JP2022057212A - Package, object with package and method for manufacturing object with package - Google Patents

Abstract

To provide a package which can efficiently be produced and whose appearance and communication characteristic are satisfactory, an object with a package, and a method for manufacturing an object with a package.SOLUTION: In a container 10 with a package, a package 1 covering at least a portion of a container 5 (an object) includes a first base material 4, an antenna 20 formed on at least one surface side of the first base material 4, a second base material, a wiring part formed on at least one surface side of the second base material, and an IC chip connected electrically to the wiring part. The second base material is laminated on the first base material 4. The antenna 20, the wiring part and the IC chip constitute a communication circuit which enables non-contact communication with an external apparatus, and the first base material 4 and the second base material include the same material with each other.SELECTED DRAWING: Figure 1

Description

The present invention relates to a package, an article with a package, and a method for manufacturing an article with a package capable of non-contact communication.

In recent years, IC tags using RFID technology have been used as non-contact short-range communication using radio waves and the like. For example, with IC tags attached to various articles, the articles are used for distribution such as transportation and sales. In this case, by holding the article over an external device (reading / writing device) as necessary, the article information recorded on the IC chip of the IC tag can be read out by non-contact communication or various information can be written on the IC chip. can. This enables efficient physical distribution management.

The IC tag attached to the article is mainly composed of a chip portion, an antenna portion, and a support portion that holds them. Immediately after the article is manufactured, a method of forming the IC tag in advance on the packaging material covering the article can be considered in order to start the distribution management associated with the IC tag. However, such a packaging material is printed in large quantities by, for example, a gravure printing machine, and is usually wound into a roll and stored. When parts having different thicknesses such as IC chips are mixed, it becomes difficult to neatly wind the packaging material into a roll. Further, if the IC chip is attached to the packaging material in advance, the defective packaging material that fails to be packed in the article must be discarded together with the IC chip. Further, even if the IC chip is damaged during transportation of the packaging material, the packaging material must be replaced after the packaging material is packed in the article, which may increase the manufacturing cost and the work load.

Further, Patent Document 1 and Patent Document 2 disclose an article in which an IC tag is attached and the IC tag is covered with a packaging material. However, if the base material of the IC tag is harder than the packaging material, it may cause damage to the packaging material or poor appearance due to the end face of the IC tag. On the contrary, when the base material of the IC tag is soft, the pressure when covering with the packaging material may cause the IC tag to fail. Patent Document 3 discloses a method for manufacturing a packaging paperboard that enables non-contact communication. A plurality of antenna patterns are printed on one layer of at least two layers of packaging paperboard at predetermined intervals, and a plurality of RFIC elements on which an IC chip is mounted are predetermined on the other layer of the two layers. Adhere at intervals. Then, one layer and the other layer are bonded together, the RFIC element and the antenna pattern are sandwiched between one layer and the other layer, and the RFIC element and the antenna pattern are electrically connected. From the above, a paperboard for packaging that enables non-contact communication can be obtained.

Japanese Unexamined Patent Publication No. 2010-49410 Special Table 2014-164317 International release WO2018 / 216686

By forming a part of the IC tag such as an antenna on the packaging material in advance and then attaching the remaining part of the IC tag including the IC chip formed separately to the packaging material later, the IC chip It is possible to efficiently manufacture articles with packaging materials that do not cause disposal loss of articles due to defects. By the way, depending on the material, such a packaging material may expand due to moisture absorption, or may be contracted by applying heat in order to fit the packaging material to an article. At this time, the remaining part of the IC tag including the IC chip may be peeled off or deformed from the packaging material, resulting in poor appearance or insufficient communication characteristics.

The present disclosure has been made in view of such circumstances, and provides a method for manufacturing a package, an article with a package, and an article with a package, which can be efficiently produced and has a good appearance and communication characteristics. Make it an issue.

The package according to the present embodiment is a package that covers at least a part of the article, and includes a first base material, an antenna formed on at least one surface side of the first base material, and a second base material. The base material is provided with a wiring portion formed on at least one surface side of the second base material, and an IC chip electrically connected to the wiring portion, and the second base material is the second base material. The antenna, the wiring portion, and the IC chip, which are laminated on the base material 1, constitute a communication circuit capable of non-contact communication with an external device, and the first base material and the second base material form a communication circuit. , Contain the same material as each other.

Further, in the package according to another embodiment of the present embodiment, the same material may be PET.

Further, in the package according to another embodiment of the present embodiment, the same material may be a paper material.

Further, in the package according to another embodiment of the present embodiment, the IC chip may be arranged on the surface of the second base material on the side close to the first base material.

Further, the package according to another embodiment of the present embodiment further includes a third base material, and the third base material may be laminated so as to sandwich the antenna so as to face the first base material. good.

Further, in the package according to another embodiment of the present embodiment, when the first base material and the second base material are viewed in a plan view from the stacking direction, a part of the antenna and a part of the wiring portion overlap. You may.

Further, the article with a package according to another embodiment of the present embodiment may be an article in which the above package is fixed to the article.

Further, in the article with a package according to another embodiment of the present embodiment, the article has an uneven surface, and the package is fixed so that the communication circuit is arranged on the uneven surface of the article. May be good.

The method for manufacturing an article with a package according to the present embodiment is a method for manufacturing an article with a package in which at least a part of the article is covered with the package.
The difference in shrinkage rate after immersing the article in hot water at 100 ° C. for 10 seconds with the package in contact with or close to the outer peripheral surface is 5% or less, the first base material and the second base material. A step of forming an antenna on at least one surface side of the first base material, a step of forming a wiring portion on at least one surface side of the second base material, and the wiring portion. The process of electrically connecting the IC chip to the device and the communication circuit composed of the antenna, the wiring unit, and the IC chip by laminating the first base material and the second base material are connected to the external device. In the process of forming a package that enables non-contact communication, the package is brought into contact with or close to the article, and then the package is heated and heat-shrinked to bring the package to the article. It is provided with a fixing process.

Further, in the method for manufacturing a packaged product according to another embodiment of the present embodiment, the stretching direction of the first base material is defined as the first stretching direction, and the stretching direction of the second base material is defined as the second stretching direction. When, the first base material and the second base material may be laminated so that the second stretching direction is along the first stretching direction.

Further, in the method for manufacturing a packaged product according to another embodiment of the present embodiment, which is a step performed before the step of forming the package, the outer peripheral surface with respect to the first base material and the second base material. A step of preparing a third base material, wherein the difference in shrinkage rate after immersing the article in hot water at 100 ° C. for 10 seconds with the package in contact with or close to the package is 5% or less.
A step of laminating the third base material facing the first base material so as to sandwich the antenna may be further provided.

Further, in the method for manufacturing a packaged product according to another embodiment of the present embodiment, the package may be fixed to the article so that the communication circuit is arranged on the uneven surface of the article.

According to the present embodiment, it is possible to provide a package, a packaged article, and a method for manufacturing a packaged article, which can be efficiently produced and have good appearance and communication characteristics.

It is a schematic diagram explaining the structure of the package body and the article with a package body of 1st Embodiment. It is plan view and sectional drawing explaining the package body of 1st Embodiment. It is an enlarged sectional view explaining the detail of part C of FIG. 2 (b). It is a figure explaining the manufacturing method of the package body of 1st Embodiment. It is a figure explaining the manufacturing method of the package body of 1st Embodiment. It is sectional drawing explaining the package body of 2nd Embodiment. It is a schematic diagram explaining the structure of the article with a package of 3rd Embodiment. It is a top view explaining the package body of 4th Embodiment. It is a top view explaining the package of 5th Embodiment and 6th Embodiment. It is plan view and sectional drawing explaining the package of 7th Embodiment.

Hereinafter, an example of the package, the article with the package, and the method for manufacturing the article with the package will be described with reference to the drawings and the like. However, the package or the like of the present disclosure is not limited to the embodiments and examples described below.

In addition, each figure shown below is shown schematically. Therefore, the size and shape of each part are exaggerated as appropriate to facilitate understanding. Further, in each figure, hatching showing a cross section of the member is omitted as appropriate. Numerical values such as dimensions and material names of each member described in the present specification are examples of embodiments, and are not limited thereto, and can be appropriately selected and used. In the present specification, terms that specify a shape or a geometric condition, such as parallel, orthogonal, and vertical, are used to include substantially the same state in addition to the exact meaning.

1. 1. First Embodiment The first embodiment of the packaged body and the article with the packaged body of the present disclosure will be described. FIG. 1A is a schematic view showing a container 10 with a package body in which the package body 1 is provided in the container 5. FIG. 1 (b) is a view showing a cross section of the container 10 with a package of FIG. 1 (a) cut in a plane passing through the line AA in the vertical direction and passing through the second portion 3. 2 (a) is a plan view for explaining the package 1, and FIG. 2 (b) is a line BB along the longitudinal direction of the package 1 in the figure of FIG. 2 (a). It is sectional drawing when the package 1 is cut in the plane parallel to the thickness direction of the package 1 passing through. FIG. 3 is an enlarged view of a portion C including the IC chip 6 of FIG. 2 (b).

