JP2022109860A - Substrate processing device - Google Patents

Abstract

To provide a substrate processing device, which can be mounted with various type of modules without changing a design of a vacuum conveying module and can appropriately convey an object to be conveyed.SOLUTION: A substrate processing device comprises: a vacuum conveying module having a vacuum conveying space and an opening part; a wall unit mounted on the opening part, which includes a first gate valve and a second gate valve, where a width dimension of the second gate valve is larger than a width dimension of the first gate valve; a substrate processing module which is mounted on the wall unit and has a substrate processing space, where the substrate processing space is communicated with the vacuum conveying space through the first gate valve; a ring stocker that is mounted on the wall unit; and a conveying mechanism that is configured to convey a substrate between the vacuum conveying space and the substrate processing space and is configured to convey at least one annular member between the vacuum conveying space and a storage space.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to a substrate processing apparatus.

Japanese Unexamined Patent Application Publication No. 2002-200002 discloses a substrate processing apparatus that processes substrates. The substrate processing apparatus includes an atmospheric section that processes substrates under an atmospheric pressure atmosphere, and a decompression section that processes substrates under a reduced pressure atmosphere. The atmosphere section and the decompression section are integrally connected via two load lock modules capable of switching between an atmospheric pressure atmosphere and a decompressed atmosphere.

US2020/0083071A1

The technology according to the present disclosure is a vacuum transfer module of a substrate processing apparatus that can be used to mount a plurality of types of processing modules having different internal dimensions, transfer distances, etc., and various modules such as a ring stocker without changing the design of the vacuum transfer module. , to provide a substrate processing apparatus in which various modules are mounted and an object to be transported can be accurately transported.

One aspect of the present disclosure is a vacuum transfer module having a vacuum transfer space and an opening, and a wall unit attached to the opening, wherein the wall unit includes a first gate valve and a second gate valve; The substrate processing module includes a wall unit in which the width dimension of two gate valves is larger than the width dimension of the first gate valve, and a substrate processing space attached to the wall unit. 1 a substrate processing module communicating with said vacuum transfer space via a gate valve; and a ring stocker attached to said wall unit and having a storage space for storing at least one annular member used in said plasma processing module. and the storage space includes a ring stocker communicating with the vacuum transfer space via the second gate valve, and a ring stocker disposed in the vacuum transfer space, between the vacuum transfer space and the substrate processing space. configured to transfer substrates between the vacuum transfer space and the storage space via the first gate valve; and to transfer at least one annular member between the vacuum transfer space and the storage space via the second gate valve. and a substrate processing apparatus comprising:

According to the present disclosure, in a vacuum transfer module of a substrate processing apparatus, when various modules such as a plurality of types of processing modules and stockers having different internal dimensions, transfer distances, etc. are mounted, various modules can be installed without changing the design of the vacuum transfer module. By mounting the module, it becomes possible to carry out the transportation of the object to be transported accurately.

1 is a plan view showing the outline of the configuration of a wafer processing apparatus according to an embodiment; FIG. It is a perspective view which shows typically the outline of a structure of the module which concerns on this embodiment. 1 is a longitudinal sectional view schematically showing the outline of the configuration of a module according to this embodiment; FIG. FIG. 4 is a schematic cross-sectional plan view showing configurations of an end part, a post-processing module, and a ring stocker; FIG. 11 is a schematic perspective view of the configuration of an end part according to another embodiment; FIG. 11 is a schematic plan view of the configuration of an end part according to another embodiment; FIG. 4 is a detailed view of the aperture plate for the substrate processing module; It is a detailed view of the ring stocker opening plate. It is the schematic of the state which attached the substrate processing module and the ring stocker.

In the manufacturing process of semiconductor devices, various processing steps are performed in which the inside of a processing module containing semiconductor wafers (hereinafter simply referred to as "wafers") is decompressed and predetermined processing is performed on the wafers. ing. These processing steps are performed in a substrate processing apparatus (hereinafter also referred to as a wafer processing apparatus) having a plurality of processing modules.

This wafer processing apparatus has, for example, an atmospheric section equipped with an atmospheric module for performing desired processing on wafers in an atmospheric atmosphere, and a decompression section equipped with a decompression module for performing desired processing on wafers in a decompressed atmosphere. is doing. The atmosphere part and the decompression part are integrally connected via a load lock module configured to be able to switch the inside between the atmospheric atmosphere and the decompressed atmosphere.

