JP2023180271A - Electronic component unit and method for manufacturing electronic component unit - Google Patents

Abstract

To provide an electronic component unit and a method for manufacturing an electronic component unit that can improve waterproofness and be easily manufactured.SOLUTION: An electronic component unit 1 includes a board 2 on which an electronic component 3 is mounted, a bracket 10 including a base 11, two or more gripping pieces 12 having one end connected to the base 11 and the other end gripping the board 2 and positioning the board 2 at a distance from the base 11, a front mounting piece 13 that protrudes from the front and back of the base 11 to the front and rear of the base 11, respectively, and a rear mounting piece 14, and a resin case 17 enclosing the board 2, the base 11, and the gripping piece 12 by molding. The front mounting piece 13 and the rear mounting piece 14 protrude outside the resin case 17.SELECTED DRAWING: Figure 2

Description

The present invention relates to an electronic component unit and a method for manufacturing an electronic component unit.

The electronic component unit includes, for example, a board on which electronic components are mounted, a rectangular metal base having a recess in the center and mounting holes at the four corners, and a metal base that is filled in the recess of the metal base and attached to the bottom of the recess. and an epoxy resin molding material that covers the substrate (for example, see Patent Document 1).

Other electronic component units include a board on which electronic components are mounted, a metal frame member that has a rectangular frame body, mounting ears with mounting holes drilled in the centers of the four sides of the frame, and an open top end. The resin container is shaped like a truncated pyramid and has an electronic component placed inside and a frame member attached to the open end by adhesive, and a resin material that is filled into the resin container and covers the board. For example, see Patent Document 2).

The electronic component unit configured in this way is used by being directly fixed to the vehicle engine using the mounting hole instead of inside the vehicle interior, so the board housed in the recess of the metal base or in the resin container is fixed with the resin. It is sealed to improve waterproofness.

Japanese Patent Application Publication No. 2006-190725 JP2014-015080A

In the electronic component unit disclosed in Patent Document 1, the board is covered with resin, but if the resin covering the board peels off from the metal base and a gap is created between the resin and the metal base, water may leak out. If water enters the gap, there is a possibility that water will travel along the metal base and reach the substrate attached to the metal base.

Furthermore, in the electronic component unit disclosed in Patent Document 2, connection pins electrically connected to electronic components mounted on the board are soldered to the board, and the board is supported by the connection pins in a resin container. The process of temporarily fixing the substrate or temporarily fixing the substrate by inserting a columnar section provided inside the resin container into a hole provided in the substrate and then applying heat to the columnar section to melt it; The process of bonding the frame member to the resin container is then carried out before the resin is molded, making the manufacturing process of the electronic component unit complicated.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component unit that can improve waterproofness and is easily manufactured, and a method for manufacturing the electronic component unit.

In order to achieve the above object, the electronic component unit of the present invention includes a board on which electronic components are mounted, a base, one end of which is connected to the base, the other end of which grips the board, and a position where the board is spaced apart from the base. a bracket having two or more gripping pieces disposed on the base, a front mounting piece and a rear mounting piece protruding from the front and back of the base toward the front and rear of the base, respectively; and a resin case containing the board, the base, and the gripping piece in a mold. The front mounting piece and the rear mounting piece protrude outside the resin case.

In the electronic component unit configured in this way, the bracket can hold the board at a distance from the base, and the front mounting piece and the rear mounting piece can be used to hold the board in the mold for molding the resin case. Since the base and the base can be placed at separate positions, the base and the board can be placed at separate positions within the resin case.

Further, the gripping piece in the electronic component unit includes a front gripping piece placed in front of the base and a rear gripping piece placed behind the base, and the bracket is provided between the front gripping piece and the front mounting piece. The base may include a front notch that opens from the front of the base, and a rear notch that opens from the rear of the base between the rear gripping piece and the rear attachment piece.

When the electronic component unit is configured in this way, even if the resin case peels off from the base and a gap is created between the base and the resin case, the distance for water to reach the board can be lengthened and the water can be The intrusion route is not a straight line but a winding route, further suppressing water from reaching the substrate, and further improving waterproofness.

Furthermore, the base of the electronic component unit has a central part facing the board, a front bent part that extends in front of the central part and bends with respect to the central part, and a rear part that extends behind the central part and bends with respect to the central part. The front mounting piece may protrude from the front end of the front bending part, and the rear mounting piece may protrude from the rear end of the rear bending part.

According to the electronic component unit configured in this way, the base housed in the resin case is not flat but has a front bent part and a rear bent part at the front and rear, so that it is Even if a shearing force is applied in this direction, the front bent part and the rear bent part can absorb the shearing force and prevent the resin case from falling off the bracket.

Furthermore, the front gripping piece of the electronic component unit may have a curved portion that curves forward at its tip, and the rear gripping piece of the electronic component unit may have a curved portion that curves rearward at its tip. In the electronic component unit configured in this way, when the board is inserted between the front gripping piece and the rear gripping piece, the board slides on the curved surface of the curved part and the front gripping piece and the rear gripping piece are separated. Since it is bent, it becomes easier to attach the board to the bracket.

In addition, a method for manufacturing an electronic component unit includes attaching a board on which an electronic component is mounted to a gripping piece of a bracket having a base and two or more gripping pieces connected to the base, and placing the board at a distance from the base. The assembly process includes an assembly process in which the upper and lower molds sandwich the front mounting piece and rear mounting piece that protrude from the front and rear of the bracket, and the substrate, base, and The method includes an installation step of accommodating the gripping piece, and a molding step of injecting resin into a mold and molding a resin case containing the substrate, base, and gripping piece. According to the manufacturing method of the electronic component unit configured in this way, the front mounting piece and the rear mounting piece of the bracket are sandwiched between the upper mold and the lower mold, and the bracket gripping the board is used to move inside the mold. Since the resin case can be molded while positioning the board at a position separated from the upper and lower molds, it improves the waterproofness of the electronic component unit and is easy to manufacture. Fixing members such as pins are also unnecessary.

Furthermore, in the method of manufacturing an electronic component unit, resin may be passed through a plurality of holes provided in the center of the base facing the substrate during the molding process. According to the method for manufacturing an electronic component unit configured in this way, the resin injected into the mold can smoothly enter the narrow gap between the center part of the base and the board and electronic component. Since the resin can be quickly injected into the cavity of the mold during molding, it is possible to suppress the formation of voids in the resin case after molding.

According to the electronic component unit and the method for manufacturing the electronic component unit of the present invention, it is possible to improve waterproofness and to easily manufacture the electronic component unit.

FIG. 2 is a front view of an electronic component unit in one embodiment. It is a sectional view of an electronic component unit in one embodiment. (A) is a front view of a board on which electronic components are mounted in an electronic component unit according to an embodiment. (B) is a side view of a board on which electronic components are mounted in the electronic component unit of one embodiment. (A) is a front view of the bracket in the electronic component unit of one embodiment. (B) is a side view of the bracket in the electronic component unit of one embodiment. FIG. 3 is an exploded view of a board and a bracket on which electronic components are mounted in an electronic component unit according to an embodiment. FIG. 2 is a side view of the electronic component unit of one embodiment in a state where a board on which electronic components are mounted and a bracket are inserted into a mold. FIG. 2 is a perspective view of a shock absorber in which an electronic component unit of one embodiment is attached via a pedestal.

EMBODIMENT OF THE INVENTION Hereinafter, the electronic component unit 1 of this invention is demonstrated based on embodiment shown in the figure. As shown in FIGS. 1 to 5, an electronic component unit 1 in one embodiment is formed by molding a board 2 on which an electronic component 3 is mounted, a metal bracket 10 that holds the board 2, and a metal bracket 10 that holds the board 2. It includes a substrate 2 and a resin case 17 that encloses a part of the bracket 10.

As shown in FIGS. 2 and 3, the substrate 2 includes a rectangular substrate main body 2a and four protrusions 2b protruding from the four corners of the substrate main body 2a in the front-rear direction. The board body 2a includes wiring (not shown) made of copper foil. Although not shown in detail in this embodiment, the board main body 2a is constructed by laminating a copper foil wiring pattern and a resist for protecting the wiring pattern on one or both of the front and back sides of an insulating material.

The electronic components 3 are active elements, passive elements, integrated circuits, etc., and are mounted on the substrate body 2a and connected to the wiring. The electronic component unit 1 of this embodiment is a controller that controls a solenoid valve for adjusting damping force in a shock absorber (not shown), and the electronic component 3 includes a driver that supplies current to the solenoid and a driver that supplies current to the solenoid. It is comprised of components such as a plurality of elements and integrated circuits including an MPU that performs control calculation processing for controlling current, and is mounted on the front and back sides of the board body 2a of the board 2.

In addition, a two-core cable 4 for supplying current to a solenoid valve (not shown) is connected to the left side of the board main body 2a in FIG. 3(A). Connected to the right side is a four-core cable 5 for receiving power from an external power source (not shown) and for receiving commands from a higher-level control device.

Therefore, the electronic component unit 1 receives power from an external power source (not shown) via the cable 5, receives commands from a higher-level control device (not shown), and operates the solenoid valve (not shown) via the cable 4. The solenoid valve is controlled by supplying current to the solenoid valve. Note that the electronic component unit 1 of this embodiment is a control device that controls a solenoid valve in a shock absorber, but it may also be a controller of other equipment or a sensor that detects some information. Alternatively, electronic components 3 suitable for processing may be mounted on the substrate 2 depending on the purpose and function.

