JP2020201283A - Substrate inspection device, inspection tool, and substrate inspection method therefor - Google Patents

Abstract

To provide a substrate inspection device that with time shortens setup time required for registration setting of a new substrate, and change of substrate models.SOLUTION: An inspection tool mounted on a substrate inspection device for inspecting a substrate having plural inspection terminals and substrate position marks is provided with plural probes, guide holes for guiding a tip of the probes to the inspection terminals, and a guide plate having plural tool position marks, and is moved by an inspection tool moving part. A transportation table for holding and transporting the substrate includes plural table position marks, and an auxiliary camera which recognizes the plural tool position marks. A main camera moves relatively with the transportation table and recognizes the plural position marks on the transportation table. In the substrate inspection device, a control device determines an origin position of a control coordinate of an orthogonal coordinate and a direction of a coordinate axis, on the basis of the plural table position marks recognized by the main camera, and further, the substrate and the inspection tool are positionally recognized from a position on the control coordinate of each position mark recognized by the main camera and the auxiliary camera, in order to be adjusted.SELECTED DRAWING: Figure 2

Description

The present invention relates to a substrate inspection device and an inspection jig having an automatic alignment function in which a contactor is brought into contact with an inspection terminal of a wiring pattern formed on a printed wiring board to mainly electrically inspect the wiring pattern.

The present invention is not limited to printed wiring boards, and various substrates and semiconductors such as flexible substrates, multilayer wiring boards, electrode plates for liquid crystal displays and plasma displays, ceramic and resin substrates for semiconductor packages, and film carriers. It can be applied to the inspection of electrical wiring characteristics formed on wafers and the like. In this specification, these various wiring boards are collectively referred to as "boards".

In recent years, multi-layer boards using a build-up method that supports fine and high density printed wiring boards have become standing. The substrate produced by this manufacturing method has many fine via holes that are wirings between layers. As one of the reliability tests, a four-terminal measurement (Kelvin method) is performed in which the internal wiring resistance between the inspection terminals is accurately measured to determine the quality. In this case, two contacts are brought into conductive contact with a large number of fine inspection terminals at the same time. In order to carry out this inspection, accurate alignment is required to align the substrate with the inspection jig. Prior art for this alignment includes:

In Patent Document 1, the main camera 44 of the main body reads the table positioning mark 57 of the transport table that transports the substrate 2, determines the origin of the reference coordinate system, and further, the auxiliary camera 55 of the transport table sets the inspection jig positioning mark. The positions of the inspection jig 41 are recognized by reading 47A and 47B. Next, a configuration for recognizing the position of the substrate by reading the substrate positioning marks 2A and 2B with the main camera will be disclosed. According to it, the positional relationship between the board and the inspection jig is calculated and the position is calculated by utilizing the fact that the positional relationship between the main camera and the auxiliary camera becomes a natural constant via the table positioning mark. By calculating the deviation and correcting and matching the position of the inspection jig, the position of the pattern of the substrate and the contact of the inspection jig are matched.

Further, in order to confirm the alignment state and detect and correct the misalignment of the substrate by the inspection press or the like, a alignment confirmation camera 45 is provided inside the inspection jig, and the inspection is performed in the state of the press at the time of inspection. An image is taken of a state in which the through hole 46 for confirming the alignment of the jig and the substrate positioning mark 2A are coaxially overlapped, and if the displacement of the substrate exceeds the allowable range, the press is released and realignment is performed.

However, the center of multiple inspection patterns and the needle tip of the contacts are perfect because there are manufacturing errors in processing and assembly, although the dedicated inspection jig has a large number of contacts that match the manufactured substrate. If the inspection pattern is small or the manufacturing error of the needle tip is large, the contact may deviate from the inspection pattern and the continuity inspection may not be PASS.
Furthermore, in order to confirm the alignment during inspection, it is necessary to install a matching confirmation camera (including the lighting unit) inside the dedicated inspection jig, but the density of the substrate is increasing and the contacts Due to the increase in the number of cameras, the physical restrictions on the space for installing the camera configuration in the inspection jig increase, making installation difficult.

Further, in the general-purpose inspection jig 104 that sequentially inspects all circuit patterns with the pair of movable contacts 142A and 142B of the second embodiment, the tip of the pair of contacts is the light of the auxiliary camera 55. The position of the contactor is recognized by aligning with the axis, and the coordinate system of the general-purpose inspection jig is aligned with the reference coordinate system.
Further, a matching confirmation camera 45 is provided for the displacement of the substrate due to a large number of contacts of the pair of movable contacts, and the table positioning marks 47A and 47B (the code is estimated to be 57) after the inspection. And the substrate positioning marks 2A and 2B are imaged to detect the positional deviation of the substrate, and realignment is performed in the same manner as in the first embodiment.
However, there is a problem in mass-produced products because it takes too much time to integrate all the movements by sequentially moving the contacts to all the circuit patterns on one substrate for inspection.

In Patent Document 2, FIG. 7 of the present application shows the state of variation in the error of the pin group (contact group) at the time of manufacturing the inspection jig. Then, the means for improvement is described. The deviation of the pin position in the XY direction of some or all of the inspection pins from the design position is measured, and the measured deviation is averaged to obtain the pin deviation average, which is provided in the inspection jig. The deviation of the jig position mark in the XY direction from the design position is measured to obtain the jig position mark deviation, and the pin deviation average and the jig position mark deviation (average) are individually or combined. It is registered in the substrate inspection device, and based on the data, optical alignment is performed from the positions of the substrate position mark acquired by the substrate camera 24 and the jig position mark acquired by the jig camera 21.
To acquire the pin group and the jig position mark position, specifically, the through hole of the pin group and the jig position mark when the processing of the first pin holding member 134 that holds the tip end side of the pin is completed. Is substituted with the actually measured length measurement value (actual measurement value).
However, as the jig position data registered in the substrate inspection device, the deviation of the pin group is the average value of the XY components and the deviation amount of each pin does not matter. Therefore, the area where the inspection terminal is small and the deviation amount of the pins Large inspection terminals can cause contact loss.

In Patent Document 3, the lower imaging unit 4 is moved to image a pair of reference points of the upper probe jig, and the upper imaging unit 3 similarly images a pair of lower reference points of the lower probe jig. At the time of inspection, the upper and lower imaging units are returned to the reference position T, and the front and back surfaces of the IC package substrate are individually imaged with a pair of reference points on the front and back surfaces of the substrate for image analysis, and the front and back surfaces of the substrate are analyzed. The deviation correction amount is calculated and the upper probe jig and the lower probe jig are individually corrected in the X-axis, Y-axis, and θ directions. In this configuration, the two upper and lower imaging units 3, 4 (cameras) can recognize the front and back of the IC package substrate and the positions of the upper and lower probe jigs.
However, it is a condition that the positions of the upper and lower cameras and the optical axis coincide with the reference position T, and the three coordinate systems of the feed mechanism and the work feed mechanism 5 of the upper and lower cameras match. There is a risk that the optical axis, including the optical axis, may deviate from each other before, after, or during operation over time, and if even one of them deviates, readjustment is required. In addition, the reference signs (marks) of these three coordinate systems are not disclosed, and there is a problem that readjustment on site is not easy.

In Patent Document 4, a dent sheet of pressure-sensitive paper (a white sheet that changes color to black when pressure is applied) is attached to a substrate, and a test head is pressed to obtain dents on the probe P to obtain a linear shape. Since the position of a specific dent is recognized by the camera of the apparatus and statistically processed, the "positional deviation amount" and the "positional deviation direction", which are the states of the displacement of all the probes P, are specified. This is solved by attaching a dent sheet to the difficulty of identifying an unclear dent of the probe P directly from the substrate.
However, this work is necessary every time the test head is mounted on the device, which is a burden on the operator. In addition, when the probe is malfunctioning and needs to be replaced, the test head will be removed from the device, so it is necessary to perform this operation again.

In response to this above problem, in Patent Document 5, the periphery of the above-mentioned optically aligned optical position is searched by an electric inspection to obtain a central position suitable for the electric inspection, and the difference from the position of the electric inspection is obtained. The data representing the above is written and read to the main storage device of the device or the storage means of the inspection jig on a one-to-one basis with the inspection jig, and the data is aligned based on the data representing the difference.
Further, with respect to the substrate inspection apparatus, the master scale is used to standardize the measurement criteria of the substrate inspection apparatus and perform calibration to remove the inherent error of each of the plurality of substrate inspection apparatus.

However, in the case of electrical exploration, the same substrate of the sample is moved a little from the optical position and pressed many times, which causes a problem that the sample substrate is damaged.
Further, as a calibration for removing the peculiar error of each of the plurality of board inspection devices, the peculiar characteristics of each device may still remain only by setting the origin of the XY coordinate system by the main camera and the master scale.
Further, although it is assumed that the substrate is manufactured as designed, there are variations in the positional error in the target mark position and the like in the manufacturing process of the substrate.
As described above, various measures have been taken to recognize the positions of the inspection jig and the substrate before the inspection and to align the inspection jig with the substrate, but there is room for improvement.

Japanese Unexamined Patent Publication No. 2000-055791 Japanese Unexamined Patent Publication No. 2013-164381 Japanese Unexamined Patent Publication No. 10-332763 Japanese Unexamined Patent Publication No. 2014-159978 JP-A-2010-169651

In the alignment method of Patent Documents 1 to 4, the inspection terminal of the substrate and the contactor of the inspection jig are likely to have a PASS suitable for the electrical inspection at a position slightly shifted from the position where the substrate is optically aligned. There may be electrical positions suitable for matching. Therefore, in Patent Document 5, the data of the difference between the optical position and the electric position is stored as a manufacturing error of the inspection jig on a one-to-one basis and added to the optical position. However, if the board inspection device to be mounted changes, the electrical position may also change, and the electrical search around the optical position is performed again to recognize the electrical position that matches the electrical inspection, and the conforming position is different from the existing position. If this is the case, it is necessary to correct the alignment data so that the matching position becomes the target position for alignment.

Further, when using a plurality of substrate inspection devices and a plurality of inspection jigs, if the combination thereof is changed, the data of the difference between the optical position and the electrically compatible position may be corrected again, so the product name of the inspection board. Setup time may be longer when changing.
From the above situation, it can be seen that each of the plurality of substrate inspection devices, inspection jigs, and substrates still has an error factor due to the variation in manufacturing error. Appropriate measures are required for the factors of each part.

From the above viewpoint, the present invention minimizes the difference between the optical position and the electrical position, and one registration of the difference provides a more appropriate optical alignment that can be applied to a plurality of devices over time. Realize. An object of the present invention is to provide a substrate inspection device for shortening the setup time for registering and setting a new substrate for a new product and changing a substrate model, an inspection jig mounted on the substrate inspection jig, and an alignment method thereof.

The first means of the present invention is a board inspection device for inspecting the electrical characteristics of a plurality of inspection terminals to which an electric circuit is wired and a board having a plurality of board position marks. A replaceable inspection jig that brings the probe into contact, an inspection jig moving part that holds the inspection jig in the inspection jig holding part and moves it, and a plurality of table position marks that hold the substrate in the board holding part and convey it. An inspection jig including a transfer table and a main camera that moves relative to the transfer table and recognizes a plurality of position marks on the transfer table including a plurality of board position marks and a plurality of table position marks. Has a guide hole that guides the tip of the probe to the inspection terminal and a guide plate with multiple jig position marks, and the transport table moves relative to the inspection jig to display multiple jig position marks. There is an auxiliary camera that recognizes, and the board inspection device determines the position of the origin of the control coordinates, which are orthogonal coordinates based on the plurality of table position marks recognized by the main camera, in the optical alignment for aligning the board and the inspection jig. It is further equipped with a control device that determines the direction of the coordinate axes and controls the relative movement of the inspection jig and the transfer table, and the control device sets the position of the board on the control coordinates from a plurality of board position marks recognized by the main camera. A substrate inspection device characterized in that the substrate and the inspection jig are aligned by recognizing and recognizing the position of the inspection jig on the control coordinates from a plurality of jig position marks recognized by the auxiliary camera.

