JP2022039407A - Mounting stand, heating device, soldering device, and insert fixing method - Google Patents

Abstract

To provide a mounting stand which can easily attach a slender insert to and detach from a stage, a heating device including the mounting stand, a soldering device and an insert fixing method.SOLUTION: A mounting stand 1 comprises: a stage 10 on which a work-piece W is placed; a slender insert 20 of which a part or the whole is inserted in the stage 10; and a detachable fixture 30 which fixes the insert 20 to the stage 10. An insertion hole 15 in which the insert 20 is inserted, and a fitting hole 16 in which the fixture 30 is fitted are formed on the stage 10. The fixture 30 has a pin 31 in which a through hole 35 communicating with the insertion hole 15 is formed, and an embedded component 36. The insert 20 is inserted in the insertion hole 15 and the through hole 35 and an embedded amount of the embedded component 36 increases, whereby the insert 20 is pinched and fixed by the fixture 30. A heating device includes the mounting stand 1, and a heater. A soldering device comprises the heating device, a chamber for accommodating the stage 10, and a processed gas supply part which supplies a processed gas into the chamber.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mounting table, a heating device, a soldering device, and a method for fixing an insert, and in particular, a mounting table, a heating device, a soldering device, and an insert that can easily fix and remove an elongated insert to a stage. Regarding the fixing method.

For example, in a reflow soldering apparatus, in order to reduce the oxide film of the object to be soldered, a reducing gas is supplied to heat the object to a temperature suitable for reducing the oxide film. After the oxide film is reduced, the object is heated to a melting temperature of the solder higher than the temperature suitable for reduction, and solder bonding is performed. Such temperature control for the object can be performed by placing the object on a stage formed of graphite in a plate shape and adjusting the heating amount of the stage with a heater (see, for example, Patent Document 1). .).

Japanese Patent No. 6677844

In order to control the temperature of the stage, which affects the temperature of the object, a thermocouple is inserted into the pores formed on the side surface of the stage to detect the temperature of the stage. When installing the thermocouple on the stage, if the thermocouple is simply inserted into the pores and not fixed, the thermocouple will easily come off the stage. When trying to fix a thermocouple to a stage, if the stage is made of graphite, the stage is thin and fragile, making it difficult to form threads and fixing it directly with screws. be. It is conceivable to bond the thermocouple to the stage, but if the thermocouple breaks down, the entire stage will have to be replaced.

In view of the above problems, the present invention provides a mounting table, a heating device, a soldering device, and a method for fixing an insert, which can easily fix and remove an elongated insert such as a thermocouple to a stage. The purpose.

In order to achieve the above object, the mounting table according to the first aspect of the present invention has a stage having a mounting surface on which a work is placed and an elongated outer shape, and a part or the whole thereof is inserted into the stage. The inserted insert is provided with a fixture attached to and detachable from the stage for fixing the inserted insert inserted into the stage to the stage, and the stage is provided with a fixture from the first surface of the stage. An insertion hole into which the insert is inserted is formed toward the inside of the stage, and the insertion hole extends from a second surface of the stage, which is different from the first surface, through the insertion hole. An fitting hole into which the fixture is fitted is formed, and the fixture has a pin having a through hole that communicates with the insertion hole when fitted into the fitting hole, and an embedding amount in the pin. The insert has a variable embedding member, and the insert is inserted into the insertion hole and the through hole, and the embedding amount of the embedding member in the pin is increased, so that the insert can be formed. It is configured to be sandwiched between the fixtures.

With this configuration, the pin is fitted into the stage from the fitting hole, the insert is inserted into the insertion hole and the through hole, and the amount of the embedded member embedded in the pin is increased to fix the insert to the stage. can do. Further, the insert can be easily removed from the stage by reducing the amount of the embedded member embedded in the pin from the state where the insert is fixed to the stage.

Further, in the mounting table according to the second aspect of the present invention, in the mounting table according to the first aspect of the present invention, the embedded member is a set screw, and the fixture has the set screw as the pin. By moving the insert toward the through hole in the direction along the axis of the through hole, the insert that has passed through the through hole is sandwiched between the inner surface of the through hole and the tip of the set screw.

With this configuration, the insert can be firmly sandwiched with a simple configuration.

Further, the mounting table according to the third aspect of the present invention is, in the mounting table according to the second aspect of the present invention, at least the through hole on the inlet side of the insert and the first surface and the fitting. The insertion hole between the insertion hole and the insertion hole is formed to have a width of 0.4 times or more the outer circumference of the through hole and the insertion piece passing through the insertion hole.

