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JP2021086685A - Circuit board for mounting led and belt-like flexible led light - Google Patents

Circuit board for mounting led and belt-like flexible led light Download PDF

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JP2021086685A
JP2021086685A JP2019213390A JP2019213390A JP2021086685A JP 2021086685 A JP2021086685 A JP 2021086685A JP 2019213390 A JP2019213390 A JP 2019213390A JP 2019213390 A JP2019213390 A JP 2019213390A JP 2021086685 A JP2021086685 A JP 2021086685A
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led
power supply
circuit board
mounting
terminal
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山口 亮
Akira Yamaguchi
亮 山口
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Atex Co Ltd
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Atex Co Ltd
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Abstract

To provide a thin and narrow width circuit board for mounting LED, and a belt-like flexible LED light using the same.SOLUTION: A circuit board 10 for mounting LED includes a base board 20 having insulation property and flexibility, and a wiring pattern 30 formed on the base board 20. The wiring pattern 30 includes a first power supply part 31 and a second power supply part 32 formed at both sides in a width direction W of the base board 20, for supplying current to an LED 50 and a part mounting part 33 located between the first power supply part 31 and the second power supply part 32, for mounting the LED 50, which are formed on one side of the base board 20. The first power supply part 31 and the second power supply part 32 can be formed in narrow width and thin thickness when forming an LED lighting unit by being folded back to the reverse side of the part mounting part 33.SELECTED DRAWING: Figure 1

Description

本発明は、可撓性を有する帯状基板により形成されたLED実装用回路基板と、このLED実装用回路基板にLEDが実装され、ケースに収納された帯状フレキシブルLEDライトに関するものである。 The present invention relates to an LED mounting circuit board formed of a flexible strip-shaped substrate, and a strip-shaped flexible LED light in which an LED is mounted on the LED mounting circuit board and housed in a case.

各種の屋外、屋内の照明、電飾、誘導灯等に、帯状のLED照明装置が使用されることがある。例えば、特許文献1に記載のLED実装用回路基板、帯状フレキシブルLEDライトおよびそれを用いたLED照明装置は、フレキシブル基板の幅方向の中央部に複数のLEDがアレイ状に実装されるLED実装部が設けられ、LEDに電流を流すための給電パターンが形成された第1の基板および第2の基板が設けられている。
この第1の基板および第2の基板は、その裏面同士が接着され、一体化して一枚の可撓性の板とし、かつ断面T字状となるようにして発光ユニットが形成されている。
Band-shaped LED lighting devices may be used for various outdoor and indoor lighting, illuminations, guide lights, and the like. For example, the LED mounting circuit board, the band-shaped flexible LED light, and the LED lighting device using the same as described in Patent Document 1 are LED mounting portions in which a plurality of LEDs are mounted in an array in the central portion in the width direction of the flexible board. Is provided, and a first substrate and a second substrate on which a power supply pattern for passing a current through the LED is formed are provided.
The back surfaces of the first substrate and the second substrate are adhered to each other, and the light emitting unit is formed so as to be integrated into one flexible plate and to have a T-shaped cross section.

また、可撓性を有する基板を折り曲げる技術に関して、特許文献2に記載のものが知られている。
特許文献2に記載の多針電極は、絶縁性を有する可撓性基板上に導電性材料による多数の平行線パターンが設けられ、平行線の一方の端面を針電極として利用するものである。この多針電極は、各電極線にほぼ平行な方向に沿って、互いが逆方向に折り曲げられている。
Further, a technique described in Patent Document 2 is known as a technique for bending a flexible substrate.
The multi-needle electrode described in Patent Document 2 is provided with a large number of parallel line patterns made of a conductive material on a flexible substrate having an insulating property, and one end face of the parallel lines is used as a needle electrode. The multi-needle electrodes are bent in opposite directions along a direction substantially parallel to each electrode line.

特開2013−118169号公報Japanese Unexamined Patent Publication No. 2013-118169 特開昭58−199157号公報Japanese Unexamined Patent Publication No. 58-199157

特許文献1に記載のLED実装用回路基板、帯状フレキシブルLEDライトおよびそれを用いたLED照明装置では、第1の基板および第2の基板の裏面同士が接着されて断面T字状に形成されているため、発光ユニットの高さが高くなってしまう。第1の基板および第2の基板をLED実装部から折り曲げずにそのままの状態とすると、T字状とするより遥かに薄く形成することができるが、T字状とするより幅が広くなってしまう。 In the LED mounting circuit board, the strip-shaped flexible LED light, and the LED lighting device using the same as described in Patent Document 1, the back surfaces of the first substrate and the second substrate are adhered to each other to form a T-shaped cross section. Therefore, the height of the light emitting unit becomes high. If the first substrate and the second substrate are left as they are without being bent from the LED mounting portion, they can be formed much thinner than the T-shape, but the width becomes wider than the T-shape. It ends up.

フレキシブル基板を多層基板で構成し、LED実装部の配線パターンと、第1の基板および第2の基板の配線パターンとが上下の関係となるように配線することで、幅狭に形成することができるが、そうすると、フレキシブル基板のコストが大幅に増大してしまう。 The flexible substrate can be formed into a narrow width by configuring the flexible substrate with a multilayer substrate and wiring the wiring pattern of the LED mounting portion so that the wiring patterns of the first substrate and the second substrate are in a vertical relationship. However, doing so would significantly increase the cost of the flexible substrate.

特許文献2に記載の多針電極では、各電極線にほぼ平行な方向に沿って、互いが逆方向に基板が折り曲げられているので、この基板を一面側にLEDを実装する配線基板に適用しようとすると、折り曲げられるいずれかの基板が、LEDを覆うことになってしまう。 In the multi-needle electrode described in Patent Document 2, since the substrate is bent in opposite directions along the direction substantially parallel to each electrode line, this substrate is applied to a wiring board for mounting an LED on one side. If you try, one of the bendable substrates will cover the LED.

