JP2023005270A - Electronic component testing device - Google Patents

Abstract

To raise the temperature of an electronic component to a predetermined test temperature and maintain the temperature, and also cause the electronic component to discharge heat during a test.SOLUTION: An electronic component testing device 10 includes: a first probe 11 in contact with a first external electrode W1 of an electronic component W; a second probe 21 in contact with a second external electrode W2; and a controller 40. The controller 40 controls the heating temperature of the first probe 11 so that the heating temperature will become higher than the test temperature of the electronic component W and controls the heating temperature of the second probe 21 so that the heating temperature will become lower than the test temperature of the electronic component W.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present disclosure relates to an electronic component tester that tests self-heating electronic components at a predetermined test temperature higher than room temperature.

2. Description of the Related Art There is known an electronic component testing apparatus that tests an electronic component that generates heat by applying a voltage or current at a predetermined test temperature higher than room temperature.

However, there has been no development of an electronic component testing apparatus that heats and maintains an electronic component to be tested to a predetermined test temperature and effectively dissipates heat from the electronic component that self-heats during the test.

Japanese Patent No. 5987977

It is with this in mind that the present disclosure provides a method for heating and maintaining an electronic component under test to a predetermined test temperature while effectively removing heat from the self-heating electronic component during testing. An object of the present invention is to provide a heat-dissipating electronic component testing apparatus.

The present disclosure provides an electronic component testing apparatus for testing an electronic component having a first external electrode and a second external electrode and generating self-heating at a predetermined test temperature higher than room temperature, wherein the first external electrode of the electronic component is a first probe in contact; a second probe in contact with the second external electrode of the electronic component; a first probe heater and a first probe temperature sensor connected to the first probe; and a second probe. a second probe heater and a second probe temperature sensor, and a control unit connected to a second probe heater and a second probe temperature sensor, wherein electricity is applied to the electronic component between the first probe and the second probe, and the control unit controls the first probe heater to maintain the temperature of the first probe at a heating temperature higher than the test temperature of the electronic component based on the signal from the first probe temperature sensor, and the second probe The electronic component testing apparatus controls the second probe heater so as to maintain the heating temperature of the second probe at a heating temperature lower than the test temperature based on a signal from a temperature sensor.

In the present disclosure, the controller controls the first probe heater and the second probe so that the temperature difference between the heating temperature of the first probe and the heating temperature of the second probe is in the range of 5°C to 15°C. It is an electronic component testing device that controls the heater.

According to the present disclosure, the electronic component testing apparatus tests a plurality of electronic components, and the first probe is held by a first probe holder and includes a single first probe element corresponding to the plurality of electronic components. , the first probe heater and the first probe temperature sensor are built in the first probe holder, the second probe is held in the second probe holder, and a plurality of second probe elements corresponding to each electronic component are provided. and wherein the second probe heater and the second probe temperature sensor are built in the second probe holder.

In the present disclosure, the electronic component testing apparatus tests a plurality of electronic components, the first probe is held by a first probe holder, and includes a plurality of first probe elements corresponding to the respective electronic components, The first probe heater and the first probe temperature sensor are built in the first probe holder, the second probe is held in the second probe holder, and includes a plurality of second probe elements corresponding to each electronic component, A said 2nd probe heater and a said 2nd probe temperature sensor are electronic component test equipment built in the said 2nd probe holder.

In the present disclosure, between the first probe and the second probe, a DC voltage, a DC current, an AC voltage, an AC current, a superimposition of a DC voltage and an AC voltage, or a DC voltage is applied to the electronic component. It is an electronic device testing device that applies a superposition of current and alternating current.

According to the present disclosure, it is possible to provide an electronic component testing apparatus that heats and maintains an electronic component to be tested to a predetermined test temperature and effectively dissipates heat from the electronic component that generates heat during the test. can.

