JP2024134584A - Data generation device and data generation method - Google Patents

Abstract

To provide a data generation device and a data generation method that can generate productivity data for evaluating the productivity of mounting conditions.SOLUTION: A data generation method for generating productivity data for evaluating the productivity of mounting conditions used in a component mounting device includes obtaining mounting performance data of multiple types of components mounted on a board by the component mounting device (ST1), extracting multiple mounting conditions for one type of component from the multiple types of components from the mounting performance data (ST2), calculating the productivity of the component mounting device corresponding to each mounting condition on the basis of the multiple mounting conditions (ST3), and generating productivity data for the one type of component on the basis of the calculated productivity (ST4).SELECTED DRAWING: Figure 11

Description

The present invention relates to a data generation device and a data generation method for generating productivity data for evaluating the productivity of mounting conditions used in a component mounting device.

The mounting operation of a mounting machine that mounts components on a board is controlled based on a large number of operating parameters, including mounting conditions related to component pickup by a nozzle, component imaging, and component mounting. Appropriate values for these operating parameters are set for each component as component data linked to component information, including information such as the component shape. Furthermore, even for the same component, component data with different operating parameters is created depending on the board to be mounted and the required quality and productivity. The system described in Patent Document 1 tally up the success rate of component mounting work for each component data, and corrects the operating parameters (control parameters) based on the tally up results.

Patent No. 6807528

However, in conventional techniques including Patent Document 1, if operating parameters are generated using only the success rate calculated from past performance as an evaluation index, it is possible that conditions with a high success rate but a slow pick-up speed and low productivity will be generated, and so there is a demand for data that can appropriately evaluate productivity when generating operating parameters or evaluating the quality of the operating parameters.

The present invention therefore aims to provide a data generation device and a data generation method that can generate productivity data for evaluating the productivity of mounting conditions.

The data generation device of the present invention is a data generation device that generates productivity data for evaluating the productivity of mounting conditions used in a component mounting device, and includes an acquisition unit that acquires mounting performance data of multiple types of components mounted on a board by the component mounting device, an extraction unit that extracts multiple mounting conditions for one type of component from the mounting performance data, a calculation unit that calculates the productivity of the component mounting device corresponding to each of the mounting conditions based on the multiple mounting conditions, and a generation unit that generates productivity data for the one type of component based on the calculated productivity.

The data generation method of the present invention is a data generation method for generating productivity data for evaluating the productivity of mounting conditions used in a component mounting device, and includes an acquisition step of acquiring mounting performance data of multiple types of components mounted on a board by the component mounting device, an extraction step of extracting multiple mounting conditions for one type of component from the mounting performance data, a calculation step of calculating the productivity of the component mounting device corresponding to each of the mounting conditions based on the multiple mounting conditions, and a generation step of generating productivity data for the one type of component based on the calculated productivity.

The present invention makes it possible to generate productivity data for evaluating the productivity of mounting conditions.

FIG. 1 is a configuration diagram of a production system according to an embodiment of the present invention; FIG. 1 is a configuration explanatory diagram of a component mounting line provided in a production system according to an embodiment of the present invention. FIG. 1 is a block diagram showing a configuration of a production system according to an embodiment of the present invention. FIG. 1 is an explanatory diagram of an example of component data used in a component mounting device according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of a method for calculating production capacity data according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of an example of a general index table used in a parts data management device (data generating device) according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of a method for determining a comprehensive index according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of an example of a productivity data (for each part) display screen displayed on a display provided in a production system according to an embodiment of the present invention. FIG. 13 is an explanatory diagram of an example of a productivity data (part-by-part details) display screen displayed on a display provided in a production system according to an embodiment of the present invention. FIG. 13 is an explanatory diagram of an example of a productivity data (multiple parts) display screen displayed on a display provided in the production system according to an embodiment of the present invention. FIG. 1 is a flow diagram of a data generation method according to an embodiment of the present invention.

One embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, screen displays, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the production system, component mounting line, component mounting device, production management device, and component data management device (data generation device). In the following, corresponding elements in all drawings are given the same reference numerals and duplicated explanations will be omitted.

First, the configuration of production system 1 will be described with reference to Figure 1. Production system 1 is configured to include floors F1-F3 in a customer's factory and a support center S. Support center S is established in a location away from floors F1-F3 (factories) and supports the customer's production activities. Each floor F1-F3 is equipped with component mounting lines L1-L3 that produce mounted boards with components mounted on boards as products. Note that floors F1-F3 may be configured to be installed within the same factory, or may be configured to be installed in multiple factories of the same customer or multiple customers' factories. Each floor F1-F3 has the same configuration, and floor F1 will be described below.

In FIG. 1, three component mounting lines L1 to L3 are installed on floor F1. The production equipment on component mounting lines L1 to L3 is connected to production management device 3 via an in-house communication network 2 such as a LAN (Local Area Network). The number of component mounting lines L1 to L3 installed on floor F1 does not have to be three, and may be one, two, four or more. The production management device 3 has the function of creating data and parameters necessary for the operation of the production equipment on component mounting lines L1 to L3 and transmitting them to each production device. In addition, the operation status, work history, and other operating results of each production device are transmitted from each production device to the production management device 3.

