JP2020105055A - Bending method and bending apparatus of glass - Google Patents

Abstract

To provide an apparatus and a method for bending glass capable of bending glass partly or wholly to a desired shape.SOLUTION: A bending apparatus of glass is equipped with a light source for emitting a first laser beam to be absorbed in the glass, a location where the glass is arranged, an optical system for irradiating the glass with the laser beam emitted from the light source, and control means for controlling action of each part of the bending apparatus. A predetermined bending target part of the glass is irradiated with the laser beam and thus heated to a softening temperature or higher of the glass to become a soft region. The glass is thus bent or bowed.SELECTED DRAWING: Figure 4

Description

The present invention relates to bending of glass, and more particularly to bending of glass using laser light.

As a method of processing glass, after arranging the glass in the mold, irradiating the glass through the mold with a laser that penetrates the mold and is absorbed by the glass, the glass is provided on the molding surface. It is already known to mold into a shape that follows (see, for example, Patent Document 1).

JP, 2018-16507, A

There is a need to locally or entirely bend a glass formed into a thin plate or rod shape into a desired shape.

For example, it is possible to make the desired shape by pressing (pressing) the part you want to bend to the mold while heating the entire glass above the softening point, but it is necessary to adhere it to high temperature glass. In addition, such a method is disadvantageous in terms of productivity and cost because, in general, an expensive die is consumed quickly and it is necessary to secure a heating time and a cooling time after processing. In the first place, if some kind of processing (deformation, joining with other members, printing, etc.) is performed in advance on the portion other than the portion to be bent, the entire glass cannot be softened.

Although the method disclosed in Patent Document 1 is suitable for deforming the surface of glass into a desired shape, bending of the glass itself is not assumed. This can be confirmed, for example, from the fact that it is possible to use a CO ₂ laser having a wavelength of approximately 9 μm to 11 μm that is absorbed by the glass surface and hardly penetrates inside.

The present invention has been made in view of the above problems, and to realize an apparatus and a method capable of bending a glass formed into a plate shape or a rod shape locally or entirely, into a desired shape. To aim.

In order to solve the above-mentioned problems, the invention of claim 1 is a method for bending glass, in which a predetermined target portion of the glass to be processed is irradiated with a first laser beam absorbed inside the glass. The glass is bent or curved by heating the processing target portion to a temperature equal to or higher than the softening point of the glass to form a softened region.

The invention of claim 2 is the method for bending a glass according to claim 1, wherein the processing target portion is defined in a linear shape, and one side of the glass that sandwiches the processing target portion is first. And irradiating the first laser light while scanning along the processing target portion to bend the glass at the softened region. The bending is performed so that the second portion forms a predetermined angle with the first portion.

The invention of claim 3 is the method for bending glass according to claim 1, wherein the glass and the curved surface are placed in a state in which the glass is placed on a mold whose upper surface is a curved surface. In a range including at least a part of a portion where and are separated from each other, the first laser light is scanned on the glass while varying the heat input amount according to the degree of separation between the glass and the curved surface. While irradiating the glass, the glass is curved along the curved surface by forming the softened region along the curved surface on the glass.

The invention of claim 4 is the method for bending glass according to any one of claims 1 to 3, wherein the scanning of the first laser light is arranged in the optical path of the first laser light. It is characterized by being performed by a scanner.

A fifth aspect of the present invention is the glass bending method according to any one of the first to third aspects, wherein the scanning of the first laser light is performed by moving a stage on which the glass is arranged. It is characterized by doing.

A sixth aspect of the present invention is the glass bending method according to any one of the first to third aspects, wherein the scanning of the first laser beam is performed by a galvano scanner and a stage on which the glass is arranged. It is characterized in that it is performed in combination with movement.

The invention of claim 7 is the method for bending glass according to any one of claims 1 to 6, wherein a focus moving lens and a condenser lens are provided in the optical path of the first laser beam. And the lens for focus movement is movable in the optical path in the direction from the light source of the first laser light toward the condensing lens, and depending on the irradiation position of the first laser light on the glass. The focus of the first laser beam is positioned on the surface of the glass by moving the focus moving lens regardless of the irradiation position.

The invention of claim 8 is the method for bending glass according to any one of claims 1 to 7, wherein a beam expander is provided in the optical path of the first laser beam, and The beam diameter of the first laser beam is changed according to the irradiation position.

The invention of claim 9 is the method for bending glass according to claim 8, wherein the first laser light whose beam diameter is adjusted by the beam expander is incident on an aspherical cylindrical lens, whereby A linear laser beam emitted from an aspherical cylindrical lens is applied to the processing target portion of the glass.

The invention of claim 10 is the method for bending glass according to any one of claims 1 to 9, wherein the first laser light is a mid-infrared laser light.

The invention of claim 11 is the method for bending glass according to any one of claims 1 to 10, wherein the second laser light is absorbed on the surface of the glass but does not pass through the inside of the glass. Is irradiated to the glass at the same time as the irradiation of the first laser light.

The invention of claim 12 is the method for bending a glass according to claim 11, wherein the irradiation position of the second laser light is made to coincide with the irradiation position of the first laser light. ..

The invention of claim 13 is the method for bending glass according to claim 12, wherein the second laser light is combined with the first laser light and then the glass is irradiated. And

The invention of claim 14 is the method for bending glass according to claim 13, wherein the third laser light which is visible light is further combined with the first laser light and the second laser light. The glass is then irradiated.

The invention of claim 15 is the method for bending glass according to any one of claims 11 to 14, wherein the second laser light is CO ₂ laser light.

The invention of claim 16 is the method for bending glass according to claim 1 or 2, wherein at least the portion to be processed of the glass is heated in advance before the irradiation with the first laser light. The feature is that

The invention of claim 17 is the method for bending glass according to claim 3, wherein the glass is irradiated with the first laser beam in a state where the glass is heated by heating the mold. , Is characterized.

The invention of claim 18 is the method for bending glass according to claim 5 or 6, wherein the glass is heated by heating the stage, and the first laser beam is applied to the glass. Is irradiated.

The invention of claim 19 is a processing device for bending glass, wherein a first light source that emits a first laser beam absorbed inside the glass, a location where the glass is disposed, The first laser includes: a first optical system that irradiates the glass with the first laser light emitted from the first light source; and a control unit that controls the operation of each unit of the processing apparatus. Irradiating light on a predetermined processing target portion of the glass, and heating or bending the processing target portion to a temperature equal to or higher than the softening point of the glass to form a softened region, thereby bending or bending the glass. Is characterized by.

The invention of claim 20 is the processing apparatus according to claim 19, further comprising a scanning unit that scans the glass with the first laser beam with which the glass is irradiated, and the processing target portion is linear. When the one side of the glass sandwiching the portion to be processed is the first portion and the other side is the second portion, the first laser light is processed by the scanning means to the processing target. By irradiating while scanning along the portion, the glass is bent at the softened region, and bending is performed so that the second portion forms a predetermined angle with respect to the first portion. , Is characterized.

A twenty-first aspect of the present invention is the processing apparatus according to the nineteenth aspect, wherein a scanning unit that causes the first laser beam with which the glass is irradiated to scan the glass, and a die having a curved upper surface. Further comprising, in a state in which the glass is placed on the curved surface of the mold, in the range including at least a part of the portion where the glass and the curved surface are separated, Irradiating the laser beam while scanning the glass by the scanning means while varying the heat input according to the degree of separation between the glass and the curved surface, and softening the glass along the curved surface. By forming a region, the glass is curved along the curved surface.

