JP2771814B2 - Electronic component automatic mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to an automatic mounting apparatus for electronic components, and more particularly to an improvement in mounting accuracy of electronic components and an improvement in operation efficiency of the apparatus.

[Summary of the Invention]

According to the present invention, the electronic component mounting head or the XY table has a waiting time from when the electronic component mounting position is reached on the substrate until the component mounting is started, the component mounting required by the mounted electronic component. This is an electronic component automatic mounting device that can be changed according to accuracy.

[Conventional technology]

In recent years, electronic devices have been miniaturized, and as a result, the electronic components used have also been reduced in size, and the degree of adhesion of electronic components mounted on a substrate has been increased. Deviations are likely to occur, and the requirements for component mounting accuracy on the board have become increasingly strict, especially for components with a small terminal spacing and a large number of terminals, such as flat package ICs. Therefore, in order to improve the mounting accuracy of the electronic components of the automatic electronic component mounting apparatus and to improve the operation rate of the apparatus, several types of moving speeds of the XY table are set in stages according to the size of the electronic components. Several kinds of step-up acceleration and stop deceleration of the table are set stepwise according to the size of the electronic component so as to prevent displacement of the electronic component due to inertia. (For example, JP-A-61-160999
[Problems to be Solved by the Invention] The XY table of the electronic component automatic mounting apparatus is capable of instantly stopping at the component mounting position when mounting a component on a board. It is impossible, and stops with a time attenuated vibration centered on the stop position due to inertia as shown in FIG. 5, and the component mounting accuracy is reduced. In the conventional technology, an XY of an automatic component mounting apparatus is used.
By making the moving speed, acceleration and deceleration of the table variable, it is possible to prevent displacement of electronic components due to inertia. However, although it is possible to reduce the damped vibration of the XY table, it is impossible to prevent it, and there is a case where components are mounted before the damped vibration ends.
There is a possibility that the mounting accuracy may be reduced. Therefore, XY
In order to improve the stopping accuracy of the table, it is conceivable to increase the rigidity of the XY table, but this is not effective because it increases the weight and the cost.

[Means to solve the problem]

In order to solve the above-mentioned problems, an electronic component automatic mounting apparatus according to the present invention is characterized in that a moving speed of an XY table is kept constant, and a component mounting head or an XY table arrives at a component mounting position on a substrate. The electronic component automatic mounting apparatus is provided with a function of making the standby time of the component mounting head variable until the start of the electronic component mounting.

[Action]

According to the present invention, the electronic component automatic mounting apparatus can change the standby time of the component mounting head until the component mounting starts after the component mounting head or the XY table arrives at the component mounting position on the board. Will be possible.

〔Example〕

Hereinafter, an electronic component automatic mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a main part of an electronic component automatic mounting apparatus according to one embodiment of the present invention, FIG. 2 is a block diagram of a control system,
FIG. 3 is a flowchart of the movement of the component mounting head and the XY table and the component mounting, FIGS. 4A to 4D are timing charts of the movement of the component mounting head and the XY table and the component mounting, and FIG. It is a graph which shows the vibration situation after a stop of a Y table.

As shown in FIGS. 1 and 2, the electronic component automatic mounting apparatus of the present invention is roughly divided into four blocks: a component mounting head assembly 1, an XY table 2, a component station 3, and a control block 4. Each is also subdivided.

The component mounting head assembly 1 includes a mounting head 11, a rotary base 12, a head rotating mechanism 13, and a camera 14. The plurality of rotary bases 12 are arranged at equal intervals.
2. It is composed of the control unit 113. Also,
The rotary base 12 includes an AC motor 121, a rotary base motor drive unit 122, and an electromagnetic clutch / brake unit 123.

The XY table 2 is a DC motor 2 with an encoder for the X axis.
1. A motor drive unit 22 for the X-axis, a DC motor 23 with an encoder for the Y-axis, and a motor drive unit 24 for the Y-axis.

The parts station 3 includes a DC motor 31, a parts station motor drive unit 32, a position detection unit 33,
It is composed of a parts cassette 34.

The control block 4 includes an arithmetic unit (hereinafter referred to as a CPU) 4
1. It comprises an internal memory 42 and an external storage device 43.

As shown in FIGS. 1, 2 and 3, the mounting head 11 is provided with a suction nozzle 111 at the tip and a suction nozzle up / down mechanism 112 at the rear. The suction nozzle 111 is moved up and down by a suction nozzle raising / lowering mechanism 112 controlled by a control unit 113, sucks an electronic component from the parts cassette 34, and releases the electronic component at a component mounting position on the substrate 5 to release the electronic component. Perform mounting. The rotary base 12 is a motor drive unit 12 for the rotary base.
It is driven by an AC motor 121 controlled by 2 and rotates by a fixed angle (360 ° / n) determined by the number (n) of the mounting heads 11, and is stopped by an electromagnetic clutch / brake unit 123. Since the stopping accuracy cannot be increased only by controlling the motor drive unit 122 for control, the control from the control unit 113 is also performed. Electronic components are part cassettes
Since it is always supplied in a fixed direction from 34, the printed circuit board 5
In the case of electronic components that do not have polarity such as resistance, they are mounted by rotating the mounting angle in two directions of 0 degrees and 90 degrees, and electronic components that have polarities such as electrolytic capacitors In the case of, it is necessary to rotate the mounting angle in four directions of 0 degree, 90 degrees, 180 degrees, and 270 degrees to perform mounting.
When the mounting head 11 is moved to the position of the first head rotating mechanism 13 by the rotary base 12 in order to rotate the Rotated to an angle.
The mounting head 11 rotated by the first head rotating mechanism 13 is then moved to the position of the camera 14, the rotation angle of the electronic component is confirmed by the camera 14, and a slight angle shift is caused by the second angle.
Is finely adjusted by the second head rotating mechanism 13 and moves to the component mounting position.
Although not shown in FIG. 1, the head rotating mechanism
The camera 13 and the camera 14 are incorporated in the component mounting head assembly 1, and the rotation and the rotation angle of the mounting head 11 are checked.

