JP2021077692A - Package and transparent sealing member - Google Patents

Abstract

To provide a package that is composed of a transparent sealing member and a mounting substrate bonded together, prevents a bonding material from protruding into an accommodation space of an optical element, and suppresses a volatile component of the bonding material from adhering to the optical element, and a transparent sealing member.SOLUTION: In a package (10: 10A to 10G) in which a transparent sealing member (18: 18A to 18G) and a mounting substrate (14: 14A to 14G) are joined and that has a space 22 for accommodating at least one optical element 12, a portion where the transparent sealing member 18 and the mounting substrate 14 are joined has a step 30 or a taper 30 that suppresses the entry of a bonding material 16 into the space 22.SELECTED DRAWING: Figure 1

Description

The present invention relates to a package used for an optical component, for example, a package suitable for use in an LED (light emitting diode), an LD (semiconductor laser), etc., and a transparent sealing member.

In general, an optical component having an optical element (for example, LED, LD, etc.) that emits ultraviolet rays requires a transparent sealing member in order to protect the optical element from outside air and moisture. Metallizing or resin adhesive is used to join the mounting substrate on which the optical element is mounted and the transparent sealing member.

Patent Document 1 describes a metal heat sink on which a semiconductor element is mounted, a metal frame in which a brazing material such as silver brazing is bonded to the upper surface of the heat sink, and a brazing material on the upper surface of the frame. A housing composed of a joined ceramic lid is disclosed.

Patent Document 2 discloses a package for an ultraviolet light emitting element in which a condenser lens made of glass such as quartz is bonded to a lens holding member with an adhesive.

Japanese Unexamined Patent Publication No. 2001-237335 Japanese Unexamined Patent Publication No. 2007-311707

By the way, when the lid body is resin-bonded to the mounting substrate, the resin may protrude into the arrangement space of the optical element. In this case, the light emitted from the optical element may be blocked by the protruding resin, and the overall light transmittance may decrease.

Further, when the lid body is resin-bonded to the mounting substrate, pressurization and heating may be performed. In this case, a part of the above-mentioned protruding resin is volatilized by heating or the like, and the volatile components adhere to the optical element, which may deteriorate the optical element and the optical component.

On the other hand, when the lid is metal-bonded to the mounting substrate, solder such as AuSn (gold tin) is laminated on a metal layer formed by metallizing in advance, and pressure-heat bonding is performed. At that time, the solder may leak to the outside. If the solder enters the space where the optical element is arranged, the wiring may be short-circuited as well as light blocking.

The present invention has been made in consideration of such a problem, and in a package formed by bonding a transparent sealing member and a mounting substrate, a bonding material such as resin or solder protrudes into the arrangement space of the optical element. It is an object of the present invention to provide a package and a transparent sealing member capable of avoiding such a problem and suppressing adhesion of a part of a bonding material or a volatile component to an optical element or the like.

The first aspect of the present invention is a package in which a transparent sealing member and a mounting substrate are bonded to each other and have a space for accommodating at least one optical element, and the transparent sealing member and the mounting substrate are bonded to each other. The portion is provided with a step or taper that suppresses the entry of the bonding material into the space.

A second aspect of the present invention is a transparent sealing member having a bonding surface to be bonded to a mounting substrate, and has a step or taper that suppresses the entry of the bonding material into the inside of the transparent sealing member.

According to the package of the first aspect, when the transparent sealing member is bonded to the mounting substrate, the step or taper suppresses the entry of the bonding material into the accommodation space, so that the light emitted from the optical element is emitted. It is almost unobstructed by the bonding material, and it is possible to suppress a decrease in the overall light transmittance. Further, even when pressurization and heating are performed when joining the transparent sealing member to the mounting substrate, the joining material is suppressed from entering the accommodation space by the step or taper, so that, for example, the joining material can be used. In the case of resin, it is possible to suppress phenomena such as the volatile components of the resin adhering to the optical element. For example, when the bonding material is solder or the like, it is possible to suppress the phenomenon of short-circuiting of wiring as well as light blocking. This leads to suppressing deterioration of the quality of the optical element and the optical component.

According to the transparent sealing member of the second aspect, when the transparent sealing member is joined to the mounting substrate, the step or taper suppresses the entry of the joining material into the accommodation space, so that the transparent sealing member comes out of the optical element. The emitted light is hardly blocked by the bonding material, and the decrease in the overall light transmittance can be suppressed.