In the second means of the present invention, in the first means, there are three or more table position marks, two or more near one axis of the control coordinates, and one or more apart from each other.
In the third means of the present invention, in the first or second means, a matching camera that recognizes a plurality of position marks on the transport table is attached to the inspection jig holding portion, and the control device is the main camera or matching. Based on the multiple table position marks recognized by the camera, the X-axis of the control coordinates of the movement of the transport table in the X-direction or Y-direction, and the movement of the inspection jig holding portion by the inspection jig moving portion in the X-direction or Y-direction. And the deviation from the Y axis is recognized, and the movement of the transport table in the X direction or the Y direction and the movement of the inspection jig holding portion in the X direction or the Y direction by the inspection jig moving portion are controlled based on the recognized deviation. To correct.
In the fourth means of the present invention, in the third means, the XY standard scale having the calibration data is held in the substrate holding portion, and the main camera or the matching camera recognizes a plurality of predetermined positions on the XY standard scale. The control coordinates are calibrated according to.

In the fifth means of the present invention, in the third or fourth means, the auxiliary camera has an auxiliary camera position mark fixed to the transport table to indicate the position of the optical axis thereof, and the control device is the main camera or the matching. The position of the auxiliary camera is recognized on the control coordinates by the auxiliary camera position mark recognized by the camera.
According to the sixth means of the present invention, in any of the third to fifth means, the control device X of the transport table based on a plurality of table position marks recognized by the main camera or the matching camera for each predetermined condition. The deviation of the control coordinates of the movement in the direction or the Y direction and the movement of the inspection jig holding portion by the inspection jig moving portion in the X direction or the Y direction from the X axis and the Y axis is recognized, and based on the recognized deviation. Corrects the movement of the transport table in the X or Y direction and the control of the movement of the inspection jig holding part in the X or Y direction by the inspection jig moving part, and is based on a plurality of jig position marks recognized by the auxiliary camera. The position of the inspection jig is recognized on the control coordinates.

In the seventh means of the present invention, in any of the first to sixth means, the control device comprises a plurality of resist position marks selected from a plurality of openings of the resist mask on the substrate surface recognized by the main camera. The position deviation of the resist mask from the inspection terminal is recognized from the plurality of board position marks, and the position deviation is reflected in the recognition of the position of the board.
The eighth means of the present invention is any of the first to seventh means, wherein the control device or inspection jig has a storage unit, or the control device has an external interface connected to the external storage means. The control device recognizes the difference between the optically aligned optical position and the electrical position conforming to the electrical inspection of the inspection jig, and generates data representing the recognized difference on a one-to-one basis with each inspection jig. Data representing the difference stored in the storage unit or the external storage means and associated with the inspection jig held in the inspection jig holding unit is read from the storage unit or the external storage means, and the data representing the read-out difference is represented. Align based on.

The ninth means of the present invention is the preparation step of preparing the board inspection device in any of the first to eighth means, and the main camera moves relative to the transfer table to form a plurality of board position marks. The process of recognizing a plurality of position marks on a transport table including a plurality of table position marks, and the position of the origin of control coordinates which are orthogonal coordinates based on the plurality of table position marks recognized by the main camera. The process of determining the direction of the coordinate axes, the process of the auxiliary camera moving relative to the inspection jig mounted on the inspection jig holding part to recognize multiple jig position marks, and the process of placing the board on the board holding part. The process of mounting, the process of the main camera moving relative to the transport table to recognize multiple board position marks on the mounted board, and the process of the control device recognizing multiple board positions recognized by the main camera. By recognizing the position of the board on the control coordinates from the mark and recognizing the position of the inspection jig on the control coordinates from the multiple jig position marks recognized by the auxiliary camera, the board and the inspection jig are matched. A substrate inspection method comprising a matching step, and after the matching step, a step of bringing the substrate into contact with an inspection jig for electrical inspection.

The tenth means of the present invention is the ninth means, in which the preparation step is a board inspection device in which a matching camera that recognizes a plurality of position marks on a transfer table is attached to an inspection jig holding portion as a board inspection device. The prepared board inspection method includes a mark recognition step in which the main camera or the matching camera moves relative to the transport table to recognize a plurality of table position marks, and a plurality of control devices recognized in the mark recognition step. From the X-axis and Y-axis of the control coordinates of the movement of the transport table in the X-direction or Y-direction and the movement of the inspection jig holding portion in the X-direction or Y-direction by the inspection jig moving portion based on the table position mark of Based on the deviation recognition process that recognizes the deviation and the deviation recognized by the control device in the deviation recognition process, the movement of the transport table in the X or Y direction, and the X of the inspection jig holding unit by the inspection jig moving unit. A correction step of correcting the control of movement in the direction or the Y direction is further included.
The eleventh means of the present invention is the step of causing the substrate holding portion to hold the XY standard scale having the calibration data in the tenth means, and the main camera or the matching camera moves relative to the transfer table. It further includes a step of recognizing a plurality of predetermined positions on the XY standard scale and a step of the control device calibrating the control coordinates based on the recognized plurality of predetermined positions.

The twelfth means of the present invention is the tenth or eleventh means, in which the preparation step is a substrate inspection device, which is a substrate having an auxiliary camera position mark fixed to a transport table and indicating the optical axis position thereof. An inspection device is prepared, and the board inspection method is a process in which the main camera or the matching camera moves relative to the transport table to recognize the auxiliary camera position mark, and the control device recognizes the main camera or the matching camera. The step of recognizing the position of the auxiliary camera on the control coordinates by the auxiliary camera position mark is further included.
In the thirteenth means of the present invention, in any of the tenth to twelfth means, the main camera or the matching camera moves relative to the transport table for each predetermined condition to recognize a plurality of table position marks. Based on the mark recognition process and the plurality of table position marks recognized in another mark recognition process, the movement of the transport table in the X or Y direction, and the inspection jig holding by the inspection jig moving part. A transport table based on another deviation recognition step that recognizes the deviation of the control coordinates of the movement of the jig in the X direction or the Y direction from the X axis and the Y axis, and the deviation recognized by the control device in another deviation recognition process. The step of correcting the movement of the inspection jig holding part in the X direction or the Y direction and the control of the movement of the inspection jig holding part by the inspection jig moving part in the X direction or the Y direction, and the auxiliary camera with the inspection jig for each of the predetermined conditions. Based on the jig position mark recognition process that moves relatively and recognizes a plurality of jig position marks and the multiple jig position marks recognized by the control device in the jig position mark recognition process, the inspection cure. It further includes a step of recognizing the position of the jig on the control coordinates.

In the fourteenth means of the present invention, in any of the ninth to thirteenth means, the main camera moves relative to the transport table, and a plurality of resists among the plurality of openings of the resist mask on the surface of the substrate are used. The process of recognizing the position mark together with multiple board position marks,
The control device further includes a step of recognizing the position deviation of the resist mask from the inspection terminal from the recognized plurality of resist position marks and the plurality of substrate position marks, and reflecting the position deviation in the recognition of the position of the substrate. ..
The fifteenth means of the present invention is any of the ninth to fourteenth means, and in the preparation step, a control device or a board inspection device in which the inspection jig has a storage unit is prepared as the board inspection device, and the board is inspected. The method is a process in which the control device recognizes the difference between the optically aligned optical position and the electric position suitable for the electric inspection for the inspection jig, and the data representing the recognized difference is individually displayed by the control device. The process of storing in the storage unit in a one-to-one relationship with the inspection jig and the control device reads out from the storage unit data representing the difference associated with the inspection jig held in the inspection jig holding unit. The matching step further includes a step of matching the substrate and the inspection jig based on the data representing the difference read by the control device.

The sixteenth means of the present invention recognizes a plurality of table position marks by moving relative to the transport table for each predetermined condition during continuous automatic inspection in any of the ninth to fifteenth means. The control device checks the difference between the table position mark recognition process and the start of continuous automatic inspection of multiple table position marks recognized in the table position mark recognition process, and determines the position of the origin of the control coordinates and the direction of the coordinate axes. It further includes a step of resetting and a step of the auxiliary camera recognizing a plurality of jig position marks for each predetermined condition during continuous automatic inspection.

The 17th means of the present invention is the substrate inspection method of any of the 9th to 16th means, in which the control device has control coordinates that are orthogonal coordinates based on a plurality of table position marks recognized by the main camera. The process of determining the position of the origin and the direction of the coordinate axis, the process of the auxiliary camera moving relative to the inspection jig to recognize the position of multiple jig position marks on the control coordinates, and the process of recognizing multiple jig position marks on the substrate holding part. The transfer table is an inspection jig so that the process of fixing the pressure-sensitive recording plate with the pressure-sensitive sheet attached to the part facing the tool position mark and the inspection position of the pressure-sensitive recording plate directly under the inspection jig. The process of moving relative to the jig and the guide plate of the inspection jig are pressed against the pressure-sensitive recording plate, thereby recording the pressure contact marks of multiple jig position marks on the pressure-sensitive sheet as multiple pressure-sensitive position marks. After that, the inspection jig moving unit moves the inspection jig so as to release the press, and then the main camera moves relative to the board recognition position where the board is recognized, and the main camera moves the transfer table. The process of recognizing multiple pressure-sensitive position marks recorded on the pressure-sensitive pressure-sensitive sheet fixed to the substrate holding portion, and the control coordinates of multiple jig position marks at the inspection position recognized by the auxiliary camera. It further includes a step of verifying that the position matches the position on the control coordinates of the plurality of jig position marks at the inspection position recognized by the main camera through the plurality of pressure sensitive position marks at the substrate recognition position.

The eighteenth means of the present invention is an inspection jig mounted on a substrate inspection device for inspecting the electrical characteristics of a substrate having a plurality of inspection terminals to which an electric circuit is wired.
The inspection jig main body is provided with a recording medium on which data is recorded, and the inspection jig main body includes a jig base held in the inspection jig holding portion of the substrate inspection device and a plurality of jig bases in contact with inspection terminals. The guide plate includes a probe, a probe holding portion for holding a plurality of probes, and a guide plate having a plurality of guide holes for guiding the tips of the plurality of probes to the inspection terminal, and the guide plate can optically recognize the position. It has a plurality of jig position marks, and the data of the recording medium includes the design position data of the plurality of jig position marks and the corrected position data of the plurality of jig position marks. The corrected position data is the contact point group of the plurality of probes set from the design inspection points of the plurality of inspection terminals on the substrate and the measurement positions of the plurality of guide holes or the tip group of the plurality of probes. It is the position data of a plurality of jig position marks corrected from the measurement positions of the plurality of jig position marks so that the position and the position are appropriately matched.

In the nineteenth means of the present invention, the condition for proper matching in the eighteenth means is the amount of deviation of the positions of the contact point groups of the plurality of probes from the design inspection points of the plurality of inspection terminals, or a plurality of conditions. It is determined from the margin amount that deviates from the design area of the inspection terminal.
A twentieth means of the present invention is the eighteenth or nineteenth means, wherein the inspection jig includes a storage means in which data is written and read by a substrate inspection device, and the storage means includes a recording medium.

The 21st means of the present invention is a method for manufacturing an inspection jig in any of the 18th to 20th means, which includes a step of creating corrected position data of a plurality of jig position marks. Is the process of creating design data for multiple inspection terminals on the substrate, the positions of multiple jig position marks on the manufactured inspection jig body, and the positions of multiple guide holes or the positions of the tips of multiple probes. The process of measuring, the process of setting the position of the contact point group of a plurality of probes from the measured position, and the rotation amount of the contact point group of a plurality of probes for suitable matching with a plurality of inspection terminal groups of the substrate. Includes a step of exploring and determining the amount of movement, and a step of creating corrected position data corrected from the measurement positions of a plurality of jig position marks so as to correspond to the determined amount of rotation and amount of movement. Manufacturing method of inspection jig.