The invention of claim 22 is the processing apparatus according to claim 20 or claim 21, wherein the first optical system includes a galvano scanner arranged in an optical path of the first laser beam, and the galvano scanner. Constitutes the scanning means.

The invention of claim 23 is the processing apparatus according to claim 20 or claim 21, further comprising a stage on which the glass is disposed, the glass is disposed on the stage, and the first laser light is The scanning unit is realized by moving the stage in a state where the glass is irradiated.

The invention of claim 24 is the processing apparatus according to claim 20 or claim 21, wherein the first optical system includes a galvano scanner arranged in the optical path of the first laser beam, and the glass is The scanning means further comprises a stage arranged, and the scanning means is a combination of the galvano scanner and movement of the stage on which the glass is arranged when the first laser beam is irradiated.

A twenty-fifth aspect of the present invention is the processing apparatus according to any one of the nineteenth to twenty-fourth aspects, wherein the first optical system has a focal point movement arranged in the optical path of the first laser beam. And a condenser lens, wherein the focus moving lens is provided so as to be movable back and forth in a direction from the light source of the first laser light toward the condenser lens in the optical path. The focus of the first laser light is positioned on the surface of the glass regardless of the irradiation position by moving the focus moving lens according to the irradiation position of the first laser light. To do.

The invention of claim 26 is the processing apparatus according to any one of claims 19 to 25, further comprising a beam expander in which the first optical system is arranged in an optical path of the first laser light. It is characterized in that the beam expander changes the beam diameter of the first laser light according to an irradiation position on the glass.

The invention of claim 27 is the processing apparatus according to claim 26, wherein the first optical system further includes an aspherical cylindrical lens in the optical path of the first laser light, and the aspherical cylindrical lens is And converting the first laser light, which is incident after the beam diameter is adjusted by the beam expander, into linear laser light and emits the laser light, and irradiates the processing target portion of the glass. To do.

The invention of claim 28 is the processing apparatus according to any one of claims 19 to 27, wherein the first laser beam is a mid-infrared laser beam.

The invention of claim 29 is the processing apparatus according to any one of claims 19 to 28, which emits a second laser beam that is absorbed by the surface of the glass but does not pass through the inside of the glass. A second light source and a second optical system for irradiating the glass with the second laser light emitted from the second light source are further provided, and the second laser light is used for the first laser. The glass is irradiated simultaneously with the irradiation of light.

The invention of claim 30 is the processing apparatus according to claim 29, characterized in that the irradiation position of the second laser light is matched with the irradiation position of the first laser light.

A thirty-first aspect of the present invention is the processing apparatus according to the thirtieth aspect, wherein the second laser light is combined with the first laser light and then the glass is irradiated.

The invention of claim 32 is the processing apparatus according to any one of claims 29 to 31, further comprising a third light source that emits a third laser beam that is visible light, The first laser light and the second laser light are further combined with each other, and then the glass is irradiated.

The invention of claim 33 is the processing apparatus according to any one of claims 29 to 32, wherein the second laser light is CO ₂ laser light.

The invention of claim 34 is the processing apparatus according to claim 19 or claim 20, further comprising a glass heating means for heating the glass, wherein the glass heating is performed before the irradiation with the first laser light. At least the portion to be processed of the glass is preheated by means.

A thirty-fifth aspect of the present invention is the processing apparatus according to the twenty-first aspect, further comprising a die heating means for heating the die, wherein the die heating means heats the die to heat the glass. The glass is irradiated with the first laser light in a heated state.

The invention of claim 36 is the processing apparatus according to claim 23 or 24, further comprising stage heating means for heating the stage, wherein the stage is heated by the stage heating means to heat the glass. In this state, the glass is irradiated with the first laser light.

According to the invention of claims 1 to 36, the glass is bent or curved into a desired shape in a shorter time than when the glass is bent by pressing with a mold and without unnecessary heat input. Can be made

In particular, according to the inventions of claims 2 and 20, by heating only a predetermined processing target portion to form a softened region, the glass can be bent at the processing target portion, so that the glass can be bent in a short time. Moreover, the glass can be bent without applying heat to a portion other than the portion to be processed.

In particular, according to the inventions of claims 3 and 21, the heating temperature of the glass itself can be made lower than that of the conventional press working, so that the temperature of the mold is also lower than the softening point of the glass. Can be suppressed. Therefore, the life of the mold can be extended.

In particular, according to the inventions of claim 4 and claim 22, since scanning with a high degree of freedom can be performed using a galvano scanner, the irradiation time (scanning speed) and the beam overlap amount of the first laser light can be determined for each glass position. It is possible to freely change. As a result, it is possible to control the temperature distribution in the glass during bending by varying the heat input amount for each place, and thus to control the bent shape of the glass.

In particular, according to the inventions of claims 5 and 23, it is possible to perform scanning over a wide range compared to the case of scanning with a galvano scanner.

In particular, according to the inventions of claims 6 and 24, it is possible to perform scanning over a wide range at high speed.

Particularly, according to the inventions of claims 7 and 25, the heat input amount can be made constant regardless of the processing position.

In particular, according to the inventions of claims 9 and 27, it becomes possible to heat the glass while controlling the distribution of the amount of heat input in the in-plane direction of the glass.

In particular, according to the twelfth and thirtieth inventions, it becomes possible to heat the glass while controlling the distribution of the heat input in the thickness direction.

Particularly, according to the inventions of claims 14 and 32, the processing position can be easily visually recognized.

Particularly, according to the inventions of claims 16 to 18 and 31 to 36, the time required for bending is shortened.

It is a figure which shows the transmission spectrum and reflection spectrum of soda lime glass. It is a figure showing roughly about the 1st processing mode. It is a figure showing roughly about the 2nd processing mode. It is a figure which shows typically the processing apparatus 100 which concerns on a 1st structural example. It is a figure which shows typically the processing apparatus 200 which concerns on the example of a 2nd structure. It is a figure which shows typically the processing apparatus 300 which concerns on the 3rd structural example. It is a figure which shows typically the processing apparatus 400 which concerns on the example of a 4th structure. It is a figure which shows typically the processing apparatus 500 which concerns on a 5th structural example. It is a figure for demonstrating the role of the lens for focus movement, and a condensing lens. It is a figure which shows typically the processing apparatus 600 which concerns on the example of a 6th structure. It is a figure which shows typically the processing apparatus 700 which concerns on the example of a 7th structure. It is a figure which shows typically the processing apparatus 800 which concerns on the 8th structural example. It is a figure for demonstrating a modification.

<Outline of processing>
FIG. 1 is a diagram showing a transmission spectrum and a reflection spectrum of soda lime glass, which is a generally widely used glass type. The thickness of the glass is 0.7 mm. According to FIG. 1, in the wavelength range of 3 μm to 5 μm, which is the emission wavelength range of the mid-infrared laser, the reflectance is as low as about 10%, while the transmittance is about 70%. This means that when the soda-lime glass is irradiated with the mid-infrared laser, internal absorption occurs, which locally or entirely heats the glass. The transmittance is almost zero at 6 μm or more. Further, the reflectance has a peak in the vicinity of 10 μm included in the emission wavelength range of the CO ₂ laser, and a broad peak also exists in the vicinity of 21 μm.