そこで本発明は、厚みが薄く、幅方向に細いLED実装用回路基板およびそれを用いた帯状フレキシブルLEDライトを提供することを目的とする。 Therefore, an object of the present invention is to provide a circuit board for mounting an LED, which is thin in thickness and thin in the width direction, and a band-shaped flexible LED light using the same.

本発明のLED実装用回路基板は、絶縁性および可撓性を有する帯状のベース基板と、前記ベース基板に形成された配線パターンとを備え、前記配線パターンは、前記ベース基板の幅方向の両側端部に形成され、LEDに電流を供給するための一対の電源部と、前記一対の電源部の間に位置し、前記LEDが実装される部品実装部とが、前記ベース基板の一方の面に形成され、前記一対の電源部は、前記部品実装部の裏面側に折り返されたことを特徴とする。 The circuit board for mounting LEDs of the present invention includes a strip-shaped base substrate having insulation and flexibility, and a wiring pattern formed on the base substrate, and the wiring pattern is provided on both sides of the base substrate in the width direction. A pair of power supply units formed at the ends for supplying current to the LEDs and a component mounting unit located between the pair of power supply units and on which the LEDs are mounted are one surface of the base substrate. The pair of power supply units are folded back to the back surface side of the component mounting unit.

本発明のLED実装用回路基板においては、配線パターンは、LEDに電流を供給するための一対の電源部と、LEDが実装される部品実装部とが、ベース基板の一方の面に形成されている。そして、ベース基板の幅方向の両側端部に形成された一対の電源部が、一対の電源部の間に位置する部品実装部の裏面側に折り返されている。そのため、LEDをおもて面に向けたまま、部品実装部の配線パターンと、一対の電源部の配線パターンとを、立体的に配線できる。 In the LED mounting circuit board of the present invention, in the wiring pattern, a pair of power supply parts for supplying a current to the LED and a component mounting part on which the LED is mounted are formed on one surface of the base board. There is. Then, a pair of power supply units formed at both end portions in the width direction of the base substrate are folded back to the back surface side of the component mounting portion located between the pair of power supply units. Therefore, the wiring pattern of the component mounting portion and the wiring pattern of the pair of power supply portions can be three-dimensionally wired while the LED is facing the front surface.

前記一対の電源部の幅の合計は、前記部品実装部の幅より短くすることができる。一対の電源部を部品実装部の裏面側に折り返しても、一対の電源部の幅の合計が、部品実装部の幅より短いため、一対の電源部同士が重ならない。従って、一対の電源部同士が重なり、短絡してしまうことを防止することができる。 The total width of the pair of power supply units can be shorter than the width of the component mounting unit. Even if the pair of power supply units is folded back to the back surface side of the component mounting unit, the total width of the pair of power supply units is shorter than the width of the component mounting unit, so that the pair of power supply units do not overlap each other. Therefore, it is possible to prevent the pair of power supply units from overlapping each other and causing a short circuit.

前記一対の電源部には、一対の電源線が接続される接続部が形成されたものとすることができる。一対の電源部に一対の電源線が接続されていても、一対の電源部の幅の合計が、部品実装部の幅より短いため、一対の電源線が短絡することを防止することができる。 The pair of power supply units may be formed with a connection portion to which the pair of power supply lines are connected. Even if a pair of power supply lines are connected to the pair of power supply units, the total width of the pair of power supply units is shorter than the width of the component mounting portion, so that it is possible to prevent the pair of power supply lines from being short-circuited.

前記一対の電源部と、前記部品実装部との間に、非配線領域が形成されたものとすることができる。非配線領域に配線パターンが形成されていないため、非配線領域を折り目とすることにより、薄いベース基板を折り曲げることになるので、容易に一対の電源部を折り返すことができる。 It is possible that a non-wiring region is formed between the pair of power supply units and the component mounting unit. Since the wiring pattern is not formed in the non-wiring region, the thin base substrate is bent by making the non-wiring region a crease, so that the pair of power supply units can be easily folded back.

本発明の帯状フレキシブルLEDライトは、本発明のLED実装用回路基板が挿入されるチューブ状のケースを備えたことを特徴とする。 The strip-shaped flexible LED light of the present invention is characterized by including a tubular case into which the circuit board for mounting the LED of the present invention is inserted.

本発明のLED実装用回路基板を薄く幅狭く形成することができるため、ケースを細くした帯状フレキシブルLEDライトを得ることができる。 Since the circuit board for mounting the LED of the present invention can be formed thin and narrow, a strip-shaped flexible LED light having a thin case can be obtained.

前記ケースには、LEDが実装されたLED実装用回路基板の裏面側に、前記LED実装用回路基板の長さ方向に沿った溝が形成されたものとすることができる。本発明のLED実装用回路基板をケースに挿入して、充填材をケースに充填する場合でも、ケースにおけるLED実装用回路基板の裏面側に、溝が形成されているため、充填材をこの溝に伝わらせてケースの奥側まで行き渡らせることができる。 In the case, a groove along the length direction of the LED mounting circuit board may be formed on the back surface side of the LED mounting circuit board on which the LED is mounted. Even when the LED mounting circuit board of the present invention is inserted into the case and the filler is filled in the case, since a groove is formed on the back surface side of the LED mounting circuit board in the case, the filler is filled with this groove. It can be transmitted to the back of the case.

本発明は、LEDをおもて面に向けたまま、部品実装部の配線パターンと、一対の電源部の配線パターンとが、立体的に配線できるので、単層基板であっても配線することができるため、厚みが薄く、幅方向に細いLED実装用回路基板および帯状フレキシブルLEDライトとすることができる。 In the present invention, the wiring pattern of the component mounting portion and the wiring pattern of the pair of power supply portions can be three-dimensionally wired while the LED is facing the front surface, so that even a single-layer board can be wired. Therefore, the LED mounting circuit board and the strip-shaped flexible LED light, which are thin in thickness and thin in the width direction, can be obtained.

本発明の実施の形態に係るLED実装用回路基板を示す図である。It is a figure which shows the circuit board for LED mounting which concerns on embodiment of this invention. 図1に示すLED実装用回路基板の等価回路を示す図である。It is a figure which shows the equivalent circuit of the circuit board for LED mounting shown in FIG. 図1に示すLED実装用回路基板の一部拡大図である。It is a partially enlarged view of the circuit board for LED mounting shown in FIG. 本発明の実施の形態に係る帯状フレキシブルLEDライトを示す図である。It is a figure which shows the band-shaped flexible LED light which concerns on embodiment of this invention. 図1に示すLED実装用回路基板の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the circuit board for LED mounting shown in FIG.

本発明の実施の形態に係るLED実装用回路基板およびそれを用いた帯状フレキシブルLEDライトを図面に基づいて説明する。まず、LED実装用回路基板を図1に基づいて説明する。 An LED mounting circuit board according to an embodiment of the present invention and a band-shaped flexible LED light using the same will be described with reference to the drawings. First, the LED mounting circuit board will be described with reference to FIG.

(LED実装用回路基板の構成)
LED実装用回路基板は、LEDを実装して帯状のLEDライトを形成するフレキシブル基板である。図1に示すLED実装用回路基板10は、1単位分を示すものである。LED実装用回路基板10が連続した長尺状のものから、所望とする長さのものを切り出すことができるよう、1単位分のLED実装用回路基板10の両端部には「CUT」と切断位置を示す表示が印刷されている。また、LEDのアノードが接続される「+」と、カソードが接続される「−」とが表示されている。
(Configuration of circuit board for LED mounting)
The LED mounting circuit board is a flexible board on which LEDs are mounted to form a band-shaped LED light. The LED mounting circuit board 10 shown in FIG. 1 represents one unit. One unit of LED mounting circuit board 10 is cut with "CUT" at both ends so that a desired length can be cut out from a continuous long LED mounting circuit board 10. A display indicating the position is printed. Further, "+" to which the anode of the LED is connected and "-" to which the cathode is connected are displayed.

LED実装用回路基板10は、絶縁性および可撓性を有するベース基板20と、ベース基板20の一方の面に形成された配線パターン30と、配線パターン30上を覆い、配線パターン30の端子部分を露出させた絶縁膜40とを備えている。本実施の形態に係るLED実装用回路基板10は、ベース基板20と配線パターン30とによる単層基板により形成されている。 The LED mounting circuit board 10 covers the base substrate 20 having insulation and flexibility, the wiring pattern 30 formed on one surface of the base substrate 20, and the wiring pattern 30, and the terminal portion of the wiring pattern 30. It is provided with an insulating film 40 exposed to the above. The LED mounting circuit board 10 according to this embodiment is formed of a single-layer board composed of a base board 20 and a wiring pattern 30.

ベース基板20は、長尺な帯状に形成されている。ベース基板20は、例えば、ポリイミドなどの樹脂製のフィルムにより形成されている。 The base substrate 20 is formed in a long strip shape. The base substrate 20 is formed of, for example, a resin film such as polyimide.

配線パターン30は、金属箔により形成されている。配線パターン30は、ベース基板20の幅方向Wの両側端部に形成された第1電源部31および第2電源部32であり、LED50(51〜57)に電流を供給するための第1電源部31および第2電源部32(一対の電源部)と、その間に位置する部品実装部33とが、ベース基板20の一方の面(おもて面)に形成されている。 The wiring pattern 30 is formed of a metal foil. The wiring pattern 30 is a first power supply unit 31 and a second power supply unit 32 formed on both side ends of the base substrate 20 in the width direction W, and is a first power supply for supplying a current to the LEDs 50 (51 to 57). A unit 31 and a second power supply unit 32 (a pair of power supply units) and a component mounting unit 33 located between them are formed on one surface (front surface) of the base board 20.

第1電源部31と第2電源部32とは、例えば、第1電源部31をプラス電源パターンとすることができ、第2電源部32をグランドパターンとすることができる。
第1電源部31および第2電源部32には、それぞれに網線よる電源線L1,L2(図4参照)を半田付けにより接続するために、絶縁膜40から第1電源部31および第2電源部32を露出させた接続部31a,32aが形成されている。接続部31a,32aは、第1電源部31および第2電源部32の長さ方向Lの両端部と中央部との3箇所に形成されている。
For the first power supply unit 31 and the second power supply unit 32, for example, the first power supply unit 31 can be a positive power supply pattern, and the second power supply unit 32 can be a ground pattern.
In order to connect the power supply lines L1 and L2 (see FIG. 4) by soldering to the first power supply unit 31 and the second power supply unit 32 by soldering, the insulating film 40 to the first power supply unit 31 and the second power supply unit 32 are connected to each other. Connection portions 31a and 32a with the power supply portion 32 exposed are formed. The connecting portions 31a and 32a are formed at three locations, both ends and a central portion of the first power supply unit 31 and the second power supply unit 32 in the length direction L.

