JP2553697B2 - Mold removal composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an oxygen-based fungicide composition having no irritating odor and excellent in bleaching power.

[Conventional technology and its problems]

Black stains on bathroom ceilings, tile joints, plastic walls and triangular corners in kitchens are caused by molds produced by molds such as Cladosporium and cannot be removed with cleansers or surfactants. A spray-type fungicide containing a chlorine-based bleach such as hypochlorate is commercially available.

However, a fungicide containing hypochlorite has excellent performance, but has a great risk to eyes and skin, and a spray-like agent is not suitable for molds such as ceilings. Further, it has a strong chlorine-based odor, is not suitable for use in a small bathroom, etc., and if it is accidentally used with an acidic detergent, it produces toxic gas.

In recent years, a fungicide that uses an oxygen-based bleaching agent that does not have such a risk has been studied. For example, JP-A-62-47
Japanese Patent Publication 97 discloses a composition in which hydrogen peroxide or sodium percarbonate, a bleaching activator and a peroxydisulfate are used in combination. As the bleach activator, tetraacetyldiamine, tetraacetylglycoluril, pentaerythritol tetraacetate and the like are particularly excellent. However, since these bleach activators generate peracetic acid as a bleaching active species, they have a strong pungent odor and are difficult to put into practical use.

[Means for solving the problem]

As the bleaching active species in the mold remover using an oxygen bleach, the bleaching power is high, the bleaching power is at least 30
It is necessary that the condition last for about a minute and that there is no malodor or pungent odor. The present inventors have conducted intensive studies on bleaching active species satisfying these conditions, and as a result, have found that a specific organic peracid has no irritating odor and exhibits an excellent bleaching effect, and thus completed the present invention.

That is, in the present invention, the bleaching active species is represented by the following general formulas (I) and (I
The present invention provides a fungicide composition, which is an organic peracid represented by I) or (III).

[In the formula, R represents a saturated or unsaturated, linear or branched alkyl group having 1 to 5 carbon atoms. n represents an integer of 0 to 20, preferably 0 to 5. However, when the carbon number of R is 1 or 2, n is an integer of 1 to 20, preferably 1 to 5, and when the carbon number of R is 3 to 5, n is 0 to 20, preferably 0. It is an integer of 5. In the fungicide composition of the present invention, the organic peracid can be used as it is. However, considering the storage stability of the organic peracid, it is better to generate the organic peracid at the time of use. That is, it is preferable to use hydrogen peroxide or a peroxide that produces hydrogen peroxide in an aqueous solution and an organic peracid precursor (a bleach activator) that reacts with hydrogen peroxide to produce the organic peracid. preferable.

As a peroxide that generates hydrogen peroxide in an aqueous solution,
Sodium percarbonate, sodium tripolyphosphate / hydrogen peroxide adduct, sodium pyrophosphate / hydrogen peroxide adduct, urea / hydrogen peroxide adduct, or 4Na ₂ SO ₄・ 2H ₂ O ₂・ Na
Examples include Cl, sodium perborate-hydrate, sodium perborate tetrahydrate, sodium persilicate, sodium peroxide, calcium peroxide and the like. Among these, sodium percarbonate, sodium perborate-hydrate, and sodium perborate tetrahydrate are particularly preferable.

 The following are particularly preferable as the organic peracid precursor.

(1) An acid anhydride of an organic acid represented by the following general formula (IV), (V) or (VI) [In the formula, R represents a saturated or unsaturated, linear or branched alkyl group having 1 to 5 carbon atoms. n represents an integer of 0 to 20, preferably 0 to 5. However, when the carbon number of R is 1 or 2, n is an integer of 1 to 20, preferably 1 to 5, and when the carbon number of R is 3 to 5, n is 0 to 20, preferably 0. It is an integer of 5. Or (2) an ester or amide of the above organic acid and the following compounds (VII) to (XI) The effect of the mold remover composition of the present invention can be further enhanced by adding a buffer for adjusting the pH. The pH is suitably from 5 to 13, and more preferably from 6 to 10. Examples of the buffer include hydroxides of alkali metals such as sodium hydroxide and potassium hydroxide, ammonium hydroxide, amine derivatives such as mono-, di- and triethanolamine, carbonates of alkali metals such as sodium carbonate and potassium carbonate. Carbonates such as ammonium carbonate, alkali metal silicates such as sodium silicate and potassium silicate, and silicates such as ammonium silicate can be used. Furthermore,
If necessary, alkali metal sulfates such as sodium silicate, potassium sulfate and lithium sulfate, or ammonium sulfate, alkali metal bicarbonates such as sodium bicarbonate, potassium bicarbonate and lithium bicarbonate, ammonium bicarbonate and the like can be used.

In addition, if necessary, solubilizers such as sodium p-toluenesulfonate, sodium xylenesulfonate, sodium alkenylsuccinate, and urea, surfactants, penetrants, suspending agents such as clay, abrasives, pigments, dyes, Fragrances and the like can be added.

In the fungicide composition of the present invention, the amount of the organic peracid represented by the above general formula (I), (II) or (III) is generally 0.1 to 100%, preferably 0.2 to 50%. .

When H ₂ O ₂ or a peroxide that produces H ₂ O ₂ in an aqueous solution is used, the content thereof is generally 0.5 to 98%, preferably 1 to 50%. The compounding amount is generally 0.1 to 50%, preferably 0.5 to 30%.

Preferred amounts of other optional components are as follows.

Buffering agent 0 to 30% Solubilizing agent 0 to 10% Surfactant 0 to 5% Thickener 0 to 5% Abrasive agent 0 to 20% Pigments, dyes, fragrances, etc. It is desirable to add 0.1 to 5% because it can promote the penetration of Examples of the surfactant include alkylglycoside, polyoxyethylene alkyl ether, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene fatty acid ester, oxyethyleneoxypropylene block polymer (pluronic), fatty acid monoglyceride, and amine oxide. Nonionic surfactant: soap, alkyl sulfate, alkylbenzene sulfonate,
Anionic surfactants such as polyoxyethylene alkyl sulfates and sulfosuccinic acid diesters; cationic surfactants such as mono- or dialkylamines and their polyoxyethylene adducts and mono- or di-long-chain alkyl quaternary ammonium salts An amphoteric surfactant such as carbobetaine, sulfobetaine, and hydroxysulfobetaine;

The mold removing composition of the present invention can be used in a single-pack type, but hydrogen peroxide or a peroxide that produces hydrogen peroxide in an aqueous solution and an organic peroxide precursor are separated. There is no concern about storage stability in a form in which they are separately packaged, mixed immediately before use (adding water if necessary) to form a solution, slurry or paste, and immediately sprayed or sprayed on the target surface. So desirable. The effective oxygen concentration during use is generally adjusted to 0.1 to 3%, preferably 0.2 to 1%.

〔The invention's effect〕

According to the present invention, it is possible to obtain a fungicide composition which has no irritating odor and exhibits excellent bleaching power, and thus solves the problems that conventional fungicide compositions have in practical use. be able to.

〔Example〕

Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

<Method of measuring bleaching power> A model mold plate is placed horizontally, 40μ of an aqueous solution of the mold remover composition is dropped, left for 30 minutes, washed with water and air-dried, and then the brightness is measured using a colorimeter 1001DP manufactured by NEC Corporation. (L value) was measured.

Model mold plate Cladosoporium herb
arum) was inoculated and cultured at 30 ° C. for 14 days, and a plastic plate (made of ABS resin) was used as a model mold plate. (L value of plastic plate 92.4, L value of model mold plate 60-7
0. ) <Odor> The odor of the aqueous solution of the mold removal composition was sensory evaluated by 10 panelists.

◯: No irritating odor or offensive odor ×: Irritating odor or offensive odor Example 1 A fungicide composition aqueous solution containing 3% hydrogen peroxide and 10% various acid anhydrides shown in Table 1 (effective oxygen concentration about 0.5 %)
Was prepared and subjected to bleaching power and odor tests.

 The results are shown in Table 1.

Example 2 An aqueous solution of a fungicide composition (effective oxygen concentration of about 1.35%) containing 10% of sodium percarbonate, 10% of the ester shown in Table 2 and 2% of alkylglycoside was prepared and subjected to bleaching power and odor tests. did.

 The results are shown in Table 2.

As the alkyl glycoside, one represented by the formula R ₁ (OR ₂ ) _x G _y (R ₁ = C ₁₀ , _x = O, _y = 1.35, G: glucose residue) was used.

Claims (3)

(57) [Claims] 1. A mold remover composition, wherein the bleaching active species is an organic peracid represented by the following general formula (I), (II) or (III). [In the formula, R represents a saturated or unsaturated, linear or branched alkyl group having 1 to 5 carbon atoms. n represents an integer of 0 to 20. However, when the carbon number of R is 1 or 2, n is 1
Is an integer of 20 and n is 0 when R has 3 to 5 carbon atoms.
It is an integer of ~ 20. ] 2. Hydrogen peroxide or a peroxide which produces hydrogen peroxide in an aqueous solution, and an organic peracid represented by the general formula (I), (II) or (III) when reacted with hydrogen peroxide. The mold remover composition according to claim 1, further comprising an organic peracid precursor that produces 3. An organic acid acid anhydride represented by the following general formula (IV), (V) or (VI), wherein the organic peracid precursor is (1) [In the formula, R represents a saturated or unsaturated, linear or branched alkyl group having 1 to 5 carbon atoms. n represents an integer of 0 to 20. However, when the carbon number of R is 1 or 2, n is 1
Is an integer of 20 and n is 0 when R has 3 to 5 carbon atoms.
It is an integer of ~ 20. Or (2) an ester or amide of the above organic acid and the following compounds (VII) to (XI) The mold removal composition according to claim 2.