Here, for convenience of explanation, the XYZ coordinate system is set for the package 1 before being attached to the container 5. As shown in FIGS. 2A and 2B, the Z-axis is taken in the normal direction with respect to the main surface of the first base material 4 of the package 1, and the main surface of the first base material 4 on the Z-axis is taken. The direction from the IC chip 6 to the IC chip 6 is the upper side in the + Z direction or the thickness direction, and the opposite direction is the lower side in the −Z direction or the thickness direction. Further, the direction along the Z axis is also referred to as a vertical direction in the Z direction or a thickness direction.

Further, when the package 1 is viewed from the + Z direction, the X axis is taken in the longitudinal direction of the package 1 or the first base material 4, and the Y axis is taken in the lateral direction, and FIGS. 2 (a) and 2 (b) are taken. In, the left side is the −X direction or the left side, and the right side is the + X direction or the right side. Further, in FIG. 2A, the upper side is the + Y direction or the upper side, and the lower side is the −Y direction or the lower side. Further, the direction along the X axis is also referred to as the X direction or the left-right direction, and the direction along the Y axis is also referred to as the Y direction or the vertical direction.

(A) Configuration of Package The configuration of the package 1 and the container with the package 10 according to the first embodiment will be described below with reference to FIGS. 1 to 3. As shown in FIGS. 1 (a) and 1 (b), the package 1 covers, for example, a container 5, which is an example of an article, so as to wrap around the outer periphery near the center in the height direction, and includes a package. It constitutes a container 10. The package 1 is roughly divided into a first base material 4 wound around the container 5 and an antenna 20 having a predetermined shape provided on the surface of the first base material 4 facing inward when wound around the container 5. A second portion 2 having a predetermined shape, which is one size smaller than the first portion 2 and is provided on the surface of the first portion 2 which faces inward when wound around the container 5. It is composed of a part 3 and a part 3.

On the other hand, the configuration of the package 1 in a flat state before being wound around the container 5 is as shown in FIGS. 2 (a) and 2 (b). As a constituent of the first portion 2, a first base material 4 which is a thin and long sheet or film having a substantially rectangular shape and a surface on the + Z direction side, which is one surface of the first base material 4, are formed in a predetermined pattern. The antenna 20 and the like. The antenna 20 has a configuration separated into a first partial antenna 21 arranged on the left side and a second partial antenna 22 arranged on the right side. Further, when viewed in a plan view from the + Z side, the second base material 31 of the second portion 3 is placed on the second substrate 31 via the adhesive layer 38 so as to overlap the respective ends of the first partial antenna 21 and the second partial antenna 22. It is arranged on the + Z direction side of 1 base material 4.

Examples of the second portion 3 include a second base material 31, a wiring portion 30, and an IC chip 6. Further, if necessary, the second portion 3 includes an adhesive layer for adhering the second base material 31 and the wiring portion 30, a mold release layer formed on the mounting surface side of the IC chip 6 of the wiring portion 30, and the like. It may be included. Further, the second portion 3 may include an adhesive layer 38 for fixing the second base material 31 to the first base material 4. In the present embodiment, the second portion 3 is formed by overlapping the adhesive layer 38, the IC chip 6, the wiring portion 30, and the second base material 31 in this order from the side closer to the first base material 4. Here, the wiring portion 30 has a configuration in which a first branch portion 32 arranged on the left side and a second branch portion 33 arranged on the right side are partially separated. The IC chip 6 is arranged so as to straddle the first branch portion 32 and the second branch portion 33 of the wiring portion 30.

Further, the IC chip 6 and the wiring portion 30 are both configured to be sandwiched between the first base material 4 and the second base material 31. As a result, when the package 1 is wound around the container 5 so that the first base material 4 is on the outermost side, the wiring portion 30 and the IC chip 6 that are most susceptible to deterioration due to external force, moisture, or the like are the first base material 4 and the first base material 4. It is protected by the two base materials 31, and the durability and reliability of the package 1 can be improved. In this case, as shown in FIG. 1 (b), it is preferable that the container 5 is provided with a recess 57 on the side surface thereof toward the inside. Since the container 5 has such a shape, the convex portion of the package 1 particularly the second portion 3 is housed in the recess 57, and the appearance of the package 1 in the container with the package 10 is improved. Is. However, the container 5 does not necessarily have to have a recess on its side surface.

On the other hand, in the second portion 3, the adhesive layer 38, the second base material 31, the wiring portion 30, and the IC chip 6 are overlapped in this order from the side closer to the first base material 4, as in the seventh embodiment described later. May be done. At this time, even if the container 5 does not have a recess on the side surface thereof, it is possible to avoid deterioration of the appearance of the package 1 wound around the container 5.

Since the package 1 has the above configuration, one of the electrodes of the IC chip 6 is electrically connected to the first partial antenna 21 via the first branch portion 32, and the other is electrically connected to the second branch portion 33. It will be electrically connected to the second partial antenna 22 via. Further, the antenna 20 forms a pair of left and right dipole antennas centered on the IC chip 6. As a result, the package 1 can transmit and receive radio signals in the UHF band such as 920 MHz, and can transmit information by non-contact communication with an external device. Hereinafter, the configuration of each part of the package 1 will be described.

(I) First base material The first base material 4 is a member that supports the antenna 20 formed by printing or the like, has appropriate flexibility, and the antenna 20 is damaged or broken due to deformation due to an external force or the like. It is preferable that it can suppress. The first base material 4, which is used to cover at least a part of an article such as a container 5, has the printability, durability, etc. for imparting distinctiveness and design to the article and maintaining this for a long period of time. Desired. Further, in order to fit the shape of the article, a heat-shrinkable first base material 4 may be used. The heat-shrinkable film is also called a shrink film or a shrink label.

Examples of the heat-shrinkable first base material 4 include a stretched polyester-based film, a stretched polystyrene-based film, a stretched polyolefin-based film, a polylactic acid-based film, a foamed polyolefin-based film, a stretched polyester-polyester co-extruded film, or a foamed polystyrene. Examples include system films. Further, a laminated film of the non-woven fabric and the film may be used. Among these, stretched polyester-based film, stretched polystyrene-based film, stretched polyolefin-based film, polylactic acid-based film, foamed polyolefin-based film, foamed polystyrene-based film, laminated film of non-woven fabric and shrink film, stretched polyester-polystyrene co-extruded film. One or more films selected from the group consisting of are preferred.

The thickness of the first base material 4 is not particularly limited, but can be appropriately selected within a range that does not impair heat resistance, rigidity, mechanical properties, appearance, and the like. The thickness of the first base material 4 can be, for example, 10 μm or more and 500 μm or less, preferably 20 μm or more and 200 μm or less. This is because, within this range, appropriate rigidity, flexibility and heat resistance can be ensured, and adhesion to an article such as a container can be obtained.

The stretched film may be uniaxially stretched or biaxially stretched, and in the case of a uniaxially stretched film, it may be vertically uniaxially stretched or horizontally uniaxially stretched. The longitudinal uniaxial stretching refers to a long film which is an original member from which a large number of first base materials 4 are taken and is stretched in the flow direction of the long film. In this case, the longitudinal direction of the first base material 4 usually corresponds to the width direction of the long film, that is, the direction perpendicular to the flow direction. On the other hand, the lateral uniaxial stretching refers to a long film stretched in the width direction. Therefore, in the case of longitudinal uniaxial stretching, the first base material 4 heat-shrinks along the lateral direction, and in the case of horizontal uniaxial stretching, it thermally shrinks along the longitudinal direction.

When the first base material 4 is formed into a cylinder and mounted on the container 5 and then heat-shrinked, it is preferable to use a laterally uniaxially stretched film. In this case, the first base material shrinks along the outer peripheral direction of the container 5, so that the first base material 4 can be brought into close contact with the container 5 in a good appearance. On the other hand, examples of the first base material 4 that does not require heat shrinkage include paper materials such as high-quality paper, coated paper, and art paper, synthetic paper, non-woven fabric, and cloth material. In this embodiment, polyethylene terephthalate (PET), which is a heat-shrinkable stretched polyester-based film, is used as the first base material 4.

(Ii) Antenna The antenna 20 is arranged on one of the front and back surfaces of the first base material 4, or divided into both surfaces. The antenna 20 is a portion where a predetermined pattern for transmitting and receiving radio waves is formed of a conductive member. In the present embodiment, the antenna 20 includes a pair of dipole antennas, a first partial antenna 21 and a second partial antenna 22, so that radio waves can be transmitted and received in the UHF band such as 920 MHz. However, the antenna 20 is not limited to a dipole antenna, and may be, for example, a monopole antenna or a loop antenna or the like depending on the communication specifications.

