JP2021024950A - Pressure sensitive adhesive sheet - Google Patents
Pressure sensitive adhesive sheet Download PDFInfo
- Publication number
- JP2021024950A JP2021024950A JP2019143869A JP2019143869A JP2021024950A JP 2021024950 A JP2021024950 A JP 2021024950A JP 2019143869 A JP2019143869 A JP 2019143869A JP 2019143869 A JP2019143869 A JP 2019143869A JP 2021024950 A JP2021024950 A JP 2021024950A
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- adhesive sheet
- pressure
- meth
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 61
- 239000000853 adhesive Substances 0.000 claims description 68
- 230000001070 adhesive effect Effects 0.000 claims description 68
- 239000000178 monomer Substances 0.000 claims description 41
- 239000010410 layer Substances 0.000 claims description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 16
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 15
- 239000000194 fatty acid Substances 0.000 claims description 15
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- 150000004665 fatty acids Chemical class 0.000 claims description 15
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- 125000000524 functional group Chemical group 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 238000011084 recovery Methods 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 46
- -1 2-ethylhexyl Chemical group 0.000 description 33
- 229920001971 elastomer Polymers 0.000 description 32
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- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 description 1
- 229920002743 polystyrene-poly(ethylene-ethylene/propylene) block-polystyrene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- AAYRWMCIKCRHIN-UHFFFAOYSA-N propane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CCCS(O)(=O)=O AAYRWMCIKCRHIN-UHFFFAOYSA-N 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C09J2425/006—Presence of styrenic polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明は、粘着シートに関する。 The present invention relates to an adhesive sheet.
半導体ウエハ、各種パッケージ類等の電子部品材料は、大径の状態で製造された後、素子小片(チップ)に切断分離(ダイシング)されるとともに個々にピックアップされ、マウント工程に移されることがある。この際、通常、被加工物は、粘着シートに貼着された状態で各工程に供され、チップをピックアップする際には、チップ間隔を広げるべく粘着シートを伸長させる(エキスパンド工程)。そのため、上記のように用いられる粘着シートが備える基材には、伸長性優れるポリ塩化ビニルフィルムが多用される(特許文献1、2)。 Electronic component materials such as semiconductor wafers and various packages may be manufactured in a large diameter state, then cut and separated (diced) into small element pieces (chips), picked up individually, and transferred to the mounting process. .. At this time, the workpiece is usually subjected to each process in a state of being attached to the adhesive sheet, and when the chips are picked up, the adhesive sheet is extended in order to widen the chip interval (expanding process). Therefore, a polyvinyl chloride film having excellent extensibility is often used as the base material of the pressure-sensitive adhesive sheet used as described above (Patent Documents 1 and 2).
複数のチップの一部を粘着シートからピックアップし、残りのチップを保管する場合には、保管性の観点から、粘着シートは伸長後に復元することが求められる。しかしながら、従来の粘着シート(例えば、ポリ塩化ビニルフィルムを基材とする粘着シート)は、復元性(収縮性)が十分ではなく、特に、1枚の粘着シートに固定されたチップを複数回に分けてピックアップするような場合には、使用し難いという問題がある。 When a part of a plurality of chips is picked up from the adhesive sheet and the remaining chips are stored, the adhesive sheet is required to be restored after stretching from the viewpoint of storability. However, conventional pressure-sensitive adhesive sheets (for example, pressure-sensitive adhesive sheets based on a polyvinyl chloride film) do not have sufficient resilience (shrinkage), and in particular, chips fixed to one pressure-sensitive adhesive sheet are formed multiple times. There is a problem that it is difficult to use when picking up separately.
本発明は上記従来の課題を解決するためになされたものであり、その目的とするところは、電子部品材料の固定に供され得る粘着シートであって、伸縮性に優れ、かつ、繰り返しの伸縮操作を行っても、良好な伸縮性が維持され得る粘着シートを提供することにある。 The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is an adhesive sheet that can be used for fixing electronic component materials, has excellent elasticity, and repeatedly expands and contracts. It is an object of the present invention to provide an adhesive sheet which can maintain good elasticity even when an operation is performed.
本発明の粘着シートは、基材と、該基材の少なくとも片側に配置された粘着剤層とを備える粘着シートであって、23℃の環境下において、張力をかけて該粘着シートを150%伸長させた状態で5分間保持し、張力を開放した際の寸法復元率が、伸長前の該粘着シートを基準として20%以下である。
1つの実施形態においては、上記基材が、脂肪酸アミドを含む。
1つの実施形態においては、上記脂肪酸アミドの含有割合が、上記基材100重量部に対して、0.001重量部〜10重量部である。
1つの実施形態においては、上記粘着剤層が、アクリル系粘着剤を含む。
1つの実施形態においては、上記アクリル系粘着剤が、極性官能基を有するモノマー由来の構成単位を含むアクリル系ポリマーを含む。
1つの実施形態においては、上記極性官能基を有するモノマーの含有割合が、上記アクリル系ポリマー100重量部に対して、0.01重量部〜40重量部である。
1つの実施形態においては、上記極性官能基を有するモノマーが、(メタ)アクリル酸である。
1つの実施形態においては、上記(メタ)アクリル酸の含有割合が、上記(メタ)アクリル系ポリマー100重量部に対して、1重量部〜20重量部である。
The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet including a base material and a pressure-sensitive adhesive layer arranged on at least one side of the base material, and tension is applied to 150% of the pressure-sensitive adhesive sheet in an environment of 23 ° C. The dimensional restoration rate when the tension is released by holding for 5 minutes in the stretched state is 20% or less based on the adhesive sheet before stretching.
In one embodiment, the substrate comprises a fatty acid amide.
In one embodiment, the content ratio of the fatty acid amide is 0.001 part by weight to 10 parts by weight with respect to 100 parts by weight of the base material.
In one embodiment, the pressure-sensitive adhesive layer comprises an acrylic pressure-sensitive adhesive.
In one embodiment, the acrylic pressure-sensitive adhesive comprises an acrylic polymer containing a monomer-derived structural unit having a polar functional group.
In one embodiment, the content ratio of the monomer having a polar functional group is 0.01 part by weight to 40 parts by weight with respect to 100 parts by weight of the acrylic polymer.
In one embodiment, the monomer having the polar functional group is (meth) acrylic acid.
In one embodiment, the content ratio of the (meth) acrylic acid is 1 part by weight to 20 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.
本発明によれば、電子部品材料の固定に供され得る粘着シートであって、伸縮性に優れ、かつ、繰り返しの伸縮操作を行っても、良好な伸縮性が維持され得る粘着シートを提供することができる。 According to the present invention, there is provided an adhesive sheet that can be used for fixing electronic component materials, has excellent elasticity, and can maintain good elasticity even when repeated expansion and contraction operations are performed. be able to.
A.粘着シートの概要
図1は、本発明の好ましい実施形態による粘着シートの概略断面図である。粘着シート100は、基材10と、基材10の少なくとも片側に配置された粘着剤層20とを備える。
A. Overview Figure 1 of the adhesive sheet is a schematic sectional view of a pressure-sensitive adhesive sheet according to a preferred embodiment of the present invention. The pressure-sensitive
本発明の粘着シートは、23℃の環境下において、張力をかけて粘着シートを150%伸長させた状態で5分間保持し、張力を開放した際の寸法復元率(以下、単に復元率ともいう)が、伸長前の粘着シートを基準として80%以上であることが好ましく、82%以上であることがより好ましく、85%以上であることがさらに好ましい。当該復元率は大きいほど好ましいが、上限値は、例えば、95%(好ましくは98%)である。本明細書において、復元率は、下記の方法で測定される。
幅10mm、長さ100mmの粘着シート片に対して、初期評点間距離L0=50mmの標線を長さ方向に記入する。チャック間距離70mmで引っ張り試験機にセットし、引張速度300mm/minで150%(例えば、チャック間距離:145mm)まで伸長させ、伸長状態を5分間保持した後、伸長評点間距離L1を測定する。その後張力を開放して5分後の評点間距離Lを測定し、下記の式により復元率(%)を求める。
復元率(%)={(伸長評点間距離L1−評点間距離L)/(伸長評点間距離L1−初期評点間距離L0)}×100
The pressure-sensitive adhesive sheet of the present invention is held for 5 minutes in a state where the pressure-sensitive adhesive sheet is stretched by 150% under tension in an environment of 23 ° C., and the dimensional restoration rate when the tension is released (hereinafter, also simply referred to as restoration rate). ) Is preferably 80% or more, more preferably 82% or more, and further preferably 85% or more based on the pressure-sensitive adhesive sheet before elongation. The larger the restoration rate, the more preferable, but the upper limit is, for example, 95% (preferably 98%). In the present specification, the restoration rate is measured by the following method.
For the adhesive sheet piece having a width of 10 mm and a length of 100 mm, a marked line with an initial score distance L 0 = 50 mm is drawn in the length direction. Was set in a tensile tester at a chuck distance 70 mm, tensile 150% at a rate of 300 mm / min (e.g., distance between chucks: 145mm) is extended until after the extended state was held for 5 minutes, measuring the elongation between marks distance L 1 To do. After that, the tension is released, the distance L between the scores is measured 5 minutes later, and the restoration rate (%) is calculated by the following formula.
Restoration rate (%) = {(distance between extended grades L 1- distance between grades L) / (distance between extended grades L 1- distance between initial grades L 0 )} × 100
本発明においては、上記復元率を80%以上とすることにより、伸縮性に優れ、かつ、繰り返しの伸縮操作を行っても、良好な伸縮性が維持され得る粘着シートを提供することができる。例えば、粘着シート上に配置された複数あるチップを、数回に分けてピックアップする場合、本発明の粘着シートを用いれば、ピックアップの際には当該粘着シートを伸長させて、一部のチップを良好にピックアップすることができ、その後には、粘着シートが収縮復元して良好な保管性が実現される。また、このような操作を繰り返し行う場合にも、伸縮性を発現し、良好なピックアップ性と保管性とが維持される。上記復元率は、例えば、基材を構成する樹脂種を適切に選択すること、当該樹脂の構造を調整すること(例えば、ポリウレタンフィルム)、PPエラストマーフィルム、Stエラストマーフィルム等により、制御することができる。 In the present invention, by setting the restoration rate to 80% or more, it is possible to provide an adhesive sheet having excellent elasticity and capable of maintaining good elasticity even after repeated expansion and contraction operations. For example, when a plurality of chips arranged on an adhesive sheet are picked up in several times, if the adhesive sheet of the present invention is used, the adhesive sheet is stretched at the time of picking up, and some of the chips are picked up. It can be picked up well, and then the adhesive sheet shrinks and restores to achieve good storage. Further, even when such an operation is repeatedly performed, elasticity is exhibited, and good pick-up property and storability are maintained. The restoration rate can be controlled by, for example, appropriately selecting the resin type constituting the base material, adjusting the structure of the resin (for example, polyurethane film), PP elastomer film, St elastomer film, or the like. it can.