1 is a diagram showing the configuration of an electronic component testing apparatus according to a first embodiment of the present disclosure; FIG. 4 is a flow chart showing the action of electronic component testing. The figure which shows the structure of the electronic component testing apparatus by 2nd Embodiment of this indication.

<First embodiment>
A first embodiment of the present disclosure will be described below with reference to FIGS. 1 and 2. FIG.

The electronic component testing apparatus 10 according to the present embodiment heats a plurality of self-heating electronic components (for example, laminated ceramic capacitors) W to a predetermined test temperature (for example, 100° C. to 170° C.) higher than normal temperature, and It is intended to be tested against Here, performing a test on the electronic component W means a test in which an electrical load is applied while heating the electronic component W and applying a thermal load, or a test in which an electrical load is applied while heating the electronic component W and applying a thermal load. It involves testing by applying an electrical load and making electrical measurements on the electronic component W.

First, an electronic component W to be tested according to the first embodiment will be described. As shown in FIG. 1, the electronic component W has an electronic component body W0, and a first external electrode W1 and a second external electrode W2 provided on the electronic component body W0. Then, the electronic component testing apparatus 10 heats such an electronic component W to a predetermined temperature (test temperature) higher than room temperature, and after heating to the test temperature, applies electricity to the electronic component to perform screening such as burn-in. process and a measurement process at a high temperature.

Specifically, the electronic component testing apparatus 10 heats an electronic component W composed of a plurality of, for example, 200 laminated ceramic capacitors to a test temperature (100° C. to 170° C.) higher than normal temperature, and applies an electric current to the electronic component W. is applied to perform electrical tests such as withstand voltage test, capacitance test, insulation resistance test, and leakage current test.

Such an electronic component testing apparatus 10 includes a first probe 11 that contacts the first external electrode W1 of the electronic component W, a second probe 21 that contacts the second external electrode W2 of the electronic component W, and the first probe 11 and a second probe heater 23 and a second probe temperature sensor 25 connected to the second probe 21 .

Of these, the first probe 11 is held by a horizontally elongated first probe holder 12 and includes a single first probe element 11a corresponding to a plurality of electronic components W. As shown in FIG. In this embodiment, the first probe element 11a of the first probe 11 is made of a strip-shaped conductor.

The first probe heater 13 is built in the first probe holder 12 and is composed of a rubber heater that extends substantially over the entire length of the first probe holder 12 . It is provided in the substantially central part of the direction.

On the other hand, the second probe 21 is held by a horizontally elongated second probe holder 22 and includes a plurality of second probe elements 21a provided corresponding to the plurality of electronic components W. As shown in FIG. In the present embodiment, each second probe element 21a of the second probe 21 is made of a pin-shaped conductor provided corresponding to each electronic component W. As shown in FIG.

The second probe heater 23 is built in the second probe holder 22 and consists of a rubber heater extending substantially over the entire length of the second probe holder. It is provided approximately in the center.

As described above, the first probe element 11a is made of a strip-shaped conductor, and the second probe element 21a is made of a pin-shaped conductor. Both the first probe holder 12 and the second probe holder 22 are made of a non-conductive material such as machinable ceramics.

Furthermore, between the first probe 11 and the second probe 21, a DC voltage, a DC current, an AC voltage, an AC current, a superposition of a DC voltage and an AC voltage, or a DC current and a A test circuit section 30 is connected via wirings 31 and 32 to apply a superimposed alternating current to apply an electrical load to the electronic component W, or perform electrical measurement, or both.

Further, the electronic device testing apparatus 10 has a control section 40 that drives and controls the components described above.

As electronic components that can be tested using the electronic component testing apparatus 10 according to the present embodiment, semiconductor elements such as negative characteristic thermistors, diodes, and transistors, and ceramic capacitors, in addition to the above-described multilayer ceramic capacitors. Some capacitors other than the above are exemplified.

Next, each component of the electronic component testing apparatus 10 will be described below.

