JP2020010003A - Component mounting apparatus - Google Patents

Abstract

To suppress a reduction in production efficiency caused by switching of imaging conditions.SOLUTION: The component mounting apparatus includes: a rotary head 20 having a plurality of suction nozzles 22 for sucking components; and image pickup devices 37, 39 for imaging the components sucked by the suction nozzles. The plurality of suction nozzles is arranged at intervals in the circumferential direction on a first circumference and is movable on the first circumference. The imaging apparatus is capable of imaging components sucked by the suction nozzles under a plurality of different imaging conditions at a plurality of imaging positions B1, B2 provided on the first circumference.SELECTED DRAWING: Figure 3

Description

  The technology disclosed in this specification relates to a component mounting apparatus.

  Patent Literature 1 discloses a component mounting apparatus. The component mounting apparatus includes a rotary head having a plurality of suction nozzles for sucking a component, and an imaging device for imaging the component sucked by the suction nozzle.

JP 2017-73474 A

  In the component mounting apparatus, some of the components sucked by the suction nozzle perform a plurality of images under different imaging conditions. In the component mounting apparatus of Patent Literature 1, in order to perform a plurality of imagings while changing the imaging conditions, a time for switching the imaging conditions is required. That is, when imaging a component under the first imaging condition and the second imaging condition, first, the component is imaged under the first imaging condition, and then the imaging condition is changed from the first imaging condition to the second imaging condition. After that, the component must be imaged under the second imaging condition. In the component mounting apparatus of Patent Literature 1, since the driving of the component mounting apparatus must be stopped while the imaging condition is changed, production efficiency may be reduced. This specification provides a technique for suppressing a decrease in production efficiency caused by switching of imaging conditions.

  The present specification discloses a component mounting apparatus that mounts components on a board. The component mounting apparatus includes a rotary head having a plurality of suction nozzles for sucking a component, and an imaging device for imaging the component sucked by the suction nozzle. The plurality of suction nozzles are arranged at intervals in the circumferential direction on the first circumference and are movable on the first circumference. The imaging device is capable of imaging the component sucked by the suction nozzle under a plurality of different imaging conditions at a plurality of imaging positions provided on the first circumference.

  In the above component mounting apparatus, since a plurality of imaging positions are provided on the first circumference, different imaging conditions can be set for each of the plurality of imaging positions. For this reason, just by moving the suction nozzle to a plurality of imaging positions, it is possible to image the component sucked by the suction nozzle under a plurality of imaging conditions. Since it is not necessary to switch the imaging conditions at each imaging position, it is possible to suppress a decrease in production efficiency caused by the switching of the imaging conditions.

FIG. 1 is a schematic diagram illustrating a configuration of a component mounter 10 according to an embodiment. FIG. 2 is a side view schematically showing the rotary head 20 of the component mounter 10. FIG. 3 is a bottom view schematically showing the rotary head 20. 5 is a flowchart illustrating a mounting procedure of the component mounter 10; The schematic diagram of the lower surface of the rotary head 20 concerning a modification.

  In an embodiment of the present technology, the plurality of imaging positions may include a first imaging position and a second imaging position different from the first imaging position. In addition, the imaging device may include a first camera that images the component at the first imaging position and a second camera that images the component at the second imaging position. In this case, the imaging condition at the first imaging position may be the imaging condition of the first camera, and the imaging condition at the second imaging position may be the imaging condition of the second camera. The imaging condition of the first camera may be different from the imaging condition of the second camera. By equipping the first camera and the second camera, different imaging conditions can be set for the first camera and the second camera.

  In an embodiment of the present technology, the plurality of imaging positions may include a first imaging position and a second imaging position different from the first imaging position. The imaging device may include a first illuminator that illuminates the component at the first imaging position, and a second illuminator that illuminates the component at the second imaging position. The imaging condition at the first imaging position may be an illumination condition by the first illuminator, and the imaging condition at the second imaging position may be an illumination condition by the second illuminator. The illumination condition by the first illuminator may be different from the illumination condition by the second illuminator. By equipping the first illuminator and the second illuminator, the component can be illuminated under two illumination conditions without changing the illumination conditions of each illuminator.

  In one embodiment of the present technology, when the component sucked by the suction nozzle is positioned at the first imaging position, the first camera takes an image of the component, and the component sucked by the suction nozzle is moved to the second imaging position. May be further provided with a control device that causes the second camera to image the component when positioned at the imaging position.