With this configuration, even if the insert is sandwiched between a pin and a set screw and becomes flat, the flattened portion of the insert will pass through when the insert is pulled out of the through hole and the insertion hole. It is possible to prevent the hole and the insertion hole from being caught and stuck.

Further, the mounting table according to the fourth aspect of the present invention is the mounting table according to the first aspect of the present invention, in which the pin has the pin on the side where the embedded member is present rather than the through hole. In the fixture, the amount of the gap changes and the size of the through hole changes as the embedded member moves in the direction of the gap between the gaps. , The insert is sandwiched between the inner surfaces of the through holes.

With this configuration, it is possible to sandwich the insert by reducing the inner diameter of the through hole, and it is possible to prevent the insert from becoming flat.

Further, the heating device according to the fifth aspect of the present invention includes a mounting table according to any one of the first to fourth aspects of the present invention, and a heater for heating the stage. The insert is a thermocouple, and the stage is made of a carbon-based material.

With this configuration, it is possible to provide a heating device capable of fixing the insert to the stage while adopting a stage in which temperature control is easy but direct screw fixing is difficult.

Further, the soldering device according to the sixth aspect of the present invention includes the heating device according to the fifth aspect of the present invention, the work is a substrate having solder, and a chamber accommodating the stage and a chamber. Further, a processing gas supply unit for supplying the processing gas used when soldering the substrate to the inside of the chamber is provided.

With such a configuration, it is possible to provide a soldering apparatus capable of appropriately adjusting the temperature of the stage and soldering the substrate appropriately.

Further, in the method for fixing the insert according to the seventh aspect of the present invention, the insert is placed on the stage using the mounting table according to any one of the first to fourth aspects of the present invention. In the fitting step of fitting the pin into the stage from the fitting hole so that the through hole communicates with the insertion hole, and the insertion into the stage from the first surface. The insertion step of inserting an object and arranging the tip of the insert through the through hole and inside the stage inside the pin, and the amount of the embedded member embedded in the pin. It is provided with a holding step of increasing and sandwiching the insert with the fixture.

With this configuration, the insert can be easily fixed to the stage.

According to the present invention, the insert is fixed to the stage by fitting the pin into the stage from the fitting hole, inserting the insert into the insertion hole and the through hole, and then increasing the amount of the embedded member embedded in the pin. can do. Further, the insert can be easily removed from the stage by reducing the amount of the embedded member embedded in the pin from the state where the insert is fixed to the stage.

It is an exploded perspective view of the mounting table which concerns on 1st Embodiment of this invention. It is an exploded perspective view of the fixture provided in the mounting table which concerns on 1st Embodiment of this invention. It is a flowchart which shows the procedure of fixing a thermocouple to the stage in the mounting table which concerns on 1st Embodiment of this invention. It is sectional drawing of the mounting table which concerns on 1st Embodiment of this invention. It is a schematic block diagram of the soldering apparatus which concerns on 3rd Embodiment of this invention which includes the heating apparatus which concerns on 2nd Embodiment of this invention. (A) is a plan view of the fixture according to the modified example, and (B) is a side sectional view of the fixture according to the modified example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, members that are the same as or correspond to each other are designated by the same or similar reference numerals, and duplicated description will be omitted.

First, the mounting table 1 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is an exploded perspective view of the mounting table 1. The mounting table 1 is a table suitable for controlling the temperature of the mounted work W, and is a stage 10 on which the work W is mounted, a thermocouple 20 for detecting the temperature of the stage 10, and a thermocouple 20 for the stage 10. It is provided with a fixing tool 30 for fixing to.

In the present embodiment, the stage 10 is formed of graphite in a flat plate shape (carbon plate). When the stage 10 is made of graphite, the response (followability) when the temperature of the stage 10 is changed can be accelerated. In the stage 10, one flat plate-shaped surface is a mounting surface 12 on which the work W is mounted. The mounting surface 12 is typically formed in a rectangle sized to accommodate at least the work W. Further, the mounting surface 12 is formed flat from the viewpoint of stability when the work W is mounted. It is preferable that the back surface 13 on the back side of the mounting surface 12 of the stage 10 is also formed flat. The stage 10 is preferably formed relatively thin from the viewpoint that the thickness of the flat plate shape enhances the followability when the temperature is changed. In the present embodiment made of graphite, the thickness of the stage 10 can be formed to be 3 mm to 10 mm, typically 5 mm or 7 mm, but other than the thickness exemplified here. It may be the thickness of. Here, one of the four surfaces on which the thickness of the stage 10 appears is referred to as the front surface 11. In the present embodiment in which the stage 10 is formed in the shape of a rectangular flat plate, the front surface 11 is orthogonal to the mounting surface 12 and the back surface 13.