FIG. 1A is a vertical cross-sectional view showing a package (first package) according to the first embodiment, and FIG. 1B is a vertical cross-sectional view showing the first package in an exploded manner. FIG. 2A is an enlarged cross-sectional view showing a first example of a step formed on the transparent sealing member of the first package, and FIG. 2B is an enlarged cross-sectional view showing a second example of the step. FIG. 3A is an enlarged cross-sectional view showing a third example of a step formed on the transparent sealing member of the first package, and FIG. 3B is an enlarged cross-sectional view showing a fourth example of the step. FIG. 4A is a bottom view showing an example in which convex portions having steps are formed in an annular shape on the bottom surface of a transparent pedestal, and FIG. 4B is a bottom view showing an example in which a plurality of convex portions having steps are arranged in an annular shape. 4C is a bottom view showing an example in which convex portions having steps are formed in a rectangular ring shape, and FIG. 4D is a bottom view showing an example in which a plurality of convex portions having steps are arranged in a rectangular ring shape. FIG. 5A is an enlarged cross-sectional view showing an example in which the position of the end face on the accommodation space side in the convex portion is aligned with the position of the inner peripheral surface of the transparent body, and FIG. 5B shows the position of the end face on the outer peripheral side of the pedestal of the transparent body. It is an enlarged cross-sectional view which shows the example shifted. FIG. 6A is an enlarged cross-sectional view showing an example in which the end surface of the convex portion on the accommodating space side shown in FIG. 2A is an inclined surface, and FIG. 6B is an example in which the end surface of the convex portion shown in FIG. 3A on the accommodating space side is an inclined surface. It is an enlarged sectional view which shows. FIG. 7A is a vertical cross-sectional view showing the package according to the comparative example, and FIG. 7B is a vertical cross-sectional view showing the package according to the comparative example in an exploded manner. FIG. 8A is a vertical cross-sectional view showing the package (second package) according to the second embodiment, and FIG. 8B is a vertical cross-sectional view showing the second package in an exploded manner. FIG. 9A is a vertical cross-sectional view showing the package (third package) according to the third embodiment, and FIG. 9B is a vertical cross-sectional view showing the third package in an exploded manner. FIG. 10A is a vertical cross-sectional view showing the package (fourth package) according to the fourth embodiment, and FIG. 10B is a vertical cross-sectional view showing the fourth package in an exploded manner. FIG. 11A is an enlarged cross-sectional view showing a first example of a step formed on the mounting substrate of the fourth package, and FIG. 11B is an enlarged cross-sectional view showing a second example of the step. FIG. 12A is an enlarged cross-sectional view showing a third example of the step formed on the mounting substrate of the fourth package, and FIG. 12B is an enlarged cross-sectional view showing the fourth example of the step. FIG. 13A is a top view showing an example in which convex portions having steps are formed in an annular shape on the upper surface of the mounting substrate, and FIG. 13B is a top view showing an example in which a plurality of convex portions having steps are arranged in an annular shape. 13C is a top view showing an example in which convex portions having steps are formed in a rectangular ring shape, and FIG. 13D is a top view showing an example in which a plurality of convex portions having steps are arranged in a rectangular ring shape. FIG. 14A is an enlarged cross-sectional view showing an example in which the position of the end face on the accommodation space side in the convex portion is aligned with the position of the inner peripheral surface of the transparent body, and FIG. 14B shows the position of the end face on the outer peripheral side of the transparent sealing member. It is an enlarged cross-sectional view which shows the example shifted. FIG. 15A is an enlarged cross-sectional view showing an example in which the end surface of the convex portion on the accommodating space side shown in FIG. 11A is an inclined surface, and FIG. 15B is an example in which the end surface of the convex portion shown in FIG. 12A on the accommodating space side is an inclined surface. It is an enlarged sectional view which shows. FIG. 16A is a vertical cross-sectional view showing the package (fifth package) according to the fifth embodiment, and FIG. 16B is a vertical cross-sectional view showing the fifth package in an exploded manner. FIG. 17A is a vertical cross-sectional view showing the package (sixth package) according to the sixth embodiment, and FIG. 17B is a vertical cross-sectional view showing the sixth package in an exploded manner. FIG. 18A is a vertical cross-sectional view showing the package (seventh package) according to the seventh embodiment, and FIG. 18B is a vertical cross-sectional view showing the seventh package in an exploded manner.

Hereinafter, examples of embodiments of the package and the transparent sealing member according to the present invention will be described with reference to FIGS. 1A to 18B.

First, as shown in FIGS. 1A and 1B, the optical component (hereinafter referred to as the first optical component 100A) having the package according to the first embodiment (hereinafter referred to as the first package 10A) is the above-mentioned first. It has one package 10A and at least one optical element 12 housed in the first package 10A. The optical element 12 emits, for example, ultraviolet light 13.