Note that in this embodiment, since the electronic component 3 is mounted on the front and back sides of the board body 2a, the board body 2a is provided with wiring patterns on the front and back sides of the insulating material, but only on one of the front and back sides of the board 2. When mounting the electronic component 3 on the board body 2a, it is sufficient to provide the wiring pattern only on one of the front side and the back side of the board body 2a. Furthermore, the configuration and shape of the board main body 2a are merely examples, and the design can be changed to suit mounting of the electronic component 3.

Subsequently, as shown in FIGS. 2 and 4, the bracket 10 is placed in a position where the base 11 is connected to the base 11 at one end and the board 2 is held at the other end so that the board 2 is spaced apart from the base 11. and a front attachment piece 13 and a rear attachment piece 14 that protrude from the front and rear of the base 11 toward the front and rear of the base 11, respectively.

The base 11 includes a central portion 11a facing the substrate 2, a front bent portion 11b that extends in front of the central portion 11a and bends with respect to the central portion 11a, and a front bent portion 11b that extends behind the central portion 11a and bends with respect to the central portion 11a. It is provided with a rear side bent part 11c.

In this embodiment, the central portion 11a is a rectangular plate, and includes a square hole 11a1 provided at the center and round holes 11a2 and 11a3 provided before and after the square hole 11a1. The front bent portion 11b is a rectangular plate having the same width as the central portion 11a and bent vertically upward from the front of the central portion 11a. The rear bent portion 11c is a rectangular plate having the same width as the central portion 11a and bent vertically upward from the rear of the central portion 11a. The front bent portion 11b and the rear bent portion 11c face each other in the front-rear direction, and the height of the front bent portion 11b and the height of the rear bent portion 11c are the same.

As shown in FIGS. 4 and 5, the gripping pieces 12 include two front gripping pieces 12a, 12a arranged at the front of the base 11, and two rear gripping pieces 12b, 12b arranged at the rear of the base 11. It is equipped with Each of the front gripping pieces 12a, 12a includes horizontal pieces 12a1, 12a1 extending in parallel in the left-right direction from the left and right sides of the front side of the center portion 11a of the base 11, and a vertical piece 12a2 rising vertically from the front end of the horizontal pieces 12a1, 12a1. , 12a2, curved portions 12a3, 12a3 that curve forward from the tips of the vertical pieces 12a2, 12a2, and grooves 12a4, 12a4 that open from the side opposite to the base 11 on the tip side of the vertical pieces 12a2, 12a2. It is equipped with

The horizontal pieces 12a1, 12a1 have a trapezoidal shape, and extend in the horizontal direction from the left and right sides of the center portion 11a with one bottom side connected to the front left and right sides of the center portion 11a, respectively. Furthermore, front notches 15, 15 that open from the front are provided at the boundaries between the horizontal pieces 12a1, 12a1 and the center portion 11a of the base 11.

The vertical pieces 12a2, 12a2 are elongated rectangular plates connected to the front of each horizontal piece 12a1, 12a1, bent vertically, and rising upward. In the left-right direction of 11a, the thickness direction is directed toward the front-rear direction of central portion 11a.

The curved portions 12a3, 12a3 are curved forward from the upper ends, which are the tips of the vertical pieces 12a2, 12a2. Further, the grooves 12a4, 12a4 open from the side opposite to the base 11, close to the lower end of the curved portions 12a3, 12a3 on the tip side of the vertical pieces 12a2, 12a2. In other words, the grooves 12a4, 12a4 open from the outer sides of the vertical pieces 12a2, 12a2, with the center portion 11a side being the inner side in the width direction of the vertical pieces 12a2, 12a2.

The rear gripping pieces 12b, 12b include horizontal pieces 12b1, 12b1 extending in parallel in the left-right direction from the left and right sides of the rear side of the center portion 11a of the base 11, and vertical pieces 12b1, 12b1 rising vertically from the rear ends of the horizontal pieces 12b1, 12b1. Pieces 12b2, 12b2, curved portions 12b3, 12b3 that curve backward from the tips of the vertical pieces 12b2, 12b2, and grooves 12b4 that open from the side opposite to the base 11 on the tip side of the vertical pieces 12b2, 12b2. , 12b4.

The horizontal pieces 12b1 and 12b1 have a trapezoidal shape, and extend in the horizontal direction from the left and right sides of the center part 11a with one side of the bottom connected to the rear left and right sides of the center part 11a. Furthermore, rear notches 16, 16 that open from the rear are provided at the boundaries between the horizontal pieces 12b1, 12b1 and the center portion 11a of the base 11.

The vertical pieces 12b2, 12b2 are elongated rectangular plates connected to the rear of each horizontal piece 12b1, 12b1, bent vertically, and rising upwards, and having the same height as each other, with the center portion in the width direction. In the left-right direction of 11a, the thickness direction is directed toward the front-rear direction of central portion 11a.