An insertion hole 15 is formed in the stage 10 from the front surface 11 toward the inside of the stage 10. The insertion hole 15 is a hole into which the thermocouple 20 is inserted. In this embodiment, the thermocouple 20 corresponds to the insert and the front surface 11 corresponds to the first surface. The size of the insertion hole 15 is formed to be large enough to allow the thermocouple 20 to pass through, and in the present embodiment, the diameter is 0.5 mm to 5 mm, typically 1.3 mm and 1.5 mm. It is formed to be 2 mm, 4 mm, or the like. However, the size of the insertion hole 15 is not limited to the size exemplified here, and may be appropriately determined in consideration of the size of the thermocouple 20 and the thickness of the stage 10. The insertion hole 15 is typically formed in the middle of the stage 10 in the thickness direction H. Further, the insertion hole 15 typically extends from the central portion of the front surface 11 in the width direction toward the center of gravity of the stage 10 along the mounting surface 12. The length of the insertion hole 15 (distance from the front surface 11, depth) may be determined from the viewpoint of allowing the thermocouple 20 to be arranged at the position where the temperature of the stage 10 is desired to be detected. In the present embodiment, the length of the insertion hole 15 is 15 mm to 30 mm, or 18 mm to 25 mm.

Further, the stage 10 is formed with a fitting hole 16 from the mounting surface 12 toward the back surface 13. The fitting hole 16 is a hole into which the fixture 30 is fitted. In this embodiment, the mounting surface 12 corresponds to the second surface. The fitting hole 16 penetrates the insertion hole 15. Here, when the fitting hole 16 penetrates the insertion hole 15, it means that the insertion hole 15 appears at two points on the inner surface of the fitting hole 16. In other words, the insertion hole 15 is formed inside the stage 10 between the fitting hole 16 and the front surface 11 and inside the stage 10 on the opposite side of the fitting hole 16 to the front surface 11. Is. In the present embodiment, the fitting hole 16 penetrates the thickness direction H of the stage 10 and reaches the back surface 13 from the mounting surface 12, but does not penetrate the thickness direction H and reaches the back surface 13. It does not have to be reached. The size of the fitting hole 16 may be determined according to the size of the fixture 30 to be fitted inside, and in the present embodiment, the fitting hole 16 is formed to have a diameter of approximately 4 mm to 8 mm, typically a diameter of 6 mm.

As the thermocouple 20, a sheathed thermocouple is used in the present embodiment. The size of the thermocouple 20 may be appropriately selected from those specified in the Japanese Industrial Standards in consideration of the size of the stage 10 and the size of the insertion hole 15. The thermocouple 20 has an outer diameter of 1 mm in the present embodiment, but may have an outer diameter of 1.6 mm, 3.2 mm, or the like depending on the situation. The thermocouple 20 typically includes a compensating lead. Therefore, the length of the thermocouple 20 is the length from the insertion hole 15 in the stage 10 to the measuring instrument (not shown), and may be several hundred mm to several thousand mm. Therefore, the thermocouple 20 has an elongated outer shape. A part of the thermocouple 20 is inserted inside the stage 10 so that the tip reaches the end of the insertion hole 15, and the rest is exposed from the stage 10.

In this embodiment, the fixative 30 includes a pin 31, a set screw 36, and a washer 39. The pin 31 is similar in appearance to a hexagon bolt, but no screw is formed in a portion corresponding to the threaded portion of the hexagon bolt (hereinafter referred to as “shaft portion”). The pin 31 is formed so that the shaft portion is fitted into the fitting hole 16 of the stage 10. An embedded hole 33 is formed in the pin 31 along the axis from the top surface of the head. The set screw 36 can be inserted into the embedding hole 33. The washer 39 is a member provided between the head of the pin 31 and the mounting surface 12 of the stage 10 when the pin 31 is fitted into the fitting hole 16. The washer 39 may be used as needed and may be omitted if it is not needed. In the fixture 30, the shaft portion of the pin 31 is fitted into the fitting hole 16 of the stage 10, and the head of the pin 31 is exposed without being fitted into the fitting hole 16. Therefore, a part of the fixture 30 is fitted into the fitting hole 16. The details of the fixture 30 will be described with reference to FIG.

