JP2519970B2 - Method for manufacturing mask for ROM-type optical recording card, method for manufacturing ROM-type optical recording card, inspection method therefor, mask inspection apparatus, and inspection apparatus for ROM-type optical recording card - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method of manufacturing a mask used for manufacturing an optical recording medium, particularly a ROM type optical recording card.

In recent years, cards recording various information such as ID cards, cash cards, and bank cards have become widespread, and the mask of the present invention is used for such a ROM type optical recording card.

[Prior Art] It is necessary to record various information such as personal data and data of the issuing company on this kind of card, and at the initial stage, such information is recorded with visible characters or symbols. Also, in the latter stage, it is recorded by an electric signal using magnetism, but it is necessary to cope with the prevention of forgery and falsification and the increase in the amount of information.

Therefore, in recent years, an optical recording card applying a laser technique has been developed. This optical recording card has an information recording medium (optical recording medium) having an optical reflection surface,
Data pits are formed on the optical reflection surface, and the data pits are detected by the laser based on the difference in optical reflectance of the data pits, and the information is read.

By the way, in an optical recording medium, a data pit pattern expressing data, a track guide groove for performing tracking at the time of writing and reading the data, an address portion indicating a position of each sector of each track, a usage state, and the like are shown. A pre-formatting pattern is required, and these pre-formatting pattern and data pit pattern are formed in advance on the optical recording medium in a form that cannot be written and erased.

As one of the data reading means of the optical recording medium, there is a method of comparing the intensities of reflected light. Then, as one of the techniques for manufacturing an optical recording medium suitable for it, a photo-etching technique is applied to process the pre-formatting pattern and the data pit pattern as a mask, and the pre-formatting pattern and the data pit pattern are made of a reflective metal or the like. There is a method of forming high and low reflectance by forming the pattern. There are various types of masks, from a standard mother mask to a working mask used when an actual optical recording medium is produced in a factory. Conventional photomasks used when manufacturing these masks. The manufacturing process is as shown in FIG.

That is, an original is created by an artwork 112 based on a specification 111 that describes the specifications of an optical recording medium, and the original is reduced by a reduction camera 113 to create an emulsion-type or hard-type reticle (intermediate mask) 114. .

This reticle (intermediate mask) 114 is used as a photo repeater 115.
Thus, the master mask 120 is created by stenciling the original drawing from 10 times to 5 times drawn on the reticle (intermediate mask) 114 while reducing it to 1/10 or 1/5. The master mask 120 is printed to obtain the working mask 116.

Alternatively, CAD input 117 is performed based on the specifications 111 to create a magnetic tape 118, and the pattern generator 121 is used as an input medium to automatically expose a variable rectangle on a high resolution dry plate (HRP) at high speed and with high accuracy. By doing so, the reticle 114 is created, and the working mask 116 is obtained through the above-described steps.

Further, the master mask 115 is created by the electron beam exposure device 122 using the magnetic tape 118 as an input medium, and the working mask 116 is obtained through the above-described steps.

[Problems to be Solved by the Invention] If the content of information to be stored in the ROM type optical recording medium is different, it is necessary to deal with each. Therefore, when manufacturing a ROM-type optical recording medium, it is necessary to manufacture those having an individual pit pattern for each card specification (software corresponding to each type of card). (Compatible with software), because an expensive mother mask was created for each, the mother mask of the ROM type optical recording medium has become expensive. Further, conventionally, when manufacturing a mask of this ROM type optical recording medium, an electron beam or a pattern generator or the like is used as the exposure means, but when the amount of information is large, the data processing time and the exposure time are long. In addition, the inspection process of the mother mask requires a lot of time, which is one of the reasons for increasing the price of the mask. Furthermore, the method using artwork is extremely complicated.

The present invention has been made in view of the above circumstances and is capable of processing data by a read / write device for a writable optical recording card and is inexpensive.
An object of the present invention is to provide a method of manufacturing a mask suitable for manufacturing a ROM type optical recording medium.

[Means for Solving the Problems] Therefore, a method for producing a working mask for a ROM-type optical recording card according to the first aspect of the present invention is a method for producing a working mask for a ROM-type optical recording card containing data. A mother mask manufacturing step of forming a mother mask having a formatting pattern, and obtaining a control symbol from the pre-formatting pattern on a master mask substrate on which the pre-formatting pattern is transferred, and forming a data pit pattern by laser irradiation to form a master. The method is characterized by including a master mask manufacturing step of manufacturing a mask and a working mask manufacturing step of manufacturing a working mask in which the pre-formatting pattern and the data pit pattern are transferred from the master mask.

A method for producing a mother mask for a ROM-type optical recording card of the second invention is a method for producing a mother mask for a ROM-type optical recording card, which is a resist coating step of coating a hard mask blanks with an electron beam resist. An exposure step of irradiating the electron beam resist with an electron beam according to the shape of a pre-formatting pattern, a developing step of developing the electron beam resist, and an etching step of etching the hard mask blanks. And a removing step of removing the electron beam resist from the hard mask blanks.

A method for producing a mother mask for a ROM-type optical recording card of the third invention is a method for producing a mother mask for a ROM-type optical recording card, which comprises a resist coating step of coating a hard mask blanks with a photoresist, Next, an exposure step of irradiating the photoresist with light according to the shape of a pre-formatting pattern, a developing step of developing the photoresist, an etching step of etching the hard mask blanks, and then the hard mask. And a removing step of removing the photoresist from the blanks.

The method for producing a mother mask for a ROM-type optical recording card according to a fourth aspect of the present invention is a method for producing a mother mask for a ROM-type optical recording card, in which a high-resolution photographic plate is shaped according to the shape of a pre-formatting pattern. And an exposure step of irradiating the high-resolution photographic plate, and a developing step of developing and fixing the high-resolution photographic plate to form an emulsion mask,
On the other hand, a resist coating step of coating the hard mask blanks with a photoresist, an exposure step of exposing the emulsion mask to the emulsion mask, and a developing step of developing the photoresist, The method is characterized by including an etching step of etching the hard mask blanks, and then a removing step of removing the photoresist from the hard mask blanks.

A method for producing a mother mask for a ROM-type optical recording card according to a fifth aspect of the present invention is a method for producing a master mask for a ROM-type optical recording card, which is a master mask blank in which a metal film is formed on a base material. A resist coating step of coating a photoresist on the metal film, an exposure step of exposing a mother mask having a pre-formatting pattern over the photoresist, a developing step of developing the photoresist, the master mask blanks And an etching step of etching the metal film, and a removing step of removing the photoresist from the metal film.

The method for producing a master mask with data for ROM type optical recording card of the sixth invention is a method for producing a master mask with data pit pattern for ROM type optical recording card, in which a pre-formatting pattern is transferred onto the surface. An optical recording film forming step of forming an optical recording film on the surface of the master mask substrate, and a writing step of punching the optical recording film corresponding to the data pit pattern by laser irradiation according to a pre-formatting pattern, and The method further includes an etching step of etching the master mask substrate, and a remove step of removing the optical recording film from the master mask substrate.

Further, a method for producing an optical recording card of a seventh invention is a method for producing an optical recording card in which a data pit pattern is formed between a card front substrate and a card back substrate which are bonded and bonded together, A mother mask manufacturing step of creating a mother mask having a pre-formatting pattern, and a control signal is obtained from the pre-formatting pattern on the master mask substrate on which the pre-formatting pattern is transferred to form a data pit pattern by laser irradiation. A master mask manufacturing process for manufacturing a master mask,
RO including a working mask manufacturing process for manufacturing a working mask in which the pre-formatting pattern and the data pit pattern are transferred from the master mask
It is characterized in that the data pit pattern is formed by transferring the data pit pattern of the working mask produced by the method for producing a working mask for an M-type optical recording card by etching or lift-off.