The first package 10A comprises a flat plate-shaped first mounting substrate 14A on which the optical element 12 is mounted and a first transparent sealing member 18A bonded onto the first mounting substrate 14A via, for example, an organic resin. Have. As the resin, for example, an epoxy adhesive, a silicone adhesive, a urethane adhesive, or the like can be preferably used. Wiring and the like are formed on the surface of the first mounting substrate 14A.

Further, the bonding between the first mounting substrate 14A and the first transparent sealing member 18A includes metal bonding in addition to the resin bonding described above. The metal joint is formed in advance on the bonding surface of the first mounting substrate 14A with the first transparent sealing member 18A and on the bonding surface of the first transparent sealing member 18A with the first mounting substrate 14A by metallizing. This is a method of laminating solder such as AuSn (gold tin) on the metal layer and pressurizing and heating the metal layer.

Therefore, when the above-mentioned "resin-bonded organic resin" and "metal-bonded solder" are referred to without distinction, they are simply referred to as "bonding material 16".

Although not shown, the optical element 12 is configured by, for example, laminating a GaN-based crystal layer having a quantum well structure on a sapphire substrate (coefficient of thermal expansion: 7.7 × 10 ^{−6 / ° C.).} As a mounting method of the optical element 12, for example, a so-called face-up mounting in which the crystal layer constituent surface is mounted so as to face the first transparent sealing member 18A and functions as the light emitting surface 12a can be adopted.

That is, the terminal (not shown) derived from the optical element 12 and the circuit wiring (not shown) formed on the first mounting substrate 14A are electrically connected by, for example, a bonding wire (not shown). To do. Of course, so-called flip-chip mounting in which the light emitting surface 12a is mounted so as to face the first mounting substrate 14A and the back surface of the sapphire substrate functions as the light emitting surface can also be preferably adopted.

The first transparent sealing member 18A includes, for example, a transparent body 20 fixed on a flat plate-shaped first mounting substrate 14A, and the transparent body 20 has a recess of a lower surface opening, that is, a storage space 22. The transparent body 20 has an annular pedestal 24 fixed on the first mounting substrate 14A and a lens body 26 integrally formed on the pedestal 24. The accommodation space 22 has a dome shape.

The planar shape of the bottom surface of the lens body 26 is, for example, a circular shape, and the external shape (planar shape) of the pedestal 24 is, for example, a square shape. Of course, the planar shape of the bottom surface of the lens body 26 may be an elliptical shape, a track shape, or the like, and the outer shape of the pedestal 24 may be a polygonal shape such as a circular shape, a rectangular shape, a triangular shape, or a hexagonal shape.

As a method for producing the first transparent sealing member 18A having such a shape, a powder sintering method can be preferably adopted. For example, a molding slurry containing silica powder and an organic compound is cast into a molding die, solidified by a chemical reaction between the organic compounds, for example, a dispersion medium and a curing agent or a curing agent, and then released from the molding die. After that, the first transparent sealing member 18A can be produced by firing.

As for the dimensions of the first transparent sealing member 18A, the height of the first transparent sealing member 18A is 0.5 to 10 mm, the outer diameter of the pedestal 24 is 3.0 to 100 mm, and the height of the pedestal 24 is 0.2. It is ~ 1 mm. The lens body 26 has a bottom portion having a maximum length of 2.0 to 10 mm and a maximum height of 0.5 to 10 mm, and has an aspect ratio of 0.3 to 1.0 or the like.

The dimensions of the optical element 12 are 0.005 to 0.5 mm in thickness, and although not shown, the vertical dimension seen from the upper surface is 0.5 to 2.0 mm, and the horizontal dimension is 0.5 to 2. It is 0 mm.

With such a configuration, the height of the first optical component 100A from the lower surface 14a of the first mounting substrate 14A to the light emitting surface 12a of the optical element 12 is ha, and from the lower surface 14a of the first mounting substrate 14A to the bonding material 16. When the height to the upper surface (lower surface of the first pedestal 24A) is hb, ha> hb.

Therefore, even if the light distribution angle of the ultraviolet light 13 emitted from the optical element 12 is 180 ° or more, the ultraviolet light 13 emitted laterally from the light emitting surface 12a of the optical element 12 is first transparently sealed. It directly hits the pedestal 24 of the member 18A and hardly hits the joint portion between the first mounting substrate 14A and the first transparent sealing member 18A, that is, the joint material 16.

Further, in the first package 10A, as shown in FIGS. 1A to 2B, the joining material 16 enters the accommodation space 22 at least in the portion where the first transparent sealing member 18A and the first mounting substrate 14A are joined. It has a step 30 that suppresses the above. In particular, in the first package 10A, the step 30 is formed by integrally forming the convex portion 32 on the bottom surface of the first transparent sealing member 18A. Of course, the step 30 may be formed by providing the convex portion 32 separately on the bottom surface of the first transparent sealing member 18A. The same applies hereinafter.

