JP2603952B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP2603952B2 JP2603952B2 JP62167706A JP16770687A JP2603952B2 JP 2603952 B2 JP2603952 B2 JP 2603952B2 JP 62167706 A JP62167706 A JP 62167706A JP 16770687 A JP16770687 A JP 16770687A JP 2603952 B2 JP2603952 B2 JP 2603952B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- reinforcing member
- chip
- reinforcing
- bending stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明はICカードに係り、特に曲げ応力に対してICチ
ップを保護するための補強部材を備えたICカードに関す
る。The present invention relates to an IC card, and more particularly to an IC card provided with a reinforcing member for protecting an IC chip against bending stress.
(従来の技術) ICカードは演算処理機能を持つことと、記憶容量の大
きさから従来の磁気カードを発展させた様な高度な機能
を有し、キャッシュカードをはじめ様々の応用が考えら
れている。(Prior art) An IC card has an arithmetic processing function, and has advanced functions such as the development of a conventional magnetic card due to the large storage capacity, and various applications such as a cash card are considered. I have.
この様なICカードはICチップを内臓しない通常の磁気
カード等の互換性維持のため、例えばエンボスの形成や
磁気テープの貼着を可能にする等の要求からカード状基
体の少なくとも表面部材は塩化ビニル樹脂等の有機物の
シートであることが望ましい。In order to maintain compatibility of such an IC card with a normal magnetic card or the like that does not include an IC chip, at least the surface member of the card-shaped substrate is made of chloride due to requirements such as forming an emboss or adhering a magnetic tape. It is desirable that the sheet is made of an organic material such as a vinyl resin.
従来のICカードは第4図(a)(b)にその一例を示
す様にICチップ31を搭載し配線パターン32とワイヤー33
を介して該チップ31に接続された入出力端子34が形成さ
れた薄いガラスエポキシ基板からなる配線基板35を塩化
ビニル樹脂からなるカード状基体36の開口部37にはめ込
み基体36の開口部37の下部にエポキシ樹脂38を充填して
基体36を固定するという構造になっている。A conventional IC card has an IC chip 31 mounted thereon as shown in FIGS. 4 (a) and 4 (b), and a wiring pattern 32 and a wire 33.
A wiring board 35 made of a thin glass epoxy board on which input / output terminals 34 connected to the chip 31 are formed is inserted into an opening 37 of a card-like base 36 made of vinyl chloride resin. The lower portion is filled with an epoxy resin 38 to fix the base 36.
しかしながらこの構造のものにおいては、ICチップ31
として例えば0.3mm厚程度のものを使用した場合、カー
ドに曲げ応力が加わった時シリコン単結晶からなるICチ
ップ31がそれに耐えきれず破壊してしまう問題があっ
た。一方この問題を解決するためにICチップの表裏両面
に対向して剛性のある補強版を配置することが考えられ
るが、その場合でも補強板の大きさ及び位置を適切にし
なければカードに加わる曲げ応力により補強板自体が変
形してICチップを曲げ応力に対して保護する効果が期待
できなくなる。However, in this structure, the IC chip 31
For example, when a card having a thickness of about 0.3 mm is used, there is a problem that when a bending stress is applied to the card, the IC chip 31 made of silicon single crystal cannot withstand it and is broken. On the other hand, in order to solve this problem, it is conceivable to arrange a rigid reinforcing plate opposite to the front and back surfaces of the IC chip, but even in this case, if the size and position of the reinforcing plate are not appropriate, bending added to the card The reinforcing plate itself is deformed by the stress, and the effect of protecting the IC chip against bending stress cannot be expected.
これを考慮して、既に特願昭60−284009号公報におい
てICチップを保護する補強部材を備えたICカードを提案
した。この発明によれば、補強部材がカードに加わる曲
げ応力による変形の最も大きいカード状基体の縦横の中
心線に交わっていないため、補強部自体に大きな変形が
生ずることはなく、補強部材により、ICチップの保護効
果を最大限に発揮させることができる。In consideration of this, Japanese Patent Application No. 60-284009 has already proposed an IC card provided with a reinforcing member for protecting an IC chip. According to the present invention, since the reinforcing member does not intersect the vertical and horizontal center lines of the card-like substrate which is most deformed by the bending stress applied to the card, no large deformation occurs in the reinforcing portion itself. The effect of protecting the chip can be maximized.
しかしながらカードの補強部材は十分な剛性を有する
ためにカードに曲げ応力が加わった時、ICチップは保護
されるものの有機物のシートであるカバーフィルムが損
傷をうける難点が残った。However, since the reinforcing member of the card has sufficient rigidity, when a bending stress is applied to the card, the IC chip is protected, but there is still a problem that the cover film, which is an organic sheet, is damaged.
(発明が解決しようとする問題点) 以上の様に第4図に示されているICカードではカード
の曲げ応力に対してICチップが破壊される。(Problems to be Solved by the Invention) As described above, in the IC card shown in FIG. 4, the IC chip is broken by the bending stress of the card.