The substrate 5 is loaded on the XY table 2 and driven by the X-axis motor drive unit 22 and driven by the Y-axis motor drive unit 24.
The XY direction is determined by 23 and moves to the component mounting position.

In the parts station 3, a part cassette 34 is arranged in accordance with a board-compatible machine operation program programmed in, for example, a magnetic disk or an IC card, which is input to an external storage device 43 described later. It is moved left and right by the DC motor 31 driven by the station motor drive unit 32. The position of the parts cassette 34 is detected by the position detection unit 33, and the parts cassette 34 stops at a predetermined position.
The electronic component is sucked by the suction nozzle 111 in accordance with the program for board-compatible machine operation, the suction is released at the component mounting position of the substrate 5, and the component is mounted on the substrate 5. After the component mounting, the component mounting head 11 moves to the position of the third head rotating mechanism 13, and the third head rotating mechanism 13 moves.
With 13, it is returned to the position of 0 degrees and prepares for the next component suction.

Control of all units is performed by the control block 4. The control block 4 has a CPU 41 and an internal memory 42.
The machine operation basic program and the board-compatible machine operation program input from the external storage device 43 are loaded into the internal memory 42, and the control unit 113, the rotary-base motor drive unit 122, Control signals are output to the X-axis motor drive unit 22, the Y-axis motor drive unit 24, and the parts station motor drive unit 32.

In the automatic electronic component mounting apparatus, the XY table 2 and the component mounting head assembly 1 move at the timings shown in the timing charts of FIGS. 4A and 2B, and the suction nozzle 111 is lowered to the component mounting position on the substrate 5 to release the suction. Then, component mounting is performed. In the case of FIG. 4A, the component mounting head assembly 1 arrives at the component mounting position after the XY table 2 stops, so there is a little waiting time of the XY table 2 before component mounting. In the case of (b), component mounting is performed with no waiting time. The XY table 2 cannot be stopped instantaneously at the component mounting position as shown in FIG. 5 and stops while damping vibration. Therefore, in the case of FIGS. The component mounting accuracy varies depending on the timing of the movement of the mounting head assembly 1. Then, in order to increase the component mounting accuracy for all electronic components, after stopping the XY table 2 as shown in FIG.
If the waiting time until the lowering of the 111 and the releasing of the suction component are sufficiently provided, the operation efficiency of the apparatus is reduced.

There is a difference in the required component mounting accuracy depending on the shape, size, and density of the electronic components on the substrate 5, and only one electronic component requiring the component mounting accuracy in one substrate 5 is limited. In addition, the required component mounting accuracy is different. Therefore, by setting the standby time of each electronic component as shown in FIGS. 4 to 4 in advance on the board-compatible machine operation program, the component mounting accuracy required for each electronic component can be satisfied.

〔The invention's effect〕

According to the present invention, the component mounting head of the electronic component automatic mounting apparatus is configured such that the standby time until component mounting is variably programmed according to the component mounting accuracy required for each electronic component after moving the XY table. The device operation efficiency can be improved while measuring the positioning accuracy of component mounting.

[Brief description of the drawings]

1 is a perspective view of a main part of an electronic component automatic mounting apparatus according to one embodiment of the present invention, FIG. 2 is a block diagram of a control system, and FIG. 3 is movement of a component mounting head and an XY table and component mounting. 4A to 4D are timing charts of the movement of the component mounting head and the XY table and the component mounting, and FIG. 5 is a graph showing the vibration state after the XY table is stopped. 1 ... component mounting head assembly 11 ... mounting head 12 ... rotary base 122 ... rotary base motor drive unit 13 ... head rotating mechanism 14 ... camera 2 ... XY table 21 ... with X-axis encoder DC motor 22 ... Motor drive unit for X-axis 23 ... DC motor with encoder for Y-axis 24 ... Motor drive unit for Y-axis 3 ... Part station 31 ... DC motor 32 ... Motor drive unit for part station 33 ... Position Detection unit 34 ... Parts cassette 4 ... Control block 41 ... Computing device (CPU) 42 ... Internal memory 43 ... External storage device 5 ... Substrate

Claims (1)

(57) [Claims] 1. An electronic component mounting apparatus, comprising: an XY table on which a substrate is mounted; a component mounting head for mounting electronic components on the substrate; and a control block for controlling these components by program driving. Alternatively, the standby time from when the XY table arrives at the mounting position of the electronic component to when component mounting is started is variably programmed according to the component mounting accuracy required for the electronic component to be mounted. An electronic component automatic mounting device, characterized in that: