JP2783479B2 - Semiconductor device mounting method and resin discharge nozzle - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001] The present invention relates to a mounting method of a semiconductor device, of particular mounting method of sealing with resin after directly mounting a semiconductor element on a substrate, and a resin discharge nozzle for use in such a mounting method is there.

2. Description of the Related Art Conventionally, a semiconductor device such as an IC (integrated circuit) device is directly mounted on a substrate, and a semiconductor device mounting method using a resin sealing technique for sealing the semiconductor device with a resin is performed according to the viscosity of the resin. Use a resin discharge nozzle with an appropriate pipe diameter. The tip of such a nozzle usually has a shape cut in the vertical direction of the nozzle pipe, and therefore, a method is employed in which the resin is discharged along the center line direction of the nozzle.

[0003] Further, by employing a multi-nozzle having a structure in which a plurality of pins constituting each of the nozzles are provided on a holder, a uniform distribution of the discharged resin on a discharge surface is achieved. .

FIG. 4 shows an example of a conventional multi-nozzle having such a structure.

In FIG. 4, a multi-nozzle includes a multi-nozzle holder 27 and a plurality of nozzles 2 supported by the multi-nozzle holder 27.
8 is provided. On the other hand, the semiconductor element 22 is directly mounted on the substrate 23, and
3 is connected to a predetermined wiring pattern.
According to the conventional multi-nozzle thus configured as described above, the resin 20 discharged from the nozzle 28
The semiconductor element 22 can be resin-sealed on the substrate 23.

[0006]

Generally, in this type of semiconductor device mounting method , in order to meet recent demands for high-density and high-precision mounting of semiconductor devices, the accuracy of the formation region of the sealing resin has been improved. It is desired to improve the uniformity of the discharged resin.

However, according to the above-described conventional multi-nozzle, it is necessary to mount the semiconductor element at a high density, and therefore, the sealing resin region is severely restricted.
When the uniformity of the discharged resin is strictly required, it is difficult to produce a multi-nozzle with a narrow pitch due to the limitations of the nozzle size and the nozzle pitch. That is, it is difficult to obtain a fixed and uniform resin discharge at the time of high-density mounting and an arbitrary discharge resin shape from the nozzle shape.

On the other hand, it is conceivable that the nozzle is deformed, for example, bent, but in this case, resin clogging or the like occurs at the bent portion, and the nozzle is not practically usable.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and has a method of mounting a semiconductor device suitable for mounting semiconductor elements at a high density, and a resin discharge capable of discharging a resin with high accuracy and uniformity. It is an object to provide a nozzle for use.

[0010]

According to the method of mounting a semiconductor device of the present invention, in order to achieve the above-mentioned object, a semiconductor device is mounted on a substrate and the semiconductor device is sealed with resin discharged from a nozzle. In the method , the nozzle is a multi-nozzle including a plurality of nozzles, and a discharge direction and a shape of the discharge resin are controlled by performing a taper process on a tip portion of at least one nozzle positioned on an outer contour of the plurality of nozzles. It is characterized by doing.

[0011] resin discharge nozzle of the present invention to achieve the above-mentioned problems, a semiconductor element mounted on the substrate a resin discharge nozzle for resin sealing, the nozzle
A multi-nozzle comprising a plurality of nozzles, double as the discharge direction and shape of the ejection resin becomes a predetermined direction and shape
At least one of the nozzles located on the outer contour
The nozzle is tapered at its tip.

[0012]

In the method of mounting a semiconductor device according to the present invention, the nozzle is a multi-nozzle including a plurality of nozzles, and the tip of at least one of the plurality of nozzles located on the outer contour of the plurality of nozzles is tapered. The discharge direction and shape of the discharge resin are controlled. Here, as such processing, in addition to the taper processing, for example, processing to provide a slit or the like at the tip of the nozzle, surface processing of the inner wall of the nozzle tip to give resistance to the flow of resin to be discharged, and the like, By such processing, the discharge resin is discharged not in the direction along the nozzle center line but in the direction deviating from the center line. Here, the degree of deviation from the center line and the direction in which the resin is discharged are substantially the same as the material properties such as the viscosity of the resin,
It depends on the discharge conditions, such as the discharge pressure and the nozzle size, and the shape of the nozzle tip. Therefore, for the nozzle tip shape,
By performing the above-described processing in a well-balanced manner in accordance with the material properties of these resins and the discharge conditions, the degree of deviation from the center line can be adjusted. For this reason, if such processing is applied to the nozzle tip shape, when resin-encapsulating the semiconductor element mounted on the substrate, it is not necessary to narrow the nozzle pitch in the multi-nozzle, and any resin discharge amount distribution / It is possible to obtain a discharge shape, and therefore, it is possible to improve the accuracy of the sealing resin formation region at an arbitrary position on the substrate while maintaining the uniformity of the discharge resin.

On the other hand, the resin discharge nozzle of the present invention is a multi-nozzle comprising a plurality of nozzles, and the outer contour of the plurality of nozzles is formed so that the discharge direction and the shape of the discharge resin become predetermined directions and shapes. The tip of at least one of the positioned nozzles is tapered. Therefore, by using such a nozzle, it is possible to realize the semiconductor device mounting method of the present invention as described above. That is, when encapsulating a semiconductor element mounted on a substrate with a resin, the resin discharge nozzle can be used. In this case, the resin can be discharged with high accuracy and uniformity.