Further, in the method for manufacturing an optical recording card of the eighth invention, the data pit pattern and the hologram pattern are formed by superposing at least a part of each other between the card front substrate and the card back substrate which are bonded and adhered. A method for producing an optical recording card, comprising a mother mask producing step of producing a mother mask having a pre-formatting pattern, and obtaining a control symbol from the pre-formatting pattern on a master mask substrate on which the pre-formatting pattern is transferred. Master mask forming step of forming a data pit pattern by laser irradiation to form a master mask, and a working mask forming step of forming a working mask in which the pre-formatting pattern and the data pit pattern are transferred from the master mask. ROM type optical recording card The control data pit pattern of the working mask manufactured by the method for manufacturing a working mask is transferred by etching or lift-off is characterized by forming said data pit pattern.

The mask inspecting method of the ninth invention is a mask inspecting method having at least the same pre-formatting pattern and data pit pattern as the writable optical recording card, and is controlled by a control signal obtained from the pre-formatting pattern. Controlling a read / write device of a writable optical recording card to read the data pit pattern of the mask, and comparing the read data pit pattern with ROM data information based on a card specification by a computer. There is.

A mask inspection apparatus according to a tenth aspect of the invention is a mask inspection apparatus having at least the same pre-formatting pattern and data pit pattern as the writable optical recording card, and is controlled by a control signal obtained from the pre-formatting pattern. Controlling a read / write device of a writable optical recording card to read the data pit pattern of the mask, and comparing the read data pit pattern with ROM data information based on a card specification by a computer. There is.

The inspection method of the ROM type optical recording card of the eleventh invention is
A method for inspecting a ROM type optical recording card having at least the same pre-formatting pattern and data pit pattern as a writable type optical recording card, wherein the writable type optical recording card is read by a control signal obtained from the pre-formatting pattern. The writing device is controlled to read the data pit pattern of the ROM type optical recording card, and the computer compares the read data pit pattern with the ROM data information based on the card specifications.

The inspection device for the ROM type optical recording card of the twelfth invention is
A ROM type optical recording card inspection device having at least the same pre-formatting pattern and data pit pattern as a writable type optical recording card, wherein the writable type optical recording card is read by a control signal obtained from the pre-formatting pattern. The writing device is controlled to read the data pit pattern of the ROM type optical recording card, and the read data pit pattern and ROM data information based on card usage are compared by a computer.

[Operation] In the present invention, a pre-formatting pattern is formed on the mother mask. The pre-formatting pattern is drawn by electron boom irradiation and etching,
Alternatively, it is formed by drawing and etching on the hard mask blanks by a pattern generator or drawing on the emulsion mask blanks by a pattern generator and exposing and etching on the hard mask blanks. The master mask is manufactured by writing a data pit pattern of information data on a master mask base material on which a pre-formatting pattern is transferred from a mother mask and obtaining a control signal from the pre-formatting pattern.

The working mask is prepared by copying the pre-formatting pattern and the information data pit pattern from the master mask by photolithography. The optical recording medium of the optical recording card is prepared by copying the pre-formatting pattern and the data pit pattern from the working mask by photolithography. In the manufacturing process of each of the mother mask, the master mask base material, the master mask, the working mask, and the optical recording medium for the optical recording card, an inspection device is inspected as necessary. The inspection of the mask and ROM type optical recording card having the same pre-formatting pattern and data pit pattern as the possible optical recording card was read by reading the information of the data pit pattern written by the control signal obtained from the pre-formatting pattern. Reads ROM information data (data stored in the external storage device in the MT or FD state) based on the information and card specifications (software corresponding to each type of card) and compares it bit by bit on the computer Then, the mask and the ROM type optical recording card are inspected.

[Example] When mass-producing a ROM type optical recording medium, the mask actually used for the work is a working mask.

Therefore, firstly, the working mask manufacturing method
The figure will be described.

First, a writable type optical recording type pre-formatting pattern is formed into a hard mask to form a mother mask (mother mask manufacturing step (FIG. 1A)). The pre-formatting pattern consists of guide patterns, control patterns such as track number pits, and the like.

Next, the pre-formatting pattern of the mother mask is transferred to the highly reflective film of the mask blank having a highly reflective film formed on a substrate such as glass by etching or the like to prepare a master mask substrate (master mask). Substrate production process (FIG. 1 (b))).

Next, on the master mask substrate on which the pre-formatting pattern is transferred, the control signal is obtained by the pre-formatting pattern, and the encoded information data is drawn as a data pit pattern by laser irradiation while performing tracking and focusing (drawing step ( Fig. 1 (c))).

Next, the master mask base material is patterned by development etching or the like to fabricate a master mask (master mask fabrication step (FIG. 1D)).

Next, the inspection device obtains a control signal from the pre-formatting pattern to perform tracking and focusing, reads (detects) the data pit pattern information written by the inspection device, and reads the read information and the ROM information data bit by bit. Then, the written data pit pattern is inspected.

Next, a working mask is produced by transferring the pre-formatting pattern and the data pit pattern from the master mask (working mask producing step (FIG. 1 (e))).

The working mask is used for manufacturing an optical recording card (Fig. 1 (f)).

At the final stage of each step, inspection steps (g) to (l) are added as needed. In the inspection steps (g) to (l), the inspection device obtains a control signal or the like from the pre-formatting pattern to perform tracking and focusing, and the information of the data pit pattern written by the inspection device is (detected) read and read. The written data pit pattern is inspected by comparing the ROM information data bit by bit.

Secondly, a method for manufacturing a mother mask will be described with reference to FIG.

First, hard mask blanks 9 are prepared. As the hard mask blank, a low reflection chrome mask blank in which a light shielding film 12 such as a low reflection chrome is formed on a substrate 11 such as glass, for example, LUCOAT PFL manufactured by ULVAC Film Co., Ltd.
−5009 (s) L is used (FIG. 2 (a)).

In addition, soda lime blue (blue plate glass), soda lime white (white plate glass), low expansion glass, and synthetic quartz can be used as the glass material for the hard mask, and the film material is a Cr single-layer film. , Cr / CrXOy 2
A layer film and a three-layer film of CrXOy / Cr / CrXOy can be used.

The electron beam resist 13 is coated (FIG. 2 (b)). As a specific example, Tokyo Ohka Kogyo Co., Ltd. OE
BR series positive resist OEBR-1030 at 3000 rpm for 90 seconds
Spin coat and pre-bake at 170 ° C for 30 minutes. The film thickness is about 0.3 μm.

The electron beam resist 13 has a positive type and a negative type,
The positive type includes methacrylic resin and polyolefin sulfone, and the negative type includes epoxy polymer and silicone resin.

Next, an electron beam is irradiated (FIG. 2 (c)). As a specific example, an electron beam exposure apparatus Perkin Elmer Co., Ltd.
Mavis III etc. are used (Mavis series). Generally, CAD is used to input electron beam drawing data. It is also possible to prepare a magnetic tape in which data is written in the format so that the electron beam exposure apparatus is directly operated, and input by this. The data input here is pre-formatted data such as guides and data track numbers on the optical recording card.

Next, the electron beam resist 13 is developed (FIG. 2 (d)). As a specific example, Tokyo Ohka Kogyo Co., Ltd. OE
BR-1030 dedicated developer OEBR-1030DE is kept at 25 ℃ and developed for 15 minutes.

Next, the chromium film is etched (FIG. 2 (e)). As a specific example, etching is performed by immersing in an etching solution, 240 g of ceric ammonium nitrate, 60 cc of perchloric acid (70%), and 1000 cc of pure water for 50 seconds.