In the electronic component testing apparatus 10, the first probe 11 includes a single first probe element 11a, and the first probe element 11a is made of strip-shaped metal conductor. Then, the first probe element 11a contacts the first external electrode W1 of the electronic component W when the electronic component W is placed at a predetermined position.

Examples of metal materials used for the first probe element 11a include metals such as Cu, Fe, and Al.

In order to achieve good electrical contact, the contact surface of the first probe element 11a with the first external electrode W1 of the electronic component W may be plated with Au, Ag, Ni, Sn, or the like. be.

The second probe 21 also has a plurality of pin-shaped second probe elements 21a. Each second probe element 21a abuts on the second external electrode W2 of the electronic component W when the electronic component W is placed at a predetermined position.

Examples of metal materials used for the second probe element 21a include metals such as Cu, Fe, and Al. Further, in order to achieve good electrical contact, the contact surface of the second probe element 21a with the second external electrode W2 of the electronic component W may be plated with Au, Ag, Ni, Sn, or the like. .

The first probe temperature sensor 15 on the first probe 11 side and the second probe temperature sensor 25 on the second probe 21 side are both thermocouple type, Pt resistance temperature detector type, or thermistor temperature sensors.

Next, the operation of this embodiment having such a configuration will be described with reference to FIG.

First, the controller 40 drives the first probe heater 13 to heat the first probe holder 12 . The first probe 11 is thereby heated.

At the same time, the controller 40 drives the second probe heater 23 to heat the second probe holder 22 . The second probe 21 is thereby heated.

During this time, signals from the first probe temperature sensor 15 and the second probe temperature sensor 25 are input to the control unit 40, and the control unit 40 drives and controls the first probe heater 13 and the second probe heater 23 to 11 and second probe 21 are each maintained at a predetermined temperature.

In the present embodiment, it is assumed that the electronic component W is electrically tested by applying electricity to the electronic component W while heating the electronic component W at a predetermined test temperature (for example, 150° C.).

In this case, the controller 40 drives and controls the first probe heater 13 so as to maintain the first probe 11 at 153°C, which is slightly higher than the test temperature of 150°C. Similarly, the controller 40 drives and controls the second probe heater 23 so as to maintain the second probe 21 at 147°C, which is slightly lower than the test temperature of 150°C.

By heating and maintaining the first probe 11 to 153° C. and heating and maintaining the second probe 21 to 147° C., the electronic component W is heated by the first probe 11 and the second probe 21. , the temperature of the electronic component W is increased to an intermediate value between the temperature of the first probe 11 and the temperature of the second probe 21, that is, the test temperature of 150° C. and maintained.

In the present embodiment, the difference between the heating temperature of the first probe 11 and the heating temperature of the second probe 21 is 6°C. is preferably 5°C to 15°C.

In this case, if the difference in heating temperature between the first probe 11 and the second probe 21 is 5° C. or less, when the electronic component W self-heats as described later, the heat generated by this self-heating is transferred to the second It becomes difficult to dissipate heat from the probe 21 .

On the other hand, if the difference in heating temperature between the first probe 11 and the second probe 21 is 15° C. or more, temperature control of the electronic component W becomes difficult.

Next, electricity such as DC voltage, DC current, AC voltage, or AC current is applied from the test circuit unit 30 between the first probe 11 and the second probe 21, and the electrical characteristics of the electronic component W are measured. test.

In this way, while the electronic component W is being subjected to the electrical test, the electronic component W generates self-heating, and the temperature of the electronic component W rises from the test temperature of 150.degree. C. to, for example, 153.degree.

As described above, the electronic component W is heated by the first probe 11 and the second probe 21, its temperature is heated to the test temperature (150° C.), and its temperature is maintained. In this case, the electronic component W is heated at a higher temperature from the first probe 11, which is higher than the test temperature of the electronic component W, and the heat of the electronic component W is radiated to the second probe 21, which is lower than the test temperature of the electronic component W. It is Therefore, heat transfer occurs between the first probe 11, the electronic component W, and the second probe 21 before the electronic component W is subjected to an electrical test. A state of high responsiveness to heat is formed between the two probes 21 .