According to the first or ninth means of the present invention, the substrate and the inspection jig are automatically optically aligned with each other over time from a plurality of position marks optically automatically recognized by the main camera and the auxiliary camera. It can reduce the burden on workers. Since there are multiple permanent fixed table position marks, the position (X, Y, Θ) of the transport table is recognized as at least a surface on the control coordinates of the Cartesian coordinates that the main camera recognizes by moving relative to the previous surface. Changes over time can be seen from the difference from the position recognition of, and when setting the origin of Cartesian coordinates and the direction of the coordinate axes to the control coordinates, appropriate measures such as resetting, correction, and warning of various mechanism bodies can be taken. .. For example, if the surface is translated, it is reset as the optical axis movement of the main camera. The relative movement of the main camera can be maintained over time on the control coordinates within the range of the XY plane distortion of the transport table, and the recognition of a plurality of surfaces and the alignment of the control can be reproduced over time.
Since the control coordinates recognized by the camera moving relative to each other are Cartesian coordinates, the control coordinates are defined as the center point and its rotation regardless of the direction in which the multiple position marks on each recognition surface are located. Can be properly recognized above.
There are guide holes that slideably guide the tips of probes that come into contact with multiple inspection terminals on the board. Since there are multiple jig position marks fixed on the guide plate, the position variation of the tips of multiple probes is limited and stable. To do. Further, since the two cameras can recognize a plurality of position marks facing each other at any time, the change with time can be known and the reproducibility of the alignment can be ensured.

According to the second means of the present invention, since the transport table has three or more fixed plurality of table position marks at two-dimensional positions, it functions as a permanent XY scale (main body constant) and the main camera. The change with time such as the degree of orthogonality of the XY moving part of the above can be clearly seen. It is possible to distinguish between the rotation of the moving part and the degree of orthogonality. In addition, correction can be performed based on a plurality of table position marks at any time.
Since the camera moves relative to each other to recognize the position, it may be necessary to recognize the XY scale in a timely manner and correct the moving portion over time.
According to the third or tenth means of the present invention, the relative movement control is corrected and the movement on the control coordinates is performed based on the positional deviation of the plurality of table position marks recognized by the main camera and the matching camera. The reproducibility of camera recognition is stable. The transport table can correspond to the configuration of various mechanism bodies such as a rotary table. Relative movement (translation) between the board recognition position and the inspection position can be secured on the control coordinates.

According to the fourth or eleventh means of the present invention, the length (straightness), the angle (rotation, parallelism, straightness), and the orthogonality (intersection angle) are calibrated based on the XY standard scale having the calibration data. Can be treated. If it has an XY standard scale calibration certificate, it will be more compatible. This can guarantee the accuracy of the mechanism body after the moving parts of each axis are delivered on the control coordinates. Further, when a plurality of units are installed and operated, it can be improved by calibrating and correcting the variation of the error between the devices. Then, the moving portion can be corrected over time based on the recognition position data (main body constant) of the plurality of table position marks after calibration.
According to the fifth or twelfth means of the present invention, since the auxiliary camera position mark is position-recognized on the control coordinates by the main camera or the matching camera, the assembly error of the plurality of substrate inspection devices can be eliminated.
According to the means of the sixth, thirteenth, and sixteenth of the present invention, even during the continuous automatic inspection, the state of the mechanism main body such as a plurality of predetermined position marks and the room temperature of the device operation is automatically recognized under predetermined conditions, so that control is possible. It can also be corrected on the coordinates. With this, the state at the start of the inspection can be maintained and recovered. Further, it is ensured that the surface of the substrate and the surface of the inspection jig are relatively appropriate on the control coordinates over time.

According to the 7th or 14th means of the present invention, a plurality of resist position marks are also optically recognized, and it corresponds to an electrical inspection in which a plurality of probes reflecting the amount of resist displacement in the substrate manufacturing process are brought into contact with the inspection terminal. Correction recognition can be performed on the position of the board to be used.
According to the eighth, fifteenth, and twenty means of the present invention, if there is a difference between the proper optical position of the optical alignment and the electric position suitable for the actual electric inspection, it is unique to one inspection jig. By storing it as a characteristic value and reading it out as data representing individual differences, it can be shared by a plurality of board inspection devices.
According to the seventeenth means of the present invention, by using the pressure-sensitive recording plate to which the pressure-sensitive sheet is attached, the jig position mark is pressure-welded to the pressure-sensitive sheet and used as the pressure-sensitive position mark by the main camera. Can be recognized. It can be verified that the recognition positions of the plurality of jig position marks of the auxiliary camera and the positions of the plurality of jig position marks recognized through the recognition positions of the pressure-sensitive position marks of the main camera on the control coordinates are the same. If they match, the position recognition of the inspection jig of the auxiliary camera is demonstrated.

According to the 18th to 21st means of the present invention, the position data of the plurality of jig position marks indicating the positions of the inspection jigs are calculated and matched appropriately with the inspection terminal group by the contact point group of the probe in consideration of the manufacturing error. Since there is corrected position data of a plurality of jig position marks corrected from the measured position at the time of measurement, the inspection jig can be optically more appropriately aligned. The difference from the design position data means that the manufacturing error has been corrected.
According to the nineteenth means of the present invention, the contact point cloud between the substrate and the inspection jig can be properly matched according to the substrate characteristics such as the shape and arrangement of the plurality of inspection terminals on the substrate.
Correction and verification based on calculation matching before delivery of the inspection jig is a useful means for evaluating the feasibility and margin of inspection. The difference between the optical position and the electrical position of alignment can be minimized. From these, the setup at the time of delivery of the inspection jig manufactured in the new period is easy and the time can be shortened.
Although the effects of the invention have been described for each means of the present invention, the common specific matters have the same effects on other means. It may also interact.

FIG. 1 is an overall explanatory view showing the substrate inspection apparatus of the present invention. FIG. 2 is a perspective view illustrating the relative movement of the transfer table and the inspection jig of FIG. 1 on control coordinates. FIG. 3 is a cross-sectional view illustrating the auxiliary camera. FIG. 4 is an explanatory diagram of the design data of the substrate and the inspection jig and the guide plate. FIG. 5 is an explanatory view of a side view, a bottom view, and a partially enlarged view of the inspection jig. FIG. 6A is an explanatory diagram of a matching jig used for recognizing the mechanism main body. FIG. 6B is an example diagram of the XY standard scale. FIG. 7 is a conventional example of a distribution map of an error in the probe position of the inspection jig. FIG. 8A is an explanatory view in which the auxiliary camera captures the jig position mark. FIG. 8B is an explanatory view in which the auxiliary camera images the jig position mark hole. FIG. 9A is an explanatory view in which the main camera images the pressure-sensitive position mark (convex portion). FIG. 9B is an explanatory view in which the main camera captures a pressure-sensitive position mark (hole). FIG. 10 is an explanatory view of a rotary table in which the substrate of the mechanism main body is conveyed.

Hereinafter, a substrate inspection device, an inspection jig, a substrate, and a method of alignment according to a desirable embodiment of the present invention will be described with reference to the accompanying drawings.
[Embodiment 1]

FIG. 1 is an explanatory view of a right side surface showing a substrate inspection device 1 according to the present invention. An orthogonal coordinate system based on the XYΘZ axis is shown from the viewpoint of clarifying the moving directions of the transport table 21 that transports the substrate 2 and the inspection jig moving portions 30 and 30B on the upper and lower sides. For each axis, the direction of the arrow on the paper in FIG. 1 is the positive direction. When indicating the direction, it is based on the Cartesian coordinate system based on the XYΘZ axis.
The substrate inspection device 1 arranges inspection jigs 3 and 3B vertically in order to electrically inspect both sides of the substrate 2. Then, it has a function of aligning the positions of the inspection jigs 3 and 3B and the substrate 2 by optically recognizing them from both sides before bringing them into contact with each other. Regarding the explanation of the optical alignment, since the inspection jig 3 and the like are arranged vertically symmetrically, the upper side can be explained and the lower side can be interpreted in the same way. For example, it is described as the inspection jig 3 and, if necessary, the lower inspection jig 3B.

The substrate inspection device 1 includes a table moving portion 20 for a conveying table 21 that holds the substrate 2 on the substrate holding portion 211 and moves and conveys the substrate 2 along the Y axis. An inspection jig moving unit 30 for moving the inspection jig 3 having a plurality of probes 31 in the XYΘZ plane is provided. The upper and lower inspection jig moving portions 30 and 30B are arranged symmetrically with respect to the XY plane.
The transfer table 21 shown in FIGS. 1 and 2 includes a plurality of table position marks 22 indicating the positions of the transfer table 21, a substrate holding portion 211 on which the substrate 2 is placed and held, and an inspection jig as described later. Auxiliary cameras 25 and 25B that recognize the positions of the tools 3 and 3B are provided.

The inspection jig moving portions 30 and 30B are provided with inspection jig holding portions 301 and 301B, and the inspection jigs 3 and 3B are mounted and held, and the inspection jigs 3 and 3B are moved to move the inspection jigs 3 and 3B to the substrate 2. It functions to bring a plurality of probes 31 into contact with the inspection terminal 201 of the wiring pattern to be inspected. Further, a plurality of probes 31 are electrically connected to the tester 13 via the circuit switching section for electrical inspection of the substrate 2 via the connectors of the inspection jig holding portions 301 and 301B.

The control device 11 controls the movement of the inspection jig moving units 30 and 30B and the table moving unit 20. The operator of the board inspection device 1 gives an instruction to the device from the operation panel 12 and operates according to the display on the panel screen. The configuration of the moving shaft of the inspection jig moving unit 30 is as follows from the mechanism main body 10 to X, Y. They are stacked in a configuration of Θ and Z-axis. The center of the Y-axis moving portion is coaxial with the center of the Θ and Z-axis. Further, the combination may be changed as long as the control calculation is suitable.

Further, main cameras 15 and 15B for identifying the XY-axis positions of the position marks on the substrate 2 and the transport table 21 are attached to the X-axis moving portions of the upper and lower inspection jig moving portions 30 and 30B, respectively. It forms the XY coordinate system of the main camera 15.
The images captured by the main camera 15 and the auxiliary camera 25 are processed into predetermined position data by the image processing unit 14 and stored in the main storage unit 111 of the control device 11.

FIG. 2 is an explanation for explaining the inspection jig 3, the transport table 21, the control coordinates 112, and the like held by the inspection jig holding portion 301 of the inspection jig moving portion 30 on the upper side of the substrate inspection device 1 in FIG. It is a figure.
A plurality of table position marks 22 are provided on the transfer table 21, and one of them is used as the position of the reference mark 22S of the XY control coordinates of the substrate inspection device 1. With that as the origin, the control coordinate 112 is set in the control device 11. Then, the positions of the substrate 2 and the inspection jig 3 are recognized on the control coordinates 112.

To specify the position of the substrate 2, the main camera 15 moves relative to the transport table 21 to capture a pair of substrate position marks 2a and 2b and convert them into an XY position to determine the substrate position (XYΘ, center position and angle of rotation). Recognize as a surface. Similarly, in the inspection jig 3, the auxiliary camera 25 moves relative to each other to image a pair of jig position marks 3a and 3b and recognize them as a surface of the inspection jig position (XYΘ).
Since the distance between the table position mark 22 and the position of the auxiliary camera optical axis 25L of the auxiliary camera 25 described later is mechanically fixed, the positions of the substrate 2 and the inspection jig 3 should be specified with reference to the reference mark 22S. Can be done.

The jig position marks 3a and 3b are read by the auxiliary camera 25 attached to the transport table 21, and the table position marks 22 and the board position marks 2a and 2b of the board 2 are read by the main camera 15. Then, the data such as the position on the XY control coordinates of the inspection jig 3 obtained from the data read by the main camera 15 and the auxiliary camera 25 is stored in the main storage unit 111 of the control device 11.

The outline of the electrical control system in the substrate inspection device 1 includes a control device 11, a drive system for moving parts of the mechanism main body 10 such as X, Y, Z, and Θ, an operation panel 12, a tester 13, and an image processing unit 14. , Main storage unit 111, external storage means, etc. are connected to control the substrate inspection device 1.

As shown in FIG. 2, the substrate holding portion 211 mounted on the transport table 21 is provided with three engaging pins 211a according to the outer shape of the substrate 2, and the side surface of the substrate 2 engages with them. At the same time, the substrate 2 is held at an appropriate position of the substrate holding portion 211 by urging the substrate 2 toward the engaging pin side by an urging means (not shown) from the direction facing the engaging pin 211a. As described above, the distance from the position of the reference mark 22S to the substrate position marks 2a and 2b is predetermined by design.