FIG. 2 is an exploded perspective view of the fixture 30. The shaft portion 31s of the pin 31 is preferably formed to have an outer diameter that allows it to be fitted into the fitting hole 16 of the stage 10 with as little play as possible. For example, the outer diameter is about 0.05 mm smaller than the inner diameter of the fitting hole 16. It is preferably formed in a diameter. In the present embodiment, the length of the shaft portion 31s is formed so that the tip of the shaft portion 31s is flush with the back surface 13 of the stage 10 when the pin 31 is fitted into the fitting hole 16. , Other suitable lengths may be formed. A through hole 35 for passing the thermocouple 20 is formed in the shaft portion 31s. The through hole 35 extends in a direction intersecting the axis of the pin 31, typically extending in a direction orthogonal to the axis of the pin 31. The through hole 35 is formed at a height that communicates with the insertion hole 15 when the pin 31 is fitted into the fitting hole 16. The through hole 35 may be formed to have the same size as the insertion hole 15 in light of the purpose of communicating with the insertion hole 15 and passing the thermocouple 20 through, and the fitting error of the pin 31 into the fitting hole 16 may be reduced. In consideration, it may be formed larger than the insertion hole 15.

As described above, the pin 31 is formed with an embedded hole 33. The embedding hole 33 extends from the top surface of the head 31h along the axis of the pin 31 and reaches the through hole 35. In other words, the embedding hole 33 communicates with the through hole 35. An internal screw is formed in the embedding hole 33. On the other hand, the set screw 36 is formed with an external screw that engages with the internal screw of the embedded hole 33. The set screw 36 is configured so that the embedding amount with respect to the pin 31 can be changed according to the amount of rotation around its own axis, and corresponds to an embedding member. In the present embodiment, the set screw 36 is a set screw rod tip with a hexagon socket having a hexagonal hole formed at one end and a rod tip formed at the other end. Since the tip of the set screw 36 is a rod tip, when the set screw 36 is screwed into the pin 31, the tip of the set screw 36 is brought closer to the lowermost part of the inner surface of the curved through hole 35. Can be done. The tip of the set screw 36 may be a flat tip or a round tip other than the rod tip, and a hole or groove other than a hexagonal hole suitable for a tool used for tightening / loosening work is formed at the end. You may. Further, a screw, a bolt or the like may be used as an embedded member instead of the set screw 36. The fixture 30 configured in this way moves the set screw 36 toward the through hole 35 in the direction along the axis of the pin 31 so that the thermocouple 20 passing through the through hole 35 can be moved through the through hole 35. It can be sandwiched between the inner surface of the screw 36 and the tip of the set screw 36.

Next, with reference to FIG. 3, a method of fixing the thermocouple 20 (insert) in the mounting table 1 in which the members 10, 20, and 30 are configured as described above will be described. For the configurations of the members 10, 20, and 30 of the mounting table 1 referred to in the following description, FIGS. 1 and 2 will be referred to as appropriate. In order to fix the thermocouple 20 to the stage 10, first, the pin 31 passed through the washer 39 is fitted into the fitting hole 16 of the stage 10 (fitting step: S1). At this time, the orientation of the pins 31 is adjusted so that the insertion holes 15 formed on both sides of the fitting hole 16 and the through holes 35 of the pins 31 communicate with each other (so that they are arranged linearly). Is fitted into the fitting hole 16. Next, the thermocouple 20 is inserted into the insertion hole 15 from the front surface 11, passed through the through hole 35 of the pin 31, and reaches the insertion hole 15 deeper than the pin 31, so that the tip of the thermocouple 20 is staged. It is arranged inside 10 (insertion step: S2). After arranging the thermocouple 20 on the stage, the set screw 36 is screwed into the embedded hole 33 of the pin 31, and the thermocouple 20 at the portion passing through the through hole 35 is passed through the tip of the set screw 36 and the pin 31. It is sandwiched between the inner surface of the hole 35 (pinching step: S3). By doing so, the thermocouple 20 is sandwiched between the pin 31 and the set screw 36, so that it cannot be removed from the fixture 30, and the thermocouple 20 passes through the insertion hole 15 and the through hole 35, so that it is fixed. The tool 30 does not come off the stage 10. Therefore, the stage 10, the thermocouple 20, and the fixture 30 are intertwined, and the thermocouple 20 is fixed to the stage 10. FIG. 4 shows a state in which the thermocouple 20 is fixed to the stage 10.