Floor F1 may be configured to include, in addition to the production management device 3, a line management device that manages the production of mounted boards for each of the component mounting lines L1 to L3. In the example shown in FIG. 1, the production management device 3 is installed inside floor F1 where the component mounting lines L1 to L3 are installed, but the production management device 3 may be installed outside floor F1. In addition to a configuration in which the production management device 3 is provided on each of floors F1 to F3 in the factory, a configuration in which one production management device 3 installed in the factory manages the component mounting lines L1 to L3 on each of floors F1 to F3 may also be used.

In FIG. 1, a component data management device 5 is installed in the support center S. The component data management device 5 is connected to the production management device 3 on the floors F1 to F3 via an external communication network 4 such as the Internet or a mobile communication line. With this configuration, the production management device 3 and the component data management device 5 can exchange information via the external communication network 4. The component data management device 5 has a function of acquiring the operation results collected by the production management device 3 on each of the floors F1 to F3, and generating productivity data for evaluating the productivity of the mounting conditions included in the component data used by the component mounting devices installed on the floors F1 to F3. The component data management device 5 may be configured to be installed on the customer's floors F1 to F3.

Next, the detailed configuration of component mounting lines L1 to L3 will be described with reference to Figure 2. Component mounting lines L1 to L3 have the same configuration, and below, component mounting line L1 will be described. Component mounting line L1 is configured by connecting production equipment such as printing device M1, print inspection device M2, component mounting devices M3 to M6, mounting inspection device M7, and reflow device M8 in series from upstream to downstream in the board transport direction. Note that component mounting line L1 is a group of production equipment connected via the on-site communication network 2, and the production equipment does not have to be physically connected to each other.

The printing device M1, the print inspection device M2, the component mounting devices M3 to M6, the mounting inspection device M7, and the reflow device M8 are connected to the production management device 3 via the on-site communication network 2. The printing device M1 performs a solder printing operation in which solder is printed through a mask having multiple openings formed on the board B brought in from upstream by the solder printing operation unit.

In FIG. 2, the print inspection device M2 performs print inspection work to inspect the condition of the solder printed on the board B using a print inspection work unit including a solder inspection camera. Note that a solder application device that applies solder to the board B may be provided in parallel with the printing device M1 or in place of the printing device M1. Also, the component mounting line L1 does not need to be provided with the print inspection device M2.

In FIG. 2, component mounting devices M3-M6 perform component mounting work to mount components D on board B using a component mounting work unit including a conveyor, component supply unit, and mounting head. Note that component mounting line L1 is not limited to a configuration of four component mounting devices M3-M6, and may have one to three component mounting devices M3-M6, or five or more component mounting devices M3-M6. In component mounting devices M3-M6, a conveyor installed along the board transport direction transports board B to the mounting work position. The component supply unit is located outside the conveyor, and supplies components D to a pick-up position by the mounting head.

The component supply unit is equipped with a cart carrying multiple tape feeders that feed components D by tape-feeding a carrier tape holding components D, and a tray feeder that supplies components D while switching between trays holding multiple components D. The mounting head has multiple suction nozzles that pick up components D supplied by the component supply unit and performs component mounting work by transferring and mounting the components D to the mounting position on board B transported and held by the conveyor. During setup changeover, carrier tapes and trays are set in the component supply unit so that the specified components D are supplied according to the type of board to be mounted (in other words, the components D are arranged).

In FIG. 2, component mounting devices M3 to M6 are equipped with a component recognition camera that captures the component D held by the suction nozzle, a sensor that measures the flow rate of air flowing into the suction nozzle, and a head camera that captures the components supplied by the tape feeder. Using the cameras and various sensors during component mounting operations, component mounting devices M3 to M6 monitor for operation errors, such as suction errors where the suction nozzle does not properly pick up components, and supply errors where the tape feeder does not properly supply components. The monitoring results are sent to production management device 3.

In FIG. 2, the mounting inspection device M7 performs mounting inspection work to inspect the state of the component D mounted on the board B using a mounting inspection work section including a component inspection camera. The monitoring results, such as a mounting error in which the component D is not mounted at the mounting position on the board B inspected by the mounting inspection device M7, are sent to the production management device 3. Note that the component mounting line L1 does not need to be equipped with the mounting inspection device M7. The reflow device M8 performs a board heating work in which the board B brought into the device is heated by a board heating section, the solder on the board B is melted and then hardened, and the electrode portion of the board B is joined to the component D.

Next, referring to FIG. 3, the configuration of the production system 1 equipped with the production management device 3 and the component data management device 5 (data generation device) will be described. Here, among the multiple functions equipped in the production system 1, the configuration related to the function of creating productivity data for evaluating the productivity of the mounting conditions included in the component data used by the component mounting devices M3 to M6 will be mainly described.

First, the configuration of the production management device 3 will be described. The production management devices 3 installed on floors F1 to F3 have the same configuration, and floor F1 will be used as an example for the description. An input unit 11 and a display 12 are connected to the production management device 3 installed on floor F1. The production management device 3 is also connected to the production devices provided on component mounting lines L1 to L3, including component mounting devices M3 to M6, via an in-house communication network 2. The production management device 3 is equipped with a production management memory unit 13, a performance collection unit 15, and a control unit (not shown). The production management memory unit 13 is, for example, a storage device such as a semiconductor memory or a hard disk drive, and stores operation performance 14 and the like.

In FIG. 3, the input unit 11 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The display 12 is a display device such as a liquid crystal panel, and in addition to displaying various data stored in the production management storage unit 13, displays various information such as an operation screen or input screen for operation by the input unit 11, and screen information transmitted from the parts data management device 5 of the support center S. The control unit is, for example, a CPU (central processing unit), and controls the entire production management device 3.

