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JP2548543Y2 - Microphone - Google Patents

Microphone

Info

Publication number
JP2548543Y2
JP2548543Y2 JP1992001478U JP147892U JP2548543Y2 JP 2548543 Y2 JP2548543 Y2 JP 2548543Y2 JP 1992001478 U JP1992001478 U JP 1992001478U JP 147892 U JP147892 U JP 147892U JP 2548543 Y2 JP2548543 Y2 JP 2548543Y2
Authority
JP
Japan
Prior art keywords
front plate
slit
concave portion
microphone
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1992001478U
Other languages
Japanese (ja)
Other versions
JPH0560079U (en
Inventor
俊朗 井土
和夫 小野
清之 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hosiden Corp
Original Assignee
Hosiden Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hosiden Corp filed Critical Hosiden Corp
Priority to JP1992001478U priority Critical patent/JP2548543Y2/en
Priority to US07/869,441 priority patent/US5272758A/en
Priority to MYPI92000660A priority patent/MY106923A/en
Priority to EP92106823A priority patent/EP0531613B1/en
Priority to DE69207522T priority patent/DE69207522T2/en
Priority to CN92103442A priority patent/CN1026846C/en
Priority to KR1019920016360A priority patent/KR960000166B1/en
Publication of JPH0560079U publication Critical patent/JPH0560079U/en
Application granted granted Critical
Publication of JP2548543Y2 publication Critical patent/JP2548543Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】この考案は金属製カプセルの前面
板に受音用音孔としてスリットが形成されたマイクロホ
ンに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microphone in which a slit is formed on a front plate of a metal capsule as a sound receiving hole.

【0002】[0002]

【従来の技術】図3に従来のマイクロホンを示す。アル
ミニュウムの円筒状カプセル11の前面に前面板11a
が一体に形成され、前面板11aに音孔12が形成さ
れ、前面板11aの前面にクロス13が張り付けられて
いる。前面板11aの内面の周縁部に金属製の振動膜リ
ング14が対接されると共に電気的に接続され、その振
動膜リング14の前面板11aと反対の面にエレクトレ
ット振動膜15が張り付けられている。エレクトレット
振動膜15は高分子フイルム、例えば厚さ12.5μm の
比較的厚いFEP(Fluoro Ethylene Propylene)フイル
ムの一面に金属が蒸着され、その高分子フイルムは分極
されており、その蒸着膜が振動膜リング14に接して取
り付けられている。
2. Description of the Related Art FIG. 3 shows a conventional microphone. A front plate 11a is provided on the front surface of the aluminum cylindrical capsule 11.
Are integrally formed, a sound hole 12 is formed in the front plate 11a, and a cloth 13 is attached to the front surface of the front plate 11a. A vibrating membrane ring 14 made of metal is brought into contact with and electrically connected to a peripheral portion of the inner surface of the front plate 11a, and an electret vibrating membrane 15 is attached to a surface of the vibrating membrane ring 14 opposite to the front plate 11a. I have. The electret vibrating film 15 is formed by depositing a metal on one surface of a polymer film, for example, a relatively thick FEP (Fluoro Ethylene Propylene) film having a thickness of 12.5 μm, and the polymer film is polarized. It is attached in contact with the ring 14.

【0003】その振動膜15にリング状スペーサ16を
介して背極17が近接対向され、背極17は筒状の背極
保持体18の前面に保持されている。背極保持体18の
内部で構成される背室19内にインピーダンス変換用I
C素子21が配され、そのIC素子21の入力端子22
は背極17と接続され、出力端子23および共通端子
(図示せず)はカプセル11の背面より突出され、カプ
セル11の背面を塞ぐ配線基板24の配線に接続され
る。配線基板24の背面にカプセル11の後方端部が折
り曲げられて、内部の各部が前面板11aに押し付けら
れて全体が固定される。
A back electrode 17 is closely opposed to the vibrating membrane 15 via a ring-shaped spacer 16, and the back electrode 17 is held on the front surface of a cylindrical back electrode holder 18. An impedance conversion I is provided in a back chamber 19 formed inside the back pole holder 18.
A C element 21 is provided, and an input terminal 22 of the IC element 21 is provided.
Are connected to the back electrode 17, and the output terminal 23 and the common terminal (not shown) protrude from the back surface of the capsule 11 and are connected to the wiring of the wiring board 24 closing the back surface of the capsule 11. The rear end portion of the capsule 11 is bent on the back surface of the wiring board 24, and each part inside is pressed against the front plate 11a to fix the whole.

【0004】[0004]

【考案が解決しようとする課題】音孔12は受音するた
めのものであり、円形ないし、スリット状に形成され、
従来においては音孔12は前面板11aと平行な面内に
ある。このためシールド効果が少なく、誘導雑音が大き
いという問題があった。
The sound hole 12 is for receiving sound, and is formed in a circular or slit shape.
Conventionally, the sound hole 12 is in a plane parallel to the front plate 11a. Therefore, there is a problem that the shielding effect is small and the induced noise is large.

【0005】[0005]

【課題を解決するための手段】この考案によれば、受音
用のスリットはカプセルの前面板とほゞ直角な面内に形
成されている。特に請求項2の考案によれば、そのスリ
ットは前面板の外面と内面との間に位置している。
According to the present invention, the slit for receiving sound is formed in a plane substantially perpendicular to the front plate of the capsule. In particular, according to the invention of claim 2, the slit is located between the outer surface and the inner surface of the front plate.

【0006】[0006]

【実施例】図1にこの考案の実施例を示す。アルミニュ
ウムなどの金属よりなる円筒状カプセル11の前面板1
1aの外面中央部に円形凹部31が形成され、前面板1
1aの内面に、リング状凹部32が形成される。リング
状凹部32の内径は円形凹部31の径と一致され、かつ
同一軸心とされ、円形凹部31の底面31aよりもリン
グ状凹部32の底面32aの方が前面に位置し、円形凹
部31の周面と、リング状凹部32の内周面とが一致す
る部分にスリット33が構成される。円形凹部31の前
面周縁より底面31aに達する複数のテーパ状連結部3
4が等角間隔で一体に形成されている。
FIG. 1 shows an embodiment of the present invention. Front plate 1 of cylindrical capsule 11 made of metal such as aluminum
1a, a circular recess 31 is formed in the center of the outer surface,
A ring-shaped recess 32 is formed on the inner surface of 1a. The inner diameter of the ring-shaped recess 32 matches the diameter of the circular recess 31 and is the same axis. The bottom surface 32 a of the ring-shaped recess 32 is located on the front surface rather than the bottom surface 31 a of the circular recess 31. A slit 33 is formed at a portion where the peripheral surface coincides with the inner peripheral surface of the ring-shaped concave portion 32. A plurality of tapered connecting portions 3 reaching the bottom surface 31a from the front peripheral edge of the circular concave portion 31
4 are formed integrally at equal angular intervals.

【0007】例えば前面板11aの厚さが0.3mmであ
り、その内面がリング状型により前方側に押し潰されて
リング状凹部32とされ、その深さは0.2mmとされ、そ
の後、前方から円形型により前面板11aが内方に押し
潰されて円形凹部31が形成され、その深さは0.2mmと
される。よってスリット33の間隔tは0.1mmとなる。
円形凹部31の径は3mmである。このようにして、前面
板11aと直角な面内で、かつ前面板11aの外面と内
面との間にスリット33が形成される。
For example, the thickness of the front plate 11a is 0.3 mm, and the inner surface thereof is crushed forward by a ring-shaped mold to form a ring-shaped recess 32, the depth of which is 0.2 mm. The front plate 11a is crushed inward from the front by a circular mold to form a circular concave portion 31 having a depth of 0.2 mm. Therefore, the interval t between the slits 33 is 0.1 mm.
The diameter of the circular recess 31 is 3 mm. Thus, the slit 33 is formed in a plane perpendicular to the front plate 11a and between the outer surface and the inner surface of the front plate 11a.

【0008】この図1に示した例では、前面板11aの
内面にエレクトレット高分子フイルム35が形成され、
その高分子フイルム35と狭い間隔、例えば25〜40
μmをおいて導電性振動膜36が配される。導電性振動
膜36としては、例えば厚さが2〜4μm の薄いPET
(ポリエステル)などの高分子フイルムの一面にNi,A
l などを蒸着させて導電層を形成したものを用いること
ができる。前記狭い間隔を設けるため、前面板11aの
内面はその周縁部を残して前方へわずか押し潰され、前
面板11aの内面の周縁部に導電性振動膜36の周縁部
が対接されている。
In the example shown in FIG. 1, an electret polymer film 35 is formed on the inner surface of the front plate 11a,
A narrow distance from the polymer film 35, for example, 25 to 40
A conductive vibration film 36 is provided at a distance of μm. As the conductive vibration film 36, for example, a thin PET having a thickness of 2 to 4 μm is used.
Ni, A on one side of polymer film such as (polyester)
A conductive layer formed by depositing l or the like can be used. In order to provide the narrow space, the inner surface of the front plate 11a is slightly squashed forward while leaving the peripheral portion thereof, and the peripheral portion of the conductive vibration film 36 is in contact with the peripheral portion of the inner surface of the front plate 11a.

【0009】導電性振動膜36はその導電層側にて導電
性リング37に張り付け保持されている。導電性リング
37に導電性筒状体38の一端が対接される。導電性筒
状体38の他端面に両面配線基板39が対接される。配
線基板39の内面に形成されたリング状パターン41に
導電性筒状体38の他端面が対接され、リング状パター
ン41に接続されたパターン42にインピーダンス変換
用IC素子21の入力端子22が接続され、IC素子2
1の出力端子23および図に示していない共通端子は、
それぞれ配線基板39の各別のスルーホール43に接続
されて外部に電気的に導出される。配線基板39の外面
にリング状パターン44が形成され、カプセル11の後
方端部は高分子フイルム35が剥がされ、その部分がパ
ターン44に折り曲げ圧接されて、カプセル11内に導
電性リング37,導電性筒状体38,配線基板39が保
持される。
The conductive vibration film 36 is attached to and held on a conductive ring 37 on the conductive layer side. One end of a conductive cylindrical body 38 is in contact with the conductive ring 37. A double-sided wiring board 39 is in contact with the other end surface of the conductive cylindrical body 38. The other end surface of the conductive cylindrical body 38 is in contact with a ring pattern 41 formed on the inner surface of the wiring board 39, and the input terminal 22 of the impedance conversion IC element 21 is connected to the pattern 42 connected to the ring pattern 41. Connected, IC element 2
1 and the common terminal not shown in FIG.
Each is connected to each other through hole 43 of the wiring board 39 and is electrically led out. A ring-shaped pattern 44 is formed on the outer surface of the wiring board 39, the polymer film 35 is peeled off from the rear end of the capsule 11, and that portion is bent and pressed against the pattern 44, and the conductive ring 37 and the conductive ring The flexible cylindrical body 38 and the wiring board 39 are held.

【0010】この図1のマイクロホンを構成するには、
例えばアルミニュウムの平板の一面に高分子フイルムを
熱溶着などにより被着し、これを、しぼり加工により有
底円筒状に形成し、その前面板11aにスリット33を
形成し、次に高分子フイルムを分極してエレクトレット
化し、その後、導電性リング37,導電性筒状体38,
IC素子21を実装した配線基板39を順次カプセル1
1内に挿入した後、カプセル11の後端をかしめればよ
い。
To configure the microphone of FIG. 1,
For example, a polymer film is applied to one surface of an aluminum flat plate by heat welding or the like, formed into a cylindrical shape with a bottom by squeezing, a slit 33 is formed in the front plate 11a, and then the polymer film is formed. Polarized into an electret, and thereafter, the conductive ring 37, the conductive cylindrical body 38,
The wiring board 39 on which the IC element 21 is mounted is sequentially encapsulated.
After inserting the capsule 11, the rear end of the capsule 11 may be swaged.

【0011】スリット33の形成は、円形凹部31を形
成した後に、リング状凹部32を形成して構成してもよ
い、あるいは円形凹部31およびリング状凹部32を同
時に形成して構成してもよい。更に図2Aに示すように
前面板11aの内面に円形凹部45を形成し、外面にリ
ング状凹部46を形成してスリット33を構成してもよ
い。また円形凹部31(45)の代わりに方形や多角形
の凹部を形成し、リング状凹部32(46)の代わり
に、前記方形や多角形の凹部の外側にこれと接して方形
や多角形のリング状凹部を形成してスリットを形成して
もよい。
The slit 33 may be formed by forming the circular concave portion 31 and then forming the ring-shaped concave portion 32, or by simultaneously forming the circular concave portion 31 and the ring-shaped concave portion 32. . Further, as shown in FIG. 2A, the slit 33 may be formed by forming a circular concave portion 45 on the inner surface of the front plate 11a and forming a ring-shaped concave portion 46 on the outer surface. In addition, instead of the circular concave portion 31 (45), a rectangular or polygonal concave portion is formed, and instead of the ring-shaped concave portion 32 (46), a rectangular or polygonal concave portion is formed in contact with the outside of the rectangular or polygonal concave portion. The slit may be formed by forming a ring-shaped recess.