The first partial antenna 21 on the left side has a connection end 21a forming a part of a small substantially rectangular shape for making an electrical connection with the IC chip 6 on the side close to the mounting position of the IC chip 6. At the end of the first partial antenna 21 away from the IC chip 6, there is an open end 21c that forms a part of a substantially rectangular shape larger than the connection end 21a. Further, the connection end 21a and the open end 21c are connected by a straight line portion 21b. Similarly, the second partial antenna 22 on the right side has a connection end 22a for making an electrical connection with the IC chip 6 on the side close to the mounting position of the IC chip 6, and the second partial antenna 22 has a connection end 22a. It has an open end 22c having a shape larger than that of the connection end 22a at the end distant from the IC chip 6 along the line.

Further, the connection end 22a and the open end 22c are connected by a straight line portion 22b. As will be described in another embodiment described later, the antenna 20 may be a non-separable antenna in which the first partial antenna 21 and the second partial antenna 22 are connected. In this case, it is preferable to arrange the first portion 2 and the second portion 3 so that the straight line along the first branch portion 32 and the second branch portion 33 of the wiring portion 30 and the straight line along the antenna 20 are substantially parallel to each other. ..

The antenna 20 can be formed, for example, by printing a conductive ink or a conductive paste on at least one surface of the first base material 4. The conductive ink or conductive paste can be obtained, for example, by dispersing silver-based conductive particles in a binder resin or a solvent. The conductive particles are preferably silver-based, but the present invention is not limited to this, and metal powders such as nickel, gold, copper and platinum, conductive carbon or a composite thereof, alloys and the like may be used. Further, as the printing of the conductive ink or the conductive paste, screen printing using a mesh-based plate, flexographic printing, gravure printing, offset printing and the like can be used, and inkjet printing is also possible depending on the viscosity.

As a method other than this, the antenna 20 can be a method of attaching a punched metal leaf to the first base material 4 via an adhesive, or a method of applying an adhesive to a thin metal foil and then hot stamping a predetermined shape. It is also possible to take a method of heat-transferring to the first base material 4 by pressing the metal. However, since the first base material 4 is printed at high speed by a gravure printing machine or the like and wound up, it is more preferable to form the antenna 20 by a printing method capable of forming the antenna at high speed and at low cost.

(Iii) Second base material The second base material 31 is a member that supports a wiring portion 30 laminated on one surface thereof and an IC chip 6 mounted on the wiring portion 30. Therefore, it is preferable that the second base material 31 is capable of suppressing the wiring portion 30 and the IC chip 6 from being damaged by deformation due to an external force or the like, and the disconnection between the wiring portion 30 and the IC chip 6. As the second base material 31, basically, the members exemplified for the first base material 4 can be used, but in the package of the present disclosure, a predetermined position is provided between the first base material 4 and the second base material 31. It is characterized by having a relationship of.

One of the above-mentioned features is that the first base material 4 and the second base material 31 of the package 1 contain the same material. For example, in this embodiment, PET is used for both the first base material 4 and the second base material 31. Therefore, when the PET used is not particularly stretched, the expansion / contraction tendency of the first base material 4 and the second base material 31 due to environmental changes such as temperature and humidity is approximately similar. As a result, it is possible to suppress fluctuations in communication characteristics due to deformation of the wiring portion 30 or the like due to differences in the degree of expansion and contraction of the second base material 31 and the degree of expansion and contraction of the first base material 4. In addition, it is possible to suppress fluctuations in communication characteristics and poor appearance due to dropping or misalignment of the second portion 3 from the first portion 2.

In particular, when the first base material 4 and the second base material 31 contain resins having heat shrinkage as the same material as each other, their shrinkage tendencies due to an increase in environmental temperature are similar. Therefore, the strain of the second base material 31 due to the bimetal effect due to the relative positional relationship of the second base material 31 with respect to the first base material 4 and the difference in the amount of heat shrinkage between the two base materials is suppressed. Therefore, it is possible to suppress the occurrence of problems such as the second base material 31 being extremely bent or pulled in the opposite direction and the wiring portion 30 being disconnected.

In general, the paper material is a paper machine in which fibers are lined up along the direction in which the paper flows. The orientation direction of these fibers may be referred to as paper grain. The paper material is easily torn along the grain of the paper, and when the paper material absorbs moisture in the air, it has the property of being more likely to stretch along the direction perpendicular to the direction along the grain of the paper than the direction along the grain of the paper. Therefore, when both the first base material 4 and the second base material 31 are used as paper materials, both base materials are arranged so that the orientation direction of the fibers of both base materials when laminated, that is, the grain of the paper is aligned with each other. Is preferable. In this case, the elasticity of both base materials after laminating along a certain direction is close to each other, and the relative deformation of the first base material 4 and the second base material 31 can be suppressed.

It should be noted that the fact that the first base material 4 and the second base material 31 contain the same material does not necessarily mean that the components of both are completely the same material. For example, when the first base material 4 and the second base material 31 both have a laminated structure with different material layers, the laminated structures of the first base material 4 and the second base material 31 are each composed of the same material. It is sufficient to have at least one layer. Further, when the first base material 4 and the second base material 31 both have an alloy structure composed of a blend of different materials, the components contained in the first base material 4 and the second base material 31 each contain each other. It suffices if it contains the same component.

Furthermore, the ratio (weight percent) of the components of the layers of the same material composed of each other or the same components contained in each other to the total of the original first base material 4 and the second base material 31 is 50% or more. Is preferable. At this time, both the first base material 4 and the second base material 31 are composed of the same material in which more than half of the constituent components are common. Therefore, it can be expected that the expansion / contraction tendency of both base materials due to the environmental conditions can be made closer. In particular, when both the first base material 4 and the second base material 31 have a laminated structure, the above-mentioned ratios of the same material components in each layer portion closest to the surface where both base materials abut are subject to the above-mentioned conditions. Is preferable. This is because the expansion and contraction tendency of both base materials in the vicinity of the contact surfaces of the first base material 4 and the second base material 31 most affects the degree of deformation of the second base material 31.

Another feature is that the heat shrinkage characteristics of both the first base material 4 and the second base material 31 are within a certain range regardless of whether or not they contain the same material. Be done. Specifically, in the first base material 4 and the second base material 31, the article in which the package is in contact with or close to the outer peripheral surface in at least a certain direction is immersed in boiling water at 100 ° C. for 10 seconds. The difference in shrinkage rate afterwards is 5% or less. In the present embodiment, the above conditions are satisfied in the shrinkage rate along the X direction in FIG. 2 (a). However, it is more preferable that the above conditions are satisfied not only in the X direction but also in the Y direction.

Here, it will be described that the shrinkage rate of the first base material 4 is α% and the shrinkage rate of the second base material 31 is β%. In a predetermined section in which the first base material 4 and the second base material 31 are separated from each other, and the respective base materials are marked in advance in a certain direction in which they are in the same direction when they are laminated. Measure the distance. Let d ₁₀ be the distance of the predetermined section of the first base material 4 in the fixed direction, and d ₂₀ be the distance of the predetermined section of the second base material 31 in the fixed direction. After heating the separated first base material 4 and the second base material 31 under predetermined conditions, the distances of the predetermined sections marked in advance are measured again. Let d ₁₁ be the distance of the predetermined section in the fixed direction of the first base material 4 after heating, and d ₂₁ be the distance of the predetermined section of the second base material 31 in the fixed direction. At this time, the shrinkage rate α of the first base material 4 in a certain direction is α = (d ₁₀ −d ₁₁ ) × 100 / d ₁₀ , and the shrinkage rate β of the second base material 31 is β = (d). ₂₀ -d ₂₁ ) × 100 / d ₂₀ .

However, when the first base material 4 is wound around a container, the shrinkage rate means the shrinkage rate in that state. That is, if the shrinkage is stopped by being wound around the container before reaching the expected shrinkage state when the first base material 4 is heated alone, and the shrinkage is stable in that state, the shrinkage rate in the stopped state is reached. It shall mean. However, this does not apply if the condition is that the product cannot be wrapped around a container or the like.

By satisfying the above in the X direction, it can be expected that the deformation of the second portion 3 in the longitudinal direction, which is most affected by the contraction, is suppressed. As a result, it is possible to suppress fluctuations in communication characteristics and poor appearance due to deformation of the wiring portion 30 and dropping of the second portion 3 from the first portion 2. Further, by satisfying the above in both the X direction and the Y direction, the deformation of the second portion 3 in the Y direction can be suppressed as much as possible, and a more reliable package 1 can be provided.