  With reference to the drawings, a component mounter 10 according to an embodiment will be described. The component mounter 10 according to the present embodiment is an example of a component mounting apparatus according to the technology disclosed in this specification, and is an apparatus that mounts a component 12 on a board 14. The component 12 is configured by a method such as a BGA (Ball Grid Array) or a CSP (Chip Scale Package). As shown in FIG. 2, the component 12 includes, for example, a plurality of convex electrodes (bumps, pillars, etc.) 12 b (only one is shown in the drawing) on a mounting surface (lower surface) 12 a on the substrate 14. A planar mark (not shown) for indicating the direction of the electrodes 12b (that is, the direction of the component 12 when mounted on the substrate 14) is provided. When mounting the component 12 on the board 14, it is necessary to accurately detect the position and direction of the electrode 12 b of the component 12 with respect to the board 14, and position and mount the component 12 with respect to the board 14 based on the detection result. is there. For this reason, in the present embodiment, the same component 12 is imaged under a plurality of imaging conditions, and the position and direction of the component 12 with respect to the substrate 14 are adjusted.

  The component mounter 10 is also called a surface mounter or a chip mounter. Normally, the component mounter 10 is provided together with a solder printing machine, another component mounter, and a board inspection machine, and forms a series of mounting lines. As shown in FIG. 1, the component mounter 10 of the present embodiment includes a rotary head 20, a first imaging device 37 and a second imaging device 39 (imaging device unit 30), a moving device 40, and a control device. 50, a plurality of component feeders 62, and a substrate transport device 64.

  Each of the plurality of component feeders 62 accommodates a plurality of components 12. The component feeder 62 supplies the component 12 to the rotary head 20.

  The moving device 40 is a device that moves the rotary head 20 with respect to the substrate 14, and is driven by the control device 50. The moving device 40 includes an xy robot mechanism that drives the rotary head 20 in the xy directions. The moving device 40 includes a guide rail for guiding the rotary head 20, a moving mechanism for moving the rotary head 20 along the guide rail, a motor for driving the moving mechanism, and the like. By moving the rotary head 20 by the moving device 40, the rotary head 20 can move between a position where the component 12 is supplied by the component feeder 62 and the substrate 14 on which the component 12 is mounted. Here, the x direction and the y direction of the “xy direction” are substantially orthogonal to each other (see FIGS. 2 and 3).

  The substrate transfer device 64 is a device that carries the substrate 14 into the component mounter 10, positions the substrate 14 with the component mounter 10, and carries out the substrate 14 from the component mounter 10. The substrate transfer device 64 of this embodiment includes, for example, a pair of belt conveyors (not shown), a support device (not shown) that is attached to the belt conveyor and supports the substrate 14 from below, and a driving device that drives the belt conveyor. Can be configured. The substrate 14 is positioned at a mounting position in the component mounter 10, and when the component 12 is mounted at the mounting position, the substrate 14 is transported out of the component mounter 10 from the mounting position.

  As shown in FIGS. 2 and 3, the rotary head 20 includes a base 27, a rotating unit 26, a plurality of nozzle holders 24, and a plurality of suction nozzles 22. The base 27 is attached to the moving device 40, and is movable in the xy directions by the moving device 40. The rotation unit 26 is rotatably attached to the base 27. The rotating part 26 protrudes below the lower surface of the base 27. The rotation unit 26 rotates around the axis R with respect to the base 27 by an actuator (not shown).

  The plurality of nozzle holders 24 are attached to the rotating unit 26. More specifically, the plurality of nozzle holders 24 are provided at equal intervals in the circumferential direction on a lower surface of the rotating portion 26 and on a circumference C (an example of a first circumference) having a certain distance from the axis R. Are located. As described above, since the rotating unit 26 can rotate around the axis R with respect to the base 27, when the rotating unit 26 rotates around the axis R, the plurality of nozzle holders 24 increase the distance between the adjacent nozzle holders 24. It moves on the circumference C while maintaining it. Each of the plurality of nozzle holders 24 is configured to be movable in the z-direction (vertical direction) by an actuator (not shown) accommodated in the rotary head 20. The suction nozzle 22 is detachably held by each of the plurality of nozzle holders 24. The suction nozzle 22 is a nozzle that suctions the component 12. Since the nozzle holder 24 can move on the circumference C, the suction nozzle 22 can also move on the circumference C. On the circumference C, a suction position A1 is set, and a first imaging position B1 and a second imaging position B2 are set. The component 12 can be sucked by the suction nozzle 22 when the suction nozzle 22 is positioned at the suction position A1. Further, when the suction nozzle 22 is positioned at the first imaging position B1 and the second imaging position B2, it is possible to image the component 12 sucked by the suction nozzle 22.