In the present embodiment, utilizing this fact, the glass is bent by irradiating a mid-infrared laser. Hereinafter, the mid-infrared laser is also simply referred to as laser or laser light. As can be seen from FIG. 1, the CO ₂ laser is absorbed on the surface but does not penetrate inside. Therefore, the use of the CO ₂ laser alone is not suitable for bending glass.

FIG. 2 and FIG. 3 are diagrams schematically showing typical modes (first processing mode and second processing mode) of bending performed in the present embodiment.

(First processing mode)
FIG. 2 shows the case where the plate-shaped glass 1 is bent along a predetermined bending position P. Hereinafter, such a processing mode is referred to as a first processing mode. The planned bending position P is the processing target portion in the first processing mode. In addition, in the case shown in FIG. 2, the planned bending position P is defined to extend linearly in the direction perpendicular to the drawing, and on the one side of the glass 1 sandwiching the planned bending position P. The bending process is performed so that the second portion 1b on the other side forms a predetermined angle with respect to a certain first portion 1a.

In such a case, as shown in FIG. 2A, the glass 1 is horizontally held by the holding means 2 in such a manner that at least the planned bending position P and the second portion 1b are projected in the horizontal direction. The distance between the holding means 2 and the planned bending position P in the horizontal plane may be appropriately determined depending on the thickness and material of the glass 1, the desired degree of bending, and the like.

Note that, in FIG. 2, for simplification of the drawing, the manner in which the glass 1 is held by the holding means 2 is shown in a mode in which the first portion 1a is placed on the holding means 2 having a flat upper surface. In practice, the holding means 2 may hold the glass 1 in various modes such as suction, gripping, pinching, adhering, screwing, and fitting, and the holding means 2 also has a form corresponding to the holding mode. And may have a configuration.

Then, with the glass 1 held horizontally by the holding means 2 in this way, the planned bending position P is irradiated with the laser beam LB from above. More specifically, various irradiation conditions (beam diameter, beam shape, intensity, scanning speed, number of reciprocations, etc.) can be suitably set in advance to heat the irradiated region of the glass 1 to the glass softening point or higher. The predetermined laser light LB is emitted from a predetermined light source, and is emitted while scanning along a planned bending position P extending in a direction perpendicular to the drawing under an appropriately configured optical system.

Then, a part of the irradiated laser beam LB is absorbed inside the glass 1 at the planned bending position P, so that the glass is softened along the planned bending position P as shown in FIG. 2B. A softened region RE heated above the point is formed. Since the softened region RE is weaker in strength than the surroundings, the second portion 1b of the glass 1 which is not held by the holding means 2 is affected by its own weight and/or the internal stress generated in the glass 1 so that the second portion 1b shown in FIG. In, as shown by an arrow AR1, it bends downward from the horizontal direction. In other words, the glass 1 is bent at the softened region RE. The degree of bending can be adjusted by changing the irradiation conditions according to the material and thickness of the glass 1. Alternatively, an external force may be applied in the state where the softened region RE is formed to adjust the degree of bending.

The time required to form the softened region RE is about several seconds to several tens of seconds, which is sufficiently short as compared with about several hundred seconds required to heat the glass during pressing with the mold. Further, when the desired bending is realized and the irradiation of the laser beam LB is finished, the temperature of the softened region RE is rapidly lowered. Further, heat input to areas other than the softened region RE hardly occurs.

That is, according to the first processing mode, the glass 1 can be bent to a desired degree along the planned bending position P in a short time and without unnecessary heat input.

The glass 1 to be processed in the first processing mode is not limited to the plate-shaped one, and may be a rod-shaped one. It is also possible to bend the glass 1 upward by irradiating the laser beam LB from below.

Further, before irradiation with the laser beam LB, at least a portion including the planned bending position P may be heated (preheated) by a predetermined heating unit in advance. In such a case, the time required for the bending process is shortened, and the glass is hardly cracked (broken) during the bending process.

(Second processing mode)
FIG. 3 shows a case where the plate-shaped glass 1 is curved along a mold 3 prepared in advance. Hereinafter, such a processing mode is referred to as a second processing mode. In the second processing mode, the entire bending target range is the processing target portion in this mode. In the case shown in FIG. 3, the upper surface of the mold 3 is a curved surface 3a that is convexly curved upward in a plane parallel to the drawing, and extends in a direction perpendicular to the drawing in the same bending mode. It is assumed to exist. Then, the bending process is performed such that the glass 1 as a whole is curved along the curved surface 3a.

In this case, the glass 1 is placed on the curved surface 3a of the mold 3, as shown in FIG. At that time, the glass 1 may be appropriately held by a holding means (not shown) so as not to cause positional displacement. More specifically, the glass 1 is placed so as to be in contact with the mold 3 at the center position 1c in the left-right direction in the drawing and separated at the end 1e. In this case, it is necessary to bend the glass 1 to a greater extent as it approaches the end 1e.

Then, the glass 1 thus placed on the mold 3 is irradiated with laser light LB from above while scanning in a direction perpendicular to the drawing. Specifically, as shown by an arrow AR2 in FIG. 3B, the scanning position is sequentially changed between the central position 1c and the end portion 1e, and scanning is performed by the laser beam LB along the direction perpendicular to the drawing. I do. That is, scanning is performed at a plurality of locations parallel to each other along the direction perpendicular to the drawing. In FIG. 3(b), the laser beam LB is irradiated only in the range distant from the center position 1c, but the actual scanning range is the shape of the curved surface 3a of the mold 3, the material of the glass, the thickness of the glass. It may be appropriately determined according to the above.

Similar to the first processing mode, various irradiation conditions of the laser beam LB are appropriately set, emitted from a predetermined light source, and the glass is irradiated under an appropriately configured optical system, thereby It is possible to form the softened region RE heated at the irradiation position above the glass softening point. Moreover, at that time, the degree of separation between the glass 1 and the curved surface 3a is made different by changing the irradiation conditions of the laser light LB at the time of individual scanning so that the glass 1 is curved more largely from the central position 1c toward the end 1e. It is possible to bend the glass 1 along the curved surface 3a by changing the amount of heat input according to the above. The amount of heat input according to the degree of separation between the glass 1 and the curved surface 3a may be adjusted by, for example, increasing the intensity of the laser beam LB or increasing the number of times of irradiation repetition at a location where the degree of separation is large. Or by reducing the scanning speed.

If the same scanning is performed on the left side of the center position 1c as viewed in the drawing, the entire glass 1 will eventually be curved along the curved surface 3a as shown in FIG. 3(c).

In the case shown in FIG. 3, the curved shape of the mold 3 is uniform in the direction perpendicular to the drawing, but when the curved shape differs depending on the location in the direction, that is, the curved shape is three-dimensional. In such a case, the glass 1 is curved in accordance with the curved shape of the mold 3 by, for example, changing the irradiation condition according to the curved shape during scanning in the direction perpendicular to the drawing. Is possible.

In the case of the second processing mode, the time for which the mold 3 is in contact with the high temperature glass 1 is shorter than that in the conventional press processing. Further, since the heating temperature of the glass 1 itself can be made lower than that of the conventional press working, the temperature of the die 3 is softened even if it is heated for easy bending. It can be kept lower than the point. Therefore, according to the second processing mode, the life of the mold 3 can be extended.

The mold 3 used in the second processing mode is not limited to the one that is convexly curved on the curved surface 3a, and may be one that is convexly curved downward, and both are coexisting. May be. In the latter case, the corrugated glass 1 is obtained.