部品実装部33は、第1〜第11部品実装部33a〜33kから形成されている。
第1部品実装部33aには、LED51の一方の端子を第1電源部31と導通接続するために、第1電源部31に繋がるように形成され、絶縁膜40から露出させた第1LED用端子331が形成されている。
第2部品実装部33bは、LED51の他方の端子とLED52の一方の端子とを導通接続するために、第1部品実装部33aと同様に、絶縁膜40から露出させた第2LED用端子332と第1LED用端子331とが形成されている。
The component mounting portion 33 is formed of the first to eleventh component mounting portions 33a to 33k.
The first LED terminal 33a is formed so as to be connected to the first power supply unit 31 in order to conductively connect one terminal of the LED 51 to the first power supply unit 31, and is exposed from the insulating film 40. 331 is formed.
The second component mounting portion 33b and the second LED terminal 332 exposed from the insulating film 40, like the first component mounting portion 33a, in order to electrically connect the other terminal of the LED 51 and one terminal of the LED 52. A first LED terminal 331 is formed.

第3部品実装部33cは、LED52の他方の端子と抵抗61の一方の端子とを導通接続するために、第2LED用端子332と第1抵抗用端子611とが形成されている。
第4部品実装部33dは、抵抗61の他方の端子とLED53の一方の端子とを導通接続するために、第2抵抗用端子612と第1LED用端子331とが形成されている。
第5部品実装部33eは、LED53の他方の端子と逆流防止用のダイオード62の一方の端子とを導通接続するために、第2LED用端子332と第1ダイオード用端子621とが形成されている。
The third component mounting portion 33c is formed with a second LED terminal 332 and a first resistor terminal 611 in order to electrically connect the other terminal of the LED 52 and one terminal of the resistor 61.
In the fourth component mounting portion 33d, a second resistor terminal 612 and a first LED terminal 331 are formed in order to electrically connect the other terminal of the resistor 61 and one terminal of the LED 53.
In the fifth component mounting portion 33e, a second LED terminal 332 and a first diode terminal 621 are formed in order to electrically connect the other terminal of the LED 53 and one terminal of the diode 62 for preventing backflow. ..

第6部品実装部33fは、ダイオード62の他方の端子とLED54の一方の端子とを導通接続するために、第2ダイオード用端子622と第1LED用端子331とが形成されている。
第7部品実装部33gは、LED54の他方の端子と抵抗63の一方の端子とを導通接続するために、第2LED用端子332と第1抵抗用端子611とが形成されている。
第8部品実装部33hは、抵抗63の他方の端子とLED55の一方の端子とを導通接続するために、第2抵抗用端子612と第1LED用端子331とが形成されている。
In the sixth component mounting portion 33f, a second diode terminal 622 and a first LED terminal 331 are formed in order to conductively connect the other terminal of the diode 62 and one terminal of the LED 54.
The seventh component mounting portion 33g is formed with a second LED terminal 332 and a first resistor terminal 611 in order to electrically connect the other terminal of the LED 54 and one terminal of the resistor 63.
In the eighth component mounting portion 33h, a second resistor terminal 612 and a first LED terminal 331 are formed in order to conductively connect the other terminal of the resistor 63 and one terminal of the LED 55.

第9部品実装部33iは、LED55の他方の端子とLED56の一方の端子とを導通接続するために、第1LED用端子331と第2LED用端子332とが形成されている 第10部品実装部33jは、LED56の他方の端子とLED57の一方の端子とを導通接続するために、第2LED用端子332と第1LED用端子331とが形成されている。
第11部品実装部33kは、LED57の他方の端子を第2電源部32と導通接続するために、第2電源部32に繋がるように形成され、第2LED用端子332が形成されている。
The ninth component mounting unit 33i has a tenth component mounting unit 33j in which a first LED terminal 331 and a second LED terminal 332 are formed in order to electrically connect the other terminal of the LED 55 and one terminal of the LED 56. Is formed with a second LED terminal 332 and a first LED terminal 331 in order to electrically connect the other terminal of the LED 56 and the one terminal of the LED 57.
The eleventh component mounting unit 33k is formed so as to be connected to the second power supply unit 32 in order to electrically connect the other terminal of the LED 57 to the second power supply unit 32, and the second LED terminal 332 is formed.

LED50同士を接続する第2部品実装部33b、第9部品実装部33i、第10部品実装部33jは、幅方向Wの中央を中心として、一方側P1から他方P2へ配線されている。LED50と、抵抗61,63と、ダイオード62とを接続する第3部品実装部33c〜第8部品実装部33hは、一方側P1のみ、または他方側P2のみに配線されている。このように配線パターン30を形成することにより、LED50を幅方向Wに沿って同じ向きに実装することができる。 The second component mounting section 33b, the ninth component mounting section 33i, and the tenth component mounting section 33j that connect the LEDs 50 to each other are wired from one side P1 to the other P2 centering on the center in the width direction W. The third component mounting portion 33c to the eighth component mounting portion 33h that connects the LED 50, the resistors 61, 63, and the diode 62 are wired only to one side P1 or only the other side P2. By forming the wiring pattern 30 in this way, the LED 50 can be mounted in the same direction along the width direction W.

また、このように配線パターン30が形成されていることで、図2に示すように、LED51〜57と抵抗61とダイオード62と抵抗63が、第1電源部31と第2電源部32との間で、第1〜第11部品実装部33a〜33kによって直列接続されたものとなる。 Further, since the wiring pattern 30 is formed in this way, as shown in FIG. 2, the LEDs 51 to 57, the resistor 61, the diode 62, and the resistor 63 are connected to the first power supply unit 31 and the second power supply unit 32. It is connected in series by the first to eleventh component mounting portions 33a to 33k.