When removing the thermocouple 20 from the stage 10, loosen the set screw 36 screwed into the pin 31, and when the tip of the set screw 36 separates from the thermocouple 20, pull out the thermocouple 20 from the insertion hole 15 and the through hole 35. Just do it. When the thermocouple 20 is fixed, if the cross-sectional shape of the thermocouple 20 is deformed by sandwiching the thermocouple 20 between the pin 31 and the set screw 36, it becomes difficult for the thermocouple 20 to come out of the through hole 35. There is. In order to avoid such inconvenience, the pin 31 has an enlarged diameter of at least the opening of the through hole 35 on the side where the thermocouple 20 enters, which is expanded to a width of 0.4 times or more the outer circumference of the thermocouple 20. It should be a part. Here, the opening of the through hole 35 on the side where the thermocouple 20 enters is the through hole 35 which can be seen as being divided into two by the embedded hole 33 in a plan view, and the thermocouple 20 is passed through the through hole 35. Sometimes it is the part of the through hole 35 where the thermocouple 20 enters first. In other words, it is a portion of the through hole 35 located on the front 11 side of the embedding hole 33. The enlarged diameter portion of the through hole 35 may be formed in an elliptical shape having the widened width as the major axis, or may be formed in a circular shape having the widened width as the diameter. The widened width of the enlarged diameter portion is 0.5 times, 0.8 times, 1.0 times, 1.2 times, 1.5 times, 2.0 times, 3.0 times the outer circumference of the thermocouple 20. Or more.

In view of avoiding the difficulty of the deformed thermocouple 20 coming out, the insertion hole 15 (insertion hole 15 on the inlet side) between the fitting hole 16 and the front surface 11 is also expanded of the through hole 35. It may be formed so as to have a width that can be adopted as a diameter portion. The size of the insertion hole 15 on the inlet side may be aligned with the enlarged diameter portion of the through hole 35, and is different in size from the enlarged diameter portion of the through hole 35 and may be adopted as the enlarged diameter portion of the through hole 35. May be. The insertion hole 15 on the inner side of the stage 10 (the insertion hole 15 on the back side) of the stage 10 with respect to the insertion hole 15 on the inlet side has a thermocouple 20 from the viewpoint of reducing the error of the detected temperature. It is preferable that the outer diameter is close to that of. On the other hand, the opening of the through hole 35 (the opening of the through hole 35 on the back side) of the pin 31 on the side opposite to the inlet side with respect to the embedding hole 33 is the same as the enlarged diameter portion of the through hole 35 on the inlet side. It may be the same size as the insertion hole 15 on the back side. The opening of the through hole 35 on the back side is sized as it approaches the insertion hole 15 on the back side from the embedding hole 33 so that the thermocouple 20 can be smoothly inserted into the insertion hole 15 and the through hole 35. It is preferable that it is formed in a tapered shape so that

Next, with reference to FIG. 5, the heating device 50 according to the second embodiment of the present invention and the soldering device 100 according to the third embodiment of the present invention will be described. FIG. 5 is a schematic configuration diagram of the soldering apparatus 100. In the following description, when the configuration of the mounting table 1 is referred to, FIGS. 1 and 2 will be referred to as appropriate. In the present embodiment, the mounting table 1 is a component of the heating device 50, and the heating device 50 is a component of the soldering device 100. Hereinafter, the heating device 50 will be described as a part of the soldering device 100. The heating device 50 includes the above-mentioned mounting table 1 and a heater 51 for heating the stage 10 of the mounting table 1. The soldering device 100 includes the above-mentioned heating device 50, a chamber 60 accommodating the heating device 50, a formic acid supply unit 80 for supplying formic acid F to the inside of the chamber 60, and a control device 90. The work W processed by the soldering apparatus 100 is typically a substrate to be soldered.

The heater 51 heats the work W placed on the stage 10 via the stage 10. In the present embodiment, the heater 51 is arranged at a position close to the stage 10 below the stage 10. In the present embodiment, the heater 51 is configured by arranging a plurality of infrared lamps (IR lamps) along the back surface 13 of the stage 10 at appropriate intervals. In the present embodiment, as described above, the stage 10 is made of graphite, and since graphite has a small heat capacity, the temperature of the stage 10 can be rapidly changed according to the output of the heater 51.

The chamber 60 forms an internal space in which the work W is soldered. Since soldering is preferably performed under vacuum (less than atmospheric pressure), the chamber 60 can withstand at least a degree of vacuum suitable for soldering, preferably lower. It has a structure. The chamber 60 is typically formed in a rectangular parallelepiped shape from the viewpoint of ease of manufacture, but the outer peripheral wall may be formed into a curved surface from the viewpoint of pressure resistance. The chamber 60 is provided with a shutter (not shown) that opens and closes an opening (not shown) that allows the work W to be taken in and out.