In addition, the mold 3 may be heated by a predetermined mold heating unit prior to the irradiation of the laser light LB or during the irradiation of the laser light LB. In such a case, the time required for the bending process is shortened, and the glass is hardly cracked (broken) during the bending process.

<Processing equipment>
Hereinafter, a processing apparatus capable of processing the glass 1 according to the above-described first and/or second processing mode will be described.

In order to realize the above-described first and/or second processing mode, at least a light source capable of emitting a laser beam LB (mid-infrared laser), a laser beam LB at a desired position, and a desired direction. It is necessary to have a structure for making the scanning. Further, it is preferable that a structure for positioning the glass and a structure for adjusting the posture are appropriately provided during processing.

In the following, various structural examples of the processing apparatus, which mainly have different structures related to irradiation and scanning of the laser beam LB, will be sequentially described.

(First configuration example)
FIG. 4 is a diagram schematically showing the processing apparatus 100 according to the first configuration example. The processing apparatus 100 mainly includes a light source 101 for the laser light LB arranged on a base 100b, a galvano scanner 110 including two galvano mirrors 111 and 112, and a controller 100c that controls the operation of each unit of the apparatus. The Galvano mirrors 111 and 112 are provided so as to be swingable about two swinging axes which are different from each other and are orthogonal to each other. Further, the processing apparatus 100 is configured to hold the glass 1 by the holding means 2 and place the glass 1 at a predetermined location, assuming bending in the first processing mode. In addition, preferably, the processing apparatus 100 includes a positioning mechanism (not shown) for determining the arrangement position of the glass 1 (the same applies to the subsequent configuration examples).

In the case shown in FIG. 4, the light source 101 is provided so as to emit the laser light LB in a certain direction within the horizontal plane, and the galvano mirror 111 is within an angle range of Δθ1 about the swing axis along the vertical direction. The galvano mirror 112 is swingably provided within a horizontal plane in a range of Δθ2 about a swing axis along a direction orthogonal to the emission direction of the laser light LB from the light source 101. It will be done. Then, the laser light LB emitted from the light source 101 is once reflected by the galvano mirror 111, then reflected by the galvano mirror 112, and irradiated onto the glass 1 held by the holding means 2. ing. By swinging the Galvano mirrors 111 and/or 112 based on a predetermined condition, it is possible to perform scanning within the horizontal plane by the laser light LB applied to the glass 1.

Note that a not-shown condenser lens may be provided at an intermediate position in the optical path from the light source 101 to the galvanometer mirror 111 to adjust the beam diameter of the laser light LB emitted from the light source 101 to a predetermined size (( (See FIGS. 8 and 9).

In the processing apparatus 100, it is possible to heat the glass 1 by averaging the influence of the intensity distribution of the laser light LB by high-speed scanning using the galvano scanner 110. Therefore, in the processing apparatus 100, even a high-power laser whose beam mode is not necessarily good can be used.

Further, since the processing apparatus 100 can perform scanning with a high degree of freedom using the galvano scanner 110, it is possible to freely change the irradiation time (scanning speed) and the beam overlap amount of the laser light LB for each place of the glass 1. Has become. This means that the temperature distribution in the glass 1 can be controlled at the time of bending by changing the amount of heat input at each place, and hence the bent shape of the glass can be controlled.

(Second configuration example)
FIG. 5 is a diagram schematically showing the processing device 200 according to the second configuration example. Like the processing apparatus 100, the processing apparatus 200 controls the light source 201 of the laser beam LB arranged on the base 200b, the galvano scanner 210 including two galvano mirrors 211 and 212, and the operation of each part of the apparatus. Mainly includes a controller 200c. The Galvano mirrors 211 and 212 are provided so as to be swingable about two swinging axes which are different from each other and are orthogonal to each other.

As in the processing device 100, a condenser lens (not shown) is provided at an intermediate position in the optical path from the light source 201 to the galvano mirror 211, and the beam diameter of the laser light LB emitted from the light source 201 is adjusted to a predetermined size. May be

On the other hand, unlike the processing apparatus 100, the processing apparatus 200 is assumed to be bent in the second processing mode, and the glass 1 is placed on the mold 3 and held by a predetermined holding unit (not shown). Thus, it is arranged at a predetermined arrangement place. The processing device 200 further includes a heater 221 for heating the mold 3 so that the bending process according to the second processing mode can be performed more preferably.

In the processing apparatus 200 as well, similarly to the case where the galvano scanner 110 is used in the processing apparatus 100, by using the galvano scanner 210, it becomes possible to perform scanning in the horizontal plane by the laser light LB irradiated on the glass 1. There is.

Further, as described above, the heating temperature for heating the mold 3 with the heater 221 is sufficiently lower than the softening point of the glass 1.

Note that, instead of the heater 221, or in addition thereto, a mode may be provided in which a warm air heating unit that heats the mold 3 by blowing warm air is provided (the same applies to the following configuration examples). ..

(Third configuration example)
FIG. 6 is a diagram schematically showing a processing apparatus 300 according to the third configuration example. The processing device 300 is similar to the processing devices 100 and 200 in that the processing device 300 includes a light source 301 for the laser light LB arranged on a base 300b and a controller 300c for controlling the operation of each part of the device, but the processing device 300 is a galvano scanner. Is not provided.

Instead, the processing apparatus 300 includes a mirror 331 that reflects the laser beam LB and changes the irradiation direction thereof, and a first stage 341 and a second stage 342 that are movable in two directions in which the glass 1 is orthogonal to each other in a horizontal plane. Equipped with.

In the case shown in FIG. 6, the light source 101 is provided so as to emit the laser light LB in a certain direction in the horizontal plane, and the mirror 331 is provided so as to reflect the laser light LB vertically downward. The first stage 341 is provided so that the glass 1 can be moved within a predetermined range (Δx) in the x-axis direction, and the second stage 342 includes the glass 1 in a predetermined range in the y-axis direction orthogonal to the x-axis direction. It is movably provided at (Δy). More specifically, the glass 1 is moved by being held by the holding means 2 (not shown) in the first working mode and being placed on the mold 3 (not shown) in the second working mode. To be

In the processing apparatus 300, the laser light LB emitted from the light source 101 is reflected vertically downward by the mirror 331 and is applied to the glass 1. Then, by moving the first stage 341 and/or the second stage 342 based on a predetermined condition while the laser light LB is emitted from the light source 301, the scanning (relative scanning) by the laser light LB in the horizontal plane is performed. It can be done. In such a case, it is possible to perform scanning over a wide range as compared with the case of using a galvano scanner.

In the processing apparatus 300 as well, a condenser lens (not shown) is provided at an intermediate position in the optical path from the light source 301 to the mirror 331, and the beam diameter of the laser light LB emitted from the light source 301 is adjusted to a predetermined size. It may be.

Further, the first stage 341 and the second stage 342 can be heated by a predetermined stage heating means (not shown), and the glass 1 is heated by heating the first stage 341 and the second stage 342. 1 may be irradiated with the laser beam LB (the same applies to the following configuration examples). In such a case, the time required for the bending process is shortened, and the glass is hardly cracked (broken) during the bending process.