In FIG. 3, the performance collection unit 15 periodically collects performance data of component mounting work from production equipment, including component mounting equipment M3 to M6, installed on floor F1. The performance data of component mounting work includes information such as the production start date and time, production end date and time (the time when the production equipment produced the product), the number of boards produced, board information on the mounted boards, and line information on the configuration of the component mounting lines L1 to L3 that produced the boards, for each type of mounted board.

The performance record collection unit 15 also collects information related to component data used by component mounting devices M3 to M6, information related to the models of component mounting devices M3 to M6, placement information of components D in component mounting devices M3 to M6, various work errors that have occurred in component mounting devices M3 to M6, mounting errors detected by mounting inspection device M7, and the like. In other words, the performance record collection unit 15 collects mounting performance (component data, error performance, etc.) of multiple types of components D mounted on board B by component mounting devices M3 to M6. The information collected by the performance record collection unit 15 is stored in the production management storage unit 13 as operation performance 14.

In FIG. 3, the parts data management device 5 installed in the support center S has functions such as acquiring mounting records from the production management devices 3 installed on floors F1 to F3 of the customer's factory, creating productivity data for evaluating the productivity of mounting conditions, and displaying the productivity data on the displays 12 installed on floors F1 to F3. A storage device 20 is connected to the parts data management device 5.

The storage device 20 is a semiconductor memory or a hard disk drive, and stores mounting performance data 21, evaluation board information 22, evaluation production data 23, production capacity data 24, productivity data 25, overall index table 26, overall index data 27, etc. The component data management device 5 includes information processing devices such as an acquisition unit 30, an extraction unit 31, a calculation unit 32, a generation unit 33, a display processing unit 34, an overall index determination unit 35, and a control unit (not shown).

Each information processing device may be configured with independent hardware assets, or may be configured with a common CPU and a program for each information processing. The control unit is, for example, a CPU (Central Processing Unit) that controls the entire part data management device 5. Furthermore, the part data management device 5 does not need to be configured with a single computer, but may be configured with multiple devices. For example, the storage device 20 and all or part of the information processing devices that make up the part data management device 5 may be provided in the cloud via a server.

In FIG. 3, the acquisition unit 30 acquires component data including mounting conditions (operation parameters) of multiple types of components D mounted on the board B by component mounting devices M3-M6, information on the models of the component mounting devices M3-M6, and error information on work errors and mounting errors from the operation records 14 collected by multiple production management devices 3 installed on multiple floors F1-F3 (factories), and stores the data in the storage device 20 as mounting record data 21. That is, the acquisition unit 30 acquires mounting record data 21 of multiple types of components R1, R2 mounted on the board B by the component mounting devices M3-M6 (ST1 in FIG. 5).

The mounting history data 21 may include component data for multiple types of components D used on different floors F1 to F3, and error information related to errors such as the number of supply errors, pickup errors, and mounting errors that occurred when a mounted board was produced using that component data. The mounting history data 21 may also include multiple component data (mounting conditions) used for the same type of components D. The mounting history data 21 may also include component data for the same type of components D used on different models of component mounting devices M3 to M6. The mounting history data 21 may also include multiple component data used when the same type of components D were mounted on different types of boards B.

In FIG. 3, the extraction unit 31 extracts component data 21a for each type of component D from the mounting history data 21, and stores the extracted component data 21a in the storage device 20. That is, the extraction unit 31 extracts multiple component data 21a (mounting conditions 1 to 3) for one type of component R1 out of multiple types of components R1 and R2 used by component mounting devices M3 to M6 from the mounting history data 21 (ST2 in FIG. 5).

The extraction unit 31 also extracts actual error rates 21b (actual error rates P1 to P3) corresponding to multiple component data 21a (mounting conditions 1 to 3) for one type of component R1 from the mounting performance data 21, associates them with the model names of component mounting devices M3 to M6, and stores them in the storage device 20 (ST2 in Figure 5).

If the mounting history data 21 does not include the actual error rate 21b, the extraction unit 31 extracts the number of mountings N1 to N3 in which the component D was mounted on the board B using the component data 21a from the mounting history data 21 and the number of times an error such as a work error occurred (number of errors E1 to E3), and calculates the actual error rate 21b (number of errors/number of mountings) for each component data 21a. That is, the extraction unit 31 extracts the number of mountings N1 to N3 and the number of errors E1 to E3 corresponding to multiple component data 21a (mounting conditions 1 to 3) for one type of component R1 from the mounting history data 21, calculates the actual error rate 21b (number of errors/number of mountings), associates it with the model names of the component mounting devices M3 to M6, and stores it in the storage device 20.

Now, referring to FIG. 4, an example of part data 21a will be described. Part data 21a is assigned a part data code indicated by "part n" (n=1, 2, 3, ...) that identifies part data 21a. Part data 21a of the same type of part D but with different mounting conditions is assigned a different part data code to distinguish it from other part data 21a. Part data 21a has part information 40 and operating parameters 41 defined as major classification items.

In FIG. 4, part information 40 is information that indicates attributes unique to the type of part D. Here, "Name" 40a, "Shape" 40b, "Size" 40c, and "Part parameters" 40d are shown as examples of intermediate classification items. "Name" 40a is information for identifying part D, and the "product number" assigned by the part manufacturer or the company for management purposes is defined as a minor classification item. "Shape" 40b is information about the shape of part D, and minor classification items include "shape" that indicates the external shape of part D using a shape category such as rectangular or cylindrical, a drawing showing the shape of part D, and information that identifies image information.