Here, an example of the step 30 will be described with reference to FIGS. 2A to 6B. As shown in FIGS. 2A and 2B, the step 30 includes a step having an inclination angle of 90 ° (the cross-sectional shape of the convex portion 32 is rectangular) and an inclination angle θ of 90 as shown in FIGS. 3A and 3B. Examples thereof include steps of less than ° (the cross-sectional shape of the convex portion 32 is a wedge shape). If the inclination angle θ is less than 20 °, the effect of suppressing the protrusion of the bonding material 16 is not sufficient. Of course, a step having an inclination angle θ larger than 90 ° can be adopted, but the tip portion of the step 30 tends to be brittle.

In the above description, the inclination angle θ is defined as a “step” of 20 ° or more and 90 ° or less, but the case where the inclination angle θ is 90 ° is defined as a “step” and the inclination angle θ is 20 ° or more and less than 90 °. The case can also be defined as a "taper". Therefore, the step 30 is defined as a "step 30 or taper 30" that suppresses the entry of the resin or metal layer into the accommodation space 22.

Further, the “cross section” refers to a surface that is perpendicular to the bottom surface of the package and passes through the center of the package when the lens body 26 is viewed from above. The height of the step 30 or the taper 30 is measured by measuring the cross section obtained by cutting the package using a length measuring microscope or a scanning electron microscope.

Further, as shown in FIGS. 4A and 4C (bottom view), the convex portion 32 on which the step 30 or the taper 30 is formed may be formed in an annular shape, and is shown in FIGS. 4B and 4D (bottom view). As shown, a plurality of convex portions 32 having a step 30 or a taper 30 formed may be arranged in an annular shape. As an example, FIGS. 4A and 4B show convex portions 32 formed or arranged in an annular shape, and FIGS. 4C and 4D show convex portions 32 formed or arranged in a rectangular annular shape. As shown in FIG. 1A, these convex portions 32 are formed at positions close to the optical element 12 in the portion to be resin-bonded or metal-bonded to the first mounting substrate 14A, and the step 30 or the taper 30 is formed. It is formed at a position of the convex portion 32 facing the joining member 16.

As shown in FIGS. 2A and 3A, the corners of the convex portion 32 may be acute-angled, but as shown in FIGS. 2B and 3B, the corners of the convex portion 32 should be rounded. preferable. It is possible to avoid the phenomenon that the corner portion of the convex portion 32 is chipped at the time of contact with the first mounting substrate 14A.

Further, preferably, as shown in FIGS. 2A to 3B, the step 30 or the taper 30 (height hc of the convex portion 32) is 10 to 500 μm, and the width W of the convex portion 32 is at least 50 μm. The width W of the convex portion 32 is preferably the size of the first package 10A, that is, a width that does not excessively narrow the area of the portion to which the joining material 16 is applied (joining material coating portion 34).

As shown in FIG. 5A, the position of the end surface 32a on the accommodation space 22 side of the convex portion 32 may be aligned with the position of the inner peripheral surface 20a of the transparent body 20. As shown in FIG. 5B, the position of the end surface 32a may be shifted to the outer peripheral side of the pedestal 24, provided that the area of the portion to which the joining material 16 is applied (joining material coating portion 34) is not excessively narrowed. I do not care. Further, as shown in FIGS. 6A and 6B, the end surface 32a on the accommodation space 22 side of the convex portion 32 may be an inclined surface. These modifications are the same for the configurations of the second package 10B and later, which will be described later.

Here, the effect of the first package 10A will be described with reference to FIGS. 7A and 7B together with a comparative example.

First, as shown in FIGS. 7A and 7B, the package 200 according to the comparative example does not have a step 30 or a taper 30 at a portion where the transparent sealing member 18 and the mounting substrate 14 are joined. Therefore, when the transparent sealing member 18 is bonded to the mounting substrate 14, the bonding material 16 may protrude into the accommodation space 22 of the optical element 12. In this case, the ultraviolet light 13 from the optical element 12 may be blocked by the protruding bonding material 16, and the overall light transmittance may decrease.

Further, in the package 200 according to the comparative example, when pressure and heating are performed when the transparent sealing member 18 is bonded to the mounting substrate 14, a part of the above-mentioned protruding bonding material 16 is volatilized by heating or the like. As the volatile components adhere to the optical element 12, the optical element 12 and the optical components may be deteriorated.

In the package 200 according to the comparative example, when the transparent sealing member 18 is metal-bonded to the mounting substrate 14, a solder such as AuSn (gold tin) is laminated on a metal layer previously formed by metallizing and heated under pressure. Join. At that time, the solder may leak to the outside. If the solder enters the accommodation space 22 of the optical element 12, there is a risk that the wiring will be short-circuited as well as light blocking.