Further, as an intermediate configuration of the processing device 100 or 200 and the processing device 300, one galvano scanner and one stage are provided, and the laser beam LB can be scanned by the combination of the former swing and the latter movement. The processing device may be configured so that

(Fourth configuration example)
FIG. 7 is a diagram schematically showing a processing device 400 according to the fourth configuration example. Like the processing devices 100 and 200, the processing device 400 includes a light source 401 for the laser beam LB arranged on the base 400b, a galvano scanner 410 including two galvano mirrors 411 and 412, and the operation of each part of the device. In addition to the controller 400c for controlling, the glass 1 is provided with a first stage 441 and a second stage 442 that are movable in two directions in a horizontal plane orthogonal to each other, as in the processing apparatus 300.

In the case shown in FIG. 7, the light source 401 is provided so as to emit the laser light LB in a certain direction within the horizontal plane, and the galvano mirror 411 is provided in an angle range of Δθ1 around the swing axis along the vertical direction. The galvano mirror 412 is provided so as to be swingable, and is swingable within an angle range of Δθ2 around the swing axis along the direction orthogonal to the emission direction of the laser light LB from the light source 401 in the horizontal plane. It will be done.

Then, the laser light LB emitted from the light source 401 is once reflected by the galvano mirror 411, and then reflected by the galvano mirror 412, and the glass 1 placed on the first stage 441 and the second stage 442. It is designed to be irradiated. Then, while the laser light LB is emitted from the light source 401, the galvano mirrors 411 and/or 412 are swung based on a predetermined condition, and the first stage 441 and/or the second stage 442 is swung based on a predetermined condition. By moving the glass 1, the laser light LB applied to the glass 1 can be scanned in a horizontal plane.

That is, the processing apparatus 400 has an effect that the scanning range of the laser beam LB can be increased by including the stage and an effect that the processing time is shortened by the galvano scanner 410. That is, it is possible to scan a wide range at high speed.

In the processing apparatus 400 as well, a condensing lens (not shown) is provided in the middle of the optical path from the light source 401 to the galvano mirror 411, and the beam diameter of the laser light LB emitted from the light source 401 is adjusted to a predetermined size. May be

(Fifth configuration example)
FIG. 8 is a diagram schematically showing a processing apparatus 500 according to the fifth configuration example. Like the processing device 200, the processing device 500 includes a light source 501 for the laser light LB arranged on the base 500b, a galvano scanner 510 including two galvano mirrors 511 and 512, and a mold 3 for heating the mold 3. A heater 521 and a controller 500c that controls the operation of each unit of the apparatus are mainly provided. The Galvano mirrors 511 and 512 are provided so as to be swingable about two swinging axes which are different from each other and are orthogonal to each other.

Although FIG. 8 exemplifies a case where the processing device 500 includes the heater 521 on the assumption that the bending process according to the second processing mode is performed, this is not an essential mode, and the processing device 500 includes the first processing device. It may be used for bending according to the processing mode.

In addition to the above-described components, the processing device 500 further includes a focus moving lens 551 and a condenser lens 552 in this order at an intermediate position on the optical path of the laser light LB from the light source 501 to the galvanometer mirror 511. A lens moving mechanism 551m is attached to the focus moving lens 551, and by operating the lens moving mechanism 551m, the lens can be moved forward and backward within a predetermined range (ΔL) in the direction from the light source 501 toward the condenser lens 552. It will be done.

FIG. 9 is a diagram for explaining the roles of the focus moving lens and the condenser lens. Although two galvanometer mirrors are provided in the actual processing apparatus as described above, it is assumed in FIG. 9 that there is only one galvanometer mirror Mg for simplicity of explanation.

First, FIG. 9A shows how the glass 1 is irradiated with the laser light LB when only the condenser lens Lc is provided between the light source of the laser light LB and the galvanometer mirror Mg.

In such a case, when the laser light LB converged by the condenser lens Lc is incident on the galvano-mirror Mg that oscillates, the locus of the focus (beam spot) F of the laser light LB is an arc according to the oscillation of the galvano-mirror Mg. You will draw C. This means that even if the focal point F coincides with the surface of the glass 1 when the galvanometer mirror Mg is in one posture, the focal point F is deviated from the surface of the glass 1 in another posture. In such a case, the focused spot diameter of the laser beam LB varies depending on the irradiation position of the laser beam LB (or the attitude of the galvano mirror Mg) on the glass 1, and as a result, the heat input amount varies depending on the irradiation position.

On the other hand, as shown in FIG. 9B, when the focus moving lens Lm that can move back and forth within a predetermined range (ΔL) is provided in front of the condenser lens Lc (on the light source side), the galvanometer mirror Mg swings. By synchronizing the moving operation of the focus moving lens Lm with the moving operation, the focus F of the laser light LB can be positioned on the surface of the glass 1 regardless of the attitude of the galvanometer mirror Mg. In such a case, the focused spot diameter of the laser light LB can be kept constant regardless of the irradiation position of the laser light LB on the glass 1.

Alternatively, when the height of the irradiated position on the glass 1 of the laser beam LB varies depending on the place, such as during the progress of bending, the height of the focus F is set so that the focused spot diameter is constant at any place. It is also possible to intentionally change the position.

In the case shown in FIG. 8, based on this, the laser light LB emitted from the light source 601 in a certain direction in the horizontal plane passes through the focus moving lens 551 and the condenser lens 552, and then the galvano mirror 411 and further the galvano mirror 552. It reaches the mirror 412, and then the glass 1 is irradiated. The lens moving mechanism 551m moves the focus moving lens 551 according to the swing of the Galvano mirrors 511 and 512, so that the amount of heat input can be made constant regardless of the processing position when the glass 1 is bent. You can do it.

Even when the lens 551 for focus movement and the condenser lens 552 are not provided like the processing apparatus 100, the heat input amount can be changed by changing the scanning speed and the scanning pitch for each irradiation position. It is possible to make it almost constant.

(Sixth configuration example)
FIG. 10 is a diagram schematically showing a processing device 600 according to the sixth configuration example. The processing device 600 includes a light source 601 for the laser light LB arranged on the base 600b, a heater 621 for heating the mold 3, a mirror 631 for reflecting the laser light LB and changing the irradiation direction thereof. The processing apparatus 300 is similar to the processing apparatus 300 in that it includes a controller 600c that controls the operation of each part of the apparatus, but the mechanism for moving the glass 1 is movably provided within a predetermined range in one direction within a horizontal plane. Only the stage 642 thus formed is provided, and no stage for moving the glass 1 in the direction orthogonal to the direction is provided.

Instead, the processing device 600 includes a beam expander 661 at an intermediate position in the optical path of the laser light LB from the light source 601 to the mirror 631. The beam expander 661 can change the beam diameter of the laser light LB emitted from the light source 601. Further, an aspherical cylindrical lens 671 is provided between the mirror 631 and the glass 1 arranged on the stage 642. The aspherical cylindrical lens 671 has a function of converting the laser light LB emitted from the light source 601 as a Gaussian beam into a line beam LBL.

Note that, although FIG. 10 illustrates the case where the processing device 600 includes the heater 621 on the assumption that the bending process according to the second processing mode is performed, this is not an indispensable mode and the processing device 600 includes the first processing device. It may be used for bending according to the processing mode.

In the case shown in FIG. 10, the moving direction of the stage 642 is the y-axis direction like the moving direction of the stage 342 of the processing apparatus 300, and the extending direction of the line beam LBL is the x-axis direction. , And has a predetermined width w in that direction.

