JP2020096201A - Sheet sticking device and sticking method - Google Patents

Abstract

To provide a sheet sticking device and method of sticking a sheet that prevents a decrease in processing capacity per unit time.SOLUTION: A sheet sticking device 10 includes: support means 20 having adherent support means 21 for supporting an adherent WF; and unwanted sheet support means 22 located on an outside of the adherent support means 21; pressing means 40 for pressing and attaching an adhesive sheet AS to an adherend surface WF1 of the adherend WF supported by the adherend support means 21 and an unwanted sheet support surface 22A of the unwanted sheet support means 22; cutting means 50 for cutting the adhesive sheet AS attached to the adherend WF to a predetermined shape in order for an adhesive sheet portion to remain on the adherend WF; and recovery means 60 for peeling an unwanted sheet US other than the adhesive sheet portion in the adhesive sheet AS from the unwanted sheet support surface 22A. The support means 20 is provided to allow at least one of loading and unloading of the adherent WF into and out of the adherent support means 21 during the peeling of the unwanted sheet US from the unwanted sheet support surface 22A.SELECTED DRAWING: Figure 1

Description

The present invention relates to a sheet sticking device and a sticking method.

BACKGROUND ART Conventionally, there is known a sheet sticking device that sticks an adhesive sheet to an adherend and can cut the adhesive sheet into a predetermined shape (see, for example, Patent Document 1).

JP-A-2007-19239

The conventional sheet sticking apparatus as described in Patent Document 1 has an operation of carrying in an adherend to a supporting means for supporting the adherend and an operation of carrying out the adherend with the adhesive sheet stuck thereto from the supporting means. However, since the operation is performed separately from the operation of collecting the unnecessary sheet generated by cutting the adhesive sheet, the ability to attach the adhesive sheet to the adherend per unit time (hereinafter simply referred to as “processing ability”) is reduced. There is an inconvenience.

An object of the present invention is to provide a sheet sticking device and a sticking method capable of preventing a decrease in processing capacity per unit time.

The sheet sticking apparatus of the present invention includes a support means having an adherend support means for supporting an adherend and an unnecessary sheet support means located outside the adherend support means, and the support means supported by the adherend support means. A pressing means for pressing and adhering an adhesive sheet to the adherend surface of the adherend and the unnecessary sheet supporting surface of the unnecessary sheet supporting means, and to the adherend so that the adhesive sheet portion remains on the adherend. Cutting means for cutting the attached adhesive sheet into a predetermined shape; and collecting means for peeling unnecessary sheets other than the adhesive sheet portion of the adhesive sheet from the unnecessary sheet supporting surface, the supporting means comprising the collecting means. At least one of carrying in the adherend to the adherend supporting means and unloading the adherend from the adherend supporting means during peeling of the unnecessary sheet from the unnecessary sheet supporting surface by It is characterized in that it is provided tolerable.

In the sheet sticking apparatus of the present invention, it is preferable that the supporting unit includes a moving unit that relatively moves the adherend supporting unit and the unnecessary sheet supporting unit.
In the sheet sticking apparatus of the present invention, it is preferable that the unnecessary sheet supporting means has an opening through which the adherend can be taken in and out.
The sheet sticking apparatus of the present invention preferably comprises the adherend support means and a cleaning means for cleaning at least one surface of the support target supported by the adherend support means.

The sheet adhering method of the present invention comprises a supporting step of supporting an adherend by the adherend supporting means in a supporting means having an adherend supporting means and an unnecessary sheet supporting means located outside the adherend supporting means. A pressing step of pressing and adhering an adhesive sheet to the adherend surface of the adherend supported by the adherend support means and the unnecessary sheet support surface of the unnecessary sheet support means, and the adhesive sheet to the adherend A cutting step of cutting the adhesive sheet attached to the adherend so that a portion remains so as to have a predetermined shape, and a collecting step of separating unnecessary sheets other than the adhesive sheet portion of the adhesive sheet from the unnecessary sheet supporting surface. Comprising, during the peeling of the unnecessary sheet from the unnecessary sheet supporting surface by the collecting step, carry-in of the adherend to the adherend support means, and of the adherend from the adherend support means It is characterized in that at least one of unloading is carried out.