本発明の粘着シートのシリコーンミラーウエハ(例えば、厚さ20μm)に対する粘着力は、好ましくは0.1N/20mm以上であり、より好ましくは0.5N/20mm〜20N/20mmであり、さらに好ましくは0.8N/20mm〜15N/20mmである。このような範囲であれば、例えば、電子部品の製造に用いられる仮固定用シートとして有用な粘着シートを得ることができる。23℃の環境下で、JIS Z 0237:2000に準じた方法(貼り合わせ条件:2kgローラー1往復、剥離速度:300mm/min、剥離角度90°)により測定した粘着力をいう。 The adhesive strength of the pressure-sensitive adhesive sheet of the present invention to a silicone mirror wafer (for example, a thickness of 20 μm) is preferably 0.1 N / 20 mm or more, more preferably 0.5 N / 20 mm to 20 N / 20 mm, and even more preferably. It is 0.8N / 20mm to 15N / 20mm. Within such a range, for example, an adhesive sheet useful as a temporary fixing sheet used for manufacturing electronic parts can be obtained. Adhesive strength measured by a method according to JIS Z 0237: 2000 in an environment of 23 ° C. (bonding conditions: 2 kg roller 1 reciprocation, peeling speed: 300 mm / min, peeling angle 90 °).
本発明の粘着シートの厚さは、好ましくは30μm〜500μmであり、より好ましくは40μm〜300μmであり、さらに好ましくは50μm〜200μmである。 The thickness of the pressure-sensitive adhesive sheet of the present invention is preferably 30 μm to 500 μm, more preferably 40 μm to 300 μm, and further preferably 50 μm to 200 μm.
本発明の粘着シートの23℃における破断伸びは、好ましくは100%以上であり、より好ましくは250%以上であり、さらに好ましくは400%〜1000%であり、特に好ましくは500%〜900%である。上記破断伸びは、JIS K7113に準じて測定され得る。 The elongation at break of the pressure-sensitive adhesive sheet of the present invention at 23 ° C. is preferably 100% or more, more preferably 250% or more, further preferably 400% to 1000%, and particularly preferably 500% to 900%. is there. The elongation at break can be measured according to JIS K7113.
本発明の粘着シートの23℃における25%モジュラスは、好ましくは1N/10mm〜100N/10mmであり、より好ましくは1.5N/10mm〜50N/10mmであり、さらに好ましくは2N/10mm〜20N/10mmである。1つの実施形態においては、本発明の粘着シートの23℃における25%モジュラスは、20N/10mm以下である。このような範囲であれば、良好なエキスパンド性が得られる。25%モジュラスの測定方法は、以下のとおりである。
<25%モジュラス測定方法>
粘着シートを幅10mm、長さ100mmのサイズに切断し、恒温槽付き引張試験機にチャック間距離が50mmになるようにセットし、粘着シートを引張速度:300mm/minで長さ方向に引張り、25%伸びた際の応力を25%モジュラス(N/10mm)とする。
The 25% modulus of the pressure-sensitive adhesive sheet of the present invention at 23 ° C. is preferably 1N / 10mm to 100N / 10mm, more preferably 1.5N / 10mm to 50N / 10mm, still more preferably 2N / 10mm to 20N /. It is 10 mm. In one embodiment, the 25% modulus of the pressure-sensitive adhesive sheet of the present invention at 23 ° C. is 20 N / 10 mm or less. Within such a range, good expandability can be obtained. The method for measuring the 25% modulus is as follows.
<25% modulus measurement method>
Cut the adhesive sheet to a size of 10 mm in width and 100 mm in length, set it in a tensile tester with a constant temperature bath so that the distance between chucks is 50 mm, and pull the adhesive sheet in the length direction at a tensile speed of 300 mm / min. The stress when stretched by 25% is 25% modulus (N / 10 mm).
上記粘着シートは、本発明の効果が得られる限り、任意の適切なその他の層をさらに備えていてもよい。また、粘着シートが実用に供されるまでの間、粘着剤層上にセパレータが配置されて粘着剤層が保護されたセパレータ付粘着シートが提供されてもよい。 The pressure-sensitive adhesive sheet may further include any suitable other layer as long as the effects of the present invention can be obtained. Further, a pressure-sensitive adhesive sheet with a separator may be provided in which a separator is arranged on the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer is protected until the pressure-sensitive adhesive sheet is put into practical use.
B.基材
上記基材を構成する材料としては、本発明の効果が得られる限り、任意の適切な材料が用いられ得る。好ましくは、上記基材を構成する材料として、ポリウレタン系樹脂、スチレン系エラストマーまたはプロピレン系エラストマーが用いられる。なかでも好ましくは、ポリエステルポリオールまたはポリエーテルポリオールであり、これらのポリオールを用いれば、本発明の効果はより顕著となる。上記ポリオールは、単独で、または2種以上を組み合わせて用いられる。
B. The material for the substrate the substrate, as long as the effects of the present invention is obtained, any suitable material may be used. Preferably, a polyurethane resin, a styrene elastomer, or a propylene elastomer is used as the material constituting the base material. Of these, polyester polyols or polyether polyols are preferable, and the effects of the present invention become more remarkable when these polyols are used. The above polyols may be used alone or in combination of two or more.
上記ポリウレタン系樹脂は、ウレタン結合を有する樹脂をいい、アクリル−ポリウレタン共重合体やポリエステル−ポリウレタン共重合体も含まれる。ポリウレタン系樹脂は、代表的には、ポリオールとポリイソシアネートとを反応させることにより得られる。ポリオールとしては、分子中にヒドロキシル基を2個以上有するものであれば特に限定されず、任意の適切なポリオールが用いられる。例えば、ポリアクリルポリオール、ポリエステルポリオール、ポリエーテルポリオール等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 The polyurethane-based resin refers to a resin having a urethane bond, and also includes an acrylic-polyurethane copolymer and a polyester-polyurethane copolymer. The polyurethane-based resin is typically obtained by reacting a polyol with a polyisocyanate. The polyol is not particularly limited as long as it has two or more hydroxyl groups in the molecule, and any suitable polyol can be used. For example, polyacrylic polyol, polyester polyol, polyether polyol and the like can be mentioned. These may be used alone or in combination of two or more.
上記ポリアクリルポリオールは、代表的には、(メタ)アクリル酸エステルと、水酸基を有する単量体とを共重合させることにより得られる。(メタ)アクリル酸エステルとしては、例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸ブチル、(メタ)アクリル酸2−エチルヘキシル、(メタ)アクリル酸シクロヘキシル等が挙げられる。水酸基を有する単量体としては、例えば、(メタ)アクリル酸2−ヒドロキシエチル、(メタ)アクリル酸2−ヒドロキシプロピル、(メタ)アクリル酸3−ヒドキシプロピル、(メタ)アクリル酸2−ヒドロキシブチル、(メタ)アクリル酸4−ヒドロキシブチル、(メタ)アクリル酸2−ヒドロキシペンチル等の(メタ)アクリル酸のヒドロキシアルキルエステル;グリセリン、トリメチロールプロパン等の多価アルコールの(メタ)アクリル酸モノエステル;N−メチロール(メタ)アクリルアミド等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 The polyacrylic polyol is typically obtained by copolymerizing a (meth) acrylic acid ester with a monomer having a hydroxyl group. Examples of the (meth) acrylic acid ester include methyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate and the like. Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 2-hydroxy (meth) acrylate. Hydroxyalkyl esters of (meth) acrylic acids such as butyl, 4-hydroxybutyl (meth) acrylates, 2-hydroxypentyl (meth) acrylates; mono (meth) acrylic acids of polyhydric alcohols such as glycerin and trimethyl propane. Estel; N-methylol (meth) acrylamide and the like can be mentioned. These may be used alone or in combination of two or more.
上記ポリアクリルポリオールは、上記単量体成分に加えて、他の単量体を共重合させていてもよい。他の単量体としては、共重合可能な限り、任意の適切な単量体が用いられる。具体的には、(メタ)アクリル酸等の不飽和モノカルボン酸;マレイン酸等の不飽和ジカルボン酸ならびにその無水物およびモノまたはジエステル類;(メタ)アクリロニトリル等の不飽和ニトリル類;(メタ)アクリルアミド、N−メチロール(メタ)アクリルアミド等の不飽和アミド類;酢酸ビニル、プロピオン酸ビニル等のビニルエステル類;メチルビニルエーテル等のビニルエーテル類;エチレン、プロピレン等のα−オレフィン類;塩化ビニル、塩化ビニリデン等のハロゲン化α,β−不飽和脂肪族単量体;スチレン、α−メチルスチレン等のα,β−不飽和芳香族単量体等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 The polyacrylic polyol may be copolymerized with another monomer in addition to the monomer component. As the other monomer, any suitable monomer is used as long as it can be copolymerized. Specifically, unsaturated monocarboxylic acids such as (meth) acrylic acid; unsaturated dicarboxylic acids such as maleic acid and their anhydrides and mono- or diesters; unsaturated nitriles such as (meth) acrylonitrile; (meth). Unsaturated amides such as acrylamide and N-methylol (meth) acrylamide; vinyl esters such as vinyl acetate and vinyl propionate; vinyl ethers such as methyl vinyl ether; α-olefins such as ethylene and propylene; vinyl chloride and vinylidene chloride Halogenized α, β-unsaturated aliphatic monomers such as styrene, α-unsaturated aromatic monomers such as styrene and α-methylstyrene, and the like. These may be used alone or in combination of two or more.