By the way, when designing a wafer processing apparatus, as disclosed in Patent Document 1, a plurality of processing modules and component storage modules (so-called stockers) are attached to a vacuum transfer module constituting one transfer system in a decompression section. It is known. In addition to general modules for the main process, the modules to be installed include a post-processing module that performs post-processing of substrates, and a ring stocker that stores edge rings such as focus ring (FR) and cover ring (CR). Anything with dimensions and configurations is conceivable.

Further, in the vacuum transfer module that constitutes one transfer system, it is conceivable to change the type and configuration of the module to be mounted by attaching and detaching the module according to the content of the process.

In this way, when all kinds of modules are mounted on a single transport system, the specifications and dimensions differ depending on the functional configuration of the modules. and required transport distance may differ. For example, the object to be transferred in the post-processing module is a substrate (wafer), while the object to be transferred in the ring stocker is an edge ring with a larger diameter than the substrate. becomes. For these reasons, different types of modules have different dimensions and the like, and naturally the distances over which objects to be transported are transported are also different. Therefore, when mounting a plurality of modules in one transport system, it is required to mount various modules so that the transport mechanism can accurately transport objects to be transported into the respective modules.

The technology according to the present disclosure has been made in view of the above circumstances. Provided is a substrate processing apparatus capable of accurately transporting an object to be transported. A wafer processing apparatus as a substrate processing apparatus according to this embodiment will be described below with reference to the drawings. In the present specification and drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, thereby omitting redundant description.

<Structure of Wafer Processing Apparatus>
First, the wafer processing apparatus according to this embodiment will be described. FIG. 1 is a plan view showing a schematic configuration of a wafer processing apparatus 1 according to this embodiment. In this embodiment, the wafer processing apparatus 1 includes a plasma processing module for performing plasma processing such as etching processing, film forming processing, or diffusion processing on a wafer W as a substrate. In addition, after the substrate is processed in the plasma processing module, a post-processing module for performing, for example, an ashing process as a post-processing on the substrate, and an annular (ring) member (edge ring) arranged so as to surround the periphery of the wafer W are stored. will be described. However, the module configuration of the wafer processing apparatus 1 of the present disclosure is not limited to this, and may be arbitrarily selected according to the purpose of wafer processing. Further, various units and modules having different device configurations may be provided in place of the post-processing module and ring stocker.

As shown in FIG. 1, the wafer processing apparatus 1 has a configuration in which an atmosphere section 10 and a decompression section 11 are integrally connected via a load lock module 20 . The atmosphere section 10 includes an atmosphere module that performs desired processing on the wafer W under an atmosphere. The decompression unit 11 includes a decompression module that performs desired processing on the wafer W in a decompressed atmosphere.

The load lock module 20 has a plurality of, for example, three wafer transfer chambers 21a, 21b, and 21c in the present embodiment along the width direction (X-axis direction) of the loader module 30 and the fitting module 60, which will be described later. there is

Wafer transfer chambers 21a, 21b, and 21c as substrate transfer chambers (hereinafter, they may be collectively referred to simply as “wafer transfer chambers 21”) are connected to atmospheric part 10 via wafer transfer ports 22 and 23, which will be described later. The internal space of the loader module 30 and the internal space of the transfer module 50 of the decompression unit 11, which will be described later, are communicated with each other. The wafer transfer ports 22 and 23 are configured to be openable and closable by gate valves 24 and 25, respectively.

Wafer transfer chamber 21 is configured to hold wafer W temporarily. Further, the wafer transfer chamber 21 is configured so that the inside can be switched between an atmospheric atmosphere and a reduced-pressure atmosphere (vacuum state). That is, the load lock module 20 is configured so that the wafer W can be transferred appropriately between the atmospheric part 10 having an atmospheric atmosphere and the decompression part 11 having a decompressed atmosphere.

The atmospheric part 10 has a loader module 30 having a wafer transfer mechanism 40, which will be described later, and a load port 32 on which a FOUP 31 capable of storing a plurality of wafers W is mounted. The loader module 30 may be provided adjacently with an orienter module (not shown) for adjusting the horizontal orientation of the wafer W, a storage module (not shown) for storing a plurality of wafers W, and the like. good.

The loader module 30 has a rectangular housing inside, and the inside of the housing is maintained in the atmosphere. A plurality of, for example, five load ports 32 are arranged side by side on one side surface forming the long side of the loader module 30 on the Y-axis negative direction side. Wafer transfer chambers 21a, 21b, and 21c of the load lock module 20 are arranged side by side on the other side of the loader module 30, which constitutes the long side in the positive Y-axis direction.