LED実装用回路基板10は、第1電源部31および第2電源部32が、第1〜第11部品実装部33a〜33kから、ベース基板20の他方の面(裏面)側に折り曲げられ、接着される。
部品実装部33と第1電源部31との間、および部品実装部33と第2電源部32との間が折り曲げ位置となるが、この折り曲げ位置は、第2部品実装部33b〜第10部品実装部33jと、第1電源部31および第2電源部32との間による配線パターン30の非形成領域S1,S2(図3参照)としている。非形成領域S1,S2は、長さ方向Lに沿って直線状に形成されている。
In the LED mounting circuit board 10, the first power supply unit 31 and the second power supply unit 32 are bent from the first to eleventh component mounting units 33a to 33k to the other surface (back surface) side of the base substrate 20 and adhered to each other. Will be done.
The bending position is between the component mounting unit 33 and the first power supply unit 31 and between the component mounting unit 33 and the second power supply unit 32. The bending position is the second component mounting unit 33b to the tenth component. The non-formed regions S1 and S2 (see FIG. 3) of the wiring pattern 30 between the mounting unit 33j and the first power supply unit 31 and the second power supply unit 32. The non-formed regions S1 and S2 are formed linearly along the length direction L.

図3に示すように、第1電源部31の幅W1と、第2電源部32の幅W2とは、その合計が、部品実装部33の幅W3より、短く形成されている。
本実施の形態では、第1電源部31の幅W1と第2電源部32の幅W2とが等幅により形成され、それぞれの幅W1,W2は約2mmに形成されている。また、部品実装部33の幅W3は、約5mmに形成されている。
As shown in FIG. 3, the total width W1 of the first power supply unit 31 and the width W2 of the second power supply unit 32 are formed shorter than the width W3 of the component mounting unit 33.
In the present embodiment, the width W1 of the first power supply unit 31 and the width W2 of the second power supply unit 32 are formed by the same width, and the respective widths W1 and W2 are formed to be about 2 mm. Further, the width W3 of the component mounting portion 33 is formed to be about 5 mm.

絶縁膜40は、接続部31a,32a、第1LED用端子331、第2LED用端子332、第1抵抗用端子611および第2抵抗用端子612、第1ダイオード用端子621および第2ダイオード用端子622以外の領域に形成されている。 The insulating film 40 includes connection portions 31a and 32a, a terminal for the first LED 331, a terminal for the second LED 332, a terminal for the first resistor 611 and a terminal for the second resistor 612, a terminal for the first diode 621 and a terminal for the second diode 622. It is formed in a region other than.

(帯状フレキシブルLEDライトの構成)
次に、このLED実装用回路基板10を用いた帯状フレキシブルLEDライトの構成を、図4に基づいて説明する。
図4に示す帯状フレキシブルLEDライト100は、部品実装部33の裏面側に、第1電源部31と第2電源部32とを折り返されたLED実装用回路基板10にLED50、抵抗61,63およびダイオード62(図1参照)が実装され、折り返された第1電源部31と第2電源部32とに、電源線L1,L2が接続された発光ユニットUが、ケース70に挿入されている。
(Structure of strip-shaped flexible LED light)
Next, the configuration of the band-shaped flexible LED light using the LED mounting circuit board 10 will be described with reference to FIG.
In the strip-shaped flexible LED light 100 shown in FIG. 4, the LED 50, resistors 61, 63 and the LED 50, resistors 61, 63 and the LED 50, the resistors 61, 63 and the LED 50, the resistors 61, 63 and the LED 50, the resistors 61, 63 A light emitting unit U in which a diode 62 (see FIG. 1) is mounted and power lines L1 and L2 are connected to the folded first power supply unit 31 and the second power supply unit 32 is inserted in the case 70.

ケース70は、長尺状に形成され、内部に発光ユニットUを収納するための空間が形成された中空のチューブである。ケース70は、可撓性を有する軟質プラスチックまたはシリコーンゴムにより形成されている。
ケース70は、発光ユニットUの部品実装側が、透明による光出射部71として形成されている。ケース70の光出射側と反対となる発光ユニットUの裏面側が、灰色による設置部72として形成されている。光出射部71と設置部72とは一体成型されている。
The case 70 is a hollow tube formed in a long shape and having a space for accommodating the light emitting unit U inside. The case 70 is made of flexible soft plastic or silicone rubber.
In the case 70, the component mounting side of the light emitting unit U is formed as a transparent light emitting portion 71. The back surface side of the light emitting unit U opposite to the light emitting side of the case 70 is formed as a gray installation portion 72. The light emitting portion 71 and the installation portion 72 are integrally molded.

ケース70の設置部72には、発光ユニットUの長さ方向に沿って配線された電源線L1,L2を受けるために、頭頂部に溝が形成された一対の台部72aがケース70の長さ方向に沿って形成されている。
台部72aに挟まれた設置部72の底部には、溝72bがケース70の長さ方向に沿って形成されている。
In the installation portion 72 of the case 70, a pair of base portions 72a having a groove formed in the crown portion is the length of the case 70 in order to receive the power supply lines L1 and L2 wired along the length direction of the light emitting unit U. It is formed along the vertical direction.
A groove 72b is formed along the length direction of the case 70 at the bottom of the installation portion 72 sandwiched between the base portions 72a.

(LED実装用回路基板および帯状フレキシブルLEDライトの製造方法)
以上のように構成された本発明の実施の形態に係るLED実装用回路基板およびそれを用いた帯状フレキシブルLEDライトの製造方法を図面に基づいて説明する。
LED実装用回路基板10は、図5に示すようなLED実装用回路基板10が幅方向Wに連接された長尺な帯状の原基板10pから作製される。図5に示す原基板10pでは、LED実装用回路基板10が幅方向Wに4枚連接されている。そして、原基板10pの幅方向Wの両側端部11には、搬送用のスプロケットが噛み合う穴11pが長さ方向Lに沿って形成されている。
(Manufacturing method of circuit board for LED mounting and strip-shaped flexible LED light)
An LED mounting circuit board according to an embodiment of the present invention configured as described above and a method for manufacturing a band-shaped flexible LED light using the same will be described with reference to the drawings.
The LED mounting circuit board 10 is manufactured from a long strip-shaped original board 10p in which the LED mounting circuit board 10 as shown in FIG. 5 is connected in the width direction W. In the original substrate 10p shown in FIG. 5, four LED mounting circuit boards 10 are connected in the width direction W. At both end portions 11 of the original substrate 10p in the width direction W, holes 11p in which the transport sprockets mesh with each other are formed along the length direction L.