上記ポリエステルポリオールは、代表的には、多塩基酸成分とポリオール成分とを反応させることにより得られる。多塩基酸成分としては、例えば、オルトフタル酸、イソフタル酸、テレフタル酸、1,4−ナフタレンジカルボン酸、2,5−ナフタレンジカルボン酸、2,6−ナフタレンジカルボン酸、ビフェニルジカルボン酸、テトラヒドロフタル酸等の芳香族ジカルボン酸;シュウ酸、コハク酸、マロン酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、デカンジカルボン酸、ドデカンジカルボン酸、オクタデカンジカルボン酸、酒石酸、アルキルコハク酸、リノレイン酸、マレイン酸、フマール酸、メサコン酸、シトラコン酸、イタコン酸等の脂肪族ジカルボン酸;ヘキサヒドロフタル酸、テトラヒドロフタル酸、1,3−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジカルボン酸などの脂環式ジカルボン酸;あるいは、これらの酸無水物、アルキルエステル、酸ハライド等の反応性誘導体等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 The polyester polyol is typically obtained by reacting a polybasic acid component with a polyol component. Examples of the polybasic acid component include orthophthalic acid, isophthalic acid, terephthalic acid, 1,4-naphthalenedicarboxylic acid, 2,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, biphenyldicarboxylic acid, tetrahydrophthalic acid and the like. Aromatic dicarboxylic acids; oxalic acid, succinic acid, malonic acid, glutaric acid, adipic acid, pimeric acid, suberic acid, azelaic acid, sebacic acid, decandicarboxylic acid, dodecanediocarboxylic acid, octadecanedicarboxylic acid, tartaric acid, alkylsuccinic acid , Linoleic acid, maleic acid, fumaric acid, mesaconic acid, citraconic acid, itaconic acid and other aliphatic dicarboxylic acids; hexahydrophthalic acid, tetrahydrophthalic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, etc. Examples of the alicyclic dicarboxylic acid; or a reactive derivative of these acid anhydrides, alkyl esters, acid halides and the like. These may be used alone or in combination of two or more.
上記ポリオール成分としては、エチレングリコール、1,2−プロパンジオール、1,3−プロパンジオール、1,3−ブタンジオール、1,4−ブタンジオール、ネオペンチルグリコール、ペンタンジオール、1,6−ヘキサンジオール、1,8−オクタンジオール、1,10−デカンジオール、1−メチル−1,3−ブチレングリコール、2−メチル−1,3−ブチレングリコール、1−メチル−1,4−ペンチレングリコール、2−メチル−1,4−ペンチレングリコール、1,2−ジメチル−ネオペンチルグリコール、2,3−ジメチル−ネオペンチルグリコール、1−メチル−1,5−ペンチレングリコール、2−メチル−1,5−ペンチレングリコール、3−メチル−1,5−ペンチレングリコール、1,2−ジメチルブチレングリコール、1,3−ジメチルブチレングリコール、2,3−ジメチルブチレングリコール、1,4−ジメチルブチレングリコール、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール、ジプロピレングリコール、ポリプロピレングリコール、1,4−シクロヘキサンジメタノール、1,4−シクロヘキサンジオール、ビスフェノールA、ビスフェノールF、水添ビスフェノールA、水添ビスフェノールF等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 Examples of the polyol component include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, pentanediol, and 1,6-hexanediol. , 1,8-octanediol, 1,10-decanediol, 1-methyl-1,3-butylene glycol, 2-methyl-1,3-butylene glycol, 1-methyl-1,4-pentylene glycol, 2 -Methyl-1,4-pentylene glycol, 1,2-dimethyl-neopentyl glycol, 2,3-dimethyl-neopentyl glycol, 1-methyl-1,5-pentylene glycol, 2-methyl-1,5 -Pentylene glycol, 3-methyl-1,5-pentylene glycol, 1,2-dimethylbutylene glycol, 1,3-dimethylbutylene glycol, 2,3-dimethylbutylene glycol, 1,4-dimethylbutylene glycol, diethylene glycol , Triethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, 1,4-cyclohexanedimethanol, 1,4-cyclohexanediol, bisphenol A, bisphenol F, hydrogenated bisphenol A, hydrogenated bisphenol F and the like. These may be used alone or in combination of two or more.
上記ポリエーテルポリオールは、代表的には、多価アルコールにアルキレンオキシドを開環重合して付加させることにより得られる。多価アルコールとしては、例えば、エチレングリコール、ジエチレングリコール、プロピレングリコール、ジプロピレングリコール、グリセリン、トリメチロールプロパン等が挙げられる。アルキレンオキシドとしては、例えば、エチレンオキシド、プロピレンオキシド、ブチレンオキシド、スチレンオキシド、テトラヒドロフラン等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 The above-mentioned polyether polyol is typically obtained by ring-opening polymerization of an alkylene oxide on a polyhydric alcohol and adding it. Examples of the polyhydric alcohol include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, and trimethylolpropane. Examples of the alkylene oxide include ethylene oxide, propylene oxide, butylene oxide, styrene oxide, and tetrahydrofuran. These may be used alone or in combination of two or more.
上記ポリイソシアネートとしては、例えば、テトラメチレンジイソシアネート、ドデカメチレンジイソシアネート、1,4−ブタンジイソシアネート、ヘキサメチレンジイソシアネート、2,2,4−トリメチルヘキサメチレンジイソシアネート、2,4,4−トリメチルヘキサメチレンジイソシアネート、リジンジイソシアネート、2−メチルペンタン−1,5−ジイソシアネート、3−メチルペンタン−1,5−ジイソシアネート等の脂肪族ジイソシアネート;イソホロンジイソシアネート、水添キシリレンジイソシアネート、4,4′−シクロヘキシルメタンジイソシアネート、1,4−シクロヘキサンジイソシアネート、メチルシクロヘキシレンジイソシアネート、1,3−ビス(イソシアネートメチル)シクロヘキサン等の脂環族ジイソシアネート;トリレンジイソシアネート、2,2′−ジフェニルメタンジイソシアネート、2,4′−ジフェニルメタンジイソシアネート、4,4′−ジフェニルメタンジイソシアネート、4,4′−ジフェニルジメチルメタンジイソシアネート、4,4′−ジベンジルジイソシアネート、1,5−ナフチレンジイソシアネート、キシリレンジイソシアネート、1,3−フェニレンジイソシアネート、1,4−フェニレンジイソシアネート等の芳香族ジイソシアネート;ジアルキルジフェニルメタンジイソシアネート、テトラアルキルジフェニルメタンジイソシアネート、α,α,α,α−テトラメチルキシリレンジイソシアネート等の芳香脂肪族ジイソシアネート等が挙げられる。これらは単独で、または2種以上を組み合わせて用いられる。 Examples of the polyisocyanate include tetramethylene diisocyanate, dodecamethylene diisocyanate, 1,4-butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, and lysine. Aliphatic diisocyanates such as diisocyanate, 2-methylpentane-1,5-diisocyanate, 3-methylpentane-1,5-diisocyanate; isophorone diisocyanate, hydrogenated xylylene diisocyanate, 4,4'-cyclohexylmethane diisocyanate, 1,4 -Alicyclic diisocyanates such as cyclohexane diisocyanate, methylcyclohexamethylene diisocyanate, 1,3-bis (isocyanate methyl) cyclohexane; tolylene diisocyanate, 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4' -Diphenylmethane diisocyanate, 4,4'-diphenyldimethylmethane diisocyanate, 4,4'-dibenzyldiisocyanate, 1,5-naphthylene diisocyanate, xylylene diisocyanate, 1,3-phenylenedi isocyanate, 1,4-phenylenediocyanate, etc. Aromatic diisocyanates; examples include aromatic aliphatic diisocyanates such as dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, α, α, α, and α-tetramethylxylylene diisocyanate. These may be used alone or in combination of two or more.
上記ポリウレタン系樹脂の重量平均分子量は、好ましくは5000〜600000、さらに好ましくは10000〜400000である。上記ポリウレタン系樹脂の酸価は、好ましくは10以上、さらに好ましくは10〜50、特に好ましくは20〜45である。なお、本明細書において、重量平均分子量は、GPC(溶媒:THF)により測定され得る。 The weight average molecular weight of the polyurethane resin is preferably 5000 to 600000, more preferably 1000 to 400000. The acid value of the polyurethane resin is preferably 10 or more, more preferably 10 to 50, and particularly preferably 20 to 45. In addition, in this specification, a weight average molecular weight can be measured by GPC (solvent: THF).
上記スチレン系エラストマーとしては、例えば、スチレン・ブタジエン・スチレントリブロック共重合体エラストマー(SBS)、スチレン・イソプレン・スチレントリブロック共重合体エラストマー(SIS)、スチレン−エチレン・ブチレン共重合体エラストマー(SEB)、スチレン−エチレン・プロピレン共重合体エラストマー(SEP)、スチレン−エチレン・ブチレン−スチレン共重合体エラストマー(SEBS)、スチレン−エチレン・ブチレン−エチレン共重合体エラストマー(SEBC)、水添スチレン・ブタジエンエラストマー(HSBR)、スチレン−エチレン・プロピレン−スチレン共重合体エラストマー(SEPS)、スチレン−エチレン・エチレン・プロピレン−スチレン共重合体エラストマー(SEEPS)、スチレン−ブタジエン・ブチレン−スチレン共重合体エラストマー(SBBS)等が挙げられる。なかでも好ましくはSIS、SEBSである。 Examples of the styrene-based elastomer include styrene / butadiene / styrene triblock copolymer elastomer (SBS), styrene / isoprene / styrene triblock copolymer elastomer (SIS), and styrene-ethylene / butylene copolymer elastomer (SEB). ), Styrene-ethylene / propylene copolymer elastomer (SEP), styrene-ethylene / butylene-styrene copolymer elastomer (SEBS), styrene-ethylene / butylene-ethylene copolymer elastomer (SEBC), hydrogenated styrene / butadiene Elastomer (HSBR), Styrene-Ethene / Styrene-Styrene Copolymer Elastomer (SEPS), Styrene-Eethylene / Ethylene / Styrene-Styrene Copolymer Elastomer (SEEPS), Styrene-butadiene / Butylene-Styrene Copolymer Elastomer (SBBS) ) Etc. can be mentioned. Of these, SIS and SEBS are preferable.