  As is clear from the above description, by moving the base 27 in the xy directions, the suction nozzle 22 held by the nozzle holder 24 can be moved in the xy directions. The nozzle holder 24 moves on the circumference C by rotating around, and further moves in the z direction by moving the nozzle holder 24 in the z direction. Therefore, by moving the suction nozzle 22 in various directions, the component 12 can be sucked by the suction nozzle 22, and the component 12 sucked by the suction nozzle 22 can be mounted on the board 14. Therefore, in order to mount the component 12 on the substrate 14 by the rotary head 20, first, the suction nozzle 22 is positioned in the xy directions with respect to the component 12 supplied from the component feeder 62, and the suction surface (lower surface) of the suction nozzle 22 is The suction nozzle 22 is moved downward until the contact is made. When the suction surface of the suction nozzle 22 contacts the component 12, the component 12 is suctioned by the suction nozzle 22, and the suction nozzle 22 is moved upward. Next, the component 12 sucked by the suction nozzle 22 is positioned with respect to the substrate 14 by the moving device 40. At this time, the position and orientation of the component 12 in the xy direction are adjusted so that the plurality of electrodes 12b of the component 12 are positioned at predetermined positions on the substrate 14. Next, the component 12 is mounted on the board 14 by moving the suction nozzle 22 downward until the component 12 contacts the board 14. In FIG. 3, the component 12 sucked by the suction nozzle 22 is not shown.

  The imaging device unit 30 includes a first imaging device 37 and a second imaging device 39, and the imaging devices 37 and 39 are attached to the base 27 of the rotary head 20 (see FIG. 2). The imaging devices 37 and 39 are devices that image the component 12 sucked by the suction nozzle 22, and image the mounting surface (lower surface) 12a of the component 12. Since the imaging devices 37 and 39 are attached to the base 27 of the rotary head 20, even if the rotating unit 26 rotates, the imaging devices 37 and 39 do not rotate. Therefore, the positions where the imaging devices 37 and 39 capture images are fixed, and when the suction nozzle 22 is positioned at a predetermined imaging position, the component 12 sucked by the suction nozzle 22 is imaged. Specifically, when the suction nozzle 22 is positioned at the first imaging position B1, the component 12 sucked by the suction nozzle 22 is imaged by the first imaging device 37. When the suction nozzle 22 is positioned at the second imaging position B2, the component 12 sucked by the suction nozzle 22 is imaged by the second imaging device 39. The first imaging position B1 and the second imaging position B2 are provided at different positions on the circumference C, and the illumination by the first imaging device 37 and the illumination by the second imaging device 39 are mutually different. They are placed so far apart that they do not interfere.

  The first imaging device 37 includes a first component camera 32, a first illuminator 36, and a first reflector unit 33. The first component camera 32 uses the first illuminator 36 and the first reflector unit 33 to image the component 12 under the first imaging condition. More specifically, the first illuminator 36 is configured to irradiate the light to the mounting surface 12a of the component 12 from obliquely below (side-lighting) via the first reflector unit 33. I have. That is, the first illuminator 36 emits light in which the angle between the mounting surface 12a and the optical axis of the first illuminator 36 is an acute angle (an angle smaller than 90 °). The first reflecting mirror unit 33 is constituted by, for example, a pair of reflecting mirrors, and is arranged on the optical axis of the first component camera 32. The first component camera 32 captures an image of the mounting surface 12a of the component 12 illuminated by the first illuminator 36 via the first reflector unit 33 (see FIG. 2).

  Similarly, the second imaging device 39 includes a second component camera 34, a second illuminator 38, and a second reflector unit (not shown). The second component camera 34 uses the second illuminator 38 and the second reflector unit to image the component 12 under the second imaging condition. Specifically, the second illuminator 38 is configured to irradiate the entire mounting surface 12a of the component 12 with light in the vertical direction via the second reflector unit. That is, the second illuminator 38 irradiates the entire mounting surface 12a with parallel light, and the incident angle of the parallel light on the mounting surface 12a is 90 °. The second reflector unit has a configuration similar to that of the first reflector unit 33. Therefore, the second component camera 34 captures an image of the mounting surface 12a of the component 12 illuminated by the second illuminator 38 via the second reflector unit. Here, the first component camera 32 and the second component camera 34 are examples of the first camera and the second camera in the technology disclosed in this specification.