【0012】図2Bに示すように、前面板11aの内面
中央部を前方に、外側に押し出し、その一部をテーパ状
に連結し、他の部分をせん断することによりスリット4
7を形成してもよい。逆に図2Cに示すように、前面板
11aの中央部を内側に押し出してスリット48を形成
してもよい。スリットを放射線状に形成してもよい。
As shown in FIG. 2B, the central portion of the inner surface of the front plate 11a is pushed forward and outward, a part thereof is connected in a tapered shape, and the other part is sheared to form a slit 4.
7 may be formed. Conversely, as shown in FIG. 2C, the slit 48 may be formed by extruding the center of the front plate 11a inward. The slit may be formed radially.

【0013】更に、上述ではこの考案を前面板11aの
内面に高分子エレクトレットフイルムが形成されたフロ
ントエレクトレットコンデンサマイクロホンに適用した
が、振動膜がエレクトレット化されたホイルエレクトレ
ットコンデンサマイクロホン、背極側に高分子エレクト
レットフイルムが形成されたバックエレクトレットコン
デンサマイクロホン、その他のマイクロホンにもこの考
案を適用することができる。
Further, in the above description, the present invention is applied to a front electret condenser microphone in which a polymer electret film is formed on the inner surface of the front plate 11a. The present invention can be applied to a back electret condenser microphone on which a molecular electret film is formed and other microphones.

【0014】[0014]

【考案の効果】以上述べたように、この考案によれば受
音用のスリットが前面板11aと直角な面内に形成され
ているため、シールド効果が大きく、誘導雑音が小さく
なる。また、ごみなどが入り難く、前面のクロスを省略
することもでき、部品点数を少なくすることができる。
As described above, according to the present invention, since the slit for receiving sound is formed in a plane perpendicular to the front plate 11a, the shielding effect is large and the induced noise is reduced. Further, it is difficult for dust and the like to enter, the front cross can be omitted, and the number of parts can be reduced.

【0015】更に図1に示したように、受音用スリット
を前面板11aの外面と内面との間に形成したものは、
前面板11aに図2B,Cと比較して凹凸がなく、カプ
セル軸心方向の長さを小さくすることができる。
Further, as shown in FIG. 1, the sound receiving slit formed between the outer surface and the inner surface of the front plate 11a is as follows.
The front plate 11a has no irregularities as compared with FIGS. 2B and 2C, and the length in the capsule axial direction can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】Aは請求項2の考案の実施例を示す断面図、B
はその前面板11aの一部を示す平面図である。
FIG. 1A is a sectional view showing an embodiment of the invention of claim 2; FIG.
Is a plan view showing a part of the front plate 11a.

【図2】スリットの他の例を示す断面図。FIG. 2 is a sectional view showing another example of a slit.

【図3】従来のコンデンサマイクロホンを示す断面図。FIG. 3 is a sectional view showing a conventional condenser microphone.