As yet another feature, in the present embodiment, both the first base material 4 and the second base material 31 are vertically uniaxially stretched PETs, and the stretching direction of the second base material 31 is that of the first base material 4. Along the stretching direction. Specifically, the stretching direction of the first base material 4 in FIG. 2A is the X direction, and the stretching direction of the second base material 31 is also the X direction. However, the stretching directions of the two do not have to be exactly the same, and the stretching direction of one may be along the stretching direction of the other.

Here, when one stretching direction is along the other stretching direction, for example, the inclination in each direction is preferably 45 ° or less, and more preferably 22.5 ° or less. If the inclination in each direction is within 45 °, for example, the component of the amount of deformation of the second base material 31 in the direction orthogonal to the deformation direction of the first base material 4 is the component of the deformation amount of the first base material 4 with respect to the deformation direction. The relative deformation of the second base material 31 with respect to the first base material 4 can be suppressed without exceeding the component of the deformation amount of the second base material 31. If the inclination of each other is within 22.5 °, this suppressing effect can be further increased.

Further, for example, when the first base material 4 is a biaxially stretched film and the second base material 31 is a uniaxially stretched fill, and when the first base material 4 is a uniaxially stretched film, the second base material When 31 is a biaxially stretched film, it can be said that the stretching direction of the second base material 31 is along the stretching direction of the first base material 4. The same applies when both the first base material 4 and the second base material 31 are biaxially stretched films. On the other hand, even when both the first base material 4 and the second base material 31 are PETs of lateral uniaxial stretching, the stretching direction of the second base material 31 should be along the stretching direction of the first base material 4. Needless to say.

The thickness of the second base material 31 can be, for example, 10 μm or more and 500 μm or less, preferably 20 μm or more and 200 μm or less. This is because an appropriate rigidity, flexibility and heat resistance can be ensured within this range, and adhesion to the first base material 4 can be obtained.

(Iv) Wiring unit

The wiring portion 30 is a conductive portion arranged on at least one of the front and back surfaces of the second base material 31, and can transmit and receive radio waves by electrically coupling to the antenna 20. In FIG. 2A, the wiring portion 30 is connected to a first branch portion 32 extending linearly to the left side, a second branch portion 33 extending linearly to the right side, and a loop forming a closed circuit. It is composed of a part 34 and. The connection end 32a, which is the end of the first branch portion 32 on the + X direction side, and the connection end 33a, which is the end portion of the second branch portion 33 on the −X direction side, form a minute gap 35 with each other. The two portions 3 overlap with the IC chip 6 when viewed in a plan view from the + Z direction side. That is, one end of each of the first branch portion 32 and the second branch portion 33 is separated from each other and electrically connected to the IC chip 6.

Further, an open end 32c is provided at the end of the first branch portion 32 on the −X direction side, and an open end 33c is provided at the end of the second branch portion 33 on the + X direction side. These overlap with the end portion of the antenna 20 described above when the package 1 is viewed in a plan view and seen through from the + Z direction side. That is, the open end 32c of the first branch portion 32 overlaps with the connection end 21a of the first partial antenna 21, and the open end 33c of the second branch portion 33 overlaps with the connection end 22a of the second partial antenna 22. At this time, the open end 32c and the connection end 21a may actually be in contact with each other, or may be separated from each other by another layer such as the second base material 31. When they are separated from each other, they may be capacitively coupled to such an extent that the wiring unit 30 and the antenna 20 can cooperate with each other to transmit and receive electromagnetic waves having an AC waveform. Including such a case, it can be said that the wiring portion 30 and the antenna 20 are electrically connected.

On the other hand, the connection end 32a and the open end 32c of the first branch portion 32 are connected by a straight line portion 32b which is a straight road, and the connection end 33a and the open end 33c of the second branch portion 33 are a straight line portion 33b which is a straight road. It is tied with. Further, the closed circuit surrounded by the IC chip 6, a part of the straight line portion 32b, and the loop portion 34 functions as a matching circuit for coupling impedance matching between the IC chip 6 and the antenna structure including the antenna 20 and the wiring portion 30. do. The loop portion 34 does not necessarily have to be formed by branching from the wiring portion 30, and may be formed, for example, on the antenna 20 side. That is, as an example, a loop portion may be formed by branching from the straight line portion 21b of the first partial antenna 21 and the straight line portion 22b of the second partial antenna 22, respectively, and conducting both.

The wiring portion 30 can be formed by a known etching process. That is, first, a metal layer is formed on one surface of the second base material 31 by a thin-film deposition process under a vacuum environment. The metal used is, for example, copper, but conductive metals such as aluminum, nickel, chromium, titanium, gold, silver, tin, and indium can be used. The thickness of the metal layer by thin film deposition at this time can be 0.1 μm or more and 10.0 μm or less. When the thickness exceeds 10.0 μm, for example, a method of sticking a thin metal leaf on the second base material 31 via an adhesive can be selected.

Next, a photoresist dry film is laminated on the surface of the metal layer, and an original plate prepared so that only a predetermined pattern of the wiring portion 30 transmits light is layered on the layer, and light having a predetermined wavelength such as UV is emitted. Irradiate. As a result, the photoresist of the predetermined pattern portion of the wiring portion 30 that was not shielded from light by the original plate is exposed and cured, and the other portions are not exposed and cured. After that, the unphotosensitive resist is removed and the alkaline stripping solution is sprayed to remove the metal foil of the unnecessary portion by etching leaving the predetermined pattern portion of the wiring portion 30, and the desired wiring portion 30 is formed on the second base material 31. Obtain the formed laminate.

(V) IC Chip and Conductive Adhesive The IC chip 6 is an integrated circuit in which various circuit elements are formed on a semiconductor substrate such as silicon, and has a relatively thin substantially rectangular parallelepiped structure. The IC chip 6 is provided with, for example, various circuits formed on one surface thereof, and a first connection pad 62 and a second connection pad 63 which are electrical connection terminals with an antenna. The IC chip 6 may have three or more connection pads.

The IC chip 6 is various in that the first connection pad 62 and the second connection pad 63 are electrically connected to the connection end 32a of the first branch portion 32 of the wiring portion 30 and the connection end 33a of the second branch portion 33. To fulfill the function of. For example, the operating power of the IC chip 6 is taken out from the communication circuit composed of the antenna 20, the wiring unit 30, and the IC chip 6 that has received the radio wave of a predetermined frequency from the outside, and the CPU is driven. In addition, predetermined information is decoded from the received radio wave, various operations are performed, and information is read or written from the storage unit. Further, it has a function of converting transmission information into radio waves having a predetermined frequency and transmitting the transmission information via an antenna 20 or the like, if necessary.

The IC chip 6 can have various sizes depending on its required function, circuit line width, etc., but usually, the length of one side of a substantially rectangular portion of the outer shape when viewed in a plan view is 0.3 mm or more. , 1.0 mm or less. Further, as shown in FIGS. 2B and 3, an IC chip 6 is mounted so as to straddle the right end of the first branch portion 32 and the left end of the second branch portion 33, and a conductive adhesive is provided in the gap between them. 61 is filled. The conductive adhesive 61 may be, for example, an anisotropic conductive film (Anisotropic Conductive Film or ACF) or an anisotropic conductive paste (ACP). The ACF or ACP has a structure in which conductive particles 61b in which spherical resin particles are plated with nickel, gold, or the like are dispersed in a binder 61a made of an epoxy resin or the like.

As shown in FIG. 3, this conductive adhesive 61 is attached or applied to the surface of the laminated body of the second base material 31 and the wiring portion 30 on the wiring portion 30 side, and the IC chip 6 is directed downward from above. And press it by heat pressure. As a result, the conductive particles 61b inside the ACF or ACP existing in the gap between the first connection pad 62 and the second connection pad 63 provided below the IC chip 6 and the first branch portion 32 and the second branch portion 33. Are lined up in series in the thickness direction of the second base material 31 and joined to each other. As a result, the first connection pad 62 and the first branch portion 32 are electrically connected via the conductive particles 61b. Similarly, the second connection pad 63 and the second branch portion 33 are electrically connected. On the other hand, since the binder 61a is cured by the heat pressure, the IC chip 6 is mechanically in close contact with the wiring portion 30. It is preferable that gold bumps are formed in advance on the first connection pad 62 and the second connection pad 63 of the IC chip 6. As a result, the reliability of the electrical connection between the IC chip 6 and the wiring portion 30 can be improved.

The conductive adhesive 61 is not limited to ACF and ACP, and for example, a so-called conductive paste in which silver particles are dispersed as a filler in an epoxy resin may be used. However, in this case, in order to prevent a short circuit between the first connection pad 62 and the second connection pad 63, the areas to which the conductive paste is applied to the first connection pad 62 and the second connection pad 63 are applied so as to be separated from each other. Note that it should be attached. When a gold bump is formed on the connection pad of the IC chip 6, the IC chip 6 may be directly heated and connected to the wiring portion 30 without using the conductive adhesive 61 as described above. ..