According to the present invention as described above, it is possible to carry in at least one of the adherend to the supporting means and the unloading of the adherend from the supporting means during the collection of the unnecessary sheet. It is possible to prevent a decrease in the processing capacity of the.

Further, if the adherend support means is provided so as to be movable with respect to the unnecessary sheet support means, when the unnecessary sheet supported by the unnecessary sheet support means is recovered by the recovery means, the adhered sheet part is attached. Since the body can be detached from the unnecessary sheet and the collecting means and the adherend can be carried out from the supporting means or another adherend can be carried into the supporting means, it is possible to reduce the processing capacity per unit time. Can be prevented.
Further, if the unnecessary sheet supporting means is provided with an opening, it is possible to carry in the adherend to the supporting means or carry out the adherend from the supporting means through the opening.
Further, by providing the cleaning means, the adherend supporting means and the adhered surface of the adherend can be cleaned, so that it is possible to prevent dust or dirt from adhering to the adherend.

The side view which shows the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation|movement explanatory drawing of a sheet sticking apparatus.

An embodiment of the present invention will be described below with reference to the drawings.
The X axis, the Y axis, and the Z axis in the present embodiment are in a relationship of being orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. To do. Further, in the present embodiment, when viewed from the front direction in FIG. 1 parallel to the Y axis, the direction is indicated, "up" is the direction of the arrow of the Z axis, "down" is the opposite direction, and " “Left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

In FIG. 1, a sheet sticking apparatus 10 includes a support means 20 for supporting a semiconductor wafer (hereinafter, also simply referred to as a “wafer”) WF as an adherend, and an adherend surface WF1 of the wafer WF supported by the support means 20. A feeding means 30 for feeding the adhesive sheet AS to a position facing the wafer, a pressing means 40 for pressing and sticking the adhesive sheet AS onto the wafer WF supported by the supporting means 20, and an adhesive sheet portion AS1 on the wafer WF (see FIG. 2). So as to leave the adhesive sheet AS stuck to the wafer WF into a predetermined shape, a cutting means 50, a collecting means 60 for collecting an unnecessary sheet US other than the adhesive sheet portion AS1 of the adhesive sheet AS, and a transfer of the wafer WF. The transfer means 70 for

The supporting means 20 includes a supporting surface 21A that can be suction-held by a decompressing means (not shown) such as a decompression pump or a vacuum ejector, and has an inner table 21 as an adherend supporting means for supporting the wafer WF, and an outer surface of the inner table 21. A drive for supporting the inner table 21 by an output shaft 23A of the outer table 22 as a unnecessary sheet supporting means for supporting the unnecessary sheet US and a moving means for relatively moving the inner table 21 and the outer table 22. The linear motion motor 23 as a device is provided, and the wafer WF is allowed to be carried out from the supporting unit 20 while the unnecessary sheet US is being collected by the collecting unit 60.
The outer table 22 has an unnecessary sheet support surface 22A for supporting the unnecessary sheet US formed by cutting by the cutting means 50, and an adhesive sheet AS attached together with the wafer WF supported by the inner table 21, and a linear motion motor inside thereof. 23, a recess 22B that supports 23, and an opening 22C that is provided on the rear side surface of the recess 22B and that allows the wafer WF to be taken in and out, and can be moved up and down by a driving device (not shown).

The feeding means 30 includes a support roller 31 that supports the original fabric RS having the adhesive sheet AS temporarily attached to one surface of the release sheet RL, guide rollers 32A and 32B that guide the original fabric RS, and a guide roller 32A. A linear motor 33 as a drive device that supports a pressing member 33B sandwiching the original fabric RS by its output shaft 33A and a guide roller 32B, and a load cell as a tension detecting means capable of measuring the tension of the adhesive sheet AS. 34A, a peeling plate 34B as a peeling member that peels the adhesive sheet AS from the peeling sheet RL, and a driving roller 35 that is driven by a rotation motor 35A as a driving device and sandwiches the peeling sheet RL with a pinch roller 35B. A collection roller 36 that is driven by a driving device that collects the release sheet RL with a predetermined tension, and a frame that supports each member other than the support roller 31 and the collection roller 36 among the above-described constituent members that form the feeding unit 30. 37, a frame 37 is supported by a slider (not shown), and a linear motor 38 as a driving device is supported by a slider 39A (see FIG. 2) of a linear motor 39 as a driving device.