As a product, there is Chromium Etchant K, Nagase & Co., Ltd.

Finally, the resist is peeled off (FIG. 2 (f)). A specific example is Tokyo Ohka Kogyo Co., Ltd. stripper 502 at 100 ° C, 10
After immersing in min to remove the resist, rinse with a solvent in which acetone and methanol are mixed at a volume ratio of 1: 1.

In this way, the mother mask 2 having the pre-formatting pattern 14 and the guide is completed (FIG. 2 (g)).

Thirdly, another method for producing a mother mask will be described with reference to FIG.

First, hard mask blanks 9 are prepared (FIG. 3 (a)). As an example of hard mask blanks, low reflection chrome mask blanks (manufactured by ULVAC Coating Co., Ltd.)
LUCOAT PFL-5009 (S) L) is used.

Next, the photoresist 23 is spin-coated (FIG. 3 (b)). As an example of the photoresist, a positive photoresist AZ1350 / SF manufactured by Hoechst Co. is spin-coated at 3000 rpm for 60 seconds to form a resist film. When prebaked at 85 ° C for 20 minutes and cooled, the film thickness becomes about 0.5 μm.

Next, the photoresist is exposed by the light 24 of the mercury lamp by the pattern generator according to the desired preformat pattern (FIG. 3 (c)).

NSK LZ-340 is used for the pattern generator, and 18
Rectangles are exposed one shot at a time under the condition of 0 mJ / cm ² .

The data of the pre-format pattern is input by a CAD system, etc., and the content of the data is mainly data for control such as guides and data numbers.

Next, the photoresist 23 is developed (FIG. 3 (d). To develop the photoresist AZ 1350 / SF, an AZ 312MIF developer diluted with pure water to a volume ratio of 1: 1 is used. About 30 seconds After immersion, it is washed with pure water.

Next, the chromium film 25 of the hard mask blanks 9 is etched (FIG. 3 (e)). Chrome Etchant K from Nagase & Co., Ltd. can be used as the etching solution. Chromium is etched by immersion for about 50 seconds. Then, it is washed with pure water.

Next, the photoresist 23 is peeled off (FIG. 3 (f)).
AZ thinner can be used for the photoresist AZ 1350 / SF. After immersing the resist in AZ thinner for about 5 minutes to dissolve the resist, rinse it with AZ thinner prepared separately,
dry.

 Thus, the mother mask 2 is completed.

Fourth, another mother mask manufacturing method will be described with reference to FIG.

First, a high resolution photo plate 26 is prepared. Konica HRP UT is used as an example (Fig. 4 (a)).

Next, the photographic dry plate 26 is exposed to light 24 (FIG. 4 (b)).
LSK-340, an NSK company, is used as an exposure device for the photo dry plate 26, and a rectangular pattern is exposed by a 100 kV xenon flash. Each shot is exposed according to the preformat pattern data.

Next, develop and fix the photographic plate, and then use the emulsion mask 27
Is prepared (FIG. 4 (c)).

Developer: Konica HRP developer CDH-100 1: 4 diluted with pure water Development time: 5 minutes at 20 ° C Water wash: Running water 17 ° C 30 seconds Fixer: Konica HRP fixer CFL-X Fixing time: 3 minutes wash at 20 ° C : Running water 17 ° C for 10 minutes After developing and fixing under the above conditions, drain and air dry thoroughly.

Next, a layer of photoresist 23 is formed on the low reflection chrome mask blank 9 (FIG. 4 (d)). LUCOAT made by ULVAC Coating Co., Ltd. for low reflection chrome mask blanks
PFL-5009 (S) L is used.

The photoresist was spin-coated using Shipley Microposit (registered trademark) S1400-17 at 3000 rpm for 30 seconds, and prebaked at 90 ° C. for 15 minutes to obtain about 0.5.
The film thickness is μm.

Next, the emulsion mask 27 is brought into close contact, and the light of the mercury lamp is exposed at 10 mJ / cm ² (FIG. 4 (e)).

Next, the photoresist 23 is developed (FIG. 4 (f)).
Developer is Microplay Co., Ltd. (registered trademark)
Developer MF-312 diluted with pure water to a volume ratio of 1: 1 can be used for 30 seconds for development. Then, it is washed with pure water.

Next, the chromium film 25 of the hard mask blanks 9 is etched (FIG. 4 (g)). Chromium etchant K manufactured by Nagase & Co., Ltd. is used as an etching solution. When it is immersed for about 50 seconds, chromium is etched and a pattern is formed. After the etching is finished, it is washed thoroughly with water and drained.

Next, the photoresistor 23 is peeled off (FIG. 4 (h)).
For stripper, Tokyo Ohka Kogyo Co., Ltd. Stripper 10 80 ℃
After heating, soak for 60 seconds, wash thoroughly with pure water, and dry.

 Thus, the mother mask 2 is obtained.

A method for producing the master mask substrate will be described with reference to FIG.

First, a glass plate 21 having a clean surface is prepared (FIG. 5 (a)). As the glass plate, blue plate, white plate, low expansion, synthetic quartz, glass, etc. used for hard mask blanks are used. The surface flatness is selected with reference to pattern accuracy and the like. A good thickness is 0.09 "or 0.05".

Next, a highly reflective and light-shielding metal 16 such as Al, Cr, Ni, Co, Ag, Au, Cu and Ti is sputtered (FIG. 5 (b)). When the film thickness is about 700Å, the reflectance is about 90% or more for Al and about 50 to 60% for Cr in the near infrared region.

The sputtering system first reduced the pressure to 1 × 10 ^-5 Torr,
Ar gas was introduced to adjust the pressure to 1 × 10 ⁻³ Torr. The film is formed by magnetron sputtering at an evaporation rate of 10Å / sec. When Cr is used as the highly reflective and light-shielding metal, the steps shown in FIGS. 5A and 5B can be replaced with commercially available chromium hard mask blanks.

The following description will be made on the case where the metal 16 having high reflectivity and light shielding property has a film thickness of Cr of 700Å (the case of the Cr reflective film 16).

Next, a photoresist 23 is coated (FIG. 5 (c)). For example, Shipley Microposit (registered trademark) positive resist S1400-17 is spin-coated at 3000 rpm for 60 seconds and dried at 90 ° C. for 15 minutes to obtain a resist film of about 0.5 μm.

Next, a mask 17 on which a pre-format pattern for a writable optical recording card, which has been prepared in advance, is adhered, and the light of a high pressure mercury lamp is exposed at 4 mJ / cm ² (FIG. 5 (d)).

 Next, the resist 23 is developed (FIG. 5 (e)).

For example, the Shipley Microposit (registered trademark) positive resist S1400-17 can be developed by dipping the Shipley Microposit (registered trademark) MF-312 in a developer diluted with pure water at a volume ratio of 1: 1 for about 30 seconds. .

Next, the Cr reflection film 16 is etched (FIG. 5 (f)).
Chromium etchant K, Nagase & Co., Ltd. is used as an etching solution. When the etchant is kept at 20 ° C and immersed for about 60 seconds, the chrome film is etched and the preformat pattern of the mother mask is transferred.

In the case of an Al film, H ₃ PO ₄ + CH ₃ COOH + HNO ₃ + H ₂ O (capacity ratio 16: 2: 1: 1) can be used as an etchant.

Finally, the resist film is peeled off (FIG. 5 (g)). Tokyo Ohka Kogyo Co., Ltd. Heat stripper 502 to 100 ° C for 5 min
The resist peels off when immersed. After that, rinsing is performed by immersing in a solvent of acetone and methanol (volume ratio 1: 1).

Thus, the master mask substrate 20 having the pre-formatting pattern is completed.