Through openings are formed in the substrate holding portion 211 and the transport table 21, and the circuit pattern on the lower surface of the held substrate 2 is inspected by abutting with the lower inspection jig 3B. Further, the auxiliary camera 25B arranged side by side with the auxiliary camera 25 is used to image the jig position marks 3Ba and 3Bb of the lower inspection jig 3B in the −Z direction. Since the auxiliary cameras 25 and 25B have the same configuration, the configuration of the auxiliary camera 25 will be described here.

As shown in FIG. 3, the auxiliary camera 25 includes a lighting unit 251 on the upper surface of the transport table 21. The lighting unit 251 includes an outer metal cylinder 252 whose inner surface reflects light, and a light diverging portion 253 made of a transparent material such as acrylic resin or glass. The light generated from the light source passes through the light guide portion 254 made of a material such as glass fiber, reaches the light diverging portion 253, is diverged by the light diverging portion 253, becomes divergent light, and becomes the jig position mark 3a. It is irradiated toward 3b. The auxiliary camera opening 251A of the external metal cylinder 252 has a circular shape with a diameter of 2 mm, and the center is the focal point of the auxiliary camera 25 and the auxiliary camera optical axis 25L. The prism 255 changes in the Y-axis direction and is imaged on the CCD 257 via the lens 256. The field of view of the camera 25 is about 2.5 mm square. When the jig position marks 3a and 3b approach from directly above the Z axis and enter the depth of focus, an image is formed at the same time as the auxiliary camera opening 251A and the position from the auxiliary camera optical axis 25L can be recognized. The image is shown in FIG. 8 (a).

In the above-mentioned auxiliary camera opening 251A, the center of the inscribed circle of the cylinder is formed on the auxiliary camera optical axis 25L when viewed from directly above the Z axis. It is fixed to the transport table 21 and is preferable as the auxiliary camera position mark 25P. However, in order to image the jig position marks 3a and 3b, the height is different from the table position mark 22 by 25 Ph. Since the main camera 15 moves relative to the transport table 21 and the XY plane and images the table position mark 22 and the substrate position marks 2a and 2b to recognize the position, the position mark surface is an objective within the depth of focus of the main camera 15. It is a plane of distance.

The transport table 21 of FIG. 2 has a plurality of table position marks 22. Based on one of the centers of the X-axis, there are four, one for + X and one for -X, and one for + Y. The position where the central reference mark 22S and the optical axis of the main camera 15 coincide with each other is defined as the origin (0,0) 112S of the control coordinate 112 of the control device 11. The four points are arranged at (0,0), (+ tm1,0), (-tm2,0), and (0, + tm3) by design.
The substrate position marks 2a and 2b of the substrate 2 held by the substrate holding unit 211 are also imaged by the main camera 15 in the same manner as the table position mark 22, and the XY positions are recorded in the main storage unit 111. The center of the through opening of the substrate holding portion 211 and the transport table 21 is designed to be (0, −ts). The XY positions of the board position marks 2a and 2b are also designed (set) in advance from the board design data with the center of the outer shape of the board 2 as (0,0). When (0, −ts) * (-1) is added to the origin 112S (0,0) of the control coordinates 112, the control coordinates 112 and the board recognition position S6 of the main camera 15 of the mechanism main body 10 are obtained.

The probe holder 35 shown in FIG. 5 of the inspection jig 3 is also designed with the center of the outer shape of the substrate 2 as a reference (0,0). Further, the centers of the Θ and Z axes of the inspection jig moving portion 30 are also coaxially configured. When the inspection jig holding portion 301 is rotated at the inspection position S7, the probe holding body 35 of the inspection jig 3 rotates at the center of the substrate 2.
Since the reference mark 22S (0,0) of the table position mark 22 and the auxiliary camera optical axis 25L of the auxiliary camera 25 are at a fixed distance Df, the transport table 21 moves relative to the inspection jig 3 and the design distance for inspection. At the tool recognition position S4, the auxiliary camera 25 captures a pair of jig position marks 3a and 3b, and the positions are stored in the main storage unit 111. The position of the surface XYΘ of the inspection jig 3 on the control coordinates 112 can be known. Since the XYΘ position of the inspection jig 3 and the XYΘ position of the substrate 2 can be known on the control coordinates 112, the substrate 2 and the inspection jig 3 are aligned by performing arithmetic processing and moving relatively XYΘ.

The outline of the operation and operation steps of the substrate inspection device 1 is as follows.
S0 ・ Recognizes the state of the mechanism main body 10 of the substrate inspection device 1.
S1 ・ Set the data related to the inspection of the substrate 2 to be inspected.
S2 ・ The corresponding board holding unit 211 is mounted.
S3 ・ The corresponding inspection jig 3 is mounted.
S4 ・ Optical position recognition of the inspection jig 3.
Place S5 / substrate 2 and start inspection.
S6 ・ Optical position recognition of the substrate 2 and relative movement including alignment.
S7 ・ The inspection jig 3 is pressed and inspected.
S8 ・ Release the press and move relative to take out the substrate 2.
Will be. In the setup for changing the model in which the type of the substrate 2 to be inspected changes, if S1 to S8 are performed and the electrical inspection is PASS, continuous automatic inspection will be started. The cycle of continuous automatic inspection repeats S5 to S8.

The recognition of the state of the mechanism main body 10 in step S0 will be described. Each of the mechanism main bodies 10 has characteristics (variations) including manufacturing errors. In addition, the characteristics change depending on the external environment such as the room temperature of the factory where it is installed. In addition, multiple units are often installed in the same factory. Therefore, a means for recognizing the state of each mechanism main body 10 and adjusting to the specifications of product (device) accuracy will be described.
Step S0A-The XY standard scale 61 is placed on the substrate holding portion 211, and the XY coordinate system recognized by the main camera 15 is calibrated based on the XY standard scale 61.
Step S0B-The matching jig 40 is mounted on the inspection jig holding unit 301, and the XY coordinate system recognized by the matching camera 41 is calibrated based on the XY standard scale 61.

Various XY standard scales 61 mounted on the substrate holding portion 211 in step S0A are commercially available depending on the size and accuracy specifications. For example, in the case of XY100 mm shown in FIG. 6B, the material is soda glass, the outer shape is 127 (x) * 127 (y) * 5 (t), and the X-axis and Y-axis are orthogonal at 50 mm (center). There is. The scale accuracy is ± 0.002. It is also possible to attach and obtain a calibration certificate.

First, the main camera 15 moves relative to each other to recognize the plurality of table position marks 22. Then, the origin 112S of the control coordinate 112 is set based on the reference mark 22S. Next, a plurality of predetermined positions of the XY standard scale 61 are recognized. Since the captured image at a predetermined position has a + shape of a cross line, the center of the intersection is recognized. Here, the movement of the XY axes of the main camera 15 and the axes of the XY standard scale 61 are not parallel and do not match due to the inclination at the time of mounting or the like. A dedicated substrate holding portion 211 with rotation adjustment is preferable. Although it is difficult to make a perfect match, this can be corrected (tilted according to the scale of the XY standard scale, converted to a measured value without rotation, etc.) by performing arithmetic processing including rotation. Specifically, rotation converts the XY coordinate display (X, Y) of each point into polar coordinate display (radius from the center and radian angle), and subtracts the rotation (radian) error. Then, it returns to the original XY coordinates. In the X and Y directions, the center error is subtracted at each point. After the arithmetic processing, (50, 50) of the XY standard scale 61 coincides with the XY axes at the board recognition position S6. The difference in straightness (linearity, linearity) and orthogonality is recognized and recorded in the main storage unit 111. If this difference is within a predetermined range, the position recognition and the moving part of the main camera are normal.

If you have a calibration certificate for the XY standard scale 61, create calibration data and move the XY axes so that the difference (deviation amount) in position recognition of the main camera 15 (XY coordinate system) becomes an appropriate value (0). Calibration measures that can be controlled and corrected can be performed. It is preferable to perform predetermined measures (calibration measures) for straightness and orthogonality according to the accuracy specifications of the mechanism main body 10 of the device. When the apparatus main body 10 is calibrated, the scale (calibration data value) of the XY standard scale 61 and the position recognition of the main camera 15 (XY coordinate system) match. Since the XY standard scale 61 (glass) and the mechanism main body 10 (iron system) have different coefficients of thermal expansion, the recognition length of the main camera changes at room temperature, so it is preferable to specify the room temperature at which the device is operated.

The matching jig 40 in step S0B has a configuration in which the matching camera 41 is fixed to the jig base 33 shown in FIG. 6A. The XY position of the matching camera 41 is the center of the guide plate 36. The focal point is at an objective distance of 41d on the same surface as the surface of the guide plate 36. The field of view of the camera is about 2.5 mm square. It is equivalent to moving the main camera 15 to the inspection jig 3.
The positions of the reference mark 22S and the auxiliary camera optical axis 25L of the auxiliary camera 25 are fixed values. Here, the fixed distance Df is also actually measured.

First, the matching camera 41 captures a plurality of table position marks 22 to recognize the positions. Next, the inspection jig moving unit 30 moves the XY axis of the fixed distance Df after moving the height difference 25Ph from the opening 251A of the auxiliary camera by the + Z axis. This is directly above the auxiliary camera optical axis 25L. The opening 251A of the circular auxiliary camera having a diameter of 2 mm is imaged to recognize the auxiliary camera optical axis 25L which is the central position. This is written in the main memory unit 111. This means that the mechanical fixed distance Df was actually measured.
In this case, the manufacturing error of the mechanical fixed distance Df between the plurality of devices is eliminated. Here, the auxiliary camera opening 251A of the lighting unit 251 of the auxiliary camera 25 is fixed to the transport table 21 and functions as the auxiliary camera position mark 25P. Further, even if the main body of the auxiliary camera 25 is moved or replaced, the position of the auxiliary camera position mark 25P does not move. When the lighting unit 251 is replaced, the fixed distance Df can be measured again.

The matching camera 41 moves relative to each other to recognize predetermined plurality of positions of the XY standard scale 61. Calculation processing is performed in the same manner as in the main camera 15 described above, and recording is performed in the main storage unit 111. If this difference is within a predetermined range, the position recognition and movement of the matching camera 41 are normal.

It is also verified whether the differences in the position recognition (XY coordinate system) of the above two cameras are relatively equivalent (translation). Two XY coordinate systems (main camera 15 recognition system and matching camera 41) in the mechanism main body 10 can be seen, such as the difference in the straightness of the Y axis of the transport table 21 (parallelism (rotation) and orthogonality of the two XY coordinate systems). The relative difference state of the recognition system) can be recognized. If necessary, the straightness, orthogonality, parallelism (rotation) of the non-conforming portion, the design constant value of the mechanism main body 10 and the like are corrected so as to match the control coordinates 112. When the correction procedure is performed, it is preferable to perform the steps S0A and S0B again to confirm the conformity of the mechanism main body 10 after calibration.
As a result, the mechanism main body 10 becomes an XY coordinate system with orthogonal coordinates in which the position recognition of the relative movement of the transport table 21 with respect to the main camera 15 and the matching camera 41 is the same. This is an XY movement in which the relative movements of the main camera 15 and the matching camera 41 are equivalent when viewed from the transport table 21. The XY coordinate system of the matching camera is translated by two camera intervals (XY) on the control coordinates 112 of the main camera 15.

The transport table 21 has a plurality of position marks, and the reference mark 22S is position-aligned with the main camera 15 to be the origin 112S of the control coordinates 112. The position recognition of the auxiliary camera 25 for viewing the inspection jig 3 from the reference mark 22S and the auxiliary camera optical axis 25L at a fixed distance Df is relatively equivalent to the position recognition of the main camera 15. In other words, recognizing the position of the inspection jig 3 with the auxiliary camera 25 is relatively equivalent to recognizing the position of the inspection jig 3 with the main camera 15. When the main camera 15 recognizes the substrate 2 and the auxiliary camera 25 positions the inspection jig 3 on the control coordinates 112 to control-correct (relatively move) the relative difference, the substrate 2 and the inspection jig 3 are aligned.
It is preferable that the state recognition of the mechanism main body 10 is carried out as a periodic inspection. Thereby, the change with time of the mechanism main body 10 can be improved. In addition, the error variation between a plurality of devices is also improved.
Steps S0A and S0B described above were calibrated and corrected using the XY standard scale 61. After that, a plurality of table position marks 22 fixedly arranged two-dimensionally on the transport table 21 can be automatically performed as step S0A1 or S0B1 main body check over time as an XY auxiliary scale. The reproducibility of the relative movement with the transfer table 21 can be checked, and items for which resetting and correction are appropriate can be corrected.