A wafer transfer mechanism 40 for transferring the wafer W is provided inside the loader module 30 . The wafer transfer mechanism 40 has a transfer arm 41 that holds and moves the wafer W, a turntable 42 that rotatably supports the transfer arm 41, and a turntable 43 on which the turntable 42 is mounted. A guide rail 44 extending in the longitudinal direction (X-axis direction) of the loader module 30 is provided inside the loader module 30 . Rotating table 43 is provided on guide rails 44 , and wafer transfer mechanism 40 is configured to be movable along guide rails 44 .

The decompression unit 11 includes a transfer module 50 that internally transfers the wafer W, a fitting module 60 that interconnects the load lock module 20 and the transfer module 50, and a desired process for the wafer W transferred from the transfer module 50. It has a processing module (hereinafter also referred to as a plasma processing module) 70 for applying. The insides of the transfer module 50, the fitting module 60, and the plasma processing module 70 are configured to be able to maintain a reduced-pressure atmosphere. In this embodiment, a plurality of plasma processing modules 70, for example, six plasma processing modules 70 are connected to one transfer module 50. FIG. The number and arrangement of the plasma processing modules 70 are not limited to those of this embodiment, and can be set arbitrarily.

In the decompression part 11, the wall surface of the terminal end of the transfer module 50 (the end in the positive Y-axis direction) is provided with a post-processing (substrate) for the wafer W that has been processed in the plasma processing module 70 and then transferred through the transfer module 50. processing), and a ring stocker 105 for storing edge rings. Note that the post-processing module 100 and the ring stocker 105 are detachable, and their arrangement is not limited to this embodiment, and can be set arbitrarily.

The transfer module 50 as a vacuum transfer module is connected to the load lock module 20 via the fitting module 60 as described above. The transfer module 50, for example, transfers the wafer W loaded into the wafer transfer chamber 21a of the load lock module 20 to one plasma processing module 70, performs desired processing, and performs post-processing in the post-processing module 100 as necessary. , the wafer is unloaded to the atmospheric part 10 through the wafer transfer chamber 21 c of the load lock module 20 . In one embodiment, transfer module 50 has a vacuum transfer space and an opening. The opening communicates with the vacuum transfer space.

A wafer transfer mechanism 80 as a transfer mechanism for transferring the wafer W is provided inside the transfer module 50 . That is, the wafer transfer mechanism 80 is arranged within the vacuum transfer space of the transfer module 50 . The wafer transfer mechanism 80 has a transfer arm 81 that holds and moves the wafer W, a turntable 82 that rotatably supports the transfer arm 81, and a turntable 83 on which the turntable 82 is mounted. The rotating mounting table 83 is fixed to the central portion of the transfer module 50 . In one embodiment, the wafer transfer mechanism 80 is configured to transfer substrates between the vacuum transfer space of the transfer module 50 and the substrate processing space of the post-processing module 100 described below via the first gate valve 55a. . The wafer transfer mechanism 80 is configured to transfer at least one annular member (edge ring) between the vacuum transfer space of the transfer module 50 and the storage space of the ring stocker 105 via the second gate valve 56a. be. In one embodiment, the wafer transfer mechanism 80 is configured to transfer multiple annular members (edge rings) together between the vacuum transfer space and the storage space via the second gate valve 56a. The multiple annular members may include a first edge ring and a second edge ring, which will be described later.

Fitting module 60 interconnects load lock module 20 and transfer module 50 as described above.

The plasma processing module 70 subjects the wafer W to plasma processing such as etching processing, film forming processing, or diffusion processing. As the plasma processing module 70, a module that performs processing according to the purpose of wafer processing can be arbitrarily selected. The plasma processing module 70 communicates with the transfer module 50 through a wafer transfer port 51 formed on the side wall of the transfer module 50. The wafer transfer port 51 is configured to be openable and closable using a gate valve 71. there is

The post-processing module 100 performs post-processing such as ashing on the wafer W processed in the plasma processing module 70 . In one embodiment, post-processing module 100 is an ashing module. The post-processing module 100 is used as required, and when not required, the wafer W processed by the plasma processing module 70 is unloaded to the atmospheric part 10 as it is. In one embodiment, the post-processing module (substrate processing module) 100 is attached to a wall unit 110, which will be described later, and has a processing space (substrate processing space). The processing space communicates with the vacuum transfer space of the transfer module 50 via a first gate valve 55a, which will be described later.

