JP2567451B2 - Printed circuit board with fuse - Google Patents
Printed circuit board with fuseInfo
- Publication number
- JP2567451B2 JP2567451B2 JP63095834A JP9583488A JP2567451B2 JP 2567451 B2 JP2567451 B2 JP 2567451B2 JP 63095834 A JP63095834 A JP 63095834A JP 9583488 A JP9583488 A JP 9583488A JP 2567451 B2 JP2567451 B2 JP 2567451B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- circuit board
- printed circuit
- pattern
- fuse pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は回路内の一部にヒューズパターンを内蔵した
プリント基板の改良に関するものである。Description: TECHNICAL FIELD The present invention relates to an improvement of a printed circuit board in which a fuse pattern is built in a part of a circuit.
（従来の技術及び解決しようとする課題） 従来のプリント基板は絶縁基板に銅箔により配設した
導体部及びヒューズパターンの発熱溶断部を設けて構成
されている。(Prior Art and Problems to be Solved) A conventional printed circuit board is configured by providing an insulating substrate with a conductor portion arranged by a copper foil and a heat-fusing portion of a fuse pattern.
このようなプリント基板のヒューズパターンに異常電
流が流れた場合、同回路に接続したダイオードが発熱に
よりヒューズパターンより先に壊れてしまうことがあ
り、ダイオードを保護するための働きがない。When an abnormal current flows through the fuse pattern of such a printed circuit board, the diode connected to the circuit may be broken before the fuse pattern due to heat generation, and there is no function for protecting the diode.
（課題を解決するための手段） 本発明は上述の問題点を解消したヒューズ付プリント
基板を提供するもので、その特徴はヒューズパターン部
周辺に貫通孔を設け、かつ上記ヒューズパターンのパタ
ーン面の反対側において、プリント基板の厚さを他のパ
ターン部より薄くしたことにある。(Means for Solving the Problem) The present invention provides a printed circuit board with a fuse that solves the above-mentioned problems, and is characterized in that a through hole is provided around a fuse pattern portion and a pattern surface of the fuse pattern is formed. On the opposite side, the printed circuit board is thinner than the other pattern parts.
第１図は本発明のヒューズ付プリント基板の具体例の
パターン面の上面図である。FIG. 1 is a top view of a pattern surface of a specific example of a printed circuit board with a fuse of the present invention.
図面において、（１）は絶縁基板、（２）は銅箔によ
り形成された導体部、（3a）（3b）（3c）は上記導体部
に設けられた端子、（４）はヒューズパターン、（５）
は上記ヒューズパターン（４）の周辺に設けた貫通孔で
ある。In the drawings, (1) is an insulating substrate, (2) is a conductor portion formed of copper foil, (3a), (3b) and (3c) are terminals provided on the conductor portion, (4) is a fuse pattern, ( 5)
Is a through hole provided around the fuse pattern (4).
前記端子（3a）と（3c）の間にはダイオードが取付け
られ、端子（3b）と（3c）の間にはヒューズパターン
（４）が設けられて、両者は直列に配設される。A diode is attached between the terminals (3a) and (3c), and a fuse pattern (4) is provided between the terminals (3b) and (3c), which are arranged in series.
又貫通孔（５）は例えば第２図（イ）のように、ヒュ
ーズパターン（４）の折り返しの間隙部に設けてもよい
し、同図（ロ）のようにヒューズパターン（４）の両側
に沿って設けてもよい。又上記ヒューズパターン（４）
の反対面においてプリント基板１の厚さを他のパターン
部より薄くする。Further, the through hole (5) may be provided in the gap portion at which the fuse pattern (4) is folded back as shown in FIG. 2 (a), or on both sides of the fuse pattern (4) as shown in FIG. 2 (b). You may provide along. Also, the fuse pattern (4) above
The thickness of the printed circuit board 1 is made thinner than the other pattern portions on the surface opposite to.
（作用） 上述したように、ヒューズパターン（４）の周辺に貫
通孔（５）を設けることにより、電流通電時にヒューズ
パターン（４）より放出される熱がその部分から逃げに
くくなり、ヒューズパターン（４）に熱が集まり易くな
り、ダイオードの熱による破損を防止することができ
る。(Operation) As described above, by providing the through hole (5) around the fuse pattern (4), the heat emitted from the fuse pattern (4) during current application becomes difficult to escape from that portion, and the fuse pattern ( Heat is easily collected in 4), and damage to the diode due to heat can be prevented.