In the processing apparatus 600, the laser light LB emitted from the light source 601 in a certain direction in the horizontal plane passes through the beam expander 661, is reflected vertically downward by the mirror 631, and is incident on the aspherical cylindrical lens 671. Then, in the aspherical cylindrical lens 671, the incident laser light LB is converted into a line beam LBL having a predetermined width w in the x-axis direction and emitted downward. The glass 1 is irradiated with this line beam LBL. At this time, if the stage 642 is kept stationary, a heating region is linearly formed along the x-axis direction, and by moving the stage 642 along with the irradiation of the line beam LBL, the line beam LBL is generated in the y-axis direction. If scanning is performed, a heating area is formed in a planar shape.

In such a case, it is possible to change the intensity distribution in the width direction of the line beam LBL by changing the beam diameter of the laser light LB incident on the aspherical cylindrical lens 671 by the beam expander 661. For example, the intensity of the central portion of the line beam LBL can be made larger or smaller than the others.

Further, by decentering the laser light LB incident on the aspherical cylindrical lens 671, it is possible to change the left-right balance of the intensity of the line beam LBL in the width direction.

By using the processing device 600, when the glass 1 is bent, the glass 1 can be heated while controlling the distribution of the heat input amount in the in-plane direction of the glass 1.

Note that, instead of the configuration in which the irradiation position is moved by using the stage 642 to perform the scanning with the line beam LBL as described above, one galvanomirror may be provided to scan the line beam LBL.

(Seventh configuration example)
FIG. 11 is a diagram schematically showing a processing apparatus 700 according to the seventh configuration example. The processing apparatus 700 is generally configured such that, in addition to the heating of the inside of the glass 1 by the mid-infrared laser, the heating of the surface of the glass 1 by the CO ₂ laser can be performed in a superimposed manner.

In the processing device 700, the first light source 701 that emits the CO ₂ laser LB1 and the second light source 702 that emits the mid-infrared laser LB2 are both arranged on the base 700b. In addition, the third light source 703 for emitting the visible light laser beam LB3 for confirming the irradiation position is also arranged on the base 700b.

Furthermore, from the dichroic mirror 781 and a dichroic mirror 781 that superimposes (combines) the mid-infrared laser beam LB2 emitted from the second light source 702 and the visible light laser beam LB3 emitted from the third light source 703. A dichroic mirror 782 that superimposes (combines) the superposed light of the emitted mid-infrared laser beam LB2 and the visible laser beam LB3 with the CO ₂ laser beam LB1 emitted from the first light source 701 is also arranged on the base 700b. It will be installed.

Like the processing device 200, the processing device 700 further includes a galvano scanner 710 including two galvano mirrors 711 and 712, a heater 721 for heating the mold 3, and a controller 700c for controlling the operation of each part of the device. Equipped with. The Galvano mirrors 711 and 712 are provided so as to be swingable with two different directions orthogonal to each other as their swing axes.

Note that, although FIG. 11 illustrates the case where the processing apparatus 700 includes the heater 721 assuming the execution of the bending processing in the second processing mode, this is not an indispensable mode, and the processing apparatus 700 includes the first processing mode. It may be used for bending according to the processing mode.

In the case shown in FIG. 11, a beam expander 761 is further provided in the optical path of the CO ₂ laser light LB1 from the first light source 701 to the dichroic mirror 782 so that the beam diameter of the CO ₂ laser light LB1 can be adjusted. It has become.

On the other hand, in the middle of the optical path of the mid-infrared laser beam LB2 from the second light source 702 to the dichroic mirror 781, a beam expander 762, a focus moving lens 751 provided with a lens moving mechanism 751m, and a condensing lens 752. Are provided in this order, and adjustment of the beam diameter of the mid-infrared laser beam LB2 using the beam expander 762 and position control of the focus F using the focus moving lens 751 and the condenser lens 752 can be performed. It has become.

In FIG. 11, the optical path of the CO ₂ laser light LB1 from the beam expander 761 to the dichroic mirror 782 is bent by the mirror 731, and the optical path of the mid-infrared laser light LB2 from the condenser lens 752 to the dichroic mirror 782. Are bent by the mirror 732, but these are both due to the arrangement of the components in FIG. 11, and are not essential aspects.

In the processing apparatus 700 shown in FIG. 11, the CO ₂ laser beam LB1 having the beam diameter adjusted by the beam expander 761, the beam diameter adjusted by the beam expander 762, and the focus moving lens 751 and the condenser lens 752. The mid-infrared laser LB2 whose focus position is adjusted is superposed on the dichroic mirror 782, and then reflected by the galvano mirror 711 and further by the galvano mirror 712, and then on the glass 1 placed on the mold 3. It is supposed to be irradiated.

By swinging the Galvano mirrors 711 and/or 712 based on a predetermined condition, the scanning of the glass 1 by the CO ₂ laser beam LB1 and the mid-infrared laser LB2 can be performed simultaneously and at the same position. ing.

In this case, the CO ₂ laser beam LB1 selectively heats the surface of the glass 1, and the mid-infrared laser LB2 heats the range from the surface of the glass 1 to the inside. By appropriately adjusting the irradiation intensity of the both, it becomes possible to heat the glass 1 while controlling the distribution of the heat input amount in the thickness direction when bending the glass 1.

Alternatively, it is also possible to selectively use only one of the CO ₂ laser beam LB1 and the mid-infrared laser LB2. Further, depending on the location of the glass 1, it may be possible to selectively use one of the CO ₂ laser beam LB1 and the mid-infrared laser beam LB2 and the irradiation of the superimposed light of both.

In addition, in the processing device 800, the visible light laser light LB3 emitted from the third light source 703 is further superimposed on the CO ₂ laser light LB1 and the mid-infrared laser light LB2, and the two are processed at the processing positions. It is also possible to irradiate the visible light laser beam LB3. Thereby, the processing position can be easily visually recognized.

(Eighth configuration example)
FIG. 12 is a diagram schematically showing a processing device 800 according to the eighth configuration example. The processing device 800 is similar to the processing device 700 in that it is configured to be able to perform heating of the inside of the glass 1 by a mid-infrared laser and heating of the surface of the glass 1 by a CO ₂ laser. The processing device 700 is different from the processing device 700 in that it can be implemented independently.

Specifically, in the processing device 800, as in the processing device 700, the first light source 801 that emits the CO ₂ laser LB1 and the second light source 802 that emits the mid-infrared laser LB2 are the base 800b. It is arranged in. The processing device 800 further includes a heater 821 for heating the mold 3, and a controller 800c for controlling the operation of each part of the device.

The beam diameter of the CO ₂ laser light LB1 emitted from the first light source 801 is adjusted by a beam expander 861 provided in the middle of the optical path. A beam expander 862, a focus moving lens 851 provided with a lens moving mechanism 851m, and a condenser lens 852 are provided in the optical path of the mid-infrared laser beam LB2 emitted from the second light source 802. In this order, the beam diameter of the mid-infrared laser beam LB2 using the beam expander 862 can be adjusted and the position of the focus F using the focus moving lens 851 and the condenser lens 852 can be controlled. ing.

However, the CO ₂ laser light LB1 whose beam diameter is adjusted by the beam expander 861, the beam diameter adjustment using the beam expander 862, and the position control of the focus F using the point moving lens 851 and the condenser lens 852. The mid-infrared laser beam LB2 that has been subjected to the above is subject to scanning by the galvano scanner without being superposed by the dichroic mirror.