The formic acid supply unit 80 supplies the formic acid F used in the soldering process to the chamber 60. Formic acid F is a substance capable of reducing an oxide on a work W (solder substrate) and functions as a reducing agent. The formic acid supply unit 80 has a formic acid source (not shown), a pipe 81 for guiding the formic acid F from the formic acid source (not shown) into the chamber 60, and a control valve 82 arranged in the pipe 81. The formic acid source (not shown) has a vaporizing portion for vaporizing the formic acid F, and is configured to be able to supply the vaporized formic acid F into the chamber 60. The vaporized formic acid F is a gas supplied in a series of steps for soldering the work W, and corresponds to a processing gas. Further, the formic acid supply unit 80 supplies the vaporized formic acid F as the processing gas to the inside of the chamber 60, and corresponds to the processing gas supply unit. The end of the pipe 81 opposite to that connected to the formic acid source (not shown) is connected to the chamber 60. The formic acid supply unit 80 is configured such that the formic acid F vaporized when the control valve 82 is opened is supplied into the chamber 60, and the supply of the formic acid F into the chamber 60 is interrupted when the control valve 82 is closed. Has been done. In this embodiment, since the stage 10 is made of graphite as described above, the stage 10 has corrosion resistance to formic acid.

The control device 90 is a device that controls the operation of the soldering device 100. The control device 90 is directly or indirectly electrically connected to the thermocouple 20 and is configured to be able to grasp the temperature detected by the thermocouple 20. That is, in the present embodiment, the control device 90 functions as a measuring instrument for the thermocouple 20. Further, the control device 90 is electrically connected to the heater 51, and is configured to be able to heat the stage 10 by turning the heater 51 on and off and changing the output. Further, the control device 90 is electrically connected to the formic acid supply unit 80, and is configured to be able to supply the formic acid F toward the chamber 60 through the opening / closing operation of the control valve 82.

The soldering apparatus 100 configured as described above operates as follows. The work W is supplied into the chamber 60 and placed on the mounting surface 12 of the stage 10. After that, the control device 90 activates the heater 51 to start heating the work W via the stage 10. Further, the control device 90 controls the control valve 82 to supply the vaporized formic acid F into the chamber 60. When the formic acid F is supplied into the chamber, the control device 90 sets the temperature of the heater 51 based on the temperature detected by the thermocouple 20 so that the work W has a temperature suitable for the reduction of the oxide by the formic acid F. Adjust the output. When the oxide on the work W is reduced and removed, the inside of the chamber 60 is made a negative pressure so that the temperature of the work W rises to the temperature at which the solder on the work W melts. The output of the heater 51 is adjusted based on the detected temperature. A vacuum pump (not shown) that can be controlled by the control device 90 may be used to create a negative pressure in the chamber 60. When the solder on the work W melts, the work W is soldered. Once the work W has been soldered, the work W is naturally or forcibly cooled and removed from the chamber 60. In this way, the soldered work W can be manufactured by the action of the soldering device 100.

As described above, according to the mounting table 1 according to the present embodiment, the pin 31 is fitted into the fitting hole 16, the thermocouple 20 is inserted into the insertion hole 15 and the through hole 35, and the set screw is inserted into the pin 31. By screwing in 36, the thermocouple 20 can be easily fixed to the stage 10. Further, by loosening the set screw 36 from the pin 31, the thermocouple 20 can be easily removed from the stage 10. Further, if the width of the through hole 35 on the inlet side and the insertion hole 15 on the inlet side of the pin 31 is widened, even if the thermocouple 20 is sandwiched between the pin 31 and the set screw 36 and deformed flatly, the thermocouple 20 is formed. It is possible to prevent the screw from being caught in the through hole 35 and the insertion hole 15 when the screw is removed. Further, according to the heating device 50 according to the present embodiment, since the stage 10 is made of graphite, it is possible to quickly follow the change in the output of the heater 51. Further, according to the soldering apparatus 100 according to the present embodiment, the temperature of the work W can be appropriately adjusted, and the work W can be soldered appropriately.

Next, with reference to FIG. 6, the fixture 130 according to the modified example will be described. FIG. 6A is a plan view of the fixture 130, and FIG. 6B is a side sectional view of the fixture 130. Fixture 130 is used to fix the thermocouple 20 (see FIG. 1) and the stage 10 (see FIG. 1) in place of the fixture 30 (see FIG. 1) on the mounting table 1 (see FIG. 1). It is something that can be done. In the following description of the fixative 130, when each component of the mounting table 1 is referred to, FIGS. 1 and 2 will be referred to as appropriate. Fixture 130 includes a pin 131 and a bolt 136.