In "Size" 40c, subcategories include "External dimensions" indicating the size of part D, and "Electrode position" indicating the number and position (spacing) of connection electrodes (leads) formed on part D. "Part parameters" 40d is attribute information of part D, and subcategories include "Part type" indicating the type of part D, "Polarity" indicating whether the external shape of part D has a directional property, "Polarity mark" indicating the shape of the mark affixed to part D if polarity is present, and "Mark position" indicating the position of the mark if a polarity mark is present.

In FIG. 4, the operation parameters 41 are a group of control parameters (mounting conditions) used to control the component mounting devices M3 to M6 when performing component mounting work on the component D defined in the component data 21a. Here, examples of intermediate classification items include "nozzle setting" 41a, "speed parameter" 41b, "recognition" 41c, "pickup" 41d, and "mounting" 41e.

"Nozzle setting" 41a is data related to the suction nozzle (holding part) used to hold component D, and "nozzle (nozzle type)" is specified as a minor category that specifies the type of suction nozzle that can be selected. "Speed parameter" 41b is a control parameter related to the movement speed of the suction nozzle in the work operation of picking up component D with the suction nozzle and mounting it on board B. These control parameters include, as minor categories, the "suction speed" and "suction holding time" when suctioning and holding component D, the "mounting speed" and "mounting holding time" when mounting the held component D on the board, and the "feeder drive speed" when the tape feeder pitch-feeds component D.

In FIG. 4, "recognition" 41c is a parameter related to the execution of a recognition process in which a component D picked up by a suction nozzle from a component supply unit is imaged and recognized by a component recognition camera. These parameters include, as subcategory items, "camera type" that specifies the type of camera used for imaging, "lighting mode" that indicates the lighting mode used when imaging, "transmitted lamp offset", "reflected lamp offset", and "BGA lamp offset" that indicate the illuminance of the lighting, and "recognition speed" when recognizing the image obtained by imaging.

"Suction" 41d is a control parameter related to the suction operation when a component D is taken out of the component supply unit by a suction nozzle. These control parameters include, as subcategories, "suction position X" and "suction position Y" that indicate the suction position offset when the suction nozzle lands on the component D, "suction position learning" and "suction position automatic teaching" that indicate the teaching of the suction position, and the like. "Mounting" 41e is a control parameter related to the mounting operation in which the mounting head that holds the component D by suction with the suction nozzle is moved to the board, and the suction nozzle is made to perform a lifting and lowering operation to mount the component D on the board B. These control parameters include, as subcategories, "mounting load" that is the load with which the component D is pressed against the board B when the suction nozzle is lowered to land the component D on the board B, "mounting operation" that indicates the operation mode in which the suction nozzle is lowered, and "automatic height measurement" that indicates the height measurement of the board B, and the like.

In this way, each of the multiple operating parameters 41 (mounting conditions) includes, as multiple detailed mounting conditions, a parameter related to the speed at which component D is moved (such as speed parameter 41b), a parameter related to the type of holding part that holds component D (such as nozzle setting 41a), and a parameter related to the operating mode for mounting component D (such as mounting 41e).

In FIG. 4, even if the "product name" 40a is the same for component D, i.e., the component information 40 is the same, the operating parameters 41 (mounting conditions) may be changed due to changes in the model of component mounting device M3 to M6 mounted on board B, the material of board B, the arrangement of electrodes on board B, etc., or to improve the required mounting quality or work error rate.

When the operating parameters 41 of component D are changed, new component data 21a is created, linking the changed operating parameters 41 to the component information 40. At this time, a new code is assigned to "component n" (component data code) in the component data 21a to distinguish it from the operating parameters 41 before modification. In this way, in the component data 21a, the operating parameters 41, which are the mounting conditions for component mounting devices M3 to M6 to mount component D on board B, are linked to the component information 40 indicating the unique attributes of component D.

In FIG. 3, evaluation board information 22 stores information on multiple evaluation boards (evaluation boards) corresponding to components D with different external shapes and sizes. The evaluation boards are boards B for evaluating the productivity of component mounting devices M3 to M6, and are set up so that the same components D are mounted on a single board B at multiple locations (e.g., 400 locations for chip components) with different mounting intervals and mounting directions, allowing the work time and mounting quality to be evaluated. In other words, an evaluation board (predetermined board) is an evaluation board set up to mount a predetermined number of one type of components D at predetermined locations in a predetermined direction.

For example, standards provided by trade associations such as the Institute for Printed Circuits (IPC) can be used as evaluation boards. Information on the evaluation board includes the mounting position (X coordinate, Y coordinate) and mounting direction (0°, 90°, 180°, 270°, etc.) of component D. By using standardized evaluation board information, the productivity of component mounting devices M3 to M6 can be appropriately compared even if the models of component mounting devices M3 to M6 are different.

In FIG. 3, the evaluation production data 23 is production data set to be used with component mounting devices M3 to M6 to mount component D on an evaluation board, and evaluation production data 23 is prepared in advance corresponding to combinations of the models of component mounting devices M3 to M6 and the types of evaluation boards. In the evaluation production data 23, dummy component data 21a for component D to be mounted on the evaluation board, component placement for evaluation, information on the evaluation mounting head, and the like are set as initial values.

