JP2522583Y2 - Jumper wire unit with heat radiation fins - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper line unit having a heat radiation fin, and more particularly to a jumper line unit having a heat radiation fin which can be overlaid or straddled on an electronic component such as an integrated circuit.

[0002]

2. Description of the Related Art In conventional electronic parts such as integrated circuits, circuit patterns are often connected by lead wires or the like. This lead wire is generally called a jumper wire, and one lead wire in at least one direction is known.

[0003]

However, in the conventional jumper line as described above, an electronic component having a large number of lead wires, such as an integrated circuit (IC) and a large-scale integrated circuit (LSI), is used. When fixing to the substrate,
Since the front and back area of the electronic component itself is relatively large, there is a problem that it is difficult to effectively use the mounting density when fixing the electronic component to a circuit board.

[0004] The number of lead wires of electronic parts has been steadily increasing with the progress of digitalization in the future. In an electronic circuit board formed in this manner, as the density increases, the number of signal lines to be connected between electronic components (between through holes) increases, and accordingly, an expensive double-sided board or multilayer board is required. It was necessary to take countermeasures such as using them or arranging many jumper wires.

[0005] The use of a double-sided circuit board or a multilayer board has a problem that the production cost increases. In addition, as the mounting density of electronic components increases, the amount of heat radiation from these electronic components has become a problem.

[0006]

SUMMARY OF THE INVENTION The present invention has been made for the purpose of solving the above-mentioned problems, and has the following arrangement as one means for solving the above-mentioned problems. That is, a jumper line unit that connects between the through holes of the electronic circuit board, wherein a surface that matches at least an upper shape of an electronic component mounted on a portion where the jumper line straddles the jumper line is formed as a lower shape, and at least an upper shape is formed. Is molded with an insulating material having good thermal conductivity and integrated into a heat radiation fin shape capable of dissipating heat generated from the electronic component.

[0007]

With the above construction, the production process can be reduced as much as possible, and the labor required for arranging jumper wires can be minimized.
Further, the types and the number of the members to be used can be made effective and simple. For this reason, even when electronic components such as ICs and LSIs are mounted and mounted on a circuit board, the substantially planar portion of the upper surface of the electronic components and the space above the electronic components are effectively used to improve the mounting density. Lines can be arranged. Also,
At the same time, the heat generated from the electronic component can be efficiently radiated.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view of an embodiment according to the present invention, FIG. 2 is a right side view of the embodiment, and FIG.
3 is a sectional view taken along the line AA of FIG. In the drawing, reference numeral 1 denotes a convex portion of a radiating fin provided at a predetermined interval above the jumper wire unit 2 of the present embodiment, and is configured to efficiently radiate heat generated from electronic components sandwiched at the lower portion. Have been. In this embodiment, a total of seven heat radiation fin protrusions are provided. Reference numeral 2 denotes a jumper wire unit formed by integrating and molding a large number of jumper wires, and reference numeral 3 denotes a jumper wire (lead wire). In this embodiment, a predetermined number of jumper wires are arranged in parallel. The number of the jumper lines can be any required number.

At the lower part of both ends of the jumper wire unit 2,
A lower projecting piece 4 for holding an electronic component corresponding to the size of the electronic component on which the jumper wire unit 2 is to be mounted.
5 is provided, and a portion 6 sandwiched between the lower projecting pieces 4 and 5 is provided.
The electronic components are tightly clamped. This jumper line unit 2
Is made by molding the jumper wire 3 with a synthetic resin or the like having good thermal conductivity and good insulation properties such as ABS resin or epoxy resin, and integrally forming a radiating fin having a convex portion 1 formed on an upper portion thereof. is there.

The jumper wire 3 may have an arbitrary cross-sectional shape such as a substantially rectangular shape or a circular shape. In this embodiment, the terminal pitch is set to about 2.54 mm in accordance with the terminal pitch of the electronic component or the like to be mounted. However, the terminal pitch may be arbitrary. In addition, the shape of the convex portion 3 of the heat radiation fin is not limited to the shape shown in FIG. 2, and may be any shape as long as it is effective in increasing the surface area.