The ring stocker 105 stores edge rings that are generally used to improve the uniformity of plasma processing of wafers W in semiconductor manufacturing equipment. An edge ring is taken out from the ring stocker 105 and used as needed, such as during plasma processing in the plasma processing module 70 . In one embodiment, ring stocker 105 is attached to wall unit 110 described below and has a storage space for storing at least one edge ring (annular member) used in plasma processing module 70 . At least one edge ring is positioned to surround the substrate within plasma processing module 70 . Note that multiple edge rings may be used together within the plasma processing module 70 . In one embodiment, the plurality of edge rings has a first edge ring and a second edge ring, the outer diameter of the second edge ring being greater than the outer diameter of the first edge ring. In one embodiment, the first edge ring is made of Si or SiC material and the second edge ring is made of quartz. Note that the first edge ring and the second edge ring may be made of the same material. For example, the first edge ring and the second edge ring may be made of quartz. The storage space communicates with the vacuum transfer space of the transfer module 50 via a second gate valve 56a, which will be described later.

The wafer processing apparatus 1 described above is provided with a controller 90 as shown in FIG. The control unit 90 is, for example, a computer having a CPU, memory, etc., and has a program storage unit (not shown). The program storage unit stores a program for controlling transfer and processing of the wafer W in the wafer processing apparatus 1 . The program may be recorded in a computer-readable storage medium H and installed in the control unit 90 from the storage medium H.

<Configuration of each module>
The wafer processing apparatus 1 according to this embodiment is configured as described above. Next, detailed configuration of each module will be described. 2 and 3 are a perspective view and a longitudinal sectional view schematically showing the outline of the configuration of the load lock module 20, the transfer module 50, the fitting module 60, the post-processing module 100, and the ring stocker 105. FIG.

As shown in FIGS. 2 and 3, the load lock module 20, fitting module 60, transfer module 50, and post-processing module 100 (or ring stocker 105) are connected in this order from the Y-axis negative direction side.

The load lock module 20 has three wafer transfer chambers 21a, 21b, 21c arranged side by side along the width direction (X-axis direction) of the fitting module 60, as shown in FIG. Each of the three wafer transfer chambers 21 has a wafer transfer port 22 for transferring wafers W to and from the loader module 30 and a wafer transfer port serving as a substrate transfer port for transferring wafers W to and from the transfer module 50 . A mouth 23 is formed. In other words, three wafer transfer openings 22 and 23 are formed in the side walls of the load lock module 20 on the Y-axis negative direction side and the Y-axis positive direction side, respectively.

The wafer transfer chamber 21 of the load lock module 20 is connected to the loader module 30 and transfer module 50 through the gate valves 24 and 25 as described above. These gate valves 24 and 25 ensure airtightness and mutual communication between the wafer transfer chamber 21 and the loader module 30 or transfer module 50 .

As shown in FIG. 3, the wafer transfer chamber 21 is provided with a stocker 26 that temporarily holds the wafer W transferred between the loader module 30 and the transfer module 50 .

As shown in FIG. 3, the load lock module 20 is connected to an air supply section 27 for supplying gas into the wafer transfer chamber 21 and an exhaust section 28 for discharging the gas. The load lock module 20 is configured such that the atmosphere inside the wafer transfer chamber 21 can be switched between an atmospheric atmosphere and a reduced pressure atmosphere by means of the air supply section 27 and the exhaust section 28 .

An opening 52 through which the wafer W is transferred to and from the fitting module 60 is formed at one end of the transfer module 50 on the Y-axis negative direction side to which the fitting module 60 is connected. A wafer transfer port 57a is formed in a terminal wall surface 57 as the other end portion of the transfer module 50 on the positive Y-axis side. An end part (wall unit) 110 is attached to the end wall surface 57 for carrying the wafer W between the post-processing module 100 and the ring stocker 105 . Mounting tables 101 and 106 for mounting the wafer W and the edge ring are provided inside the post-processing module 100 and the ring stocker 105, respectively.

The end part 110 includes a body portion 112 in which a wafer transfer port 111 (111a, 111b) is formed, and a first gate valve 55a and a second gate valve 56a, which will be described later. In one embodiment, wall unit 110 is attached to an opening in transfer module 50 . That is, the wall unit 110 defines part of the vacuum transfer space. In one embodiment, the wall unit 110 has a first space and a second space. The first space of the wall unit 110 is arranged between the vacuum transfer space of the transfer module 50 and the substrate processing space of the post-processing module 100 . The second space of the wall unit 110 is arranged between the vacuum transfer space of the transfer module 50 and the storage space of the ring stocker 105 . The first gate valve 55a is arranged in the first space and the second gate valve 56a is arranged in the second space. In one embodiment, the first gate valve 55a is located on the side of the wall unit 110 closer to the post-processing module 100 and the second gate valve 56a is located on the side of the wall unit 110 closer to the ring stocker 105 . In one embodiment, the depth dimension of the second space is greater than the depth dimension of the first space. In this case, the second gate valve 56a is arranged farther from the transfer module 50 than the first gate valve 55a. Detailed configurations of the post-processing module 100 and the ring stocker 105 will be described later with reference to FIG.