上記スチレン系エラストマーにおいて、スチレン由来の構成単位の含有割合は、好ましくは30重量%以下であり、より好ましくは20重量%以下である。このような範囲であれば、伸縮性に優れる粘着シートを得ることができる。 In the styrene-based elastomer, the content ratio of the styrene-derived structural unit is preferably 30% by weight or less, and more preferably 20% by weight or less. Within such a range, an adhesive sheet having excellent elasticity can be obtained.
上記スチレン系エラストマーの重量平均分子量は、好ましくは1万〜50万であり、より好ましくは5万〜30万である。このような範囲であれば、伸縮性に優れる粘着シートを得ることができる。 The weight average molecular weight of the styrene-based elastomer is preferably 10,000 to 500,000, more preferably 50,000 to 300,000. Within such a range, an adhesive sheet having excellent elasticity can be obtained.
上記プロピレン系エラストマーは、プロピレン由来の構成単位を含むエラストマーであり、1つの実施形態においては、プロピレン由来の構成単位を含む共重合体である。上記プロピレン系エラストマーにおいて、プロピレン由来の構成単位の含有割合は、好ましくは30重量%〜90重量%であり、より好ましくは50重量%〜90重量%である。このような範囲であれば、伸縮性に優れる粘着シートを得ることができる。 The propylene-based elastomer is an elastomer containing a propylene-derived structural unit, and in one embodiment, is a copolymer containing a propylene-derived structural unit. In the propylene-based elastomer, the content ratio of the propylene-derived structural unit is preferably 30% by weight to 90% by weight, more preferably 50% by weight to 90% by weight. Within such a range, an adhesive sheet having excellent elasticity can be obtained.
上記プロピレン系エラストマーを構成するその他の共重合成分としては、例えば、エチレン、1−ブテン、2−メチルプロピレン、1−ペンテン、3−メチル−1−ブテン、1−ヘキセン、4−メチル−1−ペンテン、1−オクテン等のモノマー由来の構成単位が挙げられる。なかでも、エチレン、1−ブテン、1−ペンテン、1−ヘキセン、1−オクテン等が好ましく、エチレン、1−ブテンが特に好ましい。これらは単独で、または2種以上を組み合わせて用いられる。1つの実施形態においては、上記プロピレン系エラストマーは、エチレン由来の構成単位を含む。上記プロピレン系エラストマーにおいて、エチレン由来の構成単位の含有割合は、好ましくは5重量%〜20重量%であり、より好ましくは8重量%〜15重量%である。 Examples of other copolymerizing components constituting the propylene-based elastomer include ethylene, 1-butene, 2-methylpropylene, 1-pentene, 3-methyl-1-butene, 1-hexene and 4-methyl-1-. Examples thereof include structural units derived from monomers such as butene and 1-octene. Among them, ethylene, 1-butene, 1-pentene, 1-hexene, 1-octene and the like are preferable, and ethylene and 1-butene are particularly preferable. These may be used alone or in combination of two or more. In one embodiment, the propylene-based elastomer comprises a building block derived from ethylene. In the propylene-based elastomer, the content ratio of the ethylene-derived structural unit is preferably 5% by weight to 20% by weight, more preferably 8% by weight to 15% by weight.
プロピレン系エラストマーの重量平均分子量は、好ましくは1万〜50万であり、より好ましくは5万〜30万である。このような範囲であれば、伸縮性に優れる粘着シートを得ることができる。 The weight average molecular weight of the propylene-based elastomer is preferably 10,000 to 500,000, more preferably 50,000 to 300,000. Within such a range, an adhesive sheet having excellent elasticity can be obtained.
1つの実施形態においては、上記基材は単層構成である。 In one embodiment, the substrate has a single layer configuration.
別の実施形態においては、上記基材は複層構成である。基材が複層構成である場合、基材を構成する層のうち少なくとも1層が、上記のように、ポリウレタン系樹脂、スチレン系エラストマーまたはプロピレン系エラストマーを含むことが好ましい。ポリウレタン系樹脂、スチレン系エラストマーまたはプロピレン系エラストマーを含む層の合計厚さは、基材の総厚に対して、50%以上であることが好ましく、70%以上であることがより好ましい。 In another embodiment, the substrate has a multi-layer structure. When the base material has a multi-layer structure, it is preferable that at least one of the layers constituting the base material contains a polyurethane-based resin, a styrene-based elastomer, or a propylene-based elastomer as described above. The total thickness of the layer containing the polyurethane resin, the styrene elastomer, or the propylene elastomer is preferably 50% or more, more preferably 70% or more, based on the total thickness of the base material.
1つの実施形態においては、上記基材は、脂肪酸アミドを含む。脂肪酸アミドを含有させることにより、適度なすべり性を有する基材を得ることができる。脂肪酸アミドを含む基材を備える粘着シートは、搬送性に優れ、また、エキスパンダーのステージに対するグリップ力に優れ、エキスパンド工程において良好に伸長させることができる。上記基材が複層構成であり、かつ、基材の片側に粘着剤層が配置される場合においては、少なくとも、粘着剤層とは反対側に位置する当該基材の最外層に脂肪酸アミドを含有させることが好ましい。 In one embodiment, the substrate comprises a fatty acid amide. By containing the fatty acid amide, a base material having an appropriate slipperiness can be obtained. The pressure-sensitive adhesive sheet provided with the base material containing the fatty acid amide has excellent transportability and excellent grip on the stage of the expander, and can be satisfactorily stretched in the expanding step. When the base material has a multi-layer structure and the pressure-sensitive adhesive layer is arranged on one side of the base material, fatty acid amide is applied to at least the outermost layer of the base material located on the side opposite to the pressure-sensitive adhesive layer. It is preferable to include it.
脂肪酸アミドとしては、例えば、ラウリン酸アミド、パルミチン酸アミド、ステアリン酸アミド、ベヘン酸アミド、オレイン酸アミド、エルカ酸アミド、ヒドロキシステアリン酸アミド等のモノアミド類、エチレンビスラウリン酸アミド、エチレンビスステアリン酸アミド、エチレンビスヒドロキシステアリン酸アミド、エチレンビスベヘン酸アミド、ヘキサメチレンビスステアリン酸アミド、エチレンビスオレイン酸アミド、ヘキサメチレンビスオレイン酸アミド等が挙げられる。脂肪酸アミド系滑剤を構成する脂肪酸の炭素数は12以上であることが好ましく、より好ましくは12〜30であり、さらに好ましくは14〜28である。 Examples of the fatty acid amide include monoamides such as lauric acid amide, palmitic acid amide, stearic acid amide, bechenic acid amide, oleic acid amide, erucic acid amide, and hydroxystearic acid amide, ethylene bislauric acid amide, and ethylene bisstearic acid. Examples thereof include amides, ethylene bishydroxystearic acid amides, ethylene bisbechenic acid amides, hexamethylene bisstearic acid amides, ethylene bisoleic acid amides, hexamethylene bisoleic acid amides and the like. The fatty acid constituting the fatty acid amide-based lubricant preferably has 12 or more carbon atoms, more preferably 12 to 30 carbon atoms, and further preferably 14 to 28 carbon atoms.
1つの実施形態においては、脂肪酸アミドの含有割合は、基材100重量部に対して、好ましくは0.001重量部〜10重量部であり、より好ましくは0.01重量部〜3重量部である。 In one embodiment, the fatty acid amide content is preferably 0.001 to 10 parts by weight, more preferably 0.01 to 3 parts by weight, based on 100 parts by weight of the substrate. is there.
1つの実施形態において、上記基材が複層構成であり、かつ、基材の片側に粘着剤層が配置される場合、粘着剤層とは反対側に位置する当該基材の最外層における脂肪酸アミドの含有割合は、当該最外層100重量部に対して、好ましくは0.001重量部〜10重量部であり、より好ましくは0.01重量部〜3重量部である。 In one embodiment, when the base material has a multi-layer structure and the pressure-sensitive adhesive layer is arranged on one side of the base material, fatty acids in the outermost layer of the base material located on the side opposite to the pressure-sensitive adhesive layer. The content ratio of the amide is preferably 0.001 part by weight to 10 parts by weight, and more preferably 0.01 part by weight to 3 parts by weight with respect to 100 parts by weight of the outermost layer.
上記基材は、23℃の環境下において、張力をかけて基材を150%伸長させた状態で5分間保持し、張力を開放した際の復元率が、伸長前を基準として80%以上であることが好ましく、82%以上であることがより好ましく、85%以上であることがさらに好ましい。当該復元率は大きいほど好ましいが、上限値は、例えば、95%(好ましくは98%)である。 The above-mentioned base material is held in an environment of 23 ° C. in a state where the base material is stretched by 150% under tension for 5 minutes, and the restoration rate when the tension is released is 80% or more based on the value before stretching. It is preferably 82% or more, more preferably 85% or more. The larger the restoration rate, the more preferable, but the upper limit is, for example, 95% (preferably 98%).
上記基材の23℃における破断伸びは、好ましくは10%以上であり、より好ましくは250%以上であり、さらに好ましくは250%〜1000%であり、特に好ましくは250%〜800%である。 The elongation at break of the base material at 23 ° C. is preferably 10% or more, more preferably 250% or more, further preferably 250% to 1000%, and particularly preferably 250% to 800%.
上記基材の23℃における25%モジュラスは、好ましくは1N/10mm〜100N/10mmであり、より好ましくは2N/10mm〜60N/10mmであり、さらに好ましくは3N/10mm〜30N/10mmである。1つの実施形態においては、基材の23℃における25%モジュラスは、30N/10mm以下である。このような範囲であれば、良好なエキスパンド性が得られる。 The 25% modulus of the substrate at 23 ° C. is preferably 1N / 10mm to 100N / 10mm, more preferably 2N / 10mm to 60N / 10mm, and even more preferably 3N / 10mm to 30N / 10mm. In one embodiment, the 25% modulus of the substrate at 23 ° C. is 30 N / 10 mm or less. Within such a range, good expandability can be obtained.