The pressing means 40 is rotatable via a linear motion motor 43 as a drive device supported by a slider 41A of a linear motor 41 as a drive device via a bracket 42, and an output shaft 43A of the linear motion motor 43 via a bracket 43B. And a pressing roller 44 as a pressing member that presses the adhesive sheet AS against the adherend surface WF1.

The cutting means 50 includes an articulated robot 51 as a drive device and a cutting blade 52 (see FIG. 2) detachably supported by a work arm 51A of the articulated robot 51. The articulated robot 51 is a so-called 6-axis robot capable of displacing the one mounted on the work arm 51A within its work range at any position and at any angle.

The collecting means 60 is driven by a frame 61 supported by the slider 41B of the linear motor 41 and a rotating motor 62 as a driving device supported by the frame 61, and a driving roller 63 that sandwiches the unnecessary sheet US with a pinch roller 64. And a collecting roller 65 that is driven by a driving device (not shown) and collects the unnecessary sheet US with a predetermined tension.

The transfer means 70 includes an articulated robot 51 and a suction tool 71 that is detachably supported by the work arm 51A of the articulated robot 51 and that can suck and hold the wafer WF by a depressurizing means (not shown) such as a depressurizing pump or a vacuum ejector. I have it.

A procedure for sticking the adhesive sheet AS on the adherend surface WF1 of the wafer WF in the above-described sheet sticking apparatus 10 will be described.
First, the worker sets the original fabric RS as shown by the solid line in the figure to the sheet sticking device 10 in the state shown by the solid line in FIG. A signal for automatic operation is input through the operating means (not shown). Then, the feeding means 30 and the collecting means 60 drive the rotation motors 35A and 62, wind up the release sheet RL and the adhesive sheet AS, and the tension of the adhesive sheet AS located on the supporting means 20 reaches a predetermined value. Is detected by the load cell 34A, the driving of the rotation motors 35A and 62 is stopped, and the standby state is set. After that, the transfer means 70 drives the articulated robot 51 and the depressurizing means (not shown) to suck and hold the wafer WF by the suction tool 71, and then the suction tool 71 is inserted into the opening 22C to mount the wafer WF on the support surface 21A. When placed, the supporting means 20 drives the depressurizing means (not shown) to suck and hold the wafer WF. Next, the pressing means 40 drives the linear motor 43 to lower the pressing roller 44 to press the adhesive sheet AS against the unnecessary sheet supporting surface 22A with a predetermined pressing force. At this time, when the load cell 34A detects an increase in the tension of the adhesive sheet AS located on the supporting means 20, the feeding means 30 drives the rotation motor 35A and winds the release sheet RL to remove the adhesive sheet AS. Control is carried out to keep the tension of the adhesive sheet AS at a predetermined value. Next, the feeding means 30 drives the linear motor 33 to sandwich the adhesive sheet AS between the pressing member 33B and the guide roller 32A, and suppress the feeding of the adhesive sheet AS.

Then, the supporting means 20 drives the linear motor 23 to move the inner table 21 upward, and then the pressing means 40 drives the linear motor 41 to move the pressing roller 44 to the right, as shown in FIG. The adhesive sheet AS is moved and pressed by the pressing roller 44 onto the adherend surface WF1 and the unnecessary sheet supporting surface 22A to be stuck. At this time, further tension is applied to the adhesive sheet AS along with the movement of the pressing roller 44, but at the moment when the load cell 34A detects it, the feeding means 30 drives the linear motors 38 and 39, and is detected by the load cell 34A. Control is performed to move the frame 37 in the horizontal direction and the vertical direction so that the tension applied does not deviate from a predetermined value. The cutting unit 50 drives the articulated robot 51 to change the tool from the suction tool 71 to the cutting blade 52 during the bonding operation of the adhesive sheet AS.

