JP2607533B2 - Processing device and processing method - Google Patents
Processing device and processing methodInfo
- Publication number
- JP2607533B2 JP2607533B2 JP62190044A JP19004487A JP2607533B2 JP 2607533 B2 JP2607533 B2 JP 2607533B2 JP 62190044 A JP62190044 A JP 62190044A JP 19004487 A JP19004487 A JP 19004487A JP 2607533 B2 JP2607533 B2 JP 2607533B2
- Authority
- JP
- Japan
- Prior art keywords
- piezo element
- tool
- processing
- cutting
- control signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003672 processing method Methods 0.000 title claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 18
- 230000008602 contraction Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 description 31
- 238000005516 engineering process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Automatic Control Of Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Position Or Direction (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、高精度な位置決め技術に係り、特に精密機
械，計測機器および半導体製造装置などの構成要素の高
精度位置決めに好適なピエゾ素子の駆動装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a high-precision positioning technology, and particularly relates to a piezo element suitable for high-precision positioning of components such as precision machines, measuring instruments and semiconductor manufacturing devices. It relates to a driving device.
従来より、ピエゾ素子を用いた位置決め技術は多方面
で応用されている。たとえば、工具回転型の切削装置に
おいて、加工中に回転工具の切込み量を自在に制御する
ことができれば所望の制御信号を与えることによつて、
任意曲面の加工が可能となり、とりわけ金属反射鏡を用
いた光学技術へ多大な貢献ができる。2. Description of the Related Art Conventionally, positioning technology using a piezo element has been applied in various fields. For example, in a cutting tool of a tool rotation type, if a cutting amount of a rotating tool can be freely controlled during machining, a desired control signal is given by giving a desired control signal.
Processing of an arbitrary curved surface becomes possible, and a great contribution can be made particularly to optical technology using a metal reflecting mirror.
このような観点から、従来特開昭59−19601号におい
て、第３図に示す回転工具の切込み量制御方法が考案さ
れている。すなわち、工具回転型の切削装置において、
工具２に切込み量制御用のピエゾ素子１を取り付け、工
具の回転角位置に応じてあらかじめ関数発生回路６に書
き込んでおいた工具切込みデータを読み出す。この工具
切込みデータを工具切込み用のピエゾ素子に印加するこ
とによつて、回転工具の切込み量制御を実現するもので
ある。ここで、切削加工は、回転工具と被削材11とが相
対的に移動することによつて行われる。From this point of view, a method for controlling the depth of cut of a rotary tool shown in FIG. 3 has conventionally been devised in JP-A-59-19601. That is, in a tool rotation type cutting device,
The piezo element 1 for controlling the cutting amount is attached to the tool 2, and the tool cutting data previously written in the function generating circuit 6 is read out according to the rotational angle position of the tool. By applying the tool cutting data to the piezo element for tool cutting, the cutting amount control of the rotary tool is realized. Here, the cutting is performed by relatively moving the rotary tool and the workpiece 11.
上記従来技術は、ピエゾ素子の駆動による切込み量制
御が開ループ制御となつていたため、第４図に示すピエ
ゾ素子特有の印加電圧に対する変位の動的なスヒテリシ
スについて配慮されておらず、高精度な切込み量制御が
実現できないという問題があつた。この解決手段として
切込み制御用ピエゾ素子の変位量を直接測定して、この
測定値と切込み量目標値を比較制御する周知の閉ループ
制御を適用することが容易に考えられるが、回転中のピ
エゾ素子の変位を測定し、さらにその測定信号を回転体
の外部へ取り出すことは困難であつた。また、数値計算
によりピエゾ素子のヒステリシスを考慮して目標値を設
定する手段も考えられる。しかし第３図に示すようにピ
エゾ素子のヒステリシスは印加電圧の範囲によつて異つ
たループを描く特性があるため、印加電圧が変動する一
般的な制御に対して上記の手段を適用すると誤差が大き
くなる問題があつた。In the above prior art, since the depth of cut control by driving the piezo element is an open loop control, the dynamic hysteresis of the displacement with respect to the applied voltage peculiar to the piezo element shown in FIG. There is a problem that the depth of cut control cannot be realized. As a solution to this, it is easy to apply a well-known closed-loop control for directly measuring the displacement of the piezo element for cutting control and comparing and controlling this measured value with the target value of the cutting amount. It is difficult to measure the displacement of the motor and extract the measurement signal to the outside of the rotating body. In addition, a means for setting a target value in consideration of the hysteresis of the piezo element by numerical calculation is also conceivable. However, as shown in FIG. 3, the hysteresis of the piezo element has a characteristic of drawing a different loop depending on the range of the applied voltage. Therefore, when the above means is applied to general control in which the applied voltage fluctuates, an error occurs. There was a growing problem.
本発明の目的は、回転体内部にあるピエゾ素子をヒス
テリシスの影響なく高精度に位置決めし、所望の形状に
加工が可能な加工装置及び加工方法を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a processing apparatus and a processing method capable of positioning a piezo element inside a rotating body with high accuracy without being affected by hysteresis and processing into a desired shape.
上記目的、試料テーブルと、前記試料テーブル上の試
料を加工するための加工具と、前記加工具の位置を変え
るための第１のピエゾ素子と、前記加工具を回転させる
回転手段と、前記第１のピエゾ素子に制御信号を印加す
る制御信号印加手段と、前記制御信号印加手段からの制
御信号が印加される第２のピエゾ素子と、前記第２のピ
エゾ素子に設けられたウエイトと、前記第２のピエゾ素
子の伸縮量を計測するための変位計と、前記変位計から
の出力信号に基づいて前記第１のピエゾ素子を制御する
閉ループ制御手段とを有することを特徴とする加工装置
により、また、第１のピエゾ素子に設けられた回転加工
具を用いて試料表面を加工する加工方法において、前記
第１のピエゾ素子への制御信号と共通の制御信号が印加
され、かつウエイトが設けられた第２のピエゾ素子の伸
縮量に基づいて前記第１のピエゾ素子を制御することを
特徴とする加工方法により達成される。The above object, a sample table, a processing tool for processing a sample on the sample table, a first piezo element for changing a position of the processing tool, a rotating unit for rotating the processing tool, Control signal applying means for applying a control signal to the first piezo element, a second piezo element to which a control signal from the control signal applying means is applied, a weight provided on the second piezo element, A processing apparatus comprising: a displacement meter for measuring an amount of expansion and contraction of a second piezo element; and closed loop control means for controlling the first piezo element based on an output signal from the displacement meter. In a processing method for processing a sample surface using a rotary processing tool provided on a first piezo element, a control signal common to a control signal for the first piezo element is applied, and a weight is applied. Is achieved by the processing method characterized by controlling said first piezoelectric element based on expansion and contraction of the second piezoelectric element provided.
第１図を用いて、本発明における回転工具の切込み制
御方法の基本的動作を説明する。The basic operation of the method for controlling cutting of a rotary tool according to the present invention will be described with reference to FIG.
計測用のピエゾ素子３は、実際の変位を計測器５で測
定し閉ループ制御を行つているため、関数発生器６から
の目標変位信号DOに従つて変位する。回転工具用のピエ
ゾ素子１は、上述の計測用ピエゾ素子３と同一の電圧信
号VHによつて駆動されるために、目標変位信号DOに従つ
て変位することができる。The piezo element 3 for measurement is displaced according to the target displacement signal D O from the function generator 6 because the actual displacement is measured by the measuring device 5 and closed loop control is performed. Piezoelectric element 1 for a rotary tool can be in order to be by connexion driven to the same voltage signal V H and measuring a piezoelectric element 3 described above to follow connexion displaced target displacement signal D O.