上記基材のJIS K 6253に準拠して測定した硬度は、好ましくは80A〜100Aであり、より好ましくは85A〜95Aである。このような範囲であれば、良好なエキスパンド性が得られる。1つの実施形態においては、基材を構成する材料として上記ポリウレタン系樹脂を用い、当該基材の上記硬度が80A〜100A(好ましくは85A〜95A)とされる。このようにすれば、本発明の効果が顕著となる。 The hardness of the base material measured according to JIS K 6253 is preferably 80A to 100A, more preferably 85A to 95A. Within such a range, good expandability can be obtained. In one embodiment, the polyurethane resin is used as the material constituting the base material, and the hardness of the base material is 80A to 100A (preferably 85A to 95A). In this way, the effect of the present invention becomes remarkable.
上記基材の厚さは、所望とする強度または柔軟性、ならびに使用目的等に応じて、任意の適切な厚さに設定され得る。基材の厚さは、好ましくは1000μm以下であり、より好ましくは1μm〜500μmであり、さらに好ましくは1μm〜300μmであり、特に好ましくは3μm〜200μmであり、最も好ましくは5μm〜100μmである。 The thickness of the base material can be set to an arbitrary appropriate thickness depending on the desired strength or flexibility, the purpose of use, and the like. The thickness of the base material is preferably 1000 μm or less, more preferably 1 μm to 500 μm, further preferably 1 μm to 300 μm, particularly preferably 3 μm to 200 μm, and most preferably 5 μm to 100 μm.
上記基材は、少なくとも一方の面のSUS304板に対する動摩擦力が、0.1N〜7.0Nであることが好ましく、0.1N〜5.0Nであることがより好ましく、0.1N〜3.0Nであることがさらに好ましい。動摩擦係数がこのような範囲の基材を備える粘着シートは、搬送性に優れ、また、エキスパンダーのステージに対するグリップ力に優れ、エキスパンド工程において良好に伸長させることができる。 The dynamic friction force of the base material with respect to the SUS304 plate on at least one surface is preferably 0.1N to 7.0N, more preferably 0.1N to 5.0N, and 0.1N to 3. It is more preferably 0N. The pressure-sensitive adhesive sheet provided with the base material having a coefficient of kinetic friction in such a range has excellent transportability and excellent grip on the stage of the expander, and can be satisfactorily stretched in the expanding step.
C.粘着剤層
上記粘着剤層は、任意の適切な粘着剤から構成される。粘着剤としては、アクリル系粘着剤、シリコーン系粘着剤、ビニルアルキルエーテル系粘着剤、ポリエステル系粘着剤、ポリアミド系粘着剤、ウレタン系粘着剤、フッ素系粘着剤、スチレン−ジエンブロック共重合体系粘着剤、活性エネルギー線硬化型粘着剤等が挙げられる。1つの実施形態においては、アクリル系粘着剤が用いられる。
C. Adhesive Layer The adhesive layer is composed of any suitable adhesive. Adhesives include acrylic adhesives, silicone adhesives, vinyl alkyl ether adhesives, polyester adhesives, polyamide adhesives, urethane adhesives, fluorine adhesives, styrene-diene block copolymer adhesives. Examples thereof include agents and active energy ray-curable pressure-sensitive adhesives. In one embodiment, an acrylic pressure-sensitive adhesive is used.
上記アクリル系粘着剤としては、例えば、(メタ)アクリル酸アルキルエステルの1種または2種以上を単量体成分として用いたアクリル系ポリマー(ホモポリマーまたはコポリマー)をベースポリマーとするアクリル系粘着剤等が挙げられる。(メタ)アクリル酸アルキルエステルの具体例としては、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸プロピル、(メタ)アクリル酸イソプロピル、(メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸s−ブチル、(メタ)アクリル酸t−ブチル、(メタ)アクリル酸ペンチル、(メタ)アクリル酸ヘキシル、(メタ)アクリル酸ヘプチル、(メタ)アクリル酸オクチル、(メタ)アクリル酸2−エチルヘキシル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸ノニル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸デシル、(メタ)アクリル酸イソデシル、(メタ)アクリル酸ウンデシル、(メタ)アクリル酸ドデシル、(メタ)アクリル酸トリデシル、(メタ)アクリル酸テトラデシル、(メタ)アクリル酸ペンタデシル、(メタ)アクリル酸ヘキサデシル、(メタ)アクリル酸ヘプタデシル、(メタ)アクリル酸オクタデシル、(メタ)アクリル酸ノナデシル、(メタ)アクリル酸エイコシル等の(メタ)アクリル酸C1−20アルキルエステルが挙げられる。なかでも、炭素数が4〜18の直鎖状もしくは分岐状のアルキル基を有する(メタ)アクリル酸アルキルエステルが好ましく用いられ得る。 The acrylic pressure-sensitive adhesive includes, for example, an acrylic pressure-sensitive adhesive based on an acrylic polymer (homopolymer or copolymer) using one or more (meth) acrylic acid alkyl esters as a monomer component. And so on. Specific examples of the (meth) acrylic acid alkyl ester include methyl (meth) acrylic acid, ethyl (meth) acrylic acid, propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, butyl (meth) acrylic acid, and (meth). ) Isobutyl acrylate, s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate , (Meta) 2-ethylhexyl acrylate, (meth) isooctyl acrylate, (meth) nonyl acrylate, (meth) isononyl acrylate, (meth) decyl acrylate, (meth) isodecyl acrylate, (meth) acrylate Undecyl, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate , (Meta) acrylic acid nonadecil, (meth) acrylic acid eicosyl and the like (meth) acrylic acid C1-20 alkyl esters. Of these, (meth) acrylic acid alkyl esters having a linear or branched alkyl group having 4 to 18 carbon atoms can be preferably used.
(メタ)アクリル酸アルキルエステル由来の構成単位の含有割合は、アクリル系ポリマー100重量部に対して、好ましくは50重量部であり、より好ましくは60重量部以上であり、さらに好ましくは70重量部以上であり、特に好ましくは80重量部〜97重量部である。 The content ratio of the structural unit derived from the (meth) acrylic acid alkyl ester is preferably 50 parts by weight, more preferably 60 parts by weight or more, still more preferably 70 parts by weight, based on 100 parts by weight of the acrylic polymer. These are the above, and particularly preferably 80 parts by weight to 97 parts by weight.
上記アクリル系ポリマーは、凝集力、耐熱性、架橋性等の改質を目的として、必要に応じて、上記(メタ)アクリル酸アルキルエステルと共重合可能な他のモノマーに対応する単位を含んでいてもよい。このようなモノマーとして、例えば、アクリル酸、メタクリル酸、カルボキシエチルアクリレート、カルボキシペンチルアクリレート、イタコン酸、マレイン酸、フマル酸、クロトン酸等のカルボキシル基含有モノマー;無水マレイン酸、無水イコタン酸等の酸無水物モノマー;(メタ)アクリル酸ヒドロキシエチル、(メタ)アクリル酸ヒドロキシプロピル、(メタ)アクリル酸ヒドロキシブチル、(メタ)アクリル酸ヒドロキシヘキシル、(メタ)アクリル酸ヒドロキシオクチル、(メタ)アクリル酸ヒドロキシデシル、(メタ)アクリル酸ヒドロキシラウリル、(4−ヒドロキシメチルシクロヘキシル)メチルメタクリレート等のヒドロキシル基含有モノマー;スチレンスルホン酸、アリルスルホン酸、2−(メタ)アクリルアミド−2−メチルプロパンスルホン酸、(メタ)アクリルアミドプロパンスルホン酸、スルホプロピル(メタ)アクリレート、(メタ)アクリロイルオキシナフタレンスルホン酸等のスルホン酸基含有モノマー;(メタ)アクリルアミド、N,N−ジメチル(メタ)アクリルアミド、N−ブチル(メタ)アクリルアミド、N−メチロール(メタ)アクリルアミド、N−メチロールプロパン(メタ)アクリルアミド等の(N−置換)アミド系モノマー;(メタ)アクリル酸アミノエチル、(メタ)アクリル酸N,N−ジメチルアミノエチル、(メタ)アクリル酸t−ブチルアミノエチル等の(メタ)アクリル酸アミノアルキル系モノマー;(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸エトキシエチル等の(メタ)アクリル酸アルコキシアルキル系モノマー;N−シクロヘキシルマレイミド、N−イソプロピルマレイミド、N−ラウリルマレイミド、N−フェニルマレイミド等のマレイミド系モノマー;N−メチルイタコンイミド、N−エチルイタコンイミド、N−ブチルイタコンイミド、N−オクチルイタコンイミド、N−2−エチルヘキシルイタコンイミド、N−シクロヘキシルイタコンイミド、N−ラウリルイタコンイミド等のイタコンイミド系モノマー;N−(メタ)アクリロイルオキシメチレンスクシンイミド、N−(メタ)アクルロイル−6−オキシヘキサメチレンスクシンイミド、N−(メタ)アクリロイル−8−オキシオクタメチレンスクシンイミド等のスクシンイミド系モノマー;酢酸ビニル、プロピオン酸ビニル、N−ビニルピロリドン、メチルビニルピロリドン、ビニルピリジン、ビニルピペリドン、ビニルピリミジン、ビニルピペラジン、ビニルピラジン、ビニルピロール、ビニルイミダゾール、ビニルオキサゾール、ビニルモルホリン、N−ビニルカルボン酸アミド類、スチレン、α−メチルスチレン、N−ビニルカプロラクタム等のビニル系モノマー;アクリロニトリル、メタクリロニトリル等のシアノアクリレートモノマー;(メタ)アクリル酸グリシジル等のエポキシ基含有アクリル系モノマー;(メタ)アクリル酸ポリエチレングリコール、(メタ)アクリル酸ポリプロピレングリコール、(メタ)アクリル酸メトキシエチレングリコール、(メタ)アクリル酸メトキシポリプロピレングリコール等のグリコール系アクリルエステルモノマー;(メタ)アクリル酸テトラヒドロフルフリル、フッ素(メタ)アクリレート、シリコーン(メタ)アクリレート等の複素環、ハロゲン原子、ケイ素原子等を有するアクリル酸エステル系モノマー;ヘキサンジオールジ(メタ)アクリレート、(ポリ)エチレングリコールジ(メタ)アクリレート、(ポリ)プロピレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、ペンタエリスリトールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、エポキシアクリレート、ポリエステルアクリレート、ウレタンアクリレート等の多官能モノマー;イソプレン、ブタジエン、イソブチレン等のオレフィン系モノマー;ビニルエーテル等のビニルエーテル系モノマー等が挙げられる。これらのモノマーは、単独で、または2種以上組み合わせて用いてもよい。 The acrylic polymer contains a unit corresponding to another monomer copolymerizable with the (meth) acrylic acid alkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance, crosslinkability, etc. You may. Examples of such monomers include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acids such as maleic anhydride and icotanic anhydride. Anhydrous monomer; hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxy (meth) acrylate Hydroxyl group-containing monomers such as decyl, hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methylmethacrylate; styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropansulfonic acid, (meth). ) Sulfonic acid group-containing monomers such as acrylamide propanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid; (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) (N-substituted) amide-based monomers such as acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide; aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, (Meta) Aminoalkyl Acrylate Monomer such as t-butylaminoethyl (meth) Acrylic Acid; (Meth) Aluminoxyalkyl Acrylic Acid Monomer such as methoxyethyl (Meta) Acrylic Acid, ethoxyethyl (Meta) Acrylic Acid; N Maleimide-based monomers such as −cyclohexyl maleimide, N-isopropyl maleimide, N-lauryl maleimide, N-phenylmaleimide; N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N- Itaconimide-based monomers such as 2-ethylhexylitaconimide, N-cyclohexylitaconimide, N-laurylitaconimide; N- (meth) acryloyloxymethylene succinimide, N- (meth) accurloyl-6-oxyhexamethylene succinimide, N-( Meta) Succinimide-based monomers such as acryloyl-8-oxyoctamethylene succinimide; vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrroli Vinyls such as don, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazin, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholin, N-vinylcarboxylic acid amides, styrene, α-methylstyrene, N-vinylcaprolactam Monomer; Cyanoacrylate monomer such as acrylonitrile and methacrylonitrile; Epoxy group-containing acrylic monomer such as glycidyl (meth) acrylate; Polyethylene glycol (meth) acrylate, Polypropylene glycol (meth) acrylate, (meth) acrylic acid Glycol-based acrylic ester monomers such as methoxyethylene glycol and methoxypolypropylene glycol (meth) acrylate; heterocycles such as tetrahydrofurfuryl (meth) acrylate, fluorine (meth) acrylate and silicone (meth) acrylate, halogen atoms and silicon atoms. Acrylic acid ester-based monomers having the above; hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol Polyfunctional monomers such as di (meth) acrylate, trimethylolpropantri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, urethane acrylate; isoprene, butadiene, Olefin-based monomers such as isobutylene; vinyl ether-based monomers such as vinyl ether and the like can be mentioned. These monomers may be used alone or in combination of two or more.