For this reason, when an electrical test is performed on the electronic component W and the temperature of the electronic component W rises from 150° C. to 153° C. due to self-heating, the electronic component W is heated from the first probe 11 heated to 153° C. No heat transfer from the side.

On the other hand, since the heat from the electronic component W is transmitted to the second probe 21 side, even if the electronic component W is heated to a high temperature by the electricity applied during the electrical test, the heat of the electronic component W is transferred to the second probe. 21 can effectively dissipate heat. Therefore, it is possible to prevent the electronic component W from being rapidly heated to a high temperature (so-called thermal runaway). For example, when the electronic component W is heated to 153°C by self-heating, the temperature difference between the electronic component W at 153°C and the second probe 21 at 147°C increases from 3°C to 6°C. The heat of the heated electronic component W can be effectively radiated by the second probe 21 .

As described above, according to the present embodiment, it is not necessary to detect the temperature of each electronic component W, and it is only necessary to heat the first probe 11 and the second probe 21 to the predetermined heating temperature. , the test temperature of the electronic component W can be reliably maintained at an intermediate value between the heating temperature of the first probe 11 and the heating temperature of the second probe 21 . Further, even if the temperature rises due to self-heating caused by the electricity applied to the electronic component W during the electrical test, the heat of the electronic component W can be effectively dissipated by the second probe 21 .

Further, according to the present embodiment, the test temperature of the electronic component W heated by the first probe 11 and the second probe 21 is the heating temperature of the first probe 11 and the heating temperature of the second probe 21. Therefore, a temperature distribution occurs in the electronic component W after heating from the first probe 11 side toward the second probe 21 side.

However, since the difference between the heating temperature of the first probe 11 and the heating temperature of the second probe 21 is 5° C. to 15° C. as described above, the temperature distribution in the electronic component W can be kept relatively small. Therefore, no trouble occurs when the electronic component W is electrically tested.

Furthermore, it is not necessary to provide a probe temperature sensor corresponding to each electronic component W, and a single first probe heater 13 and a single first probe temperature sensor 15 are provided on the first probe 11 side. , a single second probe heater 23 and a single second probe temperature sensor 25 are provided on the second probe 21 side. The control unit 40 controls the first probe heater 13 according to the signal from the first probe temperature sensor 15 , and the control unit 40 controls the second probe heater 23 according to the signal from the second probe temperature sensor 25 . Therefore, the overall apparatus can be simplified, and the control system can be simplified as much as possible.

<Second Embodiment>
Next, a second embodiment of the present disclosure will be described with reference to FIG.

In the second embodiment shown in FIG. 3, the same parts as those in the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 3, the electronic component testing apparatus 10 heats an electronic component W composed of a plurality of, for example, 200 laminated ceramic capacitors to a test temperature (100° C. to 170° C.) higher than normal temperature, and the electronic component W Electricity is applied to it, and electrical tests such as withstand voltage test, capacitance, insulation resistance, and leakage current are performed.

Such an electronic component testing apparatus 10 includes a first probe 11 that contacts the first external electrode W1 of the electronic component W, a second probe 21 that contacts the second external electrode W2 of the electronic component W, and the first probe 11 and a second probe heater 23 and a second probe temperature sensor 25 connected to the second probe 21 .

Of these, the first probe 11 is held by a horizontally elongated first probe holder 12 and includes a plurality of first probe elements 11a provided corresponding to the plurality of electronic components W. As shown in FIG. In this embodiment, the first probe element 11a of the first probe 11 is made of a pin-shaped conductor provided corresponding to each electronic component W. As shown in FIG.

The first probe heater 13 is built in the first probe holder 12 and is composed of a rubber heater that extends substantially over the entire length of the first probe holder 12 . It is provided in the substantially central part of the direction.