Sixth, a method for producing a master mask containing data will be described with reference to FIG.

First, a master mask base material 20 on which a pre-formatting pattern is formed is prepared (FIG. 6 (a)). This has been previously subjected to the step of preparing a master mask substrate (FIG. 5). The following description will be made assuming that the reflective film made of a metal having a high reflective property and a light blocking property in the mask is Cr (in the case of the Cr reflective film 16).

Next, an optical recording film composed of a dye and a resin is formed on the Cr reflection film 16.
31 is formed (FIG. 6 (b)). It is necessary to use a dye that absorbs the laser beam in the next process well. The resin should withstand the acid of the etching process. For this purpose, an ordinary binder for an optical recording film composed of dye and resin can be used.
Regarding the compounding ratio of the dye and the resin, with respect to the dye 1, the resin 1 or more has good acid resistance.

For example, a dye having a large absorption at a semiconductor laser of 830 nm IR-8201 part of Nippon Kayaku Co., Ltd., Taihei Chemical Co., Ltd. Nitrocellulose H1 / 8 3 parts, 75 parts of cyclohexanone, 75 parts of 1,2-dichloroethane are mixed. To use. When this is spin-coated at 1000 rpm for 60 seconds, the film thickness becomes about 2600Å. When the absolute reflectance of the chromium film is 52% for the light of wavelength 830 nm, the reflectance of the chromium portion and the glass portion as viewed from the dye film surface (optical recording film 31) side are 17% and 5%, respectively.
become. At this time, since light interference occurs due to the optical recording film 31 and the chrome film, the film thickness of the optical recording film 31 is not appropriately selected according to the type of resin, the type of dye, the ratio of the resin and the dye, and the material of the reflective film. Then, the chrome portion and the glass portion viewed from the dye film surface side may read and contrast in writing light may not be obtained.

Next, using the pre-formatting pattern formed on the master mask substrate 20, auto tracking,
The data pits are written by encoding using the software of the writable optical recording card while performing autofocusing and the like (FIG. 6 (c)).

In the case of the dye film, when the semiconductor laser light of 830 nm is focused on the spot of 5 μm, it can be performed by irradiating the energy of 20 μsec at 8 mW, for example.

The written data pit 32 is etched (FIG. 6 (d)).

The chromium film is exposed at the pit portion written in the previous step, and the other portion is covered with the dye film. Therefore, if it is dipped in an etching solution, the dye film can be substituted for the resist film to perform etching.

When using a chrome mask, the etchant is nitric acid No. 2 above.
Cerium ammonium 240g, perchloric acid (70%) 60cc, pure water (20 ± 1 ° C) 1000cc is immersed for 90 seconds for etching.

As a product, there is Chromium Etchant K, Nagase & Co., Ltd.

800c phosphoric acid as an etchant for aluminum masks
c, nitric acid 50cc, acetic acid 100cc, pure water 50cc can be used.

The remaining optical recording film is removed (FIG. 6 (e)). That is, the dye film used as the optical recording film is removed with a solvent.

In the case of the example, if it is immersed in acetone, it dissolves in about 10 seconds. Then, the surface is washed by rinsing with another acetone.

As a result, the master mask 33 containing the data pit 32 and the pre-formatting pattern 14 is completed (FIG. 6 (f)).

If necessary, the master mask 33 which has been completed after etching and removal is inspected (FIG. 6 (g)).

[Effect] In the mask manufacturing method of the present invention, a control pit,
If the pattern of information pits, guides, etc. and the logical structure for reading and writing data are the same as the writable optical recording card, a reader for writable optical recording card
Since the writer can be used as a card inspection device and a mask inspection device, the inspection in the card manufacturing process and the mask manufacturing process can be easily performed without requiring another inspection device. Also, a reader / writer system for a writable optical recording card can be used as a data drawing device. Further, the reader / writer for the writable optical recording card can be used as the reader for the ROM type optical recording card. As a result, the manufacturing cost of the data-containing mother mask can be reduced, the manufacturing process of the data-containing mother mask can be simplified, and eventually, it is possible to meet the demand for the production of a large variety of optical recording cards in a small lot. . As described above, in the mask of the present invention, the shape, size, arrangement of the preformat pattern and the data pit pattern of the ROM type optical recording medium,
Since the logical structure is the same as that of the writable optical recording card, the ROM type optical recording medium manufactured by using this mask can be read by the writable optical recording card reader. Moreover, it is possible to easily and inexpensively manufacture an information-containing mask for a ROM type optical recording medium card or the like by using a pre-formatting pattern of a writable type optical recording type. Moreover, it is only necessary to manufacture a master mask containing arbitrary information data for each product lot, and it is not necessary to manufacture an expensive mother mask for each product lot, so it is possible to manufacture optical recording media (cards, etc.) at low cost. Can be done.
Although not shown, the inspection device is configured by a combination of a writing / reading device for a writable optical recording card, a personal computer as an inspection and ROM information writing control device, and its external storage device.

[Other Embodiments] Next, a method of manufacturing a card having an optical recording medium manufactured using the working mask 5 of the present invention will be described.

In FIG. 7, FIG. 8, FIG. 9 and FIG. 10, 41 is an optical recording card, and the optical recording card 41 is between two card base materials, that is, a card front base material 42 and a card back base material 43. In the optical recording section 45 is provided. The card front substrate 42 is made of a transparent and highly smooth resin such as polycarbonate, polymethylmethacrylate or epoxy, and the card back substrate 43 is made of a resin material such as vinyl chloride, polycarbonate or polyethylene terephthalate. There is.

The working mask 5 of the present invention is used to form the optical recording portion 45.

Next, a method of manufacturing various optical recording cards will be described.

First, FIG. 11 shows a method of forming an optical recording card 41a by directly forming an information pattern on a card surface base material with a metal reflection film.

(1) First, as shown in FIG. 11, a transparent card surface base material 42 of polycarbonate having a thickness of 0.40 mm is prepared (FIG. 11 (a)).

(2) Next, an acrylic-silicone resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied on the outer surface of the card surface base material 42 by a roll coating method so that the dry film thickness becomes about 5 μm, and the hard coat layer 46. Are formed (FIG. 11 (b)).

(3) Next, an acrylic-silicone resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied to the inner surface of the card surface base material 42 by a roll coating method so that the dry film thickness becomes about 5000 Å, and the anchor layer 47 is formed. It is formed (Fig. 11 (c)).

(4) Next, an aluminum film 48a is vacuum-deposited on a portion of the card surface base material 42 corresponding to the optical recording portion 45, and a film having a vacuum degree of 2 × 10 ⁻⁵ Torr and a vapor deposition rate of 20 Å / sec is about 1000 Å. It is formed to be thick (FIG. 11 (d)).

(5) Next, a photoresist, Microposit (registered trademark) S1400-17 of Shipley Co., Ltd. is applied on the aluminum coating 48a of the card surface base material 42 by a spinner at 3000 rpm for 30 seconds to obtain a dry film thickness of about 5000 Å. After obtaining the coating film, 90 ℃, 1
Prebaking is performed for 5 minutes to form the resist layer 51 (first
Figure 1 (e)).

(6) Next, the working mask 5 on which a desired optical recording pattern is formed is brought into close contact with the resist layer 51 of the card front substrate 42, and exposed at 4 mJ / cm ² using a high pressure mercury lamp to form an optical recording pattern layer. 51b is formed (FIG. 11 (f)).

(7) Next, the resist layer 51 of the card surface base material 42 is developed for 30 seconds with a developer prepared by diluting 1 part of the developer MF-312 of Shipley Co. with 1 part of pure water, and rinsed with pure water. Perform thoroughly and dry (Fig. 11 (g)).