1つの実施形態においては、上記アクリル系ポリマーは、極性官能基を有するモノマー由来の構成単位を含む。基材が脂肪酸アミドを含む場合、極性官能基を有するモノマー由来の構成単位を含むアクリル系ポリマーを用いれば、脂肪酸アミドの粘着剤層への移行を防止することができ、耐久性に優れる粘着シートを得ることができる。極性官能基を有するモノマー由来の構成単位の含有割合は、アクリル系ポリマー100重量部に対して、好ましくは0.01重量部〜40重量部であり、より好ましくは1重量部〜30重量部であり、さらに好ましくは2重量部〜20重量部であり、特に好ましくは3重量部〜15重量部である。上記極性官能基としては、例えば、カルボキシル基、ヒドロキシル基等が挙げられる。 In one embodiment, the acrylic polymer comprises a monomer-derived structural unit having a polar functional group. When the base material contains a fatty acid amide, if an acrylic polymer containing a structural unit derived from a monomer having a polar functional group is used, the transfer of the fatty acid amide to the pressure-sensitive adhesive layer can be prevented, and the pressure-sensitive adhesive sheet has excellent durability. Can be obtained. The content ratio of the structural unit derived from the monomer having a polar functional group is preferably 0.01 parts by weight to 40 parts by weight, and more preferably 1 part by weight to 30 parts by weight with respect to 100 parts by weight of the acrylic polymer. It is more preferably 2 parts by weight to 20 parts by weight, and particularly preferably 3 parts by weight to 15 parts by weight. Examples of the polar functional group include a carboxyl group and a hydroxyl group.
1つの実施形態においては、極性官能基を有するモノマーとして、(メタ)アクリル酸が用いられ得る。この実施形態において、(メタ)アクリル酸由来の構成単位の含有割合は、アクリル系ポリマー100重量部に対して、好ましくは1重量部〜40重量部であり、より好ましくは1重量部〜20重量部であり、さらに好ましくは1重量部〜10重量部である。 In one embodiment, (meth) acrylic acid can be used as the monomer having a polar functional group. In this embodiment, the content ratio of the structural unit derived from (meth) acrylic acid is preferably 1 part by weight to 40 parts by weight, more preferably 1 part by weight to 20 parts by weight, based on 100 parts by weight of the acrylic polymer. Parts, more preferably 1 part by weight to 10 parts by weight.
上記粘着剤は、必要に応じて、任意の適切な添加剤を含み得る。該添加剤としては、例えば、開始剤、架橋剤、粘着付与剤、可塑剤、顔料、染料、充填剤、老化防止剤、導電材、帯電防止剤、紫外線吸収剤、光安定剤、剥離調整剤、軟化剤、界面活性剤、難燃剤、酸化防止剤等が挙げられる。 The pressure-sensitive adhesive may optionally contain any suitable additive. Examples of the additive include an initiator, a cross-linking agent, a tackifier, a plasticizer, a pigment, a dye, a filler, an antiaging agent, a conductive material, an antistatic agent, an ultraviolet absorber, a light stabilizer, and a peeling conditioner. , Softeners, surfactants, flame retardants, antioxidants and the like.
1つの実施形態においては、上記粘着剤は、架橋剤を含む。 In one embodiment, the pressure-sensitive adhesive comprises a cross-linking agent.
上記架橋剤としては、例えば、イソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤、過酸化物系架橋剤の他、尿素系架橋剤、金属アルコキシド系架橋剤、金属キレート系架橋剤、金属塩系架橋剤、カルボジイミド系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、アミン系架橋剤などが挙げられる。なかでも好ましくは、イソシアネート系架橋剤またはエポキシ系架橋剤である。 Examples of the cross-linking agent include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, and metals. Examples thereof include salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, and amine-based cross-linking agents. Of these, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is preferable.
上記イソシアネート系架橋剤の具体例としては、ブチレンジイソシアネート、ヘキサメチレンジイソシアネート等の低級脂肪族ポリイソシアネート類;シクロペンチレンジイソシアネート、シクロへキシレンジイソシアネート、イソホロンジイソシアネート等の脂環族イソシアネート類;2,4−トリレンジイソシアネート、4,4’−ジフェニルメタンジイソシアネート、キシリレンジイソシアネート等の芳香族イソシアネート類;トリメチロールプロパン/トリレンジイソシアネート3量体付加物(日本ポリウレタン工業社製、商品名「コロネートL」)、トリメチロールプロパン/へキサメチレンジイソシアネート3量体付加物(日本ポリウレタン工業社製、商品名「コロネートHL」)、ヘキサメチレンジイソシアネートのイソシアヌレート体(日本ポリウレタン工業社製、商品名「コロネートHX」)等のイソシアネート付加物;等が挙げられる。イソシアネート系架橋剤の含有量は、所望とする粘着力、粘着剤層の弾性等に応じて、任意の適切な量に設定され得、ベースポリマー100重量部に対して、代表的には0.1重量部〜20重量部であり、より好ましくは0.5重量部〜10重量部である。 Specific examples of the isocyanate-based cross-linking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; 2,4- Aromatic isocyanates such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylolpropane / tolylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L") Methylolpropane / hexamethylene diisocyanate trimeric adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), isocyanurate of hexamethylene diisocyanate (manufactured by Japan Polyurethane Industry Co., Ltd., trade name "Coronate HX"), etc. Isocyanate adduct; etc. The content of the isocyanate-based cross-linking agent can be set to an arbitrary appropriate amount according to the desired adhesive strength, elasticity of the pressure-sensitive adhesive layer, etc., and is typically 0. It is 1 part by weight to 20 parts by weight, more preferably 0.5 part by weight to 10 parts by weight.
前記エポキシ系架橋剤としては、例えば、N,N,N’,N’−テトラグリシジル−m−キシレンジアミン、ジグリシジルアニリン、1,3−ビス(N,N−グリシジルアミノメチル)シクロヘキサン(三菱ガス化学社製、商品名「テトラッドC」)、1,6−ヘキサンジオールジグリシジルエーテル(共栄社化学社製、商品名「エポライト1600」)、ネオペンチルグリコールジグリシジルエーテル(共栄社化学社製、商品名「エポライト1500NP」)、エチレングリコールジグリシジルエーテル(共栄社化学社製、商品名「エポライト40E」)、プロピレングリコールジグリシジルエーテル(共栄社化学社製、商品名「エポライト70P」)、ポリエチレングリコールジグリシジルエーテル(日本油脂社製、商品名「エピオールE−400」)、ポリプロピレングリコールジグリシジルエーテル(日本油脂社製、商品名「エピオールP−200」)、ソルビトールポリグリシジルエーテル(ナガセケムテックス社製、商品名「デナコール EX−611」)、グリセロールポリグリシジルエーテル(ナガセケムテックス社製、商品名「デナコール EX−314」)、ペンタエリスリトールポリグリシジルエーテル、ポリグリセロールポリグリシジルエーテル(ナガセケムテックス社製、商品名「デナコール EX−512」)、ソルビタンポリグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、アジピン酸ジグリシジルエステル、o−フタル酸ジグリシジルエステル、トリグリシジル−トリス(2−ヒドロキシエチル)イソシアヌレート、レゾルシンジグリシジルエーテル、ビスフェノール−S−ジグリシジルエーテル、分子内にエポキシ基を2つ以上有するエポキシ系樹脂等が挙げられる。エポキシ系架橋剤の含有量は、所望とする粘着力、粘着剤層の弾性等に応じて、任意の適切な量に設定され得、ベースポリマー100重量部に対して、代表的には0.01重量部〜10重量部であり、より好ましくは0.03重量部〜5重量部である。 Examples of the epoxy-based cross-linking agent include N, N, N', N'-tetraglycidyl-m-xylene diamine, diglycidyl aniline, and 1,3-bis (N, N-glycidyl aminomethyl) cyclohexane (Mitsubishi Gas). Chemical Co., Ltd., trade name "Tetrad C"), 1,6-hexanediol diglycidyl ether (Kyoeisha Chemical Co., Ltd., trade name "Epolite 1600"), neopentyl glycol diglycidyl ether (Kyoeisha Chemical Co., Ltd., trade name " Epolite 1500NP "), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name" Epolite 40E "), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name" Epolite 70P "), polyethylene glycol diglycidyl ether (Japan Oil and fat company, product name "Epiol E-400"), polypropylene glycol diglycidyl ether (Japan Oil and Fat Co., product name "Epiol P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX, product name "Denacol" EX-611 "), glycerol polyglycidyl ether (manufactured by Nagase ChemteX, trade name" Denacol EX-314 "), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase Chemtex, trade name" Denacol EX ") -512 "), sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcin diglycidyl ether, bisphenol Examples thereof include −S—diglycidyl ether and epoxy resins having two or more epoxy groups in the molecule. The content of the epoxy-based cross-linking agent can be set to an arbitrary appropriate amount according to the desired adhesive strength, elasticity of the pressure-sensitive adhesive layer, etc., and is typically 0. It is 01 parts by weight to 10 parts by weight, more preferably 0.03 parts by weight to 5 parts by weight.