Thus, between the transfer module 50 and the fitting module 60, no plate member or gate valve is provided as shown. That is, the transfer module 50 and the fitting module 60 define an integrated transfer space S in which the inner space is communicated and the wafer W is transferred by the wafer transfer mechanism 80 .

As described above, on the side surfaces of the transfer module 50 on the negative and positive sides of the X-axis, which constitute the long sides of the transfer module 50, a plurality (in this embodiment, the number of plasma processing modules 70 to be installed) communicates with the plasma processing modules 70. A total of six wafer transfer ports 51 are formed. The wafer transfer port 51 is configured to be openable and closable using a gate valve 71 (see FIG. 1).

A gas supply unit 54 for supplying an inert gas (for example, N ₂ gas) to the transfer space S is connected to the ceiling surface of the transfer module 50 above the wafer transfer port 51 . The gas supply unit 54 supplies an inert gas to the transfer space S so as to block the wafer transfer port 51 , so as to form an air curtain. to suppress the scattering of particles and the like from the transfer module 50 .

In addition, the gas supply unit 54 eliminates the stagnant portion of the airflow inside the transfer space S, and the transfer space S is properly exhausted by an exhaust mechanism (not shown) connected to the fitting module 60. An inert gas is supplied to the inside of S.

<Configuration of post-processing module and ring stocker>
Next, detailed configurations of the post-processing module 100 and the ring stocker 105 will be described. FIG. 4 is a schematic cross-sectional plan view showing the configuration of the end part (wall unit) 110 provided on the end wall surface 57 of the transfer module 50 in the wafer processing apparatus 1, the post-processing module 100, and the ring stocker 105. FIG. 100 and the surroundings of the ring stocker 105 are enlarged and illustrated. Incidentally, in FIG. 4, the state in which the wafer transfer mechanism 80 (transfer arm 81) extends to the inside of each module is illustrated by broken lines.

As shown in FIG. 4, the terminal wall surface 57 of the transfer module 50 is attached with an end part 110 having a first gate valve 55a and a second gate valve 56a. The end part 110 has a main body 112 formed with a wafer transfer port 111 (111a, 111b) that can be opened and closed by the first gate valve 55a and the second gate valve 56a. The end part 110 is configured so that the body portion 112 can be freely attached to the end wall surface 57 of the transfer module 50 . The mounting method is not particularly limited, but it may be mounted by screwing, for example. The post-processing module 100 is mounted on the end wall surface 57 via the first gate valve 55a of the end part 110, and the ring stocker 105 is mounted via the second gate valve 56a of the end part 110.

A main body portion 112 of the end part 110 is configured by connecting a first main body portion 112a and a second main body portion 112b. The first main body portion 112a is a hollow housing that connects the terminal wall surface 57 and the post-processing module 100. The side surface on the terminal wall surface 57 side is open, and the wafer transfer port 111a is formed on the side surface on the post-processing module 100 side. It is A first gate valve 55a is provided inside the first body portion 112a. The second body portion 112b is a hollow housing that connects the terminal wall surface 57 and the ring stocker 105. The side surface on the terminal wall surface 57 side is open, and the wafer transfer port 111b is formed on the side surface on the ring stocker 105 side. It is A second gate valve 55b is provided inside the first body portion 112a. The structure of the main body part 112 is arbitrary. For example, in the structure according to the present embodiment, the thickness in the width direction (X-axis direction) is (Thickness in the Y-axis direction) varies depending on the part.

Although the configuration of the end part 110 is not limited to the illustrated form, for example, the first gate valve 55a and the second gate valve 56a may be gate valves having different dimensions and structures. That is, the first gate valve 55a may be a so-called bonnet-type gate valve, and the second gate valve 56a may be a so-called insert-type gate valve. The bonnet-type first gate valve is a gate valve attached to the convex portion of the first main body portion 112a. Also, an insert-type gate valve is a gate valve that is attached to a concave portion of the second main body portion 112b.

In the configuration according to the present embodiment, as shown in FIG. 4, the end part 110 has a Y-axis thickness L1 of a portion corresponding to the first gate valve 55a and a Y-axis thickness L1 of a portion corresponding to the second gate valve 56a. It is different from the directional thickness L2 and has a relationship of L1<L2. In other words, the distance L1 between the post-processing module 100 and the terminal wall surface 57 of the transfer module 50 is smaller than the distance L2 between the ring stocker 105 and the terminal wall surface 57 of the transfer module 50 .