(8) Next, 16 parts of phosphoric acid, 2 parts of acetic acid, 1 part of nitric acid, and 1 part of pure water were mixed and stirred, and the aluminum film 48a of the card surface substrate 42 was used as a mask at the optical recording pattern layer 51b at 35 ° C. using an etching solution. The aluminum coating 48a is etched by immersing it in the etching solution for 50 seconds to form an aluminum pattern 48b, followed by washing with pure water and drying (FIG. 11 (h)).

(9) Next, re-exposure is carried out at 100 mj / cm ² to improve the strippability of the photoresist on the card surface substrate 42, 1 part of the stripping solution 10 from Tokyo Ohka Kogyo Co., Ltd. is prepared and diluted with 3 parts of pure water. The card surface base material 42 is dipped in the prepared solution for 1 to 2 seconds to form an optical recording pattern layer 51.
Peel off b, immediately wash thoroughly with pure water and dry (Fig. 11 (i)).

(10) Next, on a card backing material 43 of a vinyl chloride sheet having a desired design and a thickness of 0.35 mm, an adhesive layer 52 made of a urethane-based thermoplastic adhesive is previously formed on the inner surface to a dry film thickness. It is applied by a roll coating method so as to have a thickness of 5 μm, and the inner surfaces of the card front base material 42 and the card back base material 43 are overlapped,
Bonding is performed by hot pressing at 90 ℃ and 15Kg / cm ² for 10 minutes.
Figure (j)).

(11) Next, cutting is performed in a normal card shape (Fig. 11 (k)).

(12) Thus, the optical recording card 41a is completed (FIG. 11 (l)).

Next, FIG. 12 shows a preparation method in the case of forming an optical recording card 41b by directly forming an information pattern by a metal reflection film after providing a hologram pattern on the card front substrate by stamping or the like.

(1) First, as shown in FIG. 12, a transparent card surface base material 42 of polycarbonate having a thickness of 0.40 mm is prepared (FIG. 12 (a)).

(2) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied to the outer surface of the card surface base material 42 by a roll coating method so that the dry film thickness is about 5 μm, and the hard coat layer 46 is formed. Are formed (FIG. 12 (b)).

(3) A mold having a hologram pattern 53 is applied to a portion of the card front substrate 42 corresponding to the optical recording portion forming area.
The hologram pattern 53 is formed on the inner surface side of the card front substrate 42 by hot pressing at 250 ° C. and 10 Kg / cm ² for 1 minute (FIG. 12 (c)).

(4) Next, the aluminum film 48a is vacuum-deposited on the hologram pattern 53 of the card front substrate 42 to a film thickness of about 1000Å at a vacuum degree of 2 × 10 ^-5 Torr and an evaporation rate of 20Å / sec. (FIG. 12 (d)).

(5) Next, a photoresist, Microposit (registered trademark) S1400-17 of Shipley Co., Ltd. is applied on the aluminum coating 48a of the card surface base material 42 by a spinner at 3000 rpm for 30 seconds to obtain a dry film thickness of about 5000 Å. After getting the coating, 90 ℃, 1
Prebaking is performed for 5 minutes to form the resist layer 51 (first
2 (e)).

(6) Next, the working mask 5 on which a desired optical recording pattern is formed is brought into close contact with the resist layer 51 of the card front substrate 42, and exposed at 4 mJ / cm ² using a high pressure mercury lamp to form an optical recording pattern layer. 51b is formed (FIG. 12 (f)).

(7) Next, the resist layer 51 of the card surface base material 42 is developed for 30 seconds with a developer prepared by diluting 1 part of the developer MF-312 of Shipley Co. with 1 part of pure water, and rinsed with pure water. Perform thoroughly and dry (Fig. 12 (g)).

(8) Next, 16 parts of phosphoric acid, 2 parts of acetic acid, 1 part of nitric acid, and 1 part of pure water were mixed and stirred, and the aluminum film 48a of the card surface substrate 42 was used as a mask at the optical recording pattern layer 51b at 35 ° C. using an etching solution. The aluminum coating 48a is etched by immersing it in the etching solution for 50 seconds to form an aluminum pattern 48b, followed by washing with pure water and drying (FIG. 12 (h)).

(9) Next, in order to improve the releasability of the photoresist on the card surface base material 42, re-exposure is carried out at 100 mJ / cm ² , 1 part of the stripping solution 10 from Tokyo Ohka Kogyo Co., Ltd. is prepared and diluted with 3 parts of pure water. The card surface base material 42 is dipped in the above solution for 1 to 2 seconds, the resist layer 51 is peeled off, and immediately washed with pure water sufficiently to dry it.
Figure 12 (i)).

(10) Next, on a card backing material 43 of a vinyl chloride sheet having a desired design and a thickness of 0.35 mm, an adhesive layer 52 made of a urethane-based thermoplastic adhesive is previously formed on the inner surface to a dry film thickness. It is applied by a roll coating method so as to have a thickness of 5 μm, and the inner surfaces of the card front substrate 42 and the card back substrate 43 are overlapped with each other,
Bonding is performed by hot pressing at 90 ℃ and 15Kg / cm ² for 10 minutes.
Figure (j)).

(11) Next, cutting is performed in a normal card shape (Fig. 12 (k)).

(12) Thus, the optical recording card 41b is completed (Fig. 12 (l)).

As a method of creating the hologram pattern, the 2P method (photopolymer method) can be used in addition to the above.

Next, a method for creating an optical recording card 41c provided with an information recording layer in which a metal reflective film is directly patterned after forming an information pattern with a dye having absorption of ultraviolet rays and infrared rays on a card surface substrate is described below. Shown in Figure 13.

(1) First, as shown in FIG. 13, a transparent card surface base material 42 of polycarbonate having a thickness of 0.40 mm is prepared (FIG. 13 (a)).

(2) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied to the outer surface of the card surface base material 42 by a roll coating method so that the dry film thickness is about 5 μm, and the hard coat layer 46 is formed. Are formed (FIG. 13 (b)).

(3) Next, an acrylic-silicone resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied to the inner surface of the card surface base material 42 by a roll coating method so that the dry film thickness becomes about 5000 Å, and the anchor layer 47 is formed. It is formed (Fig. 13 (c)).

(4) Next, Infrared absorption dye CY-20 from Nippon Kayaku Co., Ltd. 1 part Screen process ink medium S8-800 from Toyo Ink Mfg. Co., Ltd. 20 parts 5 parts thinner S718 screen process ink from Toyo Ink Mfg. Co., Ltd. , A desired optical recording layer 54b having a dry film thickness of about 2 μm is formed on the card surface base material 42 by silk screen printing on the card surface base material 42 with the mixed ink (FIG. 13 ( d)).

(5) Next, the aluminum film 48a is vacuum-deposited on the optical recording layer 54b of the card surface base material 42 to form a vacuum degree of 2 × 10.
^It is formed to have a film thickness of about 1000Å at ^-5 Torr and an evaporation rate of 20Å / sec (Fig. 13 (e)).

(6) Next, on the aluminum coating 48a of the card surface base material 42, a photoresist of Shipley Co., Ltd., Microposit (registered trademark) S1400-17 was applied by a spinner at 3000 rpm for 30 seconds to obtain a dry film thickness of about 5000 Å. After obtaining the coating film, 90 ℃ 15
Prebaking is performed for a minute to form the resist layer 51 (13th
(F)).

(7) Next, the working mask 5 on which a desired optical recording pattern is formed is brought into close contact with the resist layer 51 of the card front substrate 42, and exposed at 4 mJ / cm ² using a high pressure mercury lamp to form an optical recording pattern layer. 51b is formed (FIG. 13 (g)).