上記粘着剤層の厚さは、好ましくは1μm〜50μmであり、より好ましくは1μm〜30μmであり、さらに好ましくは2μm〜20μmである。 The thickness of the pressure-sensitive adhesive layer is preferably 1 μm to 50 μm, more preferably 1 μm to 30 μm, and further preferably 2 μm to 20 μm.
上記粘着剤層のナノインデンテーション法による弾性率は、好ましくは0.005〜5MPaであり、より好ましくは0.01〜2MPaである。このような範囲であれば、基材の伸縮性を阻害し難い粘着剤層を形成することができ、本発明の効果がより顕著となる。また、適切な粘着力を有する粘着剤層を形成することができる。上記弾性率は、例えば、粘着剤層に含まれる粘着剤の組成;粘着剤のベースポリマーとなる樹脂材料の種類、分子量、架橋度等により調整することができる。なお、ナノインデンテーション法による弾性率とは、圧子を試料(熱膨張性微小球が存在しない箇所)に押し込んだときの、圧子への負荷荷重と押し込み深さとを負荷時、除荷時にわたり連続的に測定し、得られた負荷荷重−押し込み深さ曲線から求められる。本明細書において、ナノインデンテーション法による弾性率とは、測定条件を荷重:1mN、負荷・除荷速度:0.1mN/s、保持時間:1s、環境温度:23℃として上記のように測定した弾性率をいう。 The elastic modulus of the pressure-sensitive adhesive layer by the nanoindentation method is preferably 0.005 to 5 MPa, more preferably 0.01 to 2 MPa. Within such a range, an adhesive layer that does not easily inhibit the elasticity of the base material can be formed, and the effect of the present invention becomes more remarkable. In addition, a pressure-sensitive adhesive layer having an appropriate adhesive strength can be formed. The elastic modulus can be adjusted, for example, by the composition of the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer; the type of resin material used as the base polymer of the pressure-sensitive adhesive, the molecular weight, the degree of cross-linking, and the like. The elastic modulus according to the nanoindentation method refers to the load on the indenter and the pushing depth when the indenter is pushed into the sample (where the thermally expandable microspheres do not exist) continuously during loading and unloading. It is obtained from the obtained load-push depth curve. In the present specification, the elastic modulus by the nanoindentation method is measured as described above under the measurement conditions of load: 1 mN, load / unloading speed: 0.1 mN / s, holding time: 1s, and environmental temperature: 23 ° C. The elastic modulus.
D.粘着シートの製造方法
本発明の粘着シートは、任意の適切な方法により製造することができる。本発明の粘着シートは、基材上に粘着剤層を形成して得られ得る。粘着剤層の形成方法としては、例えば、基材上に粘着剤を塗工する方法、任意の適切なフィルム上に、粘着剤を塗工し形成された塗工層を中間層に転写する方法等が挙げられる。
D. Method for Producing Adhesive Sheet The adhesive sheet of the present invention can be produced by any suitable method. The pressure-sensitive adhesive sheet of the present invention can be obtained by forming a pressure-sensitive adhesive layer on a base material. Examples of the method for forming the pressure-sensitive adhesive layer include a method of applying a pressure-sensitive adhesive on a base material, and a method of transferring a coating layer formed by applying a pressure-sensitive adhesive on an arbitrary suitable film to an intermediate layer. And so on.
上記粘着剤の塗工方法としては、任意の適切な塗工方法が採用され得る。例えば、塗布した後に乾燥して各層を形成することができる。塗布方法としては、例えば、マルチコーター、ダイコーター、グラビアコーター、アプリケーター等を用いた塗布方法が挙げられる。乾燥方法としては、例えば、自然乾燥、加熱乾燥等が挙げられる。 Any suitable coating method can be adopted as the coating method of the pressure-sensitive adhesive. For example, each layer can be formed by applying and then drying. Examples of the coating method include a coating method using a multi-coater, a die coater, a gravure coater, an applicator, and the like. Examples of the drying method include natural drying and heat drying.
E.用途
本発明の粘着シートは、電子部品を製造する際に、電子部品材料を仮固定するためのシートとして、好適に用いられ得る。1つの実施形態においては、本発明の粘着シートは、チップピックアップ用の粘着シートとして用いられ得る。電子部品材料を切断する際の仮固定シートとして用いられる。該電子部品材料としては、例えば、半導体チップ、LEDチップ、セラミックコンデンサ等が挙げられる。
E. Applications The adhesive sheet of the present invention can be suitably used as a sheet for temporarily fixing an electronic component material when manufacturing an electronic component. In one embodiment, the pressure-sensitive adhesive sheet of the present invention can be used as a pressure-sensitive adhesive sheet for chip pickup. It is used as a temporary fixing sheet when cutting electronic component materials. Examples of the electronic component material include semiconductor chips, LED chips, ceramic capacitors and the like.
以下、実施例によって本発明を具体的に説明するが、本発明はこれら実施例によって限定されるものではない。実施例における評価方法は以下のとおりである。なお、下記評価においては、セパレータを剥離した粘着シートを用いた。また、実施例において、特に明記しない限り、「部」および「%」は重量基準である。 Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. The evaluation method in the examples is as follows. In the following evaluation, an adhesive sheet from which the separator was peeled off was used. Further, in the examples, unless otherwise specified, "parts" and "%" are based on weight.
(1)復元率
幅10mm、長さ100mmの粘着シート片に対して、初期評点間距離L0=50mmの標線を長さ方向に記入した。23℃の環境温度下で、チャック間距離70mmで引っ張り試験機にセットし、引張速度300mm/minで150%(チャック間距離:145mm)まで伸長させ、伸長状態を5分間保持した後、伸長評点間距離L1を測定した。その後張力を開放して5分後の評点間距離Lを測定し、下記の式により復元率(%)を求めた。
復元率(%)={(伸長評点間距離L1−評点間距離L)/(伸長評点間距離L1−初期評点間距離L0)}×100
復元率は、所定方向Iと当該方向Iに直交する方向IIとの2サンプルについて測定した。
また、40℃の環境温度下で、上記の方法により粘着シートを伸縮させて、復元率を求めた。
(1) Restoration rate For the adhesive sheet piece having a width of 10 mm and a length of 100 mm, a marked line with an initial score distance L 0 = 50 mm was drawn in the length direction. Under an environmental temperature of 23 ° C., it was set in a tensile tester at a distance between chucks of 70 mm, stretched to 150% (distance between chucks: 145 mm) at a tensile speed of 300 mm / min, held in an stretched state for 5 minutes, and then stretched. The distance L 1 was measured. After that, the tension was released and the distance L between the scores was measured 5 minutes later, and the restoration rate (%) was calculated by the following formula.
Restoration rate (%) = {(distance between extended grades L 1- distance between grades L) / (distance between extended grades L 1- distance between initial grades L 0 )} × 100
The recovery rate was measured for two samples in a predetermined direction I and a direction II orthogonal to the direction I.
Further, the pressure-sensitive adhesive sheet was expanded and contracted by the above method under an environmental temperature of 40 ° C. to determine the restoration rate.
(2)動摩擦力
テーブルの上に粘着テープを基材フィルム面が上になるように貼り付け、その上にSUS304板(重さ200g、63mm×63mm)を基材フィルム面と接触するように置き、基材フィルム面上でSUS304板を移動(100mm/min)させ、その時発生した平均荷重(N)を計測し、これを動摩擦力とした。
(2) Dynamic friction force Adhesive tape is attached on the table so that the base film surface faces up, and a SUS304 plate (weight 200 g, 63 mm x 63 mm) is placed on it so as to come into contact with the base film surface. The SUS304 plate was moved (100 mm / min) on the surface of the base film, and the average load (N) generated at that time was measured and used as the dynamic friction force.
