JP2547406B2 - Multi-product measuring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a multi-product measuring device.

(Prior Art) In the process of measuring the electrical characteristics of a semiconductor device (chip) formed on the peripheral part of a measured object, for example, a semiconductor wafer,
An input signal, that is, an inspection signal is transmitted to the chip from a peripheral device such as an inspection device called a tester for judging whether the chip is good or bad. The tester then receives the output signal from the chip. The output signal is compared with a predetermined signal to determine whether the chip is a good product or a defective product.

Usually, the above-mentioned input signal and output signal are sent from the tester or sent to the tester by the probe needles held on the probe card so as to match the positions of the electrodes (pads) provided on the chip. At this time, the above probe card was converted into a corresponding one depending on the kind of the object to be measured.

The conversion method was a troublesome method in which the operator selected a probe card fixed to the insert ring portion with a screw according to the data of the next measurement object and manually converted it.

Furthermore, for measurement, peripheral devices such as testers,
Sometimes the operator recognizes the ID written on the DUT and the product type name is already known, but it also takes time and effort to enter the corresponding parameters.

An attempt to automate the above matters is disclosed in JP-A-60-
72239, JP-A-61-154138 and the like.

(Problems to be Solved by the Invention) At present, the demand for semi-custom ICs is increasing with the diversification of ICs. Further, the number of cases of high-mix low-volume production has increased, and the number of cases in which integrated circuit elements of different types are formed on one measured object, such as a wafer, has increased.
For this reason, it would take too much time if the above-mentioned operator switched the probe card corresponding to each data of the object to be measured by each means.

Further, also in peripheral devices for performing measurement and the like, the same problem as described above occurs because the operator selects from various types of data each time the data of the measured object is converted.

The semiconductor manufacturing process is desired to be automated in order to improve productivity, yield, and quality. In particular,
With the high integration of chips on the device under test, semiconductor measurement equipment,
For example, a wafer prober is required to be completely unmanned and capable of measuring a large number of small-quantity wafers. Therefore, in order to automate the semiconductor measuring device, it is desired to enable automatic recognition of the type of the measured object, automatic loading of a measurement program such as a tester based on the recognition, and automatic conversion of the probe card.

The present invention has been made in order to satisfy the above demands, and provides a multi-product measuring device which saves the labor of an operator, promotes complete automation of a semiconductor measuring device, and has an effect of improving work efficiency. It is a thing.

[Structure of Invention]

(Means for Solving Problems) The present invention recognizes data previously provided on a measured object, automatically transmits the data to a probe device and a peripheral device, and at the same time, a head plate of the probe device. Select and transport the probe card corresponding to the above data,
An upper surface of the probe card in a multi-product measuring device having means for mounting and means for loading a program corresponding to the above-mentioned data into the peripheral device, and performing probing measurement of multi-product automatically. And a chuck having a plurality of protruding pins for supporting the probe card taken out from the cassette by a handling arm with the lock portion facing upward, and a chuck provided on the head plate and rotated by a motor. And a lock ring that releasably engages with the lock portion of the probe card to fix the probe card to the head plate.

(Operation) The measuring device of the present invention recognizes data provided in advance on the object to be measured, automatically transmits the data to the probe device and the peripheral device, and also corresponds to the data in the inspection unit of the probe device. It has a means for selecting, transporting, and mounting a probe card to be used, and a means for loading a program corresponding to the above data to the above peripheral device, and since it is configured to perform probing measurement of various types, the operator's labor is saved. Omit, promote full automation of measuring equipment,
The effect that the work efficiency can be improved can be obtained.

(Embodiment) A fully automatic wafer probe apparatus, which is an embodiment of the apparatus of the present invention, will be described below with reference to the drawings. FIG. 1 shows a schematic overall view of a wafer probe apparatus, mainly including a loader section (1), a prober section (2), a test head (3),
It consists of an operation panel (4). The loader unit (1) is an object supply unit, and is an installation position where one or a plurality of wafer cassettes (6) accommodating, for example, 25 wafers (5) are installed.

The number of wafer cassettes varies depending on the probe device, but normally, 2 to 4 cassettes including a supply cassette and a storage cassette can be installed.

The wafers (5) stored in the cassette are taken out one by one by a transfer means such as a vacuum suction arm and transferred onto the chuck (7) of the prober unit (2). Wafer (5)
The position can be automatically detected by detecting the groove at the outermost edge of each wafer (5) installation groove provided in the cassette (6) and storing the groove interval in advance.