(8) Next, the resist layer 51 of the card surface base material 42 is developed for 30 seconds with a developing solution prepared by diluting 1 part of the developer MF-312 of Shipley Co. with 1 part of pure water, and rinsed with pure water. Perform thoroughly and dry (Fig. 13 (h)).

(9) Next, 16 parts of phosphoric acid, 2 parts of acetic acid, 1 part of nitric acid, and 1 part of pure water were mixed and stirred, and the aluminum coating 48a of the card surface substrate 42 was used as a mask at the optical recording pattern layer 51b at 35 ° C. using an etching solution. After the aluminum coating 48a is etched by immersing it in the etching solution of 50 seconds to form the aluminum pattern 48b, it is washed with pure water and dried (FIG. 13 (i)).

(10) Next, in order to improve the releasability of the photoresist on the card surface base material 42, re-exposure was carried out at 100 mJ / cm ² , 1 part of the stripping solution 10 from Tokyo Ohka Kogyo Co., Ltd. was prepared and diluted with 3 parts of pure water. The card surface base material 42 is dipped in the solution for 1 to 2 seconds, the resist layer 51 is peeled off, immediately rinsed with pure water sufficiently and dried (first step).
Figure 13 (j)).

(11) Next, an adhesive layer 52 made of a urethane-based thermoplastic adhesive is preliminarily dried on the inside surface of the card backing substrate 43 of a vinyl chloride sheet having a desired design and a thickness of 0.35 mm to a dry film thickness. It is applied by a roll coating method so as to have a thickness of 5 μm, and the inner surfaces of the card front substrate 42 and the card back substrate 43 are overlapped with each other,
Heat-press at 90 ℃ and 15kg / cm ² for 10 minutes to bond (No. 13
(Figure (k)).

(12) Next, cutting is performed in a normal card shape (Fig. 13 (l)).

(13) Thus, the optical recording card 41c is completed (FIG. 13 (m)).

Next, an optical recording card 41d provided with an information recording layer having a patterned metal reflection film after forming an information pattern on the card surface substrate with a dye having absorption of ultraviolet rays and infrared rays and providing a hologram pattern by stamping or the like. Fig. 14 shows the method of making it.

(1) First, as shown in FIG. 14, a transparent card surface base material 42 of polycarbonate having a thickness of 0.40 mm is prepared (FIG. 14 (a)).

(2) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied to the surface of the card surface base material 42 by a roll coating method so that the dry film thickness becomes about 5 μm, and the hard coat layer 46 is formed. Are formed (FIG. 14 (b)).

(3) Next, Infrared absorbing dye CY-20 from Nippon Kayaku Co., Ltd. 1 part Toyo Ink Mfg. Co., Ltd. screen process ink medium S8-800 20 parts Toyo Ink Mfg. Co., Ltd. screen process ink thinner S718 5 parts Silk-screen printing on the card surface base material 42 with the mixed ink to dry the film thickness 2 μm on the part corresponding to the optical recording part 45.
A desired optical recording layer 54b is formed (FIG. 14 (c)).

(4) A mold having a hologram pattern 53 formed on the optical recording layer 54b of the card surface base material 42 is applied at 250 ° C. and 10 Kg / cm.
^A hot press is performed at ² for 1 minute to form a hologram pattern 53 on the inner surface side of the card front substrate 42 (FIG. 14 (d)).

(5) Next, the aluminum film 48a is vacuum-deposited on the hologram pattern 53 of the card front substrate 42 to a film thickness of about 1000Å at a vacuum degree of 2 × 10 ^-5 Torr and an evaporation rate of 20Å / sec. As shown in FIG. 14 (e).

(6) Next, on the aluminum film 48a of the card surface base material 42, a photoresist of Shipley Co., Ltd., Microposit (registered trademark) S1400-17 was applied by a spinner at 3000 rpm for 30 seconds to obtain a dry film thickness of about 5000 Å. After obtaining the coating film, 90 ℃ 15
Prebaking is performed for a minute to form the resist layer 51 (14th
(F)).

(7) Next, the working mask 5 on which a desired optical recording pattern is formed is brought into close contact with the resist layer 51 of the card front substrate 42, and exposed at 4 mJ / cm ² using a high pressure mercury lamp to form an optical recording pattern layer. 51b is formed (FIG. 14 (g)).

(8) Next, the resist layer 51 of the card surface base material 42 is developed for 30 seconds with a developing solution prepared by diluting 1 part of the developer MF-312 of Shipley Co. with 1 part of pure water, and rinsed with pure water. Perform thoroughly and dry (Fig. 14 (h)).

(9) Next, 16 parts of phosphoric acid, 2 parts of acetic acid, 1 part of nitric acid, and 1 part of pure water were mixed and stirred, and the aluminum coating 48a of the card surface substrate 42 was used as a mask at the optical recording pattern layer 51b at 35 ° C. using an etching solution. After the aluminum coating 48a is etched by immersing it in the etching solution for 50 seconds to form the aluminum pattern 48b, it is washed with pure water and dried (FIG. 14 (i)).

(10) Next, in order to improve the strippability of the photoresist on the card surface base material 42, re-exposure is performed at 100 mJ / cm ² , and 1 part of the stripping solution 10 from Tokyo Ohka Kogyo Co., Ltd. is prepared and diluted with 3 parts of pure water. The card surface substrate 42 is dipped in the above solution for 1 to 2 seconds, immediately rinsed with pure water, and dried (FIG. 14 (j)).

(11) Next, an adhesive layer 52 made of a urethane-based thermoplastic adhesive is preliminarily dried on the inside surface of the card backing substrate 43 of a vinyl chloride sheet having a desired design and a thickness of 0.35 mm to a dry film thickness. It is applied by a roll coating method so as to have a thickness of 5 μm, and the inner surfaces of the card front substrate 42 and the card back substrate 43 are overlapped with each other,
Bonding is performed by hot pressing at 90 ℃ and 15Kg / cm ² for 10 minutes.
(Figure (k)).

(12) Next, cutting is performed in a normal card shape (Fig. 14 (l)).

(13) Thus, the optical recording card 41d is completed (FIG. 14 (m)).

Next, FIG. 15 shows a method of making the optical recording card 41e by sandwiching the optical recording tape having the information pattern formed by the metal reflection film.

(1) First, as shown in FIG. 15, a PET film 55 having a thickness of 50 μm is prepared (FIG. 15 (a)).

(2) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied on the PET film 55 by a roll coating method so that the dry film thickness becomes about 5000 Å to form the anchor layer 47 ( Figure 15 (b)).

(3) Next, in the information recording area forming area of the PET film 55,
The aluminum film 48a is vacuum-deposited to a vacuum degree of 2 × 1.
It is formed to have a film thickness of about 1000 Å at 0 ^-5 Torr and an evaporation rate of 20 Å / sec (Fig. 15 (c)).

(4) Next, on the aluminum film 48a of the PET film 55, a photoresist of Shipley Co., Ltd., Microposit (registered trademark) S1400-17 was applied by a roll coating method and then applied for 30 seconds to give a dry film thickness of about 5000 Å. 90 after getting the membrane
The resist layer 51 is formed by drying for 15 minutes at ℃ (15th
Figure (d)).

(5) Next, the working mask 5 on which a desired optical recording pattern is formed is brought into close contact with the resist layer 51 of the PET film 55 and exposed at 4 mJ / cm ² using a high pressure mercury lamp to form the optical recording pattern layer 51b. It is formed (Fig. 15 (e)).

(6) Next, the PET film 55 is applied to the developer MF-3 of Shipley Co.
12 1 part is developed with a developing solution diluted with 1 part of pure water for 30 seconds, washed thoroughly with pure water, and dried (FIG. 15 (f)).

