g / l Formalin 5ml / l Brightener (dispersant) 20g / l ( Brightener) The following variables A, B, C and variables A: 5 ml / l B: 10 ml / l C: 15 ml / l Plating conditions Temperature: 20 ° C Current density As shown in Table 1 (whisker test) The following whisker test was performed on the prepared plated test pieces.
室内放置によるウィスカ発生状況として、実体顕微鏡
（×40倍）でウィスカの最大長さおよび発生密度として
1cm2当たりに発生したウィスカの本数を測定した。The maximum length and density of whiskers using a stereoscopic microscope (× 40)
The number of whiskers generated per 1 cm 2 was measured.
ウィスカの測定結果を第１表に示す。 Table 1 shows the whisker measurement results.
本発明の実施例であるサンプルNo.1〜８は室内放置１
年後においてもウィスカの発生は全くなかった。Sample Nos. 1 to 8 according to the embodiment of the present invention were left indoors 1
Years later, there were no whiskers.
一方、比較例であるサンプルNo.9〜14はウィスカの成
長が認められ、めっき中の炭素量が多くなるにしたがっ
てウィスカの発生が多かった。On the other hand, in samples Nos. 9 to 14 as comparative examples, whisker growth was observed, and the generation of whiskers increased as the amount of carbon in the plating increased.
［発明の効果］ 以上説明したように、本発明は銅および銅合金の錫め
っき層に発生するウィスカを抑制する効果は極めて大き
く、電子部品の材料として使用される場合においても、
信頼性が向上する。[Effects of the Invention] As described above, the present invention has an extremely large effect of suppressing whiskers generated in a tin plating layer of copper and a copper alloy, and even when used as a material for electronic components,
Reliability is improved.
Claims (1)
含有する一層の光沢錫めっきが直接又は銅下地めっきを
介して形成されていることを特徴とする光沢錫めっきを
有する銅又は銅合金。(1) 0.10 to 0.50 wt% of carbon (excluding 0.1 wt%)
A copper or copper alloy having bright tin plating, wherein a layer of bright tin plating to be contained is formed directly or via a copper base plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337038A JP2718793B2 (en) | 1989-12-26 | 1989-12-26 | Copper or copper alloy with bright tin plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337038A JP2718793B2 (en) | 1989-12-26 | 1989-12-26 | Copper or copper alloy with bright tin plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03197692A JPH03197692A (en) | 1991-08-29 |
| JP2718793B2 true JP2718793B2 (en) | 1998-02-25 |
Family
ID=18304853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1337038A Expired - Fee Related JP2718793B2 (en) | 1989-12-26 | 1989-12-26 | Copper or copper alloy with bright tin plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2718793B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4813785B2 (en) * | 2004-09-29 | 2011-11-09 | Ｄｏｗａメタルテック株式会社 | Tin plating material |
| JP2006193778A (en) * | 2005-01-13 | 2006-07-27 | Fujitsu Ltd | Sn plating film of electronic parts |
| US9514856B2 (en) * | 2011-08-04 | 2016-12-06 | Kobe Steel, Ltd. | Copper alloy |
| JP6421154B2 (en) * | 2016-09-26 | 2018-11-07 | 千住金属工業株式会社 | Method for producing metal body |
| KR102597172B1 (en) * | 2016-11-08 | 2023-11-02 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02145793A (en) * | 1988-11-28 | 1990-06-05 | Kobe Steel Ltd | Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistance |
| JPH02270986A (en) * | 1989-04-10 | 1990-11-06 | Kobe Steel Ltd | Tin coated metallic sheet having excellent brightness and whisker resistance |
-
1989
- 1989-12-26 JP JP1337038A patent/JP2718793B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03197692A (en) | 1991-08-29 |
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