The pin 131 has a shaft portion 131s to be fitted into the fitting hole 16 of the stage 10 and a head portion 131h provided at one end of the shaft portion 131s. The shaft portion 131s is formed in a round bar shape in which no screw is formed on the outer periphery. The head 131h is typically formed in a columnar shape having a diameter larger than that of the shaft portion 131s, but may be formed in a prismatic shape having a right-angled cross section formed in a polygon such as a hexagon. A through hole 135 for passing the thermocouple 20 is formed in the shaft portion 131s. The through hole 135 is formed in the same position as the through hole 35 in the pin 31 (see FIG. 1) with respect to the shaft portion 131s, but the size is substantially the same as the outer diameter of the thermocouple 20. There is. Here, substantially the same means that the thermocouple 20 can be passed through the through hole 35 (the thermocouple 20 can be moved in the longitudinal direction in the through hole 35) from the outer diameter of the thermocouple 20. Although it is large, it is as close to the outer diameter of the thermocouple 20 as possible. An embedded hole 133 into which a bolt 136 is inserted is formed in the head 131h. The embedding hole 133 is formed so as to extend in a direction orthogonal to the axis of the pin 131. In this modification, the embedding hole 133 penetrates the side surface of the cylinder constituting the head 131h.

The pin 131 is formed with a slit 134 that bisects the side of the head 131h with respect to the through hole 135 in a direction that intersects (typically orthogonally) the axial direction of the pin 131. The slit 134 is a form of a gap that divides the pin 131 from the through hole 135 along the axis of the pin 131. The slit 134 also appears on the top surface of the head 131h in a plan view. The slit 134 is elongated along the diameters of the head 131h and the shaft portion 131s in a plan view. The slit 134 is elongated in a direction orthogonal to the direction in which the embedding hole 133 extends in a plan view. The embedded hole 133 is divided into two by the slit 134. In the embedding hole 133, an internal screw is formed in one of the two portions divided by the slit 134, and an internal screw is not formed in the other. Bolts 136 can be inserted into the embedding holes 133.

The bolt 136 is typically a hexagon socket head cap screw, but a groove for receiving a positive or negative screwdriver may be formed on the top surface of the head, and the outer circumference of the head is sandwiched by a wrench around the axis. The head may be formed in a hexagonal shape so that it can be rotated. An external screw that engages with an internal screw formed in a part of the embedded hole 133 is formed in the shaft portion of the bolt 136. The bolt 136 is configured so that the embedding amount with respect to the pin 131 can be changed according to the amount of rotation around its own axis, and corresponds to an embedding member. When screwing the bolt 136 into the embedding hole 133, insert the tip of the bolt 136 from the embedding hole 133 on the side where the internal thread is not formed, and after the tip of the bolt 136 has passed the slit 134, the inside of the embedding hole 133 Allows it to be screwed into a screw.

When the fixing tool 130 configured as described above is applied to the mounting table 1 instead of the fixing tool 30 (see FIGS. 1 and 2), first, the shaft of the pin 131 is inserted into the fitting hole 16 of the stage 10. The portion 131s is fitted (fitting step). At this time, the orientation of the pin 131 is adjusted so that the insertion hole 15 and the through hole 135 communicate with each other. Next, the tip of the thermocouple 20 is passed through the insertion hole 15 and the through hole 135 and placed inside the stage 10 (insertion step). Next, the bolt 136 is screwed into the embedding hole 133. Then, since the internal screw is not formed in the embedding hole 133 between the head of the bolt 136 and the slit 134, the tip of the bolt 136 advances while being hooked on the screw of the embedding hole 133 in the back of the slit 134. Then, the width of the slit 134 gradually decreases. As the width of the slit 134 gradually decreases, the diameter of the through hole 135 also gradually decreases, and the outer circumference of the thermocouple 20 is sandwiched by the entire inner surface of the through hole 135 (pinching step). By doing so, since the thermocouple 20 is sandwiched between the pins 131, the stage 10, the thermocouple 20 and the fixture 130 are in an entangled state, and the thermocouple 20 is fixed to the stage 10. According to the fixture 130 of this modification, since the thermocouple 20 is sandwiched so as to wrap around the entire inner surface of the through hole 135, it is possible to prevent the thermocouple 20 from being deformed flatly.

In the above description, it is assumed that the stage 10 is formed of graphite in a flat plate shape, but the material may be a metal other than carbon, silicon, or other material, and the shape is other than the plate shape. It may be a rectangular parallelepiped or the like. The mounting table 1 according to the embodiment of the present invention is particularly useful when a material that is difficult to thread is used as the stage 10, but even when a material that can be threaded is used, the stage 10 is screwed. It has the advantage that the insert can be easily fixed without any processing.