The set of data related to the inspection of the substrate 2 to be inspected in step S1 sets data related to all inspections such as the name of the substrate 2, the electrical inspection standard, the serial number of the inspection jig 3, and the data related to the alignment.
When mounting the corresponding substrate holding portion 211 in step S2, the substrate holding portion 211 corresponding to the inspected substrate 2 is used in order to place and hold the inspected substrate 2 having a different physical shape at the design position.
The mounting of the corresponding inspection jig 3 in step S3 occurs even after the inspection jig 3 is lowered and repaired at the site due to malfunction of the probe 31 or the like. The inspection jig 3 is mechanically positioned by the inspection jig holding portion 301, but there is an error in the reproducibility of the position, and it is necessary to recognize the position of the inspection jig 3 in the next step S4 each time.

The optical position recognition of the inspection jig 3 in step S4 will be described. The present invention is characterized in that the inspection jig 3 is optically automatically positioned. In step S0, the manufacturing error of the mechanism main body 10 is improved, and if the position of the inspection jig 3 is known on the control coordinates 112, it is possible to perform an arithmetic process for moving the inspection jig 3 to the position of the substrate 2.
First, the main camera 15 recognizes a plurality of table position marks 22, and sets the origin 112S of the control coordinates 112. The origin (0,0) 112S is the point where the center of the optical axis of the main camera 15 and the position of the reference mark 22S are aligned. When a plurality of table position marks 22 fixedly arranged two-dimensionally (fixed XY positions and values on the main body) are recognized, the reproducibility of the orthogonality of the XY coordinate system recognized by the main camera 15 can be confirmed. If it is stored in the main storage unit 111, the change with time can be known. Also, a reasonable correction is possible.

Next, the auxiliary camera 25 having the auxiliary camera optical axis 25L at a fixed distance Df from the origin 112S of the control coordinates recognizes the pair of jig position marks 3a and 3b. Since the positional relationship between the main camera 15 and the auxiliary camera 25 is clear from the origin, it is equivalent to recognizing the jig position marks 3a and 3b by the main camera 15. The position (Xj, Yj, Θj) of the surface of the inspection jig 3 is determined on the control coordinates 112.
However, it is assumed that the pair of jig position marks 3a and 3b are in the proper positions of the inspection jig 3. In other words, the position of the inspection jig 3 is required to be the position of the pair of jig position marks 3a and 3b.

In step S5, the substrate 2 is placed on the substrate holding portion 211 to instruct the inspection start.
In step S6, first, the main camera 15 recognizes the position by relatively moving so as to form a pair of board position marks 2a and 2b directly under the main camera 15 on the transport table 21 or the like. Since the positions (Xb, Yb, Θb) of the surface of the substrate 2 are determined on the control coordinates 112, the matching relative movement amounts (ΔXjb, ΔYjb, ΔΘjb) are calculated and the substrate 2 and the inspection jig 3 are moved. Let me.
However, it is assumed that the pair of substrate position marks 2a and 2b are at appropriate positions on the substrate 2. In other words, the position of the substrate 2 is required to be the position of the pair of substrate position marks 2a and 2b.
In step 7, since the substrate 2 is located at the matching position directly below the inspection jig 3, the inspection jig 3 is pressed into contact with the substrate 2. The probe 31 comes into contact with the inspection terminal 201 to perform an electrical inspection.
In step S8, the press is released at the end of the inspection, the transfer table 21 and the like are returned to the mounting position S8 of the substrate 2, and the substrate 2 is taken out.

The present device 1 can perform continuous automatic inspection by providing an automatic board mounting device and a board taking out device. (Not shown.) Steps 5 to 8 are repeated. Here, it is preferable to automatically recognize the optical position of the inspection jig 3 in step 4 when a predetermined condition such as the number of inspections is met. The state of continuous automatic inspection can last for days until there are no uninspected substrates. The state of the mechanism main body 10 and the like can be maintained at the start state of the continuous automatic inspection in order to avoid the continuity inspection failure due to the misalignment.
With this, the mutual positional relationship of the mechanism main body 10 with time can be recognized. The position on the control coordinates 112 can also be modified as needed. Since the main camera 15 recognizes the positions of the plurality of table position marks 22, an abnormality in the main camera XY movement system can be found from the difference (deviation amount) from the previous position data, and an appropriate device can be operated.
[Embodiment 2]

A dedicated inspection jig 3 mounted on the apparatus 1 to inspect the electrical characteristics of the substrate 2 will be described. The inspection jig 3 shown in FIG. 5 has a jig base 33 that is placed on the inspection jig holding portion 301 and held at a mechanical position as a common standard so that it can be replaced. The jig base 33 has a connector 341 and is connected to the tester 13 via the connector of the inspection jig holding portion 301. The connector 341 of the jig base 33 is connected to the electrode 344 of the electrode plate 343 by wiring 342 or the like. This portion is referred to as an electrode body 34.

The probe 31, which is in contact with the electrode 344 and the inspection terminal 201 of the substrate 2 and is electrically connected, has a structure in which one end or both ends have an urging force and expand and contract. The plurality of probes 31 stand facing the electrode 344 and the inspection terminal 201. A guide hole 361 that slidably guides the probe holding plate A351 holding the probe 31, the probe holding portion 35A of the probe holding plate B352, and the tip end 31A of the probe 31 to the inspection terminal 201 because a plurality of the substrates 2 face each other. A guide plate 36 is formed of a probe holder 35.
In the inspection jig 3, it is the guide plate 36 that directly faces the substrate 2 and comes into contact with the substrate 2. If the positions of the guide plate 36 and the substrate 2 are known, optical alignment can be performed.

The guide plate 36 will be described in detail with reference to FIG. For the design of the inspection jig 3, the inspection terminal 201 of the conductor pattern 202 of the substrate surface layer of FIG. 4 is extracted from the design data of the substrate 2, and the hole processing data 364 of the guide plate 36 and the like is created. Add the parts mounting holes required for assembly to it. In the present application, since the positions of the jig position marks 3a and 3b of the inspection jig 3 are the positions of the inspection jig 3, a pair of jig position marks 3a and 3b are added to the guide plate 36. Specifically, a pair of jig position mark holes 362 and a length measuring hole 363 described later are added to the guide plate to obtain hole processing data 364 of the guide plate 36. Holes are drilled with an NC drill or the like based on this design data, but a manufacturing error (positional variation) similar to that of the conventional example shown in FIG. 7 will occur although it is minute.

Therefore, it is confirmed that the hole measurement data JHM1 of the guide plate 36 in which the hole group related to the alignment after the hole processing is measured by the digital length measuring machine 60 is within a predetermined error. It is preferable that this measurement has a pair of length measuring holes 363. The pair of length measuring holes 363 are designed and arranged equally on both sides on the X axis from the center of the substrate 2. The center is in the middle of the length measurement value. It becomes easy to mount the guide plate 36 on the length measuring machine (XY coordinate system) 60 and set the center (rotation origin 0, 0) and the angle (radian). This can be calculated by converting the length measurement value (XY coordinates) into a value with an angle (radian) = 0. Further, the jig position marks 3a and 3b on the guide plate 36 of the inspection jig 3 on which the probe 31 is mounted and the guide plate 36 of the probe holder 35 can be later measured by reflection illumination based on the length measuring hole 363. .. The control device 11 performs alignment calculation processing on the plane of the rotation angle (X, Y, Θ) with respect to the positions of the guide plate 36 of the substrate 2 and the inspection jig 3, and the inspection jig moving unit 30 also supports it. It has a mechanical configuration with a center of rotation.

Next, the matching state of the inspection terminal group 201G of the substrate 2 and the contact point group 32G including the manufacturing error of the probe 31 is simulated (calculation matching) to correct the manufacturing error. The method is, for example,
S110 ・ Correction of position data of jig position mark A ・
The method for minimizing the error (deviation amount) from the design value is the following procedure from S111 to S114.
The inspection point data TCL1 of the design of the inspection terminal group 201G of S111 / substrate 2 is created.
Data PCM1 of S112 / probe contact point cloud 32G is created. The contact point 32 is set at a position PCM1 having a high probability of occurrence from the center JHM1 of the measured guide hole 361. For example, it is the center of the guide hole 361.
In S113, CAD, etc., the rotation and movement of the PCM1 are added to the TCL1 to perform arithmetic matching. The difference value (ΔnX, ΔnY, or ΔnD diagonal line) of the corresponding point cloud is minimized.
The minimum state of S114 and S113 is set to the proper position of the manufactured inspection jig 3. The position JMDA of the jig position mark hole 362 of the PCM1 in that state is acquired.

Although it was described as matching by CAD or the like in S113, for example, arithmetic processing can be easily performed on spreadsheet software. The surface of the PCM1 is rotated, calculated and moved in the X and Y directions so that the difference between each point (nXt, nYt) of the TCL1 and each point (nXp, nYp) of the PCM1 is minimized.
Specifically, the rotation converts the XY coordinate display (X, Y) of each point into the polar coordinate display (radius and radian from the center), and adds the rotation (radian) of the movement instruction value. Then, it returns to the original XY coordinates. In the X and Y directions, the movement instruction value is added to each point. The maximum value of the difference is stored for each movement instruction value. The state in which all the stored maximum values are the minimum is the position of the appropriate PCM1 surface of S113. The work is easy if similar dedicated software is prepared.

The inspection terminal 201 has a large and small area. Small terminals are difficult to contact, and large terminals are easy to contact.
S120 ・ Correction of position data of jig position mark B ・
The procedure from S121 to S124 is as follows, which maximizes the margin until the contact point 32 comes off from the inspection terminal 201. Calculation verification is performed in advance by a method similar to the electrical exploration described later.
The design range data TPL1 of the inspection terminal group 201G of S121 / substrate 2 is created. When the inspection terminal is rectangular, nTPL1 = nTCL1 (+ nPX, -nPX, + nPY, -nPY)
S122 = S112 ・ Create data PCM1 of contact point cloud 32G of probe 31.
In S123, CAD, etc., the rotation and movement of the PCM1 are added to the TPL1 to perform arithmetic matching. Maximize the minimum value of the margin value (+ nPCX, -nCPCX, + nCPCY, -nCPCY) of the corresponding point cloud. (+ NPCX = + nPX + ΔnX, the same applies below)
When the inspection terminal is circular, the maximum margin of margin = n terminal radius (nR / 2) -ΔnD diagonal deviations S124 and S123 is the proper position of the manufactured inspection jig 3. The position JMDB of the jig position mark hole 362 of the PCM1 in that state is acquired.

From the above, three types of position data for the jig position marks 3a and 3b are created: the design jig position data JMD at the time of designing the inspection jig, and the correction jig position data JMDA and JMDB of the manufactured inspection jig. To. The difference between the design jig position data JMD and the correction jig position data JMDA indicates the manufacturing accuracy of the inspection jig 3, and the difference between the correction jig position data JMD and the correction jig position data JMDB indicates the degree of matching margin during use. This makes it possible to evaluate the performance of the inspection jig 3 when it is used before shipping. It is also useful for verifying the feasibility of electrical inspection by feeding back to the design process of the substrate 2 and the inspection jig 3.

The jig position marks 3a and 3b will be described. The positions of the pair of jig position marks 3a and 3b may be located on any of the guide plates 36 in terms of design, but they are arranged symmetrically on the central X-axis as shown in FIGS. 4 and 5. The position recognition of the inspection jig 3 is uniaxially moved on the X-axis, which is convenient for the mechanism of the relative movement of the auxiliary camera 25, and the error of the position recognition is also improved. It will be preferable that it is close to one axis. The same applies to the length measuring hole 363.
The columnar jig position marks 3a and 3b such as metal that reflect light are press-fitted into the jig position mark holes 362 and fixed. The position is fixed with the guide hole group 361G, and the expansion / contraction movement (XYZ) of the contact point group 32G of the probe 31 can be limited to the clearance range of the difference in diameter between the guide hole 361 and the probe tip 31A.