The calculation unit 32 calculates the productivity of the mounting conditions by simulating the component mounting devices M3 to M6 mounting the components D on the evaluation board (predetermined board) using the component data 21a (mounting conditions) based on the component data 21a (mounting conditions), the evaluation board information 22, and the evaluation production data 23 stored in the storage device 20 (ST3 in FIG. 5). That is, the calculation unit 32 calculates the productivity of the component mounting devices M3 to M6 corresponding to each mounting condition by simulating the component mounting devices M3 to M6 mounting one type of component D on the predetermined board (evaluation board) using each mounting condition (component data 21a). Note that a virtual evaluation method in which multiple components D are mounted multiple times at the same position on the evaluation board may also be used.

Specifically, the calculation unit 32 replaces the dummy component data 21a in the evaluation production data 23 with the component data 21a to be calculated, optimizes the component layout and mounting head configuration to correspond to the component D to be calculated, and executes a simulation that mimics the operation of component mounting devices M3 to M6 to calculate the productivity of component mounting devices M3 to M6 that corresponds to the mounting conditions (operation parameters 41) included in the component data 21a. For example, CPH (chip per hour) is used as the productivity, which indicates the number of components D that component mounting devices M3 to M6 mount in one hour.

When there are multiple mounting heads corresponding to the type of suction nozzle (holding unit) included in the operation parameters 41 (mounting conditions) of the component data 21a, the calculation unit 32 optimizes the placement of the components D for all mounting heads and executes a simulation, and adopts the maximum CPH among the multiple calculated CPHs as the productivity of the component mounting devices M3 to M6 corresponding to the mounting conditions. When there are multiple models of the component mounting devices M3 to M6, the calculation unit 32 calculates the productivity for each model. The calculation unit 32 associates the calculated productivity (CPH) with the component data code of the component data 21a, the model of the component mounting devices M3 to M6, and the type of evaluation board, and stores it in the storage device 20 as production capacity data 24.

The calculation unit 32 may calculate the productivity of the mounting conditions using a simple method other than the above-mentioned method of calculating the productivity of the mounting conditions by simulation. For example, the calculation unit 32 may calculate the productivity scored according to the detailed mounting conditions, such as "10 points" if the mounting speed, which is the speed parameter 41b (detailed mounting condition) included in the operation parameter 41 (mounting condition) of the component data 21a, is "100%", and "4 points" if it is "40%". In this case, the productivity is calculated that does not depend on the board B on which the component D is mounted or the evaluation board. In other words, the calculation unit 32 may calculate the productivity of the component mounting devices M3 to M6 corresponding to each mounting condition using the detailed mounting conditions (mounting speed, etc.) included in each mounting condition (component data 21a).

In FIG. 3, the overall index table 26 contains information necessary to generate an overall index for evaluating the quality of the component data 21a from the productivity (CPH) of component mounting devices M3 to M6 corresponding to the mounting conditions (operation parameters 41) included in the component data 21a and the actual error rate 21b corresponding to those mounting conditions.

Now, referring to FIG. 6, an example of the overall index table 26 will be described. In this example, the overall index 50 is divided into four stages, from a good "A" to a bad "D", based on the relationship between the productivity (CPH) of component mounting devices M3 to M6 corresponding to the mounting conditions and the actual error rate 21b. Specifically, the productivity (CPH) is divided into five stages (20,000 or more, 19,000 or more and less than 20,000, 18,000 or more and less than 19,000, 15,000 or more and less than 18,000, and less than 15,000). The actual error rate 21b is divided into four stages (less than 0.5%, 0.5% or more and less than 1.0%, 1.0% or more and less than 2.0%, and 2.0% or more).

The overall index 50 is defined based on the relationship between the productivity (CPH) category and the actual error rate 21b category. For example, "A" is defined as the overall index 50 for the section where the productivity (CPH) is "20,000 or more" and the actual error rate 21b is "less than 0.5%". Also, "D" is defined as the overall index 50 for the section where the productivity (CPH) is "less than 15,000" and the actual error rate 21b is "2.0% or more". In other words, the higher the productivity (CPH) and the lower the actual error rate 21b, the better the overall index 50 (the better the implementation conditions), and the lower the productivity (CPH) and the higher the actual error rate 21b, the worse the overall index 50 (the worse the implementation conditions).

The overall index 50 is not limited to four levels, the productivity (CPH) to five levels, and the actual error rate 21b to four levels, and may be changed as appropriate. The categories of productivity (CPH) and actual error rate 21b may be changed as appropriate depending on the size of component D and the models of component mounting devices M3 to M6. The overall index 50 is not limited to the alphabetical order of "A" to "D", and may be, for example, numbers "1" to "4", or "◯", "△", "X", "sunny", "cloudy", "rainy", etc.

In FIG. 3, the overall index determination unit 35 determines an overall index 50 corresponding to the mounting conditions of the component data 21a based on the productivity (CPH) and actual error rate 21b calculated by the calculation unit 32, and the overall index table 26, and stores the overall index 50 in the storage device 20 as overall index data 27 (FIG. 7). In this way, the overall index 50 is an index that can comprehensively evaluate the quality of the component data 21a, taking into account the productivity (CPH) and error occurrence probability (actual error rate 21b) corresponding to the operation parameters 41 (mounting conditions) included in the component data 21a.

The overall index determination unit 35 may determine the overall index 50 by weighting the productivity and the actual error rate 21b without using the overall index table 26. The overall index determination unit 35 may also determine the overall index 50 by using a relational equation that calculates the overall index 50 using the productivity and the actual error rate 21b as variables.