(Vi) Adhesive layer As shown in FIGS. 2 (b) and 3, the wiring portion 30 is arranged on at least one of the front and back surfaces of the second base material 31. When the wiring portion 30 is formed by a method other than the above-mentioned etching method, an adhesive layer is appropriately used. For example, when a wiring portion 30 having a predetermined pattern is formed on a second base material 31 by hot stamping from a film with an adhesive on which a metal foil is formed, or a metal foil punched into a predetermined pattern shape in advance. May be attached on the second base material 31.

As the adhesive layer, various insulating thermoplastic resins or thermosetting resins can be used. When a thermoplastic resin base material or the like is used as the second base material 31, the metal foil layer may be transferred to the surface of the second base material 31 by, for example, thermal transfer, without providing the adhesive layer 3 again. The second base material 31 itself can be fused with the metal foil layer to obtain an adhesive effect.

(Vii) Adhesive layer Further, as shown in FIGS. 2B and 3, an adhesive layer 38 is provided on the surface of the second base material 31 facing the first base material 4. This is to fix the second portion 3 to the first portion 2, as will be described later. As the adhesive layer 38, various materials used for general labels can be used, for example, natural rubber adhesives, synthetic rubber adhesives, silicone resin adhesives, urethane resin adhesives, acrylic resin adhesives and the like. Can be used.

Further, the pressure-sensitive adhesive layer 38 may be blended with a tackifier, a filler, a softener, an antiaging agent, a colorant such as a dye or a pigment, or the like, if necessary. Examples of the tackifier include rosin-based resin, terpene resin, phenol-based resin, xylene-based resin and the like. Examples of the filler include silica, talc, calcium carbonate, clay and the like. Examples of the softener include a plasticizer and the like. The thickness of the adhesive layer 38 is not particularly limited, but may be, for example, 0.01 mm or more and 5.0 mm or less.

When both the second base material 31 and the first base material 4 are formed of a thermoplastic resin base material, it is not necessary to provide the adhesive layer 38 again. In this case, the second base material 31 of the second part 3 is brought into contact with the first base material 4 of the first part 2 in a state where the first part 2 and the second part 3 are heated. This is because the material 31 and the first base material 4 are self-fused and integrated. Further, when the adhesive layer 38 is provided on the second portion and is not adhered to the first base material 4 and is temporarily stored as the second portion 3, the surface of the adhesive layer 38 of the second portion 3 is shown. It is possible to provide a release paper that does not. The release paper is used to maintain the adhesive strength of the adhesive layer 38 when the second portion 3 is partially stored. The material of the release paper is not particularly limited as long as it can adhere to the adhesive layer 38 without impairing the adhesive strength of the adhesive layer 38, and various resin films, coated papers, or composite materials thereof can be released from a mold such as silicone. Those coated with an agent can be used.

(B) Article with Package Next, the container 10 with a package provided on the outer surface of the container 5 with the package 1 having the above-described configuration will be described with reference to FIGS. 1 (a) and 1 (b). do. The container 5 is an example of an article, and the container 10 with a package is an example of an article with a package. The container 5 is composed of a bottle 51 having a substantially cylindrical shape at the center and a lower portion, a tapered upper portion, and an upper spout, and a cap 52 for closing the spout. The container 5 has an internal 53 which is a closed space in which a liquid can be stored when the cap 52 is closed.

The package 1 is wound and fixed so as to cover at least a part of the container 5 along the substantially cylindrical outer circumference of the container 5. As a method of fixing the package 1 to the container 5, an adhesive is applied to a part of the contact portion of the package 1 with the container 5, and both ends of the wound package 1 are adhered. A method of joining through an agent to finish in a ring shape can be considered. When the first base material 4 of the package 1 is a member that shrinks heat, the package 1 is wound around the container 5, and both ends thereof are joined via an adhesive, and then the package is used. A method of heating the whole of 1 to a predetermined temperature can be considered. In this case, the package 1 is placed in contact with or close to the container 5. After that, by heating the package 1, the gap between the package 1 and the container 5 is filled by the heat shrinkage of the first base material 4, so that the package 1 is fitted and fixed to the shape of the container 5. Can be done.

(C) Method for manufacturing package and article with package Next, a method for manufacturing the package and article with package according to the present embodiment will be described. In FIGS. 4 and 5, the second portion 3 is attached to the first portion 2 constituting the package 1 of the first embodiment to form the package 1, and this is wound around the container 5 to manufacture the container 10 with the package. It is a figure explaining a series of manufacturing methods.

First, as shown in FIG. 4A, a long first base material 4 wound in a roll shape is prepared. The antenna 20 is formed by using conductive ink obtained by dispersing silver-based conductive particles in a binder resin or a solvent by gravure printing or the like. After that, it is passed through a drying oven or the like to volatilize the solvent of the conductive ink and dry it. Next, as shown in FIG. 4 (b), the long first base material 4 is cut to a certain length, and then the antenna 20 formed on the first base material 4 which is the first portion 2 is formed. The second portion 3 is mounted and fixed so as to straddle the first partial antenna 21 and the second partial antenna 22.

As a result, the cut first base material 4 is formed with a package 1 composed of the first portion 2 and the third portion 3 bonded to each other. The method of manufacturing the second portion, that is, the method of forming the wiring portion 30 on the second base material 31 and further mounting and fixing the IC chip 6 on the wiring portion 30 is as described above. The long first base material 4 may be cut after the second portion 3 is mounted on the antenna 20 of the first base material 4.

After that, as shown in FIG. 4C, the package 1 is wound around the outer periphery of the bottle 51 of the container 5 near the center in the vertical direction, and both ends thereof are joined by an adhesive such as hot melt. As a result, the package 1 is wrapped around the outer periphery of the container 5 in the vertical direction near the center in a ring shape. The inner surface of the package 1 and the outer surface of the bottle 51 may be bonded with an adhesive. As a result, even if the package 1 is not shrink-processed, it is possible to prevent the package 1 from being displaced in the vertical direction with respect to the container 5. In this way, the container 10 with a package is obtained.

By the way, in the step of attaching the second portion 3 to the first portion 2, it is necessary to stop the transport operation of the container 5 for a predetermined time on the production line. This is because when the step of attaching the second portion 3 to the first portion 2 and the step of winding and fixing the package 1 around the container 5 are performed in parallel at the same time, it is necessary to have the same processing capacity in both steps. In this case, in the step of winding the package 1 around the container 5 and fixing the container 5, the container 5 to be wound by the package 1 may be completely stationary and the first portion 2 may be wound along the outer periphery thereof.

Alternatively, the container 5 may be rotated along its own substantially cylindrical central axis, during which the fixedly arranged package 1 may be wound around the rotating container 5 via an adhesive. In any case, while the package 1 is wound around the container 5, it is necessary to stop the container 5 in the transport direction, and during that time, even if the front and rear containers 5 are stopped in the same manner, the container 5 is particularly stopped for the above-mentioned reason. It does not become a process rate-determining factor.

In other words, for the container 5 on the downstream side, the time zone in which the transport operation when carrying out the step of attaching the package 1 around the container 5 is stopped is set as the first time zone, and the container on the upstream side thereof. With respect to 5, the time zone in which the transport operation when carrying out the step of laminating the second portion 3 on the outer surface of the first portion 2 is stopped is defined as the second time zone. At this time, at least a part of the first time zone and the second time zone overlap each other. As a result, the time loss of a series of processes can be reduced and the work efficiency can be improved.

If the first base material 4 and the second base material 31 of the package 1 have heat shrinkage and it is desired to fit the package 1 to the shape of the container 5 as much as possible, the above-mentioned container 10 with a package is shown in FIG. As shown in 5, it is passed through a predetermined drying furnace 304. As a result, the shrink treatment for heat-shrinking both base materials is further performed, and the container 10 with a good-looking package can be obtained. Here, since the first base material 4 and the second base material 31 have the above-mentioned heat shrinkage relationship, the relative deformation of both base materials is suppressed as much as possible, and the appearance and communication characteristics are good. A container 10 with a package can be obtained.

(D) Summary of Package and Article with Package of First Embodiment As described above, the package 1 of the first embodiment covers at least a part of the article exemplified in the container 5. The package 1 includes a first base material 4, an antenna 20 formed on at least one surface side thereof, a second base material 31, and a wiring portion 30 formed on at least one surface side thereof. , Equipped with. Further, an IC chip 6 that is electrically connected to the wiring unit 30 is further provided. The second base material 31 is laminated on the first base material 4, and the antenna 20, the wiring portion 30, and the IC chip 6 form a communication circuit capable of non-contact communication with an external device.