Various modules such as the post-processing module 100 and the ring stocker 105 have chamber thicknesses, internal space dimensions, etc. according to their characteristics, and the distance from the module entrance to the transfer center also differs depending on each module. In the configuration according to the present embodiment, as shown in FIG. 4, the distance M1 from the module entrance of the post-processing module 100 to the transportation center and the distance M2 from the module entrance of the ring stocker 105 to the transportation center satisfy M1>M2. in a relationship. This is because the wall of the post-processing module 100 is thick because the post-processing module 100 may perform plasma processing, and the overall size of the housing of the module is larger than that of the ring stocker 105 .

Further, as shown in FIG. 4, the width dimension (X-axis direction dimension) D1 of the first gate valve 55a and the width dimension (X-axis direction dimension) D2 of the second gate valve 56a have a relationship of D1<D2. . This is because the transfer object of the post-processing module 100 is the wafer W, whereas the transfer object of the ring stocker 105 is an edge ring having a larger diameter than the wafer W.

In designing the wafer processing apparatus 1 in the semiconductor device manufacturing process, the design and dimensions of various modules such as the post-processing module 100 and the ring stocker 105 are determined in advance according to the processing contents. That is, the distance M1 from the module entrance of the post-processing module 100 to the transportation center and the distance M2 from the module entrance of the ring stocker 105 to the transportation center are defined in advance.

On the other hand, the end part 110 according to this embodiment is a part configured to be detachable from the end wall surface 57 of the transfer module 50 . That is, the design is arbitrary, and it is also possible to manufacture and prepare a plurality of types of end parts 110 . Of course, the width dimensions D1 and D2 of the first gate valve 55a and the second gate valve 56a included in the end part 110 can be arbitrarily designed. For example, as in the configuration according to the present embodiment, the first gate valve 55a having a width dimension D1 that matches the design of the post-processing module 100 and the second gate valve 56a having a width dimension D2 that matches the design of the ring stocker 105. The end part 110 may be designed and used to have a .

In the wafer processing apparatus 1 according to the present embodiment, as described above, the detachable end part 110 is attached to the end wall surface 57 of the transfer module 50, and the post-processing module is mounted through the end part 110. 100 and ring stocker 105 are mounted. As a result, various modules such as the post-processing module 100 and the ring stocker 105 can be mounted via the end part 110 without changing the design of the transfer module 50 as the vacuum transfer module.

Also, by appropriately designing the end parts 110, it is possible to accurately carry objects (wafers W, edge rings, etc.) to the post-processing module 100 and the ring stocker 105. FIG. Specifically, the end part 110 is manufactured so that the Y-axis direction thickness L1 of the first gate valve 55a and the Y-axis direction thickness L2 of the second gate valve 56a included in the end part 110 are set to desired values. can suitably adjust the conveying distance in each module. Specifically, the conveying distance in the post-processing module 100 according to this embodiment is L1+M1, and the conveying distance in the ring stocker 105 is L2+M2. By changing the values of L1 and L2 according to the design of the end part 110, the transport distance of each module can be designed to a desired distance.

It should be noted that the embodiments disclosed this time should be considered as examples and not restrictive in all respects. The embodiments described above may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

In the above embodiment, the gate valves included in the end part 110 are the first gate valve 55a, which is a so-called bonnet-type gate valve, and the second gate valve 56a, which is a so-called insert-type gate valve. It is not limited to this. For example, when two post-processing modules are mounted on the terminal wall surface 57 of the transfer module 50, an end part configured to have two so-called bonnet-type gate valves may be manufactured. Further, for example, when two ring stockers are mounted on the end wall surface 57 of the transfer module 50, an end part having a configuration having two so-called insert-type gate valves may be manufactured. As described above, the end parts are removable from the transfer module 50, so the end parts may be used according to the type of module to be mounted. The wafer processing apparatus 1 therefore comprises a flexible system that is attached to the opening of the transfer module 50 . The flexible system selectively includes one of the first replaceable unit, the second replaceable unit and the third replaceable unit. The first replaceable unit includes a first wall unit (not shown) and two aftertreatment modules 100,100. A first wall unit is mounted in the opening of the transfer module 50 and includes two first gate valves 55a, 55a. Two post-treatment modules 100, 100 are attached to the first wall unit. Each post-processing module 100 has a substrate processing space, and the substrate processing space communicates with the vacuum transfer space of the transfer module 50 through the first gate valve 55a. The second replaceable unit includes a second wall unit (not shown) and two ring stockers 105,105. A second wall unit is mounted in the opening of the transfer module 50 and includes two second gate valves 56a, 56a. Two ring stockers 105, 105 are attached to the second wall unit. Each ring stocker 105 has a storage space for storing one or more edge rings (annular members) used in plasma processing module 70 . The storage space communicates with the vacuum transfer space of the transfer module 50 via the second gate valve 56a. A third replaceable unit includes a third wall unit 110 , one post-processing module 100 and one ring stocker 105 .