The curved portions 12b3, 12b3 are curved rearward from the upper ends, which are the tips of the vertical pieces 12b2, 12b2. Further, the grooves 12b4, 12b4 open from the side opposite to the base 11, close to the lower end of the curved portions 12b3, 12b3 on the tip side of the vertical pieces 12b2, 12b2. In other words, the grooves 12b4, 12b4 open from the outer sides of the vertical pieces 12b2, 12b2, with the center portion 11a side being the inner side in the width direction of the vertical pieces 12b2, 12b2.

The front gripping piece 12a and the rear gripping piece 12b, which are arranged on the left side of the center part 11a, face each other in the front-rear direction of the base 11, and the height of the front gripping piece 12a and the height of the rear gripping piece 12b are are the same, and the height position of the groove 12a4 and the height position of the groove 12b4 are arranged at the same position. Further, the front gripping piece 12a and the rear gripping piece 12b, which are arranged on the right side of the center part 11a, face each other in the front-rear direction of the base 11, and the height of the front gripping piece 12a and the height of the rear gripping piece 12b are are the same, and the height position of the groove 12a4 and the height position of the groove 12b4 are arranged at the same position. The height positions of the grooves 12a4 and 12b4 are located above the upper end of the center portion 11a of the base 11. Further, the length in the vertical direction between the lower ends of the grooves 12a4 and 12b4 and the upper end of the center portion 11a of the base 11 is determined by It is set to be greater than or equal to the length in the vertical direction of the electronic component 3 on the 11 side.

As described above, the bracket 10 includes four gripping pieces 12, two front gripping pieces 12a, 12a and two rear gripping pieces 12b, 12b. 11, it is sufficient that at least two or more gripping pieces 12 are provided, and the two or more gripping pieces 12 can sandwich and grip the substrate 2a in the front and back direction. Alternatively, the substrate 2a may be held by sandwiching it in the left and right direction.

The front mounting piece 13 is a rectangular plate that protrudes from the front end of the front bent portion 11b of the base 11, and has a long hole 13a passing through its thickness.

The rear mounting piece 14 includes a rectangular plate 14a that protrudes rearward from the rear end of the rear bent portion 11c of the base 11, and a center that protrudes rearward from the center of the tip that is the rear end of the plate 14a. It includes a claw 14b and a pair of opposing claws 14c and 14d that protrude rearward from both left and right sides in FIG.

The central claw 14b includes a vertical portion 14b1 extending upward from the left and right center of the plate 14a in FIG. It includes a horizontal portion 14b2 that extends toward the rear and separates from the horizontal portion 14b2. The opposing claws 14c and 14d are located at the rear end of the plate 14a, and are spaced apart from the center claw 14b by a predetermined distance in the left-right direction, with the center claw 14b provided at the center in between. They extend horizontally toward the rear from positions that do not overlap with the center claws 14b when viewed from above.

The bracket 10 configured as described above is formed by punching and bending a single metal plate as a base material, but it is formed by assembling a plurality of parts. Good too.

Next, an assembly process for attaching the board 2 on which the electronic component 3 is mounted to the bracket 10 will be explained. To attach the board 2 on which the electronic component 3 is mounted to the bracket 10, as shown in FIG. It is inserted between the rear gripping piece 12b and the rear gripping piece 12b. The front and back length of the board body 2a is approximately equal to the distance between the vertical piece 12a2 of the front gripping piece 12a and the vertical piece 12b2 of the rear gripping piece 12b, and the board 2 is held between the front gripping piece 12a and the rear side. As the board 2 approaches the gripping piece 12b, the front protrusion 2b of the board 2 comes into contact with the curved part 12a3 of the front gripping piece 12a, and the front protrusion 2b of the board 2 comes into contact with the curved part 12b3 of the rear gripping piece 12b. come into contact with

From this state, when the board 2 is further brought closer to the base 11, the front, rear, left, and right vertical pieces 12a2, 12b2 in contact with the protrusion 2b are bent, and the distance between the vertical pieces 12a2, 12b2 facing each other in the front and back direction increases, and the board 2 approaches the base 11 while increasing the distance between the vertical pieces 12a2 and 12b2. When the protrusion 2b of the board 2 is inserted into the grooves 12a4, 12b4 of the vertical pieces 12a2, 12b2 on the front, rear, left and right sides, the vertical pieces 12a2, 12b2 are restored to their original positions by their own elastic force, and the board body 2a of the board 2 is restored. Grasp the front and back of the Since the protrusions 2b of the substrate 2 are fitted into the grooves 12a4 and 12b4, movement of the substrate 2 in the vertical and horizontal directions is also restricted. In this way, when the assembly process is completed, the gripping pieces 12 of the bracket 10 grip the front and rear of the board 2 and restrain the movement of the board 2 in the vertical and horizontal directions, so that the board 2 is firmly fixed to the bracket 10. .

