JP2022077951A - 固体撮像素子 - Google Patents
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 126
- 239000002184 metal Substances 0.000 claims abstract description 126
- 238000006243 chemical reaction Methods 0.000 claims abstract description 24
- 238000005192 partition Methods 0.000 claims description 47
- 238000003384 imaging method Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 10
- 230000035945 sensitivity Effects 0.000 description 8
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
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- 230000008021 deposition Effects 0.000 description 4
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- 230000000295 complement effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZQXQADNTSSMHJI-UHFFFAOYSA-N hafnium(4+) oxygen(2-) tantalum(5+) Chemical compound [O-2].[Ta+5].[Hf+4] ZQXQADNTSSMHJI-UHFFFAOYSA-N 0.000 description 1
- KQHQLIAOAVMAOW-UHFFFAOYSA-N hafnium(4+) oxygen(2-) zirconium(4+) Chemical compound [O--].[O--].[O--].[O--].[Zr+4].[Hf+4] KQHQLIAOAVMAOW-UHFFFAOYSA-N 0.000 description 1
- KUVFGOLWQIXGBP-UHFFFAOYSA-N hafnium(4+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Hf+4] KUVFGOLWQIXGBP-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
101 半導体基板
101F 半導体基板の表面
101B 半導体基板の裏面
103 光電変換素子
105 配線層
107 高誘電率(高κ)膜
109 バッファ層
111、111’、111” 第1の金属グリッド構造
113、113’、113”、113G、113B、113R、113B’、113G’ 第2の金属グリッド構造
115B 青色カラーフィルタ層
115BS 青色フィルタセグメント
115G 緑色カラーフィルタ層
115GS 緑色フィルタセグメント
115R 赤色カラーフィルタ層
115RS 赤色フィルタセグメント
117 透明層
119 集光構造
119-1 第1の集光構造
ML1 第1の厚さ
119-2 第2の集光構造
ML2 第2の厚さ
121 第1のグリッド構造
121S 第1のグリッドセグメント
121W パーティショングリッド幅
MW1 第1のグリッド幅
MW2 第2のグリッド幅
MWB 青色グリッド幅
MWG 緑色グリッド幅
MWR 赤色グリッド幅
dG、dB、dR、dB’、dG’ シフト
L 入射光
D 水平方向
P1 第1の通常画素
P2 第2の通常画素
PDAF 位相検出オートフォーカス
MH1 第1のグリッドの高さ
MHR、MHG 第2のグリッドの高さ
A-A’断面線
B-B’断面線
Claims (10)
- 複数の光電変換素子、
前記複数の光電変換素子の上に配置され、複数の第1のカラーフィルタセグメントを有する第1のカラーフィルタ層、
前記複数の光電変換素子の上に配置され、前記第1のカラーフィルタ層に隣接し、複数の第2のカラーフィルタセグメントを有する第2のカラーフィルタ層、
前記第1のカラーフィルタ層と前記第2のカラーフィルタ層との間に配置された第1の金属グリッド構造、および
前記複数の第1のカラーフィルタセグメントの間及び前記複数の第2のカラーフィルタセグメントとの間にそれぞれ配置された第2の金属グリッド構造を含み、
前記第1の金属グリッド構造の底部は第1のグリッド幅を有し、前記第2の金属グリッド構造の底部は前記第1のグリッド幅よりも狭い第2のグリッド幅を有する固体撮像素子。 - 前記複数の第1のカラーフィルタセグメントは、緑色カラーフィルタセグメントを含み、
前記複数の第2のカラーフィルタセグメントは、青色及び/又は赤色のカラーフィルタセグメントを含み、
前記緑色カラーフィルタセグメントの間の前記第2の金属グリッド構造の底部は緑色グリッド幅を有し、
前記青色及び/又は赤色カラーフィルタセグメントの間の第2の金属グリッド構造の底部は前記緑色グリッド幅と異なる青色及び/又は赤色グリッド幅を有し、
前記緑色グリッド幅と前記青色及び/又は赤色グリッド幅との差は、0~50nmである請求項1に記載の固体撮像素子。 - 前記第1の金属グリッド構造および前記第2の金属グリッド構造上に配置されたパーティショングリッド構造をさらに含み、