In addition to the packaging body 1 and the container with a packaging body 10 of the present embodiment having the above-mentioned configuration, the first base material 4 and the second base material 31 of the packaging body 1 can contain the same material as each other. Examples of the same material include PET and paper materials. At this time, the expansion / contraction tendency of the first base material 4 and the second base material 31 due to environmental changes such as temperature and humidity is approximately approximate. As a result, changes in communication characteristics due to deformation of the wiring portion 30 of the second base material 31 due to the difference between the degree of expansion and contraction of the second base material 31 and the degree of expansion and contraction of the first base material 4, and the second portion It is possible to suppress fluctuations in communication characteristics and poor appearance due to dropping from the first portion 2 of 3 and misalignment.

Further, regardless of whether the first base material 4 and the second base material 31 contain the same material, the heat shrinkage characteristics of both may be in a certain range. Specifically, the difference in shrinkage between the first base material 4 and the second base material 31 after immersing the article in which the package is in contact with or close to the outer peripheral surface in boiling water at 100 ° C. for 10 seconds. It is 5% or less. When both base materials satisfy this condition, it can be expected that the deformation of the second portion 3 in the longitudinal direction, which is most affected by the shrinkage, is suppressed, and the deformation of the wiring portion 30 and the first portion of the second portion 3 are expected. It is possible to suppress fluctuations in communication characteristics and poor appearance due to dropping from 2.

Further, when the stretching direction of the first base material 4 is the first stretching direction and the stretching direction of the second base material 31 is the second stretching direction, the first base material is oriented so that the second stretching direction is along the first stretching direction. 4 and the second base material 31 may be laminated. Here, the mutual inclination between the first stretching direction and the second stretching direction is preferably 45 ° or less, and more preferably 22.5 ° or less. As a result, the component of the amount of deformation of the second base material 31 in the direction orthogonal to the deformation direction of the first base material 4 exceeds the component of the amount of deformation of the second base material 31 in the direction of deformation of the first base material 4. This is because the relative deformation of the second base material 31 with respect to the first base material 4 is suppressed.

2. 2. Second Embodiment Next, the second embodiment of the package of the present disclosure will be described focusing on the differences from the first embodiment. FIG. 6 is a cross-sectional view similar to FIG. 2B showing the configuration of the package 1a according to the second embodiment. The structure of the first portion 2a of the package 1a is different from that of the first portion 2 of the first embodiment. That is, the first portion 2a has a structure in which the third base material 4b is further laminated so as to face the first base material 4a with the antenna 20 formed on one surface of the first base material 4a interposed therebetween. .. The second portion 3 is arranged on the surface of the third base material 4b opposite to the first base material 4a. The third base material 4b may be made of the same material as the first base material 4a, or may be made of a material different from the first base material 4a exemplified as the first base material 4. However, from the viewpoint of suppressing the uneven occurrence of strain or deformation due to the difference in the expansion / contraction tendency of the first base material 4a and the third base material 4b due to environmental changes, both base materials are used in order to make the expansion / contraction tendencies uniform. Is preferably configured to contain the same material. Further, the thicknesses of both base materials can be arbitrarily determined.

By forming the first portion 2a in such a configuration, the antenna 20 formed by printing or the like can be sandwiched between the first base material 4a and the third base material 4b. This makes it possible to suppress damage to the antenna 20 during processing such as handling of the first portion 2a and attachment of the first portion 2a to the container 5.

By adding the third base material 4b, the third base material 4b exists between the antenna 20 and the wiring portion 30 of the second portion 3. Since these are generally insulators, by appropriately selecting the dielectric constant of each layer, the overlapping portion of the antenna 20 and the wiring portion 30 is capacitively coupled when the package 1a is viewed in a plan view from the + Z direction side. .. Therefore, when the wiring portion 30 and the antenna 20 cooperate with each other, the package 1a can satisfactorily transmit and receive electromagnetic waves having an AC waveform.

The manufacturing method of the first part 2a of the present embodiment is different from that of the first part 2 of the first embodiment in the following points. That is, after the antenna 20 is formed on at least one surface of the first base material 4a, the third base material 4b is arranged so as to face the first base material 4a so that the antenna 20 is sandwiched between the antenna 20 and the third base material 4a. A step of pouring the molten resin into the gap between the base material 4b and the first base material 4a and adhering the two to each other is further added. However, when the first base material 4a and the third base material 4b have self-bonding property by heating, they can be bonded to each other only by heating both base materials without using an adhesive.

3. 3. Third Embodiment Next, the third embodiment of the packaged article of the present disclosure will be described focusing on the differences from the first embodiment. FIG. 7A is a schematic view showing a container 11 with a package body in which the package body 1 is provided in the container 5a. FIG. 7 (b) is a view showing a cross section of the container with a package 11 of FIG. 7 (a) cut by a plane passing through the line EE in the vertical direction. The container 5a is an example of an article, and the container 11 with a package is an example of an article with a package.

The container 5a is different from the container 5 of the first embodiment in that the substantially cylindrical outer surface of the container 5a is provided with a continuous uneven portion 54 along the vertical direction. When the container 5a is cut in a plane perpendicular to the vertical direction, the cross-sectional shape of the outer peripheral portion sequentially changes from a substantially circular shape having a small diameter to a substantially circular shape having a large diameter as it sequentially advances in one direction along the vertical axis. After that, the cross-sectional shape sequentially changes from a substantially circular shape having a large diameter to a substantially circular shape having a small diameter. Further, the cross-sectional shape repeats this change. Since the container 5a has such a shape, the convex portion of the package 1 particularly having the second portion 3 is housed in any of the concave portions 58 of the uneven portion 54, and the package 1 in the container with the package 11 has a convex shape. This is because the appearance is good.

However, the shape of the uneven portion 54 of the container 5a is not limited to such a shape, and the unevenness may be formed along the outer periphery of the plane perpendicular to the vertical direction of the container 5a, which is irregular. It may be an uneven pattern.

On the other hand, the package 1 of the container 11 with a package is the same as that of the first embodiment. Therefore, the configuration and manufacturing method of the container 11 with a package are the same as those of the package 1 and the container 10 with a package, except that the shape of the container 5a is different. Here, as shown in FIG. 7B, the bottle 51a of the container 5a has a predetermined thickness, and the bottle 51a includes an inner surface 55 facing the inner 53 and an outer surface 56 visible from the outside. There is. The liquid contained in the inner 53 of the container 5a comes into contact with the inner surface 55 of the bottle 51a.

From this, when the shortest distance between the surface of the package 1 wound along the outer surface 56 of the bottle 51a and the inner surface 55 in contact with the outer surface 56 is DS, the value of DS is 0.5 mm or more. It is preferably present, and more preferably 2.0 mm or more. The DS values are usually the outermost portion of the outer surface 56 and the outermost or outer surface of the inner surface 55 along the normal direction of the main surface of the first substrate 4 on which the antenna 20 of the package 1 is formed. It is the distance from the part close to 56. Generally, as the antenna constituting the communication circuit for non-contact communication gets closer to moisture, the progress of radio waves is hindered and the communicable distance tends to become shorter. Therefore, when the main component of the content to be put in the container 5a is water, by keeping the antenna 20 of the package 1b as far away from the content as possible, it is possible to suppress communication obstruction of the package 1b with an external device.

On the other hand, when the first base material 4 of the package 1 is a base material that shrinks heat like a shrink film, the first base material 4 is fixed in a shape along the outer surface 56 of the bottle 51a. Therefore, the above-mentioned DS needs to be replaced with DT, which is the shortest distance between the innermost portion of the outer surface 56 of the bottle 51a, that is, the portion closest to the inner surface 55, and the outermost portion of the inner surface 55. In this case, the DT value is preferably 0.5 mm or more, and more preferably 4.0 mm or more.

4. Fourth Embodiment Next, the fourth embodiment of the package of the present disclosure will be described focusing on the differences from the first embodiment. FIG. 8 is a plan view corresponding to FIG. 2A showing the configuration of the package 1c according to the fourth embodiment. The package 1c includes a second part 3 having the same configuration as that of the first embodiment. Further, the first portion 2b includes an antenna 20a. The antenna 20a includes a pair of a first partial antenna 23 and a second partial antenna 24.

The first partial antenna 23 on the left side has a connection end 23a for making an electrical connection with the IC chip 6 on the side close to the mounting position of the IC chip 6, and the IC is along the first partial antenna 23. It has an open end 23c at the end away from the chip 6. Further, the connection end 23a and the open end 23c are connected by a zigzag-shaped meander portion 23d, unlike the straight line portion 21b as in the first embodiment. Similarly, the second partial antenna 24 on the right side has a connection end 24a for making an electrical connection with the IC chip 6 on the side close to the mounting position of the IC chip 6, and the second partial antenna 22 has a connection end 24a. It has an open end 24c at the end away from the IC chip 6 along. Further, the connection end 24a and the open end 24c are connected by a meander portion 24d symmetrically with the first partial antenna 23.