Specifically, the processing apparatus 800 is provided with a galvano scanner 810A for performing scanning with the CO ₂ laser beam LB1 and a galvano scanner 810B for performing scanning with the mid-infrared laser beam LB2. The former is composed of two Galvano mirrors 811 and 812, and the latter is composed of two Galvano mirrors 813 and 814. The Galvano mirrors 811 and 812 are provided so as to be swingable about two mutually different orthogonal directions as swing axes. Similarly, the Galvano mirrors 813 and 814 are also swingably provided with two mutually different orthogonal directions as the swing axes.

In FIG. 12, the optical path of the CO ₂ laser light LB1 from the beam expander 861 to the galvano mirror 811 is bent by the mirrors 831 and 832, and the mid-infrared laser light LB2 from the beam expander 862 to the galvano mirror 811 is changed. Although the optical path is bent by the mirrors 833 and 834, these are both due to the arrangement of the components in FIG. 12, and are not essential aspects.

In the case shown in FIG. 12, the first light source 801 is provided so as to emit the CO ₂ laser light LB1 in a certain direction within the horizontal plane, and the galvano mirror 811 has Δθ1 around the swing axis along the vertical direction. The galvano mirror 812 is swingably provided within an angle range of Δθ2 around the swing axis along a certain direction in the horizontal plane. Then, by swinging the galvano mirrors 811 and/or 812 based on a predetermined condition while the CO ₂ laser beam LB1 is emitted from the first light source 801, the CO ₂ laser beam LB1 is applied to the glass 1. Scanning can be performed in the horizontal plane.

Similarly, the second light source 802 is provided so as to emit the mid-infrared laser beam LB2 in a certain direction within the horizontal plane, and the galvano mirror 813 is within an angle range of Δθ3 about the swing axis along the vertical direction. The galvano mirror 814 is swingably provided within an angle range of Δθ4 around the swing axis along a certain direction in the horizontal plane. Then, while the mid-infrared laser beam LB2 is emitted from the second light source 802, the galvano mirrors 813 and/or 814 are swung based on a predetermined condition, so that the glass 1 is subjected to the mid-infrared laser beam LB2. The scanning can be performed in a horizontal plane by

When the swings by the galvano scanner 810A and the galvano scanner 810B are synchronized, the scanning of the glass 1 by the CO ₂ laser beam LB1 and the mid-infrared laser LB2 can be performed simultaneously and at the same position, as in the processing device 700. .. On the other hand, it is also possible to intentionally make the irradiation positions of the both different and perform the processing in parallel at different positions.

According to the processing device 800, it is possible to bend the glass 1 with a high degree of freedom in processing position and processing conditions.

<Modification>
FIG. 13 is a diagram for explaining a modified example in which a galvano scanner is used for scanning laser light in bending. As described above, in the actual processing apparatus, basically two galvano mirrors are provided for biaxial scanning, but in FIG. 13, for simplicity of explanation, it is assumed that there is only one galvano mirror Mg. The case of the second processing mode is taken as an example.

In this case, as the glass 1 bends as the bending process progresses, the incident angle α of the laser light LB at the peripheral portion 1s of the glass 1 increases as shown in FIG. Therefore, the loss due to reflection increases, and the distance d1 from the galvano-mirror Mg to the peripheral portion 1s becomes longer than the distance d0 from the galvano-mirror Mg to the center position 1c. In that case, it may become impossible to process.

As a countermeasure for avoiding such a problem, as shown by an arrow AR3 in FIG. 13B, the mold 3 is tilted as the scanning position of the laser beam LB approaches the peripheral portion 1s of the glass 1, and the glass 1 is tilted. It is possible to reduce the incident angle α of the laser light LB. However, in an actual processing device, it is necessary to perform such inclination in at least two axial directions, and the mechanism for realizing this is complicated. In addition, there is concern that the processing time will increase.

Therefore, as another measure, as shown in FIG. 13C, the auxiliary mirror Ma arranged on the side of the mold 3 so that the reflecting surface along the vertical plane faces the mold 3 causes the galvanometer to move. It is possible to reflect the laser light LB reaching from the mirror Mg and then irradiate the glass 1 on the mold 3 with the laser light LB. In such a case, the incident angle α of the laser light LB with respect to the glass 1 can be made approximately 0° by appropriately controlling the swinging state of the galvanometer mirror Mg.

Note that in FIG. 13C, the auxiliary mirror Ma is shown only on the right side of the mold 3 for simplicity of illustration, but in reality, at least the mold 3 is responded to by scanning in the biaxial directions. Auxiliary mirrors Ma will be provided on all four sides. Depending on the scanning mode, the glass 1 may be irradiated with the laser beam LB after being reflected twice by the two auxiliary mirrors Ma.

1 glass 2 holding means 3 mold 100, 200, 300, 400, 500, 600, 700, 800 processing device 101, 201, 301, 401, 501, 601 (laser light LB) light source 110, 210, 410, 510 , 710, 810A, 810B Galvano Scanner 111, 112, 211, 212, 411, 412, 511, 512, 711, 712, 811 to 814, Mg Galvano Mirror 221, 521, 621, 721, 821 Heater 331, 631, 731 , 732, 831 to 834 Mirrors 341, 342, 441, 442, 642 Stages 551, 751, 851, Lm Focus moving lens 551m, 751m, 851m Lens moving mechanism 552, 752, 852, Lc Condensing lens 661, 761, 762, 861, 862 Beam expander 671 Aspherical cylindrical lens 781, 782 Dichroic mirror F Focus LB laser light LB1 CO ₂ laser light LB2 Mid-infrared laser light LB3 Visible light laser light LBL Line beam Ma Auxiliary mirror P Fold planned position RE Softening region

Claims (36)