When the attachment of the adhesive sheet AS is completed, the cutting means 50 drives the articulated robot 51 to pierce the adhesive sheet AS with the cutting blade 52 as shown by the chain double-dashed line in FIG. 2, and the cutting blade 52 is attached to the wafer WF. Move along the perimeter. As a result, the adhesive sheet portion AS1 remains on the wafer WF, and the unnecessary sheet US is formed on the outer periphery of the adhesive sheet portion AS1. Then, the supporting means 20 drives the linear motor 23 to return the inner table 21 to the initial position as shown by the chain double-dashed line in FIG. 2, and the transferring means 70 drives the articulated robot 51 to cut the cutting blade. Tool exchange is performed from 52 to the suction tool 71. Further, the collecting means 60 and the pressing means 40 drive the rotation motor 62 and the linear motor 41, and as shown by the two-dot chain line in FIG. 2, the frame 61 is moved to the right to collect the unnecessary sheet US. Then, while the unnecessary sheet US is being collected by the collecting means 60, the transfer means 70 drives the articulated robot 51 and a depressurizing means (not shown), and the suction tool 71 is inserted into the opening 22C and the suction tool 71 is used. The wafer WF is suction-held, and the wafer WF is unloaded from the inner table 21 to the next step.

After that, the supporting means 20 drives a driving device (not shown) to lower the outer table 22 to separate the unnecessary sheet US from the unnecessary sheet supporting surface 22A. Next, the feeding means 30 drives the linear motor 33 to release the sandwiching of the adhesive sheet AS by the pressing member 33B and the guide roller 32A. Then, while the collecting means 60 stops the driving of the rotation motor 62, each means drives each driving device to return each member to the initial position. By this returning operation, a predetermined amount of the adhesive sheet AS is peeled from the release sheet RL and placed on the supporting means 20, and thereafter the same operation as described above is repeated.

According to the above-described embodiment, at least one of the loading of the wafer WF into the supporting means 20 and the unloading of the wafer WF from the supporting means 20 can be performed during the collection of the unnecessary sheet US. It is possible to prevent the processing performance per hit from decreasing.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the present invention is mainly illustrated and described with respect to particular embodiments mainly, but without departing from the technical idea and the scope of the object of the present invention, with respect to the embodiments described above, the shape, Those skilled in the art can make various modifications in the material, quantity, and other detailed configurations. Further, the description of limiting the shape, the material, etc. disclosed above is an exemplification for facilitating the understanding of the present invention, and does not limit the present invention. The description with the name of the member from which some or all of the above restrictions are removed is included in the present invention.

For example, the sheet sticking apparatus 10 includes a cleaning unit 80 that cleans the adherend surface WF1 that is the surface of the wafer WF that is supported by the inner table 21 and is supported by the inner table 21, as indicated by the chain double-dashed line in FIG. May be. Such a cleaning means 80 has a linear motor 82 as a driving device supported by a slider 81A of a linear motor 81 as a driving device provided in the recess 22B, and an output shaft 82A of the linear motor 82 and a bracket 83A. A configuration including a pressure-sensitive adhesive roller 83 as a removing member supported via the cleaning means 80 after the transfer means 70 places the wafer WF on the support surface 21A, and the cleaning means 80 causes the linear motor 81 and the linear motor. By driving 82, the pressure-sensitive adhesive roller 83 can be reciprocated in the left-right direction while being urged to the adherend surface WF1. Thereby, the adherend surface WF1 can be cleaned and the posture of the wafer WF can be corrected along the support surface 21A. The cleaning unit 80 may clean the support surface 21A of the inner table 21, may clean both the support surface 21A and the adherend surface WF1 of the wafer WF, or may adhere the support target to the adhesive sheet. The wafer WF to which the portion AS1 is attached may be used and the surface of the adhesive sheet portion AS1 may be cleaned.
The cleaning unit 80 may employ a brush or a blade material as a removing member, a gas spraying unit such as a pressure pump or a turbine, or a suction unit such as a decompression pump or a vacuum ejector. You don't have to.