On the other hand, in the first package 10A shown in FIGS. 1A and 1B and the like, as described above, at least the portion where the first transparent sealing member 18A and the first mounting substrate 14A are joined to the accommodation space 22. It has a step 30 or a taper 30 that suppresses the entry of the joining material 16.

Therefore, when the first transparent sealing member 18A is joined to the first mounting substrate 14A, the step 30 or the taper 30 suppresses the entry of the joining material 16 into the accommodation space 22, so that the ultraviolet light from the optical element 12 is suppressed. 13 is hardly obstructed by the bonding material 16, and a decrease in the overall light transmittance can be suppressed.

Further, even when pressurization and heating are performed when the first transparent sealing member 18A is joined to the first mounting substrate 14A, the joining material 16 can enter the accommodation space 22 due to the step 30 or the taper 30. Since it is suppressed, it is possible to suppress a phenomenon such as the volatile component of the bonding material 16 (when the bonding material is an adhesive) adhering to the optical element 12. This leads to suppressing deterioration of the quality of the optical element 12 and the first optical component 100A.

Further, when the first transparent sealing member 18A is metal-bonded to the first mounting substrate 14A, a solder such as AuSn (gold tin) is laminated on a metal layer formed by metallizing in advance, and pressure-heated bonding is performed. .. At that time, the solder may leak to the outside. However, in the first optical component 100A, the step 30 or the taper 30 suppresses the entry of the bonding material 16 (solder in this case) into the accommodation space 22, so that the bonding material 16 causes a short circuit or contact between the wirings. A short circuit between them can be avoided.

Next, as shown in FIGS. 8A and 8B, the optical component (hereinafter referred to as the second optical component 100B) having the package according to the second embodiment (hereinafter referred to as the second package 10B) is described above. It has a second package 10B and at least one optical element 12 housed in the second package 10B.

The second package 10B has a second mounting substrate 14B and a second transparent sealing member 18B. The second mounting substrate 14B has an accommodation space 22 having an upper surface opening, and the optical element 12 is mounted in the accommodation space 22. The second transparent sealing member 18B is joined via the joining material 16 so as to close the accommodation space 22 on the second mounting substrate 14B.

The second transparent sealing member 18B includes a transparent body 20 fixed on the second mounting substrate 14B. The transparent body 20 does not have a storage space 22 like the transparent body 20 of the first transparent sealing member 18A. That is, the transparent body 20 of the second transparent sealing member 18B has a pedestal 24 fixed on the second mounting substrate 14B and a solid lens body 26 integrally formed on the pedestal 24.

Then, as shown in FIGS. 8A and 8B, the second package 10B has a storage space at least in a portion where the second transparent sealing member 18B and the second mounting substrate 14B are joined, similarly to the first package 10A. It has a step 30 or a taper 30 that suppresses the entry of the bonding material 16 into the 22. Also in the second package 10B, the step 30 or the taper 30 is formed by forming the convex portion 32 integrally or separately on the bottom surface of the second transparent sealing member 18B.

The manufacturing method of the second transparent sealing member 18B, the dimensions of the second transparent sealing member 18B, the step, the shape of the convex portion 32, and the like are the same as those of the first transparent sealing member 18A described above. Is omitted. The same applies hereinafter.

Next, as shown in FIGS. 9A and 9B, the optical component (hereinafter referred to as the third optical component 100C) having the package according to the third embodiment (hereinafter referred to as the third package 10C) is the third. It has three packages 10C and at least one optical element 12 housed in the third package 10C.

The third package 10C has a third mounting substrate 14C and a third transparent sealing member 18C. The third mounting board 14C has a storage space 22 having an upper surface opening, similarly to the second mounting board 14B described above. The third transparent sealing member 18C includes a transparent body 20 fixed on the third mounting substrate 14C. The transparent body 20 has a pedestal 24 fixed on the third mounting substrate 14C and a solid lens body 26 integrally formed on the pedestal 24.

Then, the third transparent sealing member 18C is joined to the third mounting substrate 14C via, for example, a joining material 16 so as to close the accommodation space 22 in the same manner as the second package 10B.

In particular, the third package 10C has a step 30 or a taper 30 that suppresses the entry of the bonding material 16 into the accommodation space 22 at least at the portion where the third transparent sealing member 18C and the third mounting substrate 14C are bonded. .. That is, a disc-shaped (planar shape is a circle, a quadrangle, a polygon, etc.) convex portion 32 having an area larger than the opening area of the accommodation space 22 is integrally formed on the bottom surface of the third transparent sealing member 18C. Then, a step 30 or a taper 30 is formed.