(7) Next, 16 parts of phosphoric acid, 2 parts of acetic acid, 1 part of nitric acid, and 1 part of pure water were mixed and stirred, and the aluminum coating 48a of the PET film 55 was etched at 35 ° C. using the optical recording pattern layer 51b as a mask. After being immersed in the solution for 50 seconds, the aluminum coating 48a is etched to form an aluminum pattern 48b, which is then washed with pure water and dried (FIG. 15 (g)).

(8) Next, in order to improve the releasability of the photoresist of the PET film 55, re-exposure was performed at 100 mJ / cm ² , and 1 part of the stripping solution 10 from Tokyo Ohka Kogyo Co., Ltd. was prepared and diluted with 3 parts of pure water. To
The PET film 55 is dipped for 1 to 2 seconds, immediately washed with pure water, and then dried (FIG. 15 (h)).

(9) Next, a transparent card surface base material 42 of polycarbonate having a thickness of 0.40 mm is prepared (FIG. 15 (i)).

(10) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied on the surface of the card surface base material 42 by a roll coating method so that the dry film thickness becomes about 10 μm, and the hard coat layer 46 is formed. Are formed (FIG. 15 (j)).

(11) Next, an adhesive layer 52b made of a urethane-based thermoplastic adhesive is applied in advance to the inner surface of the card surface base material 42 by a roll coating method so that the dry film thickness is 5 μm on the inner surface (fifteenth).
(Figure (k)).

(12) The PET film 55 and the card front substrate 42 are bonded to each other with the adhesive layer 52b with the aluminum pattern 48b inside (the 15th position).
Figure (l)).

(13) Next, an adhesive layer 52 made of a urethane-based thermoplastic adhesive is preliminarily dried on the inner surface of the card backing base material 43 of a 0.30 mm thick vinyl chloride sheet having a desired design. It is applied by a roll coating method so as to have a thickness of 5 μm, and the inner surfaces of the card front substrate 42 and the card back substrate 43 are overlapped with each other,
Bonding is performed by hot pressing at 90 ℃ and 15Kg / cm ² for 10 minutes.
Figure (m)).

(14) Next, cutting is performed in a normal card shape (Fig. 15 (n)).

(15) Thus, the optical recording card 41e is completed (FIG. 15 (o)).

Next, the optical recording tape having an information pattern formed with a metal reflection film is sandwiched, and the front base material is used as an optical recording card 41f to form an information pattern with a dye that absorbs ultraviolet rays and infrared rays. Shown in the figure.

(1) First, as shown in FIG. 16, a PET film 55 having a thickness of 50 μm is prepared (FIG. 16 (a)).

(2) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied on the PET film 55 by a roll coating method so that the dry film thickness becomes about 5000 Å to form the anchor layer 47 ( Figure 16 (b)).

(3) Next, in the information recording area forming area of the PET film 55,
The aluminum film 48a is vacuum-deposited to a vacuum degree of 2 × 1.
It is formed to have a film thickness of about 1000 Å at 0 ^-5 Torr and a vapor deposition rate of 20 Å / sec (Fig. 16 (c)).

(4) Next, a photoresist, Microposit (registered trademark) S1400-17, of Shipley Co., was applied on the aluminum coating 48a of the PTE film 55 by a roll coating method and then coated for 30 seconds to give a dry film thickness of about 5000 Å. 90 after getting the membrane
Dry for 15 minutes at ℃, to form a resist layer 51 (16th
Figure (d)).

(5) Next, the working mask 15 on which a desired optical recording pattern is formed is brought into close contact with the resist layer 51 of the PET film 55 and exposed at 4 mJ / cm ² using a high pressure mercury lamp to form the optical recording pattern layer 51b. It is formed (Fig. 16 (e)).

(6) Next, the PET film 55 is applied to the developer MF-3 of Shipley Co.
12 1 part is developed with a developing solution diluted with 1 part of pure water for 30 seconds, washed thoroughly with pure water, and dried (FIG. 16 (f)).

(7) Next, 16 parts of phosphoric acid, 2 parts of acetic acid, 1 part of nitric acid, and 1 part of pure water were mixed and stirred, and the aluminum film 48a of the PET film 55 was etched at 35 ° C. using the optical recording pattern layer 516 as a mask. The aluminum film 48a is etched by immersing it in the solution for 50 seconds to form an aluminum pattern 48b, followed by washing with pure water and drying (FIG. 16 (g)).

(8) Next, in order to improve the releasability of the photoresist of the PET film 55, re-exposure was carried out at 100 mJ / cm ² , and 1 part of the stripping solution 10 from Tokyo Ohka Kogyo Co., Ltd. was put into a solution diluted with 3 parts of pure water. PE
The T film 55 is dipped for 1 to 2 seconds, immediately rinsed thoroughly with pure water and dried (FIG. 16 (h)).

(9) Next, a transparent card surface base material 42 of 0.40 mm thick polycarbonate is prepared (FIG. 16 (i)).

(10) Next, an acrylic-silicon resin 1161 manufactured by Dainippon Ink and Chemicals, Inc. is applied to the outer surface of the card surface base material 42 by a roll coating method so that the dry film thickness is about 10 μm, and the hard coat layer 46 is formed. Are formed (FIG. 16 (j)).

(11) Next, the infrared absorption dye CY-20 from Nippon Kayaku Co., Ltd. 1 part Toyo Ink Mfg. Co., Ltd. screen process ink medium S8-800 20 parts Toyo Ink Mfg. Co., Ltd. screen process ink thinner S718 5 parts , Dry film thickness 2μ on the part corresponding to the optical recording part 45 by silk screen printing on the card surface base material 42 with the mixed ink
A desired optical recording pattern layer 51b of about m is formed (16th
(Figure (k)).

(12) Next, an adhesive layer 52b made of a urethane-based thermoplastic adhesive is applied in advance to the inner surface of the card surface base material 42 by a roll coating method so as to have a dry film thickness of 5 μm on the inner surface (sixteenth).
Figure (l)).

(13) The PET film 55 and the card front substrate 42 are bonded to each other with the adhesive layer 52b with the aluminum pattern 48b inside (the 16th).
Figure (m)).

(14) Next, a cardboard backing material 43 of a 0.30 mm thick vinyl chloride sheet with a desired design is preliminarily coated with an adhesive layer 52 made of a urethane-based thermoplastic adhesive on the inner surface side to form a dry film thickness. It is applied by a roll coating method so as to have a thickness of 5 μm, and the inner surfaces of the card front substrate 42 and the card back substrate 43 are overlapped with each other,
Heat-press at 90 ℃ and 15Kg / cm ² for 10 minutes to bond (No. 16
(N)).

(15) Next, cutting is performed in a normal card shape (Fig. 16 (o)).

(16) Thus, the optical recording card 41f is completed (FIG. 16 (p)).