On the other hand, the second probe 21 is held by a horizontally elongated second probe holder 22 and includes a plurality of second probe elements 21a provided corresponding to the plurality of electronic components W. As shown in FIG. In the present embodiment, each second probe element 21a of the second probe 21 is made of a pin-shaped conductor provided corresponding to each electronic component W. As shown in FIG.

The second probe heater 23 is built in the second probe holder 22 and consists of a rubber heater extending substantially over the entire length of the second probe holder. It is provided approximately in the center.

As described above, the first probe element 11a is made of a pin-shaped conductor, and the second probe element 21a is made of a pin-shaped conductor. Both the first probe holder 12 and the second probe holder 22 are made of a non-conductive material such as machinable ceramics.

Furthermore, between the first probe 11 and the second probe 21, a DC voltage, a DC current, an AC voltage, an AC current, a superposition of a DC voltage and an AC voltage, or a DC current and a A test circuit section 30 is connected via wirings 31 and 32 to perform an electrical test of the electronic component W by applying a superimposed alternating current.

Further, the electronic device testing apparatus 10 has a control section 40 that drives and controls the components described above.

The effects of the electronic component testing apparatus 10 in the second embodiment shown in FIG. 3 are substantially the same as those of the electronic component testing apparatus 10 in the first embodiment shown in FIGS.

10 Electronic component testing apparatus 11 First probe 11a First probe element 12 First probe holder 13 First probe heater 15 First probe temperature sensor 21 Second probe 21a Second probe element 22 Second probe holder 23 Second probe heater 25 Second probe temperature sensor 30 Test circuit section 40 Control section W Electronic component W0 Electronic component body W1 First external electrode W2 Second external electrode

Claims (5)

In an electronic component testing apparatus for testing an electronic component having a first external electrode and a second external electrode and generating self-heating at a predetermined test temperature higher than room temperature,
a first probe that contacts the first external electrode of the electronic component;
a second probe that contacts the second external electrode of the electronic component;
a first probe heater and a first probe temperature sensor connected to the first probe;
a second probe heater and a second probe temperature sensor connected to the second probe;
and a control unit,
electricity is applied to the electronic component between the first probe and the second probe;
The control unit controls the first probe heater to maintain the temperature of the first probe at a heating temperature higher than the test temperature of the electronic component based on the signal from the first probe temperature sensor, An electronic component testing apparatus that controls the second probe heater so as to maintain the heating temperature of the second probe at a heating temperature lower than the test temperature based on a signal from the second probe temperature sensor. The control unit controls the first probe heater and the second probe heater so that the temperature difference between the heating temperature of the first probe and the heating temperature of the second probe is in the range of 5°C to 15°C. , The electronic device testing apparatus according to claim 1. The electronic component testing apparatus tests a plurality of electronic components, the first probe is held by a first probe holder and includes a single first probe element corresponding to the plurality of electronic components,
The first probe heater and the first probe temperature sensor are built in the first probe holder,
The second probe is held by a second probe holder and includes a plurality of second probe elements corresponding to each electronic component,
3. The electronic component testing apparatus according to claim 1, wherein said second probe heater and said second probe temperature sensor are built in said second probe holder. The electronic component testing apparatus tests a plurality of electronic components, the first probe is held by a first probe holder and includes a plurality of first probe elements corresponding to each electronic component,
The first probe heater and the first probe temperature sensor are built in the first probe holder,
The second probe is held by a second probe holder and includes a plurality of second probe elements corresponding to each electronic component,
3. The electronic component testing apparatus according to claim 1, wherein said second probe heater and said second probe temperature sensor are built in said second probe holder. DC voltage, DC current, AC voltage, AC current, superposition of DC voltage and AC voltage, or DC current and AC current to the electronic component between the first probe and the second probe. 5. The electronic device test apparatus according to claim 1, wherein the superimposition of .

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