以下、本発明の一実施例を第２図によりさらに具体的
に説明する。Hereinafter, one embodiment of the present invention will be described more specifically with reference to FIG.
本装置は、工具回転角度αと試料テーブル12の移動距
離Ｘに応じて切削工具２に取りつけたピエゾ素子１を伸
縮させて任意形状の切削を行う数値制御フライカツテイ
ング装置である。切削加工は、ピエゾ素子１とダイヤモ
ンド工具２からなる工具をカツタスピンドル８を駆動し
て回転運動させておき、被加工物11をガイドレール12に
沿つて移動することによつて行われる。This apparatus is a numerically controlled fly cutting apparatus for cutting an arbitrary shape by expanding and contracting a piezo element 1 attached to a cutting tool 2 in accordance with a tool rotation angle α and a moving distance X of a sample table 12. The cutting is performed by rotating a tool composed of the piezo element 1 and the diamond tool 2 by driving the cutter spindle 8 and moving the workpiece 11 along the guide rail 12.
切削工具の切込み量制御は次のように行われる。すな
わち、工具の回転角度αと被加工物の移動量Ｘをそれぞ
れロータリエンコーダ10と測長計13によつて検出し、こ
れらの信号に応じて関数発生回路６より工具切込み信号
Ｄ（X,α）を発生する。この工具切込み信号Ｄ（X,α）
は、アンプ７によつてピエゾ駆動電圧VHに変換されて、
工具部のピエゾ素子と同一の特性を持つピエゾ素子３に
伝達される。ピエゾ素子３には、切削工具２と同じ重量
のウエイト４が固定されている。ピエゾ素子３の伸縮量
Ｄは変位計５によつて測定される、この測定信号Ｄが目
標の工具切込み信号Ｄ（X,α）と等しくなるようにフイ
ードバツク制御される。この閉ループ系によつてピエゾ
素子３は、目標の工具切込み信号Ｄ（X,α）に等しい伸
縮を行うことから、ピエゾ駆動電圧VHはピエゾ素子の動
的なヒステリシスを補償した値となつている。そこで、
上記のピエゾ駆動電圧VHを、スリツプリング９を介して
回転中のピエゾ素子１に印加すれば、ピエゾ素子１の動
的ヒステリシスをも同時に補償することができる。The cutting depth control of the cutting tool is performed as follows. That is, the rotation angle α of the tool and the moving amount X of the workpiece are detected by the rotary encoder 10 and the length measuring device 13, respectively, and the function generating circuit 6 outputs the tool cutting signal D (X, α) according to these signals. Occurs. This tool cutting signal D (X, α)
Is converted into Yotsute piezo driving voltage V H to the amplifier 7,
The light is transmitted to the piezo element 3 having the same characteristics as the piezo element of the tool portion. A weight 4 having the same weight as the cutting tool 2 is fixed to the piezo element 3. The amount of expansion / contraction D of the piezo element 3 is measured by the displacement meter 5, and feedback control is performed so that the measurement signal D becomes equal to the target tool cutting signal D (X, α). With this closed loop system, the piezo element 3 expands and contracts equal to the target tool cutting signal D (X, α), so that the piezo drive voltage V H is a value that compensates for the dynamic hysteresis of the piezo element. I have. Therefore,
By applying the piezo drive voltage VH to the rotating piezo element 1 via the slip ring 9, the dynamic hysteresis of the piezo element 1 can be compensated at the same time.
第５図は、本実施例において得られた工具切込み制御
用ピエゾ素子の電圧・変位間の関係である。測定は、工
具を回転せずに行つている。この図から、第４図に比べ
て、電圧・変位間に直線性が得られていることがわか
る。FIG. 5 shows the relationship between the voltage and the displacement of the piezo element for controlling the tool cutting obtained in the present embodiment. The measurement is performed without rotating the tool. From this figure, it can be seen that linearity is obtained between the voltage and the displacement as compared with FIG.