一方補強板を埋め込んだICカードでは補強板の外寸及
びカード基体中に埋め込む位置を適切にしなければICチ
ップの保護にならないばかりかカバーフィルムをも損傷
してしまう。On the other hand, in the case of an IC card in which a reinforcing plate is embedded, unless the outer dimensions of the reinforcing plate and the position where the reinforcing plate is embedded in the card are not appropriate, the IC chip is not only protected but also the cover film is damaged.
本発明は上記の欠点を鑑みてなされたもので、カード
に加えられた曲げ応力に対しICチップの破壊を防止する
補強部材がカバーフィルムを損傷しないカードを提供す
ることを目的とする。The present invention has been made in view of the above-mentioned drawbacks, and has as its object to provide a card in which a reinforcing member for preventing breakage of an IC chip against bending stress applied to the card does not damage a cover film.
(問題点を解決するための手段) 本発明はこの目的を達成するためにカード基体中に埋
設された補強部材が少なくとも端部においては薄くなっ
ていることを特徴とする。(Means for Solving the Problems) In order to achieve this object, the present invention is characterized in that the reinforcing member embedded in the card base is thin at least at the end.
(作用) 本発明によればカードに加えられる曲げ応力を補強部
材が受け止める。しかも、同一厚みをもつ補強部材と比
較して、カードに加わる曲げ応力が中央部から周辺部に
かけて均一にかかり、補強部材の周辺部に集中しないた
め、補強部材の周辺部の鋭利な部分がカバーフィルムを
損傷することは極めて少なくなり、補強部材によるICチ
ップの保護効果を最大限に発揮させられる。(Operation) According to the present invention, the reinforcing member receives bending stress applied to the card. In addition, compared to a reinforcing member having the same thickness, the bending stress applied to the card is uniformly applied from the central portion to the peripheral portion and is not concentrated on the peripheral portion of the reinforcing member, so that the sharp portion of the peripheral portion of the reinforcing member is covered. Damage to the film is extremely reduced, and the effect of protecting the IC chip by the reinforcing member can be maximized.
(実施例) 以下図面を参照して本発明のICカードについて詳細に
説明する。第1図は本発明の一実施例に係る補強部材の
斜視図及び第1図中L1,L2に添った断面図であり第2図
はカード状基体とICチップ及び補強部材の平面的位置関
係を示す平面図であり第3図はその要部を拡大して示す
断面図である。(Example) Hereinafter, an IC card of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a reinforcing member according to one embodiment of the present invention and a cross-sectional view taken along lines L 1 and L 2 in FIG. 1. FIG. 2 is a plan view of a card-like base, an IC chip, and a reinforcing member. FIG. 3 is a plan view showing a positional relationship, and FIG. 3 is a cross-sectional view showing an enlarged main part thereof.
第2図及び第3図において熱可塑性樹脂からなるカー
ド状基体1は、コアシート2とその両面に接着剤5,6に
よりラミネートされたカバーフィルム3,4により構成さ
れコアシート2中にICチップ7a,7bが埋め込まれてい
る。コアシート2の両面にICチップ7a,7bのパッドと適
宜接続された配線パターン8,9が各々形成されている。2 and 3, a card-like substrate 1 made of a thermoplastic resin is composed of a core sheet 2 and cover films 3, 4 laminated on both sides thereof with adhesives 5, 6, and an IC chip is provided in the core sheet 2. 7a and 7b are embedded. On both surfaces of the core sheet 2, wiring patterns 8, 9 appropriately connected to pads of the IC chips 7a, 7b are formed.
そしてカード状基体1中にこの例では、カバーフィル
ム3,4のICチップ7a,7bに対向する面に接続してICチップ
7a,7bの表裏面に対向する位置に板状の補強部材11a,11b
及び12a,12bが設けられている。補強部材11a,11b,12a,1
2bは全て同一材質からなり大きな弾性率を有するものが
望ましく具体的には金属箔等が好適である。In this example, the IC chip is connected to the surface of the cover films 3 and 4 facing the IC chips 7a and 7b in the card-shaped substrate 1.
Plate-shaped reinforcing members 11a, 11b at positions facing the front and back surfaces of 7a, 7b
And 12a, 12b. Reinforcement members 11a, 11b, 12a, 1
2b is preferably made of the same material and having a large elastic modulus, and specifically, a metal foil or the like is suitable.
また補強部材11a,11b及び12a,12bの外形寸法(縦横寸
法)は、曲げ応力によるICチップ7a,7bの破壊防止のみ
ならず、カード状基体1とICチップ7a,7bとの境界上の
配線パターンの断線防止のためにもICチップ7a,7bの縦
横寸法より大きくすることが必要であり、好ましくはIC
チップ7a,7bとの縦横寸法の差が0.5mm以上あることが適
当である。The outer dimensions (length and width) of the reinforcing members 11a, 11b and 12a, 12b not only prevent the breakage of the IC chips 7a, 7b due to bending stress, but also reduce the wiring on the boundary between the card-shaped base 1 and the IC chips 7a, 7b. In order to prevent disconnection of the pattern, it is necessary to make the vertical and horizontal dimensions of the IC chips 7a and 7b larger.
It is appropriate that the difference between the vertical and horizontal dimensions of the chips 7a and 7b is 0.5 mm or more.