Since the antenna 20a is a dipole antenna, the electric length from the open end 23c of the first partial antenna 23 to the open end 24c of the second partial antenna 24 needs to be 1/2 wavelength of the communication radio wave. For example, when communicating at 920 MHz in the UHF band, the electric length needs to be about 160 mm. Therefore, by making the antenna 20a a meander shape as in the present embodiment, the left-right width of the antenna can be further reduced as compared with the case where the antenna shape is a linear shape that spreads laterally. As a result, the formation region of the antenna 20a on the first base material 4 can be made small, the material cost can be reduced, and the design and security can be improved by making the antenna 20a difficult to see.

5. Fifth Embodiment Next, the fifth embodiment of the package of the present disclosure will be described focusing on the differences from the first embodiment. FIG. 9A is a plan view corresponding to FIG. 2A showing the configuration of the package 1d according to the fifth embodiment. The package 1d includes a first portion 2c and a second portion 3b having a configuration different from that of the first embodiment.

The first portion 2c includes an antenna 25, but unlike the antenna 20 of the first embodiment, the first portion 2c is not separated into two partial antennas, and constitutes one antenna in which the left and right sides are connected. However, the antenna 25 may be separated to the left and right like the antenna 20. It has an open end 25c that forms a substantially rectangular portion at the end away from the IC chip 6 on the left side of the antenna 25. In contrast to this, it has an open end 25d that forms a substantially rectangular portion at the end away from the IC chip 6 on the right side of the antenna 25. Further, there is no connecting end between the open ends 25c and 25d, and they are connected to each other by a straight line portion 25b.

On the other hand, the second portion 3b has a straight portion 39 that partially overlaps with the straight portion 25b of the antenna 25 when viewed in a plan view from the + Z direction side, and open ends 39c and 39d formed at both ends thereof. A wiring portion 30a is provided. Further, the wiring portion 30a branches from the straight portion 39 at two points, and forms a path to the connection ends 34c and 34d that are electrically connected to the IC chip 6, the loop portion first branch portion 34a and the loop portion second branch. A portion 34b is further provided. The loop portion first branch portion 34a and the loop portion second branch portion 34b form the loop portion 34. The connection end 34c of the loop portion first branch portion 34a and the connection end 34d of the loop portion second branch portion 34b overlap with the IC chip 6 when the second portion 3b is viewed in a plan view from the + Z direction side. .. That is, one end of each of the loop portion first branch portion 34a and the loop portion second branch portion 34b is electrically connected to the IC chip 6.

The straight line portion 25b of the antenna 25 and the straight line portion 39 of the wiring portion 30a may actually be in contact with each other, or may be separated from each other by another layer. When the two are separated from each other, it is sufficient that the wiring unit 30a and the antenna 25 are capacitively coupled to the extent that the electromagnetic wave of the AC waveform can be transmitted and received in cooperation with each other. On the other hand, the closed circuit surrounded by the IC chip 6, the loop portion 1st branch portion 34a, the loop portion 2nd branch portion 34b, and the straight line portion 39 has the impedance of the IC chip 6 and the antenna structure including the antenna 25 and the wiring portion 30a. It functions as a matching circuit for coupling matching.

The method for manufacturing the container with the first portion 2c, the second portion 3b, and the package 1d of the present embodiment is the same as the corresponding manufacturing method of the first embodiment. Since the package 1d of the present embodiment has such a configuration, the area of the overlapping portion when the straight portion 25b of the antenna 25 and the straight portion 39 of the wiring portion 30a are viewed in a plan view and seen through from the + Z direction side is increased. Can be taken. As a result, even if the stacking position of the second portion 3b with respect to the first portion 2c is slightly deviated, the capacitive coupling between the two can be obtained satisfactorily, so that the manufacturing load of the package 1b can be reduced and the yield can be expected to be improved.

6. Sixth Embodiment Next, the sixth embodiment of the package of the present disclosure will be described focusing on the differences from the fifth embodiment. FIG. 9B is a plan view corresponding to FIG. 9A showing the configuration of the package 1e according to the sixth embodiment. The package 1e includes a second portion 3c having a configuration different from that of the fifth embodiment.

In the present embodiment, the wiring portion 30b of the second portion 3c does not have an open end, and a part of the wiring portion 30b overlaps with the antenna 25 of the first portion 2c when viewed in a plan view from the + Z direction side. Not done. The wiring portion 30a of the second portion 3c is a loop portion first branch portion 34a and a loop portion No. 3 that form a path from both ends of the straight line portion 34e to the connection ends 34c and 34d for electrically connecting to the IC chip 6, respectively. It includes two branch portions 34b. The straight line portion 34e, the loop portion first branch portion 34a, and the loop portion second branch portion 34b form the loop portion 34. The connection ends 34c and 34d overlap with the IC chip 6 when the second portion 3c is viewed in a plan view from the + Z direction side. That is, one end of each of the loop portion first branch portion 34a and the loop portion second branch portion 34b is electrically connected to the IC chip 6.

Since the straight line portion 25b of the antenna 25 and the straight line portion 34e of the wiring portion 30a do not overlap when viewed in a plan view and perspective from the + Z direction side, the degree of capacitive coupling is higher than that in the configuration in which both overlap. small. However, since the original capacitive coupling between the two is weak, even if the stacking position of the second portion 3c with respect to the first portion 2c is slightly deviated, a large variation in the capacitive coupling between the two is unlikely to occur. Therefore, since the positional deviation of the laminated position does not affect the communication characteristics of the package 1e so much, stable communication performance of the package 1e can always be ensured regardless of the variation in the manufacturing process.

7. Seventh Embodiment Next, the seventh embodiment of the package of the present disclosure will be described focusing on the differences from the first embodiment. 10 (a) is a plan view corresponding to FIG. 2 (a) for explaining the package 1f, and FIG. 10 (b) is a diagram of FIG. 10 (a) in the longitudinal direction of the package 1 f. It is sectional drawing when the package 1f is cut in the plane parallel to the thickness direction of the package 1f passing through the FF line along the above.

The arrangement of the second portion 3d with respect to the first portion 2 of the package 1f is different from that of the second portion 3 of the first embodiment. In the second portion 3d, the adhesive layer 38, the second base material 31, the wiring portion 30, and the IC chip 6 are arranged in order from the side closer to the first base material 4. That is, the arrangement of the second portion 3d from the second base material 31 to the IC chip 6 is reversed with respect to the second portion 3 of the first embodiment.

When the package 1f has such a configuration, there are two ways to wind the package 1f around the container 5. The first winding method is a method of winding so that the first base material 4 is on the outermost circumference, and the second winding method is a method of winding so that the IC chip 6 is on the outermost circumference. In the first winding method, the IC chip 6 which is easily deteriorated by an external force or an environmental change is protected by the first base material 4, and the durability and reliability of the package 1f are improved. On the other hand, in the second winding method, when there is no recess on the side surface of the container 5 and there is no gap for accommodating the IC chip 6, the first base material 4 can be wound straight around the outer periphery of the container 5 without wrinkling. It is advantageous in terms of points.

When the cross section of the series of packages from the second embodiment to the sixth embodiment is viewed, the adhesive layer 38, the IC chip 6, and the wiring portion are arranged in order from the side closest to the first base material 4 or 4b. 30 and the second base material 31 are arranged. However, all of these are replaced with a configuration in which the adhesive layer 38, the second base material 31, the wiring portion 30, and the IC chip 6 are arranged in order from the side closer to the first base material 4 or 4b as in the present embodiment. It may be an embodiment. In this case, it goes without saying that the above-mentioned effects can be obtained in any of the embodiments.

8. Examples The examples relating to the present disclosure will be described below. However, the content of the present disclosure is not limited to the embodiment. In addition, except for the solvent, each composition of each layer is a mass part in terms of solid content.

(A) Sample preparation of Examples and Comparative Examples (i) Example 1
First, a transparent PET film with a thickness of 30 μm (Hishipet (registered trademark) LX-18S manufactured by Mitsubishi Chemical Corporation) is used as the first base material, and a desired design is applied to the surface facing the container when the film is wound. And the antenna was gravure-printed with multiple rows of repeating multi-imposition. As a result, the first part in which the antenna was formed on the first base material was completed. Further, as the second base material, a transparent PET film having a thickness of 25 μm (Lumilar (registered trademark) manufactured by Toray Industries, Inc.) is used, and copper is vacuum-deposited on a PET film of the same type as the first base material, and the temperature is 90 ° C. After annealing with the above method, a desired wiring portion was produced by a photolithography method. Further, the IC chip having gold bumps formed on the pads in advance was thermocompression-bonded to the wiring portion so that the pad of the IC chip could be electrically connected to the wiring portion. As a result, the second part in which the wiring part and the IC chip were provided on the second base material was completed.