In the above description, the insert is a thermocouple 20, but a linear or strip-shaped elongated object other than the thermocouple 20 may be used as the insert.

In the above description, it is assumed that the heating device 50 is housed in the chamber 60, but at least the stage 10 may be housed in the chamber 60, and the heater 51 may be provided outside the chamber 60. good. At this time, the portion of the chamber 60 between the heater 51 and the stage 10 may be made transparent, and the stage 10 may be heated by the radiant heat from the heater 51.

In the above description, the heating device 50 is a component of the soldering device 100, but the heating device 50 may be a component of a device other than the soldering device 100. For example, the heating device 50 can be a component of a device such as a solder bump manufacturing device for forming solder bumps on a substrate and a firing device for firing a metal paste.

In the above description, the processing gas is vaporized formic acid F, but a series of steps for soldering the work W such as nitrogen in place of the vaporized formic acid F or in addition to the vaporized formic acid F. It may contain the gas used for. In this case, a configuration in which a processing gas other than formic acid F is supplied into the chamber 60 in place of the formic acid supply unit 80 or in addition to the formic acid supply unit 80 also corresponds to the processing gas supply unit, which is typically the case. The processing gas supply unit will also be controlled by the control device 90.

In the above description, the mounting table, the heating device, the soldering device, and the fixing method of the insert according to the embodiment of the present invention have been described mainly with reference to FIGS. 1 to 6 as an example. The structure, number, arrangement, shape, material, etc. are not limited to the above specific examples, and those appropriately selectively adopted by those skilled in the art are also included in the scope of the present invention as long as the gist of the present invention is included. ..

1 Mounting stand 10 Stage 11 Front 12 Mounting surface 15 Insertion hole 16 Fitting hole 20 Thermocouple 30, 130 Fixture 31, 131 Pin 35, 135 Through hole 36, 136 Set screw 50 Heating device 51 Heater 60 Chamber 80 Formic acid supply Part 100 Soldering device F Formic acid W Work

Claims (7)

A stage with a mounting surface on which the work is mounted, and
An insert that has an elongated shape and is partially or wholly inserted into the stage.
A fixture detachable from the stage, which fixes the insert inserted into the stage to the stage, is provided.
The stage is formed with an insertion hole into which the insert is inserted from the first surface of the stage toward the inside of the stage, and the second surface of the stage is different from the first surface. A fitting hole into which the fixture is fitted is formed so as to extend from the surface of the insertion hole through the insertion hole.
The fixative has a pin having a through hole that communicates with the insertion hole when fitted into the fitting hole, and an embedding member having a variable embedding amount in the pin.
With the insert inserted into the insertion hole and the through hole, the amount of the embedded member embedded in the pin increases, so that the insert is sandwiched between the fixtures.
Mounting stand. The embedded member is a set screw.
The fixative moves the set screw toward the through hole in a direction along the axis of the pin so that the insert passing through the through hole can be moved to the inner surface of the through hole and the set screw. It is configured to be sandwiched between the tip and the tip.
The mounting table according to claim 1. At least, the through hole on the inlet side of the insert and the insertion hole between the first surface and the fitting hole are 0. It is formed to be more than four times as wide,
The mounting table according to claim 2. The pin is formed with a gap that divides the pin on the side where the embedded member is located rather than the through hole.
In the fixture, as the embedded member moves in the direction of the gap, the amount of the gap changes and the size of the through hole changes, so that the insert is formed on the inner surface of the through hole. It is a composition that sandwiches
The mounting table according to claim 1. The mounting table according to any one of claims 1 to 4.
A heater for heating the stage is provided.
The insert is a thermocouple
The stage is made of a material whose main raw material is carbon.
Heating device. The heating device according to claim 5 is provided.
The work is a substrate having solder and is
The chamber that houses the stage and
A processing gas supply unit for supplying the processing gas used when soldering the substrate to the inside of the chamber is further provided.
Soldering equipment. A method of fixing the insert to the stage using the mounting table according to any one of claims 1 to 4.
The fitting step of fitting the pin into the stage from the fitting hole so that the through hole communicates with the insertion hole.
An insertion step of inserting the insert into the stage from the first surface and arranging the tip of the insert inside the stage inside the pin through the through hole.
It comprises a pinching step of increasing the embedding amount of the embedding member with respect to the pin and sandwiching the insert with the fixing tool.
How to fix the insert.

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