この原基板10pは、ベース基板20のおもて面側の全面に形成された金属箔をエッチング等により除去して配線パターン30を形成し、そして、第1LED用端子331、第2LED用端子332、第1抵抗用端子611および第2抵抗用端子612、第1ダイオード用端子621および第2ダイオード用端子622の領域以外を絶縁膜40が覆うことで作製される。 In this original substrate 10p, the metal foil formed on the entire surface side of the base substrate 20 is removed by etching or the like to form a wiring pattern 30, and the first LED terminal 331 and the second LED terminal 332 are formed. , The insulating film 40 covers the regions other than the regions of the first resistor terminal 611 and the second resistor terminal 612, the first diode terminal 621, and the second diode terminal 622.

次に、部品実装機により、第1LED用端子331および第2LED用端子332にLED50を、第1抵抗用端子611および第2抵抗用端子612に抵抗61,63、第1ダイオード用端子621および第2ダイオード用端子622にダイオード62を搭載し、リフロー炉により半田付けする。
そして、切断線Cの位置を切断することで、部品が実装された個々のLED実装用回路基板10(図1参照)とする。
Next, depending on the component mounting machine, the LED 50 is connected to the first LED terminal 331 and the second LED terminal 332, the resistors 61, 63 are connected to the first resistance terminal 611 and the second resistance terminal 612, the first diode terminal 621 and the first diode terminal 621 are used. 2 The diode 62 is mounted on the diode terminal 622 and soldered by a reflow furnace.
Then, by cutting the position of the cutting line C, the individual LED mounting circuit board 10 (see FIG. 1) on which the components are mounted is obtained.

次に、長さ方向Lに沿って連接されたLED実装用回路基板10のうち、所望とする長さ分のLED実装用回路基板10の端部に表示された切断位置を示す「CUT」を切断する。そうすることで、様々な長さの要求に応じることができる。 Next, among the LED mounting circuit boards 10 connected along the length direction L, "CUT" indicating the cutting position displayed at the end of the LED mounting circuit board 10 for the desired length is added. Disconnect. By doing so, it is possible to meet the demands of various lengths.

次に、電源線L1(図4参照)を第1電源部31に沿って配置し、接続部31aに半田付けする。また、電源線L2(図4参照)を第2電源部32に沿って配置し、接続部32aに半田付けする。
電源線L1,L2は、例えば、網線とする他に、可撓性を有する銅板、単線、撚り線等とすることができる。電源線L1,L2を第1電源部31および第2電源部32に接続することで、第1電源部31および第2電源部32よりも大電流を流すことができ、電圧降下を抑制することができ、更に、輝度が低下し難くすることができる。
Next, the power supply line L1 (see FIG. 4) is arranged along the first power supply unit 31 and soldered to the connection unit 31a. Further, the power supply line L2 (see FIG. 4) is arranged along the second power supply unit 32 and soldered to the connection unit 32a.
The power supply lines L1 and L2 may be, for example, a net wire, a flexible copper plate, a single wire, a stranded wire, or the like. By connecting the power supply lines L1 and L2 to the first power supply unit 31 and the second power supply unit 32, a larger current can flow than the first power supply unit 31 and the second power supply unit 32, and the voltage drop can be suppressed. Furthermore, it is possible to make it difficult for the brightness to decrease.

そして、図3に示すように、配線パターン30の非配線領域S1,S2を折り返し線として、第1電源部31と第2電源部32とを部品実装部33の裏面側にそれぞれ折り返す。
非配線領域S1,S2には、配線パターン30が形成されていないため、非配線領域S1,S2を折り目とすることにより、薄いベース基板20を折り曲げることになるので、容易に一対の電源部を折り返すことができる。
Then, as shown in FIG. 3, the non-wiring areas S1 and S2 of the wiring pattern 30 are used as folded lines, and the first power supply unit 31 and the second power supply unit 32 are folded back to the back surface side of the component mounting unit 33, respectively.
Since the wiring pattern 30 is not formed in the non-wiring areas S1 and S2, the thin base substrate 20 is bent by making the non-wiring areas S1 and S2 creases, so that a pair of power supply units can be easily formed. Can be folded back.

第1電源部31の幅W1と、第2電源部32の幅W2との合計が、部品実装部33の幅W3より、短く形成されているため、第1電源部31と第2電源部32とが重なることなく折り返すことができる。従って、第1電源部31と第2電源部32とが短絡してしまうことが防止することができる。
また、第1電源部31に接続された電源線L1が第2電源部32に、第2電源部32に接続された電源線L2が第1電源部31に干渉することなく、折り返すことができるので、電源線L1が第2電源部32や電源線L2に、電源線L2が第1電源部31や電源線L1に短絡することが防止できる。
Since the sum of the width W1 of the first power supply unit 31 and the width W2 of the second power supply unit 32 is formed shorter than the width W3 of the component mounting unit 33, the first power supply unit 31 and the second power supply unit 32 are formed. Can be folded back without overlapping. Therefore, it is possible to prevent the first power supply unit 31 and the second power supply unit 32 from being short-circuited.
Further, the power supply line L1 connected to the first power supply unit 31 can be folded back to the second power supply unit 32, and the power supply line L2 connected to the second power supply unit 32 can be folded back without interfering with the first power supply unit 31. Therefore, it is possible to prevent the power supply line L1 from being short-circuited to the second power supply unit 32 and the power supply line L2, and the power supply line L2 from being short-circuited to the first power supply unit 31 and the power supply line L1.