  Under the (first) imaging condition of the first imaging device 37 described above, light is emitted obliquely to the mounting surface 12a of the component 12. Therefore, in the captured image obtained by the first component camera 32, the (irregular) structure of the electrode 12b provided on the mounting surface 12a of the component 12 can be easily recognized. For this reason, when mounting the component 12 on the board 14, it is easy to position the electrode 12b of the component 12 at a desired position. Under the (second) imaging condition of the second imaging device 39 described above, the entire mounting surface 12a of the component 12 is irradiated with light from the vertical direction. Therefore, in a captured image obtained by the second component camera 34, a mark (on a plane) indicating the direction of the electrode 12b provided on the mounting surface 12a of the component 12 is easily recognized. Therefore, when mounting the component 12 on the board 14, the direction of the component 12 with respect to the board 14 is easily determined.

  As described above, the component mounter 10 according to the present embodiment sucks the suction nozzle 22 at the first imaging position B1 and the second imaging position B2 under different conditions such as the first imaging condition and the second imaging condition. It is possible to capture an image of the component 12 that has been set. That is, by moving the suction nozzle 22 on the circumference C, it is possible to move to a plurality of imaging positions B1 and B2. For this reason, by setting different imaging conditions for each imaging position as in the present embodiment, it is not necessary to switch the imaging conditions of the imaging device unit 30, and the component 12 sucked to the suction nozzle 22 can be changed under different imaging conditions. Images can be taken. Therefore, it is possible to suppress a decrease in the production efficiency caused by the switching of the imaging condition.

  The control device 50 is configured using a computer having a CPU, a ROM, and a RAM. As shown in FIG. 1, the rotary head 20, the moving device 40, the imaging device unit 30, the component feeder 62, and the substrate transport device 64 are communicably connected to the control device 50. The control device 50 drives the connected devices 20, 30, 40, 62, and 64 by executing a program installed in advance. That is, the control device 50 drives the moving device 40 to move the rotary head 20, and further moves the suction nozzle 22 in the z direction when the suction nozzle 22 of the rotary head 20 is positioned at the suction position A1. Thereby, the component 12 is sucked. The control device 50 mounts the component 12 on the board 14 by moving the suction nozzle 22 in the z direction when the sucked component 12 is positioned at a mounting position (not shown). Further, the control device 50 causes the first component camera 32 to take an image when the component 12 sucked by the suction nozzle 22 is positioned at the first imaging position B1, and positions the component 12 at the second imaging position B2. Then, the second component camera 34 takes an image.

  With reference to FIG. 4, a procedure for mounting the component 12 on the board 14 using the component mounter 10 will be described. First, in step S12, the component mounter 10 suctions the component 12 to the suction nozzle 22. Specifically, the control device 50 drives the moving device 40 to move the rotary head 20 to a position where the rotary head 20 sucks the component 12 (the component feeder 62). The control device 50 drives the rotation moving mechanism (actuator) of the rotary head 20 to rotate the rotating unit 26, and positions the suction nozzle 22 at the suction position A1. Next, the control device 50 drives the z-axis movement mechanism (actuator) of the rotary head 20, moves the suction nozzle 22 positioned at the suction position A1 downward from the reference height, and moves the suction nozzle 22 to the tip (adsorption surface). ) Is picked up by the component 12. After the suction of the component 12, the suction nozzle 22 moves upward again and returns to the reference height.

  Next, in step S14, the first imaging device 37 images the component 12 at the first imaging position B1 under the first imaging condition (see FIG. 3). Specifically, the control device 50 drives the rotation moving mechanism of the rotary head 20 to rotate the rotating unit 26, and positions the component 12 sucked by the suction nozzle 22 at the first imaging position B1. Next, the control device 50 drives the first imaging device 37 to image the mounting surface 12a of the component 12 positioned at the first imaging position B1. At this time, the first illuminator 36 irradiates the mounting surface 12a of the component 12 with light obliquely. Note that the first imaging device 37 is fixed to the base 27 of the rotary head 20 and is not affected by rotation of the rotating unit 26 of the rotary head 20 or the like. For this reason, while performing the imaging process in step S14, the rotary head 20 can suck another component 12 using the other suction nozzle 22 positioned at the suction position A1.