The wafer cassette (6) is transferred to the cassette storage portion manually or by a clean robot or the like (not shown). When the first measurement cassette is transported to the cassette storage section, the loading of the cassette (6) is confirmed by a switch mechanism or the like that automatically operates by placing the provided cassette.
Fix the cassette (6) in a predetermined position. This switch is effective when connected to a power switch (not shown) of the wafer transfer drive system, and at the same time as receiving a signal to fix the cassette, the first measurement wafer (5) is taken out by the vacuum suction arm. It is desirable to move to the measurement process.
This switch may be an optical element, an optical detection means, a magnetic detection means, or the like, and may be any switch as long as it receives the installation of the cassette (6) and automatically performs the probing process sequentially. Further, it is apparent that the wafer size can be recognized from the detection of the outermost wafer installation groove provided in the wafer cassette (6) by the reception at this time.

Next, in order to perform the measurement, data indicating that it is different for each wafer (5) or each different chip (8) is provided in advance. For example, write the barcode. It is necessary to send data according to such differences in product type to the probe card (9), tester (3) and the like. That is, it is necessary to change and set the probe card (9) and the tester (3) depending on the product type. Therefore, it is necessary to recognize the data of the wafer or chip (8) on the wafer (5). The operator self-recognizes this data, and the operation panel (4)
It is also possible to activate the input, i.e. input manually, but it is preferable to use a data recognition device (not shown) to do it fully automatically.

As a method of recognizing the data of the object to be measured, as shown in FIG. 3, it is necessary to have an optical means for reading data (product code) (10) such as a product provided on the wafer (5). It is one way. This optical means is performed by, for example, an alignment stage (11) that performs a 5-point check. It is also possible to automatically perform the next operation by reading the data of this optical system, but by using this optical system, the function to display the data on the monitor (12),
If manual support is also included, it will be advantageous in case of probing failure. The optically read data is converted into a digital signal, the data is collated with pre-stored data to recognize the data, and the stored control program is read based on this data. Is transmitted to the probe card converter, the tester (3), etc.

These data transmission / reception, conversion, and the like may be performed by a central processing unit (CPU) that manages a data program such as a probe card converter and a tester (3).

The prober unit (2) is equipped with an alignment stage (11).
It consists of an XY stage, fine alignment of the wafer (5) on the chuck (7) is performed by the alignment stage, and while the chuck is driven in the XY direction by the XY stage, the pad of the chip (8) of the wafer (5) and the probe card. The needle (13) in (9) is brought into contact with the needle for measurement.

The probe card (9) has a needle (13) in contact with the chip pad in the center, and a gold-plated round (15), which is connected to the terminal on the connector (14) side, on the surface to be attached to the connector (14), the connector. A lock mechanism (lock portion 16) that is locked to a lock ring that is the lock mechanism on the (14) side is formed.

On the other hand, the connector (14) is provided with a lock ring (17) having a protrusion (17a) that engages with the groove (16a) of the lock portion (16) of the probe card (9) as a lock mechanism. Gear part (17b) provided on the outer periphery of the lock ring (17)
Is engaged with the worm (18a) of the step motor (18), and the rotation of the motor (18) causes the lock ring (17) to rotate.
By rotating, the protrusion (17a) can be engaged with or disengaged from the lock portion (16) of the probe card (9).

A magnetic head, an optical reading unit, or the like is provided as a data reading unit for reading data of an ID (10) such as a magnetic tape or a bar code or a character in the alignment unit of the prober unit and the test head.

 Next, the chuck (7) will be described.

The chuck (7) normally sucks and holds a wafer by vacuum suction and is driven by each stage. In the present invention, the chuck (7) carries not only the wafer but also a probe card (9) and carries it. Used for. The chuck (7) is provided with a pin (19) which can be projected from the upper surface of the chuck. Pin (19) is chuck (7)
It serves as lift means for lifting the upper probe card (9) upward, and when the probe card (9) is conveyed to the lower part of the connector (14) by the XY stage, the pin (19) protrudes from the upper surface of the chuck and the probe card ( 9) is lifted upward to bring the probe card (9) close to the connector (14).

The automatic transfer and mounting of the probe card (9) in the above-mentioned configuration will be described. First, for example, a cassette dedicated to the probe card (9) is set in the loader unit (1) and started. The loader unit (1) takes out the probe card (9) from the cassette by a handling arm or the like and mounts the probe card (9) above the chuck (7) of the prober unit (2). If the one mounted on the chuck (7) is the probe card (9), the alignment is not performed and the chuck (7) is driven by the XY stage to directly convey the probe card (9) below the connector (14). . Then, the whole chuck (7) is raised to raise the probe card (9).
And the connector (14). In this state, the lock ring (17) is rotated to engage the protrusion (17a) with the groove (16a) of the lock portion (16) of the probe card (9) to connect the probe card (9) to the connector (14). Fixed to.