前記固体撮像素子の断面図では、前記パーティショングリッド構造は複数のパーティショングリッドセグメントに分割され、前記パーティショングリッド構造は、前記第1のグリッド幅以上のパーティショングリッド幅を有する請求項1に記載の固体撮像素子。 - 前記第1の金属グリッド構造および前記第2の金属グリッド構造上に配置されたパーティショングリッド構造をさらに含み、
前記固体撮像素子の断面図では、前記パーティショングリッド構造は複数のパーティショングリッドセグメントに分割され、前記第2の金属グリッド構造は、前記固体撮像素子の端部領域では、前記複数のパーティショングリッドセグメントのそれぞれの中心線に対してシフトして配置され、前記複数の第1のカラーフィルタセグメントは、緑色カラーフィルタセグメントを含み、前記複数の第2のカラーフィルタセグメントは、青色及び/又は赤色のカラーフィルタセグメントを含む請求項1に記載の固体撮像素子。 - 前記固体撮像素子の端部領域では前記複数のパーティショングリッドセグメントのそれぞれの中心線に対して、前記緑色カラーフィルタセグメントの間の前記第2の金属グリッド構造は、第1のシフトを有し、前記青色及び/又は赤色のカラーフィルタセグメントの間の前記第2の金属グリッド構造は、第2のシフトを有し、前記第1のシフトと前記第2のシフトは異なっており、前記第1のシフトと前記第2のシフトの差は0~50nmである請求項4に記載の固体撮像素子。
- 前記第1の金属グリッド構造および前記第2の金属グリッド構造上に配置されたパーティショングリッド構造をさらに含み、
前記固体撮像素子の断面図では、前記パーティショングリッド構造は複数のパーティショングリッドセグメントに分割され、前記第2の金属グリッド構造は、前記固体撮像素子の端部領域では、前記複数のパーティショングリッドセグメントのそれぞれの中心線に対してシフトして配置され、水平方向では、前記第2の金属グリッド構造は入射光から離れる側に向かってシフトして配置される請求項1に記載の固体撮像素子。 - 前記第1の金属グリッド構造および前記第2の金属グリッド構造上に配置されたパーティショングリッド構造をさらに含み、
前記固体撮像素子の断面図では、前記パーティショングリッド構造は複数のパーティショングリッドセグメントに分割され、前記第2の金属グリッド構造は、前記固体撮像素子の端部領域では、前記複数のパーティショングリッドセグメントのそれぞれの中心線に対してシフトして配置され、前記第1のカラーフィルタ層または前記第2のカラーフィルタ層は、前記第2の金属グリッド構造の一部を覆う請求項1に記載の固体撮像素子。 - 前記複数の光電変換素子は、複数の位相検出オートフォーカス画素と、前記位相検出オートフォーカス画素を囲む複数の第1の通常画素と、前記複数の第1の通常画素を囲む複数の第2の通常画素とに対応するように配置され、前記第1の金属グリッド構造は、前記複数の位相検出オートフォーカス画素と前記複数の第1の通常画素との間の領域に対応するように配置され、前記第2の金属グリッド構造は、前記複数の第1の通常画素と前記複数の第2の通常画素との間の領域に対応するように配置される請求項1に記載の固体撮像素子。
- 前記第1の金属グリッド構造は第1のグリッドの高さを有し、前記第2の金属グリッド構造は前記第1のグリッドの高さよりも低い第2のグリッドの高さを有し、前記固体撮像素子の断面図では、前記第1の金属グリッド構造および前記第2の金属グリッド構造は、台形、三角形、または長方形として形成され、前記第1のグリッド幅に対する前記第2のグリッド幅の比は、0.25~0.9である請求項1に記載の固体撮像素子。
- 前記第1のカラーフィルタ層および前記第2のカラーフィルタ層上に配置された複数の集光構造をさらに含み、
前記複数の集光構造の厚さは異なる請求項1に記載の固体撮像素子。
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US17/096,018 US12046611B2 (en) | 2020-11-12 | 2020-11-12 | Solid-state image sensor |
US17/096,018 | 2020-11-12 |
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JP (1) | JP7301090B2 (ja) |
KR (1) | KR102497910B1 (ja) |
CN (1) | CN114497090A (ja) |
TW (1) | TWI793647B (ja) |
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US12027548B2 (en) * | 2020-12-09 | 2024-07-02 | Visera Technologies Company Limited | Image sensor |
US12046609B2 (en) * | 2021-10-07 | 2024-07-23 | Visera Technologies Company Limited | Solid-state image sensor |
US20240021634A1 (en) * | 2022-07-14 | 2024-01-18 | Visera Technologies Company Limited | Image sensor and method for reducing image signal processor |
Citations (5)
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JP2011003622A (ja) * | 2009-06-17 | 2011-01-06 | Nikon Corp | 撮像素子 |
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