The cross-sectional shape of the step 30 or the taper 30 is the same as the shape shown in FIGS. 2A to 3B described above, and examples thereof include a step having an inclination angle of 90 ° and a step having an inclination angle of less than 90 °. In this case, the corner portion of the convex portion 32 may have an acute-angled shape, but it is preferable that the corner portion is rounded.

Next, as shown in FIGS. 10A and 10B, the optical component (hereinafter referred to as the fourth optical component 100D) having the package according to the fourth embodiment (hereinafter referred to as the fourth package 10D) is the first. It has four packages 10D and at least one optical element 12 housed in the fourth package 10D.

The fourth package 10D has a fourth mounting substrate 14D and a fourth transparent sealing member 18D. The fourth mounting substrate 14D has the same configuration as the above-mentioned first mounting substrate 14A (see FIG. 1B), and the fourth transparent sealing member 18D has the above-mentioned first transparent sealing member 18A (see FIG. 1B). It has a configuration similar to that of the above, that is, an accommodation space 22 in which the optical element 12 is accommodated.

The fourth package 10D has a step 30 or a taper 30 that suppresses the entry of the bonding material 16 into the accommodation space 22 at least at the portion where the fourth transparent sealing member 18D and the fourth mounting substrate 14D are bonded. Have. In particular, in the fourth package 10D, as shown in FIG. 10B, the step 30 or the taper 30 is formed by forming the convex portion 32 integrally or separately on the upper surface of the fourth mounting substrate 14D.

Here, an example of the step 30 or the taper 30 will be described with reference to FIGS. 11A to 15B.

As shown in FIGS. 11A and 11B, the step 30 or the taper 30 includes a step having an inclination angle of 90 ° (the cross-sectional shape of the convex portion 32 is rectangular) and an inclination angle as shown in FIGS. 12A and 12B. Examples thereof include a step 30 in which θ is less than 90 ° or a taper 30 (the cross-sectional shape of the convex portion 32 is a wedge shape).

Further, as shown in FIGS. 13A and 13C (top view), the convex portion 32 on which the step 30 or the taper 30 is formed may be formed in an annular shape, and is shown in FIGS. 13B and 13D (top view). As shown, a plurality of convex portions 32 having a step 30 or a taper 30 formed may be arranged in an annular shape. As an example, FIGS. 13A and 13B show convex portions 32 formed or arranged in an annular shape, and FIGS. 13C and 13D show convex portions 32 formed or arranged in a rectangular annular shape. As shown in FIG. 11A, these convex portions 32 are formed at positions close to the optical element 12 in the portion joined to the fourth mounting substrate 14D, and the step 30 or the taper 30 is formed on the convex portion 32. Of these, it is formed at a position facing the bonding material 16.

As shown in FIGS. 11A and 12A, the corner portion of the convex portion 32 may have an acute-angled shape, but as shown in FIGS. 11B and 12B, it is preferable that the corner portion is rounded. It is possible to avoid the phenomenon that the corner portion of the convex portion 32 is chipped at the time of contact with the transparent body 20 or the like.

Further, preferably, the step 30 or the taper 30 (height hc of the convex portion 32) is 10 to 500 μm, and the width W of the convex portion 32 is at least 50 μm. As a result, it is possible to secure a sufficient storage volume of the adhesive layer for adhering and fixing the mounting substrate and the transparent body. The width W of the convex portion 32 is preferably the size of the package, that is, the width at which the area of the portion to which the joining material 16 is applied (the joining material coating portion 34) is not excessively narrowed.

As shown in FIGS. 11A, 11B, 12A, 12B and 14A, the position of the inner end surface 32a in the convex portion 32 is the position of the inner peripheral surface 20a of the transparent body 20 (the position of the outer periphery of the accommodation space 22). ) May be adjusted. As shown in FIG. 14B, the end surface 32a is placed on the outer peripheral side of the fourth transparent sealing member 18D, provided that the area of the portion to which the bonding material 16 is applied (the bonding material coating portion 34) is not excessively narrowed. You can shift it. Further, as shown in FIGS. 15A and 15B, the end surface 32a on the accommodation space 22 side may be an inclined surface. These modifications are the same for the configurations of various packages described later.

Next, as shown in FIGS. 16A and 16B, the optical component (hereinafter referred to as the fifth optical component 100E) having the package according to the fifth embodiment (hereinafter referred to as the fifth package 10E) is the fifth. It has 5 packages 10E and at least one optical element 12 housed in the 5th package 10E.

The fifth package 10E has the same configuration as the second package 10B (see FIGS. 8A and 8B) described above, but a step 30 or a taper 30 due to the convex portion 32 is formed on the upper surface of the fifth mounting substrate 14E. It differs in that.