FIG. 4 shows an example of the jumper line unit 2 of the present embodiment having the above-described configuration, which is mounted on a circuit board together with actual electronic components. FIG. 4 is a cross-sectional view of the jumper line unit 2 of the present embodiment in which the electronic component is sandwiched, taken along a plane AA in FIG. In FIG. 4, reference numeral 10 denotes a circuit board, and reference numeral 20 denotes an electronic component to be held according to the present embodiment.

Prior to mounting the jumper line unit 2 of the present embodiment, first, an electronic component is inserted into a through hole for component mounting provided on a substrate. Subsequently, the jumper line unit 2 of the present embodiment is formed on the electronic component (FIG. 4 shows an example in which an integrated circuit is mounted as an electronic component) at a portion formed between the lower projecting pieces 4 and 5. The jumper wire 3 is inserted into the through hole for the jumper wire provided outside the mounting position of the electronic component, and is pushed until the electronic component is in close contact with the upper surface of the electronic circuit component. In this state, the jumper wire 3 expands outside in the penetrated through hole. Therefore, the jumper wire unit 2 is stably fixed while maintaining the close contact state with the electronic component.

[0013] Therefore, it is only necessary to pass through a solder layer or the like and then solder and fix the substrate. As described above, according to the present embodiment, the jumper wire unit 2 can also be used as the radiator fin, and the jumper wire can be disposed on the upper surface of the electronic component. For this reason, even if the mounting density of the electronic circuit base is increased, a jumper line unit that requires little space for arranging the jumper wires and can greatly improve the mounting density can be provided.

Further, the heat generated from the electronic components straddling the jumper wire unit 2 of the present embodiment can be efficiently radiated. As described above, according to the present embodiment, the fixing of the jumper wires is complete even on a board on which electronic components such as an LSI having a large front and back surface and a large amount of heat generated by the components themselves are mounted, and It can be installed with minimal space. In addition, the problem of heat radiation of the electronic component generating a large amount of heat can be solved at the same time.

As described above, according to this embodiment, the number of production steps can be reduced as much as possible, the labor required for arranging jumper wires can be minimized, and the types and number of members used can be made effective and simple. be able to. Therefore, IC, LSI
When at least one and at least one electronic component such as the electronic component is mounted and mounted on a circuit board by a TAB (tape aided bonding) method or the like, a substantially flat portion on the upper surface of the electronic component and the upper portion thereof The space area can be effectively used for improving the mounting density, and the heat generated from the electronic components can be efficiently radiated.

[0016]

[Effects of the Invention] As described above, according to the present invention, the production process can be reduced as much as possible, the labor required for arranging jumper wires can be minimized, and the type and number of used members can be effectively and simply reduced. can do. Therefore, IC, LSI
Even when such electronic components are mounted and mounted on a circuit board, the jumper wires can be disposed by effectively utilizing the substantially planar portion of the upper surface of the electronic component and its upper space region for improving the mounting density. In addition, the amount of heat generated from the electronic component can be efficiently radiated.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of an embodiment according to the present invention;

FIG. 2 is a right side view showing the configuration of the present embodiment;

FIG. 3 is a sectional view taken along the line AA of FIG. 1;

FIG. 4 is a diagram showing a state where the present embodiment is mounted on an actual board together with electronic components.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Convex part 2 Jumper wire unit 3 Jumper wire 4, 5 Lower projecting piece 10 Substrate 20 It is an electronic component.

Claims (1)

(57) [Scope of request for utility model registration] 1. A jumper line unit for connecting between through holes of an electronic circuit board, wherein at least a surface conforming to at least an upper shape of an electronic component mounted on a portion where the jumper line straddles the jumper wire has a lower shape. A jumper wire unit with a heat radiation fin, characterized in that at least the upper part is molded with an insulating material having a good thermal conductivity integrated into a heat radiation fin shape capable of dissipating heat generated from the electronic component.