Further, since the board 2 is fixed at the height of the grooves 12a4 and 12b4 with respect to the front gripping piece 12a and the rear gripping piece 12b, it is fixed at a position spaced apart from the base 11 in the vertical direction, and the base A gap is formed between 11 and 11. As described above, the length in the vertical direction between the lower ends of the grooves 12a4 and 12b4 and the upper end of the center portion 11a of the base 11 is set to be greater than or equal to the length in the vertical direction of the electronic component 3 on the base 11 side of the board 2. Therefore, interference between the electronic component 3 on the base 11 side of the board 2 and the center portion 11a of the base 11 is prevented.

Furthermore, in the present embodiment, the height of the front bent portion 11b and the rear bent portion 11c of the base 11 is greater than the distance in the vertical direction between the upper end of the central portion 11a of the base 11 and the lower end of the substrate 2. When the electronic component unit 1 is viewed from the side, the substrate 2 is disposed above the front bent portion 11b and the rear bent portion 11c.

Since the front gripping piece 12a and the rear gripping piece 12b are provided with curved parts 12a3 and 12b3, respectively, when inserting the board 2 between the front gripping piece 12a and the rear gripping piece 12b, the protrusion 2b is inserted into the curved part. Since the vertical pieces 12a2, 12b2 are bent by sliding on the curved surfaces of 12a3, 12b3, the work of attaching the board 2 to the bracket 10 is facilitated.

In addition, cutouts are provided on the front, back, left, and right sides of the board main body 2a in the board 2, into which the grooves 12a4 and 12b4 of the front gripping piece 12a and the rear gripping piece 12b are fitted, so that the board 2 is fixed in the vertical and horizontal directions with respect to the bracket 10. You may restrict movement to. Further, vertical movement of the substrate 2 may be restrained by providing a recess into which the substrate 2 fits in the vertical piece 12a2 of the front gripping piece 12a and the vertical piece 12b2 of the rear gripping piece 12b.

After the assembly process of attaching the board 2 to the bracket 10 is completed, as shown in FIG. After the installation step of accommodating the mounted substrate 2, a molding step of injecting hot melted resin to form the resin case into the mold M from a gate (not shown) and molding the resin case 17 is performed. In the installation process, the front mounting piece 13 and the rear mounting piece 14 of the bracket 10 are sandwiched between the upper mold M1 and the lower mold M2, so that the bracket 10 is fixed to the mold M. When the bracket 10 is fixed to the mold M in this way, the central part 11a of the base 11 is positioned at a position spaced apart from the lower mold M2 in the cavity in which the resin is injected in the mold M, and the gripping piece 12 The substrate 2 fixed to the base 11 is also positioned apart from the upper mold M1 and the lower mold M2. Therefore, in the molding process after the installation process, resin is injected into the gap while the base 11 and the board 2 carrying the electronic components 3 are inserted into the mold M, so that the resin hardened after molding is injected into the gap. A base 11 and a board 2 on which electronic components 3 are mounted are enclosed in a case 17. Further, since the base 11 is accommodated in the cavity of the mold M, the front bent portion 11b and the rear bent portion 11c are accommodated in the resin case 17, and only the front mounting piece 13 and the rear mounting piece 14 are made of resin. It protrudes outward from the front and rear of the case 17.

Since the square hole 11a1 and the round holes 11a2, 11a3 are provided in the center part 11a of the base 11, the resin injected into the mold M during the molding process is transferred to the center part 11a of the base 11, the substrate 2, and the electronic components 3. The height of the board 2 from the base 11 is higher than the height of the front bent part 11b and the rear bent part 11c from the base 11. Since a gap is formed between the portion 11b and the rear bent portion 11c and the substrate 2, the resin can pass through the gap even if the base 11 is provided with the front bent portion 11b and the rear bent portion 11c. Therefore, since the resin can be quickly injected into the void of the mold M during molding, it is possible to suppress the formation of voids in the resin case 17 after molding.

The electronic component unit 1 configured in this manner is attached to an installation target via a pedestal 20 shown in FIG. 7, for example. In this embodiment, the shock absorber D is to be installed. As shown in FIG. 7, it has an outer shell 21 as a cylindrical attachment part and a rod 22 that is movably inserted into the outer shell 21, and the rod 22 is axially oriented with respect to the outer shell 21. A damping force that prevents relative movement of the rod 22 with respect to the outer shell 21 is generated during an expansion/contraction operation for relative movement, thereby damping vibrations of the vehicle body and wheels. The pedestal 20 includes plates 20a and 20b arranged before and after the electronic component unit 1, and bolts 20b11 provided on the front plate 20a, so that the front mounting piece 13 of the electronic component unit 1 is attached to the front side of the pedestal 20. is fixed to the plate 20b by bolts 20b11 and nuts 18, and the rear mounting piece 14 of the electronic component unit 1 holds the rear plate 20a of the pedestal 20, so that the electronic component unit 1 is fixed to the pedestal 20. is permanently attached.