It was stated above that the position of the jig position mark hole 362 is measured after the hole of the guide plate 36 is machined. There is no guarantee that there is no difference in the optical recognition positions of the jig position mark hole 362 (imaging of transmitted illumination) and the jig position marks 3a and 3b (imaging of reflected illumination) to which a cylindrical metal or the like is fixed. Therefore, it is preferable to actually measure the jig position marks 3a and 3b from the surface with reference to the pair of measurement holes 363. In that case, if there is a difference from the previously measured hole measurement data JHM1, JMDA1 and JMDB1 will be created by adding the difference. As a result, the recognition positions of the jig position marks 3a and 3b of the auxiliary camera 25 become more appropriate optical positions of the inspection jig 3 (= contact point group 32G). In this way, the pair of jig position marks 3a and 3b are improved to meet the requirement that the inspection jig 3 is an appropriate position.

FIG. 8A shows an image of the jig position marks 3a and 3b captured by the auxiliary camera 25. Circular jig position marks 3a and 3b are on the inside. The outer circle is the auxiliary camera position mark 25P of the auxiliary camera opening 251A. The center is the auxiliary camera optical axis 25L. The outer quadrilateral has an auxiliary camera field of view of 25S. The positions of the jig position marks 3a and 3b can be recognized from the auxiliary camera optical axis 25L depending on the magnitude (reflectance, whiteness) of the reflected light. FIG. 8B is an image of the circular jig position mark hole 362. As for the whiteness of the reflected light, the jig position mark hole 362 has a low whiteness, the surface of the guide plate 36 has a medium whiteness, and the outside of the auxiliary camera position mark 25P has a high whiteness. The image processing unit 14 has, for example, a multi-valued function and recognizes the position of the jig position mark hole 362.

If the jig position marks 3a and 3b are used as the jig position mark holes 362, they can also be used as a pair of length measuring holes 363 (length measuring marks).
In the above description, as in the conventional case, the binarization (black and white) determination level of the image is adjusted to one, and for example, a cylindrical metal is coaxially press-fitted into the jig position mark hole 362 to increase the reflectance. Jig position marks 3a and 3b that make the image highly white are created, but it is not necessary. In addition, the correction jig position marks JMDA1 and JMDB1 can be eliminated. The design and manufacture of the inspection jig 3 becomes easy.

Further, since all the holes of the guide plate 36 are in fixed positions, the guide holes 361 may be adopted. However, the tip of the probe is also imaged inside the guide hole 361, and the image of the shape of the tip of the probe is an image in which it is not clear, but even if it is a dedicated software (algorithm) that recognizes the center position of the guide hole 361 If you can recognize the position.
From these, the position marks of jigs, length measurement, substrates, auxiliary cameras, resists, etc. have a shape fixed to the recognition surface (subject) that can recognize the position from the shading of the camera image, including recesses on the surface such as holes in the guide plate 36. If so, it will be good. It may be color identification. When there is no need for automatic camera position recognition, the operator may specify the position on the monitor of the operation panel 12.
[Embodiment 3]

As shown in FIG. 4, the surface pattern 202 of the substrate 2 is covered with a resist mask 203 as a surface protective film. The resist mask 203 may deviate from the surface pattern 202 in the substrate manufacturing process. When the resist opening 201r having the same shape is displaced and overlaps the inspection terminal 201, the center position of the inspection terminal 201 is moved from the contact point 32 of the probe 31.

In step 6 above, the main camera 15 recognizes the substrate position marks 2a and 2b of the substrate 2. In general, the substrate position marks 2a and 2b often have a conductor pattern (fiducial mark) of a single island having no resist mask 203 around them, so that the resist opening of the inspection terminal 201 of the resist mask 203 is formed. No resist misalignment was detected in 201r. In the present application, a pair of resist mask openings 201r are registered as resist position marks 2ar and 2br, position recognition is performed for each predetermined number of substrates, and substrate positions from the substrate position marks 2a and 2b and the resist position marks 2ar and 2br. It is confirmed that the difference between the above is within a predetermined error.

For example, when the error amount of the resist displacement exceeds a predetermined value, the resist mask opening 201r is adopted at the substrate position. If it exceeds half of the predetermined value, the average of the substrate position PM (Xm, Ym, Θm) of the substrate position marks 2a and 2b and the resist position PR (Xr, Yr, Θr) of the resist position marks 2ar and 2br is adopted. .. If it exceeds twice the predetermined value, it is determined that the resist of the substrate is defective.
The resist misalignment moves the substantially proper position of the contact point 32 of the probe 31 at the time of electrical inspection. Alternatively, there is a problem of reducing the contact area, and the amount of resist displacement is reflected in the position recognition of the substrate 2. This improves the requirement that the pair of substrate position marks 2a and 2b of the substrate 2 before the electrical inspection are in proper positions for contact with the probe 31. Further, when the resist misalignment error exceeds a predetermined value, it can be determined that the resist misalignment of the substrate is defective.
Further, in the optical position recognition of the resist opening 201r or the like, it is preferable that the image processing unit 14 has the above-mentioned multi-value function, color identification function, and the corresponding software for automatic recognition of the position mark.
[Embodiment 4]

The position confirmation at the time of mounting the inspection jig 3 manufactured in the new period will be described. As the position data of the jig position marks 3a and 3b, it is preferable to use JMDB1 or JMDB from the above margin, JMDA1 or JMDA from the difference from the design, and JMD from the design as the position data.
After the optical alignment of the substrate 2, an electrical inspection is performed to confirm the PASS. Then, the periphery is electrically (energized) searched from the optical position Jp (Xp, Yp, Θp) to confirm that it is in the center of the PASS range. Specifically, the inspection jig 3 is inspected by rotating the Θ axis in the positive and negative directions to be the center of the PASS range. The X-axis is then moved in the positive and negative directions for inspection and centered on the PASS range. Move the Y-axis in the positive and negative directions and inspect it to center the PASS range. This provides an electrical position Je (Xe, Ye, Θe) suitable for electrical inspection.

The data ΔJpe (Xe-Xp, Ye-Yp, Θe-Θp) of the difference between the optical position Jp and the electrical position Je of the inspection jig 3 is registered in the main storage unit 111 or other storage means as the characteristic value of the inspection jig 3. To do. Since the optical position Jp changes depending on each substrate 2, if the difference data ΔJpe is added, even if the substrate 2 changes, it can be dealt with.
Further, it is preferable that the inspection jig 3 is equipped with a storage means 39 capable of reading and writing data by the control device 11 as one of the other storage means. Even when the inspection jig 3 is mounted on another device, the electric position Jp can be reproduced by adding the original written difference data ΔJpe to the optical position Jp. It is preferable that the position data of the jig position mark described above is also written in the storage means 39 in the same manner.
However, it is unavoidable that the position of the electrical contact point group 32GE has a slight movement variation for each press due to the clear lath between the probe tip 31A and the guide hole 36. The statistical center can be obtained from a sample of data of a plurality of differences, but here, the data of one difference is adopted.
The actual substrate inspection device 1, inspection jig 3, and substrate 2 each have a minute manufacturing error from the design value. And since each of them has been improved, it is possible to cope with the change of the alignment position suitable for the electric inspection when the combination is changed.
[Other embodiments]

With respect to the type of the transfer table 21, the transfer direction of one transfer table 21 of the first embodiment may be changed from the Y-axis direction to the X-axis direction. Although X and Y change, there is no problem in the alignment control calculation.
Two transport tables 21 may be used. The position recognition of the substrate 2 of the main camera 15 and the electrical inspection are performed in parallel, and the time for continuous automatic inspection is reduced to about half. In this case, for example, when the transport directions are two independent directions of the XY axes, when the main camera 15 is fixed to the mechanism main body 10, the movement trajectories (characteristics) of the two independent transport tables 21a and 21b are minute. Will be different. It is preferable to use two control coordinates 112a and 112b depending on the accuracy of the alignment error. Correction and calibration can be performed in the same manner as in step S0 according to each movement characteristic.

The transfer of the substrate 2 shown in FIG. 10 may be performed by one rotary table 21R. For example, there are board holding portions 211n at four stop positions every 90 degrees, and the board 2 mounting S5, position recognition S6, electrical inspection S7, and taking out S8 are operated in parallel to shorten the time for continuous automatic inspection. Is also preferable.

In the first embodiment (FIG. 1), the XY relative movement of the main camera 15 is composed of the X-axis of the inspection jig moving portion 30 and the Y-axis of the table moving portion 20 of the transport table 21, but the rotary table 21R has. The main camera 15 is fixedly installed in the independent XY moving unit 15XY. Since the control coordinates 112 of the control device 11 are established, the alignment control calculation can be performed.
For example, in one rotary table 21R such as 90 degrees described above, if the division angle is controlled to be equally divided or evenly divided, an XY moving system having a tangential direction as the X axis can be obtained. The Y-axis distance of the table moving portion 20 of the first embodiment is the rotation angle (radian * radius = circumferential distance) of the rotary table.

The reference mark 22S fixed to the rotary table 21R and the auxiliary camera 25 at a fixed angle stop at the inspection position S4, and the inspection jig 3 moves independently and relative to each other by the inspection jig moving portion 30XY. The camera 25 is an XY moving system whose X axis is the tangential direction.
The independent position recognition XY movements of the main camera 15 and the matching camera 41 on the matching jig 40 can be corrected and calibrated in step S0. In addition, the equivalent of relative movement can be secured. This is because the XY moving part 15XY of the independent main camera 15 and the XY moving part (inspection jig moving part 30XY) of the auxiliary camera 25 (stopped at the inspection position S7) are at a fixed angle of 90 degrees, and the control coordinates 112. Is established, and the substrate 2 and the inspection jig 3 can be optically aligned.
However, it is a requirement that the accuracy (reproducibility) of the angle and the stop position of the rotary table 21R is ensured. In this case as well, proper arrangement of the plurality of table position marks 22 is preferable for recognizing the reproducibility of the relative movement of the table stop position and the inspection jig 3. If there is reproducibility, it can be corrected on the control coordinates. Further, the control coordinates 112a, 112b, 112c, 112d can be set for each of the four substrate holding portions 211n. A correction constant may be added to each. Table position marks 22a, 22b, 22c, 22d and the like may be added for each substrate holding portion 211n.

The main camera 15 can also be configured to control and move on the Z axis. Both the main camera 15 and the matching camera 41 can recognize the auxiliary camera position mark 25P. In the present application, the configuration using the Z-axis of the inspection jig moving portion 30 does not increase the moving portion, and the Z-axis having the same movement locus as the recognition of the jig position marks 3a and 3b is adopted.
Recognizing the auxiliary camera position mark 25P with the main camera 15 or the matching camera 41 means recognizing the coaxial position with the auxiliary camera optical axis 25L.
Similarly, the configuration of the plurality of moving portions of the mechanism main body 10 can be changed to various mechanical configurations if the control coordinates 112 are established in the control device 11.

The moving portion of the device 10 is mainly driven by rotating the ball screw with a motor, but may be of a linear system or the like. In any case, the amount of movement is small but changes depending on the temperature with respect to the indicated value of movement. This is the same for solid scale length measuring devices even if the moving part is equipped with a linear scale (length measuring device) or the like. Although it can be improved by equipping it with a laser length measuring device, it is not adopted in this device 10.

The apparatus 10 has a configuration in which the mutual difference due to temperature is distributed from the center with reference to the center of the guide plate 36 of the substrate 2 and the inspection jig 3. Further, the mechanism main body 10 makes the XY coordinate system of the main camera and the matching camera and the auxiliary camera relatively equivalent (translation) so that the temperature of the substrate recognition position S6 and the electrical inspection position S7 of the mechanism main body 10 are set. The mutual movement due to this is improved by optically automatically recognizing the transport table 21 and the inspection jig 3 and reflecting them in the control coordinates 112. Further, each moving portion is corrected based on a plurality of table position marks 22 at fixed positions (thermally expanded at the temperature at that time).