本実施例によれば、ピエゾ素子のヒステリシスの影響
なく工具切込み制御を行えるために、任意曲面を高精度
に加工することができる。According to the present embodiment, since the tool cutting control can be performed without the influence of the hysteresis of the piezo element, an arbitrary curved surface can be machined with high accuracy.
実施例では、ピエゾ素子の動的なヒステリシスについ
て述べているが、本発明によればピエゾ素子のもう一つ
の問題点であるドリフトについても同時に除去すること
ができる。また、本発明では、切削工具の位置決めに関
して記述したが、全く同じ技術により他の装置における
構成部品の高精度位置決めにも適用できることは言うま
でもない。In the embodiment, the dynamic hysteresis of the piezo element is described. However, according to the present invention, drift, which is another problem of the piezo element, can be eliminated at the same time. Although the present invention has been described with respect to the positioning of the cutting tool, it is needless to say that the same technique can be applied to the high-precision positioning of components in other apparatuses.
本発明によれば、実変位の計測を行つていない位置決
め用のピエゾ素子についても、閉ループ制御と同様の制
御ができるので、以下のような効果がある。According to the present invention, the same control as the closed loop control can be performed for the positioning piezo element for which the actual displacement is not measured, and the following effects are obtained.
（１）位置決め用のピエゾ素子の電圧・変位間のヒステ
リシスおよびドリフトを補償できる。(1) Hysteresis and drift between the voltage and displacement of the piezo element for positioning can be compensated.
（２）（１）の効果によつて位相決め用ピエゾ素子の閉
ループ制御を行わなくても、サブミクロンオーダの高精
度位置決めが実現できる。(2) Due to the effect of (1), high-precision positioning on the order of submicrons can be realized without performing closed loop control of the phase determining piezo element.
（３）（１）の効果によつて、従来技術では加工不可能
であつたサブミクロン・オーダの形状精度を持つた任意
曲面の加工が可能となる。(3) Due to the effect of (1), it is possible to process an arbitrary curved surface having a shape accuracy on the order of submicron, which cannot be processed by the conventional technology.
第１図は本発明の基本構成のブロツク図、第２図は本発
明の一実施例の工具切込み量制御型の数値制御フライカ
ツテイング装置の構成図、第３図は従来の工具切込み量
制御型の数値制御フライカツテイング装置の構成図、第
４図はピエゾ素子の電圧・変位間のヒステリシス例を示
す図、第５図は本発明の一実施例によるピエゾ素子の電
圧・変位間の関係を示す図である。 １……切込み制御用ピエゾ素子、２……切削工具、３…
…計測用ピエゾ素子、４……ウエイト、５……変位測定
器、６……関数発生器、７……ピエゾ駆動用アンプ、８
……カツタスピンドル、９……スリツプリング、10……
ロータリエンコーダ、11……被削材、12……ガイド、13
……測長器、14……誤差検出回路。FIG. 1 is a block diagram of the basic configuration of the present invention, FIG. 2 is a block diagram of a numerical control fly cutting apparatus of a tool cutting amount control type according to one embodiment of the present invention, and FIG. 3 is a conventional tool cutting amount control. FIG. 4 is a diagram showing an example of hysteresis between voltage and displacement of a piezo element, and FIG. 5 is a diagram showing a relationship between voltage and displacement of a piezo element according to an embodiment of the present invention. FIG. 1 ... Piezo element for cutting control, 2 ... Cutting tool, 3 ...