In addition, an overall index table 26, weighting, and relational expressions corresponding to a plurality of evaluation objectives may be prepared, and the overall index determination unit 35 may determine a plurality of overall indexes 50. For example, an overall index 50 that emphasizes productivity, an overall index 50 that emphasizes the error rate, an overall index 50 that emphasizes the balance between productivity and error rate, etc. may be derived, and displayed on the display 12 as productivity data 25, as described below. Note that the overall index table 26, weighting, and relational expressions may be prepared in advance, or may be set by the customer, and the ones set by the customer may be used.

The generating unit 33 creates productivity data 25 included in a display screen displayed on a display 12 set on floors F1 to F3 (customer's factory) so that a factory manager or the like can evaluate the productivity of the mounting conditions of the component data 21a. Specifically, the generating unit 33 generates the productivity data 25 for one type of component D based on the calculated productivity (CPH). The generating unit 33 also generates the productivity data 25 based on the productivity (CPH) and actual error rate 21b corresponding to each mounting condition of the one type of component D. The generating unit 33 also generates the productivity data 25 based on an overall index 50 (overall index data 27) corresponding to each mounting condition of the one type of component D.

In FIG. 3, the generation unit 33 generates productivity data 25 for multiple types of parts D by repeatedly creating productivity data 25 for one type of part D for multiple types of parts D. The display processing unit 34 executes a display process to display the productivity data 25 on the displays 12 installed on floors F1 to F3.

Next, referring to Figs. 8 to 10, an example of a productivity data display screen displayed on the display 12 by the display processing unit 34 will be described. Fig. 8 is an example of a productivity data (per part) display screen 51 displayed on the display 12 by the display processing unit 34. The productivity data (per part) display screen 51 displays a part name selection frame 52, a data display frame 53, a details display button 54, a condition selection display button 55, and a cancel button 56. When a part name is selected in the part name selection frame 52 by operating the input unit 11, an overall index 50 for part D of the selected part name and the like are displayed in the data display frame 53. In this example, a part with the part name "R1" (hereinafter referred to as "part R1" etc.) has been selected.

The data display frame 53 has a number column 53a, an operation parameter display column 53b, and an evaluation value display column 53c. The number column 53a displays the condition number assigned to the mounting condition included in the component data 21a used to mount the component R1. In this example, the data display frame 53 displays data related to the mounting conditions included in the five component data 21a, "Condition 1" to "Condition 5". The operation parameter display column 53b displays, from among the multiple detailed mounting conditions included in the component data 21a, "Placement speed" and "Pickup speed" indicating the speed at which the component R1 is moved, "Nozzle type" indicating the type of holder that holds the component R1, and "Mounting operation" indicating the operation mode for mounting the component R1.

8, the evaluation value display field 53c displays information included in the productivity data 25. In this example, the productivity (CPH) included in the production capacity data 24 calculated based on the mounting conditions included in the component data 21a, the actual error rate 21b under the mounting conditions, the number of errors, and the number of mountings, and the overall index 50 included in the overall index data 27 generated from the productivity and the actual error rate 21b are displayed. Note that the productivity (CPH) and actual error rate 21b displayed in the evaluation value display field 53c may be alphabets (A, B, C, ...), numbers (1, 2, 3, ...), and symbols (o, △, x, etc.) in addition to the numerical values shown in FIG. 8. Furthermore, the data displayed in the data display frame 53 is not limited to the example in FIG. 8, and the models of the component mounting devices M3 to M6 used in the calculation of the productivity and the type of evaluation board may also be displayed.

In this way, the display processing unit 34 displays the productivity (CPH) (production capacity data 24), actual error rate 21b, and overall index 50 (overall index data 27) included in the productivity data 25 for each of a plurality of mounting conditions on the display 12. By displaying the productivity (CPH), actual error rate 21b, and overall index 50 for each mounting condition of one type of component D on the display 12 set up on floors F1 to F3 (customer's factories), the factory manager can easily judge the quality of the component data 21a and can easily select the component data 21a that is optimal in terms of productivity, the application of the mounting board, etc. from the component data 21a with a mounting record.

The display processing unit 34 does not need to display all (three) of the productivity, actual error rate 21b, and overall index 50 as the productivity data 25 in the evaluation value display field 53c, but may display at least one (one or two) of the productivity and overall index 50.

When mounting conditions are selected from the number column 53a of the data display frame 53 by operating the input unit 11 and the detail display button 54 is pressed, the display processing unit 34 displays a productivity data (details by part) display screen on the display 12. In FIG. 8, three mounting conditions, "Condition 1", "Condition 2", and "Condition 3", are selected, and a selection display 53d is displayed surrounding the three selected mounting conditions, with "Condition 1", "Condition 2", and "Condition 3" in the number column 53a being hatched with diagonal lines.

Figure 9 is an example of a productivity data (details by component) display screen 57 that the display processing unit 34 displays on the display 12 when the detail display button 54 in Figure 8 is pressed. The productivity data (details by component) display screen 57 displays a display component frame 58, a detailed mounting conditions display frame 59, and a back button 60. The display component frame 58 displays the component name (R1) of the component whose detailed mounting conditions are displayed in the detailed mounting conditions display frame 59.

The detailed mounting condition display frame 59 includes an item display field 59a, a condition 1 display field 59b, a condition 2 display field 59c, a condition 3 display field 59d, a productivity display field 59e, an actual error rate display field 59f, and an overall index display field 59g. The item display field 59a displays the item names corresponding to the subcategory items (detailed mounting conditions) of the operation parameters 41 (mounting conditions) of the component data 21a shown in FIG. 4.