The second portion was cut into a length of 10 mm and a width of 30 mm and adhered to a predetermined position on the antenna which was inside when the roll-shaped first portion was wound. The second portion was adhered to the first portion in such a direction that the wiring portion and the IC chip were sandwiched between the first portions. Then, the first part of the long length was cut to a predetermined length. As a result, a strip-shaped package according to the embodiment including the first portion and the second portion was obtained. The dimensions of the package were 230 mm on the longitudinal side and 160 mm on the lateral side. This was wound around a bottle having a maximum circumference of 228 mm and a minimum circumference of 185 mm and having irregularities on the side surface. One of the samples of the container with a package according to Example 1 is immersed in boiling water at 100 ° C. for 10 seconds, the package is cut and removed from the container, and further, the first base material and the second base material are used. The shrinkage ratio was determined by measuring each dimension. As a result, the shrinkage rate of the first base material was 76% when it was not wrapped around the bottle, but since it follows the outer shape of the bottle when it is wrapped around the bottle, the actual shrinkage rate of the first base material is this. In this example, the shrinkage rate of the first base material was 1.0% in the portion having a maximum circumference of 228 mm and 19% in the portion having a minimum circumference of 185 mm. On the other hand, the shrinkage rate of the second base material was 0.5%. The second base material is adhered to the first base material at a portion having a maximum circumference, and the second base material is not adhered to a portion having a minimum circumference of the first base material.

(Ii) Example 2
A sample of the container with a package according to Example 2 was prepared in the same manner as in Example 1 except that the bottle had a maximum circumference of 216 mm and a minimum circumference of 172 mm and was wound around a bottle having irregularities on the side surface. One of the samples of such a container with a package is immersed in boiling water at 100 ° C. for 10 seconds as in Experimental Example 1, then the package is cut and removed from the container, and further, the first base material and the second base material and the second unit are removed. It was separated into materials, and each dimension was measured to determine the shrinkage rate. As a result, the shrinkage rate of the first base material was 6% in the portion having the maximum peripheral diameter of 216 mm, and 25% in the portion having the minimum peripheral diameter of 172 mm. On the other hand, the shrinkage rate of the second base material was 0.5% as in Example 1.

(Iii) Comparative Example A sample of a container with a package according to Comparative Example was prepared in the same manner as in Example 1 except that the bottle had a maximum circumference of 207 mm and a minimum circumference of 163 mm and was wound around a bottle having irregularities on the side surface. One of the samples of such a container with a package is immersed in boiling water at 100 ° C. for 10 seconds as in Experimental Example 1, then the package is cut and removed from the container, and further, the first base material and the second base material and the second unit are removed. It was separated into materials, and each dimension was measured to determine the shrinkage rate. As a result, the shrinkage rate of the first base material was 10% in the portion having the maximum peripheral diameter of 207 mm, and 29% in the portion having the minimum peripheral diameter of 163 mm. On the other hand, the shrinkage rate of the second base material was 0.5% as in Example 1.

(B) Experimental contents and results Of the samples of the containers with packages of the above Examples and Comparative Examples, those not immersed in boiling water at 100 ° C. were placed in a steam-type heat-shrinker at 85 to 95 ° C. The label was passed through to fit the shape of the container, and a container with a package after heat shrinkage was obtained. For these samples, (1) appearance confirmation and (2) non-contact communication confirmation were performed. The following symbols are entered for each confirmation result.
(1) Appearance confirmation 〇: The appearance was good.
Δ: The appearance was a little bad, but it was at a level that could be shipped as a product.
X: Wrinkles and cracks were remarkably generated, and the appearance was poor.
(2) Non-contact communication confirmation 〇: Good communication was possible.
Δ: Communication sensitivity decreased, but it was at a level that could be shipped as a product.
X: Communication was not possible or communication sensitivity was significantly reduced.

The above test results are shown in Table 1. Examples 1 and 2 in which the difference in shrinkage between the first base material and the second base material having the maximum circumference is 0.5% or 5.5% after being immersed in boiling water at 100 ° C. for 10 seconds. There was no problem with the appearance and non-contact communication performance. On the other hand, the comparative example in which the difference in shrinkage rate after being immersed in boiling water at 100 ° C. for 10 seconds between the maximum circumferences of the first base material and the second base material is 9.5% is at least a problem in appearance. It turned out that there is.

1, 1a, 1b, 1c, 1d, 1e, 1f Package 2, 2a, 2b, 2c 1st part 3, 3a, 3c, 3d 2nd part 4, 4a 1st base material 4b 3rd base material 5, 5a Container 6 IC chip 9 Antenna laminated body 10, 11 Container with package 20, 20a, 25 Antenna 21, 23 First part antenna 21a, 23a Connection end 21b Straight part 21c, 23c Open end 22, 24 Second part antenna 22a, 24a Connection end 22b Straight part 22c, 24c Open end 23d, 24d Meander part 25b Straight part 25c, 25d Open end 30, 30a Wiring part 31 Second base material 32 First branch part 32a Connection end 32b Straight part 32c Open end 33 First 2 Branch 33a Connection end 33b Straight part 33c Open end 34 Loop part 34a Loop part 1st branch part 34b Loop part 2nd branch part 34c, 34d Connection end 34e Straight part 35 Gap 38 Adhesive layer 39 Straight part 39c, 39d Open end 51, 51a Bottle 52 Cap 53 Inside 54 Concavo-convex 55 Inner surface 56 Outer surface 57, 58 Recess 61 Conductive adhesive 61a Binder 61b Conductive particles 62 First connection pad 63 Second connection pad 200 Transfer foil film 200A Transfer foil film residue 201 Support Base material 202 Metal foil layer 302 Hot stamping jig 303 Notch 304 Heater

Claims (12)

A package that covers at least part of an article
The first base material and
An antenna formed on at least one surface side of the first base material and
The second base material and
A wiring portion formed on at least one surface side of the second base material, and
An IC chip that is electrically connected to the wiring unit is provided.
The second base material is laminated on the first base material, and the second base material is laminated on the first base material.
The antenna, the wiring unit, and the IC chip form a communication circuit capable of non-contact communication with an external device.
The package in which the first base material and the second base material contain the same material as each other. The package according to claim 1, wherein the same material is PET. The package according to claim 1, wherein the same material is a paper material. The package according to any one of claims 1 to 3, wherein the IC chip is arranged on a surface of the second base material on the side close to the first base material. Further equipped with a third substrate,
The package according to any one of claims 1 to 4, wherein the third base material is laminated so as to sandwich the antenna so as to face the first base material. Any one of claims 1 to 5, wherein a part of the antenna and a part of the wiring portion overlap when viewed in a plan view from the stacking direction of the first base material and the second base material. The packaging described in the section. An article with a package in which the package according to any one of claims 1 to 6 is fixed to the article. The article has an uneven surface and has an uneven surface.
The article with a package according to claim 7, wherein the package is fixed so that the communication circuit is arranged on the uneven surface of the article. A method of manufacturing an article with a package in which a package covers at least a part of the article.
The difference in shrinkage rate after immersing the article in hot water at 100 ° C. for 10 seconds with the package in contact with or close to the outer peripheral surface is 5% or less, the first base material and the second base material. And the process of preparing
A step of forming an antenna on at least one surface side of the first base material, and
A step of forming a wiring portion on at least one surface side of the second base material, and
The process of electrically connecting the IC chip to the wiring unit and
The first base material and the second base material are laminated to form a package in which a communication circuit composed of the antenna, the wiring portion, and the IC chip enables non-contact communication with an external device. And the process to do
A method for producing an article with a package, comprising: a step of bringing the package into contact with or close to the article, heating the package to heat shrink it, and fixing the package to the article. When the stretching direction of the first base material is the first stretching direction and the stretching direction of the second base material is the second stretching direction, the second stretching direction is along the first stretching direction. The method for manufacturing an article with a package according to claim 9, wherein the first base material and the second base material are laminated. It is a step performed before the step of forming the package, and is
The difference in shrinkage between the first base material and the second base material after immersing the article in hot water at 100 ° C. for 10 seconds with the package in contact with or close to the outer peripheral surface is 5%. The following steps of preparing the third base material and
The method for manufacturing an article with a package according to claim 9, further comprising a step of laminating the third base material so as to sandwich the antenna so as to face the first base material. .. The manufacture of an article with a package according to any one of claims 9 to 11, wherein the package is fixed to the article so that the communication circuit is arranged on the uneven surface of the article. Method.

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