部品実装部33に折り返された第1電源部31と第2電源部32とは、部品実装部33の裏面に両面テープまたは接着材等により貼り付けることができる。このようにして発光ユニットU(図4参照)が作製できる。 The first power supply unit 31 and the second power supply unit 32 folded back to the component mounting unit 33 can be attached to the back surface of the component mounting unit 33 with double-sided tape or an adhesive. In this way, the light emitting unit U (see FIG. 4) can be manufactured.

次に、図4に示すように、ケース70の端部から発光ユニットUを差し込み、内部に充填材としてシリコーンゴムを充填する。ケース70の内部にシリコーンゴムを充填したときに、発光ユニットU(LED実装用回路基板10)の部品実装部33側はLED50等が配置されるための空間が確保されるため、シリコーンゴムをケース70の端部から奥部方向へ進めることが可能である。
しかし、第1電源部31と第2電源部32が部品実装部33に折り返されることで薄くなったLED実装用回路基板10では、設置部72の底部との隙間が少ない。
Next, as shown in FIG. 4, the light emitting unit U is inserted from the end of the case 70, and the inside is filled with silicone rubber as a filler. When the inside of the case 70 is filled with silicone rubber, a space for arranging the LED 50 and the like is secured on the component mounting portion 33 side of the light emitting unit U (LED mounting circuit board 10), so that the silicone rubber is used as the case. It is possible to advance from the end of 70 toward the back.
However, in the LED mounting circuit board 10 which is thinned by folding back the first power supply unit 31 and the second power supply unit 32 to the component mounting unit 33, the gap between the first power supply unit 31 and the second power supply unit 32 is small.

本実施の形態に係る帯状フレキシブルLEDライト100では、設置部72に発光ユニットUの下方を、長さ方向Lに沿って溝72bが形成されている。従って、シリコーンゴムを、発光ユニットUの裏面側にも十分に行き渡らせるための空間を確保することができ、ケース70の端部から奥側まで十分に行き渡らせることができる。 In the strip-shaped flexible LED light 100 according to the present embodiment, a groove 72b is formed in the installation portion 72 below the light emitting unit U along the length direction L. Therefore, it is possible to secure a space for the silicone rubber to be sufficiently distributed to the back surface side of the light emitting unit U, and it is possible to sufficiently distribute the silicone rubber from the end portion to the back side of the case 70.

以上のように、図1に示す本実施の形態に係るLED実装用回路基板10おいては、配線パターン30は、LED50に一対の電源部(第1電源部31,第2電源部32)と、LED50が実装される部品実装部33とが、ベース基板20の一方の面に形成されている。そして、ベース基板20の幅方向Wの両側端部に形成された一対の第1,第2電源部31,32が、一対の第1,第2電源部31,32の間に位置する部品実装部33の裏面側に折り返されている。そのため、単層基板であっても、一対の第1,第2電源部31,32と部品実装部33とを厚み方向に立体的に配線することができる。従って、幅方向Wに細く、かつT字状に形成された特許文献1に記載のLED実装用回路基板より、厚みを薄く形成することができる。 As described above, in the LED mounting circuit board 10 according to the present embodiment shown in FIG. 1, the wiring pattern 30 includes a pair of power supply units (first power supply unit 31, second power supply unit 32) on the LED 50. , The component mounting portion 33 on which the LED 50 is mounted is formed on one surface of the base substrate 20. Then, the pair of first and second power supply units 31 and 32 formed on both side ends of the base substrate 20 in the width direction W are located between the pair of first and second power supply units 31 and 32 for mounting components. It is folded back to the back surface side of the portion 33. Therefore, even in the case of a single-layer substrate, the pair of first and second power supply units 31 and 32 and the component mounting unit 33 can be three-dimensionally wired in the thickness direction. Therefore, the thickness can be made thinner than the LED mounting circuit board described in Patent Document 1 which is thin in the width direction W and formed in a T shape.

また、LED実装用回路基板10を薄く幅狭く形成することができるため、帯状フレキシブルLEDライト100を薄く幅狭く形成することができる。
なお、本実施の形態では、LED実装用回路基板10が、ベース基板20と、ベース基板20の一方の面に形成された配線パターン30とによる単層基板により形成されていたが、例えば、部品実装部が複数層の配線パターンにより形成され、第1電源部および第2電源部も複数層の配線パターンにより形成され、部品実装部に複数色を発光するLEDを実装するようにしてもよい。
Further, since the LED mounting circuit board 10 can be formed thin and narrow, the band-shaped flexible LED light 100 can be formed thin and narrow.
In the present embodiment, the LED mounting circuit board 10 is formed of a single-layer board composed of a base board 20 and a wiring pattern 30 formed on one surface of the base board 20, but for example, a component. The mounting unit may be formed by a plurality of layers of wiring patterns, the first power supply unit and the second power supply unit may also be formed by a plurality of layers of wiring patterns, and LEDs that emit a plurality of colors may be mounted on the component mounting unit.

本発明は、各種の屋外、屋内の照明、電飾、誘導灯等の分野において好適に利用することができる。 The present invention can be suitably used in various fields such as outdoor and indoor lighting, illuminations, and guide lights.