When the lock mechanism (lock portion 16 and lock ring 17) is engaged, the probe card (9) and the connector (14) are arranged such that the gold-plated round (15) and the position of the terminal pin match.

To remove the probe card (9) from the connector (14), the chuck (7) is moved to the lower side of the ring insert part, and the lock ring (17) is first rotated in the reverse order of the attachment. (17a) and lock part (1
The probe card (9) is placed on the chuck (7) by releasing the engagement of 6), conveyed to the loader unit (1), and returned into the cassette by the loader unit (1). In this way, automatic conversion of the probe card (9) is achieved.

In the above embodiment, when the probe card (9) is connected to the connector (14), the probe card (9) is previously chucked (7) so that the lock portion (16) and the lock ring (17) are engaged with each other. Although it is necessary to align the position when the device is mounted on the device, in the present invention, a function for automatically adjusting the position can be added.

After installing the probe card (9), when the test head (3) is installed on the head plate (20) of the probe device main body, the probe card (9) has the ring insert part (2).
The chip (8) on the wafer (5) can be measured by being electrically connected to the test head (3) via 1).

The test head (3) has a function of automatically loading the program obtained by the data recognition because the measurement program differs depending on the kind of the measurement chip (8) and the like like the probe card (9) described above.

In this way, when there are different kinds of integrated circuit elements on one wafer, a code corresponding to the kind of the integrated circuit element part is stamped on the wafer, for example, by a bar code or on a scribe line of the element, Just print it.

By doing so, it is possible to save the operator's trouble and continue the measurement while editing the measurement program of the object to be measured.

The above embodiment describes the semiconductor measuring device adapted to the wafer prober, but the present invention is not limited to this.For example, a measuring device satisfying the scope of claims such as an inspection of a printed circuit board or an inspection of a liquid crystal substrate is possible. Any one is acceptable.

Further, for example, in the case of a gate array or the like, when the probe card is designed to have the same chip size and pad position, it is not necessary to convert the probe card for each product type. In such a case, it is possible to automatically switch only the measuring program of the peripheral device, for example, the tester.

〔The invention's effect〕

According to the present invention as described above, it is possible to obtain the effects that the labor of the operator is saved, the automation of the measuring device is promoted, and the work efficiency can be improved.

Moreover, the lock portion is provided on the upper surface of the probe card, and the probe card taken out from the cassette by the handling arm is supported by the chuck with the lock portion facing upward, while the head plate is rotated by the motor to rotate the probe card. By providing a lock ring that engages with the lock part in a disengageable manner, and by engaging the lock part of the probe card supported by the chuck with the lock ring, the probe card can be automatically operated without human intervention such as an operator. Since it can be mounted on the head plate, a large number of probe cards stored in the cassette can be fully automated, and the structure is simple and can be provided at low cost.

[Brief description of drawings]

FIG. 1 is a schematic overall view for explaining an embodiment of the device of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a probing flowchart of FIG. 1, and FIG. b) is a plan view and a side view of the probe card shown in FIG. 2, FIG. 5 is a view showing the locking mechanism of the probe card shown in FIG. 4, FIG. 6 is a side view of the chuck shown in FIG. 2, and FIG. It is a figure explaining the data recognition method on the wafer of the figure. 1 …… loader section, 9 …… probe card 2 …… prober section, 10 …… data 3 …… test head, 13 …… probe needle 5 …… wafer, 14 …… connector 7 …… chuck, 16 …… lock Department

Claims (2)

(57) [Claims] 1. A device for recognizing data provided in advance on an object to be measured, automatically transmitting the data to a probe device and peripheral devices, and a probe card corresponding to the data on a head plate of the probe device. In a multi-product type measuring device characterized by having a means for selecting, carrying, and mounting and a means for loading a program corresponding to the above-mentioned data to the peripheral device, and performing a probing measurement of a multi-product type automatically, A lock portion provided on the upper surface of the probe card, a chuck having a plurality of projecting pins for supporting the probe card taken out from the cassette by a handling arm with the lock portion facing upward, and a chuck provided on the head plate. The probe card is rotated by a motor to engage and disengage with the lock part of the probe card. A multi-product measuring device comprising a lock ring fixed to a head plate. 2. The multi-product according to claim 1, wherein the probe card is electrically connected to the probe device and peripheral devices by being fixed to the head plate by a control lock ring. measuring device.