The measured values of the mechanism main body 10, the inspection jig 3, and the substrate 2 related to the alignment of the substrate inspection device 1 are different from the design values due to different materials. It is preferable that the mechanism main body 10 is equipped with a digital temperature / humidity meter so that it can be connected to or communicated with the control device 11. It can be improved if there is regularity in the mutual difference due to temperature. This apparatus records date and time and position recognition data under predetermined conditions such as operation steps S0 and S4. By adding the date and time, temperature, and humidity to the state of the mechanism main body 10 and analyzing these recorded data groups, the regularity of the mutual difference depending on the temperature can be reflected in the control of the mechanism main body 10.

The position mark recognized by the camera is generally an independent circular island or hole, but any shape such as a polygon such as a quadrilateral or a + shape of a cross that can be image-processed for position recognition by the camera may be used. As for lighting, the one with appropriate reflection or transmission can be adopted.
The auxiliary camera position mark 25P is a circular auxiliary camera opening 251A having a diameter of 2 mm, but a cross line made of transparent glass may be used. In this case, the restrictions on the field of view and the magnification of the auxiliary camera 25 are improved.
The position marks are not limited to a pair, and may be two or more such as two pairs.

In the second embodiment, the contact point group 32G of the inspection jig 3 and the like are set from the measured values of the holes of the guide plate 36, but it is related to the alignment of the tip group and the like of the probe 31 mounted on the inspection jig 3. The position may be directly measured and set by the digital length measuring device 60. The positional relationship between the contact point group 32G and the jig position marks 3a and 3b can be seen.
A pair of length measuring holes 363 that determine the origin for measuring the length of the holes of the manufactured guide plate 36 have been added on the X-axis, but the guide holes 363 may be substituted. However, it is not easy to determine a substitute guide hole 363 from the guide hole group 363G having a large number of high densities, and it is preferable to add it at a position useful for length measurement.

Further, the tip group may measure the dent group in which the dent acquisition plate 2T on which the dent sheet 2S of the pressure sensitive paper is attached to the inspection jig 3 is pressure-welded.
Further, if the dent sheet is a partial dent sheet only in the peripheral portion of each of the jig position marks 3a and 3b of the hole by utilizing the unevenness on the surface of the guide plate 36, the dent sheet has a thickness and has a pressure contact force. It can be concentrated and acquired at the same time as the mark of the pressure contact mark of the hole and the dent group of the probe. Position data of the contact point group 32G and the jig position marks 3a and 3b may be created from these two measured values. The dents correspond to the pressure contact marks of the pressure sensitive sheet 2S. The pressure-sensitive sheet 2S has pressure sensitivity, and the area to be pasted varies depending on the pressure sensitivity and the press pressure. Those for low pressure, which are highly sensitive to pressure, are preferable. In addition, there are various types such as a transfer type. The point is that the pressure sensitivity due to the pressure contact of the unevenness on the surface of the guide plate 36 may be visually recorded.

When the inspection jig 3 is mounted on the substrate inspection device 1, the pressure-sensitive recording plate 2T to which the pressure-sensitive sheet 2S is partially attached is fixed to the substrate holding portion 211, and after the inspection jig 3 presses, the holes are healed. The position of the pressure-sensitive position marks 3at and 3bt (described later in FIG. 9) of the pressure contact marks of the jig position marks 3a and 3b can be recognized by the main camera 15. The surface position (XYΘ) of the inspection jig 3 can also be known. The use of the pressure-sensitive position marks 3at and 3bt of the pressure contact marks of the pressure-sensitive sheet 2S is preferable as a means for confirming (demonstrating) that the position recognition of the auxiliary camera 25 and the main camera 15 are relatively equivalent. If they are inconsistent, steps S0A1, 0B1 or S0A, S0B can be performed to correct or calibrate the cause from the difference analysis from the previous record, and the equivalent can be recovered. Further, when there is no matching camera 41, the non-identical data (XYΘ) is the mechanism body constant Δp (XYΘR) of the data of the difference between the two optical positions, the center X and Y positions, the rotation, and the orthogonality (of the auxiliary camera 25). Relative movement coefficient) may be set. If there are three or more jig position marks in two dimensions, the difference in orthogonality can be known. Δp1, Δp2, ··· Δpn may be similarly set in the plurality of substrate holding portions 211n as necessary. In any case, the equivalent (relative movement) can be maintained and restored.

Further, even if the equivalent confirmation matching jig 45 in which the inspection jig 3 is fixed to the guide plate 36 and the convex jig position marks 3a, 3b ... 3n are two-dimensional at three points or more is used. good. The position can be recognized by the main camera 15 using the pressure sensitive recording plate 2T. Equivalent to (XYΘR) or different from the auxiliary camera 25 can be recognized.
The images obtained by the main camera 15 capturing the pressure-sensitive position marks 3at and 3bt of the pressure-sensitive recording plate 2T are the strong dark colors shown in FIG. 9A in the convex jig position marks 3a and 3b, and the non-pressure contact portion. The guide plate 36 has a low dark color (no color development). In the concave jig position marks 3a and 3b such as holes, the pressure contact on the surface of the guide plate 36 shown in FIG. 9B is moderately colored (medium density color). From these, even if the matching camera 41 is not provided, the mechanism main body constant Δp (XYΘR) of the data of the difference between the two optical positions may be set for each of the plurality of substrate holding portions 211n.
However, the pressure-sensitive recording plate 2T is fixed to the substrate holding portion 211n in the case of a plurality of substrate holding portions 211n and a multi-imposition substrate (inspection press for each surface of the inspection jig), and the configuration of the mechanism main body. It is preferable to avoid it as much as possible because it may be a considerable work due to its characteristics.
In the present application, the origin setting of the main camera 15 (step S0A1) and the jig position marks 3a and 3b (step S4) of the auxiliary camera 25 are automatically recognized directly at a predetermined timing of the device operation including each mounting of the inspection jig 3. doing. At least the position of the inspection jig 3 on the control coordinates can be known.

The plurality of table position marks 22 may be, for example, a pair of fixed table position marks 22. Since it can be recognized as a surface from the XY coordinates recognized by the main camera 15, it can be recognized if there is a change over time. However, in the present application, the position marks are arranged in the X-axis and Y-axis directions with the reference mark 22S as the origin, which is preferable for the arithmetic processing for analyzing the state of surface change (XYΘR).

For example, tm4≈2 * ts of (0, −tm4) may be added to the arrangement of (0, + tm3) in FIG. 2 described above. The position of the entire surface of the transport table 21 can be recognized. (+ Tm1, -tm4) and (-tm2, -tm4) may be added to this. The arrangement of these functions as an XY auxiliary scale fixed to the transport table 21 with respect to the XY coordinate system recognized by the main camera 15, which is preferable for recognizing the reproducibility of relative movement.

Regarding the reproducibility of the relative movement system of the inspection jig 3, it can be seen that the matching jig 40 having the matching camera 41 described above is mounted and the position marks such as a plurality of table position marks 22 are recognized in a timely manner. The relative relationship between the main camera 15 and the XY coordinate system recognized by the matching camera 41 or the auxiliary camera 25 can be known and corrected. As a result, the position recognition of the main camera 15 and the auxiliary camera 25 can be made equivalent over time.
Further, the matching camera 41 may be fixed to the inspection jig holding portion 301. There is no work of mounting and removing the matching jig 40, and position recognition can be performed even with the inspection jig 3. It is possible even during continuous automatic inspection. The arrangement of the matching camera 41 can be selected according to the configuration and characteristics of the mechanism main body 10. There is also an arrangement on both.

The height 25Ph of the Z axis of the auxiliary camera position mark 25P may be the same as the table position mark 22 and the board position marks 2a and 2b. It can be recognized by both the main camera 15 and the matching camera 41. However, in the present application, as shown in FIGS. 1, 2 and 3 due to the problem of physical interference between the protrusion (not shown) on the transport table 21 and the guide plate 36 of the inspection jig 3 when the jig position marks 3a and 3b are imaged. It is projected on.

Although the above-mentioned XY standard scale 61 has a cross shape, it may have a paddy character shape or a grid shape (grid arrangement). If the accuracy of the XY positions of the plurality of predetermined position marks arranged in two dimensions is guaranteed, the control coordinates 112 can be calibrated from the position recognition of the cameras 15 and 41 based on the accuracy.

In the main body configuration of FIG. 1, the inspection jig 3 and the matching camera 25 are indirectly connected to the main camera 15 to perform approximate relative movement, and the error is small as compared with other main body configurations, but the main body configuration of relative movement. If they are different, there may be problems with the mechanical characteristics of the mechanism body 10, the room temperature, but the error and change over time.
In the implementation of optical alignment of various substrate inspection devices having different transport tables, inspection jigs, moving shaft configurations, and arrangement forms of the mechanism main body 10 as shown in other embodiments, the main camera 15, The configuration of the plurality of position marks on the matching camera 41, the auxiliary camera 25, and the table 21 can appropriately cope with changes over time.
The overall gist of the above is that if the position recognition of the plurality of table position marks 22 of the main camera 15 is within the range of automatic resetting and correction, the main camera 15 and the inspection jig 3 or the matching camera 41 are a plurality of on the table 21. The relative movement equivalent to that of the position mark and the auxiliary camera 25 is realized by automatic correction. Then, even if the plurality of substrate inspection devices 1 mounted on one inspection jig 3 change, the difference from the electrical position from the proper optical position does not change.

The above description of a particular embodiment of the invention is presented for purposes of illustration. Although there are some contextual statements, they are not intended to be exhaustive or to limit the invention in its original form. It is self-evident to those skilled in the art that numerous modifications and changes are possible in the light of the above description.

The substrate inspection device and inspection jig of the present invention can be used for all energizing jigs and energizing devices that simultaneously bring a probe into conductive contact with a plurality of inspection terminals provided on electronic components such as printed wiring boards, IC packages, and ICs. it can.

1. Board inspection device 10-Mechanism body, device 11-Control device 112-Control coordinates 112S-Origin of control coordinates 15-Main camera 21-Transfer table, table 22-Table position mark 22S-Reference mark 25-Auxiliary camera 25L- Auxiliary camera optical axis 251A, 25P ・ Auxiliary camera opening, auxiliary camera position mark 2 ・ board 2T ・ pressure sensitive recording board, dent acquisition board 2a, 2b ・ board position mark 201 ・ inspection terminal, pattern, inspection point 201r ・ resist Mask opening 2ar, 2br, resist position mark 30, inspection jig moving part 3, inspection jig 3a, 3b, jig position mark 3at, 3bt, pressure sensitive position mark 31, probe, contactor 32, contact point 36, Guide plate 361 ・ Guide hole 362 ・ Jig position mark hole, jig position mark, length measurement mark 363 ・ Length measurement hole, length measurement mark 39 ・ Storage means 40 ・ Matching jig 41 ・ Matching camera 60 ・ Length measuring machine, Digital length measuring machine 61 / XY standard scale

Claims (21)