In FIG. 9, the detailed mounting conditions of "Condition 1", "Condition 2", and "Condition 3" are displayed in the condition 1 display field 59b, the condition 2 display field 59c, and the condition 3 display field 59d. In this example, the detailed mounting conditions displayed are "Nozzle type" from the nozzle settings 41a shown in FIG. 4, "Mounting speed", "Pickup speed", "Mounting hold time", "Pickup hold time", and "Feeder drive speed" from the speed parameters 41b, "Transmitted lamp offset", "Reflected lamp offset", and "BGA lamp offset" from the recognition 41c, "Pickup position learning" and "Pickup position automatic teach" from the pick-up 41d, and "Mounting operation" and "Automatic height measurement" from the mounting 41e.

The productivity display field 59e displays the productivity (CPH) (production capacity data 24) for "Condition 1," "Condition 2," and "Condition 3." The actual error rate display field 59f displays the actual error rates 21b for "Condition 1," "Condition 2," and "Condition 3." The overall index display field 59g displays the overall index 50 for "Condition 1," "Condition 2," and "Condition 3." When the scroll bar in the detailed implementation conditions display frame 59 is operated, the detailed implementation conditions displayed in the detailed implementation conditions display frame 59 are scrolled.

In FIG. 9, when the back button 60 is pressed by operating the input unit 11, the display returns to the productivity data (per part) display screen 51 (FIG. 8). In FIG. 8, when the condition selection display button 55 is pressed by operating the input unit 11, the display processing unit 34 displays the productivity data (multiple parts) display screen on the display 12. When the stop button 56 is pressed, the display processing unit 34 stops the display process.

Figure 10 is an example of a productivity data (multiple parts) display screen 61 displayed by the display processing unit 34 on the display 12 when the condition selection display button 55 in Figure 8 is pressed. The productivity data (multiple parts) display screen 61 displays a display condition selection frame 62, a data display frame 63, a detail display button 64, a part selection display button 65, and a cancel button 66. When a display condition is selected in the display condition selection frame 62 by operating the input unit 11, the overall index 50 for multiple parts D that match the selected condition is displayed in the data display frame 63. In this example, the parts D with the mounting condition "overall index A" are displayed. Other display conditions that can be selected include "productivity range" and "achievement error rate range".

The data display frame 63 has a part name column 63a, an operation parameter display column 63b, and an evaluation value display column 63c. The part name column 63a displays the part name of part D. The operation parameter display column 63b and the evaluation value display column 63c are similar to the operation parameter display column 53b and the evaluation value display column 53c of the productivity data (per part) display screen 51 shown in FIG. 8, and detailed description will be omitted.

In this way, the display processing unit 34 displays the productivity (CPH) (production capacity data 24), actual error rate 21b, and overall index 50 (overall index data 27) included in the productivity data 25 for each of the multiple types of parts D on the display 12. By displaying the productivity (CPH), actual error rate 21b, and overall index 50 for each mounting condition of the multiple types of parts D on the display 12 set up on floors F1 to F3 (customer's factories), the factory manager can create and change part data 21a to suit the productivity, use of the mounting board, etc.

When the detail display button 64 is pressed by operating the input unit 11, the display processing unit 34 causes the display 12 to display detailed information about the part name surrounded by the selection display 63d on the productivity data (multiple part details) display screen (not shown). When the part selection display button 65 is pressed by operating the input unit 11, the display processing unit 34 causes the display 12 to display the productivity data (by part) display screen 51 (Figure 8). When the stop button 66 is pressed, the display processing unit 34 stops the display process.

Next, following the flow of FIG. 11 and with reference to FIG. 5, a data generation method for generating productivity data 25 for evaluating the productivity of the mounting conditions (operation parameters 41) used by component mounting devices M3 to M6 will be described. First, the acquisition unit 30 acquires mounting performance data 21 in which component mounting devices M3 to M6 mount multiple types of components R1 and R2 on board B from the production management device 3 installed on floors F1 to F3 (factory) (ST1: acquisition process).

Then, the extraction unit 31 extracts from the mounting history data 21 a plurality of mounting conditions (component data 21a) used by component mounting devices M3 to M6 for one type of component R1 out of the plurality of types of components R1 and R2 (ST2: extraction process). The calculation unit 32 then calculates the productivity (production capacity data 24) of the component mounting devices M3 to M6 corresponding to each mounting condition based on the mounting conditions (operation parameters 41) included in the plurality of component data 21a for the one type of component R1 (ST3: calculation process). The generation unit 33 then generates productivity data 25 for the one type of component R1 based on the calculated productivity (production capacity data 24) (ST4: generation process).

In FIG. 11, if productivity data 25 has not been generated for all types of components R1 and R2 included in the mounting performance data 21, or if productivity data 25 has not been generated for all of the specified types of components (No in ST5), the extraction process (ST2), calculation process (ST3), and generation process (ST4) are repeatedly executed for the next type of component R2.

That is, the extraction unit 31 extracts mounting conditions (component data 21a) for each of the multiple types of components R1 and R2 from the mounting performance data 21 (ST2), the calculation unit 32 calculates the productivity (production capacity data 24) of component mounting devices M3 to M6 corresponding to each mounting condition based on the multiple mounting conditions (component data 21a) (ST3), and the generation unit 33 generates productivity data 25 for the multiple types of components R1 and R2 based on the calculated productivity (ST4).