さらに補強部材11a,11b及び12a,12bの縦横寸法は必要
以上に大きいと、応力に対するそれ自体の変形が大きく
なり補強効果が失われるので、好ましくはICチップ7a,7
bとの縦横寸法の差が5mm未満となる程度に配置する。Further, if the vertical and horizontal dimensions of the reinforcing members 11a, 11b and 12a, 12b are larger than necessary, deformation of the reinforcing members themselves against stress becomes large and the reinforcing effect is lost, so that the IC chips 7a, 7b are preferably used.
It is arranged so that the difference in vertical and horizontal dimensions from b is less than 5 mm.
さらに補強部材11a,11bおよび12a,12bのICカード厚み
方向での配設位置については、カードの中心から離れた
位置ほど曲げ剛性が増大し、保護効果が向上する。この
観点から本実施例の様にカード状基体1の表面部材であ
るカバーフィルム3,4のICチップ7a,7bに対向する面に補
強部材11a,11b及び12a,12bを接して設けることが望まし
い。Furthermore, as for the disposition positions of the reinforcing members 11a, 11b and 12a, 12b in the thickness direction of the IC card, the bending stiffness increases as the distance from the center of the card increases, and the protection effect improves. From this point of view, it is desirable to provide the reinforcing members 11a, 11b and 12a, 12b in contact with the surfaces of the cover films 3, 4, which are the surface members of the card-like substrate 1, facing the IC chips 7a, 7b, as in this embodiment. .
以上説明した様に、本発明によれば、ICチップを保護
する補強部材がカードに曲げ応力が加わった際にも表面
部材のカバーフィルムは損傷されないで、カード本体の
動作安定性,環境安定性及び美観向上になる。As described above, according to the present invention, even when the reinforcing member for protecting the IC chip is subjected to bending stress on the card, the cover film of the surface member is not damaged, and the operation stability and environmental stability of the card body are maintained. Also, the appearance is improved.
第1図は本発明の一実施例に係る補強部材の斜視図及び
L1,L2に添った面での断面図、第2図は同実施例に係るI
Cカードにおけるカード状基体とICチップ及び補強部材
の平面的位置関係を示す平面図、第3図は同実施例に係
るICカードの要部を拡大して示す断面図、第4図は従来
のICカードの斜視図及び断面図である。 1……カード状基体、2……コアシート 3,4……カバーフィルム、5,6……接着剤 7a,7b……ICチップ、8,9……配線パターン 10……接続用導体、11a,11b,12a,12b……補強部材FIG. 1 is a perspective view of a reinforcing member according to one embodiment of the present invention,
FIG. 2 is a sectional view taken along a plane along L 1 and L 2, and FIG.
FIG. 3 is a plan view showing a planar positional relationship between a card-shaped base, an IC chip and a reinforcing member in a C card, FIG. 3 is a cross-sectional view showing an enlarged main part of the IC card according to the embodiment, and FIG. It is the perspective view and sectional drawing of an IC card. DESCRIPTION OF SYMBOLS 1 ... Card-shaped base, 2 ... Core sheet 3, 4 ... Cover film, 5, 6 ... Adhesive 7a, 7b ... IC chip, 8, 9 ... Wiring pattern 10 ... Connection conductor, 11a , 11b, 12a, 12b …… Reinforcing member
Claims (4)
おいて、厚みが少なくとも端部において薄い前記補強部
材を埋設したことを特徴とするICカード。1. An IC card having a reinforcing member for protecting an IC, wherein the reinforcing member having a small thickness at least at an end portion is embedded.
する特許請求の範囲第1項記載のICカード。2. The IC card according to claim 1, wherein said reinforcing member is a metal foil.
0.5mm以上4mm未満であることを特徴とする特許請求の範
囲第1項記載のICカード。3. The reinforcing member has a difference in length and width from the IC.
2. The IC card according to claim 1, wherein said IC card is not less than 0.5 mm and less than 4 mm.
と、このコアシートの両面に接着されたカバーフィルム
と、前記カバーフィルムと前記ICとの間に挿入された補
強部材とを具備することを特徴とする特許請求の範囲第
1項、第2項又は第3項記載のICカード。4. An IC, comprising: a core sheet in which the IC is embedded; a cover film adhered to both sides of the core sheet; and a reinforcing member inserted between the cover film and the IC. The IC card according to claim 1, 2 or 3, wherein
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167706A JP2603952B2 (en) | 1987-07-07 | 1987-07-07 | IC card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167706A JP2603952B2 (en) | 1987-07-07 | 1987-07-07 | IC card |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6411895A JPS6411895A (en) | 1989-01-17 |
JP2603952B2 true JP2603952B2 (en) | 1997-04-23 |
Family
ID=15854703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62167706A Expired - Lifetime JP2603952B2 (en) | 1987-07-07 | 1987-07-07 | IC card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2603952B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000099678A (en) | 1998-09-18 | 2000-04-07 | Hitachi Ltd | Ic card and its production |
-
1987
- 1987-07-07 JP JP62167706A patent/JP2603952B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6411895A (en) | 1989-01-17 |
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