Various designs and configurations can be considered for the end parts. For example, when no module is mounted on the end wall surface 57 of the transfer module 50, a so-called end plate is attached to cover and close the end wall surface 57 with a plate member. Also good. That is, the unit flexible system may selectively include any one of the first replaceable unit, the second replaceable unit, the third replaceable unit and the fourth replaceable unit. A fourth replaceable unit includes a fourth wall unit (end plate). Further, as a configuration of the wafer processing apparatus 1, one vacuum transfer module may be connected to another vacuum transfer module. In that case, instead of the end parts according to the above embodiment, a cylindrical pass module may be attached to connect the vacuum transfer modules and transfer the substrate between the vacuum transfer modules.

Further, instead of the configuration of the end part 110 according to the above-described embodiment, the end part 110 may be composed of a common end plate and opening plates corresponding to each replaceable unit (for example, the post-processing module 100 and the ring stocker 105). good. 5 and 6 are schematic explanatory diagrams of the configuration of an end part 110 according to another embodiment, FIG. 5 being a schematic perspective view and FIG. 6 being a schematic plan view. In addition, in the description of the present embodiment, constituent elements having the same functional configuration as the configuration of the above-described embodiment are denoted by the same reference numerals, and the description thereof may be omitted.

As shown in FIGS. 5 and 6, the end parts 110 include a common end plate 120 having two gate valves, and a substrate processing module plate corresponding to each gate valve 130, 130 and provided detachably. It includes an aperture plate 124 and a ring stocker aperture plate 126 . The configuration of the two gate valves 130, 130 provided on the end part 110 in this embodiment is arbitrary, and may be, for example, the above-described so-called bonnet-type gate valve or insert-type gate valve.

That is, in a state where the common end plate 120 is attached to the end wall surface 57 of the transfer module 50, the substrate processing module opening plate 124 and the ring stocker opening plate 126 are detachably provided in an arbitrary configuration. Any attachment/detachment means may be used, for example, screws may be used. As an example of attachment, as shown in FIG. 6, the substrate processing module opening plate 124 and the post-processing module 100 may be attached to one of the gate valves 130 in this order from the apparatus main body side. Further, the ring stocker opening plate 126 and the ring stocker 105 may be attached to the other gate valve 130 in this order from the apparatus main body side.

FIG. 7 is a detailed view of the substrate processing module aperture plate 124 . FIG. 8 is a detailed view of the ring stocker opening plate 126. As shown in FIG. 7 shows a state in which the substrate processing module opening plate 124 is attached to the post-processing module 100, and FIG. 8 shows a state in which the ring stocker opening plate 126 is attached to the ring stocker 105, respectively. As can be seen by comparing FIGS. 7 and 8, the substrate processing module aperture plate 124 and the ring stocker aperture plate 126 differ greatly in thickness. The ring stocker opening plate 126 is thicker than the substrate processing module opening plate 124 . Accordingly, in the end part 110, the Y-axis direction thickness L1 of one gate valve 130 and the Y-axis direction thickness L2 of the other gate valve 130 are different (L1 <L2) (see FIG. 6).

In this embodiment, the substrate processing module opening plate 124 and the ring stocker opening plate 126 are attached and detached as necessary. This makes it possible to easily adjust the conveying distance L1+M1 in the post-processing module 100 and the conveying distance L2+M2 in the ring stocker 105 using an opening plate corresponding to a desired mounting module. In particular, since the transport distances of both can be adjusted without exchanging the common end plate 120, the transport distance can be easily adjusted.

FIG. 9 is a schematic diagram of the post-processing module 100 and the ring stocker 105 attached to the gate valves 130, 130 of the end part 110 according to this embodiment. As shown in FIG. 9, the modules attached via the end parts 110 to the terminal wall surface 57 of the transfer module 50 may vary greatly in size depending on the type. By constructing the end part 110 from a common end plate 120 and opening plates 124 and 126, it is possible to attach and detach various modules even when the dimensions of the various modules to be installed are greatly different as shown in FIG. can be easily done.