The following examples of the present invention will further clarify such an operation of the present invention, and will further clarify other operations of the present invention.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 schematically shows the structure of a multi-nozzle according to an embodiment of the present invention.

In FIG. 1, a multi-nozzle includes a multi-nozzle holder 17 and a plurality of nozzles 18 supported by the multi-nozzle holder 17.
a and 18b. On the other hand, the semiconductor element 12 is directly mounted on the substrate 13 and is connected to a wiring pattern formed on the substrate 13 by a bonding wire 15 in a predetermined manner.

In this embodiment, in particular, the plurality of nozzles 18a,
Among the nozzles 18a located on the outer contour of the nozzles 18b,
A taper 19 is provided at the tip.

According to the multi-nozzle of the present embodiment configured as described above, the semiconductor element 12 can be resin-sealed on the substrate 13 by the resin 10 discharged from the nozzles 18a and 18b. Here, since the taper 19 is provided, the resin 10 is discharged in a direction deviating inward from the center line of the nozzle 18a. And discharge conditions such as the discharge pressure and the size of the nozzle 18a are provided in a well-balanced manner. That is, the degree of deviation of the resin 10 discharged from the nozzle 18a from the center line and the discharge direction are determined by the taper 19.
As a result, the substrate is controlled while maintaining the uniformity of the resin 10 without using a nozzle having a size that does not cause the resin clogging without affecting the nozzle pitch. Semiconductor element 1 on 13
An appropriate amount of the resin 10 can be discharged around the periphery of the resin 2.

In the above embodiment, the taper is provided for a plurality of nozzles 18a located on the outer contour. However, the taper may be provided for only one nozzle 18a located on the outer contour. . In this case, particularly, a deformed resin shape such as left-right asymmetry can be obtained.

For example, as shown in FIG.
In the case where the discharge condition of the resin 10 is restricted by the outer shape of the substrate 13a in relation to the mounting position of 2, the discharge condition of the resin 10 is restricted by the step of the substrate 13b as shown in FIG. Or when the resin discharge conditions are restricted by obstacles, etc.
It is extremely effective to obtain such a deformed resin shape.

In the above embodiment, the taper processing is performed on the nozzle 18a located on the outer contour. Thus, the discharge amount distribution and the discharge shape of the resin may be controlled.

In the above-described embodiment, the taper 19 is provided at the tip of the nozzle 18a. However, as the processing to be applied to the tip, for example, processing to form a slit or the like, Surface treatment of the inner wall of the nozzle tip that gives resistance to the flow may be performed, and even with such processing, the discharge resin can be discharged not in the direction along the nozzle center line but in the direction off the center line. ,
Therefore, a desired resin discharge amount distribution and discharge shape can be obtained.

[0024]

As described above in detail, according to the semiconductor device mounting method of the present invention, the nozzle is a multi-nozzle including a plurality of nozzles, and at least one of the plurality of nozzles is located at an outer contour of the plurality of nozzles. It is necessary to narrow the nozzle pitch in the multi-nozzle when encapsulating the resin with the semiconductor element mounted on the substrate because the discharge direction and shape of the discharge resin are controlled by applying a taper process to the tip of the multi-nozzle. An arbitrary resin discharge amount distribution and discharge shape can be obtained without using a nozzle size that does not cause resin clogging. Therefore, it is possible to increase the accuracy of the sealing resin formation region at an arbitrary position on the substrate while maintaining the uniformity of the discharge resin.

On the other hand, according to the resin discharge nozzle of the present invention, the nozzle is a multi-nozzle composed of a plurality of nozzles, and the plurality of nozzles are arranged so that the discharge direction and the shape of the discharge resin are in predetermined directions and shapes. Since the tip of at least one nozzle located at the contour is tapered, the method for mounting a semiconductor device according to the present invention can be realized.

As a result, the method of mounting the semiconductor device of the present invention
By using the method and the resin discharge nozzle, a high-performance semiconductor device in which semiconductor elements are mounted at high density can be efficiently manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a multi-nozzle according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a semiconductor device sealed with a resin using another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a semiconductor device sealed with a resin using still another embodiment of the present invention.

FIG. 4 is a schematic side view showing a conventional multi-nozzle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Resin 12 Semiconductor element 13, 13a, 13b Substrate 15 Bonding wire 17 Multi-nozzle holder 18a, 18b Nozzle 19 Tape

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Yumi Maruyama 3211-1 Satomi, Satosho-gun, Asakuchi-gun, Okayama Pref. 63-182531 (JP, U) Hikaru 1-135735 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/56

Claims (2)

(57) [Claims] 1. A method of mounting a semiconductor device in which a semiconductor element is mounted on a substrate and the semiconductor element is sealed with resin discharged from a nozzle, wherein the nozzle is a multi-nozzle including a plurality of nozzles. A method of mounting a semiconductor device, characterized in that a discharge direction and a shape of the discharge resin are controlled by performing a taper process on a tip portion of at least one nozzle located at an outer contour of the nozzle. 2. A resin discharge nozzle for resin-sealing a semiconductor element mounted on a substrate, said nozzle comprising:
Is a multi-nozzle composed of a plurality of nozzles, so that the ejection direction and shape of the ejection resin are in a predetermined direction and shape.
At least located at the outer contour of the plurality of nozzles
A resin discharge nozzle characterized in that a tip of one nozzle is tapered .