この際、ヒューズパターン面の反対側において、プリ
ント基板の厚さを他のパターン部より薄くすることによ
り、熱がヒューズパターン部に一層集中し易くなり、ダ
イオード保護の効果が一層増大する。At this time, by making the thickness of the printed circuit board thinner than the other pattern portion on the side opposite to the fuse pattern surface, heat is more likely to be concentrated on the fuse pattern portion, and the effect of diode protection is further increased.
（発明の効果） 以上説明したように、ヒューズ付プリント基板のヒュ
ーズパターンの周辺に貫通孔を設けることにより、この
部分に熱が集中し易くなり、異常電流が流れた場合、ヒ
ューズが加熱溶断され、ダイオードの熱による破損を防
止することができる。又この際、ヒューズパターン面の
反対側において、プリント基板の厚さを他のパターン部
より、薄くすることにより、熱がこの部分に一層集中し
易くなり、ダイオード保護の効果が一層増大する。(Effects of the Invention) As described above, by providing a through hole in the periphery of the fuse pattern of the printed circuit board with a fuse, heat easily concentrates in this portion, and when an abnormal current flows, the fuse is heated and blown. It is possible to prevent damage to the diode due to heat. Further, at this time, by making the thickness of the printed circuit board thinner than the other pattern portions on the side opposite to the fuse pattern surface, heat is more likely to be concentrated on this portion and the effect of diode protection is further enhanced.
第１図は本発明のヒューズ付プリント基板の具体例のパ
ターン面の上面図である。 第２図（イ）及び（ロ）はいずれも貫通孔の配設位置の
説明図である。 １……絶縁基板、２……導体部、3a、3b、3c……端子、
４……ヒューズパターン、５……貫通孔。FIG. 1 is a top view of a pattern surface of a specific example of a printed circuit board with a fuse of the present invention. FIGS. 2A and 2B are explanatory views of the positions where the through holes are provided. 1 ... Insulating substrate, 2 ... Conductor part, 3a, 3b, 3c ... Terminal,
4 ... Fuse pattern, 5 ... Through hole.
フロントページの続き (56)参考文献 特開 昭60−175479（ＪＰ，Ａ) 実開 昭55−108777（ＪＰ，Ｕ) 実開 昭63−3174（ＪＰ，Ｕ) 実開 昭51−47864（ＪＰ，Ｕ)Continuation of the front page (56) References JP-A-60-175479 (JP, A) Actually opened 55-108777 (JP, U) Actually opened 63-3174 (JP, U) Actually opened 51-47864 (JP , U)
Claims (1)
るヒューズパターンを有するプリント基板においてヒュ
ーズパターン部周辺に貫通孔を設け、かつ上記ヒューズ
パターンのパターン面の反対側において、プリント基板
の厚さを他のパターン部より薄くしたことを特徴とする
ヒューズ付プリント基板。1. A printed circuit board having a fuse pattern that is blown by an overcurrent in a part of a circuit, wherein a through hole is provided around a fuse pattern portion, and a printed circuit board is provided on the side opposite to the pattern surface of the fuse pattern. A printed circuit board with a fuse, wherein the thickness of the printed circuit board is thinner than that of other pattern parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63095834A JP2567451B2 (en) | 1988-04-18 | 1988-04-18 | Printed circuit board with fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63095834A JP2567451B2 (en) | 1988-04-18 | 1988-04-18 | Printed circuit board with fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01266784A JPH01266784A (en) | 1989-10-24 |
| JP2567451B2 true JP2567451B2 (en) | 1996-12-25 |
Family
ID=14148414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63095834A Expired - Fee Related JP2567451B2 (en) | 1988-04-18 | 1988-04-18 | Printed circuit board with fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2567451B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180076572A (en) * | 2016-12-28 | 2018-07-06 | 주식회사 엘지화학 | Printed circuit board with circuit pattern including bottlenect section |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI106657B (en) * | 1999-04-14 | 2001-03-15 | Helvar Oy | Foil fuse made on PCB |
| DE102010037390B4 (en) * | 2010-09-08 | 2012-08-30 | Vossloh-Schwabe Deutschland Gmbh | Multi-layer printed circuit board with printed circuit board fuse |
-
1988
- 1988-04-18 JP JP63095834A patent/JP2567451B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180076572A (en) * | 2016-12-28 | 2018-07-06 | 주식회사 엘지화학 | Printed circuit board with circuit pattern including bottlenect section |
| KR102423944B1 (en) * | 2016-12-28 | 2022-07-21 | 주식회사 엘지에너지솔루션 | Printed circuit board with circuit pattern including bottlenect section |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01266784A (en) | 1989-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |