JP2023176185A - Alignment apparatus, exposure apparatus, and method for manufacturing article - Google Patents

Abstract

To provide an alignment apparatus that can improve aligning accuracy between an original plate and a substrate.SOLUTION: An alignment apparatus according to the present invention comprises: a first measurement part which detects first measuring light passing through a first mark of a first object, an optical system, and a second mark of a second object, and measures positions of the first mark and the second mark in a first plane perpendicular to an optical axis of the optical system; a second measurement part which measures a height of the first object in a direction parallel to the optical axis of the optical system; a drive part which moves at least one of the first object and the second object in the first plane; and a control part which calculates relative positions between the first mark and the second mark in the first plane from measured positions of the first mark and the second mark, corrects relative positions calculated on the basis of a relation between a deviation amount of relative positions to be calculated and a height to be measured, and the measured height, and controls the drive part on the basis of corrected relative positions.SELECTED DRAWING: Figure 1

Description

The present invention relates to an alignment device, an exposure device, and a method of manufacturing an article.

Conventionally, in an exposure apparatus that exposes a substrate so as to transfer the pattern formed on the original onto the substrate, in order to improve the overlay accuracy of the pattern on the substrate, the distance between the original and the substrate is increased. There is a need to improve alignment accuracy.
When performing the alignment, the exposure device projects measurement light onto a mark formed on the substrate and receives the measurement light reflected by the mark.The projection optical system uses the image of the mark formed by projecting the measurement light onto the mark formed on the substrate. The position of the substrate in a plane perpendicular to the optical axis of the substrate is measured.

At this time, if the optical system that projects and receives the measurement light has comatic aberration or optical axis misalignment, the image of the mark will vary depending on the height of the substrate in the direction parallel to the optical axis of the projection optical system. Since the detected waveform changes, an error will be included in the measured position of the substrate within the plane.
Patent Document 1 detects the image of the mark on the substrate formed by the measurement light while changing the height of the substrate, thereby reducing coma aberration and optical axis deviation of the optical system that projects and receives the measurement light. An alignment device is disclosed that adjusts the position of an optical member within the optical system so as to reduce the number of optical elements.

Japanese Patent Application Publication No. 2009-16762

The alignment device disclosed in Patent Document 1 includes a measurement system that measures marks on the original and reference marks on the substrate stage, and a measurement system that measures the marks on the substrate and the reference marks on the substrate stage. Two measurement systems are used.
That is, in the alignment device disclosed in Patent Document 1, the relative position between the mark on the original and the mark on the substrate is indirectly measured by two measurement systems.
In the alignment device disclosed in Patent Document 1, coma aberration and optical axis deviation occur in an optical system included in one measurement system that measures marks on a substrate and a reference mark on a substrate stage from images of both marks. are being adjusted.

On the other hand, by using a single measurement system that measures both marks by guiding the measurement light so that it is reflected by the mark on the substrate and then passes through the mark on the original, it is possible to A positioning device that performs positioning between the two is also known.
In other words, in such an alignment device, the relative position between the mark on the original and the mark on the substrate is directly measured by a single measurement system, so that the alignment disclosed in Patent Document 1 is not possible. The alignment accuracy is improved compared to other devices.

On the other hand, in such alignment devices, if the optical system included in the measurement system has comatic aberration or optical axis misalignment, the height of the substrate in the direction parallel to the optical axis of the projection optical system may be adjusted. The detection waveforms of the images of both the upper mark and the mark on the original will change.
Therefore, not only the substrate but also the original plate includes an error in the measured position in a plane perpendicular to the optical axis of the projection optical system.

Therefore, an object of the present invention is to provide an alignment device that can improve the accuracy of alignment between an original and a substrate using a measurement system that measures both marks on the original and marks on the substrate. do.

The alignment device according to the present invention includes: a first mark formed on a first object; an optical system; a second mark formed on a second object disposed on the opposite side of the object, and detects the first measurement light passing through the second mark formed on the second object, and a first measurement unit that measures the position in a first vertical plane; a second measurement unit that measures the height of the first object in the first direction; the first object and the second object. a drive unit that moves at least one of the first mark and the second mark within a first plane; The relative position between the mark and the mark in the first plane is calculated, and the relationship between the calculated deviation amount of the relative position and the measured height is determined by controlling the second measurement unit. The present invention is characterized by comprising a control section that corrects the relative position calculated based on the height and controls the drive section based on the corrected relative position.

According to the present invention, it is possible to provide an alignment device that can improve the accuracy of alignment between an original and a substrate using a measurement system that measures both marks on the original and marks on the substrate. .

FIG. 1 is a schematic cross-sectional view of an exposure apparatus including an alignment device according to a first embodiment. FIG. 3 is a top view of an alignment mark and an imaging surface of a CCD camera in the positioning device according to the first embodiment. FIG. 3 is a diagram schematically showing defocus characteristics in the alignment device according to the first embodiment. 5 is a flowchart showing processing when performing alignment in the alignment device according to the first embodiment. FIG. 7 is a diagram schematically showing defocus characteristics in the alignment device according to the second embodiment. FIG. 7 is a diagram schematically showing defocus characteristics in a positioning device according to a third embodiment.

Below, the positioning device according to this embodiment will be described in detail based on the accompanying drawings. Note that the drawings shown below are drawn on a different scale from the actual scale so that the present embodiment can be easily understood.
In the following, a direction parallel to the optical axis of the projection optical system 3 is referred to as the Z direction (first direction), and two directions perpendicular to each other in a plane perpendicular to the optical axis of the projection optical system 3 (first plane) are referred to as the Z direction (first direction). The X direction (second direction) and the Y direction (third direction).

[First embodiment]
Traditionally, equipment for manufacturing devices using photolithography technology transfers a circuit pattern drawn on an original (reticle, mask) by projecting it onto a substrate (plate) via a projection optical system. Projection type exposure equipment is used.
Such projection exposure apparatuses are required to improve overlay accuracy, which is the accuracy when overlaying a plurality of patterns on a substrate.

In order to improve the overlay accuracy, it is necessary to align the original and the substrate with each other with high precision, and for this purpose, the projection exposure apparatus is provided with an alignment measurement system.
One such alignment measurement system is an off-axis alignment measurement system that measures alignment marks on a substrate by illuminating them with non-exposure light without going through a projection optical system. It has been known.

Furthermore, as one such alignment measurement system, there is a TTL (Through The Lens) alignment measurement system that measures the alignment mark on the substrate by illuminating the alignment mark on the substrate via a projection optical system using non-exposure light. It has been known.
Note that when the projection optical system is composed of at least one mirror, it is also called a TTM (Through The Mirror) alignment measurement system.

In addition, when aligning the substrate using the TTL alignment measurement system, the height of the substrate in the direction parallel to the optical axis of the projection optical system is determined based on the height of the substrate in the plane perpendicular to the optical axis. It is known that the measurement position of the alignment mark changes.
Changes in the measured position of the alignment mark on the substrate according to the height of the substrate, more specifically, the deviation (defocus) of the substrate surface of the substrate from the position of best focus by the projection optical system, are as follows: This is called the defocus characteristic.

Furthermore, in recent years, there has been a demand for an alignment measurement system that can reduce detection errors of alignment marks on a substrate for various processes (material, thickness, film thickness, line width, etc.) on the substrate.
For example, if the alignment measurement system includes a TIS (Tool Induced Shift), a detection error will occur when detecting the alignment mark even if the alignment mark has a symmetrical step structure.

Note that TIS here is an index of measurement value deviation caused by a system error of the measurement system itself, and is a measurement error caused by, for example, coma aberration.
Conventionally, by comprehensively evaluating the symmetry and positional deviation of alignment marks, the optical members constituting the alignment measurement system can be adjusted to reduce the comatic aberration and optical axis deviation of the alignment measurement system. Techniques have been proposed to reduce the detection error.

However, since the above-mentioned conventional technique aims to reduce the detection error of the alignment mark on the substrate, it does not consider reducing the detection error of the alignment mark on the original.
On the other hand, when using a TTM alignment measurement system, visible light can be used as the non-exposure light, so it is possible to detect the light that passes through each of the alignment marks on the substrate and the alignment mark on the original.
When such light is detected, a change in the height of the substrate causes a shift not only in the alignment mark on the substrate but also in the measured position of the alignment mark on the original.

As mentioned above, in the alignment device that measures the position of the original and the substrate in the exposure device that transfers the pattern of the original onto the substrate via the projection optical system, the defocus characteristic is affected depending on the height of the substrate. There is a known problem in which alignment accuracy decreases.
That is, the positional information of both the alignment mark on the original and the alignment mark on the substrate is falsified due to the influence of local changes or defocus characteristics on the substrate surface.
Therefore, in this embodiment, the relative position between the original and the substrate is corrected with high precision by taking into account the influence of the defocus characteristics, thereby improving the accuracy of alignment between the original and the substrate. The purpose of the present invention is to provide an alignment device that can improve the performance.

FIG. 1 shows a schematic cross-sectional view of an exposure apparatus 30 including an alignment apparatus according to the first embodiment.

The exposure device 30 guides (exposes) the exposure light that has passed through the mask 1 (second object) onto the resist (photosensitive agent) coated on the plate 4 (first object) via the projection optical system 3. This is a projection type exposure apparatus that transfers the pattern formed on the mask 1 onto the resist.
In the alignment apparatus according to the present embodiment, the light that does not expose the resist, that is, the non-exposure light that is reflected by the alignment mark 4a (first mark) on the plate 4 is transmitted onto the mask 1 via the projection optical system 3. The light is guided to the alignment mark 1a (second mark).
That is, in the alignment apparatus according to this embodiment, the mask 1 and the plate 4 are arranged on opposite sides of the projection optical system 3 in the Z direction parallel to the optical axis of the projection optical system 3.

The alignment apparatus according to this embodiment detects the alignment mark 1a on the mask 1 and the alignment mark 4a on the plate 4 by the light guide, that is, employs the TTM method.
Then, the mask stage 2 and the plate stage 5 are driven within the XY plane based on the detected positions of the alignment mark 1a on the mask 1 and the alignment mark 4a on the plate 4, respectively. Thereby, alignment between the mask 1 and the plate 4 is performed.

As shown in FIG. 1, the exposure apparatus 30 includes a mask stage 2 (driver), a projection optical system 3 (optical system), a plate stage 5 (driver), and an illumination system 6.
The exposure apparatus 30 also includes an alignment measurement system 7 (first measurement section), a focus measurement system 8 (second measurement section), and a computer 16 (control section, calculation section).
Note that, as shown below, the alignment apparatus according to this embodiment includes a mask stage 2, a projection optical system 3, a plate stage 5, an alignment measurement system 7, a focus measurement system 8, and a computer 16.

The illumination system 6 irradiates exposure light for illuminating the circuit pattern formed on the mask 1.
The mask stage 2 (original stage) is configured to be movable at least in the X direction and the Y direction while holding the mask 1.

The projection optical system 3 is composed of a plurality of mirrors (reflecting members) that reflect the exposure light that has passed through the mask 1 so as to guide it to the plate 4. A circuit pattern is projected onto the plate surface of the plate 4.
The plate stage 5 (substrate stage) is configured to be movable at least in the X direction, Y direction, and Z direction while holding the plate 4.

The alignment measurement system 7 is a positioning microscope and detects an alignment mark 1a formed on the mask surface of the mask 1 and an alignment mark 4a formed on the plate surface of the plate 4. Thereby, the relative position (hereinafter referred to as an alignment measurement value) in the XY plane between the alignment mark 1a and the alignment mark 4a is measured.
The specific configuration of the alignment measurement system 7 will be described in detail later.

The focus measurement system 8 includes a light projector that emits a light beam (second measurement light) onto the plate surface of the plate 4, and a light receiver that receives the light beam reflected by the plate surface. The focus measurement system 8 can measure the position of the plate surface of the plate 4 with respect to the projection optical system 3 in the Z direction, that is, the alignment focus with respect to the projection optical system 3, by detecting the position information of the reflected light beam.
The computer 16 is configured to control the operations of the mask stage 2, plate stage 5, alignment measurement system 7, and focus measurement system 8.

Next, processing performed in the alignment apparatus according to this embodiment will be described.
Specifically, a method of performing alignment between the mask 1 and the plate 4 by detecting position information of each of the alignment marks 1a and 4a in the alignment apparatus according to this embodiment will be described.

As shown in FIG. 1, the alignment measurement system 7 includes a mirror 9, a correction optical system 10, a beam splitter 11, an illumination optical system 12, a mirror 13, a relay optical system 14, and a CCD camera 15 (a light receiving element, an image sensor). ).

Specifically, in the alignment measurement system 7, as shown in FIG. 1, a light beam (first measurement light) is emitted from an illumination optical system 12 including a light source.
Next, the light beam emitted from the illumination optical system 12 is reflected by the beam splitter 11, passes through the correction optical system 10, and is then reflected by the mirror 9, thereby reaching the alignment mark 1a on the mask surface of the mask 1. light is guided.
A part of the light beam guided to the alignment mark 1a is blocked by a light blocking portion forming the alignment mark 1a.

Next, the light beam that has passed through the alignment mark 1a passes through the projection optical system 3 and is guided to the alignment mark 4a on the plate surface of the plate 4, thereby illuminating the alignment mark 4a.
Then, a part of the light beam guided to the alignment mark 4a is reflected by the reflecting portion forming the alignment mark 4a.

Next, the light beam reflected by the alignment mark 4a enters the beam splitter 11 again via the projection optical system 3, the alignment mark 1a, the mirror 9, and the correction optical system 10.
The light flux incident on the beam splitter 11 passes through the beam splitter 11, is reflected by the mirror 13, passes through the relay optical system 14, and then enters the imaging surface of the CCD camera 15, where it is received.