When productivity data 25 has been generated for all types of components R1 and R2 (Yes in ST5), the display processing unit 34 displays the productivity data 25 on the display 12 (ST6: display processing step) (FIGS. 8 to 10). This makes it possible to generate productivity data 25 for evaluating the productivity of the mounting conditions.

As described above, the component data management device 5 of this embodiment is a data generation device that includes an acquisition unit 30 that acquires mounting history data 21 of multiple types of components D mounted on a board B by component mounting devices M3 to M6, an extraction unit 31 that extracts multiple mounting conditions (operation parameters 41 of component data 21a) of one type of component R1 of the multiple types of components R1 and R2 from the mounting history data 21, a calculation unit 32 that calculates the productivity (production capacity data 24) of the component mounting devices M3 to M6 corresponding to each mounting condition based on the multiple mounting conditions, and a generation unit 33 that generates productivity data 25 of one type of component R1 based on the calculated productivity.

This makes it possible to generate productivity data 25 for evaluating the productivity of mounting conditions.

In the above, the mounting conditions are described as operation parameters 41 included in the component data 21a, but this is not a limitation. For example, the mounting conditions (operation parameters 41) and the component information 40 may be stored as separate files and associated with each other by the component data code.

The data generation device and data generation method of the present invention have the effect of generating productivity data for evaluating the productivity of mounting conditions, and are useful in the field of component mounting, where components are mounted on a board.

5. Parts data management device (data generation device)
12 Display 50 Overall index D, R1, R2 Components M3 to M6 Component mounting device

Claims (13)

A data generation device for generating productivity data for evaluating productivity of mounting conditions used in a component mounting device, comprising:
an acquisition unit that acquires mounting performance data of a plurality of types of components mounted on a board by a component mounting device;
an extracting unit that extracts a plurality of mounting conditions for one type of component among the plurality of types of components from the mounting record data;
a calculation unit that calculates the productivity of the component mounting device corresponding to each of the plurality of mounting conditions based on the plurality of mounting conditions;
a generation unit that generates productivity data for the one type of part based on the calculated productivity. The data generating device according to claim 1, further comprising a display processing unit that displays the productivity data for the one type of part on a display. The extraction unit is
Further extracting a performance error rate corresponding to the mounting condition for each of the one type of components from the mounting performance data;
The generation unit is
2. The data generating device according to claim 1, further comprising: a data generating unit configured to generate productivity data for the one type of component based on the productivity and the actual error rate corresponding to each of the mounting conditions. The extraction unit is
Further extracting a performance error rate corresponding to the mounting condition for each of the one type of components from the mounting performance data;
The data generating device includes:
a comprehensive index determination unit that determines a comprehensive index corresponding to each of the mounting conditions based on the productivity and the actual error rate corresponding to each of the mounting conditions,
The generation unit is
2. The data generating device according to claim 1, further comprising: a data generating unit configured to generate productivity data for the one type of component based on a comprehensive index corresponding to each of the mounting conditions. The data generation device according to claim 1, wherein each of the plurality of implementation conditions includes a plurality of detailed implementation conditions. The detailed mounting conditions include:
6. The data generating device according to claim 5, further comprising at least one of a speed at which the component is moved, a type of a holder that holds the component, and an operation mode for mounting the component. The calculation unit is
2. The data generating device according to claim 1, wherein the productivity of each of the mounting conditions is calculated by simulating a process in which the component mounting device mounts the one type of component on a predetermined board using each of the mounting conditions. The data generating device according to claim 7, wherein the specified board is an evaluation board configured to mount a specified number of the one type of components at specified positions in a specified orientation. The extraction unit is
extracting mounting conditions for each of the plurality of types of components from the mounting record data;
The calculation unit is
Calculating the productivity of the component mounting device corresponding to each of the mounting conditions based on the plurality of mounting conditions for the plurality of types of components;
The generation unit is
The data generating device according to claim 1 , further comprising: a data generating unit configured to generate productivity data for the plurality of types of parts based on the calculated productivity. The data generating device according to claim 9, further comprising a display processing unit that displays the productivity data for the multiple types of parts on a display. The extraction unit is
further extracting, from the mounting record data, a record error rate corresponding to the mounting condition for each of the plurality of types of components;
The generation unit is
10. The data generating device according to claim 9, further comprising: a data generating unit configured to generate productivity data for the plurality of types of components based on the productivity and the actual error rate corresponding to each of the mounting conditions. The extraction unit is
further extracting, from the mounting record data, a record error rate corresponding to the mounting condition for each of the plurality of types of components;
The data generating device includes:
a comprehensive index determination unit that determines a comprehensive index corresponding to each of the mounting conditions based on the productivity and the actual error rate corresponding to each of the mounting conditions,
The generation unit is
10. The data generating device according to claim 9, further comprising: a data generating unit configured to generate productivity data for the plurality of types of components based on a comprehensive index corresponding to each of the mounting conditions. 1. A data generation method for generating productivity data for evaluating productivity of mounting conditions used in a component mounting device, comprising:
an acquisition step of acquiring mounting performance data of a plurality of types of components mounted on a board by the component mounting device;
an extraction step of extracting a plurality of mounting conditions for one type of component among the plurality of types of components from the mounting record data;
a calculation step of calculating the productivity of the component mounting device corresponding to each of the plurality of mounting conditions based on the plurality of mounting conditions;
generating productivity data for the one type of part based on the calculated productivity.

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