  Next, in step S16, the second imaging device 39 images the component 12 at the second imaging position B2 under the second imaging condition (see FIG. 3). Specifically, the control device 50 drives the rotation moving mechanism of the rotary head 20 to rotate the rotating unit 26, and positions the component 12 sucked by the suction nozzle 22 at the second imaging position B2. Next, the control device 50 drives the second imaging device 39 to image the mounting surface 12a of the component 12 positioned at the second imaging position B2. At this time, the second illuminator 38 irradiates the entire mounting surface 12a of the component 12 with light in the vertical direction. In the present embodiment, the first imaging device 37 and the second imaging device 39 can shoot simultaneously without their illumination light interfering with each other. For this reason, while performing the imaging process of step S16, the first imaging device 37 can image the mounting surface 12a of the component 12 positioned at the first imaging position B1. 20 can suction another component 12 using another suction nozzle 22 positioned at the suction position A1.

  Next, in step S18, a positioning process for determining the position and direction of the component 12 is executed. Specifically, the control device 50 performs image processing of the captured images under two different illumination conditions obtained from the first imaging position B1 and the second imaging position B2, and specifies the position of the electrode 12b of the component 12. At the same time, the direction of the component 12 with respect to the suction nozzle 22 is specified. Then, based on the specified position of the electrode 12b and the direction of the component 12, the position and direction in which the suction nozzle 22 (component 12) is positioned with respect to the substrate 14 are determined. The control device 50 drives the rotational movement mechanism of the rotary head 20 based on the determined positioning direction, and adjusts the mounting direction of the component 12 with respect to the board 14.

  Next, in step S20, the component 12 is mounted on the board 14. Specifically, the control device 50 drives the moving device 40 to adjust the rotary head 20 in the xy directions based on the positioning position determined by the positioning process in step S18, and Adjust the position. After the positioning, the control device 50 drives the z-axis moving mechanism of the rotary head 20, moves the suction nozzle 22 downward, and mounts the component 12 on the board 14.

  Through the series of steps described above, the mounting of the component 12 on the substrate 14 using the component mounter 10 is completed. Therefore, even when imaging is performed under a plurality of imaging conditions in one component 12, the time required to switch the imaging conditions is not required. That is, it is possible to suppress a decrease in the production efficiency caused by the switching of the imaging condition.

  In the mounting procedure of the above-described embodiment, one component 12 has been described. However, the component 12 can be mounted on the substrate 14 by using a plurality of other suction nozzles 22 at the same time and in the same steps.

  The direction (rotation angle) adjustment of the component 12 in step S18 is performed before the (xy) position adjustment of the component 12 in step S20, but is not limited to this order, and the (xy) position adjustment of the component 12 is not limited to this order. Later, the direction (rotation angle) of the component 12 may be adjusted. Alternatively, both may be performed simultaneously. Here, the “rotation angle” is an angle of rotation about an axis substantially perpendicular to an xy plane (a substantially horizontal plane including the above-described x direction and y direction) as a rotation axis.

  Further, in the above-described embodiment, the imaging condition to be changed is the illumination angle of illumination. However, the present invention is not limited to such an example, and can be applied to the case where various imaging conditions are changed. As a modification, the light source colors of the first imaging device 137 and the second imaging device 139 may be different. This is because, depending on the type of the component 12 used in the component mounter 10, by changing the color of the light source, the structure (bump, pillar, etc.) for positioning the component 12 can be more clearly recognized.

  For example, as shown in FIG. 5, the first imaging device 137 includes a first component camera 132, a first illuminator 136, and a reflector unit (not shown). It is configured to irradiate red light to the 12 mounting surfaces 12a. The first component camera 132 captures an image of the mounting surface 12a of the component 12 illuminated in red by the first illuminator 136. The second imaging device 139 includes a second component camera 134, a second illuminator 138, and a reflecting mirror unit (not shown). The second illuminator 138 is attached to the mounting surface 12a of the component 12. , For example, to emit blue light. The second component camera 134 captures an image of the mounting surface 12a of the component 12 illuminated in blue by the second illuminator 138. Note that the first illuminator 136 and the second illuminator 138 can be configured to emit light of a specific color (red and blue light) by using a filter that cuts a specific wavelength. .

  According to the above configuration, the same component 12 is illuminated with two lights, red and blue, without switching the imaging device. Therefore, even if the optimal light source color in the component 12 to be imaged is not clear beforehand, it is possible to acquire an image with a plurality of light source colors and select an appropriate image later. That is, there is no need to set the imaging conditions in advance. In this case, the control device 50 clarifies the detailed form of the component necessary for positioning the component 12 from among the plurality of captured images (for example, the end of the electrode 12b of the component 12 is sharp. ) May be provided.