... Measurement piezo element, 4 ... Weight, 5 ... Displacement measuring instrument, 6 ... Function generator, 7 ... Piezo drive amplifier, 8
…… Cutter spindle, 9… Slip ring, 10 ……
Rotary encoder, 11 Workpiece, 12 Guide, 13
… Length measuring device, 14… Error detection circuit.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０２Ｎ 2/00 Ｈ０２Ｎ 2/00 Ｂ (72)発明者 桂城 正彦 東京都国分寺市東恋ヶ窪１丁目280番地 株式会社日立製作所中央研究所内 (72)発明者 鈴木 達人 東京都国分寺市東恋ヶ窪１丁目280番地 株式会社日立製作所中央研究所内 (56)参考文献 特開 昭63−209186（ＪＰ，Ａ) 特開 昭60−80502（ＪＰ，Ａ) 特開 昭59−19601（ＪＰ，Ａ)──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical display location H02N 2/00 H02N 2/00 B (72) Inventor Masahiko Katsuragi 1-280 Higashi-Koigabo, Kokubunji-shi, Tokyo Hitachi Central Research Laboratory Co., Ltd. (72) Inventor Tatsuto Suzuki 1-280 Higashi Koigakubo, Kokubunji-shi, Tokyo Hitachi Central Research Laboratory Co., Ltd. (56) References JP-A-63-209186 (JP, A) JP-A-60 -80502 (JP, A) JP-A-59-19601 (JP, A)
Claims (2)
加手段と、 前記制御信号印加手段から出力される制御信号が印加さ
れる第２のピエゾ素子と、 前記第２のピエゾ素子に設けられたウエイトと、 前記第２のピエゾ素子の伸縮量を計測するための変位計
と、 前記変位計からの出力信号に基づいて前記第１のピエゾ
素子を制御する閉ループ制御手段とを有することを特徴
とする加工装置。A sample table, a processing tool for processing a sample on the sample table, a first piezo element for changing a position of the processing tool, a rotating means for rotating the processing tool, Control signal applying means for applying a control signal to the first piezo element; a second piezo element to which a control signal output from the control signal applying means is applied; and a second piezo element. A weight, a displacement meter for measuring an amount of expansion and contraction of the second piezo element, and closed loop control means for controlling the first piezo element based on an output signal from the displacement meter. Processing equipment.
を用いて試料表面を加工する加工方法において、 前記第１のピエゾ素子への制御信号と共通の制御信号が
印加され、かつウエイトが設けられた第２のピエゾ素子
の伸縮量に基づいて前記第１のピエゾ素子を制御するこ
とを特徴とする加工方法。2. A processing method for processing a sample surface using a rotary processing tool provided on a first piezo element, wherein a control signal common to a control signal to the first piezo element is applied, and a weight is applied. A processing method for controlling the first piezo element based on the amount of expansion and contraction of the second piezo element provided with the first piezo element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62190044A JP2607533B2 (en) | 1987-07-31 | 1987-07-31 | Processing device and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62190044A JP2607533B2 (en) | 1987-07-31 | 1987-07-31 | Processing device and processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435613A JPS6435613A (en) | 1989-02-06 |
| JP2607533B2 true JP2607533B2 (en) | 1997-05-07 |
Family
ID=16251419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62190044A Expired - Lifetime JP2607533B2 (en) | 1987-07-31 | 1987-07-31 | Processing device and processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2607533B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4303125C1 (en) * | 1993-02-04 | 1994-05-11 | Hommelwerke Gmbh | Piezoelectric setting drive circuit for precision positioning of cutting tool - with auxiliary setting drive providing detected movement used to linearise movement of controlled setting element |
| JP4563695B2 (en) * | 2004-02-23 | 2010-10-13 | ボンドテック株式会社 | Pressurizing method and joining apparatus |
| NL2004153A (en) | 2009-02-24 | 2010-08-25 | Asml Netherlands Bv | Lithographic apparatus, a method for removing material of one or more protrusions on a support surface, and an article support system. |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63209186A (en) * | 1987-02-26 | 1988-08-30 | Canon Inc | Piezoelectric driving device |
-
1987
- 1987-07-31 JP JP62190044A patent/JP2607533B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6435613A (en) | 1989-02-06 |
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