A method of bending glass,
By irradiating a predetermined processing target portion of the glass with the first laser light absorbed inside the glass, and heating the processing target portion to a temperature equal to or higher than the softening point of the glass to form a softened region. Bending or bending the glass,
A method for bending glass, which is characterized in that The method for bending glass according to claim 1,
The processing target portion is defined in a linear shape,
When one side sandwiching the portion to be processed in the glass is a first portion and the other side is a second portion,
By irradiating the first laser light while scanning the portion to be processed, the glass is bent at the softened region, and the second portion has a predetermined length with respect to the first portion. Bend to make an angle,
A method for bending glass, which is characterized in that The method for bending glass according to claim 1,
In a state in which the glass is placed on a mold whose upper surface is a curved surface, the first laser light is included in a range including at least a part of a portion where the glass and the curved surface are separated from each other. The, while irradiating while scanning the glass while varying the amount of heat input according to the degree of separation between the glass and the curved surface, by forming the softened region along the curved surface in the glass, Bending the glass along the curved surface,
A method for bending glass, which is characterized in that A method for bending glass according to any one of claims 1 to 3, comprising:
The scanning of the first laser light is performed by a galvano scanner arranged in the optical path of the first laser light.
A method for bending glass, which is characterized in that A method for bending glass according to any one of claims 1 to 3, comprising:
The scanning of the first laser light is performed by moving the stage on which the glass is arranged,
A method for bending glass, which is characterized in that A method for bending glass according to any one of claims 1 to 3, comprising:
The scanning of the first laser light is performed by a combination of a galvano scanner and movement of a stage on which the glass is arranged,
A method for bending glass, which is characterized in that A method for bending glass according to any one of claims 1 to 6, comprising:
A focus moving lens and a condenser lens are arranged in the optical path of the first laser light,
The focus moving lens is movable in the optical path in a direction from the light source of the first laser light toward the condenser lens,
By moving the focus moving lens according to the irradiation position of the first laser light on the glass, the focus of the first laser light is positioned on the surface of the glass regardless of the irradiation position.
A method for bending glass, which is characterized in that A method for bending glass according to any one of claims 1 to 7, comprising:
A beam expander is provided in the optical path of the first laser beam,
Changing the beam diameter of the first laser light according to the irradiation position on the glass by the beam expander,
A method for bending glass, which is characterized in that The method for bending glass according to claim 8,
The first laser light whose beam diameter has been adjusted by the beam expander is made incident on an aspherical cylindrical lens, whereby linear laser light emitted from the aspherical cylindrical lens is directed to the processing target portion of the glass. Irradiate,
A method for bending glass, which is characterized in that The method for bending glass according to any one of claims 1 to 9,
The first laser light is a mid-infrared laser light,
A method for bending glass, which is characterized in that A method for bending glass according to any one of claims 1 to 10, comprising:
Irradiating the glass with a second laser light that is absorbed on the surface of the glass but does not pass through the inside of the glass, simultaneously with the irradiation of the first laser light.
A method for bending glass, which is characterized in that The method for bending glass according to claim 11,
Aligning the irradiation position of the second laser light with the irradiation position of the first laser light;
A method for bending glass, which is characterized in that The method for bending glass according to claim 12,
Irradiating the glass after synthesizing the second laser light with the first laser light,
A method for bending glass, which is characterized in that The method for bending glass according to claim 13,
The third laser light which is visible light is further combined with the first laser light and the second laser light, and then the glass is irradiated with the third laser light.
A method for bending glass, which is characterized in that The method for bending glass according to any one of claims 11 to 14,
The second laser light is CO ₂ laser light,
A method for bending glass, which is characterized in that The method for bending glass according to claim 1 or 2, wherein
Before irradiating the first laser light, at least the portion to be processed of the glass is preheated,
A method for bending glass, which is characterized in that The method for bending glass according to claim 3,
In a state where the glass is heated by heating the mold, the glass is irradiated with the first laser light,
A method for bending glass, which is characterized in that A method for bending glass according to claim 5 or 6, wherein
In a state where the glass is heated by heating the stage, the glass is irradiated with the first laser light,
A method for bending glass, which is characterized in that A processing device for bending glass,
A first light source that emits a first laser beam that is absorbed inside the glass;
A placement location where the glass is placed,
A first optical system for irradiating the glass with the first laser light emitted from the first light source;
Control means for controlling the operation of each part of the processing device;
Equipped with
Bending the glass by irradiating a predetermined processing target portion of the glass with the first laser light and heating the processing target portion to a temperature equal to or higher than the softening point of the glass to form a softened region. Or bend,
A processing device characterized by the above. The processing apparatus according to claim 19, wherein
Scanning means for scanning the glass with the first laser light applied to the glass,
Further equipped with,
The processing target portion is defined in a linear shape,
When one side sandwiching the portion to be processed in the glass is a first portion and the other side is a second portion,
The glass is bent at the softened region by irradiating the first laser light while scanning the portion to be processed by the scanning means, and the second portion becomes the first portion. Bend to make a predetermined angle with
A processing device characterized by the above. The processing apparatus according to claim 19, wherein
Scanning means for scanning the glass with the first laser light applied to the glass;
A mold whose upper surface is a curved surface,
Further equipped with,
In a state in which the glass is placed on the curved surface of the mold, the first laser light is applied in a range including at least a part of a portion where the glass and the curved surface are separated from each other. By irradiating while scanning the glass by the scanning means while varying the heat input amount according to the degree of separation between the glass and the curved surface, by forming the softened region along the curved surface in the glass , Bending the glass along the curved surface,
A processing device characterized by the above. The processing device according to claim 20 or claim 21,
The first optical system includes a galvano scanner arranged in the optical path of the first laser beam,
The galvano scanner constitutes the scanning means,
A processing device characterized by the above. The processing device according to claim 20 or claim 21,
A stage on which the glass is placed,
Further equipped with,
The scanning unit is realized by moving the stage while the glass is placed on the stage and the glass is irradiated with the first laser light.
A processing device characterized by the above. The processing device according to claim 20 or claim 21,
The first optical system includes a galvano scanner arranged in the optical path of the first laser beam,
Further comprising a stage on which the glass is placed,
The scanning means is a combination of the galvano scanner and movement of a stage on which the glass is arranged when the first laser light is irradiated.
A processing device characterized by the above. The processing apparatus according to any one of claims 19 to 24,
The first optical system further includes a focus moving lens arranged in the optical path of the first laser light, and a condenser lens,
The focus moving lens is provided so as to be movable back and forth in a direction from the light source of the first laser light toward the condenser lens in the optical path,
By moving the focus moving lens according to the irradiation position of the first laser light on the glass, the focus of the first laser light is positioned on the surface of the glass regardless of the irradiation position.
A processing device characterized by the above. The processing apparatus according to any one of claims 19 to 25,
The first optical system further includes a beam expander arranged in the optical path of the first laser light,
The beam expander changes the beam diameter of the first laser light according to the irradiation position on the glass,
A processing device characterized by the above. The processing device according to claim 26,
The first optical system further includes an aspherical cylindrical lens in the optical path of the first laser light,
The aspherical cylindrical lens converts the first laser light, which is incident after the beam diameter is adjusted by the beam expander, into linear laser light and emits the laser light.
Irradiate the portion to be processed of the glass,
A processing device characterized by the above. The processing apparatus according to any one of claims 19 to 27,
The first laser light is a mid-infrared laser light,
A processing device characterized by the above. The processing apparatus according to any one of claims 19 to 28,
A second light source that emits a second laser beam that is absorbed on the surface of the glass but does not pass through the inside of the glass;
A second optical system for irradiating the glass with the second laser light emitted from the second light source;
Further equipped with,
Irradiating the glass with the second laser light at the same time as irradiating the first laser light,
A processing device characterized by the above. The processing device according to claim 29,
Aligning the irradiation position of the second laser light with the irradiation position of the first laser light;
A processing device characterized by the above. The processing apparatus according to claim 30, wherein
Irradiating the glass after synthesizing the second laser light with the first laser light,
A processing device characterized by the above. The processing device according to any one of claims 29 to 31, wherein:
A third light source that emits a third laser beam that is visible light,
Further equipped with,
Irradiating the glass after further combining the third laser light with the first laser light and the second laser light,
A processing device characterized by the above. The processing apparatus according to any one of claims 29 to 32,
The second laser light is CO ₂ laser light,
A processing device characterized by the above. The processing device according to claim 19 or 20, wherein
Glass heating means for heating the glass,
Further equipped with,
Before irradiating the first laser light, at least the portion to be processed of the glass is preheated by the glass heating means,
A processing device characterized by the above. The processing device according to claim 21,
Mold heating means for heating the mold,
Further equipped with,
In a state where the glass is heated by heating the mold by the mold heating means, the glass is irradiated with the first laser light,
A processing device characterized by the above. The processing apparatus according to claim 23 or 24,
Stage heating means for heating the stage,
Further equipped with,
In a state where the glass is heated by heating the stage by the stage heating means, the glass is irradiated with the first laser light,
A processing device characterized by the above.

Images