Claims (3)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 金属製カプセルの前面板に受音用音孔と
してスリットが形成されたマイクロホンにおいて、上記前面板の外面中央部に、第1の凹部が形成され、 上記前面板の内面に、上記第1の凹部の外周縁と内周縁
が一致したリング状の第2の凹部が形成され、 上記第1の凹部の底面より上記第2の凹部の底面が前方
に位置してこれら両底面間に上記スリットが形成され、 上記第1の凹部の底面外周縁と、上記第2の凹部の底面
内周縁とを上記スリットを横断して連結する複数の連結
部がこれら底面と一体に形成され、 ていることを特徴とするマイクロホン。
1. A microphone in which a slit is formed in a front plate of a metal capsule as a sound receiving sound hole , a first concave portion is formed in a central portion of an outer surface of the front plate, and an inner surface of the front plate is formed by : Outer edge and inner edge of the first recess
Are formed, and the bottom surface of the second recess is located forward of the bottom surface of the first recess.
The slit is formed between these two bottom surfaces, and the outer peripheral edge of the bottom surface of the first concave portion and the bottom surface of the second concave portion
Multiple connections that connect the inner periphery across the slit
A microphone , wherein a part is formed integrally with these bottom surfaces .
【請求項2】 金属製カプセルの前面板に受音用音孔と
してスリットが形成されたマイクロホンにおいて、 上記前面板の内面中央部に、第1の凹部が形成され、 上記前面板の外面に、上記第1の凹部の外周縁と内周縁
が一致したリング状の第2の凹部が形成され、 上記第1の凹部の底面より上記第2の凹部の底面が後方
に位置してこれら両底面間に上記スリットが形成され、 上記第1の凹部の底面外周縁と、上記第2の凹部の底面
内周縁とを上記スリットを横断して連結する複数の連結
部がこれら底面と一体に形成され、 ていることを特徴とするマイクロホン。
2. A sound receiving sound hole on a front plate of a metal capsule.
In the microphone in which the slit is formed , a first concave portion is formed at a central portion of an inner surface of the front plate, and an outer peripheral edge and an inner peripheral edge of the first concave portion are formed on an outer surface of the front plate.
Are formed, and the bottom surface of the second recess is located rearward of the bottom surface of the first recess.
The slit is formed between these two bottom surfaces, and the outer peripheral edge of the bottom surface of the first concave portion and the bottom surface of the second concave portion
Multiple connections that connect the inner periphery across the slit
A microphone , wherein a part is formed integrally with these bottom surfaces .
【請求項3】 金属製カプセルの前面板に受音用音孔と
してスリットが形成されたマイクロホンにおいて、 上記前面板の中央部が一方の側に、その前面板の厚みよ
り大きく押し出されて突出部が形成され、この突出部は
複数の連結部で上記前面板に一体に連結され、これら連
結部間に上記スリットが形成されていることを特徴とす
るマイクロホン。
3. A sound receiving hole in a front plate of a metal capsule.
In a microphone having a slit formed as described above, the center of the front plate is on one side, and the thickness of the front plate is
Extruded to form a protrusion, which is
The front plate is integrally connected to the front plate at a plurality of connection portions.
The slit is formed between the joints.
Microphone.
JP1992001478U 1991-09-09 1992-01-20 Microphone Expired - Lifetime JP2548543Y2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1992001478U JP2548543Y2 (en) 1992-01-20 1992-01-20 Microphone
US07/869,441 US5272758A (en) 1991-09-09 1992-04-16 Electret condenser microphone unit
MYPI92000660A MY106923A (en) 1991-09-09 1992-04-18 Electret condenser microphone unit.
DE69207522T DE69207522T2 (en) 1991-09-09 1992-04-21 Electret microphone unit
EP92106823A EP0531613B1 (en) 1991-09-09 1992-04-21 Electret condenser microphone unit
CN92103442A CN1026846C (en) 1991-09-09 1992-05-09 Electret capacitive microphone
KR1019920016360A KR960000166B1 (en) 1991-09-09 1992-09-08 Electret condenser microphone unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992001478U JP2548543Y2 (en) 1992-01-20 1992-01-20 Microphone

Publications (2)

Publication Number Publication Date
JPH0560079U JPH0560079U (en) 1993-08-06
JP2548543Y2 true JP2548543Y2 (en) 1997-09-24

Family

ID=11502560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992001478U Expired - Lifetime JP2548543Y2 (en) 1991-09-09 1992-01-20 Microphone

Country Status (1)

Country Link
JP (1) JP2548543Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004201291A (en) * 2002-12-03 2004-07-15 Hosiden Corp Microphone

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4633030B2 (en) * 2006-10-03 2011-02-16 株式会社オーディオテクニカ Condenser microphone unit and condenser microphone

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3222194A1 (en) * 1982-06-12 1983-12-15 Gebr. Happich Gmbh, 5600 Wuppertal SUN VISOR, ESPECIALLY FOR VEHICLES

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004201291A (en) * 2002-12-03 2004-07-15 Hosiden Corp Microphone

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