100 帯状フレキシブルLEDライト
U 発光ユニット
10 LED実装用回路基板
10p 原基板
11 両側端部
11p 穴
20 ベース基板
30 配線パターン
31 第1電源部
32 第2電源部
31a,32a 接続部
33 部品実装部
33a 第1部品実装部
33b 第2部品実装部
33c 第3部品実装部
33d 第4部品実装部
33e 第5部品実装部
33f 第6部品実装部
33g 第7部品実装部
33h 第8部品実装部
33i 第9部品実装部
33j 第10部品実装部
33k 第11部品実装部
331 第1LED用端子
332 第2LED用端子
40 絶縁膜
L1,L2 電源線
50,51〜57 LED
61,62,63 抵抗
611 第1抵抗用端子
612 第2抵抗用端子
621 第1ダイオード用端子
622 第2ダイオード用端子
70 ケース
71 光出射部
72 設置部
72a 台部
72b 溝
C 切断線
L 長さ方向
W 幅方向
S1,S2 非形成領域
W1,W2,W3 幅
P1 一方側
P2 他方側
100 Band-shaped flexible LED light U light emitting unit 10 LED mounting circuit board 10p Original board 11 Both side ends 11p hole 20 Base board 30 Wiring pattern 31 1st power supply part 32 2nd power supply part 31a, 32a Connection part 33 Parts mounting part 33a 1 Part mounting part 33b 2nd part mounting part 33c 3rd part mounting part 33d 4th part mounting part 33e 5th part mounting part 33f 6th part mounting part 33g 7th part mounting part 33h 8th part mounting part 33i 9th part Mounting part 33j 10th part mounting part 33k 11th part mounting part 331 1st LED terminal 332 2nd LED terminal 40 Insulation film L1, L2 Power supply line 50, 51-57 LED
61, 62, 63 Resistance 611 1st resistance terminal 612 2nd resistance terminal 621 1st diode terminal 622 2nd diode terminal 70 Case 71 Light emitting part 72 Installation part 72a Base part 72b Groove C Cutting line L Length Direction W Width direction S1, S2 Non-formed area W1, W2, W3 Width P1 One side P2 The other side

Claims (6)

絶縁性および可撓性を有する帯状のベース基板と、前記ベース基板に形成された配線パターンとを備え、
前記配線パターンは、前記ベース基板の幅方向の両側端部に形成され、LEDに電流を供給するための一対の電源部と、前記一対の電源部の間に位置し、前記LEDが実装される部品実装部とが、前記ベース基板の一方の面に形成され、
前記一対の電源部は、前記部品実装部の裏面側に折り返されたLED実装用回路基板。
A strip-shaped base substrate having insulating properties and flexibility, and a wiring pattern formed on the base substrate are provided.
The wiring pattern is formed at both end portions in the width direction of the base substrate, is located between a pair of power supply units for supplying a current to the LED and the pair of power supply units, and the LED is mounted. A component mounting portion is formed on one surface of the base substrate.
The pair of power supply units are LED mounting circuit boards that are folded back to the back surface side of the component mounting unit.
前記一対の電源部の幅の合計は、前記部品実装部の幅より短い請求項1記載のLED実装用回路基板。 The LED mounting circuit board according to claim 1, wherein the total width of the pair of power supply units is shorter than the width of the component mounting unit. 前記一対の電源部には、一対の電源線が接続される接続部が形成された請求項2記載のLED実装用回路基板。 The LED mounting circuit board according to claim 2, wherein a connection portion to which the pair of power supply lines is connected is formed in the pair of power supply units. 前記一対の電源部と、前記部品実装部との間に、非配線領域が形成された請求項1から3のいずれかの項に記載のLED実装用回路基板。 The LED mounting circuit board according to any one of claims 1 to 3, wherein a non-wiring region is formed between the pair of power supply units and the component mounting unit. 前記請求項1から4のいずれかの項にLED実装用回路基板が挿入されるチューブ状のケースを備えた帯状フレキシブルLEDライト。 A strip-shaped flexible LED light provided with a tubular case into which a circuit board for mounting an LED is inserted according to any one of claims 1 to 4. 前記ケースには、LEDが実装されたLED実装用回路基板の裏面側に、前記LED実装用回路基板の長さ方向に沿った溝が形成された請求項5記載の帯状フレキシブルLEDライト。 The strip-shaped flexible LED light according to claim 5, wherein in the case, a groove is formed along the length direction of the LED mounting circuit board on the back surface side of the LED mounting circuit board on which the LED is mounted.
JP2019213390A 2019-11-26 2019-11-26 Circuit board for mounting led and belt-like flexible led light Pending JP2021086685A (en)

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CN103826382A (en) * 2014-02-20 2014-05-28 鹤山市银雨照明有限公司 Bent flexible circuit board and LED strip lamp with same
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CN203984762U (en) * 2014-04-28 2014-12-03 鹤山丽得电子实业有限公司 Flexible circuit board, flexible LED strip
JP2017028034A (en) * 2015-07-17 2017-02-02 大日本印刷株式会社 Connection structure between flexible substrates for led element
CN109323153A (en) * 2018-04-10 2019-02-12 深圳市乐的美光电股份有限公司 A kind of curved flexible LED strip of any angle

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013118169A (en) * 2011-10-31 2013-06-13 Atex Co Ltd Led mounting circuit board, belt-like flexible led light, and led lighting device using the same
CN103826382A (en) * 2014-02-20 2014-05-28 鹤山市银雨照明有限公司 Bent flexible circuit board and LED strip lamp with same
JP3191036U (en) * 2014-03-25 2014-06-05 コロナ産業株式会社 Decorative lighting equipment
CN203984762U (en) * 2014-04-28 2014-12-03 鹤山丽得电子实业有限公司 Flexible circuit board, flexible LED strip
CN203880482U (en) * 2014-04-29 2014-10-15 鹤山丽得电子实业有限公司 LED bar-shaped lamp with insulating liquid solidified thin film layer
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