Further, in the above embodiments, the wafer transfer mechanism 80 has been described as basically transferring the wafer W. However, like the wafer processing apparatus 1 according to this embodiment, the wafer W An edge ring ER may be used when plasma processing is performed on the . In such a case, the vacuum transfer section may be configured to transfer the edge ring ER as well. For example, the ring stocker 105 according to the above embodiment stores an edge ring that is generally used when plasma processing is performed in the plasma processing module 70. In such a configuration, naturally, the wafer transfer mechanism 80 is desirably configured to be capable of carrying not only the wafer W but also the edge ring.

Reference Signs List 1 wafer processing apparatus 50 transfer module 55a first gate valve 56a second gate valve 57 end wall surface 80 wafer transfer mechanism 100 post-processing module (substrate processing module)
105 Ring stocker 110 Wall unit (end part)
W wafer

Claims (12)

a vacuum transfer module having a vacuum transfer space and an opening;
a wall unit attached to the opening, the wall unit including a first gate valve and a second gate valve, wherein the width dimension of the second gate valve is greater than the width dimension of the first gate valve; a wall unit;
a substrate processing module attached to the wall unit and having a substrate processing space, the substrate processing space communicating with the vacuum transfer space through the first gate valve;
A ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in the plasma processing module, the storage space communicating with the vacuum transfer space via the second gate valve. a ring stocker in communication;
disposed in the vacuum transfer space, configured to transfer a substrate between the vacuum transfer space and the substrate processing space via the first gate valve, and comprising the vacuum transfer space and the storage space; a transport mechanism configured to transport at least one annular member between and through the second gate valve. The wall unit has a first space and a second space, the first space being arranged between the vacuum transfer space and the substrate processing space, and the second space being between the vacuum transfer space and the substrate processing space. 2. The substrate processing of claim 1, disposed between a storage space, wherein the first gate valve is disposed within the first space and the second gate valve is disposed within the second space. Device. 3. The substrate processing apparatus according to claim 1, wherein said second gate valve is arranged further away from said vacuum transfer module than said first gate valve. 4. The substrate processing apparatus according to claim 1, wherein said substrate processing module is a post-processing module. 5. The substrate processing apparatus according to claim 4, wherein said post-processing module is an ashing module. 6. The substrate processing apparatus of any one of claims 1 to 5, wherein the at least one annular member has at least one edge ring arranged to surround the substrate within the plasma processing module. 7. The substrate processing apparatus of claim 6, wherein the at least one edge ring comprises multiple edge rings used together within the plasma processing module. 8. The substrate processing of claim 7, wherein the plurality of edge rings comprises a first edge ring and a second edge ring, the outer diameter of the second edge ring being greater than the outer diameter of the first edge ring. Device. 9. The substrate processing apparatus according to claim 8, wherein said first edge ring is made of Si material or SiC material, and said second edge ring is made of quartz. The first gate valve is a bonnet type gate valve,
10. The substrate processing apparatus according to claim 1, wherein said second gate valve is an insert type gate valve. The wall unit is
a common end plate attached to the opening and including the first gate valve and the second gate valve;
a substrate processing module aperture plate mounted between the common end plate and the substrate processing module;
11. The substrate processing apparatus according to claim 1, further comprising a ring stocker opening plate attached between said common end plate and said ring stocker. a vacuum transfer module having a vacuum transfer space and an opening;
a flexible system attached to the opening of the vacuum transfer module and selectively including one of a first replaceable unit, a second replaceable unit and a third replaceable unit;
The first replaceable unit comprises:
a first wall unit mounted in the opening and including two first gate valves;
two substrate processing modules mounted on said first wall unit, each substrate processing module having a substrate processing space, said substrate processing space communicating with said vacuum transfer space through said first gate valve; two substrate processing modules;
The second replaceable unit comprises:
a second wall unit mounted in the opening and including two second gate valves;
two ring stockers attached to the second wall unit, each ring stocker having a storage space for storing an annular member used in the plasma processing module, the storage space accommodating the second gate valve; two ring stockers in communication with the vacuum transfer space via
The third replaceable unit comprises:
A third wall unit mounted in the opening and including a first gate valve and a second gate valve, wherein the width dimension of the second gate valve is greater than the width dimension of the first gate valve. a unit;
a substrate processing module attached to the third wall unit and having a substrate processing space, the substrate processing space communicating with the vacuum transfer space through the first gate valve;
A ring stocker attached to the third wall unit and having a storage space for storing an annular member used in the plasma processing module, the storage space communicating with the vacuum transfer space via the second gate valve. A substrate processing apparatus comprising: a ring stocker;

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