[実施例1]
2−エチルヘキシルアクリレート(2EHA)/アクリル酸(AA)=90/10(重量比)から構成されるアクリル系ポリマー100重量部、ポリイソシアネート系架橋剤(商品名「コロネートL」、日本ポリウレタン社製)5重量部と、グリシジルアミン系架橋剤(商品名「TETRAD−C」、三菱瓦斯化学社製)0.05重量部、および酢酸エチルを含む粘着剤を調製した。この粘着剤を、片面をシリコーンで剥離処理した厚さ38μmのポリエステルフィルム(商品名:MRF、三菱化学ポリエステル株式会社製)の剥離処理面に塗布し、120℃で2分間加熱して、厚さ20μmの粘着剤層を形成した。次いで、当該粘着剤層面に、基材としてのステアリン酸アミドを0.1重量部含有したポリウレタン系フィルムA(厚さ:70μm、大石産業社製)に転写し、50℃にて48時間保存し、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Example 1]
100 parts by weight of acrylic polymer composed of 2-ethylhexyl acrylate (2EHA) / acrylic acid (AA) = 90/10 (weight ratio), polyisocyanate-based cross-linking agent (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) A pressure-sensitive adhesive containing 5 parts by weight, 0.05 parts by weight of a glycidylamine-based cross-linking agent (trade name “TETRAD-C”, manufactured by Mitsubishi Gas Chemicals, Inc.), and ethyl acetate was prepared. This adhesive is applied to the peeled surface of a 38 μm-thick polyester film (trade name: MRF, manufactured by Mitsubishi Chemical Polyester Co., Ltd.) whose one side is peeled with silicone, and heated at 120 ° C. for 2 minutes to achieve the thickness. A 20 μm pressure-sensitive adhesive layer was formed. Next, the pressure-sensitive adhesive layer surface was transferred to a polyurethane-based film A (thickness: 70 μm, manufactured by Oishi Sangyo Co., Ltd.) containing 0.1 parts by weight of stearic acid amide as a base material, and stored at 50 ° C. for 48 hours for adhesion. I got a sheet.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[実施例2]
基材として、ポリウレタン系フィルムB(厚さ:60μm、日本マタイ社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Example 2]
An adhesive sheet was obtained in the same manner as in Example 1 except that a polyurethane film B (thickness: 60 μm, manufactured by Nihon Matai Co., Ltd.) was used as the base material.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[実施例3]
基材として、ステアリン酸アミドを0.05重量部含有したポリプロピレン系エラストマー(PPエラストマー)フィルム(厚さ:100μm、日東電工社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Example 3]
Adhesive in the same manner as in Example 1 except that a polypropylene-based elastomer (PP elastomer) film (thickness: 100 μm, manufactured by Nitto Denko KK) containing 0.05 parts by weight of stearic acid amide was used as the base material. I got a sheet.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[実施例4]
基材として、ポリエチレン(PE;厚さ:10μm)/スチレン系エラストマー(Stエラストマー;厚さ:60μm)フィルム/ポリエチレン(厚さ:10μm)からなる積層体(厚さ:80μm、日本マタイ社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Example 4]
Laminated body made of polyethylene (PE; thickness: 10 μm) / styrene elastomer (St elastomer; thickness: 60 μm) film / polyethylene (thickness: 10 μm) as a base material (thickness: 80 μm, manufactured by Nihon Matai Co., Ltd.) An adhesive sheet was obtained in the same manner as in Example 1 except that the above was used.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[実施例5]
基材として、エチレン酢酸ビニル共重合体フィルム(EVA;厚さ:10μm)/スチレン系エラストマーフィルム(厚さ:60μm)/エチレン酢酸ビニル共重合体フィルム(厚さ:10μm)からなる積層体(厚さ:80μm、日本マタイ社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Example 5]
A laminate (thickness) composed of an ethylene-vinyl acetate copolymer film (EVA; thickness: 10 μm) / styrene-based elastomer film (thickness: 60 μm) / ethylene-vinyl acetate copolymer film (thickness: 10 μm) as a base material. An adhesive sheet was obtained in the same manner as in Example 1 except that 80 μm (manufactured by Nihon Matai Co., Ltd.) was used.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[比較例1]
基材として、ステアリン酸アミド0.7重量部含有ポリ塩化ビニルフィルム(PVC;厚さ:70μm、ダイヤプラス社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Comparative Example 1]
An adhesive sheet was obtained in the same manner as in Example 1 except that a polyvinyl chloride film (PVC; thickness: 70 μm, manufactured by Diaplus) containing 0.7 parts by weight of stearic acid amide was used as a base material. ..
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[比較例2]
基材として、ポリエチレンフィルム(PE;厚さ:100μm、日東電工社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Comparative Example 2]
An adhesive sheet was obtained in the same manner as in Example 1 except that a polyethylene film (PE; thickness: 100 μm, manufactured by Nitto Denko KK) was used as a base material.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[比較例3]
基材として、ポリプロピレンフィルム(PP;厚さ:55μm)/ポリエチレンフィルム(PE;厚さ:25μm)からなる積層体(厚さ:80μm、大倉工業社製)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Comparative Example 3]
Example 1 except that a laminate (thickness: 80 μm, manufactured by Okura Industrial Co., Ltd.) made of polypropylene film (PP; thickness: 55 μm) / polyethylene film (PE; thickness: 25 μm) was used as the base material. An adhesive sheet was obtained in the same manner as above.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
[比較例4]
基材として、エチレン酢酸ビニル共重合体フィルム(厚さ:100μm、日東電工社製)を用いたこと以外は、実施例1と同様にして粘着シートを得た。
得られた粘着シートを上記(1)および(2)の評価に供した。結果を表1に示す。
[Comparative Example 4]
An adhesive sheet was obtained in the same manner as in Example 1 except that an ethylene-vinyl acetate copolymer film (thickness: 100 μm, manufactured by Nitto Denko KK) was used as a base material.
The obtained adhesive sheet was subjected to the evaluations of (1) and (2) above. The results are shown in Table 1.
表1に示すように、本願発明によれば、復元率の高い粘着シートを得ることができる。このような粘着シートをチップのピックアップに用いれば、粘着シート上に配置された複数あるチップを、数回に分けてピックアップする場合、ピックアップの際には当該粘着シートを伸長させて、一部のチップを良好にピックアップすることができ、その後には、粘着シートが収縮復元して良好な保管性が実現される。 As shown in Table 1, according to the present invention, an adhesive sheet having a high restoration rate can be obtained. When such an adhesive sheet is used for picking up chips, when a plurality of chips arranged on the adhesive sheet are picked up in several times, the adhesive sheet is stretched at the time of picking up, and a part of the adhesive sheet is extended. The chips can be picked up well, after which the adhesive sheet shrinks and restores to achieve good storage.
10 基材
20 粘着剤層
100 粘着シート
10
Claims (8)
23℃の環境下において、張力をかけて該粘着シートを150%伸長させた状態で5分間保持し、張力を開放した際の寸法復元率が、伸長前の該粘着シートを基準として80%以上である、
粘着シート。 A pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer arranged on at least one side of the base material.
In an environment of 23 ° C., the pressure-sensitive adhesive sheet is held for 5 minutes in a state of being stretched by 150% under tension, and the dimensional restoration rate when the tension is released is 80% or more based on the pressure-sensitive adhesive sheet before stretching. Is,
Adhesive sheet.
The pressure-sensitive adhesive sheet according to claim 8, wherein the content ratio of the (meth) acrylic acid is 1 part by weight to 20 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.
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TW109125549A TW202113006A (en) | 2019-08-05 | 2020-07-29 | Adhesive sheet the size recovery rate is 80% or more relative to the adhesive sheet before being stretched |
CN202010773237.9A CN112322204A (en) | 2019-08-05 | 2020-08-04 | Adhesive sheet |
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WO2014103468A1 (en) * | 2012-12-28 | 2014-07-03 | リンテック株式会社 | Dicing-sheet substrate film and dicing sheet |
WO2016075753A1 (en) * | 2014-11-11 | 2016-05-19 | 株式会社寺岡製作所 | Adhesive tape having foamed resin base material, and method for producing same |
JP2017171772A (en) * | 2016-03-23 | 2017-09-28 | 日東電工株式会社 | Pressure sensitive adhesive sheet |
WO2018003312A1 (en) * | 2016-06-30 | 2018-01-04 | リンテック株式会社 | Semiconductor processing sheet |
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JP2001207140A (en) | 2000-01-26 | 2001-07-31 | Sumitomo Bakelite Co Ltd | Adhesive tape for processing semiconductor wafer |
JP2010260893A (en) | 2009-04-30 | 2010-11-18 | Nitto Denko Corp | Laminated film and method for producing semiconductor device |
JP6587811B2 (en) * | 2015-02-24 | 2019-10-09 | 日東電工株式会社 | Thermally peelable adhesive sheet |
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2019
- 2019-08-05 JP JP2019143869A patent/JP2021024950A/en active Pending
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2020
- 2020-07-29 KR KR1020200094279A patent/KR20210018078A/en not_active Application Discontinuation
- 2020-07-29 TW TW109125549A patent/TW202113006A/en unknown
- 2020-08-04 CN CN202010773237.9A patent/CN112322204A/en active Pending
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JPS6269640A (en) * | 1985-09-24 | 1987-03-30 | Nippon Carbide Ind Co Ltd | Adhesive film for wafer dicing |
JPH03171627A (en) * | 1989-08-01 | 1991-07-25 | Mitsui Toatsu Chem Inc | Wafer processing film |
JP2004303999A (en) * | 2003-03-31 | 2004-10-28 | Lonseal Corp | Adhesive tape for wafer dicing |
JP2007314636A (en) * | 2006-05-24 | 2007-12-06 | Nitto Denko Corp | Pressure-sensitive adhesive sheet |
WO2014003312A1 (en) * | 2012-06-27 | 2014-01-03 | 주식회사 트루윈 | Gap correction inductance type angle sensor, and signal processing method for same |
WO2014103468A1 (en) * | 2012-12-28 | 2014-07-03 | リンテック株式会社 | Dicing-sheet substrate film and dicing sheet |
WO2016075753A1 (en) * | 2014-11-11 | 2016-05-19 | 株式会社寺岡製作所 | Adhesive tape having foamed resin base material, and method for producing same |
JP2017171772A (en) * | 2016-03-23 | 2017-09-28 | 日東電工株式会社 | Pressure sensitive adhesive sheet |
WO2018003312A1 (en) * | 2016-06-30 | 2018-01-04 | リンテック株式会社 | Semiconductor processing sheet |
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JP7096417B1 (en) | 2021-12-06 | 2022-07-05 | ニチバン株式会社 | Adhesive tape |
JP2023084028A (en) * | 2021-12-06 | 2023-06-16 | ニチバン株式会社 | Adhesive tape |
Also Published As
Publication number | Publication date |
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CN112322204A (en) | 2021-02-05 |
TW202113006A (en) | 2021-04-01 |
KR20210018078A (en) | 2021-02-17 |
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