The shock absorber D includes, for example, an outer shell 21 whose lower end is closed, a cylinder (not shown) accommodated in the outer shell 21, a rod 22 movably inserted into the cylinder, and connected to the rod 22. A piston that is inserted into the cylinder and divides the inside of the cylinder into a growth side chamber and a compression side chamber, an intermediate cylinder that is arranged between the cylinder and the outer shell 21, and an annular gap between the intermediate cylinder and the outer shell 21. The valve case is provided at the lower end of the cylinder and partitions the pressure side chamber and the reservoir. The expansion side chamber and the compression side chamber are filled with liquid such as hydraulic oil, and the reservoir is filled with liquid and gas. Note that the liquid used in the shock absorber D may be other than hydraulic oil, for example, a liquid such as water or an aqueous solution.

In addition, the piston is provided with a rectifying passage that only allows liquid to flow from the compression side chamber to the expansion side chamber, and the valve case that partitions the reservoir and the compression side chamber only allows liquid to flow from the reservoir to the compression side chamber. A suction passage is provided. Furthermore, the expansion side chamber is communicated with the reservoir via a discharge passage formed by an annular gap between the cylinder and the intermediate tube, and the discharge passage provides resistance to the flow of liquid from the expansion side chamber toward the reservoir. In addition, a solenoid valve that can adjust the resistance by adjusting the amount of current supplied from the electronic component unit 1 is provided. The solenoid valve is housed in a cylindrical housing 23 that protrudes from the side of the lower end of the outer shell 21 .

When the shock absorber D configured in this manner is contracted, liquid moves from the pressure side chamber, which is compressed by the movement of the piston relative to the cylinder, to the expansion side chamber, which expands through the rectifying passage of the piston, and the rod 22 enters the cylinder. A volume of liquid is discharged into the reservoir via the discharge passage and the solenoid valve. Since the solenoid valve provides resistance to the flow of liquid passing therethrough, the pressure within the cylinder increases and the buffer D generates a damping force that prevents the contraction operation. Further, since the resistance to the flow of the liquid can be adjusted by adjusting the amount of current applied to the solenoid valve, the damping force of the shock absorber D during contraction operation can be adjusted.

Further, when the shock absorber D is extended, liquid is discharged from the expansion side chamber compressed by the movement of the piston relative to the cylinder to the reservoir via the discharge passage and the solenoid valve. Furthermore, when the shock absorber D is extended, liquid is supplied from the reservoir via the suction passage to the pressure side chamber that is expanded by the movement of the piston relative to the cylinder. Then, since the solenoid valve provides resistance to the flow of liquid passing therethrough, the pressure in the expansion side chamber increases, and the shock absorber D generates a damping force that prevents the expansion operation. Further, since the resistance to the flow of the liquid can be adjusted by adjusting the amount of current applied to the solenoid valve, the damping force of the shock absorber D during expansion operation can be adjusted. In this way, the shock absorber D as an installation target to which the electronic component unit 1 of the present embodiment is applied can change the damping force by the current supply from the electronic component unit 1.

Further, a lower suspension spring support 24 is attached to the intermediate outer periphery of the outer shell 21 to support the lower end of a suspension spring (not shown). A suspension spring (not shown) is interposed between the upper suspension spring receiver attached to the tip of the rod 22 and the lower suspension spring receiver 24 described above, and when the shock absorber D is interposed between the vehicle body and the wheel. Elastically supports the vehicle body.

Further, on the outer periphery of the lower end of the outer shell 21, a knuckle bracket 25 is provided that can be connected to a knuckle that rotatably holds a wheel of a vehicle. As shown in FIG. 1, the knuckle bracket 25 is curved along the outer periphery of the outer shell 21 and is attached to the outer shell 21, and has an attachment portion with both ends in the circumferential direction extending in the radial direction. is fastened to the arm with bolts and nuts across the arm extending from the knuckle. Note that the knuckle bracket 25 is provided with a hole 25a through which the housing 23 in which the solenoid valve is accommodated is inserted. In addition, the structure of the buffer D mentioned above is an example, Comprising: The design can be changed.

As described above, the electronic component unit 1 of the present embodiment includes the substrate 2 on which the electronic component 3 is mounted, the base 11, one end is connected to the base 11, and the other end grips the substrate 2 and holds the substrate 2 against the base 11. A bracket 10 having two or more gripping pieces 12 arranged at spaced apart positions, and a front mounting piece 13 and a rear mounting piece 14 protruding from the front and rear of the base 11 toward the front and rear of the base 11, respectively; a substrate 2; It includes a resin case 17 that encloses a base 11 and a grip piece 12 by molding, and a front attachment piece 13 and a rear attachment piece 14 protrude outside the resin case 17.

In the electronic component unit 1 configured in this way, the bracket 10 can hold the board 2 at a position separated from the base 11, and the resin case 17 can be attached using the front mounting piece 13 and the rear mounting piece 14. The substrate 2 and the base 11 can be placed at separate positions using a mold M for molding.

Therefore, according to the electronic component unit 1 of the present embodiment, the board 2 can be placed in the mold M at a position where the board 2 and the base 11 are separated from each other through the bracket 10, so that molding of the resin case 17 is easy. becomes. Furthermore, since the base 11 and the board 2 are placed at separate positions within the resin case 17, the resin case 17 may peel off from the base 11, and water may enter between the base 11 and the resin case 17. Also, it becomes difficult for water to reach the substrate 2. As described above, according to the electronic component unit 1 of this embodiment, the waterproofness can be improved and it can be manufactured easily.

Furthermore, in the electronic component unit 1 of the present embodiment, the gripping piece 12 includes a front gripping piece 12a disposed in front of the base 11 and a rear gripping piece 12b disposed behind the base 11, and Reference numeral 10 indicates a front notch 15 which is located between the front gripping piece 12a and the front mounting piece 13 and opens from the front of the base 11, and a front notch 15 which is located between the rear gripping piece 12b and the rear mounting piece 14 and which is opened from the front of the base 11. A rear notch 16 that opens from the rear is provided.

When the electronic component unit 1 is configured in this way, even if the resin case 17 is separated from the base 11 and a gap is created between the base 11 and the resin case 17, it is possible to enter the resin case 17 from the front mounting piece 13 side. Water that has entered into the resin case 17 from the rear mounting piece 14 side cannot reach the board 2 unless it makes a U-turn around the front notch 15 and passes through the front gripping piece 12a. Since water cannot reach the substrate 2 unless it makes a U-turn around the rear notch 16 and passes along the rear gripping piece 12b, the distance it takes for the water to reach the substrate 2 can be lengthened, and the water intrusion path is straight. The path is winding rather than winding. Therefore, according to the electronic component unit 1 configured in this way, it is possible to further suppress water from reaching the substrate 2, and thus the waterproofness can be further improved.

Further, in the electronic component unit 1 of the present embodiment, the base 11 includes a central portion 11a facing the substrate 2, a front bent portion 11b extending in front of the central portion 11a and bent with respect to the central portion 11a, and a central portion 11a. The front mounting piece 13 protrudes from the front end of the front bending part 11b, and the rear mounting piece 14 has a rear bending part 11c that extends to the rear of the center part 11a and bends with respect to the center part 11a. protruding from the rear end.

According to the electronic component unit 1 configured in this way, the base 11 housed in the resin case 17 is not flat but has a front bent part 11b and a rear bent part 11c in the front and back. Even if a shearing force is applied to the resin case 17 in the longitudinal and lateral directions, the shearing force is received by the front bent part 11b and the rear bent part 11c, thereby preventing the resin case 17 from falling off the bracket 10.

In the electronic component unit 1 of the present embodiment, the front bent portion 11b and the rear bent portion 11c are connected to the center portion 11a of the base 11, and the front gripping piece 12a and the rear gripping piece 12b that grip the board 2 are connected to the center portion 11a of the base 11. Since they are raised upward in the same direction, the height of the electronic component unit 1 in the vertical direction can be reduced, and the electronic component unit 1 can be made smaller.

Furthermore, in the electronic component unit 1 of the present embodiment, the front gripping piece 12a has a curved portion 12a3 that curves forward at the tip, and the rear gripping piece 12b has a curved portion 12a3 that curves toward the rear at the tip. It has a portion 12b3. In the electronic component unit 1 configured as described above, when the board 2 is inserted between the front gripping piece 12a and the rear gripping piece 12b, the board 2 slides on the curved surfaces of the curved parts 12a3 and 12b3 and is held in the front grip. Since the piece 12a and the rear gripping piece 12b are bent, it becomes easy to attach the board 2 to the bracket 10.

Furthermore, as shown in FIG. 4A, the bracket 10 in the electronic component unit 1 of this embodiment has a symmetrical shape, so that the cable 4 is placed on the left side and the cable 5 is placed on the right side. Alternatively, the board 2 can be rotated 180 degrees horizontally, the cable 4 is placed on the right side, the cable 5 is placed on the left side, and the board 2 is attached to the grip piece 12. It is also possible. Therefore, without changing the design of the bracket 10 and the board 2, by simply changing the mounting orientation of the board 2, the solenoid valve can receive the cable 4 and power for supplying current, and receive commands from the host control device. The arrangement of the receiving cables 5 can be changed.

Note that the front mounting piece 13 is provided with a long hole 13a, and the rear mounting piece 14 is provided with a central claw 14b and opposing claws 14c, 14d, but the design may be changed as appropriate depending on the means of attachment to the pedestal 20. It is possible. Therefore, for example, if bolts and nuts are used to attach the front mounting piece 13 and the rear mounting piece 14 to the pedestal 20, the bolts must be inserted through both the front mounting piece 13 and the rear mounting piece 14. It is only necessary to provide a hole for the

Further, the board 2 on which the electronic component 3 is mounted is attached to the gripping piece 12 of the bracket 10 having a base 11 and two or more gripping pieces 12 connected to the base 11, and the board 2 is placed at a position spaced apart from the base 11. In the assembly process of arranging, the front mounting piece 13 and the rear mounting piece 14 protruding from the front and rear of the bracket 10 are sandwiched between the upper mold M1 and the lower mold M2 in the mold M which is divided into the upper mold M1 and the lower mold M2. At the same time, there is an installation step of accommodating the substrate 2, the base 11, and the gripping piece 12 in the mold M, and a resin case 17 containing the substrate 2, the base 11, and the gripping piece 12 is molded by injecting resin into the mold M. It includes a molding step of molding. According to the manufacturing method of the electronic component unit 1 configured in this way, the front mounting piece 13 and the rear mounting piece 14 of the bracket 10 are sandwiched between the upper mold M1 and the lower mold M2, thereby producing a bracket that grips the board 2. 10 can be used to mold the resin case 17 while positioning the board 2 within the mold M at a position separated from the upper mold M1 and the lower mold M2. Therefore, while improving the waterproofness of the electronic component unit 1, Easy to manufacture. In addition, by sandwiching the front mounting piece 13 and the rear mounting piece 14 of the bracket 10 between the upper mold M1 and the lower mold M2, the board 2 can be mounted in the mold M using the bracket 10 that grips the board 2. Since the substrate 2 can be positioned at a position separated from the mold M1 and the lower mold M2, a fixing member such as a pin for fixing the substrate 2 within the mold M becomes unnecessary.

Further, in the method of manufacturing the electronic component unit 1, the resin is passed through the square hole 11a1 and the round holes 11a2, 11a3 (a plurality of holes) provided in the central part of the base 11 facing the substrate 2 during the molding process. did. According to the manufacturing method of the electronic component unit 1 configured in this way, the resin injected into the mold M can be smoothly applied even to the narrow gap between the center portion 11a of the base 11 and the substrate 2 and electronic component 3. Since the resin can be quickly injected into the cavity of the mold M during molding, it is possible to suppress the formation of voids in the resin case 17 after molding.

In addition, although each part of the electronic component unit 1 was described above in detail using an example in which the installation target of the electronic component unit 1 was the shock absorber D, the installation target is not limited to the shock absorber D. 1 may be used as equipment, machinery, etc.

Although the preferred embodiments of the present invention have been described in detail above, modifications, variations, and changes can be made without departing from the scope of the claims.

DESCRIPTION OF SYMBOLS 1... Electronic component unit, 2... Board, 3... Electronic component, 10... Bracket, 11... Base, 11a... Center part, 11b... Front side bending part, 11c. ... Rear side bent part, 12... Grip piece, 12a3, 12b3... Curved part, 13... Front side grip piece, 14... Rear side grip piece, 15... Front side notch, 16...・Rear side notch, 17...resin case

Claims (6)

A board on which electronic components are mounted,
a base, two or more gripping pieces having one end connected to the base and the other end gripping the substrate and disposing the substrate in a position separated from the base; A bracket having a front mounting piece and a rear mounting piece that protrude forward and backward;
a resin case that encloses the substrate, the base, and the gripping piece in a mold,
The electronic component unit, wherein the front mounting piece and the rear mounting piece protrude outside the resin case. The gripping piece has a front gripping piece disposed in front of the base and a rear gripping piece disposed behind the base,
The bracket is
a front notch that is located between the front grip piece and the front attachment piece and opens from the front of the base;
The electronic component unit according to claim 1, further comprising a rear notch that is located between the rear gripping piece and the rear attachment piece and opens from the rear of the base. The base includes a central portion facing the substrate, a front bent portion that extends in front of the central portion and bends with respect to the central portion, and a rear side that extends behind the central portion and bends with respect to the central portion. It has a bent part,
The front mounting piece protrudes from the front end of the front bent portion,
The electronic component unit according to claim 1, wherein the rear mounting piece protrudes from a rear end of the rear bending portion. The front gripping piece has a curved portion that curves forward at the tip,
The electronic component unit according to claim 2 or 3, wherein the rear gripping piece has a curved portion that curves rearward at a distal end. an assembly step of attaching a board on which an electronic component is mounted to the gripping piece of a bracket having a base and two or more gripping pieces connected to the base, and arranging the board at a position spaced apart from the base;
In a mold divided into an upper mold and a lower mold, the upper mold and the lower mold sandwich the front mounting piece and the rear mounting piece protruding from the front and rear of the bracket, and the board and the base are placed in the mold. and an installation step of accommodating the gripping piece;
A method for manufacturing an electronic component unit, comprising the step of injecting resin into the mold and molding a resin case containing the substrate, the base, and the gripping piece.
6. The method of manufacturing an electronic component unit according to claim 5, wherein during the molding step, the resin is passed through a plurality of holes provided in a central portion of the base facing the substrate.