The supporting means 20 may be provided so that the wafer WF can be carried into the supporting means 20 while the unnecessary sheet US is being collected by the collecting means 60. In this case, in the sheet sticking apparatus 10, the cutting means 50 is provided. After the adhesive sheet AS is cut into a predetermined shape and the transfer means 70 transfers the wafer WF on the support surface 21A to the next step, the recovery means 60 drives the rotation motor 62 and the linear motor 41 to move the frame 61 to the right. Then, the unnecessary sheet US is collected. Then, while the recovery means 60 is recovering the unnecessary sheet US, the supporting means 20 drives the linear motor 23 to return the inner table 21 to the initial position, and the transfer means 70 causes the articulated robot 51 and The wafer WF may be placed on the support surface 21A by the suction tool 71 by driving a depressurizing means (not shown). Note that while the collecting unit 60 collects the unnecessary sheet US, after the transferring unit 70 transfers the wafer WF on the supporting surface 21A to the next step as in the above embodiment, another wafer WF is supported. You may mount on the surface 21A.
The supporting means 20 may be arranged such that the attached surface WF1 is located in the same plane as the unnecessary sheet support surface 22A when the inner table 21 is moved upward, or the attached surface WF1 is formed by the pressing roller 44. Also, as long as the adhesive sheet AS can be attached to the unnecessary sheet supporting surface 22A, the adherend surface WF1 may be arranged above or below the unnecessary sheet supporting surface 22A.
The inner table 21 may be provided with a receiving means such as a support pin and a lifter which can be projected and retracted with respect to the support surface 21A, and the receiving means may receive the wafer WF from the transfer means 70.
The outer table 22 may be provided with a plurality of openings 22C or may not be provided with the openings 22C. When the outer table 22 is not provided, the wafer WF is loaded between the inner table 21 and the outer table 22. It is enough if there is a gap that can be carried out.
As the moving means, the outer table 22 may be moved while fixing or moving the inner table 21, or a driving device that rotates the inner table 21 instead of the linear motor 23 is adopted, and the inner table 21 is recessed. The support surface 21A may be vertically or obliquely rotated by rotating in 22B. In this case, the opening 22C may be formed vertically or obliquely according to the rotation angle of the inner table 21. Good.

The feeding means 30 may be configured to feed the adhesive sheet AS that is not temporarily attached to the release sheet RL. In this case, the release plate 34B may be omitted, or the single sheet adhesive sheet AS may be delivered.
In the feeding means 30, at least one of the supporting roller 31 and the collecting roller 36 may be supported by the frame 37, and the linear motors 38 and 39 are provided so as to be inclined with respect to the vertical direction and the horizontal direction. Alternatively, they may be extended in directions not orthogonal to each other, the linear motor 39 may be supported by the slider of the linear motor 38, and the frame 37 may be supported by the slider 39A of the linear motor 39. As the tension detecting means, any pressure sensor, regulator, or the like can be adopted as long as it can measure the tension of the adhesive sheet AS, and the direct drive motor 33 has a configuration in which the support roller 31 is supported by a lockable drive device. Alternatively, the linear motors 38 and 39 may be omitted, and the raw fabric RS may be fed from the support roller 31 as the pressing roller 44 moves to the right.

The cutting means 50 does not cut the adhesive sheet portion AS1 to be left on the wafer WF into different shapes without cutting the same shape as the adherend surface WF1 of the wafer WF, or cuts larger than the adherend surface WF1. Alternatively, it may be cut smaller than the adherend surface WF1.

The collecting means 60 may be configured such that the unnecessary sheet US is directly collected from the outer table 22 by the collecting roller 65 without using the driving roller 63 and the pinch roller 64, or the frame 61, the collecting roller 65, and the like are attached to the adherend surface. The unnecessary sheet US may be collected without moving along the WF1.

The transfer unit 70 may raise the inner table 21 first, and then place the wafer WF on the support surface 21A from above without passing through the opening 22C, or separately from the cutting unit 50. It may be configured or may be omitted when the adherend is transferred by another device.