As for the shapes of the step 30, the taper 30, and the convex portion 32, various shapes shown in FIGS. 11A to 15B described above can be adopted.

Next, as shown in FIGS. 17A and 17B, the optical component (hereinafter referred to as the sixth optical component 100F) having the package according to the sixth embodiment (hereinafter referred to as the sixth package 10F) is the third. It has 6 packages 10F and at least one optical element 12 housed in the 6th package 10F.

Similar to the first package 10A described above, the sixth package 10F is joined to the flat plate-shaped sixth mounting substrate 14F on which the optical element 12 is mounted via the bonding material 16 on the sixth mounting substrate 14F. 6 It has a transparent sealing member 18F.

The sixth transparent sealing member 18F includes, for example, a transparent body 20 fixed on a flat plate-shaped sixth mounting substrate 14F. The outer shape of the transparent body 20 is box-shaped with a flat upper surface, and has a rectangular accommodating space 22.

Also in the sixth package 10F, various shapes shown in FIGS. 2A to 5B and FIGS. 11A to 15B described above can be adopted for the shapes of the step 30, the taper 30, and the convex portion 32.

Next, as shown in FIGS. 18A and 18B, the optical component (hereinafter referred to as the 7th optical component 100G) having the package according to the 7th embodiment (hereinafter referred to as the 7th package 10G) is the third. It has a 7-package 10G and at least one optical element 12 housed in the 7th package 10G.

The seventh package 10G has almost the same structure as the third package 10C (see FIGS. 9A and 9B) described above, but the shape of the transparent body 20 is different, and the upper surface is a flat plate shape. That is, the solid lens body 26 has a shape in which it is omitted.

Also in the 7th package 10G, various shapes shown in FIGS. 2A to 5B and FIGS. 11A to 15B described above can be adopted for the shapes of the step 30, the taper 30, and the convex portion 32.

[Summary of Embodiment]
[1] In the package according to the present embodiment, a space (12) in which a transparent sealing member (18: 18A to 18G) and a mounting substrate (14: 14A to 14G) are joined to accommodate at least one optical element (12). In the package (10: 10A to 10E) having 22), the joining material (16) enters the space (22) at the portion where the transparent sealing member (18) and the mounting substrate (14) are joined. It has a step (30) or a taper (30) that suppresses.

According to the above configuration, when the transparent sealing member 18 is joined to the mounting substrate 14, the step 30 or the taper 30 suppresses the entry of the joining material 16 (resin, metal, etc.) into the accommodation space 22. The light emitted from the element 12 (for example, ultraviolet light 13) is hardly blocked by the bonding material 16, and a decrease in the overall light transmittance can be suppressed.

Further, even when pressurization and heating are performed when the transparent sealing member 18 is bonded to the mounting substrate 14, the step 30 or the taper 30 suppresses the entry of the bonding material 16 into the accommodation space 22. Therefore, it is possible to suppress a phenomenon such as the volatile component of the bonding material 16 adhering to the optical element 12. This leads to suppressing deterioration of the quality of the optical element 12 and the optical component (100: 100A to 100G).

[2] In the present embodiment, the inclination angle of the step (30) or the taper (30) is preferably 20 ° or more and 90 ° or less.

[3] In the present embodiment, at least one of the transparent sealing member (18) and the mounting substrate (14) has a convex portion (32) at a portion to be joined, and the step (30) or taper (30) is formed. , Of the convex portion (32), it is formed at a position facing the bonding material (16). As a result, when the transparent sealing member 18 is joined to the mounting substrate 14, the entry of the joining material 16 into the accommodation space 22 can be efficiently suppressed by the step 30 or the taper 30 of the convex portion 32.

[4] In the present embodiment, the step (30) or the taper (30) is formed in an annular shape. As a result, the step 30 or the taper 30 formed in an annular shape can suppress the entry of the joining material 16 into the accommodation space 22.

[5] In the present embodiment, a plurality of steps (30) or tapers (30) are arranged in an annular shape. Also in this case, the plurality of steps 30 or tapers 30 arranged in an annular shape make it possible to suppress the entry of the joining material 16 into the accommodation space 22.

[6] In the present embodiment, the step (30) or the taper (30) is formed at a position close to the optical element (12) in the portion joined to the mounting substrate (14). By forming the step 30 or the taper 30 at a position close to the optical element 12, it is possible to suppress the entry of the bonding material 16 into the accommodation space 22.

[7] In the present embodiment, the step (30) is a part of a rectangular cross section. Of the part having a rectangular cross section, the surface facing the joining material 16 forms a step 30, and it is possible to suppress the entry of the joining material 16 into the accommodation space 22.