At this time, the light beam reflected by the alignment mark 4a on the plate surface of the plate 4 is partially blocked by the alignment mark 1a on the mask surface of the mask 1.
Therefore, images of both the alignment mark 1a and the alignment mark 4a are formed on the imaging surface of the CCD camera 15.
In this way, in the alignment device according to this embodiment, visible light can pass through the projection optical system 3 composed of a plurality of mirrors, so that images of both the alignment mark 1a and the alignment mark 4a can be captured by the CCD camera 15. It can be formed on the imaging surface.

FIGS. 2A, 2B, and 2C show top views of the alignment mark 1a, the alignment mark 4a, and the image signal 20 formed on the imaging surface of the CCD camera 15, respectively.

In the alignment mark 1a, two rectangular groups (a second graphic group and a third graphic group) are provided spaced apart from each other in the X direction. Each rectangular group consists of three rectangles (fourth figures) each extending in the Y direction and spaced apart from each other in the X direction, and three rectangles each extending in the X direction and spaced from each other in the Y direction. (third figure).
Further, in the alignment mark 4a, one rectangular group (first figure group) is provided. The group of rectangles includes three rectangles (second figures) each extending in the Y direction and spaced apart from each other in the X direction, and three rectangles each extending in the X direction and spaced apart from each other in the Y direction. (first figure).
In addition, in the positioning apparatus according to the present embodiment, the shapes forming each of the alignment marks 1a and 4a are not limited to rectangles, and the number and configuration of the shapes are not limited to the above.

On the imaging surface of the CCD camera 15, the alignment mark 1a and the alignment mark 4a are arranged so that one rectangular group constituting the alignment mark 4a is sandwiched between two rectangular groups constituting the alignment mark 1a in the X direction. An image is formed.
In other words, on the imaging surface of the CCD camera 15, an image signal 20 is captured in which three rectangular groups forming the alignment mark 1a and the alignment mark 4a are aligned in the X direction.

Next, an image signal 20 based on the images of the alignment mark 1a and alignment mark 4a captured by the CCD camera 15 is input to the computer 16 via a line.
Then, the computer 16 acquires positional information between the respective images of the alignment mark 1a and the alignment mark 4a, that is, the relative position (alignment measurement value) from the received image signal 20.

In addition, in the alignment device according to this embodiment, in addition to the measurement of the relative position in the XY plane between the alignment mark 1a and the alignment mark 4a by the alignment measurement system 7, the focus measurement system 8 measures the position of the plate 4 in the Z direction. (Height) is also measured.
Then, the computer 16 corrects the alignment measurement value based on the measured position of the plate 4 in the Z direction obtained from the focus measurement system 8 via a line, as described below.

3(a) and 3(b) schematically show the relationship between the amount of deviation of alignment measurement values in the X direction and Y direction and the height of the plate 4 in the Z direction, respectively, in the alignment device according to the present embodiment. It is shown in
In other words, FIGS. 3A and 3B schematically show the defocus characteristics of the alignment device according to this embodiment.
That is, the defocus characteristic here means the amount of deviation in the alignment measurement value that occurs when the plate 4 is shifted by a predetermined amount in the Z direction.

As shown in FIGS. 3(a) and 3(b), at the best focus position Δh=0 of the alignment marks 1a and 4a by the alignment measurement system 7, the deviation amounts Δx and Δy of the alignment measurement values in the X direction and the Y direction, respectively. is zero (set to zero).
The best focus position here can be defined, for example, as the height of the plate 4 in the Z direction at which the contrast of the images of the alignment marks 1a and 4a formed on the imaging surface of the CCD camera 15 is the highest. .

In addition, in the alignment apparatus according to the present embodiment, the contrast between the images of the alignment marks 1a and 4a measured by the alignment measurement system 7 and the plate 4 measured by the focus measurement system 8 when the height of the plate 4 is changed. Obtain the relationship between the height of the
Thereby, the best focus position and the amount of shift in the Z direction from the best focus position can be converted into a value measured by the focus measurement system 8 of the height of the plate 4 based on the relationship.

Next, when the plate 4 shifts from the best focus position in the Z direction, that is, defocus occurs, the alignment measurement values in the X and Y directions, respectively, as shown in FIGS. 3(a) and (b). A deviation occurs in the
Such defocus characteristics are caused by, for example, comatic aberration or optical axis deviation in the alignment measurement system 7, and are caused by, for example, the size and distribution of the film thickness of the resist coated on the plate surface of the plate 4, or the thickness of the resist. It is known that it varies depending on the material.

Furthermore, it is known that the defocus characteristics vary depending on, for example, the size and distribution of the film thickness of a pattern already formed on the plate surface of the plate 4, the material of the pattern, and the line width of the pattern.
That is, the defocus characteristic is based on at least one of the size and distribution of the film thickness of the resist, the material of the resist, the size and distribution of the film thickness of the pattern, the material of the pattern, and the line width of the pattern. It can be classified according to The defocus characteristics may be considered to be the same for each lot of plates 4, for example.

Here, since the light beam from the alignment measurement system 7 reflected by the alignment mark 4a as described above passes through the alignment mark 1a, the measurement positions of both the alignment marks 1a and 4a change according to the defocus described above. Please be careful.
Therefore, the alignment device according to the present embodiment acquires defocus characteristics as shown in FIGS. 3(a) and 3(b) in advance, and performs alignment measurement based on the acquired defocus characteristics. The alignment measurements obtained by system 7 are corrected.
Then, at least one of the mask stage 2 and the plate stage 5 is driven within the XY plane based on the corrected measurement value, thereby performing alignment between the mask 1 and the plate 4.

Specifically, as shown in FIGS. 3(a) and 3(b), the shift amount of the plate 4 from the best focus position in the Z direction (hereinafter referred to as defocus amount) is expressed as Δh, the X direction and The amount of deviation of the alignment measurement values in each Y direction is expressed as Δx and Δy.
At this time, the defocus characteristics are expressed as the following equations (1) and (2) using the approximation functions fx (Δh) (second relationship) and fy (Δh) (first relationship). .
Δx=fx(Δh)...(1)
Δy=fy(Δh)...(2)

Here, in the example shown in Figure 3(a), the approximation function fx(Δh) is a linear function passing through (Δx, Δh) = (0, 0), which is shown in Figure 3(b). In the example, the approximation function fy(Δh) is a linear function that passes through (Δy, Δh)=(0,0).
Note that although the defocus characteristics are expressed using an approximation function here, the defocus characteristics are not limited to this, and may be expressed using a table composed of discrete numerical values.

Then, consider a case where the defocus amount is Δd, and the alignment measurement values in the X direction and Y direction at this time are x and y, respectively.
Here, the alignment measurement value x in the X direction and the alignment measurement value y in the Y direction are determined as relative positions between the alignment mark 4a and the alignment mark 1a.

Specifically, first, the average value of the X coordinates of the centers of gravity of six rectangles extending in the Y direction included in the alignment mark 1a is set as the measured position mx of the alignment mark 1a in the X direction.
Further, the average value of the X coordinate of the center of gravity of each of the three rectangles extending in the Y direction included in the alignment mark 4a is defined as the measured position px of the alignment mark 4a in the X direction.
Then, the alignment measurement value x in the X direction is determined as the difference px−mx between the measurement position px of the alignment mark 4a and the measurement position mx of the alignment mark 1a in the X direction.

Similarly, the average value of the Y coordinate of the center of gravity of each of the six rectangles extending in the X direction included in the alignment mark 1a is set as the measured position my of the alignment mark 1a in the Y direction.
Further, the average value of the Y coordinate of the center of gravity of each of the three rectangles extending in the X direction included in the alignment mark 4a is set as the measured position py of the alignment mark 4a in the Y direction.
Then, the alignment measurement value y in the Y direction is determined as the difference py−my between the measurement position py of the alignment mark 4a and the measurement position my of the alignment mark 1a in the Y direction.

Note that the reference coordinates for the coordinates of the center of gravity of each rectangle can be, for example, the coordinates of the center of the imaging surface of the CCD camera 15.
Then, when the corrected alignment measurement values in the X direction and Y direction are expressed as x' and y', the corrected alignment measurement values x' and y' can be calculated using equations (1) and (2). , can be expressed as in the following equations (3) and (4).
x'=x-Δx=x-fx(Δd)...(3)
y'=y-Δy=y-fy(Δd)...(4)
Then, by moving at least one of the mask stage 2 and the plate stage 5 based on the corrected alignment measurement values x' and y', the mask 1 and the plate 4 can be aligned.

FIG. 4 is a flowchart showing a process for aligning the mask 1 and the plate 4 in the alignment apparatus according to this embodiment.
Note that the processing of each step in the flowchart is performed by the computer 16 controlling each component of the alignment apparatus according to this embodiment.

First, the mask stage 2 and plate stage 5 are moved to positions where the alignment marks 1a and 4a can be measured by the alignment measurement system 7 (step S1).
Next, the height of the plate 4 in the Z direction, that is, the amount of defocus, is measured by the focus measurement system 8 (step S2).

Next, it is determined whether the defocus characteristic for the plate 4 has already been acquired (created) in the positioning apparatus according to the present embodiment and is stored, for example, in a storage section in the computer 16 (step S3).
If the defocus characteristic has been acquired (Yes in step S3), an alignment measurement value is acquired by the alignment measurement system 7 (step S5).
On the other hand, if the defocus characteristic has not been acquired (No in step S3), the defocus characteristic is acquired by acquiring alignment measurement values while changing the height of the plate 4 in the Z direction. (Step S4). After that, the process moves to step S5.

Next, the amount of deviation of the alignment measurement value is calculated by inputting the defocus amount acquired in step S2 to the acquired defocus characteristic.
Then, by substituting the calculated deviation amount of the alignment measurement value and the alignment measurement value obtained in step S5 into equations (3) and (4), the alignment measurement value obtained in step S5 is corrected. (Step S6).

Then, by moving at least one of the mask stage 2 and the plate stage 5 in the XY plane based on the alignment measurement value corrected in step S6, the positioning between the mask 1 and the plate 4 is performed (step S7 ).

As described above, the alignment device according to the present embodiment can determine the relationship between the measurement result of the relative position between the images of both the alignment mark 1a on the mask 1 and the alignment mark 4a on the plate 4 and the height of the plate 4. Obtain the defocus characteristics that indicate.
Then, by correcting the measured relative position based on the acquired defocus characteristic and aligning the mask 1 and plate 4 with each other based on the corrected relative position, the accuracy in the alignment is improved. can be improved.

In the exposure apparatus 30 equipped with the alignment device according to the present embodiment, the height of the plate 4 is not changed according to the defocus characteristics when performing exposure, so that reduction in throughput due to the change is suppressed. be able to.
Furthermore, in the alignment device according to this embodiment, in order to adjust comatic aberration and optical axis deviation in the alignment measurement system 7 so as to reduce defocus characteristics, the optical members constituting the alignment measurement system 7 are not shifted. Therefore, the complexity of the configuration can be suppressed.

In addition, as shown in FIGS. 3(a) and 3(b), the defocus characteristics in the X direction and the Y direction are expressed as a linear function in the above, but the defocus characteristics are not limited to this and may be expressed as a polynomial function of a quadratic function or higher. It may also be expressed as
Furthermore, the alignment device according to the present embodiment is configured to receive measurement light that has been reflected by the alignment mark 4a on the plate 4 and then passed through the projection optical system 3 and the alignment mark 1a on the mask 1. However, it is not limited to this.
That is, for example, measurement light that has passed through the alignment mark 1a on the mask 1 and then through the projection optical system 3 and the alignment mark 4a on the plate 4 may be received.

Furthermore, for example, measurement light that has passed through the alignment mark 4a on the plate 4 and then through the projection optical system 3 and the alignment mark 1a on the mask 1 may be received.
In other words, the alignment device according to the present embodiment may be configured to receive measurement light that has been optically acted upon by each of the alignment mark 1a on the mask 1, the projection optical system 3, and the alignment mark 4a on the plate 4. .
In other words, in the alignment device according to this embodiment, the alignment mark 1a on the mask 1, the alignment mark 4a on the projection optical system 3, and the plate 4 only need to be placed on the optical path of the measurement light.
In other words, the alignment apparatus according to the present embodiment may be configured to receive measurement light that passes through each of the alignment mark 1a on the mask 1, the projection optical system 3, and the alignment mark 4a on the plate 4. Note that the measurement light that passes through the mark here includes not only the measurement light that passes through the mark but also the measurement light that is reflected by the mark.

[Second embodiment]
FIGS. 5(a) and 5(b) schematically show the relationship between the deviation amount of the alignment measurement value in the X direction and the Y direction and the height of the plate 4 in the Z direction, respectively, in the alignment device according to the second embodiment. It shows.
Note that since the positioning device according to this embodiment has the same configuration as the positioning device according to the first embodiment, the same reference numerals are given to the same members and the description thereof will be omitted.

In the alignment device according to the first embodiment, after the alignment measurement system 7 measures the relative position between the alignment marks 1a and 4a, the relative position is corrected based on the defocus characteristic.
On the other hand, in reality, the defocus characteristic between the measured position of the alignment mark 1a and the defocus amount and the defocus characteristic for the alignment mark 4a are different from each other.

Therefore, in the alignment apparatus according to the present embodiment, as described below, after the positions of the alignment marks 1a and 4a are measured by the alignment measurement system 7, the positions are corrected based on the defocus characteristics.
Thereby, the positions of the mask 1 and the plate 4 can be managed more strictly than the positioning device according to the first embodiment.

Specifically, the amount of shift of the plate 4 from the best focus position in the Z direction (hereinafter referred to as the defocus amount) is Δh, and the amount of displacement of the mask 1 and plate 4 in the X direction is Δmx and Δpx. I will express it.
Furthermore, the amount of positional deviation of the mask 1 and the plate 4 in the Y direction will be expressed as Δmy and Δpy.

At this time, the defocus characteristic of mask 1 is calculated as shown in the following equations (5) and (6) using the approximation functions fmx (Δh) (sixth relationship) and fmy (Δh) (fifth relationship). expressed.
Δmx=fmx(Δh)...(5)
Δmy=fmy(Δh)...(6)

In addition, the defocus characteristics of the plate 4 can be expressed using the approximation functions fpx (Δh) (fourth relationship) and fpy (Δh) (third relationship) as shown in equations (7) and (8) below. be done.
Δpx=fpx(Δh)...(7)
Δpy=fpy(Δh)...(8)

In the example shown in FIG. 5(a), the approximation function fmx (Δh) is a linear function passing through (Δmx, Δh) = (0, 0), and the approximation function fpx (Δh) is (Δpx, It is a linear function passing through Δh)=(0,0).
Also, the approximate function fmy(Δh) is a linear function that passes through (Δmy, Δh) = (0, 0), and the approximate function fpy (Δh) is a linear function that passes through (Δpy, Δh) = (0, 0). be.

Furthermore, the positions of the mask 1 in the X and Y directions are mx and px, and the positions of the plate 4 in the X and Y directions are my and py, respectively.

Specifically, the average value of the X coordinates of the centers of gravity of six rectangles extending in the Y direction included in the alignment mark 1a is set as the position mx of the mask 1 in the X direction.
Further, the average value of the Y coordinate of the center of gravity of each of the six rectangles extending in the X direction included in the alignment mark 1a is defined as the position my of the mask 1 in the Y direction.
Similarly, the average value of the X coordinates of the centers of gravity of the three rectangles extending in the Y direction included in the alignment mark 4a is defined as the position px of the plate 4 in the X direction.
Further, the average value of the Y coordinate of the center of gravity of each of the three rectangles extending in the X direction included in the alignment mark 4a is defined as the position py of the plate 4 in the Y direction.

At this time, when the alignment measurement values in the X direction and the Y direction are expressed as x and y, the alignment measurement values x and y are expressed as in the following equations (9) and (10).
x=px-mx...(9)
y=py-my...(10)
Note that the reference coordinates for the coordinates of the center of gravity of each rectangle can be, for example, the coordinates of the center of the imaging surface of the CCD camera 15.

The defocus amount is Δd, and the corrected alignment measurement values in the X direction and the Y direction are expressed as x' and y'.
At this time, the corrected alignment measurement values x' and y' can be expressed as in the following equations (11) and (12) using equations (5) to (10).
x'=x-Δx
=(px-mx)-(Δpx-Δmx)
=(px-Δpx)-(mx-Δmx)
=(px-fpx(Δd))-(mx-fmx(Δd))...(11)
y'=y-Δy
=(py-my)-(Δpy-Δmy)
=(py-Δpy)-(my-Δmy)
=(py-fpy(Δd))-(my-fmy(Δd))...(12)

Then, in the alignment apparatus according to the first embodiment, a process similar to the flowchart shown in FIG. 4 is performed, that is, based on the corrected alignment measurement values x' and y', at least Move one side.
Thereby, the mask 1 and the plate 4 can be aligned.

As described above, the alignment device according to the present embodiment has a display that shows the relationship between the measurement results of the positions of the images of the alignment mark 1a on the mask 1 and the alignment mark 4a on the plate 4 and the height of the plate 4. Get focus characteristics.
Then, the measured positions are each corrected based on the acquired defocus characteristics, and the mask 1 and plate 4 are aligned with each other based on the corrected positions, thereby improving the accuracy of the alignment. It can be further improved.

[Third embodiment]
FIGS. 6A and 6B show the relationship between the amount of deviation of the measured position of the mask 1 in the X direction and the Y direction and the height of the plate 4 in the Z direction, respectively, in the alignment device according to the third embodiment. is schematically shown.
Further, FIGS. 6(c) and 6(d) respectively show the difference between the amount of deviation of the measured position of the plate 4 in the X direction and the Y direction and the height of the plate 4 in the Z direction in the alignment device according to the third embodiment. The relationship is schematically shown.
In addition, since the alignment device according to this embodiment has the same configuration as the alignment device according to the first embodiment and the alignment device according to the second embodiment, the same members have the same reference numbers. will be added and the explanation will be omitted.

The alignment device according to the second embodiment has a defocus characteristic at the measured position of the mask 1 in the X direction, that is, at the average value of the X coordinate of the center of gravity of each of the six rectangles extending in the Y direction included in the alignment mark 1a. was considered.
Similarly, the defocus characteristic was taken into consideration at the measured position of the mask 1 in the Y direction, that is, at the average value of the Y coordinate of the center of gravity of each of the six rectangles extending in the X direction included in the alignment mark 1a.

Furthermore, consideration was given to the defocus characteristic at the measurement position of the plate 4 in the X direction, that is, at the average value of the X coordinate of the center of gravity of each of the three rectangles included in the alignment mark 4a and extending in the Y direction.
Similarly, the defocus characteristic was taken into consideration at the measurement position of the plate 4 in the Y direction, that is, at the average value of the Y coordinate of the center of gravity of each of the three rectangles included in the alignment mark 4a and extending in the X direction.

On the other hand, in the alignment apparatus according to this embodiment, the defocus characteristics of each rectangle forming the alignment mark are taken into consideration.
That is, in the alignment device according to the present embodiment, the amount of deviation of the measured position of the mask 1 in the Expressed as average value.
Similarly, the amount of deviation of the measured position of the mask 1 in the Y direction is expressed as the average value of the amount of deviation of the Y coordinate of the center of gravity of each of six rectangles extending in the X direction included in the alignment mark 1a.

In addition, in the alignment device according to the present embodiment, the amount of deviation of the measurement position of the plate 4 in the Expressed as average value.
Similarly, the amount of deviation of the measurement position of the plate 4 in the Y direction is expressed as the average value of the amount of deviation of the Y coordinate of the center of gravity of each of three rectangles extending in the X direction included in the alignment mark 4a.

Specifically, for example, the alignment mark 1a of the mask 1 has M rectangles each extending in the Y direction and spaced apart from each other in the X direction, and N rectangles each extending in the X direction and spaced apart from each other in the Y direction. Suppose that it is composed of a rectangle.
Further, the alignment mark 4a of the plate 4 is formed from P rectangles each extending in the Y direction and spaced apart from each other in the X direction, and Q rectangles each extending in the X direction and spaced apart from each other in the Y direction. Suppose that it is configured.
Note that here, M, N, P, and Q are each natural numbers, and in the example shown in FIGS. 2(a) and (b), M=6, N=6, P=3, and Q=3. It is.

ここで、ｍｘ_ｉはマスク１のアライメントマーク１ａに含まれる上記Ｍ個の矩形のうちｉ番目の矩形の重心のＸ座標であり、ｍｙ_ｊはマスク１のアライメントマーク１ａに含まれる上記Ｎ個の矩形のうちｊ番目の矩形の重心のＹ座標である。 At this time, the measurement positions mx and my of the mask 1 in the X direction and the Y direction, respectively, can be expressed as in the following equations (13) and (14).

Here, mx _i is the X coordinate of the center of gravity of the i-th rectangle among the M rectangles included in the alignment mark 1a of the mask 1, and my _j is the This is the Y coordinate of the center of gravity of the jth rectangle among the rectangles.

ここで、ｐｘ_ｋはプレート４のアライメントマーク４ａに含まれる上記Ｐ個の矩形のうちｋ番目の矩形の重心のＸ座標であり、ｐｙ_ｌはプレート４のアライメントマーク４ａに含まれる上記Ｑ個の矩形のうちｌ番目の矩形の重心のＹ座標である。
なお各矩形の重心の座標に対する基準座標は、例えばＣＣＤカメラ１５の撮像面の中心の座標とすることができる。 Similarly, the measurement positions px and py of the plate 4 in the X direction and the Y direction, respectively, can be expressed as in the following equations (15) and (16).

Here, px _k is the X coordinate of the center of gravity of the kth rectangle among the P rectangles included in the alignment mark 4a of the plate 4, and py _l is the X coordinate of the center of gravity of the kth rectangle among the P rectangles included in the alignment mark 4a of the plate 4. This is the Y coordinate of the center of gravity of the l-th rectangle among the rectangles.
Note that the reference coordinates for the coordinates of the center of gravity of each rectangle can be, for example, the coordinates of the center of the imaging surface of the CCD camera 15.

In the alignment apparatus according to this embodiment, the amount of deviation of the measurement position, that is, the defocus characteristic, is acquired for each rectangle. In the above example, M+N+P+Q defocus characteristics are determined.
At this time, the deviation amount Δmx _i of the X coordinate of the center of gravity of the i-th rectangle among the M rectangles included in the alignment mark 1a of the mask 1, and the Y-coordinate of the center of gravity of the j-th rectangle among the N rectangles. The coordinate shift amount Δmy _j is expressed as in the following equations (17) and (18).
Δmx _i =fmx _i (Δh) (17)
Δmy _j =fmy _j (Δh) (18)

Here, the shift amount of the plate surface of the plate 4 from the best focus position in the Z direction, that is, the defocus amount is set as Δh.
In addition, the approximation function representing the defocus characteristic of the i-th rectangle among the above M rectangles is fmx _i (Δh) (M relationships), and the defocus characteristic of the j-th rectangle among the above N rectangles is The approximate function shown is fmy _j (Δh) (N relationships).
Note that in FIG. 6(a), only the defocus characteristics for i=1, 2, and M are shown, and in FIG. 6(b), only the defocus characteristics for j=1, 2, and N are shown. ing.

Similarly, the deviation amount Δpx _k of the X coordinate of the center of gravity of the k-th rectangle among the P rectangles included in the alignment mark 4a of the plate 4, and the Y coordinate of the center of gravity of the l-th rectangle among the Q rectangles. The coordinate shift amount Δpy _l is expressed as in the following equations (19) and (20).
Δpx _k = fpx _k (Δh) (19)
Δpy _l = fpy _l (Δh) (20)

Here, the approximation function indicating the defocus characteristic of the k-th rectangle among the above P rectangles is fpx _k (Δh) (P relationships), and the defocus characteristic of the l-th rectangle among the above Q rectangles is The approximation function representing the relationship is fpy _l (Δh) (Q relationships).
Note that in FIG. 6(c), only the defocus characteristics for k=1, 2, and P are shown, and in FIG. 6(d), only the defocus characteristics for l=1, 2, and Q are shown. ing.

またマスク１のＹ方向における計測位置のずれ量Δｍｙを、マスク１に形成されているアライメントマーク１ａに含まれる上記Ｎ個の矩形それぞれの重心のＹ座標のずれ量の平均値として以下の式（２２）のように表す。

Then, the deviation amount Δmx of the measurement position of the mask 1 in the X direction is determined by the following formula ( 21).

Furthermore, the deviation amount Δmy of the measurement position of the mask 1 in the Y direction is calculated using the following formula ( 22).

またプレート４のＹ方向における計測位置のずれ量Δｐｙを、プレート４に形成されているアライメントマーク４ａに含まれる上記Ｑ個の矩形それぞれの重心のＹ座標のずれ量の平均値として以下の式（２４）のように表す。

Similarly, the amount of deviation Δpx of the measurement position of the plate 4 in the X direction is calculated using the following formula as the average value of the amount of deviation of the X coordinate of the center of gravity of each of the above P rectangles included in the alignment mark 4a formed on the plate 4. It is expressed as (23).

In addition, the deviation amount Δpy of the measurement position of the plate 4 in the Y direction is determined by the following formula ( 24).

As described above, in the alignment device according to this embodiment, when the alignment measurement values in the X direction and the Y direction are expressed as x and y, x and y are expressed as in the following equations (25) and (26). be able to.

In addition, in the alignment device according to this embodiment, when the deviation amounts of alignment measurement values in the X direction and the Y direction are expressed as Δx and Δy, Δx and Δy are expressed as in the following equations (27) and (28). It can be expressed as

From the above, when the defocus amount is Δd and the corrected alignment measurement values in the X direction and the Y direction are expressed as x' and y', x' and y' can be calculated using equations (25) to (28). can be expressed as in the following equations (29) and (30).

Then, in the alignment apparatus according to the first embodiment, a process similar to the flowchart shown in FIG. 4 is performed, that is, based on the corrected alignment measurement values x' and y', at least Move one side.
Thereby, the mask 1 and the plate 4 can be aligned.

As described above, the alignment device according to the present embodiment is capable of comparing the measurement results of the positions of the images of each of the plurality of rectangles constituting the alignment mark 1a on the mask 1 and the alignment mark 4a on the plate 4 with the height of the plate 4. Obtain defocus characteristics that indicate the relationship between
Then, the measured positions are each corrected based on the acquired defocus characteristics, and the mask 1 and plate 4 are aligned with each other based on the corrected positions, thereby improving the accuracy of the alignment. It can be further improved.

Note that in the above, the average value is calculated from the measured values of all the rectangles that make up the alignment mark, but the average value is not limited to this. It's okay.
Specifically, for example, all rectangles forming the alignment mark may be analyzed in advance to extract only those rectangles that are strongly affected by the defocus characteristic, and an average value may be calculated from the measured values of the extracted rectangles.

[Method for manufacturing articles]
The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent coated on a substrate using an exposure device 30 equipped with the above-described positioning device according to the present embodiment (exposing the substrate to light). step) and developing the substrate on which the latent image pattern is formed.

Furthermore, the method for manufacturing an article according to this embodiment includes other well-known processing steps (oxidation, film formation, vapor deposition, doping, planarization, etching, photoresist stripping, dicing, bonding, packaging, etc.).
The article manufacturing method according to the present embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional article manufacturing methods.

Although preferred embodiments have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

The disclosure of this embodiment includes the following configuration and method.
(Configuration 1) A first mark formed on a first object, an optical system, and arranged on the opposite side of the first object with respect to the optical system in a first direction parallel to the optical axis of the optical system. detect the first measurement light passing through the second mark formed on the second object that is being A first measurement section that measures the position in a plane, a second measurement section that measures the height of the first object in the first direction, and a second measurement section that measures the height of the first object in the first direction. A drive unit that moves within one plane and a position between the first mark and the second mark measured by controlling the first measurement unit and the position of each of the first mark and the second mark. Calculate the relative position within the first plane, and based on the relationship between the calculated deviation amount of the relative position and the measured height, and the height measured by controlling the second measurement unit. A positioning device comprising: a controller that corrects the calculated relative position and controls a drive unit based on the corrected relative position.
(Configuration 2) The position according to Configuration 1, wherein the first measurement unit receives the first measurement light that has been reflected by the first mark and has passed through the optical system and the second mark. Aligning device.
(Structure 3) The alignment according to Structure 1 or 2, wherein the first measurement section emits the first measurement light so that it is incident on the first mark after passing through the second mark. Device.
(Configuration 4) The first mark includes at least one first figure extending in a second direction within the first plane and a third direction perpendicular to the second direction within the first plane. a first figure group having at least one second figure extending in the second direction; the second mark includes at least one third figure extending in the second direction; a second figure group having at least one extending fourth figure; The difference between the average position of the center of gravity of each of the third figures in the third direction is calculated as a relative position in the third direction, and the difference between the center of gravity of each of the at least one second figure in the second direction Configurations 1 to 1, characterized in that the difference between the average value of the position and the average value of the position of the center of gravity of each of the at least one fourth figure in the second direction is calculated as the relative position in the second direction. 3. The positioning device according to any one of 3.
(Configuration 5) The relationship is an average value of the position of the center of gravity of each of the at least one first figure in the third direction, and an average value of the position of the center of gravity of each of the at least one third figure in the third direction. a first relationship between the amount of deviation of the difference between a second relationship between the measured height and the average value of the position of the center of gravity of each figure in the second direction; Correcting the relative position in the third direction calculated based on the measured height, and correcting the relative position in the second direction calculated based on the second relationship and the measured height. The positioning device according to feature 4.
(Configuration 6) The relationship is a third relationship between an average deviation amount of the position of the center of gravity of each of the at least one first figure in the third direction and the measured height, and at least one third relationship. a fourth relationship between the average deviation of the position of the center of gravity of each of the two figures in the second direction and the measured height; and the third direction of the center of gravity of each of the at least one third figure. a fifth relationship between the average deviation of the position in the second direction of the center of gravity of each of the at least one fourth figure and the measured height; and a sixth relationship between the measured height and the measured height, and the control unit corrects the relative position in the third direction calculated based on the third relationship, the fifth relationship, and the measured height. , the fourth relationship, the sixth relationship, and the measured height, the relative position in the second direction is corrected.
(Configuration 7) The first figure group includes Q (Q is a natural number) first figures extending in the second direction and P (P is a natural number) first figures extending in the third direction. The second figure group consists of N third figures (N is a natural number) extending in the second direction and M third figures (M is a natural number) extending in the third direction. a fourth figure (a natural number), and the relationship is Q relationships between the amount of displacement of the center of gravity of each of the first figures in the third direction and the measured height; P relationships between the amount of displacement of the center of gravity of each of the figures in the second direction and the measured height, the amount of displacement of the center of gravity of each of the third figures in the third direction, N relationships between the measured heights, M relationships between the positional deviation amount of the center of gravity of each fourth figure in the second direction, and the measured height; The part corrects the relative position in the third direction calculated based on the Q relationships, the N relationships, and the measured height, and corrects the relative position in the third direction calculated based on the Q relationships, the N relationships, and the measured height. The alignment device according to configuration 4, wherein the relative position in the second direction calculated based on is corrected.
(Configuration 8) The second mark has at least one third figure and at least one fourth figure, and the third figure group is spaced apart from the second figure group in the second direction. Any one of configurations 4 to 7, wherein the image of the first figure group is formed between the images of the second figure group and the third figure group in the second direction. The alignment device described in .
(Configuration 9) The drive unit moves the first object in the first direction so as to change the height, and the control unit causes the second measurement unit to measure the height while changing the height. 9. The positioning device according to any one of configurations 1 to 8, wherein the relationship is created by having the first measurement unit measure the positions of each of the first mark and the second mark.
(Configuration 10) When creating a relationship, the control unit determines the positional shift of the first mark and the second mark at a height where the contrast of the images of the first mark and the second mark is the highest. 10. The alignment device according to configuration 9, wherein the amount is set to zero.
(Configuration 11) The second measurement unit is configured to project a second measurement light toward a second object and receive the second measurement light reflected by the second object. 11. The alignment device according to any one of Configurations 1 to 10, characterized in that:
(Structure 12) An exposure device that exposes a substrate so as to transfer a pattern drawn on an original onto the substrate, the alignment device according to any one of Structures 1 to 11, and a second object. an original stage that is movable while holding an original; a substrate stage that is movable while holding a substrate as a first object; and a projection optical system that guides exposure light that has passed through the original to the substrate. An exposure apparatus comprising: a control unit that moves at least one of an original stage and a substrate stage within a first plane based on the corrected relative position.
(Structure 13) The exposure apparatus according to Structure 12, wherein the projection optical system includes at least one reflecting member that reflects the exposure light and the first measurement light.
(Configuration 14) The relationship is between the size and distribution of the film thickness of the photosensitive agent applied to the substrate, the material of the photosensitive agent, the size and distribution of the film thickness of the pattern formed on the substrate, and the size and distribution of the film thickness of the photosensitive agent applied to the substrate. 14. The exposure apparatus according to configuration 12 or 13, including a plurality of relationships that are classified based on at least one of a material and a line width of a pattern.
(Method 1) A step of exposing a substrate using the exposure apparatus according to any one of configurations 12 to 14, a step of developing the exposed substrate, and a step of manufacturing an article from the developed substrate. A method for producing an article comprising:
(Method 2) A first mark formed on a first object, an optical system, and disposed on the opposite side of the first object with respect to the optical system in a first direction parallel to the optical axis of the optical system. detecting the first measurement light passing through the second mark formed on the second object, and detecting the first mark and the second measurement light from the first measurement light detected in the detecting step. a step of measuring the position of each of the two marks in a first plane perpendicular to the first direction; a step of measuring the height of the first object in the first direction; and a step of measuring the position. calculating the relative position in the first plane between the first mark and the second mark from the respective positions of the first mark and the second mark, and the relative position calculated in the calculating step. Correct the relative position calculated in the calculation step based on the relationship between the amount of positional deviation and the height measured in the height measurement step, and the height measured in the height measurement step. and moving at least one of the first object and the second object within the first plane based on the relative position corrected in the correcting step. .

1 Mask (second object)
1a Alignment mark (second mark)
2 Mask stage (drive part)
3 Projection optical system (optical system)
4 Plate (first object)
4a Alignment mark (first mark)
5 Plate stage (drive part)
7 Alignment measurement system (first measurement section)
8 Focus measurement system (second measurement section)
16 Computer (control unit)

Claims (16)

a first mark formed on a first object; an optical system; and a first mark disposed on the opposite side of the first object with respect to the optical system in a first direction parallel to the optical axis of the optical system. detecting a first measurement light passing through a second mark formed on a second object that is a first measurement unit that measures a position within a plane;
a second measurement unit that measures the height of the first object in the first direction;
a drive unit that moves at least one of the first object and the second object within the first plane;
the first plane between the first mark and the second mark from the respective positions of the first mark and the second mark measured by controlling the first measurement unit; based on the relationship between the calculated deviation amount of the relative position and the measured height, and the height measured by controlling the second measurement unit. a control unit that corrects the calculated relative position and controls the drive unit based on the corrected relative position;
An alignment device comprising: 2. The first measurement section receives the first measurement light that has been reflected by the first mark and then passed through the optical system and the second mark. alignment device. The alignment device according to claim 2, wherein the first measurement section emits the first measurement light so that it is incident on the first mark after passing through the second mark. . The first mark includes at least one first figure extending in a second direction within the first plane, and a third direction perpendicular to the second direction within the first plane. a first figure group having at least one second figure extending into the first figure group;
The second mark includes a second figure group including at least one third figure extending in the second direction and at least one fourth figure extending in the third direction. including,
The control unit includes:
between the average value of the position of the center of gravity of each of the at least one first figure in the third direction and the average value of the position of the center of gravity of each of the at least one third figure in the third direction; calculating a difference as the relative position in the third direction;
between the average value of the position of the center of gravity of each of the at least one second figure in the second direction and the average value of the position of the center of gravity of each of the at least one fourth figure in the second direction; The positioning apparatus according to claim 1, wherein a difference is calculated as the relative position in the second direction. The above relationship is
between the average value of the position of the center of gravity of each of the at least one first figure in the third direction and the average value of the position of the center of gravity of each of the at least one third figure in the third direction; a first relationship between a differential shift amount and the measured height;
between the average value of the position of the center of gravity of each of the at least one second figure in the second direction and the average value of the position of the center of gravity of each of the at least one fourth figure in the second direction; a second relationship between the difference deviation amount and the measured height;
including;
The control unit includes:
correcting the calculated relative position in the third direction based on the first relationship and the measured height;
5. The positioning apparatus according to claim 4, wherein the calculated relative position in the second direction is corrected based on the second relationship and the measured height. The above relationship is
a third relationship between the average deviation of the position of the center of gravity of each of the at least one first figure in the third direction and the measured height;
a fourth relationship between the average deviation of the position of the center of gravity of each of the at least one second figure in the second direction and the measured height;
a fifth relationship between the average deviation of the position of the center of gravity of each of the at least one third figure in the third direction and the measured height;
a sixth relationship between the average deviation of the position of the center of gravity of each of the at least one fourth figure in the second direction and the measured height;
including;
The control unit includes:
correcting the calculated relative position in the third direction based on the third relationship, the fifth relationship, and the measured height;
5. The alignment device according to claim 4, wherein the calculated relative position in the second direction is corrected based on the fourth relationship, the sixth relationship, and the measured height. The first figure group includes Q (Q is a natural number) first figures extending in the second direction and P (P is a natural number) extending in the third direction. It is composed of a second figure,
The second figure group includes N third figures (N is a natural number) extending in the second direction and M pieces (M is a natural number) extending in the third direction. Consisting of a fourth figure,
The above relationship is
Q relationships between the amount of displacement of the center of gravity of each of the first figures in the third direction and the measured height;
P relationships between the positional deviation amount of the center of gravity of each of the second figures in the second direction and the measured height;
N relationships between the amount of displacement of the center of gravity of each of the third figures in the third direction and the measured height;
M relationships between the amount of displacement of the center of gravity of each of the fourth figures in the second direction and the measured height;
including;
The control unit includes:
correcting the calculated relative position in the third direction based on the Q relationships and the N relationships and the measured height;
5. The alignment device according to claim 4, wherein the calculated relative position in the second direction is corrected based on the P relationships, the M relationships, and the measured height. The drive unit moves the first object in the first direction so as to change the height,
The control unit causes the second measurement unit to measure the height while changing the height, and causes the first measurement unit to measure the positions of each of the first mark and the second mark. The positioning apparatus according to claim 1, wherein the relationship is created by measuring. When creating the relationship, the control unit determines the height of each of the first mark and the second mark at the height where the contrast of the images of the first mark and the second mark is highest. 9. The positioning apparatus according to claim 8, wherein the positional deviation amount is set to zero. The second mark includes at least one third figure and at least one fourth figure, and a third figure group spaced apart from the second figure group in the second direction. including;
5. The position according to claim 4, wherein the image of the first figure group is formed between the images of the second figure group and the third figure group in the second direction. Aligning device. The second measurement unit is configured to project a second measurement light toward the second object and receive the second measurement light reflected by the second object. The alignment device according to claim 1, characterized in that: An exposure device that exposes the substrate so as to transfer a pattern drawn on the original onto the substrate,
The alignment device according to any one of claims 1 to 11;
an original stage that is movable while holding the original as the second object;
a substrate stage that is movable while holding the substrate as the first object;
a projection optical system as the optical system that guides the exposure light that has passed through the original to the substrate;
Equipped with
The exposure apparatus is characterized in that the control unit moves at least one of the original stage and the substrate stage within the first plane based on the corrected relative position. 13. The exposure apparatus according to claim 12, wherein the projection optical system includes at least one reflecting member that reflects the exposure light and the first measurement light. The relationship includes the size and distribution of the thickness of the photosensitive agent applied to the substrate, the material of the photosensitive agent, the size and distribution of the thickness of the pattern formed on the substrate, and the pattern. 13. The exposure apparatus according to claim 12, further comprising a plurality of relationships classified based on at least one of the material of the pattern and the line width of the pattern. exposing the substrate using the exposure apparatus according to claim 12;
Developing the exposed substrate;
manufacturing an article from the developed substrate;
A method for manufacturing an article characterized by comprising: a first mark formed on a first object; an optical system; and a first mark disposed on the opposite side of the first object with respect to the optical system in a first direction parallel to the optical axis of the optical system. detecting the first measurement light passing through the second mark formed on the second object;
measuring the position of each of the first mark and the second mark in a first plane perpendicular to the first direction from the first measurement light detected in the detecting step;
Measuring the height of the first object in the first direction;
a relative position in the first plane between the first mark and the second mark from the respective positions of the first mark and the second mark measured in the step of measuring the position; a step of calculating
The relationship between the deviation amount of the relative position calculated in the calculating step and the height measured in the height measuring step, and the height measured in the height measuring step. correcting the relative position calculated in the calculating step based on the calculation step;
moving at least one of the first object and the second object within the first plane based on the relative position corrected in the correcting step;
An alignment method characterized by comprising:

Images