In a board inspection device that inspects the electrical characteristics of a board with multiple inspection terminals to which electric circuits are wired and multiple board position marks.
A replaceable inspection jig mounted on the substrate inspection device to bring the probe into contact with the inspection terminal.
An inspection jig moving unit that holds and moves the inspection jig in the inspection jig holding unit,
A transport table having a plurality of table position marks for holding and transporting the substrate in the substrate holding portion, and
A main camera that moves relative to the transfer table and recognizes a plurality of position marks on the transfer table including the plurality of board position marks and the plurality of table position marks.
The inspection jig has a guide hole for guiding the tip of the probe to the inspection terminal and a guide plate having a plurality of jig position marks.
The transport table has an auxiliary camera that moves relative to the inspection jig to recognize the plurality of jig position marks.
The substrate inspection device is
In the optical alignment for aligning the substrate with the inspection jig, the position of the origin of the control coordinates, which is Cartesian coordinates, and the direction of the coordinate axes are determined based on the plurality of table position marks recognized by the main camera. Further equipped with a control device for controlling the relative movement of the inspection jig and the transfer table.
The control device recognizes the position of the substrate on the control coordinates from the plurality of substrate position marks recognized by the main camera, and from the plurality of jig position marks recognized by the auxiliary camera, the inspection jig. A substrate inspection apparatus characterized in that the substrate and the inspection jig are aligned by recognizing a position on the control coordinates. The substrate inspection apparatus according to claim 1, wherein the plurality of table position marks are three or more, two or more near one axis of the control coordinates, and one or more apart from each other. A matching camera that recognizes the plurality of position marks on the transport table is attached to the inspection jig holding portion.
The control device is
Based on the plurality of table position marks recognized by the main camera or the matching camera, the movement of the transport table in the X direction or the Y direction, and the X direction or the X direction of the inspection jig holding portion by the inspection jig moving portion. The deviation of the control coordinates from the X-axis and the Y-axis of the Y-direction is recognized, and based on the recognized deviation, the movement of the transfer table in the X-direction or the Y-direction, and the inspection jig moving portion of the transfer table. The substrate inspection apparatus according to claim 1 or 2, which corrects the control of the movement of the inspection jig holding portion in the X direction or the Y direction. The control coordinates are calibrated by holding an XY standard scale having calibration data in the substrate holding portion and recognizing a plurality of predetermined positions on the XY standard scale by the main camera or the matching camera. The substrate inspection apparatus according to claim 3. The auxiliary camera has an auxiliary camera position mark fixed to the transport table to indicate the position of the optical axis thereof.
The substrate inspection device according to claim 3 or 4, wherein the control device recognizes the position of the auxiliary camera on the control coordinates by the auxiliary camera position mark recognized by the main camera or the matching camera. The control device is used for each predetermined condition.
Based on the plurality of table position marks recognized by the main camera or the matching camera, the movement of the transport table in the X direction or the Y direction, and the X direction or the X direction of the inspection jig holding portion by the inspection jig moving portion. The deviation of the control coordinates from the X-axis and the Y-axis of the Y-direction is recognized, and based on the recognized deviation, the movement of the transfer table in the X-direction or the Y-direction, and the inspection jig moving portion of the transfer table. Correct the control of the movement of the inspection jig holder in the X or Y direction,
The substrate inspection apparatus according to any one of claims 3 to 5, which recognizes the position of the inspection jig on the control coordinates based on the plurality of jig position marks recognized by the auxiliary camera. The control device has a plurality of resist position marks selected from a plurality of openings of the resist mask on the substrate surface recognized by the main camera, and positions of the resist mask from the inspection terminal from the plurality of substrate position marks. The substrate inspection apparatus according to any one of claims 1 to 6, which recognizes the deviation and reflects the positional deviation in the recognition of the position of the substrate. The control device or the inspection jig has a storage unit, or the control device has an external interface connected to an external storage means.
The control device recognizes the difference between the optically aligned optical position and the electrical position conforming to the electrical inspection of the inspection jig, and generates data representing the recognized difference with the individual inspection jig. The data representing the difference associated with the inspection jig held in the inspection jig holding unit is stored in the storage unit or the external storage means in a one-to-one relationship with the storage unit or the external storage means. The substrate inspection apparatus according to any one of claims 1 to 7, which is read from the above and performs alignment based on the data representing the difference read from the above. The preparation step for preparing the substrate inspection apparatus according to any one of claims 1 to 8.
A step in which the main camera moves relative to the transfer table to recognize a plurality of position marks on the transfer table including the plurality of board position marks and the plurality of table position marks.
A step in which the control device determines the position of the origin of the control coordinates and the direction of the coordinate axes, which are orthogonal coordinates, based on the plurality of table position marks recognized by the main camera.
A step in which the auxiliary camera moves relative to the inspection jig mounted on the inspection jig holding portion to recognize the plurality of jig position marks.
The process of placing the substrate on the substrate holding portion and
A step in which the main camera moves relative to the transfer table to recognize the plurality of substrate position marks on the mounted substrate.
The control device recognizes the position of the substrate on the control coordinates from the plurality of substrate position marks recognized by the main camera, and from the plurality of jig position marks recognized by the auxiliary camera, the inspection jig A matching step of matching the substrate and the inspection jig by recognizing the position on the control coordinates,
A substrate inspection method comprising, after the matching step, a step of bringing the substrate into contact with the inspection jig for electrical inspection. The substrate inspection method according to claim 9.
In the preparation step, as the substrate inspection device, a substrate inspection device in which the matching camera that recognizes the plurality of position marks on the transfer table is attached to the inspection jig holding portion is prepared.
The substrate inspection method is
A mark recognition step in which the main camera or the matching camera moves relative to the transport table to recognize the plurality of table position marks.
The control device moves the transport table in the X direction or the Y direction based on the plurality of table position marks recognized in the mark recognition step, and the inspection jig holding portion by the inspection jig moving portion. A deviation recognition step of recognizing a deviation of the control coordinate of the movement in the X direction or the Y direction from the X axis and the Y axis.
Based on the deviation recognized by the control device in the deviation recognition step, the movement of the transport table in the X direction or the Y direction, and the X direction or the Y direction of the inspection jig holding portion by the inspection jig moving unit. A substrate inspection method further including a correction step for correcting the control of the movement of the. A step of causing the substrate holding portion to hold the XY standard scale having calibration data,
A step in which the main camera or the matching camera moves relative to the transport table to recognize a plurality of predetermined positions on the XY standard scale.
The substrate inspection method according to claim 10, further comprising a step of calibrating the control coordinates by the control device at the recognized plurality of predetermined positions. The substrate inspection method according to claim 10 or 11.
In the preparation step, as the substrate inspection device, a substrate inspection device fixed to the transfer table and having an auxiliary camera position mark indicating the optical axis position thereof is prepared in the auxiliary camera.
The substrate inspection method is
A step in which the main camera or the matching camera moves relative to the transport table to recognize the auxiliary camera position mark.
A substrate inspection method further comprising a step in which the control device recognizes the position of the auxiliary camera on the control coordinates by the auxiliary camera position mark recognized by the main camera or the matching camera. The substrate inspection method according to any one of claims 10 to 12.
Another mark recognition step in which the main camera or the matching camera moves relative to the transfer table for each predetermined condition to recognize the plurality of table position marks.
The control device moves the transfer table in the X or Y direction based on the plurality of table position marks recognized in the other mark recognition step, and holds the inspection jig by the inspection jig moving unit. Another deviation recognition step of recognizing the deviation of the control coordinates from the X-axis and the Y-axis of the movement of the part in the X direction or the Y direction
Based on the deviation recognized by the control device in the other deviation recognition step, the movement of the transport table in the X direction or the Y direction, and the X direction or the X direction of the inspection jig holding portion by the inspection jig moving portion. The process of correcting the control of movement in the Y direction and
A jig position mark recognition step in which the auxiliary camera moves relative to the inspection jig for each predetermined condition to recognize the plurality of jig position marks.
A substrate inspection method further comprising a step of the control device recognizing the position of the inspection jig on the control coordinates based on the plurality of jig position marks recognized in the jig position mark recognition step. .. A step in which the main camera moves relative to the transfer table to recognize a plurality of resist position marks among the plurality of openings of the resist mask on the substrate surface together with the plurality of substrate position marks.
The control device recognizes the positional deviation of the resist mask from the inspection terminal from the recognized plurality of resist position marks and the plurality of substrate position marks, and uses the positional deviation as recognition of the position of the substrate. The substrate inspection method according to any one of claims 9 to 13, further comprising a step of reflecting. The substrate inspection method according to any one of claims 9 to 14.
In the preparation step, as the substrate inspection device, the control device or the substrate inspection device in which the inspection jig has a storage unit is prepared.
The substrate inspection method is
A step in which the control device recognizes the difference between the optically aligned optical position and the electrical position conforming to the electrical inspection of the inspection jig.
A step of associating the data representing the difference recognized by the control device with each of the inspection jigs on a one-to-one basis and storing the data in the storage unit.
The control device further includes a step of reading data representing the difference associated with the inspection jig held in the inspection jig holding unit from the storage unit.
The matching step is
A substrate inspection method comprising a step of matching the substrate with the inspection jig based on the data representing the difference read out by the control device. The substrate inspection method according to any one of claims 9 to 15.
A table position mark recognition step in which the main camera moves relative to the transfer table and recognizes the plurality of table position marks for each predetermined condition during continuous automatic inspection.
The control device checks the difference between the plurality of table position marks recognized in the table position mark recognition step from the start of the continuous automatic inspection, and resets the position of the origin of the control coordinates and the direction of the coordinate axes. And the process to do
A substrate inspection method further comprising a step of recognizing the plurality of jig position marks by the auxiliary camera for each predetermined condition during the continuous automatic inspection. The substrate inspection method according to any one of claims 9 to 16.
A step in which the control device determines the position of the origin of the control coordinates and the direction of the coordinate axes, which are orthogonal coordinates based on the plurality of table position marks recognized by the main camera.
A step in which the auxiliary camera moves relative to the inspection jig to recognize the plurality of jig position marks on the control coordinates.
A step of fixing a pressure-sensitive recording plate having a pressure-sensitive sheet attached to a portion of the substrate holding portion facing the plurality of jig position marks.
A step of moving the transfer table relative to the inspection jig so that the pressure-sensitive recording plate is at the inspection position directly below the inspection jig.
The guide plate of the inspection jig is pressed against the pressure-sensitive recording plate, whereby the pressure contact marks of the plurality of jig position marks are recorded on the pressure-sensitive sheet as a plurality of pressure-sensitive position marks, and thereafter. A process in which the inspection jig moving unit moves the inspection jig so as to release the press.
After that, the step of moving the main camera relative to the board recognition position for recognizing the board, and
A step in which the main camera moves relative to the transfer table and recognizes the plurality of pressure-sensitive position marks recorded on the pressure-sensitive pressure-sensitive sheet fixed to the substrate holding portion.
At the inspection position, the positions of the plurality of jig position marks at the inspection position recognized by the auxiliary camera on the control coordinates are recognized by the main camera through the plurality of pressure-sensitive position marks at the substrate recognition position. A substrate inspection method further comprising a step of verifying that the positions of the plurality of jig position marks match the positions on the control coordinates. An inspection jig mounted on a board inspection device that inspects the electrical characteristics of a board having a plurality of inspection terminals to which an electric circuit is wired.
It is equipped with an inspection jig body and a recording medium on which data is recorded.
The inspection jig body
A jig base held in the inspection jig holding portion of the substrate inspection device and
With a plurality of probes in contact with the inspection terminal,
A probe holding unit that holds the plurality of probes,
Including a guide plate having a plurality of guide holes for guiding the tips of the plurality of probes to the inspection terminal.
The guide plate has a plurality of jig position marks capable of optically recognizing the position.
The data on the recording medium
Design position data of the plurality of jig position marks and
The corrected position data of the plurality of jig position marks and the corrected position data are included.
The corrected position data includes the plurality of inspection points set from the design inspection points of the plurality of inspection terminals on the substrate, the measurement positions of the plurality of guide holes, or the measurement positions of the tip groups of the plurality of probes. An inspection jig which is position data of the plurality of jig position marks corrected from the measurement positions of the plurality of jig position marks so that the positions of the contact point groups of the probes are appropriately matched. The properly matched condition deviates from the deviation amount of the position of the contact point group of the plurality of probes from the design inspection point of the plurality of inspection terminals or the design region of the plurality of inspection terminals. The inspection jig according to claim 18, which is determined from the margin amount. The inspection jig according to claim 18 or 19, wherein the inspection jig includes a storage means for writing and reading data by the substrate inspection device, and the storage means includes the recording medium. The method for manufacturing an inspection jig according to any one of claims 18 to 20.
Including the step of creating the corrected position data of the plurality of jig position marks.
The process is
The process of creating design data for the plurality of inspection terminals on the substrate, and
A step of measuring the positions of the plurality of jig position marks on the manufactured inspection jig body, the positions of the plurality of guide holes, or the positions of the tips of the plurality of probes.
A step of setting the position of the contact point cloud of the plurality of probes from the measured position, and
A step of exploring and determining the amount of rotation and the amount of movement of the contact point group of the plurality of probes in order to appropriately match the plurality of inspection terminal groups of the substrate.
A method for manufacturing an inspection jig, which includes a step of creating the corrected position data corrected from the measurement positions of the plurality of jig position marks so as to correspond to the determined rotation amount and movement amount. ..

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