[Brief description of drawings]

FIG. 1 is a process explanatory drawing showing a manufacturing process of a ROM type optical recording card mask, FIG. 2 is a process explanatory drawing showing a manufacturing process of a mother mask, and FIG. 3 is a process explanatory drawing showing another manufacturing process of a mother mask. 4 and 5 are process explanatory diagrams showing another process for producing a mother mask, FIG. 5 is a process explanatory diagram showing a process for producing a pre-format master mask, and FIG. 6 is a process showing a process for producing a master mask containing data. FIG. 7, FIG. 7 is a perspective view of an optical recording card, FIG. 8 is a side view of the optical recording card, FIG. 9 is a plan view of the optical recording card, and FIG.
11 is a sectional view taken along the line AA in FIG. 11, FIG. 11 is a process explanatory view showing a manufacturing process of an optical recording card, FIG. 12 is a process explanatory view showing a manufacturing process of another optical recording card, and FIG. FIG. 14 is a process explanatory view showing a manufacturing process of a recording card, FIG. 14 is a process explanatory view showing a manufacturing process of another optical recording card, FIG. 15 is a process explanatory view showing a manufacturing process of another optical recording card, and FIG. FIG. 17 is a process explanatory view showing a manufacturing process of another optical recording card, and FIG. 17 is a process explanatory view showing a conventional manufacturing process of a data-containing working mask for an optical recording card. 2 ... Mother mask 5 ... Working mask 9 ... Hard mask blanks 11 ... Substrate 12 ... Shading film 13 ... Electron beam resist 14 ... Pre-formatting pit pattern 21 ... Glass plate 23 ... Photo resist 24 ... Light 25 ... Chrome film 31 ... Light Recording film 32 ... Data pit 33 ... Data-containing master mask 41, 41a, 41b, 41c, 41d, 41e, 41f ... Optical recording card 42 ... Card front substrate 43 ... Card back substrate 45 ... Optical recording part 46 ... Hard coat Layer 47 ... Anchor layer 48a ... Aluminum coating 48b ... Aluminum pattern 51 ... Resist layer 51b ... Optical recording pattern layer 52 ... Adhesive layer 53 ... Hologram pattern 54b ... Optical recording layer 55 ... PET film

Claims (14)

(57) [Claims] 1. A method of manufacturing a working mask for a ROM type optical recording card containing data, comprising a mother mask manufacturing step of forming a mother mask having a pre-formatting pattern, and a master mask having the pre-formatting pattern transferred thereto. A master mask manufacturing step of manufacturing a master mask by forming a data pit pattern by laser irradiation by obtaining a control symbol from the pre-formatting pattern on a substrate, and transferring the pre-formatting pattern and the data pit pattern from the master mask A method for producing a working mask for a ROM type optical recording card, including a working mask producing step for producing a working mask. 2. A method for producing a mother mask for a ROM type optical recording card, which comprises a resist coating step of coating a hard mask blank with an electron beam resist, and then a shape of a pre-formatting pattern on the electron beam resist. An exposure step of irradiating an electron beam in accordance with the above, a developing step of developing the electron beam resist next, an etching step of etching the hard mask blanks next, and then an electron beam resist from the hard mask blanks. And a removing step of removing the mother mask for a ROM type optical recording card. 3. A method of manufacturing a mother mask for a ROM type optical recording card, comprising a resist coating step of coating a hard mask blank with a photoresist.
Next, an exposure step of irradiating the photoresist with light according to the shape of a pre-formatting pattern, a developing step of developing the photoresist next, and an etching step of etching the hard mask blanks next,
Next, a removal step of removing the photoresist from the hard mask blanks is performed.
Method for manufacturing mother mask for M-type optical recording card 4. A method for producing a mother mask for a ROM type optical recording card, which comprises exposing a high resolution photographic plate to light according to the shape of a pre-formatting pattern, and then exposing the high resolution photographic plate. A developing step of developing and fixing to form an emulsion mask; on the other hand, a resist coating step of coating a hard mask blank with a photoresist; and an exposure step of exposing the emulsion mask to the photoresist and exposing it to light. A step of developing the photoresist, a step of etching the hard mask blanks, and a step of removing the photoresist from the hard mask blanks. Method for manufacturing mother mask for ROM type optical recording card 5. A method for producing a master mask for a ROM type optical recording card, comprising a resist coating step of coating a photoresist on the metal film of a master mask blank having a metal film formed on a substrate. An exposing step of exposing a mother mask having a pre-formatting pattern on the photoresist by exposure, a developing step of developing the photoresist, an etching step of etching the metal film of the master mask blanks,
And a removing step of removing the photoresist from the metal film. A method for manufacturing a master mask for a ROM type optical recording card, comprising: 6. A method of manufacturing a master mask containing a data pit pattern for a ROM type optical recording card, wherein an optical recording film is formed on the surface of a master mask base material having a pre-formatting pattern transferred to the surface thereof. A film forming step, then a writing step of perforating the optical recording film by laser irradiation according to a pre-formatting pattern corresponding to a data pit pattern, an etching step of etching the master mask base material, and then a master A method of manufacturing a master mask containing data for a ROM type optical recording card, comprising a removing step of removing the optical recording film from a mask base material. 7. A method of manufacturing an optical recording card in which a data pit pattern is formed between a card front substrate and a card back substrate which are bonded and bonded together, and a mother mask having a pre-formatting pattern is prepared. A mother mask producing step, and a master mask producing step of producing a master mask by forming a data pit pattern by laser irradiation by obtaining a control symbol from the pre-formatting pattern on the master mask substrate on which the pre-formatting pattern is transferred, and , The data pits of the working mask produced by a method for producing a working mask for a ROM type optical recording card, including a working mask producing step of producing a working mask in which the pre-formatting pattern and the data pit pattern are transferred from the master mask Patta Method for producing an optical recording card of the emissions was transferred by etching or lift-off and forming the data pit pattern 8. A method for producing an optical recording card, wherein a data pit pattern and a hologram pattern are formed by overlapping at least a part of each other between a card front substrate and a card back substrate which are bonded and adhered to each other. , A mother mask manufacturing step of creating a mother mask having a pre-formatting pattern, and a control symbol is obtained from the pre-formatting pattern on a master mask substrate on which the pre-formatting pattern is transferred to form a data pit pattern by laser irradiation. Of a working mask for a ROM type optical recording card including a master mask manufacturing step of manufacturing a master mask by using a master mask and a working mask manufacturing step of manufacturing a working mask in which the pre-formatting pattern and the data pit pattern are transferred from the master mask. By the way The method for producing an optical recording card, characterized in that in the data pit pattern in the working mask transferred by etching or lift-off to form the data pit pattern produced Te 9. A method of inspecting a mask having at least the same pre-formatting pattern and data pit pattern as a writable optical recording card, wherein a writable optical recording card is controlled by a control signal obtained from the pre-formatting pattern. A method of inspecting a mask, characterized in that the reading / writing device is controlled to read the data pit pattern of the mask, and the read data pit pattern and ROM data information based on a card specification are compared by a computer. 10. A mask inspection apparatus having at least the same pre-formatting pattern and data pit pattern as a writable optical recording card, wherein a control signal obtained from the pre-formatting pattern is used to write the writable optical recording card. A mask inspection device characterized by controlling a reading / writing device to read the data pit pattern of the mask and comparing the read data pit pattern with ROM data information based on a card specification by a computer. 11. The mask inspection method according to claim 9, wherein the mask is a mother mask for a ROM type optical recording card, a master mask substrate, a master mask and a working mask. 12. The mask inspection apparatus according to claim 10, wherein the mask is a mother mask for a ROM type optical recording card, a master mask substrate, a master mask and a working mask. 13. A method for inspecting a ROM type optical recording card having at least the same pre-formatting pattern and data pit pattern as a writable type optical recording card, wherein the writable type is recorded by a control signal obtained from the pre-formatting pattern. Controlling the read / write device of the optical recording card to read the data pit pattern of the ROM type optical recording card, and comparing the read data pit pattern with ROM data information based on card specifications by a computer. Do
Inspection method for ROM type optical recording card 14. An inspection device for a ROM type optical recording card having at least the same pre-formatting pattern and data pit pattern as a writable type optical recording card, wherein the writable type is determined by a control signal obtained from the pre-formatting pattern. Controlling the read / write device of the optical recording card to read the data pit pattern of the ROM type optical recording card, and comparing the read data pit pattern with ROM data information based on card specifications by a computer. Do
Inspection device for ROM type optical recording card