Further, the materials, types, shapes and the like of the adhesive sheet AS, the adhesive sheet portion AS1 left on the wafer WF and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS and the adhesive sheet portion AS1 to be left on the wafer WF may have a circular shape, an elliptic shape, a polygonal shape such as a triangle or a quadrangle, or other shapes, and may have a pressure-sensitive adhesive property, a heat-sensitive adhesive property, or the like. In the case where the adhesive sheet AS having a heat-sensitive adhesive property is adopted, it may be in an adhesive form, and an appropriate coil heater for heating the adhesive sheet or an appropriate heating means such as a heating side such as a heat pipe is provided. It may be bonded by a method. Further, the adhesive sheet AS is, for example, a single layer having only an adhesive layer, an adhesive sheet having an intermediate layer between the base material sheet and the adhesive layer, a cover layer provided on the upper surface of the base material sheet, etc. Further, it may be a so-called double-sided adhesive sheet capable of peeling the base material sheet from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer or It may be a single layer or multiple layers without an intermediate layer. As the adherend, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical disks, glass plates, steel plates, pottery, wooden boards or resin plates, Members and articles in any form can also be targeted. It should be noted that the adhesive sheet AS may be changed to a functional or practical reading method, for example, an arbitrary label such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, or the like. Any shaped sheet, film, tape, etc. can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for the means and steps, let alone the constituents of one embodiment shown in the above-mentioned embodiment. The process is not limited at all. For example, the pressing means is not limited as long as it presses an adhesive sheet on an adherend and adheres it, in view of the common general knowledge at the time of application, and is within the technical range (others). The description of the means and steps of is omitted).
Further, the drive device in the above-described embodiment includes an electric device such as a rotary motor, a direct drive motor, a linear motor, a single-axis robot and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder. In addition to the above, it is also possible to employ a combination of them directly or indirectly (some overlap with those exemplified in the embodiment).
When rollers are adopted in the above-described embodiment, a driving device for rotating and driving each roller may be provided, or the surface of each roller may be formed of a member such as rubber or resin capable of elastic deformation. However, each roller may be configured by a member that does not elastically deform, and when a pressing unit or a pressing member such as a pressing roller or a pressing head is adopted, the roller may be used in place of or in combination with the one exemplified above. , A round bar, a blade material, rubber, resin, a sponge or the like may be adopted, or a structure of pressing by blowing air such as air or gas may be adopted. The part may be made of an elastically deformable member such as rubber or resin, or may be an elastically non-deformable member. It may be configured with a rod, a roller, or the like, or when a structure for supporting or holding a supported member such as a supporting (holding) means or a supporting (holding) member is adopted, a mechanical chuck, a chuck cylinder, or the like is used. A structure in which a supported member is supported (held) by a gripping means, Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli suction, a driving device, etc., or a cutting means or a cutting blade is used Instead of or in combination with those exemplified above, a cutting member such as a cutter blade, a laser cutter, an ion beam, a thermal power, heat, water pressure, a heating wire, or a spray of a gas or a liquid may be used, or an appropriate one. You may make it cut|disconnect by moving a cutting member with what combined drive equipment.

10 sheet sticking device 20 supporting means 21 inner table (adherend supporting means)
22 Outside table (unnecessary seat support means)
22A Unnecessary sheet supporting surface 40 Pressing means 50 Cutting means 60 Collecting means AS Adhesive sheet AS1 Adhesive sheet part US Unnecessary sheet WF Wafer (adherend)
WF1 adherend

Claims (2)

A support means having an adherend support means for supporting the adherend and an unnecessary sheet support means located outside the adherend support means;
Pressing means for pressing and adhering an adhesive sheet to the adhered surface of the adherend supported by the adherend supporting means and the unnecessary sheet supporting surface of the unnecessary sheet supporting means,
Cutting means for cutting the adhesive sheet stuck to the adherend into a predetermined shape so that the adhesive sheet portion remains on the adherend,
A collecting means for separating unnecessary sheets other than the adhesive sheet portion in the adhesive sheet from the unnecessary sheet supporting surface,
The support means carries in the adherend to the adherend support means and removes the adherend from the adherend support means during the peeling of the unnecessary sheet from the unnecessary sheet supporting surface by the collecting means. A sheet sticking apparatus, characterized in that at least one of the carry-out of the wearing body is allowed. A supporting step of supporting an adherend by the adherend support means in a support means having an adherend support means and an unnecessary sheet support means located outside the adherend support means;
A pressing step of pressing and adhering an adhesive sheet to the adherend surface of the adherend supported by the adherend support means and the unnecessary sheet support surface of the unnecessary sheet support means;
A cutting step of cutting the adhesive sheet attached to the adherend into a predetermined shape so that the adhesive sheet portion remains on the adherend,
A recovery step of peeling the unnecessary sheet other than the adhesive sheet portion of the adhesive sheet from the unnecessary sheet supporting surface,
During the peeling of the unnecessary sheet from the unnecessary sheet supporting surface by the collecting step, loading of the adherend to the adherend supporting means and unloading of the adherend from the adherend supporting means. A sheet sticking method, characterized in that at least one of them is carried out.

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