[8] In the present embodiment, the taper (30) is a part of a wedge shape in cross section, and the portion having a high taper (30) is located close to the optical element (12). Of the wedge-shaped convex portions 32 in cross section, the surface facing the bonding material 16 forms an inclined surface, and the space into which the bonding material 16 enters becomes narrower as it approaches the optical element 12. As a result, it is possible to suppress the entry of the joining material 16 into the accommodation space 22.

[9] In the present embodiment, the height (hc) of the step (30) or the taper (30) (for example, the height in the direction perpendicular to the plate surface of the mounting substrate (14)) is preferably 10 to 500 μm. .. If it is less than 10 μm, the amount of the bonding material (adhesive layer) becomes small, and it becomes difficult to secure the adhesive force to the mounting substrate 14 or the transparent sealing member 18. If it exceeds 500 μm, the strength of the step 30 or the taper 30 decreases, and there is a risk of damage. Further, if it is less than 10 μm, the effect of suppressing the protrusion of the bonding material 16 is not sufficient. If it exceeds 500 μm, the height relationship (ha> hb) with the optical element 12 is not established, and as a result, the ultraviolet light 13 may hit the bonding material 16.

[10] In the present embodiment, the width of the step (30) or the taper (30) does not excessively narrow the size of the package, that is, the area of the portion to which the bonding material 16 is applied (bonding material coating portion 34). The width is preferable. That is, it is preferably at least 50 μm. If it is less than 50 μm, the effect of suppressing the protrusion of the bonding material 16 is not sufficient.

[11] In the present embodiment, it is preferable that the corners of the step (30) or the taper (30) are curved, that is, the corners are rounded. It is possible to avoid the phenomenon that the corner portion of the convex portion 32 is chipped at the time of contact with the mounting substrate 14.

[12] The transparent sealing member (18) according to the present embodiment is a transparent sealing member (18) having a joint surface (bonding material coating portion 34) to be joined to the mounting substrate (14), and is transparently sealed. It has a step (30) or a taper (30) that suppresses the entry of the bonding material (16) into the stop member (18).

According to the above configuration, when the transparent sealing member 18 is joined to the mounting substrate 14, the step 30 or the taper 30 suppresses the entry of the joining material 16 into the accommodation space 22, so that the light emitted from the optical element 12 However, it is hardly obstructed by the bonding material 16, and it is possible to suppress a decrease in the overall light transmittance.

It should be noted that the package and the transparent sealing member according to the present invention are not limited to the above-described embodiments, and of course, various configurations can be adopted without departing from the gist of the present invention.

10A to 10G ... 1st package to 7th package 12 ... Optical element 12a ... Light emitting surface 13 ... Ultraviolet light 14A to 14G ... 1st mounting substrate to 7th mounting substrate 14a ... Bottom surface 16 ... Bonding material 18A to 18G ... 1st Transparent sealing member-7th transparent sealing member 20 ... Transparent body 20a ... Inner peripheral surface 22 ... Accommodating space 24 ... Pedestal 26 ... Lens body 30 ... Step or taper 32 ... Convex portion 32a ... End face 100A to 100G ... First optical Parts-7th optical component 200 ... Package (comparative example)

Claims (12)

A package in which a transparent sealing member and a mounting substrate are bonded to each other and have a space for accommodating at least one optical element.
A package having a step or taper at a portion where the transparent sealing member and the mounting substrate are joined to prevent the joining material from entering the space. In the package according to claim 1,
A package in which the inclination angle of the step or taper is 20 ° or more and 90 ° or less. In the package according to claim 1 or 2.
At least one of the transparent sealing member and the mounting substrate has a convex portion at a portion to be joined, and the step or taper is formed at a position of the convex portion facing the joining material. package. In the package according to any one of claims 1 to 3,
A package in which the step or taper is formed in an annular shape. In the package according to any one of claims 1 to 3,
A package in which a plurality of the steps or tapers are arranged in an annular shape. In the package according to any one of claims 1 to 5,
A package in which the step or taper is formed at a position close to the optical element in a portion joined to the mounting substrate. In the package according to any one of claims 1 to 6,
The package, in which the step is a part of a rectangular cross section. In the package according to any one of claims 1 to 6,
A package in which the taper is a part of a wedge shape in cross section, and a portion having a high taper is located close to the optical element. In the package according to any one of claims 1 to 8.
A package in which the height of the step or taper is 10 to 500 μm. In the package according to any one of claims 1 to 9,
The width of the step or taper is at least 50 μm, the package. In the package according to any one of claims 1 to 10.
A package in which the corners of the step or taper are curved. A transparent sealing member having a joint surface to be joined to a mounting substrate.
A transparent sealing member having a step or taper that suppresses the entry of the bonding material into the inside of the transparent sealing member.

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