  This modification is advantageous even when a plurality of components 12 are sucked by the same rotary head 20. In this case, the component 12 can be imaged under appropriate imaging conditions by changing the imaging position for each component in accordance with previously registered component data without switching imaging conditions.

  The imaging conditions to be changed are not limited to illumination conditions such as the illumination angle of the illumination or the color of the light source, and the resolution of the camera may be different. According to such a configuration, the imaging of the parts 12 having different dimensions can be performed by the same rotary head 20.

  In the above-described embodiment, the imaging devices 37 and 39 are attached to the base 27 of the rotary head 20. However, the present invention is not limited to such an example, and the imaging devices 37 and 39 may be attached to the main body of the component mounter 10. Also in this case, the same effect as that of the present embodiment can be obtained.

  In the imaging device unit 30 of the present embodiment, two imaging devices 37 and 39 are illustrated, but the number is not limited, and one or three or more imaging devices may be provided. However, when a plurality of images are taken by one imaging device, the imaging device may be configured to be able to illuminate a plurality of imaging positions by adjusting the angle of the reflecting mirror. According to such a configuration, it is necessary to adjust the angle of the reflecting mirror to switch the imaging conditions, but the number of imaging devices can be reduced, which is advantageous in terms of installation space and cost.

  As described above, some specific examples have been described in detail. However, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and alterations of the specific examples illustrated above. The technical elements described in the present specification or the drawings exert technical utility singly or in various combinations.

10: Component mounting machine 12: Component 12a: Component mounting surface 12b: Electrode 14: Substrate 20: Rotary head 22: Suction nozzle 24: Nozzle holder 26: Rotating unit 27: Base 30: Imaging device unit 32, 132: First Component camera 33: first reflector unit 34, 134: second component camera 36, 136: first illuminator 37, 137: first imaging device 38, 138: second illuminator 39, 139 : Second imaging device 40: moving device 50: control device 62: component feeder 64: substrate transfer device A1: suction position B1: first imaging position B2: second imaging position

Claims (4)

A component mounting apparatus 10 for mounting a component 12 on a substrate 14,
A rotary head 20 having a plurality of suction nozzles 22 for sucking the component 12,
An imaging device 30 for imaging the component 12 sucked by the suction nozzle 22;
The plurality of suction nozzles 22 are arranged on the first circumference C at intervals in the circumferential direction, and are movable on the first circumference C.
The imaging device 30 can image the component 12 sucked by the suction nozzle 22 under a plurality of different imaging conditions at a plurality of imaging positions provided on the first circumference C.
Component mounting apparatus 10. The plurality of imaging positions include a first imaging position B1 and a second imaging position B2 different from the first imaging position B1,
The imaging device 30 includes a first camera (32; 132) for imaging the component 12 at the first imaging position B1, and a second camera (34;) for imaging the component 12 at the second imaging position B2. 134), and
The imaging condition at the first imaging position B1 is an imaging condition of the first camera (32; 132),
The imaging condition at the second imaging position B2 is an imaging condition of the second camera (34; 134),
2. The component mounting apparatus 10 according to claim 1, wherein an imaging condition of the first camera (32; 132) is different from an imaging condition of the second camera (34; 134). 3. The plurality of imaging positions include a first imaging position B1 and a second imaging position B2 different from the first imaging position B1,
The imaging device 30 includes a first illuminator (36; 136) that illuminates the component 12 at the first imaging position B1 and a second illuminator (36) that illuminates the component 12 at the second imaging position B2. 38; 138)
The imaging condition at the first imaging position B1 is an illumination condition by the first illuminator (36; 136),
The imaging condition at the second imaging position B2 is an illumination condition by the second illuminator (38; 138),
3. The component mounting apparatus 10 according to claim 2, wherein an illumination condition by the first illuminator (36; 136) is different from an illumination condition by the second illuminator (38; 138).   When the component 12 sucked by the suction nozzle 22 is positioned at the first imaging position B1, the first camera (32; 132) captures an image of the component 12 and is sucked by the suction nozzle 22. The control device (50) for causing the second camera (34; 134) to image the component 12 when the component 12 is positioned at the second imaging position B2. 4. The component mounting apparatus 10 according to item 1.

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